US20010045915A1 - Antenna device - Google Patents
Antenna device Download PDFInfo
- Publication number
- US20010045915A1 US20010045915A1 US09/805,888 US80588801A US2001045915A1 US 20010045915 A1 US20010045915 A1 US 20010045915A1 US 80588801 A US80588801 A US 80588801A US 2001045915 A1 US2001045915 A1 US 2001045915A1
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- US
- United States
- Prior art keywords
- carrier
- items
- protective layer
- roll
- long flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/149—Sectional layer removable
- Y10T428/1495—Adhesive is on removable layer
Definitions
- the present invention relates to a production method for, and a device for facilitating the production of, printed circuits for radio communication equipment in general, and more particular to a production method for, and a device for facilitating production of, printed circuits disposed on a flexible carrier.
- An antenna device designed as a conductive pattern on a flexible substrate has proven to be a design with very stable radio frequency characteristics. This is dependent on the accuracy with which it is possible to design the pattern on the flexible substrate.
- There is also a number of other advantages with using a flexible substrate It can however be a problem to handle these thin flexible items in the manufacturing process. These problems might include that the items adhere to each other, that they hook in to slits in each other, difficulties in applying them to a coil neck (e.g. the antenna support), that they get stuck in fissures in the manufacturing machines etc. it would therefore be beneficial to have a manufacturing process to use the advantageous flexible substrates which do not have the above mentioned problems in the manufacturing.
- One object of the present invention is thus to achieve a device for facilitating the manufacturing of devices comprising printed circuits on flexible substrates.
- This object is obtained by a device for feeding items to a manufacturing machine, where said device comprises a long flexible film arranged in a roll, said film comprising a first protective layer for carrying each of said items.
- An adhesive agent applied between said item and said protective layer, attaching said item to said protective layer, said first protective layer and said agent cooperating so that when said item is detached from said first protective layer substantially all of said adhesive agent is disposed on said item and where said item comprises a printed circuit.
- Another object of the present invention is to provide a method for manufacturing of a device which facilitate the manufacturing of devices comprising printed circuits on flexible substrates.
- This object is obtained by providing a method for manufacturing a roll of printed circuit diagrams wherein a long flexible first carrier having a conductive substrate and being arranged in a roll, is screen printed according to a first pattern with a screen paint; the part of said conductive substrate, not covered by the screen print, is etched away so that a printed circuit is obtained; said screen paint is washed away; a long flexible second carrier, comprising on a first side an adhesive agent, is laminated together with said first carrier, with said first side facing said first carrier; a first form is punched on said first carrier; excess material of said first carrier is removed so that a band is formed with said first carrier carrying items comprising said printed circuit having said first form.
- Another object of the present invention is to provide a method for manufacturing an antenna device comprising at least one printed circuit on a flexible substrate, where said printed circuit comprises at least one radiating element.
- An advantage with the present invention is that a smooth and efficient manufacturing process is achieved for the production of printed circuits on a flexible substrate.
- An advantage, according to one embodiment of the invention, is that the above mentioned problems are avoided.
- An advantage is that each printed circuit item is well protected from damage and is fed in a controlled manner to a mounting machine.
- An advantage, according to one embodiment of the invention, is that the orientation of the printed circuit items can be chosen to fit the specific application or mounting machine.
- An advantage, according to one embodiment of the invention, is that it is easy to produce several different printed circuit layouts in one batch.
- FIG. 1 shows a perspective view of a roll according to a preferred embodiment of the present invention
- FIG. 2 shows a side view of a roll according to a preferred embodiment of the invention
- FIG. 3 shows a top view of a long flexible film comprising printed circuit items according to a preferred embodiment of the invention
- FIG. 4 shows a top view of a long flexible film comprising several parallel printed circuit items according to a preferred embodiment of the invention
- FIGS. 5 a, 5 b, 5 c, 5 d and 5 e discloses a long flexible film after different process steps of in a method according to a preferred embodiment of the invention
- FIGS. 6 a, 6 b disclose the final long flexible film after all steps in FIG. 5
- FIG. 1 shows a long flexible film 101 arranged in a roll 102 .
- the film 101 comprises antenna elements, whereof four 103 , 104 , 105 and 106 are visible, and a protective carrier layer 107 .
- the antenna elements consist of etched printed circuits, having specific radio frequency characteristics, applied on a flexible substrate. Between the antenna elements and the protective layer 107 is an adhesive agent present (not shown).
- the roll 102 is mounted on a stand 108 according to known methods and the film 101 is fed over an edge 109 to a dispose roll 110 which collects the protective layer 107 . When the film 101 is fed over the edge 109 the antenna element 103 detach from the protective layer 107 .
- the film 101 is fed so that a convenient part of the antenna element 103 protrudes out from the edge 109 .
- This enables a mounting machine 111 to easy grab the antenna element 103 for mounting on a antenna support structure (not shown).
- the mounting machine 111 is depicted in a schematic manner in FIG. 1. Several different arrangement are possible for the mounting machine in dependence of the specific requirements for the specific application.
- FIG. 2 shows the roll 102 comprising antenna elements in a side view.
- FIG. 3 shows a part of a long flexible carrier film 301 , which is to be arranged in a roll, comprising antenna elements 302 .
- the antenna elements in this application are dual band elements having a first and second radiating element 303 and 304 , respectively. It is of course also possible to include other types of printed circuits than radiating elements such as for instance a matching circuit etc.
- FIG. 4 shows a part of a long flexible carrier layer 401 , which is to be arranged in a roll, comprising several parallel antenna elements 402 of different size, with different patterns and arranged in different directions.
- the arrow 403 indicates the direction of roll out.
- the different parallel structures 404 are at a later stage in the production process cut in individual rolls.
- FIGS. 5 - 9 show a small part of a long flexible film 501 after different process steps in a method according to a preferred embodiment of the invention.
- FIG. 5 a shows a side view
- FIG. 5 b shows a top view, of the long flexible substrate 501 before the first step of the present method.
- the substrate 510 comprises a first flexible polyester substrate 502 and on top of that a conductive copper layer 503 .
- On the conductive copper layer 503 is a pattern 504 printed, as shown in FIG. 5 c, one after the other, along the long flexible substrate 501 , with a paint, which is resistant to the etching fluids later used.
- the printed circuit item consists of a conductive pattern 602 , a flexible carrier 603 , and an adhesive agent 604 .
- the printed circuit item are attached to the protective layer 605 under the influence of said adhesive agent 604 .
- FIG. 7 is another preferred embodiment according to the invention disclosed.
- a conductive circuit 701 and a carrier 702 formed from the same flexible conductive metallic sheet by punching out a predefined pattern.
- Said pattern constitutes a radiating antenna device operative in at least a first frequency band and adapted for being coupled to RF circuitry (not shown).
- the conductive circuit 701 is hold in place on the carrier 702 through small retainer parts 703 .
- the retainer parts 703 are firm enough to hold the conductive circuit in place but weak enough to indestructibly release the conductive circuit 701 in the manufacturing process. Of course may more than two retainer parts be used to hold each conductive circuit 701 .
Abstract
The present invention facilitates the manufacturing of devices comprising printed circuits on flexible substrates. The objects of the invention are obtained by a device for feeding items to a manufacturing machine, where said device comprises a long flexible film arranged in a roll, said film comprising a first protective layer for carrying each of said items. An adhesive agent, applied between said item and said protective layer, attaching said item to said protective layer, said first protective layer and said agent cooperating so that when said item is detached from said first protective layer substantially all of said adhesive agent is disposed on said item and where said item comprises a printed circuit.
Description
- The present invention relates to a production method for, and a device for facilitating the production of, printed circuits for radio communication equipment in general, and more particular to a production method for, and a device for facilitating production of, printed circuits disposed on a flexible carrier.
- The rapid expansion in the mobile telecommunication market and specifically in the radio communication market has led to a tremendous increase in the demand for radio communication devices. Thus the production of such devices increases. For a player on this market to stay competitive it is vital to have competitive products and a smooth manufacturing process for these products.
- A specific, important, such product, in the radio communication area, is the antenna device. It is important for the antenna device to adhere to strict requirements of radio frequency characteristics, for instance electric length etc., in the particular radio frequency bands in which it is designed to be operative. These requirements in turn set requirements for the manufacturing process of these devices. For antenna devices designed with a conductive wire formed as a helix the production might result in devices which vary somewhat in the aforementioned characteristics. These devices are however robust, low-cost and has proven to be, once tested to adhere to said requirements, a successful approach in the design of antenna devices for radio communication devices.
- An antenna device designed as a conductive pattern on a flexible substrate has proven to be a design with very stable radio frequency characteristics. This is dependent on the accuracy with which it is possible to design the pattern on the flexible substrate. There is also a number of other advantages with using a flexible substrate. It can however be a problem to handle these thin flexible items in the manufacturing process. These problems might include that the items adhere to each other, that they hook in to slits in each other, difficulties in applying them to a coil neck (e.g. the antenna support), that they get stuck in fissures in the manufacturing machines etc. it would therefore be beneficial to have a manufacturing process to use the advantageous flexible substrates which do not have the above mentioned problems in the manufacturing.
- One object of the present invention is thus to achieve a device for facilitating the manufacturing of devices comprising printed circuits on flexible substrates. This object is obtained by a device for feeding items to a manufacturing machine, where said device comprises a long flexible film arranged in a roll, said film comprising a first protective layer for carrying each of said items. An adhesive agent, applied between said item and said protective layer, attaching said item to said protective layer, said first protective layer and said agent cooperating so that when said item is detached from said first protective layer substantially all of said adhesive agent is disposed on said item and where said item comprises a printed circuit.
- Another object of the present invention is to provide a method for manufacturing of a device which facilitate the manufacturing of devices comprising printed circuits on flexible substrates. This object is obtained by providing a method for manufacturing a roll of printed circuit diagrams wherein a long flexible first carrier having a conductive substrate and being arranged in a roll, is screen printed according to a first pattern with a screen paint; the part of said conductive substrate, not covered by the screen print, is etched away so that a printed circuit is obtained; said screen paint is washed away; a long flexible second carrier, comprising on a first side an adhesive agent, is laminated together with said first carrier, with said first side facing said first carrier; a first form is punched on said first carrier; excess material of said first carrier is removed so that a band is formed with said first carrier carrying items comprising said printed circuit having said first form.
- Another object of the present invention is to provide a method for manufacturing an antenna device comprising at least one printed circuit on a flexible substrate, where said printed circuit comprises at least one radiating element.
- An advantage with the present invention is that a smooth and efficient manufacturing process is achieved for the production of printed circuits on a flexible substrate.
- An advantage, according to one embodiment of the invention, is that the above mentioned problems are avoided.
- An advantage, according to one embodiment of the invention, is that each printed circuit item is well protected from damage and is fed in a controlled manner to a mounting machine.
- An advantage, according to one embodiment of the invention, is that the orientation of the printed circuit items can be chosen to fit the specific application or mounting machine.
- An advantage, according to one embodiment of the invention, is that it is easy to produce several different printed circuit layouts in one batch.
- Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the scope of the invention will become apparent to those skilled in the art from this detailed description.
- The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention and wherein
- FIG. 1 shows a perspective view of a roll according to a preferred embodiment of the present invention;
- FIG. 2 shows a side view of a roll according to a preferred embodiment of the invention;
- FIG. 3 shows a top view of a long flexible film comprising printed circuit items according to a preferred embodiment of the invention;
- FIG. 4 shows a top view of a long flexible film comprising several parallel printed circuit items according to a preferred embodiment of the invention;
- FIGS. 5a, 5 b, 5 c, 5 d and 5 e, discloses a long flexible film after different process steps of in a method according to a preferred embodiment of the invention;
- FIGS. 6a, 6 b disclose the final long flexible film after all steps in FIG. 5
- FIG. 1 shows a long
flexible film 101 arranged in a roll 102. Thefilm 101 comprises antenna elements, whereof four 103, 104, 105 and 106 are visible, and aprotective carrier layer 107. The antenna elements consist of etched printed circuits, having specific radio frequency characteristics, applied on a flexible substrate. Between the antenna elements and theprotective layer 107 is an adhesive agent present (not shown). The roll 102 is mounted on astand 108 according to known methods and thefilm 101 is fed over anedge 109 to adispose roll 110 which collects theprotective layer 107. When thefilm 101 is fed over theedge 109 theantenna element 103 detach from theprotective layer 107. Thefilm 101 is fed so that a convenient part of theantenna element 103 protrudes out from theedge 109. This enables amounting machine 111 to easy grab theantenna element 103 for mounting on a antenna support structure (not shown). Themounting machine 111 is depicted in a schematic manner in FIG. 1. Several different arrangement are possible for the mounting machine in dependence of the specific requirements for the specific application. - FIG. 2 shows the roll102 comprising antenna elements in a side view.
- FIG. 3 shows a part of a long
flexible carrier film 301, which is to be arranged in a roll, comprisingantenna elements 302. The antenna elements in this application are dual band elements having a first and secondradiating element - FIG. 4 shows a part of a long
flexible carrier layer 401, which is to be arranged in a roll, comprising severalparallel antenna elements 402 of different size, with different patterns and arranged in different directions. Thearrow 403 indicates the direction of roll out. In the production process it might be beneficial to process and manufacture several rolls of printed circuits simultaneously. The differentparallel structures 404 are at a later stage in the production process cut in individual rolls. - FIGS.5-9 show a small part of a long
flexible film 501 after different process steps in a method according to a preferred embodiment of the invention. FIG. 5a shows a side view, and FIG. 5b shows a top view, of the longflexible substrate 501 before the first step of the present method. The substrate 510 comprises a firstflexible polyester substrate 502 and on top of that aconductive copper layer 503. On theconductive copper layer 503 is apattern 504 printed, as shown in FIG. 5c, one after the other, along the longflexible substrate 501, with a paint, which is resistant to the etching fluids later used. Of course, as been previously mentioned, several, different or alike, patterns may be printed in parallel to produce several rolls in one batch. For sake of clarity only one is shown in this preferred embodiment. Thesubstrate 501 is next exposed to etching fluids, which etches away excess copper not covered by said paint so that a conductive pattern, a printedcircuit 505, is achieved as shown in a side view in FIG. 5d. The paint is washed away and aprotective layer 506 having anadhesive agent 507 is laminated with the polyester layer carrying the printedcircuit 505 as shown in FIG. 5e to produce the long flexible film. In FIG. 6a, which shows a side view, and 6 b which shows a top view, is the final long flexible film disclosed after the form for the printedcircuits 601 has been punched out and excess material removed. The printed circuit item consists of aconductive pattern 602, aflexible carrier 603, and anadhesive agent 604. The printed circuit item are attached to theprotective layer 605 under the influence of saidadhesive agent 604. Thus has a flexible printed circuit been created which is easily detachable as previously discussed. - In FIG. 7 is another preferred embodiment according to the invention disclosed. In this embodiment is a
conductive circuit 701 and acarrier 702 formed from the same flexible conductive metallic sheet by punching out a predefined pattern. Said pattern constitutes a radiating antenna device operative in at least a first frequency band and adapted for being coupled to RF circuitry (not shown). Theconductive circuit 701 is hold in place on thecarrier 702 throughsmall retainer parts 703. Theretainer parts 703 are firm enough to hold the conductive circuit in place but weak enough to indestructibly release theconductive circuit 701 in the manufacturing process. Of course may more than two retainer parts be used to hold eachconductive circuit 701. - It shall be realized that while a very specific and concrete example has been given the theme may be varied. For instance may a silver-polymer be used as the conductive circuit, other methods for achieving the printed circuit may be used, for instance may the printed circuit be printed on the flexible carrier using a conductive paint.
- The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.
Claims (29)
1. Dispensing device for feeding items for use in an automatic assembly process, said device comprising:
a band of flexible composite film (101) arranged in multiple turns forming a roll (102) having essentially a circularly cylindrical shape,
said film including a plurality of items to be fed, and a continuous carrier layer (107) for carrying each of said items,
characterized in that,
said items include a first conductive circuit (103), forming a radiator for transmitting/feeding information-carrying radio signals in the UHF range.
2. Device of , wherein
claim 1
said items are stickers, and
said conductive circuits are disposed on said stickers.
3. Device of , wherein
claim 1
an adhesive agent, located between said items and said carrier layer, attaching said items to said carrier layer,
said adhesive agent having a greater adhesion to each of said items than to said carrier layer, so as to attach to each of said items as it is separated from said carrier layer.
4. Device of , wherein said conductive circuit is composed of at least one element in a group consisting of: a dried conductive paint, an etched metal plate pattern produced in a positive pattern printing process, an etched metal plate pattern produced in a photo process, a punched metal plate pattern.
claim 1
5. Device of , wherein said items further include at least one further conductive circuit forming at least one element selected from a group consisting of: a radiator, a parasitic resonator, an inductor, a capacitor, a connector, a marking.
claim 1
6. Device of , wherein said at least one further conductive circuit being conductively coupled to said first conductive circuit.
claim 5
7. Device of , wherein said at least one further conductive circuit being capacitively coupled to said first conductive circuit.
claim 5
8. Device of , wherein said at least one further conductive circuit being inductively coupled to said first conductive circuit.
claim 5
9. Device of , wherein said items are arranged to be adhesively attachable to a cylindrical surface.
claim 3
10. Device of , wherein said items are arranged to be adhesively attachable to a spheroid surface.
claim 3
11. A device according to , wherein
claim 3
said item comprises a flexible substrate,
that said adhesive agent is disposed on a first side of said flexible substrate facing said protective layer,
that said first conductor is disposed on a second side of said flexible substrate opposite said first side.
12. A device according to , wherein
claim 1
said first conductive circuit comprises a first contact area arranged for being in electrical contact with RF circuitry in a radio communication device,
said radiator having radio frequency characteristics so as to be operative in at least a first frequency band.
13. A device according to , wherein
claim 1
said first conductive circuit comprises at least a first part having radio frequency characteristics so as to match said radiating member to a predetermined impedance.
14. A device according to , wherein
claim 1
said items are arranged for receiving at least a first discrete component conductively connectable to said first conductive circuit.
15. Method for manufacturing a roll of sticker items including a radiator, said method being characterized by the steps of:
screen printing a long flexible first carrier having a metallic layer disposed thereon according to a first pattern with a protective paint,
said long flexible first carrier being arranged in a roll,
etching away the part of said conductive substrate, not covered by the protective paint, is etched away so that a printed circuit is obtained,
a long flexible protective layer, an adhesive agent and said first carrier are laminated together, with said adhesive agent.
16. A method according to , wherein
claim 15
a first contour is cut on said first carrier
17. A method according to , wherein
claim 15
excess material of said first carrier is removed so that a long flexible film is formed with said long flexible protective layer carrying items comprising said printed circuit having said first form.
18. A method according to , wherein
claim 15
said screen paint is removed,
19. A method according to , wherein
claim 15
at least two patterns are screen printed side by side on said first carrier,
said long flexible film is cut in at least two parts with one of, said at least two patterns, on each part.
20. A method according to , wherein
claim 15
said first carrier is arranged in a first roll,
said long flexible protective layer is arranged in a second roll,
said painting, said etching, said washing, said laminating of said protective layer and said punching is continuously performed while unrolling said first carrier from said first roll to a third roll.
21. A method according to , wherein
claim 15
said first carrier is arranged in a first sheet,
said long flexible protective layer is arranged in a second sheet,
said painting, said etching, said washing, said laminating of said protective layer and said punching is performed on one sheet at a time producing a third sheet,
said third sheet is arranged in a roll.
22. A method for manufacturing an antenna device, characterized in the steps according to ,
claim 15
said printed circuit having a pattern operative in at least a first radio frequency band and further comprising the steps of:
unrolling said long flexible film over a first edge so that said items, comprising said printed circuit, is detached from said protective layer and protruding over said edge,
fetching of said protruding item by a mounting machine,
mounting of said fetched item on an antenna device support structure using said adhesive agent.
23. Method for manufacturing a roll of sticker items including a radiator, said method being characterized by the steps of:
printing a long flexible first carrier according to a first pattern with a conductive paint and letting it dry so that a printed circuit is obtained,
said long flexible first carrier being arranged in a roll,
a long flexible protective layer, an adhesive agent and said first carrier are laminated together, with said adhesive agent.
24. A method according to , wherein
claim 23
a first contour is cut on said first carrier
25. A method according to , wherein
claim 23
excess material of said first carrier is removed so that a long flexible film is formed with said long flexible protective layer carrying items comprising said printed circuit having said first form.
26. A method according to , wherein
claim 23
at least two patterns are screen printed side by side on said first carrier,
said long flexible film is cut in at least two parts with one of, said at least two patterns, on each part.
27. A method according to , wherein
claim 23
said first carrier is arranged in a first roll,
said long flexible protective layer is arranged in a second roll,
said painting, said etching, said washing, said laminating of said protective layer and said cutting is continuously performed while unrolling said first carrier from said first roll to a third roll.
28. A method according to , wherein
claim 23
said first carrier is arranged in a first sheet,
said long flexible protective layer is arranged in a second sheet,
said painting, said etching, said washing, said laminating of said protective layer and said cutting is performed on one sheet at a time producing a third sheet,
said third sheet is arranged in a roll.
29. A method for manufacturing an antenna device, characterized in the steps according to ,
claim 23
said printed circuit having a pattern operative in at least a first radio frequency band and further comprising the steps of:
unrolling said long flexible film over a first edge so that said items, comprising said printed circuit, is detached from said protective layer and protruding over said edge,
fetching of said protruding item by a mounting machine,
mounting of said fetched item on an antenna device support structure using said adhesive agent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/805,888 US20010045915A1 (en) | 1999-02-10 | 2001-03-15 | Antenna device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99850020.1 | 1999-02-10 | ||
EP99850020A EP1028483B1 (en) | 1999-02-10 | 1999-02-10 | Method and device for manufacturing a roll of antenna elements and for dispensing said antenna elements |
US09/249,776 US6281842B1 (en) | 1999-02-10 | 1999-02-16 | Conductive circuit device and method |
US09/805,888 US20010045915A1 (en) | 1999-02-10 | 2001-03-15 | Antenna device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/249,776 Division US6281842B1 (en) | 1999-02-10 | 1999-02-16 | Conductive circuit device and method |
Publications (1)
Publication Number | Publication Date |
---|---|
US20010045915A1 true US20010045915A1 (en) | 2001-11-29 |
Family
ID=26153826
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/249,776 Expired - Fee Related US6281842B1 (en) | 1999-02-10 | 1999-02-16 | Conductive circuit device and method |
US09/805,888 Abandoned US20010045915A1 (en) | 1999-02-10 | 2001-03-15 | Antenna device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/249,776 Expired - Fee Related US6281842B1 (en) | 1999-02-10 | 1999-02-16 | Conductive circuit device and method |
Country Status (5)
Country | Link |
---|---|
US (2) | US6281842B1 (en) |
EP (1) | EP1028483B1 (en) |
AU (1) | AU2954900A (en) |
BR (1) | BR0008119A (en) |
WO (1) | WO2000048267A1 (en) |
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WO2003023901A1 (en) * | 2001-09-07 | 2003-03-20 | Andrew Corporation | Wide bandwidth base station antenna and antenna array |
EP1517403A2 (en) * | 2003-08-29 | 2005-03-23 | Fujitsu Ten Limited | Circular polarization antenna and composite antenna including this antenna |
JP2005236656A (en) * | 2004-02-19 | 2005-09-02 | Fujitsu Ten Ltd | Circular polarization antenna |
US20090051606A1 (en) * | 2006-04-28 | 2009-02-26 | Shozo Ochi | Electronic circuit module with built-in antenna and method for manufacturing the same |
US20090315798A1 (en) * | 2008-06-24 | 2009-12-24 | Samsung Electro-Machanics Co., Ltd. | Antenna for radio frequency reception |
WO2018103897A1 (en) * | 2016-12-09 | 2018-06-14 | Telefonaktiebolaget L M Ericsson (Publ) | Improved antenna arrangement for distributed massive mimo |
US11329699B2 (en) | 2018-10-16 | 2022-05-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Disturbance mitigation |
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EP1069644B1 (en) * | 1999-07-16 | 2008-01-02 | Mitsubishi Materials Corporation | Antenna assembly |
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-
2000
- 2000-02-10 BR BR0008119-1A patent/BR0008119A/en not_active IP Right Cessation
- 2000-02-10 AU AU29549/00A patent/AU2954900A/en not_active Abandoned
- 2000-02-10 WO PCT/SE2000/000265 patent/WO2000048267A1/en active IP Right Grant
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WO2003023901A1 (en) * | 2001-09-07 | 2003-03-20 | Andrew Corporation | Wide bandwidth base station antenna and antenna array |
US20040201541A1 (en) * | 2001-09-07 | 2004-10-14 | Izzat Narian K. | Wide bandwidth base station antenna and antenna array |
US6917346B2 (en) | 2001-09-07 | 2005-07-12 | Andrew Corporation | Wide bandwidth base station antenna and antenna array |
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EP1517403A3 (en) * | 2003-08-29 | 2006-04-12 | Fujitsu Ten Limited | Circular polarization antenna and composite antenna including this antenna |
US7286098B2 (en) | 2003-08-29 | 2007-10-23 | Fujitsu Ten Limited | Circular polarization antenna and composite antenna including this antenna |
JP2005236656A (en) * | 2004-02-19 | 2005-09-02 | Fujitsu Ten Ltd | Circular polarization antenna |
US20090051606A1 (en) * | 2006-04-28 | 2009-02-26 | Shozo Ochi | Electronic circuit module with built-in antenna and method for manufacturing the same |
US20090315798A1 (en) * | 2008-06-24 | 2009-12-24 | Samsung Electro-Machanics Co., Ltd. | Antenna for radio frequency reception |
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US11916625B2 (en) | 2016-12-09 | 2024-02-27 | Telefonaktiebolaget Lm Ericsson (Publ) | Antenna arrangement for distributed massive MIMO |
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US11799524B2 (en) | 2017-11-21 | 2023-10-24 | Telefonaktiebolaget Lm Ericsson (Publ) | Antenna arrangement for distributed massive MIMO |
US11329699B2 (en) | 2018-10-16 | 2022-05-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Disturbance mitigation |
US11777619B2 (en) | 2020-02-10 | 2023-10-03 | Telefonaktiebolaget Lm Ericsson (Publ) | Dielectric waveguide signal transfer function compensation |
Also Published As
Publication number | Publication date |
---|---|
US6281842B1 (en) | 2001-08-28 |
BR0008119A (en) | 2001-11-13 |
AU2954900A (en) | 2000-08-29 |
EP1028483A1 (en) | 2000-08-16 |
WO2000048267A1 (en) | 2000-08-17 |
EP1028483B1 (en) | 2006-09-27 |
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Legal Events
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STCB | Information on status: application discontinuation |
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