US20020048142A1 - Electronic component - Google Patents
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- US20020048142A1 US20020048142A1 US09/350,065 US35006599A US2002048142A1 US 20020048142 A1 US20020048142 A1 US 20020048142A1 US 35006599 A US35006599 A US 35006599A US 2002048142 A1 US2002048142 A1 US 2002048142A1
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- terminal plate
- electronic
- electronic chip
- chip
- plate portions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Definitions
- the present invention relates to an improvement in an electronic component containing an electronic chip having metallic terminal plates joined thereto, and more particularly, to an electronic component suitably for use in the form of an electronic component composed of plural electronic elements and metallic terminal plates joined thereto such as a high capacitance capacitor.
- Japanese Unexamined Patent Publication No. 4-171911 discloses an example of such capacitors.
- a capacitor chip 56 is formed laminating a plurality of capacitors 51 through 55 .
- Metallic terminal plates 58 and 59 provided on the opposite side-faces of the capacitor of the capacitor chip and are adhered to the chip 56 through electroconductive joining materials 57 .
- the metallic terminal plates 58 and 59 have terminal plate portions 58 a and 59 a, joined to the side-faces of the capacitor chip 56 , and bent pieces 58 b and 59 b located at the lower ends of the terminal plate portions 58 a and 59 a and extending under the capacitor chip 56 .
- the bent pieces 58 b and 59 b are provided in order to facilitate the mounting of the capacitor chip 56 onto a printed circuit board or the like.
- the capacitor chip 56 is so fixed to the metallic terminal plates 58 and 59 at a location above the bent pieces 58 b and 59 b so that a gap is formed between the upper faces of the bent pieces 58 b and 59 b and the lower face of the capacitor chip 56 .
- a substrate made of aluminum or the like, having high thermal dissipation properties is used for mounting a circuit, for example, an IC or the like.
- a circuit for example, an IC or the like.
- an electronic component which comprises an electronic chip having first and second side-faces, a first metallic terminal plate containing a first terminal plate portion joined to the first side-face of the electronic chip, and a second terminal plate portion bent along the edge of the first terminal plate portion toward the second side-face and elongated in a direction different from that of connecting the first and second side-faces to be out, and a second metallic terminal plate containing a first terminal plate portion joined to the second side-face of the electronic chip, and a second terminal plate portion bent along the edge of the first terminal plate portion toward the first side-face and elongated in a direction different from that of connecting the first and second side-faces to be out.
- the second terminal plate portions of the first and second metallic terminal plates are overlapped with each other through an insulating layer.
- the insulating layer may be formed of an adhesive material, and the second terminal plate portions of the first and second metallic terminal plates are bonded to each other through the insulating layer.
- the electronic component further comprises a case for receiving the electronic chip.
- the electronic chip is formed of plural electronic elements laminated together.
- the electronic chip may be formed of plural electronic elements arranged in the lateral direction.
- FIG. 1 is a perspective view of an electronic component according to a first embodiment of the present invention
- FIG. 2 is a perspective view of an electronic component according to a second embodiment of the present invention.
- FIG. 3 a perspective view of an electronic component according to a third embodiment of the present invention.
- FIG. 4 is a perspective view illustrating an modified example of the embodiment of FIG. 2.
- FIG. 5 is an exploded perspective view showing an example of conventional high capacitance capacitors.
- FIG. 1 a capacitor according to a first embodiment of the present invention.
- a capacitor 1 contains electronic chip 7 formed by lamination and integration of plural lamination-capacitors 2 through 6 .
- the lamination-capacitors 2 through 6 preferably each include a plurality of internal electrodes which are so formed as to overlap in the thickness direction in the dielectric ceramic sheet.
- external electrodes 2 a, 2 b, 3 a, 3 b, 4 a, 5 a, 5 b and 6 a, 6 b are preferably formed, respectively. They may, however, be omitted.
- the lamination-capacitors 2 through 6 are preferably bonded together, for example, through an insulating adhesive 8 to form the electronic chip 7 .
- the electronic chip 7 may be formed by lamination of the lamination-capacitors 2 through 6 without the insulating adhesive 8 provided, and joining of the capacitors to the below-described metallic terminal plates for integration.
- the left side-face of the electronic chip 7 as viewed in FIG. 1 (the side-face where the external electrodes 2 a through 6 a are formed) will be referred to as the first side-face and the right side-face as viewed in FIG. 1 (where the external electrodes 2 b through 6 b are formed) will be referred to as the second side-face.
- a first metallic terminal plate 9 is to the first side-face of the above-described electronic chip 7 joined by use of an electroconductive joining material such as solder, an electroconductive adhesive, and the like. Any suitable material may be used.
- the first and second metallic terminal plates 9 and 10 contain first terminal plate portions 9 a and 10 a joined to the first and second side-faces of the electronic chip 7 , respectively.
- the first metallic terminal plate portions 9 a and 10 a preferably have a rectangular plane shape with their lower edges positioning below the lower face of the electronic chip 7 .
- each of the first terminal plate portions 9 a and 10 a in the width direction w is substantially equal to that of the electronic element chip 7 in the width direction.
- the first metallic terminal plate 9 includes a bent second terminal plate portion 9 b extending along the lower edge of the first terminal plate portion 9 a toward the second side-face.
- the second terminal plate portion 9 b is elongated in the width direction of the electronic chip 7 to extend out from under the electronic chip 7 .
- the second metallic terminal plate 10 includes a second terminal plate portion 10 b , which is bent along the lower edge of the first terminal plate portion 10 a toward the first side-face, and extends out from under the electronic chip 7 in the width direction.
- both of the above-described second terminal plate portions 9 b and 10 b of the first and second metallic terminal plates 9 and 10 extend under the chip 7 in the width range of the first and second side-faces, and extend forwardly outside of the range of the chip 7 in the width direction thereof.
- the distance X between the second terminal plate portions 9 b and 10 b is much shorter than the distance between the first and second side-faces.
- the distance X between the second terminal plate portions 9 b and 10 b of the first and second metallic terminal plates 9 and 10 is shortened relative to the distance between the bent pieces 58 b and 59 b in the prior art, thereby reducing the generation of an unnecessary inductance.
- electric currents with the opposite polarities flow in the metallic terminal plates 9 and 10 , respectively.
- the inductances produced in the metallic terminal plates 9 and 10 are cancelled between the second terminal plate portions 9 b and 10 b.
- the unnecessary inductances can be effectively reduced.
- the electronic chip 7 is located so that its lower face is positioned above the upper faces of the second terminal plate portions 9 b and 10 b.
- the lower face of the electronic chip 7 may contact the upper faces of the second terminal plate portions 9 b and 10 b.
- the second terminal plate portions 9 b and 10 b are elongated to extend out from under the electronic chip 7 in the width direction.
- the second terminal plate portions 9 b and 10 b may extend outwardly in other directions, for example, in an oblique direction.
- the second terminal plate portions 9 b and 10 b are parallel with each other. However, they do not necessarily need to be elongated in parallel with each other.
- FIG. 2 is a perspective view of a second embodiment of the present invention.
- a capacitor 11 of the second embodiment lamination-capacitors 2 through 6 are laminated and integrated through the insulating adhesive 8 , as in the first embodiment.
- the capacitor 11 is different from the first embodiment in the way that the second terminal plate portions 9 b and 10 b of the first and second metallic terminal plates 9 and 10 are configured.
- the second embodiment is the same as the first embodiment. Accordingly, like parts of the second embodiment as those of the first embodiment are designated by like reference numerals, and their detailed description is omitted.
- the second terminal plate portion 9 b is formed by bending of the first metallic terminal plate 9 along the lower edge of the first terminal plate portion 9 a toward the second side-face side and extends beyond the electronic chip 7 in the width direction.
- the second metallic terminal plate portion 10 b is formed by bending of the second metallic terminal plate 10 along the lower edge of the first terminal plate portion 10 a toward the first second side-face side and extends out from under the electronic chip 7 in the width direction.
- the second terminal plate portions 9 b and 10 b of the first and second metallic terminal plates 9 and 10 overlapped one another and are separated by an insulation layer 12 provided between them. With the interposed insulating layer, the electrical insulation between the terminal plate portions 9 b and 10 b is ensured.
- the insulting layer 12 may be formed of an appropriate material such as a synthetic resin or the like.
- the insulating layer 12 is formed of an insulating adhesive, an adhesive piece such as a both-side pressure-sensitive adhesive tape, or the like, and thereby, the electric insulation between the terminal plate portions 9 b and 10 b can be ensured, and moreover, can be assuredly fixed as shown in the figure.
- the terminal plate portions 9 b and 10 b can be easily joined, and the production process can be simplified.
- FIG. 3 is a perspective view illustrating a capacitor according to a third embodiment of the present invention.
- the electronic chip 7 is formed by stacking a plural lamination-capacitors 2 through 6 one atop the other.
- the electronic chip 27 is formed of the plural lamination-capacitors 2 through 6 arranged in the lateral direction, adjacently to one another.
- the lamination-capacitors 2 through 6 are so arranged that the external electrodes 2 a through 6 a are positioned on the first side-face side of the electronic chip 27 , and the external electrodes 2 b through 6 b are positioned on the second side-face side.
- the lamination-capacitors 2 through 6 are joined, for example, through an insulating adhesive 28 to be integrated together.
- the insulating adhesive 28 can be omitted.
- the lamination-capacitors 2 through 6 may be joined to metallic terminal plates 29 and 30 to be integrated.
- the external electrodes 2 a through 6 a can be omitted.
- the first and second metallic terminal plates 29 and 30 comprises first terminal plate portions 29 a and 30 a joined to the first and second side-faces of the electronic chip 27 , and the second terminal plate portions 29 b and 30 b bent along the lower edges of the first terminal plate portions 29 a and 30 a extending toward the opposed side-faces and elongated to extend from under the electronic chip 27 in the width direction thereof.
- the second terminal plate portions 29 b and 30 b overlapped one another through an insulating layer 12 as in the second embodiment.
- FIG. 4 is a perspective view illustrating an modified example of the capacitor 11 of the second embodiment.
- a case 41 may be attached by placing it over chip 7 in the direction shown by the arrow in FIG. 4.
- the case 41 preferably has a substantially rectangular parallelepiped shape with an opening (not shown) on the bottom side.
- the case 41 is so attached as to receive the electronic chip 7 through the opening of the case 41 and surround it.
- the case 41 may be formed of an appropriate material such as a synthetic resin or a metallic piece of which the surface is coated with an insulating material such as a synthetic resin or the like.
- the capacitor 11 With the attached case 41 , the capacitor 11 can be protected from breakage caused by external stress. Accidents such as an electric shock and the like can also be prevented.
- the case 41 can take various forms.
- the case 41 is fixed to the electronic chip 7 by casting a molten resin into the case 41 and curing the resin after the chip 7 is covered with the case 41 .
- the impact resistance, the vibration resistance, and the weather-proof properties can be enhanced.
- the capacitors 1 and 11 of the first and second embodiments were produced using an electronic chip 7 having an outside size in the direction of connecting the first and second side-faces of 40.0 mm, a size in the width direction of 54 mm, and a thickness of 5.0 mm.
- the inductance components, due to the metallic terminal plates 9 and 10 were 13.4 nH and 8.4 nH, respectively. This establishes that the inductance components are considerably reduced as compared with the inductance components due to the metallic terminal plates 58 and 59 of 27.9 nH of the conventional capacitor shown in FIG. 5, produced using of the same electronic chip 7 .
- the present invention is not restricted to a capacitor, and may be applied to general electronic components each containing plural, different ceramic electronic elements such as a varistor, an inductor, and the like.
- the electronic chip according to the present invention may be formed of at least two different types of ceramic electronic elements.
- the second terminal plate portions of the first and second metallic terminal plates are bent along the edges of the first terminal plate portions toward the second and first side-faces and are elongated in a different direction to extend outward from under the ceramic component.
- the distance between the second terminal plate portions is shorter than the distance between the first and second side-faces. Accordingly, the inductances produced in the second terminal plate portions cancelled each other between the second terminal plate portions of the first and second metallic terminal plates.
- the second terminal plate portions of the first and second metallic terminal plates overlap one another through the insulating layer. Accordingly, the electric insulation between the second terminal plate portions of the first and second metallic terminal plates can be ensured, and moreover, the distance between the second terminal plate portions of the first and second metallic terminal plates can be further shortened thereby further decreasing an unnecessary inductance.
- the insulating layer an adhesive material is used, and the second terminal plate portions of the first and second metallic terminal plates are bonded to one another through the adhesive material.
- the reliability of the electric insulation between the second terminal plate portions of the first and second metallic terminal plates can be enhanced, and the impact resistance or the like can be increased.
- the electronic component further is provided with a protective the case for receiving the electronic chip, enhancing resistance to mechanical impacts contributing to the prevention of accidents such as an electric shock and the like.
- the electronic chip is formed of plural electronic elements laminated together.
- the height occupied by the electronic component can be inhibited. That is, an electronic apparatus of which the height is low can be realized.
Abstract
Description
- 1. Field of the Invention
- The present invention relates to an improvement in an electronic component containing an electronic chip having metallic terminal plates joined thereto, and more particularly, to an electronic component suitably for use in the form of an electronic component composed of plural electronic elements and metallic terminal plates joined thereto such as a high capacitance capacitor.
- 2. Description of the Related Art
- Conventionally, it has been proposed that to attain a high capacitance capacitor by use of a ceramic monolithic capacitor, plural ceramic capacitors are laminated to produce a high capacitance capacitor.
- Japanese Unexamined Patent Publication No. 4-171911 discloses an example of such capacitors. In such capacitor, shown in FIG. 5, a
capacitor chip 56 is formed laminating a plurality ofcapacitors 51 through 55. -
Metallic terminal plates chip 56 throughelectroconductive joining materials 57. Themetallic terminal plates terminal plate portions capacitor chip 56, andbent pieces 58 b and 59 b located at the lower ends of theterminal plate portions capacitor chip 56. - The
bent pieces 58 b and 59 b are provided in order to facilitate the mounting of thecapacitor chip 56 onto a printed circuit board or the like. Thecapacitor chip 56 is so fixed to themetallic terminal plates bent pieces 58 b and 59 b so that a gap is formed between the upper faces of thebent pieces 58 b and 59 b and the lower face of thecapacitor chip 56. - More particularly, a substrate made of aluminum or the like, having high thermal dissipation properties, is used for mounting a circuit, for example, an IC or the like. When the above-mentioned capacitor is mounted onto such a metallic substrate, since the thermal expansion coefficient of the substrate is considerably different from that of the ceramic constituting the
capacitor chip 56, it is necessary to absorb a distortion which will be caused by the difference between the thermal expansion coefficients. Accordingly, thecapacitor chip 56 is fixed to themetallic terminal plates bent pieces 58 b and 59 b, as described above. - There have been proposed a variety of capacitors which have a large capacitance attained by lamination of plural lamination-capacitors as described above.
- However, in the case of the conventional high-capacitance capacitor shown in FIG. 5, there is the problem that a high inductance is produced in the
metallic terminal plates - According to the present invention, there is provided an electronic component which comprises an electronic chip having first and second side-faces, a first metallic terminal plate containing a first terminal plate portion joined to the first side-face of the electronic chip, and a second terminal plate portion bent along the edge of the first terminal plate portion toward the second side-face and elongated in a direction different from that of connecting the first and second side-faces to be out, and a second metallic terminal plate containing a first terminal plate portion joined to the second side-face of the electronic chip, and a second terminal plate portion bent along the edge of the first terminal plate portion toward the first side-face and elongated in a direction different from that of connecting the first and second side-faces to be out.
- Preferably, the second terminal plate portions of the first and second metallic terminal plates are overlapped with each other through an insulating layer.
- The insulating layer may be formed of an adhesive material, and the second terminal plate portions of the first and second metallic terminal plates are bonded to each other through the insulating layer.
- Preferably, the electronic component further comprises a case for receiving the electronic chip.
- Preferably, the electronic chip is formed of plural electronic elements laminated together.
- The electronic chip may be formed of plural electronic elements arranged in the lateral direction.
- For the purpose of illustrating the invention, there is shown in the drawing a form which is presently preferred, it being understood, however, that the invention is not limited to the precise arrangement and instrumentality shown.
- FIG. 1 is a perspective view of an electronic component according to a first embodiment of the present invention;
- FIG. 2 is a perspective view of an electronic component according to a second embodiment of the present invention;
- FIG. 3 a perspective view of an electronic component according to a third embodiment of the present invention;
- FIG. 4 is a perspective view illustrating an modified example of the embodiment of FIG. 2; and
- FIG. 5 is an exploded perspective view showing an example of conventional high capacitance capacitors.
- Referring now to FIGS.1-4, wherein like numerals indicate like elements, there is shown in FIG. 1 a capacitor according to a first embodiment of the present invention.
- A capacitor1 contains
electronic chip 7 formed by lamination and integration of plural lamination-capacitors 2 through 6. The lamination-capacitors 2 through 6 preferably each include a plurality of internal electrodes which are so formed as to overlap in the thickness direction in the dielectric ceramic sheet. On the opposite side faces of the lamination-capacitors 2 through 6,external electrodes capacitors 2 through 6 are preferably bonded together, for example, through aninsulating adhesive 8 to form theelectronic chip 7. However, theelectronic chip 7 may be formed by lamination of the lamination-capacitors 2 through 6 without the insulatingadhesive 8 provided, and joining of the capacitors to the below-described metallic terminal plates for integration. - As referred to below, the left side-face of the
electronic chip 7 as viewed in FIG. 1 (the side-face where the external electrodes 2 a through 6 a are formed) will be referred to as the first side-face and the right side-face as viewed in FIG. 1 (where theexternal electrodes 2 b through 6 b are formed) will be referred to as the second side-face. - A first metallic terminal plate9 is to the first side-face of the above-described
electronic chip 7 joined by use of an electroconductive joining material such as solder, an electroconductive adhesive, and the like. Any suitable material may be used. - The first and second
metallic terminal plates 9 and 10 contain firstterminal plate portions electronic chip 7, respectively. The first metallicterminal plate portions electronic chip 7. - The size of each of the first
terminal plate portions electronic element chip 7 in the width direction. - The first metallic terminal plate9 includes a bent second terminal plate portion 9 b extending along the lower edge of the first
terminal plate portion 9 a toward the second side-face. The second terminal plate portion 9 b is elongated in the width direction of theelectronic chip 7 to extend out from under theelectronic chip 7. - Similarly, the second
metallic terminal plate 10 includes a secondterminal plate portion 10 b, which is bent along the lower edge of the firstterminal plate portion 10 a toward the first side-face, and extends out from under theelectronic chip 7 in the width direction. - More particularly, both of the above-described second
terminal plate portions 9 b and 10 b of the first and secondmetallic terminal plates 9 and 10 extend under thechip 7 in the width range of the first and second side-faces, and extend forwardly outside of the range of thechip 7 in the width direction thereof. The distance X between the secondterminal plate portions 9 b and 10 b is much shorter than the distance between the first and second side-faces. - In the capacitor1 of the instant embodiment, the distance X between the second
terminal plate portions 9 b and 10 b of the first and secondmetallic terminal plates 9 and 10 is shortened relative to the distance between thebent pieces 58 b and 59 b in the prior art, thereby reducing the generation of an unnecessary inductance. On the other hand, electric currents with the opposite polarities flow in themetallic terminal plates 9 and 10, respectively. Thus, the inductances produced in themetallic terminal plates 9 and 10 are cancelled between the secondterminal plate portions 9 b and 10 b. As a whole, the unnecessary inductances can be effectively reduced. - When the capacitor1 of the instant embodiment is mounted onto a circuit board and is operated, the unnecessary inductances are cancelled between the above-described
metallic terminal plates 9 and 10, and thereby, their desired electrical characteristics can be assuredly attained. - In the above-described embodiment, the
electronic chip 7 is located so that its lower face is positioned above the upper faces of the secondterminal plate portions 9 b and 10 b. However, as an alternative construction, the lower face of theelectronic chip 7 may contact the upper faces of the secondterminal plate portions 9 b and 10 b. - This construction is preferred. When the
electronic chip 7 is lifted above theterminal plate portions 9 b and 10 b with a gap provided between theelectronic chip 7 and theterminal plate portions 9 b and 10 b, thermal conduction from the circuit board on which thechip 7 is mounted is reduced and the influence of distortions caused by the difference between the thermal expansion coefficients of the board and theelectronic chip 7 is inhibited. - In the above-described embodiment, the second
terminal plate portions 9 b and 10 b are elongated to extend out from under theelectronic chip 7 in the width direction. However, the secondterminal plate portions 9 b and 10 b may extend outwardly in other directions, for example, in an oblique direction. Furthermore, in the instant embodiment, the secondterminal plate portions 9 b and 10 b are parallel with each other. However, they do not necessarily need to be elongated in parallel with each other. - FIG. 2 is a perspective view of a second embodiment of the present invention. In a
capacitor 11 of the second embodiment, lamination-capacitors 2 through 6 are laminated and integrated through the insulatingadhesive 8, as in the first embodiment. Thecapacitor 11 is different from the first embodiment in the way that the secondterminal plate portions 9 b and 10 b of the first and secondmetallic terminal plates 9 and 10 are configured. In other respects, the second embodiment is the same as the first embodiment. Accordingly, like parts of the second embodiment as those of the first embodiment are designated by like reference numerals, and their detailed description is omitted. - In the
capacitor 11, the second terminal plate portion 9 b is formed by bending of the first metallic terminal plate 9 along the lower edge of the firstterminal plate portion 9 a toward the second side-face side and extends beyond theelectronic chip 7 in the width direction. Similarly, the second metallicterminal plate portion 10 b is formed by bending of the secondmetallic terminal plate 10 along the lower edge of the firstterminal plate portion 10 a toward the first second side-face side and extends out from under theelectronic chip 7 in the width direction. However, the secondterminal plate portions 9 b and 10 b of the first and secondmetallic terminal plates 9 and 10 overlapped one another and are separated by aninsulation layer 12 provided between them. With the interposed insulating layer, the electrical insulation between theterminal plate portions 9 b and 10 b is ensured. - Any suitable material for the insulating
layer 12 may be used. Theinsulting layer 12 may be formed of an appropriate material such as a synthetic resin or the like. Preferably, the insulatinglayer 12 is formed of an insulating adhesive, an adhesive piece such as a both-side pressure-sensitive adhesive tape, or the like, and thereby, the electric insulation between theterminal plate portions 9 b and 10 b can be ensured, and moreover, can be assuredly fixed as shown in the figure. - Particularly, if the insulating
layer 12 is formed using a both-side pressure-sensitive adhesive tape, theterminal plate portions 9 b and 10 b can be easily joined, and the production process can be simplified. - FIG. 3 is a perspective view illustrating a capacitor according to a third embodiment of the present invention. In the
capacitors 1 and 11 of the first and second embodiments, theelectronic chip 7 is formed by stacking a plural lamination-capacitors 2 through 6 one atop the other. On the other hand, in acapacitor 21 shown in FIG. 3, theelectronic chip 27 is formed of the plural lamination-capacitors 2 through 6 arranged in the lateral direction, adjacently to one another. The lamination-capacitors 2 through 6 are so arranged that the external electrodes 2 a through 6 a are positioned on the first side-face side of theelectronic chip 27, and theexternal electrodes 2 b through 6 b are positioned on the second side-face side. - The lamination-
capacitors 2 through 6 are joined, for example, through an insulatingadhesive 28 to be integrated together. However, the insulatingadhesive 28 can be omitted. For example, the lamination-capacitors 2 through 6 may be joined to metallicterminal plates 29 and 30 to be integrated. Further, as in the first embodiment, the external electrodes 2 a through 6 a can be omitted. - In the instant embodiment, the first and second
metallic terminal plates 29 and 30 comprises firstterminal plate portions electronic chip 27, and the second terminal plate portions 29 b and 30 b bent along the lower edges of the firstterminal plate portions electronic chip 27 in the width direction thereof. - The second terminal plate portions29 b and 30 b overlapped one another through an insulating
layer 12 as in the second embodiment. - In the instant embodiment, since the second terminal plate portions29 b and 30 b of the first and second
metallic terminal plates 29 and 30 are adjacent to each other, the inductances produced in the second terminal plate portions 29 b and 30 b can be effectively cancelled. - FIG. 4 is a perspective view illustrating an modified example of the
capacitor 11 of the second embodiment. - In the
capacitor 11 shown in FIG. 2, the first and secondmetallic terminal plates 9 and 10 are joined to theelectronic chip 7. A case 41 may be attached by placing it overchip 7 in the direction shown by the arrow in FIG. 4. The case 41 preferably has a substantially rectangular parallelepiped shape with an opening (not shown) on the bottom side. The case 41 is so attached as to receive theelectronic chip 7 through the opening of the case 41 and surround it. The case 41 may be formed of an appropriate material such as a synthetic resin or a metallic piece of which the surface is coated with an insulating material such as a synthetic resin or the like. - With the attached case41, the
capacitor 11 can be protected from breakage caused by external stress. Accidents such as an electric shock and the like can also be prevented. - The case41 can take various forms. Preferably, the case 41 is fixed to the
electronic chip 7 by casting a molten resin into the case 41 and curing the resin after thechip 7 is covered with the case 41. In this case, the impact resistance, the vibration resistance, and the weather-proof properties can be enhanced. - As series of experiments were carried out to test the attributes of the present invention. The
capacitors 1 and 11 of the first and second embodiments were produced using anelectronic chip 7 having an outside size in the direction of connecting the first and second side-faces of 40.0 mm, a size in the width direction of 54 mm, and a thickness of 5.0 mm. The inductance components, due to themetallic terminal plates 9 and 10, were 13.4 nH and 8.4 nH, respectively. This establishes that the inductance components are considerably reduced as compared with the inductance components due to the metallicterminal plates electronic chip 7. - In the above-described modified example of the first, second, and third embodiments, for the electronic chip, a plurality of lamination-capacitors were used. However, the present invention is not restricted to a capacitor, and may be applied to general electronic components each containing plural, different ceramic electronic elements such as a varistor, an inductor, and the like. Furthermore, the electronic chip according to the present invention may be formed of at least two different types of ceramic electronic elements.
- In the electronic component of the present invention, the second terminal plate portions of the first and second metallic terminal plates are bent along the edges of the first terminal plate portions toward the second and first side-faces and are elongated in a different direction to extend outward from under the ceramic component. Thus, the distance between the second terminal plate portions is shorter than the distance between the first and second side-faces. Accordingly, the inductances produced in the second terminal plate portions cancelled each other between the second terminal plate portions of the first and second metallic terminal plates. When the electronic component is mounted on a board or the like, an unnecessary inductance can be effectively reduced, and thereby, its desired electrical characteristics can be attained.
- Preferably, the second terminal plate portions of the first and second metallic terminal plates overlap one another through the insulating layer. Accordingly, the electric insulation between the second terminal plate portions of the first and second metallic terminal plates can be ensured, and moreover, the distance between the second terminal plate portions of the first and second metallic terminal plates can be further shortened thereby further decreasing an unnecessary inductance.
- Preferably, as the insulating layer, an adhesive material is used, and the second terminal plate portions of the first and second metallic terminal plates are bonded to one another through the adhesive material. Thus, the reliability of the electric insulation between the second terminal plate portions of the first and second metallic terminal plates can be enhanced, and the impact resistance or the like can be increased.
- Preferably, the electronic component further is provided with a protective the case for receiving the electronic chip, enhancing resistance to mechanical impacts contributing to the prevention of accidents such as an electric shock and the like.
- Preferably, the electronic chip is formed of plural electronic elements laminated together. Thus, the height occupied by the electronic component can be inhibited. That is, an electronic apparatus of which the height is low can be realized.
- The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof and, accordingly, reference should be made to the appended claims, rather than to the foregoing specification, as indicating the scope of the invention.
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP19614698A JP3412521B2 (en) | 1998-07-10 | 1998-07-10 | Electronic components |
JP10-196146 | 1998-07-10 |
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US6362948B1 US6362948B1 (en) | 2002-03-26 |
US20020048142A1 true US20020048142A1 (en) | 2002-04-25 |
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US09/350,065 Expired - Lifetime US6362948B1 (en) | 1998-07-10 | 1999-07-08 | Electronic component |
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JP (1) | JP3412521B2 (en) |
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US10971304B2 (en) | 2018-09-04 | 2021-04-06 | Samsung Electro-Mechanics Co., Ltd. | Electronic component having metal frames |
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JP2000058372A (en) * | 1998-08-04 | 2000-02-25 | Toshiba Corp | Ceramic capacitor mounting structure |
GB0116365D0 (en) * | 2001-07-04 | 2001-08-29 | Mantock Paul L | A power controller |
US6731493B2 (en) * | 2002-03-28 | 2004-05-04 | Intel Corporation | Low impedance inter-digital capacitor and method of using |
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US5053916A (en) * | 1989-03-13 | 1991-10-01 | U.S. Philips Corporation | Surface-mounted multilayer capacitor and printed circuit board having such a multilayer capacitor |
JPH0658867B2 (en) * | 1989-04-24 | 1994-08-03 | 株式会社村田製作所 | Electric double layer capacitor |
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US5576926A (en) * | 1995-04-03 | 1996-11-19 | American Technical Ceramics Corporation | Capacitor with buried isolated electrode |
-
1998
- 1998-07-10 JP JP19614698A patent/JP3412521B2/en not_active Expired - Lifetime
-
1999
- 1999-06-29 DE DE19929735A patent/DE19929735A1/en not_active Withdrawn
- 1999-07-08 US US09/350,065 patent/US6362948B1/en not_active Expired - Lifetime
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US20200075261A1 (en) * | 2018-08-29 | 2020-03-05 | Samsung Electro-Mechanics Co., Ltd. | Electronic component |
CN110875141A (en) * | 2018-08-29 | 2020-03-10 | 三星电机株式会社 | Electronic assembly |
US10636571B2 (en) * | 2018-08-29 | 2020-04-28 | Samsung Electro-Mechanics Co., Ltd. | Electronic component |
US10636570B2 (en) * | 2018-08-29 | 2020-04-28 | Samsung Electro-Mechanics Co., Ltd. | Electronic component |
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Also Published As
Publication number | Publication date |
---|---|
US6362948B1 (en) | 2002-03-26 |
JP3412521B2 (en) | 2003-06-03 |
DE19929735A1 (en) | 2000-01-13 |
JP2000030970A (en) | 2000-01-28 |
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