US20010025650A1 - Photo-electronic device and method of producing the same - Google Patents
Photo-electronic device and method of producing the same Download PDFInfo
- Publication number
- US20010025650A1 US20010025650A1 US09/810,398 US81039801A US2001025650A1 US 20010025650 A1 US20010025650 A1 US 20010025650A1 US 81039801 A US81039801 A US 81039801A US 2001025650 A1 US2001025650 A1 US 2001025650A1
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- optical fiber
- photo
- photoelectric conversion
- conversion element
- electronic device
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Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
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- G—PHYSICS
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
- G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
- G02B6/3855—Details of mounting fibres in ferrules; Assembly methods; Manufacture characterised by the method of anchoring or fixing the fibre within the ferrule
- G02B6/3861—Adhesive bonding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
- G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Definitions
- the present invention relates to a photo-electronic device (semiconductor optical module) and a method of producing thereof, particularly to a technology effectively applied to a technology of producing a photo-electronic device capable of preventing breakage of an optical fiber core line comprising a core and a clad and extended in a package and capable of preventing a deterioration in transmission efficiency of light.
- a photo-electronic device integrated with a semiconductor laser semiconductor laser element: semiconductor laser chip
- a semiconductor laser semiconductor laser element: semiconductor laser chip
- an optical communication apparatus semiconductor laser module
- a semiconductor laser laser diode
- a photo detector photo diode
- portions of a pad (pad portion) and a lead frame for fixing a silicon substrate are embedded in the case simultaneously with the transfer mold operation.
- the silicon substrate is fixed with the semiconductor laser.
- the optical fiber extended to inside and outside of the package is constructed by a structure in which the optical fiber core line is covered with a cover member up to a middle of the package and a front end thereof is a bare optical fiber at which the optical fiber core line is exposed by removing the cover member.
- the optical fiber core line is constituted by the core and the clad covering the core and both of them comprise, for example, quartz and are brittle and easy to break by external force.
- the semiconductor laser is covered with transparent gel-like resin comprising silicone resin.
- a case is formed to embed a portion of a lead frame by transfer mold.
- a semiconductor laser element, a light receiving element, an optical fiber and the like are fixed onto the silicon substrate.
- a front end portion of an optical fiber is positioned to face an emitting face of the semiconductor laser element and a front end portion thereof is adhered to the silicon substrate by an adhering agent. Further, a portion at a middle of the optical fiber is fixed to the case by an adhering agent.
- the optical fiber indicates also an optical fiber core line formed by a core and quartz covering the core and the optical fiber cable covering the optical fiber core line by a cover member of a jacket.
- optical fiber core line or the optical fiber cable may not be specified particularly or may not preferably be specified, these are referred to simply as optical fiber in the following.
- optical fiber core line When a constitution of supporting an optical fiber (optical fiber core line) is constructed by two points support constitution of fixing a front end portion of the optical fiber and a middle portion thereof, tensile force is operated to the optical fiber core line by thermal deformation of the base plate caused by heat in the solder mount test and the tensile force exceeds force of adhering the silicon substrate and the optical fiber core line and the optical fiber core line is exfoliated. Exfoliation of the optical fiber at the front end portion of the optical fiber causes a phenomenon in which a deterioration is caused in transmission and reception efficiency of light to and from the semiconductor laser element or light is not inputted at all from the front end.
- the applicants have investigated to form the lead frame by a material the thermal expansion coefficient of which is proximate to that of silicon.
- a material the thermal expansion coefficient is proximate to that of silicon, there are kovar, 42 alloy and the like.
- the thermal conductivity of 42 alloy is as small as 13.4 W/m ⁇ k in comparison with 146 W/m ⁇ k of Cu and achieves an effect of capable of restraining temperature rise of the base plate per se and restraining deformation of the base plate. Thereby, there is provided a structure in which the optical fiber is difficult to exfoliate.
- thermoplastic resin is used since thermosetting resin is provided with a drawback in which the time period of molding thereof is long and the resin is not reproducible.
- Thermoplastic resin is widely used as engineering plastic.
- resin having the heat resistant temperature equal to or higher than 200° C. there are polyphenylene sulphide (PPS), polyether sulfone (PES), polyetherketone (PEEK) and liquid crystal polymer (LCP).
- PPS polyphenylene sulphide
- PES polyether sulfone
- PEEK polyetherketone
- LCP liquid crystal polymer
- PES, PEEK and LCP are expensive and PPS is balanced in view of heat resistance and price.
- the liquid crystal polymer (LP) is featured in high heat resistance (thermal deformation temperature equal to or higher than 260° C.) and high bending strength (bending strength: 21.2 kg/mm 2 at 25° C.). Further, the liquid crystal polymer is particularly featured in small linear expansion coefficient in a direction of flow of resin in molding thereof.
- the linear expansion coefficient of the resin in the flow direction is 2.0 ⁇ 10 ⁇ 6 /° C. and the linear expansion coefficient in a direction orthogonal to the flow is 66 ⁇ 10 ⁇ 6 /° C.
- the applicants have conceived to prevent breakage caused by the thermal stress of the optical fiber core line by molding the case by making the resin flow in the direction of extending the optical fiber core line and approximating the thermal expansion coefficient of the case in the direction of extending the optical fiber core lane to the thermal expansion coefficient of the optical fiber core line.
- the thermal conductivity is as small as 0.4 W/m ⁇ k and the tensile strength of weld after molding is smaller than 25 MPa in comparison with 55 MPa or more of various engineering plastics.
- the thinner the resin thickness below the base plate fixed with the semiconductor laser element that is, the thickness of the bottom of the case, the more preferable.
- the liquid crystal polymer is provided with the low tensile strength of weld and the bottom of the case becomes brittle.
- the inventors have conceived to increase the strength by partially thickening the bottom of the case.
- FIG. 21 is an enlarged sectional view showing a portion of a package 5 of a photo-electronic device according to an investigation by the applicants.
- the package 5 comprises a case 10 and a cap 11 adhered and fixed to overlap the case 10 .
- the case 10 comprises a case main body portion 10 a and a slender case guide portion 10 b continuous to the case main body portion 10 a .
- the cap 11 comprises a cap main body portion 11 a overlapping the case main body portion 10 a and a cap guide portion lib overlapping the case guide portion 10 b.
- the case main body 10 a is constituted by a box type structure the upper portion of which is opened and is constituted by a structure in which a plurality of leads, not illustrated, constituting external electrode terminals are projected respectively from both sides thereof.
- a base plate 15 comprising a metal plate is provided at an inner bottom of the case main body portion 10 a and a support substrate (silicon platform, not illustrated) is fixed onto the base plate 15 .
- the support substrate is fixed respectively with a semiconductor laser element, a light receiving element and a front end portion of an optical fiber core line 3 a . Further, a gel-like resin 36 is filled in the case main body portion 10 a for covering the semiconductor laser element, the light receiving element and the optical fiber core line.
- the case guide portion 10 b and the cap guide portion 11 b are constructed by a structure of guiding an optical fiber cable and an optical fiber core line which becomes bare by removing a jacket (cover member) of the optical fiber cable. That is, match faces of the case guide portion 10 b and the cap guide portion 11 b are respectively provided with grooves.
- the grooves comprise cable guide grooves for guiding the optical fiber cable and core line guide grooves 10 d and 11 d continuous to the cable guide grooves.
- the cable guide grooves are extended from ends of the case guide portion 10 b and the cap guide portion 11 b to middle portions thereof and remaining portions constitute the core line guide grooves 10 d and 11 d .
- the optical fiber cable is constructed by a structure of covering the optical fiber core line 3 a comprising the core and the clad by a cover member (jacket). Therefore, the optical fiber cable integrated to the photo-electronic device is brought into a state of the optical fiber core line 3 a by removing the jacket over a predetermined length at the front end side.
- the case guide portion 10 b and the cap guide portion 11 b are inserted with the portion of the optical fiber core line 3 a and the portion of the optical fiber cable and the portions are fixed to the case guide portion Lob and the cap guide portion 10 b via an adhering agent 38 . Further, the front end portion of the optical fiber core line 3 a is fixed to the silicon platform via an adhering agent.
- the gel-like resin 36 uses the silicone resin and the adhering agent 38 uses epoxy resin of amine species. Further, an adhering agent for fixing the case 10 and the cap 11 also uses the epoxy resin of amine species.
- the epoxy resin of amine species is used since force thereof of adhering to the plastic case is excellent. However, adhering performance between the gel-like silicone resin and the epoxy resin of amine species or the plastic case is not excellent.
- a photo-electronic device including a package having a main body portion containing parts including a photoelectric conversion element at inside thereof and a guide portion a front end of which faces the photoelectric conversion element for guiding, in a penetrated state, an optical fiber for transmitting and receiving light to and from the photoelectric conversion element, in which the optical fiber is fixed to the guide portion by an adhering agent at the guide portion and portions of the main body portion including the photoelectric conversion element and a front end portion of the optical fiber are covered by a protective film formed by a resin transparent to the light and a dam is provided between the protective film and the adhering agent such that the protective film and the adhering agent are not brought into contact with each other.
- the photo-electronic device wherein the package is formed by a case and a cap adhered to overlap the case, the case is formed by a case main body portion and a case guide portion continuous to the case main body portion, the cap is formed by a cap main body portion and a cap guide portion continuous to the cap main body portion, the case main body portion is embedded with a predetermined shape of a metal plate a portion of which forms a base plate exposed to an inner bottom of the main body portion, remaining portions of which form a plurality of leads extended to inside and outside of the main body portion, a support substrate (silicon substrate: silicon platform) is fixed onto the base plate and the photoelectric conversion element and the optical fiber for transmitting and receiving light to and from the photoelectric conversion element are fixed onto the support base plate.
- a support substrate silicon substrate: silicon platform
- the support substrate is fixed with a semiconductor laser element, a light receiving element and the front end portion of the optical fiber, the optical fiber is positioned and fixed to input laser beam on one side emitted from the semiconductor laser element from a front end to an inner portion thereof and the light receiving element is positioned and fixed to receive laser beam on other side emitted from the semiconductor laser element. Further, the front end portion of the optical fiber is fixed to the support substrate by an ultraviolet ray cured adhering agent and is fixed to the support substrate by a thermosetting adhering agent.
- the protective film is formed by a gel-like resin
- the adhering agent is formed by epoxy resin of amine species
- the dam is formed by an ultraviolet ray cured adhering agent of epoxy resin species. Further, there is present an air gap at a portion of the main body portion above the protective film.
- the metal plate forming the base plate or the leads is formed by 42 alloy or kovar the thermal expansion coefficient of which is proximate to the thermal expansion coefficient of the support substrate or the optical fiber and the case and the cap constituting the package are formed by a resin (liquid crystal polymer) in which the thermal expansion coefficient in the direction along the flow of resin in molding becomes smaller than the thermal expansion coefficient in a direction orthogonal to the flow direction and the case and the cap are molded such that the thermal expansion coefficients in the direction of extending the optical fiber are reduced.
- a resin liquid crystal polymer
- a peripheral edge portion of a bottom of the case main body portion of the case formed by the resin is projected to thicken more than an inner side portion thereof and at the center of the base plate, the resin is not provided over a predetermined length along the direction of extending the optical fiber and the rear face of the base plate is exposed.
- the peripheral edge portion of the bottom of the main body portion of the package is projected to thicken more than the inner side portion.
- Such a photo-electronic device is produced by the following method.
- a method of producing a photo-electronic device in which a package is formed by a case and a cap adhered to overlap the case, the case is formed by a case main body portion and a case guide portion continuous to the case main body portion, rye cap is formed by a cap main body portion and a cap guide portion continuous to the cap main body portion, the case main body portion is embedded with a predetermined shape of a metal plate a portion of which forms a base plate exposed to an inner bottom of the case main body portion and remaining portions or which form a plurality of leads extended to inside and outside of the case main body portion, a support substrate (silicon substrate: silicon platform) is fixed onto the base plate, a photoelectric conversion element an electrode of which is connected electrically to the lead is fixed onto the support substrate, an optical fiber is supported by the guide portion in a penetrated state and fixed thereto by an adhering agent, a front end of the optical fiber is fixed to the support substrate to transmit and receive light to
- forming the protective film by filling a resin in the main body portion, and fixing the optical fiber to the guide portion by an adhering agent, wherein a dam is formed at a boundary portion of the main body portion and the guide portion such that the protective film does not invade the guide portion prior to forming the protective film.
- the method of producing a photo-electronic device wherein a semiconductor laser element is fixed to the support substrate, the front end portion of the optical fiber is positioned and fixed such that laser beam on one side emitted from the semiconductor laser element is inputted from a front end thereof to an inner portion thereof and a light receiving element is positioned and fixed to receive the laser beam on other side emitted from the semiconductor laser element.
- the front end portion of the optical fiber is coupled by the ultraviolet ray cured adhering agent and is fixed thereto by the thermosetting adhering agent.
- the case is formed by fastening a lead Frame to mold dies of transfer mold and thereafter molding liquid crystal polymer resin to flow from ore end portion to other end portion of the case and cutting and removing an unnecessary portion of the lead frame.
- the molding operation is carried out by pressing a portion of the lead frame constituting the base plate to a mold upper die by a pressure pin, the pressure pin is extended over a predetermined length along the direction of extending the optical fiber at the center of the base plate, the flowing resin is divided at one end side of the pressure pin and flows along both sides of the pressure pin and thereafter merges again on other end side of the pressure pin to flow.
- the case main body portion of the case is molded such that the resin thickness at the peripheral edge of the bottom thereof is thickened.
- the lead frame is formed by 42 alloy or kovar.
- the protective film is formed by a gel-like resin which is transparent to the light, the adhering agent for fixing the optical fiber to the case guide portion is formed by epoxy resin of amine species and the dam is formed by an ultraviolet ray cured adhering agent of epoxy resin species.
- the front end portion of the optical fiber is fixed to the support substrate respectively by the ultraviolet ray cured adhering agent and the thermosetting adhering agent and accordingly, the adhering strength is high and exfoliation of the optical fiber is difficult to cause.
- the optical fiber optical fiber core line
- Liquid crystal polymer is featured in high thermal resistance (thermal deformation temperature equal to or higher than 260° C.) and high bending strength (bending strength: 21.1 kg/mm 2 at 25° C.), however, the tensile strength of weld after molding is small. Therefore, when the resin thickness (liquid crystal polymer thickness) below the base plate is thinned in order to improve heat radiating performance, the resin becomes brittle and easy to break, however, increase in the strength is achieved by thickening the peripheral edge of the bottom of the case and accordingly, there is constituted the package having high reliability of mechanical strength.
- FIG. 1 is a schematic plane view showing a structure of preventing contact between gel-like resin and amine species epoxy resin by a dam in a photo-electronic device according to an embodiment (Embodiment 1) of the invention
- FIG. 2 is a front view of the photo-electronic device according to Embodiment 1;
- FIG. 3 is a plane view of the photo-electronic device according to Embodiment 1;
- FIG. 4 is a side view of the photo-electronic device according to Embodiment 1;
- FIG. 5 is a schematic view showing pin layout of the photo-electronic device according to Embodiment 1;
- FIG. 7 is an enlarged plane view in a state of removing a cap of the photo-electronic device according to Embodiment 1;
- FIG. 8 is an enlarged bottom view showing a portion of the photo-electronic device according to Embodiment 1;
- FIG. 9 is an enlarged sectional view showing a portion of the photo-electronic device according to Embodiment 1;
- FIG. 10 is an enlarged plane view of a silicon substrate portion in the photo-electronic device according to Embodiment 1;
- FIG. 11 is a plane view showing a case formed at a lead frame in producing the photo-electronic device according to Embodiment 1;
- FIG. 12 is a bottom view showing the case formed at the lead frame
- FIG. 13 is a sectional view enlarging a portion of the case formed at the lead frame
- FIG. 14 is a sectional view showing a state of forming the case by a transfer mold process
- FIG. 15 is a perspective view enlarging a portion of the case
- FIG. 16 is a perspective view of a portion showing a state of attaching an optical fiber to the case in producing the photo-electronic device according to Embodiment 1;
- FIG. 17 is a schematic view showing a state of positioning an optical fiber core line to the silicon substrate in producing the photo-electronic device according to Embodiment 1;
- FIGS. 18A through 18C are schematic views showing a method of fixing the optical fiber core line to the silicon substrate
- FIG. 19 is a schematic perspective view showing a state of tacking the optical fiber to a groove
- FIG. 20 is an enlarged sectional view showing a state of putting silicone gel into the case in producing the photo-electronic device according to Embodiment 1;
- FIG. 21 is a sectional view enlarging a portion of a photo-electronic device by investigation by the applicant.
- FIG. 1 through FIG. 20 are views related to a photo-electronic device and a method of producing thereof according to an embodiment (Embodiment 1) of the invention.
- a photo-electronic device (semiconductor optical module) 1 according to Embodiment 1, comprises a module main body 2 and an optical connector 4 attached to a front end of an optical fiber cable 3 constituting the module main body 2 in its outlook.
- the module main body 2 comprises the package 5 having a flat parellelepiped structure, the optical fiber cable 3 projected from one end of the package 5 and leads 6 constituting a plurality of external electrode terminals projected to align from both sides of the package 5 .
- the leads 6 are formed in dual in line type. According to Embodiment 1, there is constructed a structure in which four pieces of the leads 6 are respectively projected from the both sides of the package 5 .
- FIG. 5 is a schematic view showing layout of the leads 6 .
- a semiconductor laser element laser diode: LD
- a light receiving element photodiode: PD
- numerals 1 through 8 are attached to the leads 6 .
- the leads of 1 , 3 , 8 are NC pins not connected
- the lead of 2 is a package ground pin
- the lead of 4 is a cathode pin of a photodiode
- the lead of 5 is an anode pin of the photodiode
- the lead of 6 is a cathode pin of the laser diode
- the lead of 7 is an anode pin of the laser diode.
- the laser diode when predetermined voltage is applied across the leads of 6 and 7 , the laser diode emits laser beam.
- the laser beam is transmitted to outside of the package 5 by the optical fiber cable 3 and is transmitted to an optical fiber cable, not illustrated, connected by the optical connector 4 .
- the package 5 is formed by a case 10 made of plastic (resin) and a cap 11 made of plastics Fixed onto the case 10 .
- the case 10 is constituted by a case main body portion 10 a in a rectangular shape and a case guide portion 10 b projected from center of one end of the case main body portion 10 a in a slender shape and the cap 11 is constituted by a cap main body portion 11 a in a rectangular shape and a cap guide portion 11 b projected from center of one end of the cap main body portion 11 a in a slender shape.
- a main body portion thereof is formed by the case main body portion 10 a and the cap main body portion 11 a and a guide portion thereof is formed by the case guide portion 10 b and the cap guide portion 11 b .
- the case 10 and the cap 11 are formed by liquid crystal polymer comprising insulating resin.
- the semiconductor laser element and the light receiving element are arranged in the case main body portion 10 a .
- the guide portion that is, the case guide portion 10 b and the cap guide portion 11 b , in the adhered state, are constructed by a structure for guiding, in a penetrated state, an optical fiber cable and an optical fiber core line (comprising a is clad and a core penetrating center of the clad) which becomes bare by removing a jacket (cover member) of the optical fiber cable.
- a portion of the optical fiber cable 3 projected from the case guide portion 10 b and the cap guide portion 11 b is fixed by an adhering agent 12 .
- the adhering agent 12 is for tacking the optical fiber cable 3 to the case guide portion 10 b.
- FIG. 6 is an enlarged sectional view of the module main body 2 along a direction of extending the optical fiber
- FIG. 7 is an enlarged plane view of the module main body 2 in a state of removing the cap 11
- FIG. 8 is a bottom view thereof.
- FIG. 9 is an enlarged sectional view showing a structure of supporting the optical fiber core line at a boundary portion of the case main body portion 10 a and the case guide portion 10 b
- FIG. 10 is an enlarged plane view showing a support substrate and optical parts fixed to the support substrate.
- a base plate 15 comprising a metal plate is provided at an inner bottom of the case main body portion 10 a . Further, inner ends of the leads 6 are respectively disposed at a surrounding of the base plate 15 . The base plate 15 and the leads 6 are integrated to the case 10 in molding the case 10 .
- the optical fiber cable 3 is guided to the case guide portion 10 b and a support substrate 16 comprising a silicon substrate generally referred to as silicon platform, is fixed over the base plate 15 on an extension line of the optical fiber axis of the optical fiber cable 3 by a bonding member 17 , for example, silver paste.
- a bonding member 17 for example, silver paste.
- the optical fiber cable 3 is covered wish a cover member (jacket) made of nylon. Although the cover member is present up to a middle of the case guide portion 10 b of the case 10 , at a front end side thereof, the cover member is stripped and an optical fiber core line 3 a comprising the core and the clad is exposed. As shown by FIG. 10, the portion of the optical fiber core line 3 a is fitted to creep in a groove 20 provided at the support substrate (silicon platform) 16 . Further, there is constructed a structure in which a semiconductor laser element (semiconductor laser chip) 21 as a photoelectric conversion element and a light receiving element (photodiode) 22 are fixed to align in series onto the silicon platform 16 on an extension thereof.
- a semiconductor laser element semiconductor laser chip
- Laser beam (one laser beam) emitted from one emitting face of the semiconductor laser element 21 is inputted into the optical fiber from a front end of the optical fiber core line 3 a and laser beam (other laser beam) emitted from other emitting face thereof is received by the light receiving element 22 to monitor an optical output intensity.
- one face of the silicon platform 16 is provided with patterned conductive metallized layers 25 .
- the metallized layers 25 constitute bonding pads for connecting mounting portions for mounting the semiconductor laser element 21 and the light receiving element 22 or conductive wires. Further, the semiconductor laser element 21 and the light receiving element 22 are fixed onto the mounting portions via conductive adhering layers. Both of the semiconductor laser element 21 and the light receiving element 22 are provided with electrodes at upper faces and lower faces thereof and accordingly, the lower electrodes are respectively connected electrically to the predetermined metallized layers 25 .
- portions of the metallized layers continuous to the mounting portions and inner end portions of the predetermined leads 6 are connected by conductive wires 26 . Further, the A upper face electrodes of the semiconductor laser element 21 and the light receiving element 22 are fixed to the metallized layers independent from each other respectively via the conductive wires 26 and portions of the metallized layers are electrically connected to the inner end portions of the predetermined leads 6 via the wires 26 .
- a discharge groove 27 to intersect the groove 20 provided at the one race of the silicon platform 16 (refer to FIG. 10).
- the optical fiber core line 3 a optical fiber
- a length of the optical fiber core line 3 a which passes over the discharge groove 27 and projected is extremely short.
- the projected length is about 100 ⁇ m.
- the diameter of the optical fiber core line 3 a that is, the diameter of the clad is, for example, about 125 ⁇ m.
- the optical fiber core line 3 a is fixed to the silicon platform 16 by fixing by two kinds of adhering agents of a primary fixing portion 30 and a secondary fixing portion 31 .
- the primary fixing portion 30 is constituted by an ultraviolet ray cured adhering agent and the secondary fixing portion 31 is constituted by a thermosetting resin.
- the primary fixing portion 30 is formed in a slender shape along the optical axis of the optical fiber core line 3 a .
- the optical fiber core line 3 a is inserted and positioned to creep in the groove 20 , thereafter, the ultraviolet ray cured adhering agent is coated and thereafter, ultraviolet ray is irradiated to cure the ultraviolet ray cured adhering agent and carry out primary fixing (tacking).
- the optical fiber core line 3 a is firmly fixed to the silicon platform 16 by the primary fixing. Therefore, thereafter, there is carried out secondary fixing constituting full fixing.
- the secondary fixing is carried out by coating the thermosetting resin at a portion of the optical fiber fixed by the primary fixing portion 30 remote from the semiconductor laser element 21 and curing the resin thereafter.
- the secondary fixing processing can be carried out in batch and the productivity can be promoted.
- adhering agents of the ultraviolet ray cured adhering agent and the thermosetting resin are coated not to ride over the discharge groove 27 .
- the adhering agent which enters the discharge groove 27 is guided to side portions of the silicon platform 16 via the discharge groove 27 and accordingly, the adhering agent does not enter between the front end face of the optical fiber core line 3 a and the emitting face of the semiconductor laser element 21 and transmission and reception of light is not hampered.
- a gel-like resin snowing a rubber characteristic is filled in the case main body portion 10 a to thereby form a protective film 36 .
- the protective film 36 is a protective member which is not only transparent to the laser beam to prevent transmission loss of the laser beam which is emitted from the semiconductor laser element 21 and reaches the front end of the optical fiber core line 3 a but also excellent in humidity resistance.
- the protective film 36 covers the base plate 15 , the silicon platform 16 , the optical fiber core line 3 a , the semiconductor laser element 21 and the light receiving element 22 to thereby achieve promotion of humidity resistance of the semiconductor laser element 21 and the light receiving element 22 .
- FIG. 1, FIG. 6 and FIG. 7 there are respectively provided grooves at match faces of the case guide portion 10 b and the cap guide portion 11 b .
- the grooves comprise cable guide grooves 10 c and 11 c for guiding the optical fiber cable 3 and core line guide grooves 10 d and 11 d continuous to the cable guide grooves 10 c and 11 c .
- the cable guide grooves 10 c and 11 c are extended from ends to middles of the case guide portion 10 b and the cap guide portion 11 b and remaining portions thereof constitute the core line guide portions 10 d and lid.
- the cable guide grooves 10 c and 11 c are provided with grooves 10 e and 11 e in the peripheral direction in order to increase strength of fixing the optical fiber cable 3 by filling the resin by a larger amount.
- a dam 35 by resin at front end portions (inner end portions) of the core line guide grooves 10 d and lid on the side of the semiconductor laser element 21 .
- the dam, 35 is formed by dripping of resin and processing to cure thereof to fill up an outer peripheral clearance of the optical fiber core lines 3 a inserted into the cores line guide grooves 10 d and lid and serves as a dam for preventing silicone resin filled in the case main body portion 10 a from invading the case guide portion 10 b and the cap guide portion 11 b via the outer peripheral clearance of the optical fiber core line 3 a in filling thereof.
- Adhering agents 38 and 42 are filled in the core line guide grooves 10 d and lid and the cable guide grooves 10 c and 11 c outward from the protective film 36 to thereby fix the optical fiber core line 3 a and the optical fiber cable 3 .
- the adhering agents 38 and 42 are formed by amine species epoxy resin.
- the dam 35 is used for separating the protective film 36 and the adhering agents 38 and 42 comprising the amine species epoxy resin.
- the protective film 36 is not limited to silicone gel but may be formed by silicone rubber, low stress epoxy resin, acrylic resin or urethane resin any of which is transparent.
- the dam 35 Since the dam 35 is present in this way, the protective film 36 comprising the gel-like resin provided at the main body portion, is not brought into contact with the adhering agent 38 for fixing the optical fiber to he guide portion and accordingly, thermal stress caused by thermal variation becomes difficult to apply to the optical fiber core line, breakage of the optical fiber core line is difficult to cause and failure in optical transmission is difficult to cause.
- the resin for forming the dam 35 comprises epoxy resin of an ultraviolet ray cured type and therefore, the resin can be cured by steps the same as the steps of irradiating ultraviolet ray in fixing the optical fiber to the silicon substrate.
- the amine species epoxy resin is used for the adhering agents 38 and 42 by the following reason. That is, the adhering force for adhering to a plastic case is excellent.
- the kind of the adhering agent is not limited so far as the force of adhering to the plastic case can be maintained.
- FIG. 1 is a plane view of the photo-electronic device 1 in a state before attaching the cap 11 to the case 10 . According to the drawing, a state in which the protective film 36 and the adhering agent 38 are not brought into direct contact with each other by the presence of the dam 35 , is apparent. Further, FIG. 7 is illustrated by removing a portion of the protective film 36 .
- the case 10 is fixed with the cap 11 by the adhering agent 42 .
- Epoxy resin of amine species having a material the same as that of the adhering agent 38 is used for the adhering agent.
- the adhering agent 42 overlaps the adhering agent 38 .
- FIG. 8 shows a gate mark 40 in transfer mold and flow of resin in transfer mold (indicated by arrow marks).
- transfer mold a pressure pin is brought into contact with a rear face side of the base plate 15 and therefore, after transfer mold, the base plate 15 is exposed as shown by FIG. 8, the exposed portion becomes a slender region and is provided with a wide area and accordingly, heat radiating performance is further improved.
- the case 10 and the cap 11 are formed by the liquid crystal polymer, the base plate 15 is formed by 42 alloy, the thermal expansion coefficients of the package 5 and the base plate 15 in the direction of extending optical fiber, are proximate to the thermal expansion coefficient of the optical fiber core line and accordingly, the optical fiber core line portion fixed to the silicon platform 16 fixed to the base plate 15 and the optical fiber core line portion fixed to the case guide portion 10 b and the cap guide portion lib are difficult to exfoliate by heat in mounting the photo-electronic device 1 and a deterioration in an efficiency of optically coupling the semiconductor laser element 21 and the optical fiber core line 3 a , is difficult to cause. Further, it is difficult to cause disconnection failure of the optical fiber core line 3 a which is caused since the optical fiber core line 3 a is not fixed.
- ribs 41 are formed by thickening peripheral edge portions.
- reinforcement there may be constructed not only the structure of only thickening the peripheral edge in this way but also a structure of partially thickening hereof or a structure of providing a plurality of thick portions.
- the silicon platform 16 is fixed with the semiconductor laser element 21 and the light receiving element 22 as shown by FIG. 10, at this stage, the silicon platform 16 is not fixed with the optical fiber core line 3 a and connection by the wires 26 is not carried out.
- FIG. 11 is a plane view of forming the case 10 at a lead frame 50 by the transfer mold process
- FIG. 12 a bottom view thereof
- FIG. 13 is a sectional view thereof.
- FIG. 14 is a sectional view showing a state of carrying out transfer mold by fastening the lead frame by a lower mold die and an upper mold die.
- the lead frame 50 is formed by 42 alloy in place of copper to approximate the thermal expansion coefficient to that of silicon. Kovar may be use in place of 42 alloy. Although not particularly restricted, there is used the lead frame 50 having the thickness of 0.25 mm. As shown by FIG. 11, the lead frame 50 is provided with a frame 53 of the lead frame having a frame structure comprising a pair of outer frames 51 extended in parallel with each other and a pair of inner frames 52 extended in parallel with each other orthogonally to the outer frames 51 .
- [0113] Four pieces of the leads 6 are extended in parallel with the outer frames 51 at predetermined intervals from an inner side of a left half of each of the pair of inner frames 52 . There is constructed a pattern in which at least one piece of the leads 6 extended from the inner frame 52 is connected to the base plate 15 at the center. The lead 6 connected to the base plate 15 constitutes package ground. There is constructed a pattern in which front ends of the remaining leads 6 face vicinities of the base plate 15 . In FIG. 11, four pieces of the leads 6 are respectively projected from the inner frame 52 .
- the four pieces of leads 6 aligned in parallel are connected by a dam piece 54 .
- the dam piece 54 constitutes a pattern along the outer periphery of the case 10 , is made slender at a portion of the four pieces of leads 6 on the left side and expanded to the center side on the left side to thereby constitute a wide width.
- the case main body portion 10 a is formed at the left side portion and the case guide portion 10 b is formed on the right side.
- the case main body portion 10 a is constructed by a box shape structure the upper portion of which is opened and the case guide portion 10 b is provided with the slender core line guide groove 10 d for guiding the optical fiber core line and the cable guide groove 10 c linearly continuous to the core line guide groove 10 d .
- the cable guide groove 10 c is provided with the grooves 10 e.
- the projected portion 37 is provided on an inner end side of the core line guide groove 10 d and the portion constitutes a portion of forming the dam 35 . Therefore, when the dam 35 is formed by potting and curing the resin over the projected portion 37 (refer to FIG. 1 and FIG. 6), an opening portion 55 for filling the protective film 36 of the case main body portion 10 a and the core line guide groove 10 d of the case guide portion 10 b are separated by the dam 35 .
- a width at a portion of the lead 6 projected from the case main body portion 10 a is wide and becomes slender at a middle thereof.
- the dam piece 54 is provided at a bold portion of the lead.
- the frame 53 for the lead frame is provided with guide holes 57 and 58 used for transferring or positioning the lead frame 50 .
- the lead frame 50 is fastened by a mold lower die 61 and a mold upper die 62 , liquid crystal polymer 64 in a liquid state is injected from a gate 63 provided at the left end portion into the cavity formed by the mold lower die 61 and the mold upper die 62 to thereby form the case 10 .
- the base plate 15 of the lead frame 50 is elastically pressed to the mold upper die 62 by a pressure pin 65 integrated to the mold lower die 61 .
- the liquid crystal polymer 64 i 5 in the liquid state is prevented from moving around to a side of a mounting face of the support plate 15 for fixing the semiconductor laser element and the like.
- FIG. 12 is the bottom view of forming the case 10 to the lead frame 50 by the transfer mold process and a round portion remaining at the bottom face of the case main body portion 10 a is the gate mark 40 . Further, an exposed region of the base plate 15 is a region with which the pressure pin 65 has been brought into contact.
- the arrow marks shown in the drawing indicate a state of flow of the liquid crystal polymer 64 in the liquid state n the cavity. As is apparent from the drawing, the direction of flow of the liquid crystal polymer 64 in the liquid state is directed along the direction of extending the optical fiber and therefore, thermal expansion coefficient of the produced case 10 in the direction of extending the optical fiber becomes as small as 2.0 ⁇ 10 ⁇ 6 /° C.
- the cap 11 is produced also by the liquid crystal polymer and is formed such that the thermal expansion coefficient in a direction along the direction of extending the optical fiber becomes as small as 2.0 ⁇ 10 ⁇ 6 /° C.
- the slender pressure pin 65 is disposed along the center of the rear face of the base plate 15 and accordingly, there is not produced so-to-speak weld line formed by bringing portions of the resin in contact with each other at the region in contact with the pressure pin 65 . As a result, there is no occurrence of crack caused by the weld line and production yield of the case with the leads is promoted.
- the thickness of the case 10 below the base plate 15 is thinned (for example, 0.25 mm) to thereby increase the effect of irradiating heat to the atmosphere, however, as described above, the liquid crystal polymer is provided with low tensile strength of weld and therefore, as shown by FIG. 13, the mechanical strength is increased by thickly forming the ribs 41 at the bottom peripheral edge of the case 10 . Thereby, the mechanical strength of the package 5 can be increased, reliability of the package can be increased and long service life of the photo-electronic device 1 can be achieved.
- the silicon platform 16 fixed with the semiconductor laser element 21 and the light receiving element 22 is positioned and fixed onto the base plate 15 disposed at the inner bottom of the case 10 via the bonding member 17 . Further, although not illustrated, the upper electrodes of the semiconductor laser element 21 and the light receiving element 22 and predetermined portions are connected by the wires 26 .
- the optical fiber cable 3 is inserted into the cable guide groove 10 c of the case guide portion 10 b and the optical fiber core line 3 a on the front end side is inserted into the core line guide groove 10 d .
- the front end of the optical fiber core line 3 a is made to face the emitting face of the semiconductor laser element 21 and is positioned and fixed to the silicon platform 16 highly accurately by a passive alignment method by using a mark, not illustrated, provided at the silicon platform 16 .
- the positioning and fixing operation may be carried out by a method in which predetermined potential is applied between predetermined ones of the leads 6 to thereby operate the semiconductor laser element 21 to emit laser beam, the emitted beam is inputted from the front end of the optical fiber core line 3 a into the optical fiber and optical couple adjustment is carried out while detecting optical output to thereby fix the front end of the optical fiber core line 3 a.
- the fixing operation is carried out by a method shown by, for example, FIGS. 18A through 18C. That is, as shown by FIG. 18A, after coating an ultraviolet ray cured adhering agent 30 a in the groove 20 of the silicon platform 16 , the optical fiber core line 3 a is pressed to the bottom of the groove 20 by pressing thereof to the ultraviolet ray cured adhering agent 30 a . As shown by FIG. 18B, the pressing operation is carried out by applying predetermined load to a press piece 66 . For example, a load of 100 g is applied.
- the ultraviolet ray cured adhering agent 30 a on both sides of the optical fiber core line 3 a is irradiated with ultraviolet ray by using ultraviolet ray irradiating fibers 67 and 68 to thereby cure the ultraviolet ray cured adhering agent 30 a .
- the primary fixing portion 30 is formed by the ultraviolet ray cured adhering agent 30 a cured thereby and the optical fiber core line 3 a is fixed to the silicon platform 16 without moving.
- thermosetting resin 31 a is coated from above the optical fiber core line 3 a to extend to the one face of the silicon platform 16 and subjected to a thermal curing processing to thereby form the secondary fixing portion 31 by the thermosetting resin 31 a .
- the optical fiber core line 3 a is highly accurately fixed to the silicon platform 16 .
- the dam 35 is for preventing silicone resin from flowing toward the center side of the case guide portion 10 b via a clearance between the core line guide groove 10 d and the optical fiber core line 3 a when the silicone resin is injected into the case main body portion 10 a and preventing the silicone resin from being brought into contact with an adhering agent (epoxy resin of amine species) for fixing the optical fiber cable 3 and the optical fiber core line 3 a at later steps.
- an adhering agent epoxy resin of amine species
- the silicone resin is filled in the case main body portion 10 a .
- ultraviolet ray is irradiated, successively, heating and ageing (30 minutes at 120° C.) and heating and curing (1 hour at 120° C.) are carried out and the protective film 36 is formed by the gel-like resin.
- the core line guide groove 10 d and the cable guide 10 c reaching the adhering agent 12 from the dam 35 are coated and filled with epoxy resin of amine species and the resin is baked to thereby fix the optical fiber cable 3 and the optical fiber core line 3 a to the case guide portion 10 b by the adhering agent 38 as shown by FIG. 1.
- the cap 11 is made to overlap the case 10 , the both members are adhered to each other by the adhering agent 42 (epoxy resin of amine species) to thereby produce the photo-electronic device (semiconductor optical module) 1 as shown by FIG. 6 and FIG. 2 through FIG. 4.
- the adhering agent 42 epoxy resin of amine species
- the protective film 36 comprising the gel-like resin provided at the main body portion and the adhering agent 38 for fixing the optical fiber (optical fiber core line 3 a and optical fiber cable 3 ) to the guide portion are not brought into contact with each other.
- the resin forming the dam 35 comprises epoxy resin of ultraviolet ray cured type.
- the thermal expansion coefficient of the case 10 and the cap 11 in the direction of extending the optical fiber is 4.0 ⁇ 10 ⁇ 4 /° C. (liquid crystal polymer)
- the thermal coefficient of the base plate 15 made of 42 alloy is 5 ⁇ 10 ⁇ 6 /° C.
- the thermal expansion coefficient of the silicon platform 16 is 3.0 ⁇ 10 ⁇ 6 /° C.
- the thermal expansion coefficient of the optical fiber core line 3 a is 0.5 ⁇ 10 ⁇ 6 /° C.
- liquid crystal polymer (LCP) is featured in providing high heat resistance (thermal deformation temperature equal to or higher than 260° C.) and high bending strength (bending strength: 21.1 kg/mm 2 at 25° C.), the tensile strength of weld after molding is small. Therefore, when the resin thickness (liquid crystal polymer thickness) below the base plate is thinned to improve heat radiating performance, the resin become brittle and is easy to break, however, increase in the strength is achieved by thickening the peripheral edge o the bottom of the case and accordingly, there is constituted the package having high reliability of mechanical strength.
- the invention is not limited to the above-described embodiment and can naturally be modified variously within a range not deviated from gist thereof. That is, even in the case of a structure of connecting a light receiving element as a photoelectric conversion element and an optical fiber, the invention is similarly applicable and can achieve a similar effect.
- the adhering agent comprising epoxy resin or amine species for fixing the optical fiber core line and the protective film comprising the gel-like resin are not brought into direct contact with each other, the dam comprising ultraviolet ray cured adhering agent is provided therebetween and accordingly, a case guide portion is filled with epoxy resin of amine species and accordingly, breakage of the optical fiber core line by thermal stress can be prevented.
- optical fiber optical fiber core line
- the case is formed by liquid crystal polymer
- the thermal expansion coefficient in the direction of extending the optical fiber is reduced to be proximate to the thermal expansion coefficient of the optical fiber core line
- the base plate made of metal for fixing the silicon platform is formed by 42 alloy and therefore, the optical fiber core line is difficult to exfoliate at the support portions, the optical fiber is difficult to disconnect, the transmission and reception efficiency between the optical fiber and the semiconductor laser element is difficult to vary and the highly reliable photo-electronic device can be provided.
- the case is formed by liquid crystal polymer, the base plate is exposed at the bottom of the case, the thickness of resin below the base elate is thinned and accordingly, heat radiating Performance of the photo-electronic device can be improved and the stably operated photo-electronic device can be provided.
- the case is formed by liquid crystal polymer having low tensile strength of weld
- the thickness of the liquid crystal polymer at the peripheral edge of the bottom of the case 10 is formed to be thick as the ribs and accordingly, the mechanical strength of the case is increased and high reliability of the package is promoted.
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Abstract
Description
- The present invention relates to a photo-electronic device (semiconductor optical module) and a method of producing thereof, particularly to a technology effectively applied to a technology of producing a photo-electronic device capable of preventing breakage of an optical fiber core line comprising a core and a clad and extended in a package and capable of preventing a deterioration in transmission efficiency of light.
- There is used a photo-electronic device integrated with a semiconductor laser (semiconductor laser element: semiconductor laser chip) as a light source for an information processing apparatus or a light source for optical communication. As an example of a photo-electronic device, there is disclosed, in Japanese Patent Laid-Open No. 282369/1998 or Japanese Patent Laid-Open No. 307235/1998, an optical communication apparatus (semiconductor laser module) forming a package by a case and a lid (cap) comprising plastics (resin) formed by a transfer mold process, containing a semiconductor laser (laser diode) or a photo detector (photo diode) and extending an optical fiber to inside and outside of the package.
- Further, portions of a pad (pad portion) and a lead frame for fixing a silicon substrate, are embedded in the case simultaneously with the transfer mold operation. The silicon substrate is fixed with the semiconductor laser. The optical fiber extended to inside and outside of the package is constructed by a structure in which the optical fiber core line is covered with a cover member up to a middle of the package and a front end thereof is a bare optical fiber at which the optical fiber core line is exposed by removing the cover member. The optical fiber core line is constituted by the core and the clad covering the core and both of them comprise, for example, quartz and are brittle and easy to break by external force.
- Further, in the package, the semiconductor laser is covered with transparent gel-like resin comprising silicone resin.
- The applicants have investigated to use a copper frame having excellent thermal conductivity (thermal expansion coefficient α=17×10−6/° C.) as a lead frame for radiating heat generated at a semiconductor laser element to outside of the package in developing a photo-electronic device integrated with the semiconductor laser.
- However, according to the structure, it has been found that exfoliation of an optical fiber is caused by a mounting test by solder reflow (10 seconds at 260° C.)
- In producing a photo-electronic device, a case is formed to embed a portion of a lead frame by transfer mold. A base plate (pad) comprising a copper plate is formed at an inner bottom face of a case and a silicon substrate (thermal expansion α=3.0×10−6/° C.) is fixed onto the base plate. A semiconductor laser element, a light receiving element, an optical fiber and the like are fixed onto the silicon substrate. A front end portion of an optical fiber is positioned to face an emitting face of the semiconductor laser element and a front end portion thereof is adhered to the silicon substrate by an adhering agent. Further, a portion at a middle of the optical fiber is fixed to the case by an adhering agent.
- Here, the optical fiber indicates also an optical fiber core line formed by a core and quartz covering the core and the optical fiber cable covering the optical fiber core line by a cover member of a jacket. When the optical fiber core line or the optical fiber cable may not be specified particularly or may not preferably be specified, these are referred to simply as optical fiber in the following.
- When a constitution of supporting an optical fiber (optical fiber core line) is constructed by two points support constitution of fixing a front end portion of the optical fiber and a middle portion thereof, tensile force is operated to the optical fiber core line by thermal deformation of the base plate caused by heat in the solder mount test and the tensile force exceeds force of adhering the silicon substrate and the optical fiber core line and the optical fiber core line is exfoliated. Exfoliation of the optical fiber at the front end portion of the optical fiber causes a phenomenon in which a deterioration is caused in transmission and reception efficiency of light to and from the semiconductor laser element or light is not inputted at all from the front end.
- In order to resolve such a problem, the applicants have investigated to form the lead frame by a material the thermal expansion coefficient of which is proximate to that of silicon. As a material the thermal expansion coefficient is proximate to that of silicon, there are kovar, 42 alloy and the like. Hence, the applicants have formed the lead frame by 42 alloy (α=5×10−6/° C.). Therefore, the base plate and the lead integrated to the case are made of 42 alloy. The thermal conductivity of 42 alloy is as small as 13.4 W/m·k in comparison with 146 W/m·k of Cu and achieves an effect of capable of restraining temperature rise of the base plate per se and restraining deformation of the base plate. Thereby, there is provided a structure in which the optical fiber is difficult to exfoliate.
- Meanwhile, the applicants have investigated also on adaptability of resin constituting the case. Since the case is exposed to high temperature even in a short period of time, as a resin constituting the case, the resin having heat resistant temperature of 200° C. or higher has been investigated. Although as resins, there are thermoplastic resin and thermosetting resin, thermoplastic resin is used since thermosetting resin is provided with a drawback in which the time period of molding thereof is long and the resin is not reproducible. Thermoplastic resin is widely used as engineering plastic.
- As resin having the heat resistant temperature equal to or higher than 200° C., there are polyphenylene sulphide (PPS), polyether sulfone (PES), polyetherketone (PEEK) and liquid crystal polymer (LCP).
- PES, PEEK and LCP are expensive and PPS is balanced in view of heat resistance and price.
- Although the price is high, the liquid crystal polymer (LP) is featured in high heat resistance (thermal deformation temperature equal to or higher than 260° C.) and high bending strength (bending strength: 21.2 kg/mm2 at 25° C.). Further, the liquid crystal polymer is particularly featured in small linear expansion coefficient in a direction of flow of resin in molding thereof. The linear expansion coefficient of the resin in the flow direction is 2.0×10−6/° C. and the linear expansion coefficient in a direction orthogonal to the flow is 66×10−6/° C.
- Hence, the applicants have conceived to prevent breakage caused by the thermal stress of the optical fiber core line by molding the case by making the resin flow in the direction of extending the optical fiber core line and approximating the thermal expansion coefficient of the case in the direction of extending the optical fiber core lane to the thermal expansion coefficient of the optical fiber core line.
- However, in the case of the liquid crystal polymer, the thermal conductivity is as small as 0.4 W/m·k and the tensile strength of weld after molding is smaller than 25 MPa in comparison with 55 MPa or more of various engineering plastics. In order to improve the heat radiating performance, the thinner the resin thickness below the base plate fixed with the semiconductor laser element, that is, the thickness of the bottom of the case, the more preferable. However, as mentioned above, the liquid crystal polymer is provided with the low tensile strength of weld and the bottom of the case becomes brittle. Hence, the inventors have conceived to increase the strength by partially thickening the bottom of the case.
- Meanwhile, it has been found that there is a case of breaking the optical fiber core line from the following reason by analysis and investigation by the inventors.
- FIG. 21 is an enlarged sectional view showing a portion of a
package 5 of a photo-electronic device according to an investigation by the applicants. Thepackage 5 comprises acase 10 and acap 11 adhered and fixed to overlap thecase 10. - The
case 10 comprises a casemain body portion 10 a and a slendercase guide portion 10 b continuous to the casemain body portion 10 a. Thecap 11 comprises a capmain body portion 11 a overlapping the casemain body portion 10 a and a cap guide portion lib overlapping thecase guide portion 10 b. - The case
main body 10 a is constituted by a box type structure the upper portion of which is opened and is constituted by a structure in which a plurality of leads, not illustrated, constituting external electrode terminals are projected respectively from both sides thereof. Abase plate 15 comprising a metal plate is provided at an inner bottom of the casemain body portion 10 a and a support substrate (silicon platform, not illustrated) is fixed onto thebase plate 15. - The support substrate is fixed respectively with a semiconductor laser element, a light receiving element and a front end portion of an optical
fiber core line 3 a. Further, a gel-like resin 36 is filled in the casemain body portion 10 a for covering the semiconductor laser element, the light receiving element and the optical fiber core line. - The
case guide portion 10 b and thecap guide portion 11 b are constructed by a structure of guiding an optical fiber cable and an optical fiber core line which becomes bare by removing a jacket (cover member) of the optical fiber cable. That is, match faces of thecase guide portion 10 b and thecap guide portion 11 b are respectively provided with grooves. The grooves comprise cable guide grooves for guiding the optical fiber cable and coreline guide grooves case guide portion 10 b and thecap guide portion 11 b to middle portions thereof and remaining portions constitute the coreline guide grooves fiber core line 3 a comprising the core and the clad by a cover member (jacket). Therefore, the optical fiber cable integrated to the photo-electronic device is brought into a state of the opticalfiber core line 3 a by removing the jacket over a predetermined length at the front end side. - The
case guide portion 10 b and thecap guide portion 11 b are inserted with the portion of the opticalfiber core line 3 a and the portion of the optical fiber cable and the portions are fixed to the case guide portion Lob and thecap guide portion 10 b via anadhering agent 38. Further, the front end portion of the opticalfiber core line 3 a is fixed to the silicon platform via an adhering agent. - It has been found that according to such a structure, there is a case in which optical transmission cannot be carried out by causing a disconnection failure of the optical
fiber core line 3 a inserted into thecase guide portion 10 b and thecap guide portion 11 b. - The following has been found as a result of analyzing and investigating the point. That is, in forming the gel-
like resin 36, silicone resin having fluidity is supplied to the casemain body portion 10 a and the silicone resin flows into a clearance between the outer peripheral portion of the opticalfiber core line 3 a and the core line guide groove 10 d. As a result, the gel-like resin 36 and theadhering agent 38 are brought into contact with each other over a long distance in the coreline guide groove - The gel-
like resin 36 uses the silicone resin and the adheringagent 38 uses epoxy resin of amine species. Further, an adhering agent for fixing thecase 10 and thecap 11 also uses the epoxy resin of amine species. The epoxy resin of amine species is used since force thereof of adhering to the plastic case is excellent. However, adhering performance between the gel-like silicone resin and the epoxy resin of amine species or the plastic case is not excellent. - As a result, it has been found that since the optical fiber is not fixed to the case guide portion, there causes a phenomenon in which tensile stress is operated to the optical
fiber core line 3 a owing to temperature change and the opticalfiber core line 3 a is broken. - Further, it has been also found that in the case in which moisture is stored at the
interface 7, when the photo-electronic device is used in a cold district, there causes a phenomenon in which the moisture stored at the interface constitutes ice and the optical fiber core line is broken by an increase in the volume. The breakage is particularly easy to occur when the interface is disposed at an area of thecase guide portion 10 b and thecap guide portion 11 b. - It is an object of the invention to provide a photo-electronic device capable of preventing an optical fiber from being broken and a method of producing thereof.
- It is other object of the invention to provide a photo-electronic device having high efficiency of optically coupling a photoelectric conversion element and an optical fiber and a method of producing thereof.
- It is other object of the invention to provide a photo-electronic device having high heat radiating performance and a method of producing thereof.
- The above-described and other objects and novel features of the invention will become apparent from description of the specification and attached drawings.
- A simple explanation will be given of an outline of representative aspect of the invention disclosed in the application as follows.
- (1) According to an aspect of the invention, there is provided a photo-electronic device including a package having a main body portion containing parts including a photoelectric conversion element at inside thereof and a guide portion a front end of which faces the photoelectric conversion element for guiding, in a penetrated state, an optical fiber for transmitting and receiving light to and from the photoelectric conversion element, in which the optical fiber is fixed to the guide portion by an adhering agent at the guide portion and portions of the main body portion including the photoelectric conversion element and a front end portion of the optical fiber are covered by a protective film formed by a resin transparent to the light and a dam is provided between the protective film and the adhering agent such that the protective film and the adhering agent are not brought into contact with each other.
- According to another aspect of the invention, there is provided the photo-electronic device, wherein the package is formed by a case and a cap adhered to overlap the case, the case is formed by a case main body portion and a case guide portion continuous to the case main body portion, the cap is formed by a cap main body portion and a cap guide portion continuous to the cap main body portion, the case main body portion is embedded with a predetermined shape of a metal plate a portion of which forms a base plate exposed to an inner bottom of the main body portion, remaining portions of which form a plurality of leads extended to inside and outside of the main body portion, a support substrate (silicon substrate: silicon platform) is fixed onto the base plate and the photoelectric conversion element and the optical fiber for transmitting and receiving light to and from the photoelectric conversion element are fixed onto the support base plate.
- The support substrate is fixed with a semiconductor laser element, a light receiving element and the front end portion of the optical fiber, the optical fiber is positioned and fixed to input laser beam on one side emitted from the semiconductor laser element from a front end to an inner portion thereof and the light receiving element is positioned and fixed to receive laser beam on other side emitted from the semiconductor laser element. Further, the front end portion of the optical fiber is fixed to the support substrate by an ultraviolet ray cured adhering agent and is fixed to the support substrate by a thermosetting adhering agent.
- The protective film is formed by a gel-like resin, the adhering agent is formed by epoxy resin of amine species and the dam is formed by an ultraviolet ray cured adhering agent of epoxy resin species. Further, there is present an air gap at a portion of the main body portion above the protective film.
- The metal plate forming the base plate or the leads is formed by 42 alloy or kovar the thermal expansion coefficient of which is proximate to the thermal expansion coefficient of the support substrate or the optical fiber and the case and the cap constituting the package are formed by a resin (liquid crystal polymer) in which the thermal expansion coefficient in the direction along the flow of resin in molding becomes smaller than the thermal expansion coefficient in a direction orthogonal to the flow direction and the case and the cap are molded such that the thermal expansion coefficients in the direction of extending the optical fiber are reduced.
- A peripheral edge portion of a bottom of the case main body portion of the case formed by the resin, is projected to thicken more than an inner side portion thereof and at the center of the base plate, the resin is not provided over a predetermined length along the direction of extending the optical fiber and the rear face of the base plate is exposed. The peripheral edge portion of the bottom of the main body portion of the package is projected to thicken more than the inner side portion.
- Such a photo-electronic device is produced by the following method.
- According to another aspect of the invention, there is provided a method of producing a photo-electronic device in which a package is formed by a case and a cap adhered to overlap the case, the case is formed by a case main body portion and a case guide portion continuous to the case main body portion, rye cap is formed by a cap main body portion and a cap guide portion continuous to the cap main body portion, the case main body portion is embedded with a predetermined shape of a metal plate a portion of which forms a base plate exposed to an inner bottom of the case main body portion and remaining portions or which form a plurality of leads extended to inside and outside of the case main body portion, a support substrate (silicon substrate: silicon platform) is fixed onto the base plate, a photoelectric conversion element an electrode of which is connected electrically to the lead is fixed onto the support substrate, an optical fiber is supported by the guide portion in a penetrated state and fixed thereto by an adhering agent, a front end of the optical fiber is fixed to the support substrate to transmit and receive light to and from the photoelectric conversion element and a protective film which is transparent to the light covers the photoelectric conversion element and the optical fiber in the main body portion, the method comprising the steps of fixing the support substrate fixed with the photoelectric conversion element to inside of the main body portion, fixing a front end portion of the optical fiber by an adhering agent,
- forming the protective film by filling a resin in the main body portion, and fixing the optical fiber to the guide portion by an adhering agent, wherein a dam is formed at a boundary portion of the main body portion and the guide portion such that the protective film does not invade the guide portion prior to forming the protective film.
- According to another aspect of the invention, there is provided the method of producing a photo-electronic device wherein a semiconductor laser element is fixed to the support substrate, the front end portion of the optical fiber is positioned and fixed such that laser beam on one side emitted from the semiconductor laser element is inputted from a front end thereof to an inner portion thereof and a light receiving element is positioned and fixed to receive the laser beam on other side emitted from the semiconductor laser element. After optical couple adjustment of the optical fiber, the front end portion of the optical fiber is coupled by the ultraviolet ray cured adhering agent and is fixed thereto by the thermosetting adhering agent.
- The case is formed by fastening a lead Frame to mold dies of transfer mold and thereafter molding liquid crystal polymer resin to flow from ore end portion to other end portion of the case and cutting and removing an unnecessary portion of the lead frame. In the transfer mold, the molding operation is carried out by pressing a portion of the lead frame constituting the base plate to a mold upper die by a pressure pin, the pressure pin is extended over a predetermined length along the direction of extending the optical fiber at the center of the base plate, the flowing resin is divided at one end side of the pressure pin and flows along both sides of the pressure pin and thereafter merges again on other end side of the pressure pin to flow. The case main body portion of the case is molded such that the resin thickness at the peripheral edge of the bottom thereof is thickened. The lead frame is formed by 42 alloy or kovar.
- The protective film is formed by a gel-like resin which is transparent to the light, the adhering agent for fixing the optical fiber to the case guide portion is formed by epoxy resin of amine species and the dam is formed by an ultraviolet ray cured adhering agent of epoxy resin species.
- According to the means of (1):
- (a) Since the dam is present, the silicone resin does not flow out to the case guide portion by riding over the dam. Therefore, the epoxy resin of amine species having poor adhering performance with the silicone resin, is not brought into contact with the silicone resin, the case guide portion is filled with the epoxy resin of amine species, the force of adhering the case and the cap is also maintained and accordingly, the fiber can firmly be fixed, thermal stress caused by thermal variation is difficult to apply to the optical fiber (optical fiber core line), the optical fiber core line is difficult to break and optical transmission failure is difficult to cause.
- (b) The thermal expansion coefficient of the case and the cap in the direction of extending the optical fiber is 4.0×10−4/° C. (liquid crystal polymer), the thermal expansion coefficient of the base plate comprising 42 alloy is 5×10−6/° C., the thermal expansion coefficient of the silicon platform is 3.0×10−6/° C., the thermal expansion coefficient of the optical fiber core line is 0.5×10−6/° C., all of the coefficients are smaller than that of copper (a=17×106/° C.) and are provided with numerical values proximate to each other and therefore, it is difficult to cause exfoliation of the optical fiber fixed by the silicon platform and the case guide portion owing to deformation of the base plate. Further, the front end portion of the optical fiber is fixed to the support substrate respectively by the ultraviolet ray cured adhering agent and the thermosetting adhering agent and accordingly, the adhering strength is high and exfoliation of the optical fiber is difficult to cause. As a result, at the front end of the optical fiber, a deterioration in the transmission and reception efficiency of light between the front end and the semiconductor laser element, is not caused and the optical fiber (optical fiber core line) is difficult to break at the case guide portion.
- (c) Liquid crystal polymer (LCP) is featured in high thermal resistance (thermal deformation temperature equal to or higher than 260° C.) and high bending strength (bending strength: 21.1 kg/mm2 at 25° C.), however, the tensile strength of weld after molding is small. Therefore, when the resin thickness (liquid crystal polymer thickness) below the base plate is thinned in order to improve heat radiating performance, the resin becomes brittle and easy to break, however, increase in the strength is achieved by thickening the peripheral edge of the bottom of the case and accordingly, there is constituted the package having high reliability of mechanical strength.
- (d) Since the air gap is present at an upper portion of the protective film, even when the protective film is expanded by heat, the expanded portion elongates only to the air gap portion and is not brought into contact with the cap on the upper side and accordingly, stress is not applied to the optical fiber by deforming the package and the optical fiber is difficult to break.
- FIG. 1 is a schematic plane view showing a structure of preventing contact between gel-like resin and amine species epoxy resin by a dam in a photo-electronic device according to an embodiment (Embodiment 1) of the invention;
- FIG. 2 is a front view of the photo-electronic device according to
Embodiment 1; - FIG. 3 is a plane view of the photo-electronic device according to
Embodiment 1; - FIG. 4 is a side view of the photo-electronic device according to
Embodiment 1; - FIG. 5 is a schematic view showing pin layout of the photo-electronic device according to
Embodiment 1; - FIG. 6 is an enlarged sectional view of the photo-electronic device according to
Embodiment 1 along a direction of extending an optical fiber; - FIG. 7 is an enlarged plane view in a state of removing a cap of the photo-electronic device according to
Embodiment 1; - FIG. 8 is an enlarged bottom view showing a portion of the photo-electronic device according to
Embodiment 1; - FIG. 9 is an enlarged sectional view showing a portion of the photo-electronic device according to
Embodiment 1; - FIG. 10 is an enlarged plane view of a silicon substrate portion in the photo-electronic device according to
Embodiment 1; - FIG. 11 is a plane view showing a case formed at a lead frame in producing the photo-electronic device according to
Embodiment 1; - FIG. 12 is a bottom view showing the case formed at the lead frame;
- FIG. 13 is a sectional view enlarging a portion of the case formed at the lead frame;
- FIG. 14 is a sectional view showing a state of forming the case by a transfer mold process;
- FIG. 15 is a perspective view enlarging a portion of the case;
- FIG. 16 is a perspective view of a portion showing a state of attaching an optical fiber to the case in producing the photo-electronic device according to
Embodiment 1; - FIG. 17 is a schematic view showing a state of positioning an optical fiber core line to the silicon substrate in producing the photo-electronic device according to
Embodiment 1; - FIGS. 18A through 18C are schematic views showing a method of fixing the optical fiber core line to the silicon substrate;
- FIG. 19 is a schematic perspective view showing a state of tacking the optical fiber to a groove;
- FIG. 20 is an enlarged sectional view showing a state of putting silicone gel into the case in producing the photo-electronic device according to
Embodiment 1; and - FIG. 21 is a sectional view enlarging a portion of a photo-electronic device by investigation by the applicant.
- A detailed explanation will be given of embodiments of the invention in reference to the drawings as follows. Further, in all the drawings or explaining embodiments of the invention, portions having the same functions are attached with the same notations and a repetitive explanation thereof will be omitted.
- (Embodiment 1)
- FIG. 1 through FIG. 20 are views related to a photo-electronic device and a method of producing thereof according to an embodiment (Embodiment 1) of the invention.
- As shown by FIG. 2 and FIG. 3, a photo-electronic device (semiconductor optical module)1 according to
Embodiment 1, comprises a modulemain body 2 and an optical connector 4 attached to a front end of anoptical fiber cable 3 constituting the modulemain body 2 in its outlook. - The module
main body 2 comprises thepackage 5 having a flat parellelepiped structure, theoptical fiber cable 3 projected from one end of thepackage 5 and leads 6 constituting a plurality of external electrode terminals projected to align from both sides of thepackage 5. As shown by FIG. 4, according toEmbodiment 1, theleads 6 are formed in dual in line type. According toEmbodiment 1, there is constructed a structure in which four pieces of theleads 6 are respectively projected from the both sides of thepackage 5. - FIG. 5 is a schematic view showing layout of the
leads 6. A semiconductor laser element (laser diode: LD) and a light receiving element (photodiode: PD) are integrated In thepackage 2. In FIG. 5,numerals 1 through 8 are attached to theleads 6. The leads of 1, 3, 8 are NC pins not connected, the lead of 2 is a package ground pin, the lead of 4 is a cathode pin of a photodiode, the lead of 5 is an anode pin of the photodiode, the lead of 6 is a cathode pin of the laser diode and the lead of 7 is an anode pin of the laser diode. - Therefore, when predetermined voltage is applied across the leads of6 and 7, the laser diode emits laser beam. The laser beam is transmitted to outside of the
package 5 by theoptical fiber cable 3 and is transmitted to an optical fiber cable, not illustrated, connected by the optical connector 4. - The
package 5 is formed by acase 10 made of plastic (resin) and acap 11 made of plastics Fixed onto thecase 10. Thecase 10 is constituted by a casemain body portion 10 a in a rectangular shape and acase guide portion 10 b projected from center of one end of the casemain body portion 10 a in a slender shape and thecap 11 is constituted by a capmain body portion 11 a in a rectangular shape and acap guide portion 11 b projected from center of one end of the capmain body portion 11 a in a slender shape. Therefore, when thecap 11 is adhered to fix to thecase 10, a main body portion thereof is formed by the casemain body portion 10 a and the capmain body portion 11 a and a guide portion thereof is formed by thecase guide portion 10 b and thecap guide portion 11 b. Thecase 10 and thecap 11 are formed by liquid crystal polymer comprising insulating resin. - The semiconductor laser element and the light receiving element are arranged in the case
main body portion 10 a. Further, the guide portion, that is, thecase guide portion 10 b and thecap guide portion 11 b, in the adhered state, are constructed by a structure for guiding, in a penetrated state, an optical fiber cable and an optical fiber core line (comprising a is clad and a core penetrating center of the clad) which becomes bare by removing a jacket (cover member) of the optical fiber cable. A portion of theoptical fiber cable 3 projected from thecase guide portion 10 b and thecap guide portion 11 b, is fixed by an adheringagent 12. The adheringagent 12 is for tacking theoptical fiber cable 3 to thecase guide portion 10 b. - Next, an explanation will be given of the module
main body 2 in reference to FIG. 1 and FIG. 6 through FIG. 10. FIG. 6 is an enlarged sectional view of the modulemain body 2 along a direction of extending the optical fiber, FIG. 7 is an enlarged plane view of the modulemain body 2 in a state of removing thecap 11 and FIG. 8 is a bottom view thereof. Further, FIG. 9 is an enlarged sectional view showing a structure of supporting the optical fiber core line at a boundary portion of the casemain body portion 10 a and thecase guide portion 10 b and FIG. 10 is an enlarged plane view showing a support substrate and optical parts fixed to the support substrate. - As shown by FIG. 6 and FIG. 7, a
base plate 15 comprising a metal plate is provided at an inner bottom of the casemain body portion 10 a. Further, inner ends of theleads 6 are respectively disposed at a surrounding of thebase plate 15. Thebase plate 15 and theleads 6 are integrated to thecase 10 in molding thecase 10. - The
optical fiber cable 3 is guided to thecase guide portion 10 b and asupport substrate 16 comprising a silicon substrate generally referred to as silicon platform, is fixed over thebase plate 15 on an extension line of the optical fiber axis of theoptical fiber cable 3 by abonding member 17, for example, silver paste. - The
optical fiber cable 3 is covered wish a cover member (jacket) made of nylon. Although the cover member is present up to a middle of thecase guide portion 10 b of thecase 10, at a front end side thereof, the cover member is stripped and an opticalfiber core line 3 a comprising the core and the clad is exposed. As shown by FIG. 10, the portion of the opticalfiber core line 3 a is fitted to creep in agroove 20 provided at the support substrate (silicon platform) 16. Further, there is constructed a structure in which a semiconductor laser element (semiconductor laser chip) 21 as a photoelectric conversion element and a light receiving element (photodiode) 22 are fixed to align in series onto thesilicon platform 16 on an extension thereof. - Laser beam (one laser beam) emitted from one emitting face of the
semiconductor laser element 21 is inputted into the optical fiber from a front end of the opticalfiber core line 3 a and laser beam (other laser beam) emitted from other emitting face thereof is received by thelight receiving element 22 to monitor an optical output intensity. - As shown by FIG. 10, one face of the
silicon platform 16 is provided with patterned conductive metallized layers 25. The metallized layers 25 constitute bonding pads for connecting mounting portions for mounting thesemiconductor laser element 21 and thelight receiving element 22 or conductive wires. Further, thesemiconductor laser element 21 and thelight receiving element 22 are fixed onto the mounting portions via conductive adhering layers. Both of thesemiconductor laser element 21 and thelight receiving element 22 are provided with electrodes at upper faces and lower faces thereof and accordingly, the lower electrodes are respectively connected electrically to the predetermined metallized layers 25. - As shown by FIG. 6 and FIG. 7, portions of the metallized layers continuous to the mounting portions and inner end portions of the predetermined leads6 are connected by
conductive wires 26. Further, the A upper face electrodes of thesemiconductor laser element 21 and thelight receiving element 22 are fixed to the metallized layers independent from each other respectively via theconductive wires 26 and portions of the metallized layers are electrically connected to the inner end portions of the predetermined leads 6 via thewires 26. - Further, there is provided a
discharge groove 27 to intersect thegroove 20 provided at the one race of the silicon platform 16 (refer to FIG. 10). Although the opticalfiber core line 3 a (optical fiber) is brought into a state of passing over thedischarge groove 27, a length of the opticalfiber core line 3 a which passes over thedischarge groove 27 and projected, is extremely short. For example, the projected length is about 100 μm. Further, the diameter of the opticalfiber core line 3 a, that is, the diameter of the clad is, for example, about 125 μm. - As shown by FIG. 10, at a vicinity of the
discharge groove 27, the opticalfiber core line 3 a is fixed to thesilicon platform 16 by fixing by two kinds of adhering agents of aprimary fixing portion 30 and asecondary fixing portion 31. Theprimary fixing portion 30 is constituted by an ultraviolet ray cured adhering agent and the secondary fixingportion 31 is constituted by a thermosetting resin. - As shown by FIG. 10, the
primary fixing portion 30 is formed in a slender shape along the optical axis of the opticalfiber core line 3 a. The opticalfiber core line 3 a is inserted and positioned to creep in thegroove 20, thereafter, the ultraviolet ray cured adhering agent is coated and thereafter, ultraviolet ray is irradiated to cure the ultraviolet ray cured adhering agent and carry out primary fixing (tacking). The opticalfiber core line 3 a is firmly fixed to thesilicon platform 16 by the primary fixing. Therefore, thereafter, there is carried out secondary fixing constituting full fixing. The secondary fixing is carried out by coating the thermosetting resin at a portion of the optical fiber fixed by theprimary fixing portion 30 remote from thesemiconductor laser element 21 and curing the resin thereafter. The secondary fixing processing can be carried out in batch and the productivity can be promoted. - In the primary fixing processing and the secondary fixing processing, as a standard, adhering agents of the ultraviolet ray cured adhering agent and the thermosetting resin are coated not to ride over the
discharge groove 27. The adhering agent which enters thedischarge groove 27 is guided to side portions of thesilicon platform 16 via thedischarge groove 27 and accordingly, the adhering agent does not enter between the front end face of the opticalfiber core line 3 a and the emitting face of thesemiconductor laser element 21 and transmission and reception of light is not hampered. - Meanwhile, a gel-like resin snowing a rubber characteristic is filled in the case
main body portion 10 a to thereby form aprotective film 36. Theprotective film 36 is a protective member which is not only transparent to the laser beam to prevent transmission loss of the laser beam which is emitted from thesemiconductor laser element 21 and reaches the front end of the opticalfiber core line 3 a but also excellent in humidity resistance. Theprotective film 36 covers thebase plate 15, thesilicon platform 16, the opticalfiber core line 3 a, thesemiconductor laser element 21 and thelight receiving element 22 to thereby achieve promotion of humidity resistance of thesemiconductor laser element 21 and thelight receiving element 22. - On the other hand, as shown by FIG. 1, FIG. 6 and FIG. 7, there are respectively provided grooves at match faces of the
case guide portion 10 b and thecap guide portion 11 b. The grooves comprisecable guide grooves 10 c and 11 c for guiding theoptical fiber cable 3 and coreline guide grooves cable guide grooves 10 c and 11 c. Thecable guide grooves 10 c and 11 c are extended from ends to middles of thecase guide portion 10 b and thecap guide portion 11 b and remaining portions thereof constitute the coreline guide portions 10 d and lid. Thecable guide grooves 10 c and 11 c are provided withgrooves optical fiber cable 3 by filling the resin by a larger amount. - Further, as one of characteristics of the invention, there is formed a
dam 35 by resin at front end portions (inner end portions) of the coreline guide grooves 10 d and lid on the side of thesemiconductor laser element 21. The dam, 35 is formed by dripping of resin and processing to cure thereof to fill up an outer peripheral clearance of the opticalfiber core lines 3 a inserted into the coresline guide grooves 10 d and lid and serves as a dam for preventing silicone resin filled in the casemain body portion 10 a from invading thecase guide portion 10 b and thecap guide portion 11 b via the outer peripheral clearance of the opticalfiber core line 3 a in filling thereof. - In order to promote the dam effect, there is adopted a structure in which an inner end of the core
line guide groove 10 d is projected to the center side of the case main body portion longer than the coreline guide groove 11 d. Therefore, in dripping the resin when thedam 35 is formed, the resin is mounted also on the projectedportion 37 and as shown by FIG. 9, there is formed thedam 35 which is slightly elevated and in filling the resin forming theprotective film 36, the resin can be prevented from invading. - Adhering
agents line guide grooves 10 d and lid and thecable guide grooves 10 c and 11 c outward from theprotective film 36 to thereby fix the opticalfiber core line 3 a and theoptical fiber cable 3. - The
protective film 36 is formed by, for example, transparent silicone resin capable of transmitting laser beam (α=4.0×10−4/° C.). The adheringagents dam 35 is used for separating theprotective film 36 and the adheringagents dam 35 is formed by, for example, an ultraviolet ray cured adhering agent of epoxy resin species (α=6.2×10−5/° C.) - Further, the
protective film 36 is not limited to silicone gel but may be formed by silicone rubber, low stress epoxy resin, acrylic resin or urethane resin any of which is transparent. - Since the
dam 35 is present in this way, theprotective film 36 comprising the gel-like resin provided at the main body portion, is not brought into contact with the adheringagent 38 for fixing the optical fiber to he guide portion and accordingly, thermal stress caused by thermal variation becomes difficult to apply to the optical fiber core line, breakage of the optical fiber core line is difficult to cause and failure in optical transmission is difficult to cause. - The resin for forming the
dam 35 comprises epoxy resin of an ultraviolet ray cured type and therefore, the resin can be cured by steps the same as the steps of irradiating ultraviolet ray in fixing the optical fiber to the silicon substrate. - The amine species epoxy resin is used for the adhering
agents - FIG. 1 is a plane view of the photo-
electronic device 1 in a state before attaching thecap 11 to thecase 10. According to the drawing, a state in which theprotective film 36 and the adheringagent 38 are not brought into direct contact with each other by the presence of thedam 35, is apparent. Further, FIG. 7 is illustrated by removing a portion of theprotective film 36. - Further, the
case 10 is fixed with thecap 11 by the adheringagent 42. Epoxy resin of amine species having a material the same as that of the adheringagent 38 is used for the adhering agent. At thecase guide portion 10 b and thecap guide portion 11 b, the adheringagent 42 overlaps the adheringagent 38. - According to
Embodiment 1, thebase plate 15 and theleads 6 integrated to thecase 10, are formed by 42 alloy having thermal expansion coefficient (α=5×10−6/° C.) proximate to thermal expansion coefficient of silicon (α=3.0×10−6/° C.) or quartz (α=0.5×10−6/° C.) constituting the opticalfiber core line 3 a and thecase 10 and thecap 11 formed by transfer mold, are formed by anisotropic liquid crystal polymer. That is, thermal expansion coefficient of the liquid crystal polymer in a direction of flow of resin in transfer mold, s as small as 2.2×10−6/° C. and is proximate to the thermal expansion coefficient of silicon or quartz. Hence, thecase 10 is formed to make resin flow along the direction of extending the optical fiber. FIG. 8 shows agate mark 40 in transfer mold and flow of resin in transfer mold (indicated by arrow marks). In transfer mold, a pressure pin is brought into contact with a rear face side of thebase plate 15 and therefore, after transfer mold, thebase plate 15 is exposed as shown by FIG. 8, the exposed portion becomes a slender region and is provided with a wide area and accordingly, heat radiating performance is further improved. - The
case 10 and thecap 11 are formed by the liquid crystal polymer, thebase plate 15 is formed by 42 alloy, the thermal expansion coefficients of thepackage 5 and thebase plate 15 in the direction of extending optical fiber, are proximate to the thermal expansion coefficient of the optical fiber core line and accordingly, the optical fiber core line portion fixed to thesilicon platform 16 fixed to thebase plate 15 and the optical fiber core line portion fixed to thecase guide portion 10 b and the cap guide portion lib are difficult to exfoliate by heat in mounting the photo-electronic device 1 and a deterioration in an efficiency of optically coupling thesemiconductor laser element 21 and the opticalfiber core line 3 a, is difficult to cause. Further, it is difficult to cause disconnection failure of the opticalfiber core line 3 a which is caused since the opticalfiber core line 3 a is not fixed. - Although according to
Embodiment 1, by thinning the thickness of thecase 10 below the base plate 15 (for example, 0.25 nm) to thereby increase an effect of irradiating heat to the atmosphere, as mentioned above, tensile strength of weld of liquid crystal polymer is low. Therefore, when the thickness of the liquid crystal polymer at the bottom or thecase 10 is thinned, thecase 10 becomes brittle and the mechanical strength is reduced and therefore, as shown by FIG. 6, FIG. 8 and FIG. 9 (refer to FIG. 13),ribs 41 are formed by thickening peripheral edge portions. For the purpose of reinforcement to promote the strength, there may be constructed not only the structure of only thickening the peripheral edge in this way but also a structure of partially thickening hereof or a structure of providing a plurality of thick portions. - Thereby, the mechanical strength of the
package 5 can be promoted, the reliability of the package can be promoted and long life of the photo-electronic device 1 can be achieved. - Next, an explanation will be given of a method of producing the photo-electronic device (semiconductor optical module)1.
- At first, respective parts or assembled articles are prepared. That is, there are prepared the
case 10 made of plastics with guide for guiding the optical fiber and thecap 11 made of plastics attached to close thecase 10, thesilicon platform 16 mounted with thesemiconductor laser element 21 and thelight receiving element 22 at the one face and having thegroove 20 extended toward thesemiconductor laser element 21 and so on. Thecase 10 and thecap 11 are provided with the above-described structures. - Although as described above, the
silicon platform 16 is fixed with thesemiconductor laser element 21 and thelight receiving element 22 as shown by FIG. 10, at this stage, thesilicon platform 16 is not fixed with the opticalfiber core line 3 a and connection by thewires 26 is not carried out. - Here, an explanation will be given of the method of producing the
resin case 10 having the leads. FIG. 11 is a plane view of forming thecase 10 at alead frame 50 by the transfer mold process, FIG. 12 a bottom view thereof and FIG. 13 is a sectional view thereof. Further, FIG. 14 is a sectional view showing a state of carrying out transfer mold by fastening the lead frame by a lower mold die and an upper mold die. - The
lead frame 50 is formed by 42 alloy in place of copper to approximate the thermal expansion coefficient to that of silicon. Kovar may be use in place of 42 alloy. Although not particularly restricted, there is used thelead frame 50 having the thickness of 0.25 mm. As shown by FIG. 11, thelead frame 50 is provided with aframe 53 of the lead frame having a frame structure comprising a pair ofouter frames 51 extended in parallel with each other and a pair ofinner frames 52 extended in parallel with each other orthogonally to the outer frames 51. - Four pieces of the
leads 6 are extended in parallel with theouter frames 51 at predetermined intervals from an inner side of a left half of each of the pair ofinner frames 52. There is constructed a pattern in which at least one piece of theleads 6 extended from theinner frame 52 is connected to thebase plate 15 at the center. Thelead 6 connected to thebase plate 15 constitutes package ground. There is constructed a pattern in which front ends of the remaining leads 6 face vicinities of thebase plate 15. In FIG. 11, four pieces of theleads 6 are respectively projected from theinner frame 52. - The four pieces of
leads 6 aligned in parallel are connected by adam piece 54. Thedam piece 54 constitutes a pattern along the outer periphery of thecase 10, is made slender at a portion of the four pieces ofleads 6 on the left side and expanded to the center side on the left side to thereby constitute a wide width. The casemain body portion 10 a is formed at the left side portion and thecase guide portion 10 b is formed on the right side. The casemain body portion 10 a is constructed by a box shape structure the upper portion of which is opened and thecase guide portion 10 b is provided with the slender coreline guide groove 10 d for guiding the optical fiber core line and thecable guide groove 10 c linearly continuous to the coreline guide groove 10 d. Thecable guide groove 10 c is provided with thegrooves 10 e. - Further, as shown by FIG. 15, the projected
portion 37 is provided on an inner end side of the coreline guide groove 10 d and the portion constitutes a portion of forming thedam 35. Therefore, when thedam 35 is formed by potting and curing the resin over the projected portion 37 (refer to FIG. 1 and FIG. 6), an openingportion 55 for filling theprotective film 36 of the casemain body portion 10 a and the coreline guide groove 10 d of thecase guide portion 10 b are separated by thedam 35. - A width at a portion of the
lead 6 projected from the casemain body portion 10 a is wide and becomes slender at a middle thereof. Thedam piece 54 is provided at a bold portion of the lead. Further, theframe 53 for the lead frame is provided with guide holes 57 and 58 used for transferring or positioning thelead frame 50. - In transfer mold, as shown by FIG. 14, the
lead frame 50 is fastened by a mold lower die 61 and a moldupper die 62,liquid crystal polymer 64 in a liquid state is injected from agate 63 provided at the left end portion into the cavity formed by the mold lower die 61 and the mold upper die 62 to thereby form thecase 10. - In the transfer mold, the
base plate 15 of thelead frame 50 is elastically pressed to the mold upper die 62 by apressure pin 65 integrated to the mold lower die 61. Thereby, theliquid crystal polymer 64 i5 in the liquid state is prevented from moving around to a side of a mounting face of thesupport plate 15 for fixing the semiconductor laser element and the like. - FIG. 12 is the bottom view of forming the
case 10 to thelead frame 50 by the transfer mold process and a round portion remaining at the bottom face of the casemain body portion 10 a is thegate mark 40. Further, an exposed region of thebase plate 15 is a region with which thepressure pin 65 has been brought into contact. The arrow marks shown in the drawing indicate a state of flow of theliquid crystal polymer 64 in the liquid state n the cavity. As is apparent from the drawing, the direction of flow of theliquid crystal polymer 64 in the liquid state is directed along the direction of extending the optical fiber and therefore, thermal expansion coefficient of the producedcase 10 in the direction of extending the optical fiber becomes as small as 2.0×10−6/° C. or a numerical value proximate to that of the silicon substrate. Although an explanation will be omitted here, thecap 11 is produced also by the liquid crystal polymer and is formed such that the thermal expansion coefficient in a direction along the direction of extending the optical fiber becomes as small as 2.0×10−6/° C. - According to
Embodiment 1, theslender pressure pin 65 is disposed along the center of the rear face of thebase plate 15 and accordingly, there is not produced so-to-speak weld line formed by bringing portions of the resin in contact with each other at the region in contact with thepressure pin 65. As a result, there is no occurrence of crack caused by the weld line and production yield of the case with the leads is promoted. - Further, in molding the
case 10 by the transfer mold, the thickness of thecase 10 below thebase plate 15 is thinned (for example, 0.25 mm) to thereby increase the effect of irradiating heat to the atmosphere, however, as described above, the liquid crystal polymer is provided with low tensile strength of weld and therefore, as shown by FIG. 13, the mechanical strength is increased by thickly forming theribs 41 at the bottom peripheral edge of thecase 10. Thereby, the mechanical strength of thepackage 5 can be increased, reliability of the package can be increased and long service life of the photo-electronic device 1 can be achieved. - Next, by cutting and removing the
dam piece 54 connecting the respective leads 6 and cutting outer end portion of theleads 6 and separating theleads 6 from theinner frames 52, there can be fabricated the case of a so-to-speak butterfly type in which theleads 6 are extended straightly in the transverse direction from thecase 10. Further, there can be constituted the dual in line type as shown by FIG. 4 by forming theleads 6 and bending thereof in the same direction simultaneously with cutting and separating theleads 6 or separately. - Next, an explanation will be given of assembling of the photo-electronic device by using the
case 10 and thecap 11. - As shown by FIG. 17, the
silicon platform 16 fixed with thesemiconductor laser element 21 and thelight receiving element 22, is positioned and fixed onto thebase plate 15 disposed at the inner bottom of thecase 10 via thebonding member 17. Further, although not illustrated, the upper electrodes of thesemiconductor laser element 21 and thelight receiving element 22 and predetermined portions are connected by thewires 26. - Next, as shown by FIG. 16, the
optical fiber cable 3 is inserted into thecable guide groove 10 c of thecase guide portion 10 b and the opticalfiber core line 3 a on the front end side is inserted into the coreline guide groove 10 d. Further, as shown by FIG. 17, the front end of the opticalfiber core line 3 a is made to face the emitting face of thesemiconductor laser element 21 and is positioned and fixed to thesilicon platform 16 highly accurately by a passive alignment method by using a mark, not illustrated, provided at thesilicon platform 16. - Further, the positioning and fixing operation may be carried out by a method in which predetermined potential is applied between predetermined ones of the
leads 6 to thereby operate thesemiconductor laser element 21 to emit laser beam, the emitted beam is inputted from the front end of the opticalfiber core line 3 a into the optical fiber and optical couple adjustment is carried out while detecting optical output to thereby fix the front end of the opticalfiber core line 3 a. - The fixing operation is carried out by a method shown by, for example, FIGS. 18A through 18C. That is, as shown by FIG. 18A, after coating an ultraviolet ray cured adhering
agent 30 a in thegroove 20 of thesilicon platform 16, the opticalfiber core line 3 a is pressed to the bottom of thegroove 20 by pressing thereof to the ultraviolet ray cured adheringagent 30 a. As shown by FIG. 18B, the pressing operation is carried out by applying predetermined load to apress piece 66. For example, a load of 100 g is applied. - Next, the ultraviolet ray cured adhering
agent 30 a on both sides of the opticalfiber core line 3 a is irradiated with ultraviolet ray by using ultravioletray irradiating fibers agent 30 a. Theprimary fixing portion 30 is formed by the ultraviolet ray cured adheringagent 30 a cured thereby and the opticalfiber core line 3 a is fixed to thesilicon platform 16 without moving. - Next, as shown by FIG. 18C,
thermosetting resin 31 a is coated from above the opticalfiber core line 3 a to extend to the one face of thesilicon platform 16 and subjected to a thermal curing processing to thereby form the secondary fixingportion 31 by thethermosetting resin 31 a. Thereby, the opticalfiber core line 3 a is highly accurately fixed to thesilicon platform 16. - Next, as shown by FIG. 19, by fixing a portion of the
optical fiber cable 3 protected from thecase guide portion 10 b by the ultraviolet ray cured adheringagent 12 of epoxy resin species and filling the ultraviolet ray cured adhering agent of epoxy resin species in a portion of the coreline guide groove 10 d at the projectedportion 37 and curing thereof, thedam 35 is formed. Thedam 35 is for preventing silicone resin from flowing toward the center side of thecase guide portion 10 b via a clearance between the coreline guide groove 10 d and the opticalfiber core line 3 a when the silicone resin is injected into the casemain body portion 10 a and preventing the silicone resin from being brought into contact with an adhering agent (epoxy resin of amine species) for fixing theoptical fiber cable 3 and the opticalfiber core line 3 a at later steps. - Next, as shown by FIG. 20, the silicone resin is filled in the case
main body portion 10 a. After filling the silicone resin, ultraviolet ray is irradiated, successively, heating and ageing (30 minutes at 120° C.) and heating and curing (1 hour at 120° C.) are carried out and theprotective film 36 is formed by the gel-like resin. - Next, the core
line guide groove 10 d and thecable guide 10 c reaching the adheringagent 12 from thedam 35, are coated and filled with epoxy resin of amine species and the resin is baked to thereby fix theoptical fiber cable 3 and the opticalfiber core line 3 a to thecase guide portion 10 b by the adheringagent 38 as shown by FIG. 1. - Next, the
cap 11 is made to overlap thecase 10, the both members are adhered to each other by the adhering agent 42 (epoxy resin of amine species) to thereby produce the photo-electronic device (semiconductor optical module) 1 as shown by FIG. 6 and FIG. 2 through FIG. 4. - According to
Embodiment 1, the following effects are achieved. - (1) Since the
dam 35 is present, theprotective film 36 comprising the gel-like resin provided at the main body portion and the adheringagent 38 for fixing the optical fiber (opticalfiber core line 3 a and optical fiber cable 3) to the guide portion are not brought into contact with each other. The resin forming thedam 35 comprises epoxy resin of ultraviolet ray cured type. Thereby, the case guide portion is filled with the epoxy resin of amine species, the adhering force adhering the case and the cap is maintained and accordingly, the fiber can be fixed firmly, thermal stress caused by thermal variation is difficult to apply co the optical fiber (optical fiber core line), the optical fiber core line is difficult to break and optical transmission failure is difficult to cause. - (2) The thermal expansion coefficient of the
case 10 and thecap 11 in the direction of extending the optical fiber (opticalfiber core line 3 a) is 4.0×10−4/° C. (liquid crystal polymer), the thermal coefficient of thebase plate 15 made of 42 alloy is 5×10−6/° C., the thermal expansion coefficient of thesilicon platform 16 is 3.0×10−6/° C., the thermal expansion coefficient of the opticalfiber core line 3 a is 0.5×10−6/° C. and all of the thermal expansion coefficients are smaller than that of copper (α=17×10−6/° C.) and are numerical values proximate to each other and accordingly, it is difficult to cause exfoliation caused by thermal variation of the optical fiber fixed by the silicon platform and the case guide portion. Further, the front end portion of the optical fiber is fixed to the support substrate respectively by the ultraviolet ray cured adhering agent and the thermosetting adhering agent and accordingly, adhering strength is high and exfoliation of the optical fiber is difficult to cause. As a result, at the front end of the optical fiber, a deterioration in the transmission and reception efficiency of light between the front end of the optical fiber and the semiconductor laser element is not caused and the optical fiber (optical fiber core line) at the case guide portion is difficult to break. - (3) Although liquid crystal polymer (LCP) is featured in providing high heat resistance (thermal deformation temperature equal to or higher than 260° C.) and high bending strength (bending strength: 21.1 kg/mm2 at 25° C.), the tensile strength of weld after molding is small. Therefore, when the resin thickness (liquid crystal polymer thickness) below the base plate is thinned to improve heat radiating performance, the resin become brittle and is easy to break, however, increase in the strength is achieved by thickening the peripheral edge o the bottom of the case and accordingly, there is constituted the package having high reliability of mechanical strength.
- (d) Since an air gap is present above the protective film, even when the protective film is expanded by heat, the expanded portion is only elongated into the air gap portion and is not brought into contact with the cap on the upper side and accordingly, the optical fiber is not applied with stress by deforming the package and the optical fiber is difficult to break.
- Although a specific explanation has been given of the invention carried out by the inventors based on the embodiment as described above, the invention is not limited to the above-described embodiment and can naturally be modified variously within a range not deviated from gist thereof. That is, even in the case of a structure of connecting a light receiving element as a photoelectric conversion element and an optical fiber, the invention is similarly applicable and can achieve a similar effect.
- A simple explanation will be given of effects achieved by representative aspects of the invention disclosed in the application as follows.
- (1) The adhering agent comprising epoxy resin or amine species for fixing the optical fiber core line and the protective film comprising the gel-like resin are not brought into direct contact with each other, the dam comprising ultraviolet ray cured adhering agent is provided therebetween and accordingly, a case guide portion is filled with epoxy resin of amine species and accordingly, breakage of the optical fiber core line by thermal stress can be prevented.
- (2) Although the optical fiber (optical fiber core line) is constructed by a constitution of two points support, the case is formed by liquid crystal polymer, the thermal expansion coefficient in the direction of extending the optical fiber is reduced to be proximate to the thermal expansion coefficient of the optical fiber core line, further, the base plate made of metal for fixing the silicon platform is formed by 42 alloy and therefore, the optical fiber core line is difficult to exfoliate at the support portions, the optical fiber is difficult to disconnect, the transmission and reception efficiency between the optical fiber and the semiconductor laser element is difficult to vary and the highly reliable photo-electronic device can be provided.
- (3) The case is formed by liquid crystal polymer, the base plate is exposed at the bottom of the case, the thickness of resin below the base elate is thinned and accordingly, heat radiating Performance of the photo-electronic device can be improved and the stably operated photo-electronic device can be provided.
- (4) Although the case is formed by liquid crystal polymer having low tensile strength of weld, the thickness of the liquid crystal polymer at the peripheral edge of the bottom of the
case 10 is formed to be thick as the ribs and accordingly, the mechanical strength of the case is increased and high reliability of the package is promoted.
Claims (33)
Priority Applications (1)
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US09/810,398 US6443632B2 (en) | 2000-03-31 | 2001-03-19 | Photo-electronic device and method of producing the same |
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JP2000-098012 | 2000-03-31 | ||
JP2000098012A JP3990090B2 (en) | 2000-03-31 | 2000-03-31 | Optoelectronic device and manufacturing method thereof |
US09/800,502 US6461059B2 (en) | 2000-03-31 | 2001-03-08 | Photo-electronic device and method of producing the same |
US09/810,398 US6443632B2 (en) | 2000-03-31 | 2001-03-19 | Photo-electronic device and method of producing the same |
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US09/800,502 Division US6461059B2 (en) | 2000-03-31 | 2001-03-08 | Photo-electronic device and method of producing the same |
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US20010025650A1 true US20010025650A1 (en) | 2001-10-04 |
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US09/810,398 Expired - Fee Related US6443632B2 (en) | 2000-03-31 | 2001-03-19 | Photo-electronic device and method of producing the same |
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-
2001
- 2001-03-08 US US09/800,502 patent/US6461059B2/en not_active Expired - Fee Related
- 2001-03-19 US US09/810,398 patent/US6443632B2/en not_active Expired - Fee Related
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US20110182546A1 (en) * | 2010-01-26 | 2011-07-28 | Hitachi Cable, Ltd. | Photoelectric conversion device |
US9116314B2 (en) * | 2010-01-26 | 2015-08-25 | Hitachi Metals, Ltd. | Photoelectric conversion device |
WO2013162551A1 (en) * | 2012-04-25 | 2013-10-31 | Sarnoff Burton E | Methods for manufacturing and using solid state laser systems having cladded lasing materials |
US8837541B2 (en) | 2012-04-25 | 2014-09-16 | Light Age, Inc. | Methods for manufacturing and using solid state laser systems having cladded lasing materials |
CN103969767A (en) * | 2013-01-24 | 2014-08-06 | 株式会社藤仓 | Optical coupling method and method for manufacturing cable having connector |
US11476637B2 (en) * | 2019-12-16 | 2022-10-18 | Nichia Corporation | Light-emitting device |
US20230006415A1 (en) * | 2019-12-16 | 2023-01-05 | Nichia Corporation | Light-emitting device |
US11811190B2 (en) * | 2019-12-16 | 2023-11-07 | Nichia Corporation | Light-emitting device |
US20240014627A1 (en) * | 2019-12-16 | 2024-01-11 | Nichia Corporation | Light-emitting device |
CN111223849A (en) * | 2020-01-13 | 2020-06-02 | 中国电子科技集团公司第四十四研究所 | Multi-channel integrated refrigeration single photon avalanche photodiode device |
Also Published As
Publication number | Publication date |
---|---|
JP2001281505A (en) | 2001-10-10 |
US20010026665A1 (en) | 2001-10-04 |
JP3990090B2 (en) | 2007-10-10 |
US6443632B2 (en) | 2002-09-03 |
US6461059B2 (en) | 2002-10-08 |
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