US20010047858A1 - Conforming heat sink assembly - Google Patents
Conforming heat sink assembly Download PDFInfo
- Publication number
- US20010047858A1 US20010047858A1 US09/850,017 US85001701A US2001047858A1 US 20010047858 A1 US20010047858 A1 US 20010047858A1 US 85001701 A US85001701 A US 85001701A US 2001047858 A1 US2001047858 A1 US 2001047858A1
- Authority
- US
- United States
- Prior art keywords
- base member
- thermally conductive
- conductive base
- heat dissipating
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Definitions
- the present invention relates generally to electronic solid state and integrated circuit devices. More specifically, the present invention relates to apparatuses for dissipating heat generated by such devices. In addition, the present invention relates to cooling of multiple heat generating electronic devices with a single heat sink assembly.
- the gap pad expands so as to fill the void between to bottom of the heat sink and the top of the device to bridge the thermal gap for that shorter device. This enables thermal transfer to the shorter device.
- Gap pads of the prior art are simply affixed to the heat sink and top surfaces by thermally conductive epoxy, or the like, and/or the entire assembly may be secured together by mechanical structures, such as clamps or fasteners.
- the foregoing heat sink assemblies of the prior art suffer from the disadvantages employing a large rigid heat sink member.
- the use of gap pads or gap fillers suffer from poor thermal transfer uniformity, particularly where the group of devices to be cooled have a great degree of variance of height.
- Gap pads suffer from varying degrees of thermal conductivity because the thermal conductivity through the thickness of gap pad is proportional to the amount of compression of the pad. For example, the more the gap pad is compressed, the better the thermal conductivity will be. Therefore, the taller devices within a group will have greater thermal transfer to the heat sink than the shorter devices which have a less compressed gap pad between it and the heat sink member. As a result, use of a gap pad will necessarily result in non-uniform thermal transfer causing overall inferior thermal conductivity.
- the present invention preserves the advantages of prior art heat sink assemblies for integrated circuit devices, such as microprocessors. In addition, it provides new advantages not found in currently available assemblies and overcomes many disadvantages of such currently available assemblies.
- the invention is generally directed to the novel and unique heat sink assembly with particular application in cooling heat generating electronic components installed on a circuit board.
- the heat sink assembly of the present invention enables the simple, easy and inexpensive assembly, use and maintenance of a heat sink assembly while realizing superior heat dissipation.
- the heat sink of the present invention has particular application in simultaneously providing heat dissipation for a number of electronic components that may be of different sizes, shapes, configurations and heights or thicknesses.
- the conforming heat sink assembly for removing heat from electronic components, having respective top surfaces defining different heights and installed on a circuit board, of the present invention is provided with a flexible thermally conductive base member with a top surface and a bottom surface. The bottom surface is adapted to be positioned in flush thermal communication with the top surfaces of each of the electronic components installed on a circuit board.
- a heat dissipating element is affixed to the upper surface of the flexible thermally conductive base member.
- the heat dissipating member is corrugated to define a number of lower contact points and upstanding fin members.
- the lower contact points are movable relative to one another in accordance with the top surface of the flexible thermally conductive base member.
- the heat dissipating element is affixed to the flexible thermally conductive base member at its lower contact points to form a conforming heat sink assembly.
- the corrugated heat dissipating member is bonded to the flexible thermally conductive base member with a thermally conductive epoxy.
- thermally conductive double-sided tape is adhered to each of the top surfaces of electronic components to be cooled.
- the base of the heat sink assembly of the present invention is then mated with the top surfaces of the components to be cooled where the base member is flexed and manipulated as needed to fully engage with the top surfaces of the components, As a result, various regions of the bottom surface of the base member may lie in different planes than one another to accommodate component top surfaces which may not lie in the same plane.
- the corrugated heat dissipating member simultaneously adjusts and flexes despite structural bonding thereto with epoxy.
- Another object of the present invention is to provide a heat sink assembly that is lightweight.
- Another object of present invention is to provide a heat sink assembly that is highly resistant to vibration and shock.
- a further object of the present invention is to provide a heat sink assembly that has a lower center of mass and less joint stress.
- Another object of the present invention is provide a heat sink assembly that has lower junction resistance and a lower overall system resistance.
- FIG. 1 is a cross-sectional view of a prior art heat sink assembly for a group of devices to be cooled
- FIG. 2 is a perspective view of the heat sink member employed in the heat sink assembly of the present invention
- FIG. 3 is a front view of the heat sink member of FIG. 2;
- FIG. 4 is an exploded perspective view of the heat sink assembly of the present invention installed on a circuit board with a group of devices installed thereon;
- FIG. 5 is a perspective view of the heat sink assembly of the present invention installed on a circuit board with a group of devices installed thereon;
- FIG. 6 is a cross-sectional view through the line 6 - 6 of FIG. 5 and
- FIG. 7 is an alternative embodiment of the heat sink assembly shown in FIG. 4.
- FIG. 1 a prior art heat sink assembly 10 is shown to include a circuit board 12 and a number of devices 14 , 16 and 18 , to be cooled, which are installed thereon.
- a sample three component structure of devices 12 , 16 and 18 are shown which are of three different heights while being simultaneously cooled by a single heat sink member 20 with a base 22 with a flat bottom 24 and upstanding fins 26 attached thereto.
- the top surfaces 14 a , 16 a and 18 a of the devices 14 , 16 and 18 do not lie in the same plane thus they require some type of gap filling structure.
- a gap pad 28 is provided in the prior art assembly of FIG. 1 whereby varying degrees of compression are employed to sufficiently bridge the three thermal gaps between each of the devices 14 , 16 and 18 to be cooled and the bottom surface 24 of the heat sink member 20 .
- the leftmost device 14 is the tallest, the most compression is required of the gap pad 28 while the middle device 16 is the shortest requiring the least amount of compression to bridge the gap.
- the rightmost device 18 is of middle height and the gap pad portion therebetween has a compression between the tallest device 14 and the shortest device 16 .
- the tallest device 14 will achieve the best thermal transfer to the heat sink member 26 while the shortest device 16 will achieve the worst thermal transfer performance of the three.
- the prior art device 10 shown in FIG. 1 is very heavy as it employs a block heat sink 20 extruded from aluminum stock.
- the interconnection between the heat sink member and the devices 14 , 16 and 18 to be cooled is not structurally strong thus risks separation during shipment and the like.
- the additional weight is unacceptable, particularly in laptop computers, where overall weight of the computer is of paramount concern.
- the heavy weight of the heat sink member 20 make it top heavy thus placing stress on the gap pad joint, particularly where the prior art heat sink assembly 10 is vertically oriented, such as in a tower computer where the motherboard is vertically positioned.
- the heat dissipating member 102 is preferably a corrugated member with an undulating structure creating a number of peaks 104 and valleys 106 where the bottoms of the valleys provide to contact points for installation to a base member as will be described in detail below.
- This heat dissipating member 102 is preferably crimped or formed from a single sheet of thermally conductive material, such as aluminum of an approximate thickness of 20 mils.
- This member 102 provides for a series of upstanding fin-like member to facilitate heat dissipation when in contact with ambient air.
- This heat dissipation member 102 employed in the assembly 100 of the present invention is preferred in that it is very lightweight and easy and inexpensive to manufacture.
- the undulating construction shown in FIGS. 2 and 3 is one of many different types of crimped or formed heat dissipating members 102 that are within the scope of the present invention.
- a triangular or sinusoidal wave (not shown) maybe employed depending on the application at hand.
- many different types of materials may be employed in addition to aluminum, such as copper.
- FIGS. 4 - 6 The overall construction and installation of the assembly 100 of present invention on a circuit board is shown in FIGS. 4 - 6 .
- FIG. 4 a perspective view of the construction of the conforming heat sink assembly 100 of the present invention is shown.
- the heat dissipating member 102 is bonded to a flexible base member 104 by thermally conductive epoxy 106 or the like. More specifically, the lower contact points 108 at the valleys of the heat dissipating member 102 are bonded to the top surface 110 of the flexible base member 104 .
- the flexible base member 104 is, preferably, a sheet of thermally conductive material with an optimal thickness of approximately 100 mils.
- the conductive material for the flexible sheet is carbon-carbon matrix material for extremely high thermal conductivity.
- other flexible materials, such as conductive polymer composites may be employed for the base member 104 depending on the application.
- the heat sink assembly 100 is preferably dimensioned to be large enough to cover the electronic components 112 , 114 and 116 to be cooled on a given circuit board 118 .
- the flexible base 104 may be dimensioned to span underneath and contact all of the lower contacts points or valleys 108 of the heat dissipating member 102 .
- Such a large area heat sink assembly 100 is easy to manufacture and requires little customization.
- the flexible base member 104 may be cut into a specific footprint to match the pattern of heat generating devices 112 , 114 and 116 to be cooled to avoid excess material of the base member 104 .
- the heat dissipating member 102 itself may be sized and cut into a specific footprint to match the layout of the devices 112 , 114 and 116 to be cooled.
- FIGS. 5 and 6 illustrate actual installation of the heat sink assembly 100 of the present invention onto a number of devices 112 , 114 and 116 on a substrate 118 , such as a circuit board.
- FIG. 5 shows a perspective view of the assembly 100 while FIG. 6 shows a cross-sectional view through the line 6 - 6 of FIG. 5.
- FIGS. 5 and 6 illustrate the preferred embodiment where the base member 104 and heat dissipating member 102 are not, for simplicity, cut to a specific footprint to the layout of the components 112 , 114 and 116 to be cooled.
- the flexible base 104 and heat dissipating member 102 bonded thereon are long and wide enough to cover all of the three devices 112 , 114 and 116 shown on the circuit board 118 .
- a layout of three devices 112 , 114 and 116 are for illustration purposes only and any number of heat generating devices may be accommodated by the present invention.
- the heat dissipating member 102 is bonded to the top surface 110 of the flexible base member 104 to provide the conforming heat sink assembly 100 of the present invention.
- the assembly 100 is installed on the devices 112 , 114 and 116 to be cooled.
- a layer of bonding material 120 such as pressure sensitive double-sided tape, is applied to the bottom 122 of the flexible base member 104 for bonding of the conforming heat sink assembly 100 to the top surfaces 112 a , 114 a and 116 a of the devices 112 , 114 and 116 to be cooled.
- the conforming assembly 100 is placed over the devices 112 , 114 and 116 to be cooled and then pressed down into communication with the top surfaces 112 a , 114 a and 116 a of the devices 112 , 114 and 116 so that the bonding material 120 is engaged.
- the top portions or peaks 124 of the heat dissipating member 102 are pressed downwardly so as to urge the bottom 122 of the flexible base member 104 into contact with each of the top surfaces 112 a , 114 a and 116 a of the devices 112 , 114 and 116 to be cooled, even when the devices 112 , 114 and 116 have different heights, as shown in FIGS. 4 - 6 .
- the flexible base member 104 conforms and adapts to the top surfaces 112 a , 114 a and 116 a of the devices 112 , 114 and 116 to be cooled.
- the heat dissipating member 102 of the present invention due to its undulating corrugated configuration, conforms to the flexible base member 104 thus providing uniform thermal transfer and dissipation from the devices 112 , 114 and 116 to be cooled.
- the heat dissipating member 202 is preferably a corrugated member with an undulating structure creating a number of peaks 204 and valleys 208 where the bottoms of the valleys provide to contact points for installation into a base member as will be described in detail below.
- This heat dissipating member 202 is preferably crimped or formed from a single sheet of thermally conductive material, such as aluminum of an approximate thickness of 20 mils.
- This member 202 provides for a series of upstanding fin-like member to facilitate heat dissipation when in contact with ambient air.
- This heat dissipation member 202 employed in the assembly 200 of the present invention is preferred in that it is very lightweight and easy and inexpensive to manufacture.
- the undulating construction of heat dissipating member 202 is one of many different types of crimped or formed heat dissipating members that are within the scope of the present invention. For example, instead of the square wave configuration shown in FIG. 7, a triangular or sinusoidal wave (not shown) maybe employed depending on the application at hand. Further, many different types of materials may be employed in addition to aluminum, such as copper.
- FIG. 7 The overall construction and installation of the assembly 200 of the alternative embodiment of the of present invention on a circuit board is shown in FIG. 7.
- the heat dissipating member 202 is embedded directly into flexible base member 206 by insert molding the valleys 208 of heat dissipating member 202 directly into flexible base 206 . More specifically, the lower contact points 208 at the valleys of the heat dissipating member 202 are physically secured into flexible base member 204 . By such an insert molding connection, the lower contact points 208 are secured in thermally transfer communication with the flexible base 206 .
- the flexible base member 206 is, preferably, a sheet of thermally conductive material with an optimal thickness of approximately 100 mils.
- the conductive material for the flexible sheet is carbon-carbon matrix material for extremely high thermal conductivity and which can be molded, such as by injection molding.
- other flexible materials such as conductive polymer composites, may be employed for the base member 206 depending on the application.
- the heat sink assembly 200 is preferably dimensioned to be large enough to cover the electronic components 212 , 214 and 216 to be cooled on a given circuit board 218 .
- the flexible base 206 may be dimensioned to span underneath and contact all of the lower contacts points or valleys 208 of the heat dissipating member 202 .
- Such a large area heat sink assembly 200 is easy to manufacture and requires little customization.
- the flexible base member 206 may be cut into a specific footprint to match the pattern of heat generating devices 212 , 214 and 216 to be cooled to avoid excess material of the base member 206 .
- the heat dissipating member 202 itself may be sized and cut into a specific footprint to match the layout of the devices 212 , 214 and 216 to be cooled.
- the heat sink assembly of FIG. 7 is affixed to a circuit board in similar fashion to the heat sink assembly of FIGS. 4 - 6 .
- the heat dissipating member 202 is bonded to the top surface 210 of the flexible base member 206 to provide the conforming heat sink assembly 200 of the present invention.
- the assembly 200 is installed on the devices 212 , 214 and 216 to be cooled.
- a layer of bonding material 220 such as pressure sensitive double-sided tape, is applied to the bottom 222 of the flexible base member 206 for bonding of the conforming heat sink assembly 200 to the top surfaces 212 a , 214 a and 216 a of the devices 212 , 214 and 216 to be cooled.
- the conforming assembly 100 is placed over the devices 212 , 214 and 216 to be cooled and then pressed down into communication with the top surfaces 212 a , 214 a and 216 a of the devices 212 , 214 and 216 so that the bonding material 220 is engaged.
- the top portions or peaks 204 of the heat dissipating member 202 are pressed downwardly so as to urge the bottom 222 of the flexible base member 206 into contact with each of the top surfaces 212 a , 214 a and 216 a of the devices 212 , 214 and 216 to be cooled, even when the devices 212 , 214 and 216 have different heights, as shown in FIGS. 4 - 6 .
- the flexible base member 206 conforms and adapts to the top surfaces 212 a , 214 a and 216 a of the devices 212 , 214 and 216 to be cooled.
- the heat dissipating member 202 of the present invention due to its undulating corrugated configuration, conforms to the flexible base member 206 thus providing uniform thermal transfer and dissipation from the devices 212 , 214 and 216 to be cooled.
- the alternative embodiment 200 of FIG. 7 provides all of the advantages that the preferred embodiment 100 has over the prior art.
- the alternative embodiment 200 of FIG. 7 provides a superior heat sink assembly 200 because of the unique connection of the heat dissipating member 202 and the flexible base 206 .
- the bottom portions or valleys 208 of the heat dissipating member 202 are physically embedded or encapsulated within the body of the flexible base member 206 . This is accomplished during the molding or forming process of the base member 206 .
- Such an interconnection greatly reduces if not completely eliminates the junction resistance between the valleys 208 and the body of the flexible base 206 . More specifically, the contact resistance, conductive resistance and surface to air resistance are greatly reduced when the valleys 208 are embedded into flexible base 206 resulting in an overall system resistance that is less than prior art heat sink assemblies.
- the embedding of the fin structure, namely valleys 208 , within the flexible base 206 , as opposed to affixing the valleys 208 to the top surface 210 of the flexible base 206 , provides a superior heat sink assembly 200 in that overall thermal conductivity and thermal efficiency is greatly improved.
- the present invention provides for a heat sink assembly that can provide uniform thermal transfer regardless of the height of the devices to be cooled in a construction that is easy and inexpensive to manufacture.
- the present invention has a wide range of applications and can be easily adapted for such applications.
- the present invention may be employed for any heat generating surface that is non-uniform.
- Further applications include any circuit board configuration where a heat generating device is provided on a circuit board.
- the present invention may be easily adapted to an application where the circuit board containing the heat generating device is encased in a housing, such as a Pentium II configuration. In this arrangement (not shown), the preferred embodiment may be easily modified to accommodate such a package.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- This application is a continuation-in-part of U.S. Ser. No. 09/306,098, filed Mar. 6, 1999.
- The present invention relates generally to electronic solid state and integrated circuit devices. More specifically, the present invention relates to apparatuses for dissipating heat generated by such devices. In addition, the present invention relates to cooling of multiple heat generating electronic devices with a single heat sink assembly.
- In the electronics and computer industries, it has been well known to employ various types of electronic device packages and integrated circuit chips, such as the PENTIUM central processing unit chip (CPU) manufactured by Intel Corporation and RAM (random access memory) chips. These integrated circuit chips have a pin grid array (PGA) package and are typically installed into a socket which is soldered to a computer circuit board. These integrated circuit devices, particularly the CPU microprocessor chips, generate a great deal of heat during operation which must be removed to prevent adverse effects on operation of the system into which the device is installed. For example, a PENTIUM microprocessor, containing millions of transistors, is highly susceptible to overheating which could destroy the microprocessor device itself or other components proximal to the microprocessor.
- In addition to the PENTIUM microprocessor discussed above, there are many other types of semiconductor device packages which are commonly used in computer equipment, for example. Recently, various types of surface mount packages, such as BGA (ball grid array) and LGA (land grid array) type semiconductor packages have become increasingly popular as the semiconductor package of choice for computers.
- Also, it is very common in the electronics industry to many electronic devices on a single circuit board, such as a motherboard, modem, or “processor card” such as the Celeron board manufactured by Intel Corporation. Many times, a number of these electronic devices suffer from over heating in similar fashion to the devices discussed above. If such heat is not properly dissipated from these devices, the device or component will eventually fail or cease to operate properly. For example, a number of electronic devices may be installed proximal to one another in a cluster on a particular region on a circuit board. If each of these devices require cooling to avoid failure, some type of heat dissipation is necessary.
- In the prior art, it has been common to provide “bulk” cooling to a group of devices that require heat dissipation. In these devices, a single heat sink is placed over all of the devices that required cooling. For example, a block heat sink with a base with a flat bottom and upstanding pins, is dimensioned large enough to rest on the top heat generating surfaces of each of the heat generating devices. In this prior art assembly, the base of the heat sink member is affixed to the top surfaces of the devices to be cooled by a thermally conductive epoxy, thermally conductive double-side tape, and the like. As a result, a single heat sink member may simultaneously provide heat dissipating for a number of devices.
- The foregoing prior art assembly is generally acceptable when all of the devices to be cooled have the same thickness or if their top surfaces lie in the same plane. This is required so that the block heat sink base may sit flush on the top surfaces for proper thermal transfer. Modifications to this general prior art assembly have been made for the block heat sink to specifically accommodate multiple devices that are of different heights or have top surfaces that do not lie in the same plane. In particular, highly compressible thermally conductive gap pads or gap filler materials are commonly used to fill the gaps between the bottom of the heat sink and the top surfaces of the devices to be cooled. For example, if a device is shorter than other devices in the group of devices to be cooled, the gap pad expands so as to fill the void between to bottom of the heat sink and the top of the device to bridge the thermal gap for that shorter device. This enables thermal transfer to the shorter device. Gap pads of the prior art are simply affixed to the heat sink and top surfaces by thermally conductive epoxy, or the like, and/or the entire assembly may be secured together by mechanical structures, such as clamps or fasteners.
- The foregoing heat sink assemblies of the prior art suffer from the disadvantages employing a large rigid heat sink member. The use of gap pads or gap fillers suffer from poor thermal transfer uniformity, particularly where the group of devices to be cooled have a great degree of variance of height. Gap pads suffer from varying degrees of thermal conductivity because the thermal conductivity through the thickness of gap pad is proportional to the amount of compression of the pad. For example, the more the gap pad is compressed, the better the thermal conductivity will be. Therefore, the taller devices within a group will have greater thermal transfer to the heat sink than the shorter devices which have a less compressed gap pad between it and the heat sink member. As a result, use of a gap pad will necessarily result in non-uniform thermal transfer causing overall inferior thermal conductivity.
- In view of the foregoing, there is a demand for a heat sink assembly that is capable of dissipating heat from a group of devices simultaneously. There is a demand for a heat sink assembly that can provide uniform heat dissipation for the entire group of devices to be cooled. In addition, there is a demand for a complete heat sink assembly to be able to accommodate group of devices without the use of a gap pad.
- The present invention preserves the advantages of prior art heat sink assemblies for integrated circuit devices, such as microprocessors. In addition, it provides new advantages not found in currently available assemblies and overcomes many disadvantages of such currently available assemblies.
- The invention is generally directed to the novel and unique heat sink assembly with particular application in cooling heat generating electronic components installed on a circuit board. The heat sink assembly of the present invention enables the simple, easy and inexpensive assembly, use and maintenance of a heat sink assembly while realizing superior heat dissipation. The heat sink of the present invention has particular application in simultaneously providing heat dissipation for a number of electronic components that may be of different sizes, shapes, configurations and heights or thicknesses.
- The conforming heat sink assembly for removing heat from electronic components, having respective top surfaces defining different heights and installed on a circuit board, of the present invention is provided with a flexible thermally conductive base member with a top surface and a bottom surface. The bottom surface is adapted to be positioned in flush thermal communication with the top surfaces of each of the electronic components installed on a circuit board. A heat dissipating element is affixed to the upper surface of the flexible thermally conductive base member. The heat dissipating member is corrugated to define a number of lower contact points and upstanding fin members. The lower contact points are movable relative to one another in accordance with the top surface of the flexible thermally conductive base member. The heat dissipating element is affixed to the flexible thermally conductive base member at its lower contact points to form a conforming heat sink assembly.
- For assembly and installation, the corrugated heat dissipating member is bonded to the flexible thermally conductive base member with a thermally conductive epoxy. Preferably, thermally conductive double-sided tape is adhered to each of the top surfaces of electronic components to be cooled. The base of the heat sink assembly of the present invention is then mated with the top surfaces of the components to be cooled where the base member is flexed and manipulated as needed to fully engage with the top surfaces of the components, As a result, various regions of the bottom surface of the base member may lie in different planes than one another to accommodate component top surfaces which may not lie in the same plane. When the base member is flexed and manipulated to accommodate the component top surfaces, the corrugated heat dissipating member simultaneously adjusts and flexes despite structural bonding thereto with epoxy.
- It is therefore an object of the present invention to provide a heat sink assembly that can provide heat dissipation for more than one heat generating electronic component at a time.
- It is an object of the present invention to provide a single heat sink assembly that can provide simultaneous heat dissipation for heat generating electronic components that have different heights or thicknesses.
- It is a further object of the present invention to provide a heat sink assembly that can easily adapt to a non-uniform heat generating surface for heat dissipation therefrom.
- Another object of the present invention is to provide a heat sink assembly that is lightweight.
- It is a further object of the present invention to provide a heat sink assembly can be installed without additional tools.
- It is yet a further object of the present invention to provide a heat sink that has an ultra light fin configuration.
- Another object of present invention is to provide a heat sink assembly that is highly resistant to vibration and shock.
- A further object of the present invention is to provide a heat sink assembly that has a lower center of mass and less joint stress.
- Another object of the present invention is provide a heat sink assembly that has lower junction resistance and a lower overall system resistance.
- The novel features which are characteristic of the present invention are set forth in the appended claims. However, the inventions preferred embodiments, together with further objects and attendant advantages, will be best understood by reference to the following detailed description taken in connection with the accompanying drawings in which:
- FIG. 1 is a cross-sectional view of a prior art heat sink assembly for a group of devices to be cooled;
- FIG. 2 is a perspective view of the heat sink member employed in the heat sink assembly of the present invention;
- FIG. 3 is a front view of the heat sink member of FIG. 2;
- FIG. 4 is an exploded perspective view of the heat sink assembly of the present invention installed on a circuit board with a group of devices installed thereon;
- FIG. 5 is a perspective view of the heat sink assembly of the present invention installed on a circuit board with a group of devices installed thereon; and
- FIG. 6 is a cross-sectional view through the line6-6 of FIG. 5 and
- FIG. 7 is an alternative embodiment of the heat sink assembly shown in FIG. 4.
- Turning first to FIG. 1, a prior art
heat sink assembly 10 is shown to include acircuit board 12 and a number ofdevices devices heat sink member 20 with a base 22 with a flat bottom 24 andupstanding fins 26 attached thereto. In particular, the top surfaces 14 a, 16 a and 18 a of thedevices gap pad 28 is provided in the prior art assembly of FIG. 1 whereby varying degrees of compression are employed to sufficiently bridge the three thermal gaps between each of thedevices bottom surface 24 of theheat sink member 20. - Since the
leftmost device 14 is the tallest, the most compression is required of thegap pad 28 while themiddle device 16 is the shortest requiring the least amount of compression to bridge the gap. Therightmost device 18 is of middle height and the gap pad portion therebetween has a compression between thetallest device 14 and theshortest device 16. As a result, as discussed above, thetallest device 14 will achieve the best thermal transfer to theheat sink member 26 while theshortest device 16 will achieve the worst thermal transfer performance of the three. - The
prior art device 10 shown in FIG. 1 is very heavy as it employs ablock heat sink 20 extruded from aluminum stock. The interconnection between the heat sink member and thedevices heat sink member 20 make it top heavy thus placing stress on the gap pad joint, particularly where the prior artheat sink assembly 10 is vertically oriented, such as in a tower computer where the motherboard is vertically positioned. - Turning now to FIG. 2-6, the
heat sink assembly 100 of the present invention is shown in detail. The disadvantages suffered by the prior art device shown in FIG. 1 are solved by the present invention. Referring first to FIGS. 2 and 3, theheat dissipating member 102 is preferably a corrugated member with an undulating structure creating a number ofpeaks 104 andvalleys 106 where the bottoms of the valleys provide to contact points for installation to a base member as will be described in detail below. Thisheat dissipating member 102 is preferably crimped or formed from a single sheet of thermally conductive material, such as aluminum of an approximate thickness of 20 mils. Thismember 102 provides for a series of upstanding fin-like member to facilitate heat dissipation when in contact with ambient air. Thisheat dissipation member 102 employed in theassembly 100 of the present invention is preferred in that it is very lightweight and easy and inexpensive to manufacture. It should be understood that the undulating construction shown in FIGS. 2 and 3 is one of many different types of crimped or formedheat dissipating members 102 that are within the scope of the present invention. For example, instead of the square wave configuration shown in FIGS. 2 and 3, a triangular or sinusoidal wave (not shown) maybe employed depending on the application at hand. Further, many different types of materials may be employed in addition to aluminum, such as copper. - The overall construction and installation of the
assembly 100 of present invention on a circuit board is shown in FIGS. 4-6. Referring to FIG. 4, a perspective view of the construction of the conformingheat sink assembly 100 of the present invention is shown. Theheat dissipating member 102 is bonded to aflexible base member 104 by thermallyconductive epoxy 106 or the like. More specifically, the lower contact points 108 at the valleys of theheat dissipating member 102 are bonded to thetop surface 110 of theflexible base member 104. Theflexible base member 104 is, preferably, a sheet of thermally conductive material with an optimal thickness of approximately 100 mils. Preferably, the conductive material for the flexible sheet is carbon-carbon matrix material for extremely high thermal conductivity. However, other flexible materials, such as conductive polymer composites, may be employed for thebase member 104 depending on the application. - As shown in the exploded perspective view of FIG. 4, the
heat sink assembly 100 is preferably dimensioned to be large enough to cover theelectronic components circuit board 118. In particular, theflexible base 104 may be dimensioned to span underneath and contact all of the lower contacts points orvalleys 108 of theheat dissipating member 102. Such a large areaheat sink assembly 100 is easy to manufacture and requires little customization. Alternatively, theflexible base member 104 may be cut into a specific footprint to match the pattern ofheat generating devices base member 104. Further, theheat dissipating member 102 itself may be sized and cut into a specific footprint to match the layout of thedevices - FIGS. 5 and 6 illustrate actual installation of the
heat sink assembly 100 of the present invention onto a number ofdevices substrate 118, such as a circuit board. FIG. 5 shows a perspective view of theassembly 100 while FIG. 6 shows a cross-sectional view through the line 6-6 of FIG. 5. FIGS. 5 and 6 illustrate the preferred embodiment where thebase member 104 andheat dissipating member 102 are not, for simplicity, cut to a specific footprint to the layout of thecomponents flexible base 104 andheat dissipating member 102 bonded thereon are long and wide enough to cover all of the threedevices circuit board 118. As can be understood, a layout of threedevices - First, the
heat dissipating member 102 is bonded to thetop surface 110 of theflexible base member 104 to provide the conformingheat sink assembly 100 of the present invention. Next, theassembly 100 is installed on thedevices bonding material 120, such as pressure sensitive double-sided tape, is applied to thebottom 122 of theflexible base member 104 for bonding of the conformingheat sink assembly 100 to thetop surfaces devices assembly 100 is placed over thedevices top surfaces devices bonding material 120 is engaged. - Most importantly, the top portions or
peaks 124 of theheat dissipating member 102 are pressed downwardly so as to urge thebottom 122 of theflexible base member 104 into contact with each of thetop surfaces devices devices flexible base member 104 conforms and adapts to thetop surfaces devices heat dissipating member 102 of the present invention, due to its undulating corrugated configuration, conforms to theflexible base member 104 thus providing uniform thermal transfer and dissipation from thedevices - As shown in FIG. 7, an
alternative embodiment 200 of the heat sink assembly of the present invention is shown in detail. In similar fashion to thepreferred embodiment 100 of the present invention, the disadvantages suffered by the prior art device shown in FIG. 1 can also be solved by thealternative embodiment 200 of the present invention. In FIG. 7, theheat dissipating member 202 is preferably a corrugated member with an undulating structure creating a number ofpeaks 204 andvalleys 208 where the bottoms of the valleys provide to contact points for installation into a base member as will be described in detail below. Thisheat dissipating member 202 is preferably crimped or formed from a single sheet of thermally conductive material, such as aluminum of an approximate thickness of 20 mils. Thismember 202 provides for a series of upstanding fin-like member to facilitate heat dissipation when in contact with ambient air. Thisheat dissipation member 202 employed in theassembly 200 of the present invention is preferred in that it is very lightweight and easy and inexpensive to manufacture. It should be understood that the undulating construction ofheat dissipating member 202 is one of many different types of crimped or formed heat dissipating members that are within the scope of the present invention. For example, instead of the square wave configuration shown in FIG. 7, a triangular or sinusoidal wave (not shown) maybe employed depending on the application at hand. Further, many different types of materials may be employed in addition to aluminum, such as copper. - The overall construction and installation of the
assembly 200 of the alternative embodiment of the of present invention on a circuit board is shown in FIG. 7. Theheat dissipating member 202 is embedded directly intoflexible base member 206 by insert molding thevalleys 208 ofheat dissipating member 202 directly intoflexible base 206. More specifically, the lower contact points 208 at the valleys of theheat dissipating member 202 are physically secured intoflexible base member 204. By such an insert molding connection, the lower contact points 208 are secured in thermally transfer communication with theflexible base 206. Theflexible base member 206 is, preferably, a sheet of thermally conductive material with an optimal thickness of approximately 100 mils. Preferably, the conductive material for the flexible sheet is carbon-carbon matrix material for extremely high thermal conductivity and which can be molded, such as by injection molding. However, other flexible materials, such as conductive polymer composites, may be employed for thebase member 206 depending on the application. - Still referring to FIG. 7, the
heat sink assembly 200 is preferably dimensioned to be large enough to cover theelectronic components circuit board 218. In particular, theflexible base 206 may be dimensioned to span underneath and contact all of the lower contacts points orvalleys 208 of theheat dissipating member 202. Such a large areaheat sink assembly 200 is easy to manufacture and requires little customization. Alternatively, theflexible base member 206 may be cut into a specific footprint to match the pattern ofheat generating devices base member 206. Further, theheat dissipating member 202 itself may be sized and cut into a specific footprint to match the layout of thedevices - The heat sink assembly of FIG. 7 is affixed to a circuit board in similar fashion to the heat sink assembly of FIGS.4-6. First, the
heat dissipating member 202 is bonded to thetop surface 210 of theflexible base member 206 to provide the conformingheat sink assembly 200 of the present invention. Next, theassembly 200 is installed on thedevices bonding material 220, such as pressure sensitive double-sided tape, is applied to thebottom 222 of theflexible base member 206 for bonding of the conformingheat sink assembly 200 to thetop surfaces devices assembly 100 is placed over thedevices top surfaces devices bonding material 220 is engaged. - Most importantly, the top portions or
peaks 204 of theheat dissipating member 202 are pressed downwardly so as to urge thebottom 222 of theflexible base member 206 into contact with each of thetop surfaces devices devices flexible base member 206 conforms and adapts to thetop surfaces devices heat dissipating member 202 of the present invention, due to its undulating corrugated configuration, conforms to theflexible base member 206 thus providing uniform thermal transfer and dissipation from thedevices - The
alternative embodiment 200 of FIG. 7 provides all of the advantages that thepreferred embodiment 100 has over the prior art. In addition, thealternative embodiment 200 of FIG. 7 provides a superiorheat sink assembly 200 because of the unique connection of theheat dissipating member 202 and theflexible base 206. In particular, as stated above, the bottom portions orvalleys 208 of theheat dissipating member 202 are physically embedded or encapsulated within the body of theflexible base member 206. This is accomplished during the molding or forming process of thebase member 206. Such an interconnection greatly reduces if not completely eliminates the junction resistance between thevalleys 208 and the body of theflexible base 206. More specifically, the contact resistance, conductive resistance and surface to air resistance are greatly reduced when thevalleys 208 are embedded intoflexible base 206 resulting in an overall system resistance that is less than prior art heat sink assemblies. - Therefore, the embedding of the fin structure, namely
valleys 208, within theflexible base 206, as opposed to affixing thevalleys 208 to thetop surface 210 of theflexible base 206, provides a superiorheat sink assembly 200 in that overall thermal conductivity and thermal efficiency is greatly improved. - As a result, bulk cooling of multiple devices can be achieved without the use of gap pads or fillers which reduce the thermal conductivity of the assembly and create non-uniformity in heat dissipation from device to device. The present invention provides for a heat sink assembly that can provide uniform thermal transfer regardless of the height of the devices to be cooled in a construction that is easy and inexpensive to manufacture.
- The present invention has a wide range of applications and can be easily adapted for such applications. For example, the present invention may be employed for any heat generating surface that is non-uniform. Further applications include any circuit board configuration where a heat generating device is provided on a circuit board. The present invention may be easily adapted to an application where the circuit board containing the heat generating device is encased in a housing, such as a Pentium II configuration. In this arrangement (not shown), the preferred embodiment may be easily modified to accommodate such a package.
- It would be appreciated by those skilled in the art that various changes and modifications can be made to the illustrated embodiments without departing from the spirit of the present invention. All such modifications and changes are intended to be covered by the appended claims.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/850,017 US6367541B2 (en) | 1999-05-06 | 2001-05-07 | Conforming heat sink assembly |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US30609899A | 1999-05-06 | 1999-05-06 | |
US09/850,017 US6367541B2 (en) | 1999-05-06 | 2001-05-07 | Conforming heat sink assembly |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US30609899A Continuation-In-Part | 1999-05-06 | 1999-05-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20010047858A1 true US20010047858A1 (en) | 2001-12-06 |
US6367541B2 US6367541B2 (en) | 2002-04-09 |
Family
ID=23183796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/850,017 Expired - Lifetime US6367541B2 (en) | 1999-05-06 | 2001-05-07 | Conforming heat sink assembly |
Country Status (1)
Country | Link |
---|---|
US (1) | US6367541B2 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040008496A1 (en) * | 2002-07-10 | 2004-01-15 | Larson Thane Michael | Portable thermal barrier for an electronic system |
GB2400167A (en) * | 2003-03-31 | 2004-10-06 | Sun Microsystems Inc | A heat-sink for multiple computer elements |
US7391614B2 (en) | 2005-03-24 | 2008-06-24 | Dell Products L.P. | Method and apparatus for thermal dissipation in an information handling system |
WO2009105411A2 (en) * | 2008-02-21 | 2009-08-27 | Alcatel-Lucent Usa Inc. | Thermally conductive periodically structured gap fillers and method for utilizing same |
US20110198067A1 (en) * | 2006-06-08 | 2011-08-18 | International Business Machines Corporation | Sheet having high thermal conductivity and flexibility |
US20110316144A1 (en) * | 2010-06-25 | 2011-12-29 | Samsung Electronics Co., Ltd. | Flexible heat sink having ventilation ports and semiconductor package including the same |
CN103249278A (en) * | 2012-02-09 | 2013-08-14 | 富瑞精密组件(昆山)有限公司 | Heat dissipation device |
GB2522642A (en) * | 2014-01-30 | 2015-08-05 | Xyratex Tech Ltd | A solid state memory unit cooling apparatus and solid state storage device |
US10309473B2 (en) * | 2015-09-04 | 2019-06-04 | Edward D. Horton | Apparatus and method for heat dissipation of a brake pad |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6817096B2 (en) * | 2000-01-11 | 2004-11-16 | Cool Options, Inc. | Method of manufacturing a heat pipe construction |
US6549411B1 (en) * | 2000-12-20 | 2003-04-15 | Edward Herbert | Flexible heat sinks and method of attaching flexible heat sinks |
ATE304222T1 (en) * | 2001-06-05 | 2005-09-15 | Heat Technology Inc | HEAT SINK ARRANGEMENT AND ITS MANUFACTURING METHOD |
US20020195228A1 (en) * | 2001-06-07 | 2002-12-26 | International Business Machines Corporation | Thermal enhanced extended surface tape for integrated circuit heat dissipation |
US7128131B2 (en) * | 2001-07-31 | 2006-10-31 | The Furukawa Electric Co., Ltd. | Heat sink for electronic devices and heat dissipating method |
US6614659B2 (en) * | 2001-12-07 | 2003-09-02 | Delphi Technologies, Inc. | De-mountable, solderless in-line lead module package with interface |
US6626233B1 (en) * | 2002-01-03 | 2003-09-30 | Thermal Corp. | Bi-level heat sink |
US6955673B2 (en) * | 2002-08-16 | 2005-10-18 | Cryocor, Inc. | Heat transfer segment for a cryoablation catheter |
US20040034344A1 (en) * | 2002-08-16 | 2004-02-19 | Eric Ryba | Tip pressure monitoring for cryoablation catheters |
US6654250B1 (en) * | 2002-09-25 | 2003-11-25 | International Business Machines Corporation | Low-stress compressive heatsink structure |
US6919504B2 (en) * | 2002-12-19 | 2005-07-19 | 3M Innovative Properties Company | Flexible heat sink |
JP2005057088A (en) * | 2003-08-05 | 2005-03-03 | Agilent Technol Inc | Heat-conductive member of multilayer structure and electronic apparatus using it |
US7077858B2 (en) | 2003-09-22 | 2006-07-18 | Coolhead Technologies, Inc. | Flexible heat exchangers for medical cooling and warming applications |
US20060191675A1 (en) * | 2003-09-22 | 2006-08-31 | Coolhead Technologies, Inc. | Apparatus and methods for warming and cooling bodies |
US20050168941A1 (en) * | 2003-10-22 | 2005-08-04 | Sokol John L. | System and apparatus for heat removal |
US20050167082A1 (en) * | 2004-01-30 | 2005-08-04 | Datech Technology Co., Ltd. | Heat sink-type cooling device for an integrated circuit |
KR100558065B1 (en) * | 2004-03-15 | 2006-03-10 | 삼성전자주식회사 | Semiconductor module with heat sink |
JP4305406B2 (en) * | 2005-03-18 | 2009-07-29 | 三菱電機株式会社 | Cooling structure |
US7362582B2 (en) * | 2005-06-14 | 2008-04-22 | International Business Machines Corporation | Cooling structure using rigid movable elements |
JP4928749B2 (en) * | 2005-06-30 | 2012-05-09 | 株式会社東芝 | Cooling system |
TWI302821B (en) * | 2005-08-18 | 2008-11-01 | Ind Tech Res Inst | Flexible circuit board with heat sink |
EP2012574A1 (en) * | 2006-04-24 | 2009-01-07 | Sumitomo Electric Industries, Ltd. | Heat transfer member, protruding structural member, electronic device, and electric product |
US7705238B2 (en) * | 2006-05-22 | 2010-04-27 | Andrew Llc | Coaxial RF device thermally conductive polymer insulator and method of manufacture |
CA2670557C (en) * | 2006-11-28 | 2016-10-18 | Hayward Industries, Inc. | Programmable underwater lighting system |
US7995344B2 (en) * | 2007-01-09 | 2011-08-09 | Lockheed Martin Corporation | High performance large tolerance heat sink |
TWM357844U (en) * | 2008-11-04 | 2009-05-21 | Wistron Corp | Thermal module capable of dissipating heat generated by a plurality of heat sources and related computer system |
US8537552B2 (en) * | 2009-09-25 | 2013-09-17 | Raytheon Company | Heat sink interface having three-dimensional tolerance compensation |
US20110267834A1 (en) | 2010-04-28 | 2011-11-03 | Hayward Industries, Inc. | Underwater Light Having A Sealed Polymer Housing and Method of Manufacture Therefor |
US8467191B2 (en) | 2010-12-02 | 2013-06-18 | Micron Technology, Inc. | Assemblies including heat sink elements and methods of assembling |
TWI543702B (en) * | 2012-02-08 | 2016-07-21 | 鴻準精密工業股份有限公司 | Heat dissipation device |
EP3620149B1 (en) | 2013-03-15 | 2021-10-06 | Hayward Industries, Inc. | Modular pool/spa control system |
US11129256B2 (en) | 2016-01-22 | 2021-09-21 | Hayward Industries, Inc. | Systems and methods for providing network connectivity and remote monitoring, optimization, and control of pool/spa equipment |
US11720085B2 (en) | 2016-01-22 | 2023-08-08 | Hayward Industries, Inc. | Systems and methods for providing network connectivity and remote monitoring, optimization, and control of pool/spa equipment |
US10991639B2 (en) * | 2016-04-01 | 2021-04-27 | International Business Machines Corporation | Compliant Pin Fin heat sink with base integral pins |
CA2973208A1 (en) * | 2016-07-15 | 2018-01-15 | Magna Seating Inc. | Flexible heat sink for thermoelectric device |
US11168876B2 (en) | 2019-03-06 | 2021-11-09 | Hayward Industries, Inc. | Underwater light having programmable controller and replaceable light-emitting diode (LED) assembly |
US11292204B2 (en) | 2019-08-06 | 2022-04-05 | The Boeing Company | Induction welding using a heat sink and/or cooling |
US11458691B2 (en) | 2019-08-06 | 2022-10-04 | The Boeing Company | Induction welding using a heat sink and/or cooling |
US11358344B2 (en) | 2019-08-06 | 2022-06-14 | The Boeiog Company | Induction welding using a heat sink and/or cooling |
US11351738B2 (en) | 2019-08-06 | 2022-06-07 | The Boeing Company | Induction welding using a heat sink and/or cooling |
US11364688B2 (en) * | 2019-08-06 | 2022-06-21 | The Boeing Company | Induction welding using a heat sink and/or cooling |
US11524467B2 (en) | 2019-08-06 | 2022-12-13 | The Boeing Company | Induction welding using a heat sink and/or cooling |
US11230066B2 (en) | 2019-08-06 | 2022-01-25 | The Boeing Company | Induction welding using a heat sink and/or cooling |
USD904322S1 (en) | 2019-08-28 | 2020-12-08 | Carbice Corporation | Flexible heat sink |
USD906269S1 (en) | 2019-08-28 | 2020-12-29 | Carbice Corporation | Flexible heat sink |
USD903610S1 (en) | 2019-08-28 | 2020-12-01 | Carbice Corporation | Flexible heat sink |
US20210063099A1 (en) | 2019-08-28 | 2021-03-04 | Carbice Corporation | Flexible and conformable polymer-based heat sinks and methods of making and using thereof |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2711382A (en) * | 1951-02-08 | 1955-06-21 | Gen Electric | Method of forming and applying metal heat exchange fins |
US4964458A (en) * | 1986-04-30 | 1990-10-23 | International Business Machines Corporation | Flexible finned heat exchanger |
US5168348A (en) * | 1991-07-15 | 1992-12-01 | International Business Machines Corporation | Impingment cooled compliant heat sink |
JPH06244328A (en) * | 1993-02-19 | 1994-09-02 | Fujitsu Ltd | Heat sink |
US5837081A (en) * | 1993-04-07 | 1998-11-17 | Applied Sciences, Inc. | Method for making a carbon-carbon composite |
US5829512A (en) * | 1995-08-29 | 1998-11-03 | Silicon Graphics, Inc. | Heatsink and method of forming a heatsink |
US5653280A (en) * | 1995-11-06 | 1997-08-05 | Ncr Corporation | Heat sink assembly and method of affixing the same to electronic devices |
US5771966A (en) * | 1995-12-15 | 1998-06-30 | Jacoby; John | Folded conducting member heatsinks and method of making same |
US5912805A (en) * | 1998-11-04 | 1999-06-15 | Freuler; Raymond G. | Thermal interface with adhesive |
-
2001
- 2001-05-07 US US09/850,017 patent/US6367541B2/en not_active Expired - Lifetime
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040008496A1 (en) * | 2002-07-10 | 2004-01-15 | Larson Thane Michael | Portable thermal barrier for an electronic system |
GB2400167A (en) * | 2003-03-31 | 2004-10-06 | Sun Microsystems Inc | A heat-sink for multiple computer elements |
GB2400167B (en) * | 2003-03-31 | 2005-06-29 | Sun Microsystems Inc | Heatsink apparatus |
US7391614B2 (en) | 2005-03-24 | 2008-06-24 | Dell Products L.P. | Method and apparatus for thermal dissipation in an information handling system |
US20110198067A1 (en) * | 2006-06-08 | 2011-08-18 | International Business Machines Corporation | Sheet having high thermal conductivity and flexibility |
US9179579B2 (en) * | 2006-06-08 | 2015-11-03 | International Business Machines Corporation | Sheet having high thermal conductivity and flexibility |
WO2009105411A2 (en) * | 2008-02-21 | 2009-08-27 | Alcatel-Lucent Usa Inc. | Thermally conductive periodically structured gap fillers and method for utilizing same |
WO2009105411A3 (en) * | 2008-02-21 | 2009-12-17 | Alcatel-Lucent Usa Inc. | Thermally conductive periodically structured gap fillers and method for utilizing same |
US20090213548A1 (en) * | 2008-02-21 | 2009-08-27 | Kempers Roger S | Thermally conductive periodically structured gap fillers and method for utilizing same |
US20110316144A1 (en) * | 2010-06-25 | 2011-12-29 | Samsung Electronics Co., Ltd. | Flexible heat sink having ventilation ports and semiconductor package including the same |
US8648478B2 (en) * | 2010-06-25 | 2014-02-11 | Samsung Electronics Co., Ltd. | Flexible heat sink having ventilation ports and semiconductor package including the same |
CN103249278A (en) * | 2012-02-09 | 2013-08-14 | 富瑞精密组件(昆山)有限公司 | Heat dissipation device |
GB2522642A (en) * | 2014-01-30 | 2015-08-05 | Xyratex Tech Ltd | A solid state memory unit cooling apparatus and solid state storage device |
US9648730B2 (en) | 2014-01-30 | 2017-05-09 | Xyratex Technology Limited | Solid state memory unit cooling apparatus |
GB2522642B (en) * | 2014-01-30 | 2018-08-15 | Xyratex Tech Limited | A solid state memory unit cooling apparatus and solid state storage device |
US10309473B2 (en) * | 2015-09-04 | 2019-06-04 | Edward D. Horton | Apparatus and method for heat dissipation of a brake pad |
Also Published As
Publication number | Publication date |
---|---|
US6367541B2 (en) | 2002-04-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6367541B2 (en) | Conforming heat sink assembly | |
US6093961A (en) | Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment | |
US6459582B1 (en) | Heatsink apparatus for de-coupling clamping forces on an integrated circuit package | |
US6831836B2 (en) | Low thermal resistance interface for attachment of thermal materials to a processor die | |
US6014315A (en) | Heat sink assembly with multiple pressure capability | |
US6963130B1 (en) | Heatsinking and packaging of integrated circuit chips | |
EP0871352B1 (en) | Integrated circuit device cooling structure | |
US6385047B1 (en) | U-shaped heat sink assembly | |
US7606033B2 (en) | Mounting a heat sink in thermal contact with an electronic component | |
US6385044B1 (en) | Heat pipe heat sink assembly for cooling semiconductor chips | |
US6078500A (en) | Pluggable chip scale package | |
US5990552A (en) | Apparatus for attaching a heat sink to the back side of a flip chip package | |
US6252774B1 (en) | Multi-device heat sink assembly | |
US6265772B1 (en) | Stacked semiconductor device | |
US7307845B2 (en) | Multiple integrated circuit package module | |
US10342160B2 (en) | Heat sink attachment on existing heat sinks | |
US5737187A (en) | Apparatus, method and system for thermal management of an unpackaged semiconductor device | |
US7714423B2 (en) | Mid-plane arrangement for components in a computer system | |
US7990717B2 (en) | Heat sink and electronic device using same | |
US20080151504A1 (en) | System and method for cooling a module | |
EP0054539B1 (en) | A semiconductor integrated circuit device with an improved heat sink | |
WO2000025561A1 (en) | Heat sink assembly with threaded collar and multiple pressure capabillty | |
JP2004165586A (en) | Package structure, printed board mounted with the same package structure and electronic equipment having the same printed board | |
US20020018338A1 (en) | Insert molded heat sink assembly | |
US11810832B2 (en) | Heat sink configuration for multi-chip module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: COOL SHIELD, INC., RHODE ISLAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:COOL OPTIONS, INC.;REEL/FRAME:012343/0163 Effective date: 20020123 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FEPP | Fee payment procedure |
Free format text: PAT HOLDER CLAIMS SMALL ENTITY STATUS, ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: LTOS); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
AS | Assignment |
Owner name: COOL OPTIONS, INC., NEW HAMPSHIRE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:COOL SHIELD, INC.;REEL/FRAME:033960/0190 Effective date: 20141010 |
|
AS | Assignment |
Owner name: TICONA POLYMERS, INC., KENTUCKY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:COOL OPTIONS, INC.;REEL/FRAME:034033/0088 Effective date: 20141020 |
|
FEPP | Fee payment procedure |
Free format text: PAT HOLDER NO LONGER CLAIMS SMALL ENTITY STATUS, ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: STOL); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |