US20010045915A1 - Antenna device - Google Patents

Antenna device Download PDF

Info

Publication number
US20010045915A1
US20010045915A1 US09/805,888 US80588801A US2001045915A1 US 20010045915 A1 US20010045915 A1 US 20010045915A1 US 80588801 A US80588801 A US 80588801A US 2001045915 A1 US2001045915 A1 US 2001045915A1
Authority
US
United States
Prior art keywords
carrier
items
protective layer
roll
long flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/805,888
Inventor
Stefan Moren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US09/805,888 priority Critical patent/US20010045915A1/en
Publication of US20010045915A1 publication Critical patent/US20010045915A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0156Temporary polymeric carrier or foil, e.g. for processing or transferring
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264Peeling insulating layer, e.g. foil, or separating mask
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/007Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/14Layer or component removable to expose adhesive
    • Y10T428/149Sectional layer removable
    • Y10T428/1495Adhesive is on removable layer

Definitions

  • the present invention relates to a production method for, and a device for facilitating the production of, printed circuits for radio communication equipment in general, and more particular to a production method for, and a device for facilitating production of, printed circuits disposed on a flexible carrier.
  • An antenna device designed as a conductive pattern on a flexible substrate has proven to be a design with very stable radio frequency characteristics. This is dependent on the accuracy with which it is possible to design the pattern on the flexible substrate.
  • There is also a number of other advantages with using a flexible substrate It can however be a problem to handle these thin flexible items in the manufacturing process. These problems might include that the items adhere to each other, that they hook in to slits in each other, difficulties in applying them to a coil neck (e.g. the antenna support), that they get stuck in fissures in the manufacturing machines etc. it would therefore be beneficial to have a manufacturing process to use the advantageous flexible substrates which do not have the above mentioned problems in the manufacturing.
  • One object of the present invention is thus to achieve a device for facilitating the manufacturing of devices comprising printed circuits on flexible substrates.
  • This object is obtained by a device for feeding items to a manufacturing machine, where said device comprises a long flexible film arranged in a roll, said film comprising a first protective layer for carrying each of said items.
  • An adhesive agent applied between said item and said protective layer, attaching said item to said protective layer, said first protective layer and said agent cooperating so that when said item is detached from said first protective layer substantially all of said adhesive agent is disposed on said item and where said item comprises a printed circuit.
  • Another object of the present invention is to provide a method for manufacturing of a device which facilitate the manufacturing of devices comprising printed circuits on flexible substrates.
  • This object is obtained by providing a method for manufacturing a roll of printed circuit diagrams wherein a long flexible first carrier having a conductive substrate and being arranged in a roll, is screen printed according to a first pattern with a screen paint; the part of said conductive substrate, not covered by the screen print, is etched away so that a printed circuit is obtained; said screen paint is washed away; a long flexible second carrier, comprising on a first side an adhesive agent, is laminated together with said first carrier, with said first side facing said first carrier; a first form is punched on said first carrier; excess material of said first carrier is removed so that a band is formed with said first carrier carrying items comprising said printed circuit having said first form.
  • Another object of the present invention is to provide a method for manufacturing an antenna device comprising at least one printed circuit on a flexible substrate, where said printed circuit comprises at least one radiating element.
  • An advantage with the present invention is that a smooth and efficient manufacturing process is achieved for the production of printed circuits on a flexible substrate.
  • An advantage, according to one embodiment of the invention, is that the above mentioned problems are avoided.
  • An advantage is that each printed circuit item is well protected from damage and is fed in a controlled manner to a mounting machine.
  • An advantage, according to one embodiment of the invention, is that the orientation of the printed circuit items can be chosen to fit the specific application or mounting machine.
  • An advantage, according to one embodiment of the invention, is that it is easy to produce several different printed circuit layouts in one batch.
  • FIG. 1 shows a perspective view of a roll according to a preferred embodiment of the present invention
  • FIG. 2 shows a side view of a roll according to a preferred embodiment of the invention
  • FIG. 3 shows a top view of a long flexible film comprising printed circuit items according to a preferred embodiment of the invention
  • FIG. 4 shows a top view of a long flexible film comprising several parallel printed circuit items according to a preferred embodiment of the invention
  • FIGS. 5 a, 5 b, 5 c, 5 d and 5 e discloses a long flexible film after different process steps of in a method according to a preferred embodiment of the invention
  • FIGS. 6 a, 6 b disclose the final long flexible film after all steps in FIG. 5
  • FIG. 1 shows a long flexible film 101 arranged in a roll 102 .
  • the film 101 comprises antenna elements, whereof four 103 , 104 , 105 and 106 are visible, and a protective carrier layer 107 .
  • the antenna elements consist of etched printed circuits, having specific radio frequency characteristics, applied on a flexible substrate. Between the antenna elements and the protective layer 107 is an adhesive agent present (not shown).
  • the roll 102 is mounted on a stand 108 according to known methods and the film 101 is fed over an edge 109 to a dispose roll 110 which collects the protective layer 107 . When the film 101 is fed over the edge 109 the antenna element 103 detach from the protective layer 107 .
  • the film 101 is fed so that a convenient part of the antenna element 103 protrudes out from the edge 109 .
  • This enables a mounting machine 111 to easy grab the antenna element 103 for mounting on a antenna support structure (not shown).
  • the mounting machine 111 is depicted in a schematic manner in FIG. 1. Several different arrangement are possible for the mounting machine in dependence of the specific requirements for the specific application.
  • FIG. 2 shows the roll 102 comprising antenna elements in a side view.
  • FIG. 3 shows a part of a long flexible carrier film 301 , which is to be arranged in a roll, comprising antenna elements 302 .
  • the antenna elements in this application are dual band elements having a first and second radiating element 303 and 304 , respectively. It is of course also possible to include other types of printed circuits than radiating elements such as for instance a matching circuit etc.
  • FIG. 4 shows a part of a long flexible carrier layer 401 , which is to be arranged in a roll, comprising several parallel antenna elements 402 of different size, with different patterns and arranged in different directions.
  • the arrow 403 indicates the direction of roll out.
  • the different parallel structures 404 are at a later stage in the production process cut in individual rolls.
  • FIGS. 5 - 9 show a small part of a long flexible film 501 after different process steps in a method according to a preferred embodiment of the invention.
  • FIG. 5 a shows a side view
  • FIG. 5 b shows a top view, of the long flexible substrate 501 before the first step of the present method.
  • the substrate 510 comprises a first flexible polyester substrate 502 and on top of that a conductive copper layer 503 .
  • On the conductive copper layer 503 is a pattern 504 printed, as shown in FIG. 5 c, one after the other, along the long flexible substrate 501 , with a paint, which is resistant to the etching fluids later used.
  • the printed circuit item consists of a conductive pattern 602 , a flexible carrier 603 , and an adhesive agent 604 .
  • the printed circuit item are attached to the protective layer 605 under the influence of said adhesive agent 604 .
  • FIG. 7 is another preferred embodiment according to the invention disclosed.
  • a conductive circuit 701 and a carrier 702 formed from the same flexible conductive metallic sheet by punching out a predefined pattern.
  • Said pattern constitutes a radiating antenna device operative in at least a first frequency band and adapted for being coupled to RF circuitry (not shown).
  • the conductive circuit 701 is hold in place on the carrier 702 through small retainer parts 703 .
  • the retainer parts 703 are firm enough to hold the conductive circuit in place but weak enough to indestructibly release the conductive circuit 701 in the manufacturing process. Of course may more than two retainer parts be used to hold each conductive circuit 701 .

Abstract

The present invention facilitates the manufacturing of devices comprising printed circuits on flexible substrates. The objects of the invention are obtained by a device for feeding items to a manufacturing machine, where said device comprises a long flexible film arranged in a roll, said film comprising a first protective layer for carrying each of said items. An adhesive agent, applied between said item and said protective layer, attaching said item to said protective layer, said first protective layer and said agent cooperating so that when said item is detached from said first protective layer substantially all of said adhesive agent is disposed on said item and where said item comprises a printed circuit.

Description

    TECHNICAL FIELD OF INVENTION
  • The present invention relates to a production method for, and a device for facilitating the production of, printed circuits for radio communication equipment in general, and more particular to a production method for, and a device for facilitating production of, printed circuits disposed on a flexible carrier. [0001]
  • DESCRIPTION OF RELATED ART
  • The rapid expansion in the mobile telecommunication market and specifically in the radio communication market has led to a tremendous increase in the demand for radio communication devices. Thus the production of such devices increases. For a player on this market to stay competitive it is vital to have competitive products and a smooth manufacturing process for these products. [0002]
  • A specific, important, such product, in the radio communication area, is the antenna device. It is important for the antenna device to adhere to strict requirements of radio frequency characteristics, for instance electric length etc., in the particular radio frequency bands in which it is designed to be operative. These requirements in turn set requirements for the manufacturing process of these devices. For antenna devices designed with a conductive wire formed as a helix the production might result in devices which vary somewhat in the aforementioned characteristics. These devices are however robust, low-cost and has proven to be, once tested to adhere to said requirements, a successful approach in the design of antenna devices for radio communication devices. [0003]
  • An antenna device designed as a conductive pattern on a flexible substrate has proven to be a design with very stable radio frequency characteristics. This is dependent on the accuracy with which it is possible to design the pattern on the flexible substrate. There is also a number of other advantages with using a flexible substrate. It can however be a problem to handle these thin flexible items in the manufacturing process. These problems might include that the items adhere to each other, that they hook in to slits in each other, difficulties in applying them to a coil neck (e.g. the antenna support), that they get stuck in fissures in the manufacturing machines etc. it would therefore be beneficial to have a manufacturing process to use the advantageous flexible substrates which do not have the above mentioned problems in the manufacturing. [0004]
  • SUMMARY OF INVENTION
  • One object of the present invention is thus to achieve a device for facilitating the manufacturing of devices comprising printed circuits on flexible substrates. This object is obtained by a device for feeding items to a manufacturing machine, where said device comprises a long flexible film arranged in a roll, said film comprising a first protective layer for carrying each of said items. An adhesive agent, applied between said item and said protective layer, attaching said item to said protective layer, said first protective layer and said agent cooperating so that when said item is detached from said first protective layer substantially all of said adhesive agent is disposed on said item and where said item comprises a printed circuit. [0005]
  • Another object of the present invention is to provide a method for manufacturing of a device which facilitate the manufacturing of devices comprising printed circuits on flexible substrates. This object is obtained by providing a method for manufacturing a roll of printed circuit diagrams wherein a long flexible first carrier having a conductive substrate and being arranged in a roll, is screen printed according to a first pattern with a screen paint; the part of said conductive substrate, not covered by the screen print, is etched away so that a printed circuit is obtained; said screen paint is washed away; a long flexible second carrier, comprising on a first side an adhesive agent, is laminated together with said first carrier, with said first side facing said first carrier; a first form is punched on said first carrier; excess material of said first carrier is removed so that a band is formed with said first carrier carrying items comprising said printed circuit having said first form. [0006]
  • Another object of the present invention is to provide a method for manufacturing an antenna device comprising at least one printed circuit on a flexible substrate, where said printed circuit comprises at least one radiating element. [0007]
  • An advantage with the present invention is that a smooth and efficient manufacturing process is achieved for the production of printed circuits on a flexible substrate. [0008]
  • An advantage, according to one embodiment of the invention, is that the above mentioned problems are avoided. [0009]
  • An advantage, according to one embodiment of the invention, is that each printed circuit item is well protected from damage and is fed in a controlled manner to a mounting machine. [0010]
  • An advantage, according to one embodiment of the invention, is that the orientation of the printed circuit items can be chosen to fit the specific application or mounting machine. [0011]
  • An advantage, according to one embodiment of the invention, is that it is easy to produce several different printed circuit layouts in one batch. [0012]
  • Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the scope of the invention will become apparent to those skilled in the art from this detailed description.[0013]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention and wherein [0014]
  • FIG. 1 shows a perspective view of a roll according to a preferred embodiment of the present invention; [0015]
  • FIG. 2 shows a side view of a roll according to a preferred embodiment of the invention; [0016]
  • FIG. 3 shows a top view of a long flexible film comprising printed circuit items according to a preferred embodiment of the invention; [0017]
  • FIG. 4 shows a top view of a long flexible film comprising several parallel printed circuit items according to a preferred embodiment of the invention; [0018]
  • FIGS. 5[0019] a, 5 b, 5 c, 5 d and 5 e, discloses a long flexible film after different process steps of in a method according to a preferred embodiment of the invention;
  • FIGS. 6[0020] a, 6 b disclose the final long flexible film after all steps in FIG. 5
  • DETAILED DESCRIPTION OF THE EMBODIMENTS
  • FIG. 1 shows a long [0021] flexible film 101 arranged in a roll 102. The film 101 comprises antenna elements, whereof four 103, 104, 105 and 106 are visible, and a protective carrier layer 107. The antenna elements consist of etched printed circuits, having specific radio frequency characteristics, applied on a flexible substrate. Between the antenna elements and the protective layer 107 is an adhesive agent present (not shown). The roll 102 is mounted on a stand 108 according to known methods and the film 101 is fed over an edge 109 to a dispose roll 110 which collects the protective layer 107. When the film 101 is fed over the edge 109 the antenna element 103 detach from the protective layer 107. The film 101 is fed so that a convenient part of the antenna element 103 protrudes out from the edge 109. This enables a mounting machine 111 to easy grab the antenna element 103 for mounting on a antenna support structure (not shown). The mounting machine 111 is depicted in a schematic manner in FIG. 1. Several different arrangement are possible for the mounting machine in dependence of the specific requirements for the specific application.
  • FIG. 2 shows the roll [0022] 102 comprising antenna elements in a side view.
  • FIG. 3 shows a part of a long [0023] flexible carrier film 301, which is to be arranged in a roll, comprising antenna elements 302. The antenna elements in this application are dual band elements having a first and second radiating element 303 and 304, respectively. It is of course also possible to include other types of printed circuits than radiating elements such as for instance a matching circuit etc.
  • FIG. 4 shows a part of a long [0024] flexible carrier layer 401, which is to be arranged in a roll, comprising several parallel antenna elements 402 of different size, with different patterns and arranged in different directions. The arrow 403 indicates the direction of roll out. In the production process it might be beneficial to process and manufacture several rolls of printed circuits simultaneously. The different parallel structures 404 are at a later stage in the production process cut in individual rolls.
  • FIGS. [0025] 5-9 show a small part of a long flexible film 501 after different process steps in a method according to a preferred embodiment of the invention. FIG. 5a shows a side view, and FIG. 5b shows a top view, of the long flexible substrate 501 before the first step of the present method. The substrate 510 comprises a first flexible polyester substrate 502 and on top of that a conductive copper layer 503. On the conductive copper layer 503 is a pattern 504 printed, as shown in FIG. 5c, one after the other, along the long flexible substrate 501, with a paint, which is resistant to the etching fluids later used. Of course, as been previously mentioned, several, different or alike, patterns may be printed in parallel to produce several rolls in one batch. For sake of clarity only one is shown in this preferred embodiment. The substrate 501 is next exposed to etching fluids, which etches away excess copper not covered by said paint so that a conductive pattern, a printed circuit 505, is achieved as shown in a side view in FIG. 5d. The paint is washed away and a protective layer 506 having an adhesive agent 507 is laminated with the polyester layer carrying the printed circuit 505 as shown in FIG. 5e to produce the long flexible film. In FIG. 6a, which shows a side view, and 6 b which shows a top view, is the final long flexible film disclosed after the form for the printed circuits 601 has been punched out and excess material removed. The printed circuit item consists of a conductive pattern 602, a flexible carrier 603, and an adhesive agent 604. The printed circuit item are attached to the protective layer 605 under the influence of said adhesive agent 604. Thus has a flexible printed circuit been created which is easily detachable as previously discussed.
  • In FIG. 7 is another preferred embodiment according to the invention disclosed. In this embodiment is a [0026] conductive circuit 701 and a carrier 702 formed from the same flexible conductive metallic sheet by punching out a predefined pattern. Said pattern constitutes a radiating antenna device operative in at least a first frequency band and adapted for being coupled to RF circuitry (not shown). The conductive circuit 701 is hold in place on the carrier 702 through small retainer parts 703. The retainer parts 703 are firm enough to hold the conductive circuit in place but weak enough to indestructibly release the conductive circuit 701 in the manufacturing process. Of course may more than two retainer parts be used to hold each conductive circuit 701.
  • It shall be realized that while a very specific and concrete example has been given the theme may be varied. For instance may a silver-polymer be used as the conductive circuit, other methods for achieving the printed circuit may be used, for instance may the printed circuit be printed on the flexible carrier using a conductive paint. [0027]
  • The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims. [0028]

Claims (29)

1. Dispensing device for feeding items for use in an automatic assembly process, said device comprising:
a band of flexible composite film (101) arranged in multiple turns forming a roll (102) having essentially a circularly cylindrical shape,
said film including a plurality of items to be fed, and a continuous carrier layer (107) for carrying each of said items,
characterized in that,
said items include a first conductive circuit (103), forming a radiator for transmitting/feeding information-carrying radio signals in the UHF range.
2. Device of
claim 1
, wherein
said items are stickers, and
said conductive circuits are disposed on said stickers.
3. Device of
claim 1
, wherein
an adhesive agent, located between said items and said carrier layer, attaching said items to said carrier layer,
said adhesive agent having a greater adhesion to each of said items than to said carrier layer, so as to attach to each of said items as it is separated from said carrier layer.
4. Device of
claim 1
, wherein said conductive circuit is composed of at least one element in a group consisting of: a dried conductive paint, an etched metal plate pattern produced in a positive pattern printing process, an etched metal plate pattern produced in a photo process, a punched metal plate pattern.
5. Device of
claim 1
, wherein said items further include at least one further conductive circuit forming at least one element selected from a group consisting of: a radiator, a parasitic resonator, an inductor, a capacitor, a connector, a marking.
6. Device of
claim 5
, wherein said at least one further conductive circuit being conductively coupled to said first conductive circuit.
7. Device of
claim 5
, wherein said at least one further conductive circuit being capacitively coupled to said first conductive circuit.
8. Device of
claim 5
, wherein said at least one further conductive circuit being inductively coupled to said first conductive circuit.
9. Device of
claim 3
, wherein said items are arranged to be adhesively attachable to a cylindrical surface.
10. Device of
claim 3
, wherein said items are arranged to be adhesively attachable to a spheroid surface.
11. A device according to
claim 3
, wherein
said item comprises a flexible substrate,
that said adhesive agent is disposed on a first side of said flexible substrate facing said protective layer,
that said first conductor is disposed on a second side of said flexible substrate opposite said first side.
12. A device according to
claim 1
, wherein
said first conductive circuit comprises a first contact area arranged for being in electrical contact with RF circuitry in a radio communication device,
said radiator having radio frequency characteristics so as to be operative in at least a first frequency band.
13. A device according to
claim 1
, wherein
said first conductive circuit comprises at least a first part having radio frequency characteristics so as to match said radiating member to a predetermined impedance.
14. A device according to
claim 1
, wherein
said items are arranged for receiving at least a first discrete component conductively connectable to said first conductive circuit.
15. Method for manufacturing a roll of sticker items including a radiator, said method being characterized by the steps of:
screen printing a long flexible first carrier having a metallic layer disposed thereon according to a first pattern with a protective paint,
said long flexible first carrier being arranged in a roll,
etching away the part of said conductive substrate, not covered by the protective paint, is etched away so that a printed circuit is obtained,
a long flexible protective layer, an adhesive agent and said first carrier are laminated together, with said adhesive agent.
16. A method according to
claim 15
, wherein
a first contour is cut on said first carrier
17. A method according to
claim 15
, wherein
excess material of said first carrier is removed so that a long flexible film is formed with said long flexible protective layer carrying items comprising said printed circuit having said first form.
18. A method according to
claim 15
, wherein
said screen paint is removed,
19. A method according to
claim 15
, wherein
at least two patterns are screen printed side by side on said first carrier,
said long flexible film is cut in at least two parts with one of, said at least two patterns, on each part.
20. A method according to
claim 15
, wherein
said first carrier is arranged in a first roll,
said long flexible protective layer is arranged in a second roll,
said painting, said etching, said washing, said laminating of said protective layer and said punching is continuously performed while unrolling said first carrier from said first roll to a third roll.
21. A method according to
claim 15
, wherein
said first carrier is arranged in a first sheet,
said long flexible protective layer is arranged in a second sheet,
said painting, said etching, said washing, said laminating of said protective layer and said punching is performed on one sheet at a time producing a third sheet,
said third sheet is arranged in a roll.
22. A method for manufacturing an antenna device, characterized in the steps according to
claim 15
,
said printed circuit having a pattern operative in at least a first radio frequency band and further comprising the steps of:
unrolling said long flexible film over a first edge so that said items, comprising said printed circuit, is detached from said protective layer and protruding over said edge,
fetching of said protruding item by a mounting machine,
mounting of said fetched item on an antenna device support structure using said adhesive agent.
23. Method for manufacturing a roll of sticker items including a radiator, said method being characterized by the steps of:
printing a long flexible first carrier according to a first pattern with a conductive paint and letting it dry so that a printed circuit is obtained,
said long flexible first carrier being arranged in a roll,
a long flexible protective layer, an adhesive agent and said first carrier are laminated together, with said adhesive agent.
24. A method according to
claim 23
, wherein
a first contour is cut on said first carrier
25. A method according to
claim 23
, wherein
excess material of said first carrier is removed so that a long flexible film is formed with said long flexible protective layer carrying items comprising said printed circuit having said first form.
26. A method according to
claim 23
, wherein
at least two patterns are screen printed side by side on said first carrier,
said long flexible film is cut in at least two parts with one of, said at least two patterns, on each part.
27. A method according to
claim 23
, wherein
said first carrier is arranged in a first roll,
said long flexible protective layer is arranged in a second roll,
said painting, said etching, said washing, said laminating of said protective layer and said cutting is continuously performed while unrolling said first carrier from said first roll to a third roll.
28. A method according to
claim 23
, wherein
said first carrier is arranged in a first sheet,
said long flexible protective layer is arranged in a second sheet,
said painting, said etching, said washing, said laminating of said protective layer and said cutting is performed on one sheet at a time producing a third sheet,
said third sheet is arranged in a roll.
29. A method for manufacturing an antenna device, characterized in the steps according to
claim 23
,
said printed circuit having a pattern operative in at least a first radio frequency band and further comprising the steps of:
unrolling said long flexible film over a first edge so that said items, comprising said printed circuit, is detached from said protective layer and protruding over said edge,
fetching of said protruding item by a mounting machine,
mounting of said fetched item on an antenna device support structure using said adhesive agent.
US09/805,888 1999-02-10 2001-03-15 Antenna device Abandoned US20010045915A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09/805,888 US20010045915A1 (en) 1999-02-10 2001-03-15 Antenna device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP99850020.1 1999-02-10
EP99850020A EP1028483B1 (en) 1999-02-10 1999-02-10 Method and device for manufacturing a roll of antenna elements and for dispensing said antenna elements
US09/249,776 US6281842B1 (en) 1999-02-10 1999-02-16 Conductive circuit device and method
US09/805,888 US20010045915A1 (en) 1999-02-10 2001-03-15 Antenna device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US09/249,776 Division US6281842B1 (en) 1999-02-10 1999-02-16 Conductive circuit device and method

Publications (1)

Publication Number Publication Date
US20010045915A1 true US20010045915A1 (en) 2001-11-29

Family

ID=26153826

Family Applications (2)

Application Number Title Priority Date Filing Date
US09/249,776 Expired - Fee Related US6281842B1 (en) 1999-02-10 1999-02-16 Conductive circuit device and method
US09/805,888 Abandoned US20010045915A1 (en) 1999-02-10 2001-03-15 Antenna device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US09/249,776 Expired - Fee Related US6281842B1 (en) 1999-02-10 1999-02-16 Conductive circuit device and method

Country Status (5)

Country Link
US (2) US6281842B1 (en)
EP (1) EP1028483B1 (en)
AU (1) AU2954900A (en)
BR (1) BR0008119A (en)
WO (1) WO2000048267A1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023901A1 (en) * 2001-09-07 2003-03-20 Andrew Corporation Wide bandwidth base station antenna and antenna array
EP1517403A2 (en) * 2003-08-29 2005-03-23 Fujitsu Ten Limited Circular polarization antenna and composite antenna including this antenna
JP2005236656A (en) * 2004-02-19 2005-09-02 Fujitsu Ten Ltd Circular polarization antenna
US20090051606A1 (en) * 2006-04-28 2009-02-26 Shozo Ochi Electronic circuit module with built-in antenna and method for manufacturing the same
US20090315798A1 (en) * 2008-06-24 2009-12-24 Samsung Electro-Machanics Co., Ltd. Antenna for radio frequency reception
WO2018103897A1 (en) * 2016-12-09 2018-06-14 Telefonaktiebolaget L M Ericsson (Publ) Improved antenna arrangement for distributed massive mimo
US11329699B2 (en) 2018-10-16 2022-05-10 Telefonaktiebolaget Lm Ericsson (Publ) Disturbance mitigation
US11564188B2 (en) 2017-10-17 2023-01-24 Telefonaktiebolaget Lm Ericsson (Publ) Distributed MIMO synchronization
US11616540B2 (en) 2017-11-21 2023-03-28 Telefonaktiebolaget Lm Ericsson (Publ) Antenna arrangement for distributed massive MIMO
US11777619B2 (en) 2020-02-10 2023-10-03 Telefonaktiebolaget Lm Ericsson (Publ) Dielectric waveguide signal transfer function compensation

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1069644B1 (en) * 1999-07-16 2008-01-02 Mitsubishi Materials Corporation Antenna assembly
JP3473528B2 (en) * 1999-12-10 2003-12-08 日本電気株式会社 Motion detection device and motion detection method
DE10045419B4 (en) * 2000-09-14 2007-12-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a thermoelectric component, thermoelectric component and apparatus for carrying out the method
EP1209624A1 (en) * 2000-11-27 2002-05-29 Sony International (Europe) GmbH Method for compressed imaging artefact reduction
CN1284274C (en) * 2000-12-22 2006-11-08 安蒂诺瓦有限公司 Antenna device
US7159298B2 (en) * 2001-03-15 2007-01-09 Daniel Lieberman Method for the formation of RF antennas by demetallizing
DE10118866A1 (en) * 2001-04-18 2002-10-24 Swoboda Gmbh Geb Radar antenna with metal foil coating is made by separate injection molding of plastic part and electroforming of metal foil and joining them with adhesive
FI113811B (en) * 2003-03-31 2004-06-15 Filtronic Lk Oy Method of manufacturing antenna components
KR101204074B1 (en) * 2003-08-01 2012-11-27 삼성테크윈 주식회사 Smart label and manufacturing method thereof
EP1560155B1 (en) * 2004-01-31 2009-03-18 Atlantic ZeiserGmbH Manufacturing method for non-contact chip cards
FI120023B (en) * 2004-09-21 2009-05-29 Pulse Finland Oy Method for packaging and packaging of radiation elements
JP2007072853A (en) * 2005-09-08 2007-03-22 Renesas Technology Corp Method for manufacturing electronic apparatus
TW200846250A (en) * 2007-05-18 2008-12-01 Pyroswift Folding Co Ltd Manufacture method of tag-typed integrated soft circuit board and a structure thereof
EP2001078A1 (en) * 2007-05-25 2008-12-10 Laird Technologies AB An antenna device and a portable radio communication device comprising such an antenna device
KR101025964B1 (en) * 2009-08-10 2011-03-30 삼성전기주식회사 Method and device for manufacturing antenna pattern frame

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5537879B2 (en) * 1973-10-15 1980-09-30
US4356492A (en) * 1981-01-26 1982-10-26 The United States Of America As Represented By The Secretary Of The Navy Multi-band single-feed microstrip antenna system
US5291180A (en) 1981-10-30 1994-03-01 Reeb Max E LC structure useful in radio frequency security systems
US4843404A (en) * 1986-09-29 1989-06-27 Monarch Marking Systems, Inc. Tag web of spiral conductors
US4846922A (en) 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
AU1712188A (en) * 1987-04-27 1988-12-02 Soundcraft, Inc. Method for manufacture of and structure of a laminated proximity card
US5113921A (en) * 1987-11-02 1992-05-19 Minnesota Mining And Manufacturing Company Sheet material for masking apparatus
US5277734A (en) 1991-11-07 1994-01-11 Fred Bayer Holdings Inc. Electrically conductive circuit sheet and method and apparatus for making same
JPH066084A (en) * 1992-06-19 1994-01-14 Olympus Optical Co Ltd Automatic electronic part installation equipment
JP2570886Y2 (en) * 1993-04-05 1998-05-13 キヤノンアプテックス株式会社 Tack label roll
US5989377A (en) * 1994-07-08 1999-11-23 Metallized Products, Inc. Method of protecting the surface of foil and other thin sheet materials before and during high-temperature and high pressure laminating
US5592150A (en) * 1994-10-27 1997-01-07 Texas Instruments Incorporated Air coil and method of making the same
US5649350A (en) * 1995-10-18 1997-07-22 Ericsson Inc. Method of mass producing printed circuit antennas
US6052889A (en) * 1996-11-21 2000-04-25 Raytheon Company Radio frequency antenna and its fabrication
DE19837689A1 (en) 1998-08-19 2000-02-24 Baumer Ident Gmbh Device for marking cylindrical object such as paper roll in printing works

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023901A1 (en) * 2001-09-07 2003-03-20 Andrew Corporation Wide bandwidth base station antenna and antenna array
US20040201541A1 (en) * 2001-09-07 2004-10-14 Izzat Narian K. Wide bandwidth base station antenna and antenna array
US6917346B2 (en) 2001-09-07 2005-07-12 Andrew Corporation Wide bandwidth base station antenna and antenna array
EP1517403A2 (en) * 2003-08-29 2005-03-23 Fujitsu Ten Limited Circular polarization antenna and composite antenna including this antenna
EP1517403A3 (en) * 2003-08-29 2006-04-12 Fujitsu Ten Limited Circular polarization antenna and composite antenna including this antenna
US7286098B2 (en) 2003-08-29 2007-10-23 Fujitsu Ten Limited Circular polarization antenna and composite antenna including this antenna
JP2005236656A (en) * 2004-02-19 2005-09-02 Fujitsu Ten Ltd Circular polarization antenna
US20090051606A1 (en) * 2006-04-28 2009-02-26 Shozo Ochi Electronic circuit module with built-in antenna and method for manufacturing the same
US20090315798A1 (en) * 2008-06-24 2009-12-24 Samsung Electro-Machanics Co., Ltd. Antenna for radio frequency reception
WO2018103897A1 (en) * 2016-12-09 2018-06-14 Telefonaktiebolaget L M Ericsson (Publ) Improved antenna arrangement for distributed massive mimo
EP3780408A1 (en) * 2016-12-09 2021-02-17 Telefonaktiebolaget LM Ericsson (publ) Improved antenna arrangement for distributed massive mimo
US11349530B2 (en) 2016-12-09 2022-05-31 Telefonaktiebolaget Lm Ericsson (Publ) Antenna arrangement for distributed massive MIMO
US11916625B2 (en) 2016-12-09 2024-02-27 Telefonaktiebolaget Lm Ericsson (Publ) Antenna arrangement for distributed massive MIMO
US11564188B2 (en) 2017-10-17 2023-01-24 Telefonaktiebolaget Lm Ericsson (Publ) Distributed MIMO synchronization
US11616540B2 (en) 2017-11-21 2023-03-28 Telefonaktiebolaget Lm Ericsson (Publ) Antenna arrangement for distributed massive MIMO
US11799524B2 (en) 2017-11-21 2023-10-24 Telefonaktiebolaget Lm Ericsson (Publ) Antenna arrangement for distributed massive MIMO
US11329699B2 (en) 2018-10-16 2022-05-10 Telefonaktiebolaget Lm Ericsson (Publ) Disturbance mitigation
US11777619B2 (en) 2020-02-10 2023-10-03 Telefonaktiebolaget Lm Ericsson (Publ) Dielectric waveguide signal transfer function compensation

Also Published As

Publication number Publication date
US6281842B1 (en) 2001-08-28
BR0008119A (en) 2001-11-13
AU2954900A (en) 2000-08-29
EP1028483A1 (en) 2000-08-16
WO2000048267A1 (en) 2000-08-17
EP1028483B1 (en) 2006-09-27

Similar Documents

Publication Publication Date Title
US6281842B1 (en) Conductive circuit device and method
US7884726B2 (en) Transfer tape strap process
JP4173904B2 (en) SECURITY TAG HAVING 3D ANTENNA AREA COMPOSED OF FLAT Pedestal, AND MANUFACTURING METHOD
JP6512385B2 (en) RFID tag
KR20020071021A (en) Rfid foil or film antennas
US20020018880A1 (en) Stamping foils for use in making printed circuits and radio frequency antennas
TWI395141B (en) A method of manufacturing a contactless ticket and a ticket produced from this method
PL181697B1 (en) Method of effecting series production of printed antennas
CN103181024B (en) The method of auto-compensation antenna structure is manufactured by etching
EP1233370A1 (en) Method of manufacturing resonant circuits
US11695195B2 (en) Self-supporting antenna
CN102265293B (en) Method for making assembly of chips by means of radiofrequency transmission-reception means mechanically connected by band
EP1742294A2 (en) A method and a device for manufacturing a roll of items
DE212021000249U1 (en) RFID tag manufacturing system
EP2001078A1 (en) An antenna device and a portable radio communication device comprising such an antenna device
KR100698365B1 (en) Sticker including a pattern of a electric conductor and method of manufacturing the sticker
CN115298666A (en) RFID tag
US20070012773A1 (en) Method of making an electronic device using an electrically conductive polymer, and associated products
JP2020042605A (en) RF tag label
WO2023178678A1 (en) Foldable foil antenna component
JP2003157420A (en) Ic tag
JP2011061567A (en) Thin antenna and method of manufacturing the same
KR20040029581A (en) A method for making loop antenna and a punching tools

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION