US1892832A - Process of preparing uni-directional current carrying devices - Google Patents
Process of preparing uni-directional current carrying devices Download PDFInfo
- Publication number
- US1892832A US1892832A US55523A US5552325A US1892832A US 1892832 A US1892832 A US 1892832A US 55523 A US55523 A US 55523A US 5552325 A US5552325 A US 5552325A US 1892832 A US1892832 A US 1892832A
- Authority
- US
- United States
- Prior art keywords
- blank
- oxide
- copper
- uni
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 22
- 239000010949 copper Substances 0.000 description 22
- 229910052802 copper Inorganic materials 0.000 description 21
- 238000010438 heat treatment Methods 0.000 description 19
- 238000010791 quenching Methods 0.000 description 17
- 230000000171 quenching effect Effects 0.000 description 17
- 239000002184 metal Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 238000000576 coating method Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 9
- 238000001816 cooling Methods 0.000 description 9
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 9
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 9
- 229940112669 cuprous oxide Drugs 0.000 description 9
- 239000000543 intermediate Substances 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- YOBAEOGBNPPUQV-UHFFFAOYSA-N iron;trihydrate Chemical compound O.O.O.[Fe].[Fe] YOBAEOGBNPPUQV-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002006 petroleum coke Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
- H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
- H01L21/164—Oxidation and subsequent heat treatment of the foundation plate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
- H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
- H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
- H01L21/165—Reduction of the copper oxide, treatment of the oxide layer
Definitions
- Fig. 1 1s a view showing, in elevation, one form of blank ready to be prepared as a uni-directional current-carrying device according to my invention.
- Fig. 2 is a view showing in vertical section, auni-directional currentcarrying device as it would appear at pne point in a process embodying my invention.
- Fig. 3 is a view showing acompleted unidirectional current-carrying device constructed in accordance with my invention.
- the reference character A designates a blank of suitable material such as, copper. As shown, thls blank is of circular configuration and is provided with a central aperture A, although this particular form is not essential.
- the copper blank is chemically cleaned in a suitable manner, as by a sand blast, or by 1mmersing it for an instant in a caustic solution such as an aqueous solution of sodium hydroxide or common lye and afterward washing in water to remove the cleansing agent.
- the blank is then heated in the presence of air, as in an electric furnace. If the temperature of the copper reaches approximately 1040 centigrade, the surface of-the blank assumes a glazed appearance. The temperature of the blank should be so controlled that it is close to and preferably just below this glazing temperature or, say 101 5 centigrade.
- the application of heat causes a layer of red oxide of copper, or cuprous oxlde, to be formed on each side of the blank. This layer is of comparatively low resistance.
- the heating process is continued until the cuprous oxide layer is sufficiently thick to be mechanically strong. During this process there is formed also a thin coating of black oxide of copper or cupric oxide, over the outside of the blank. This black oxide coating has a comparatively high electrical
- the blank is transferred immediately to a second furnace which is maintained at a temperature of about 600 centigrade. In the second furnace the blank gradually cools in the presence of air.
- Fig. 2 In which A is the copper blank, 1 and 1 are the two layers of cuprous oxide, and 2 and 2 are the coatings of black copper oxide which cover the blank. the oxide coatings being greatly magnified in thickness in this view.
- the black oxide is removed from Both the black oxide coating 2 and the red oxide coating 1 may be similarly removed from the other side to permit connection with the copper member A. I have found it advantageous toapply powdered petroleum coke to the oxide coating at this stage to decrease contact resistance.
- Fig. 3 One convenient arrangement for connecting the device to an outside circuit is illustrated in Fig. 3.
- the aperture A of the copper disk A is provided with a bolt 6 which is insulated from the disk by means of an insulating sleeve 8.
- This bolt also carriestwo terminal plates 4 and 4 of some suitable electro-conducting material such as copper, one of th ese plates being disposed on each side of the disk A.
- a number of thicknesses of tinfoil or leadfoil 3 are interposed between each plate and the disk for the purpose of securing more perfect contact. This tinfoil is particularly desirable adjacent the oxide coating, but may be disclaimedd with on the other side of the disk.
- the bolt 6 is provided with a nut-6 for clamping the parts rigidly together, it being noticed that insulating washers 5 and 5 are interposed between the bolt head and the nut and the adjacent terminal plates to prevent short-circuiting the device.
- the connec tions to the external circuit may then be conveniently made by means of wires 7 and 7* attached to plates 4 and 4, respectively.
- the device When assembled in the manner shown in the drawing the device will offer considerably higher resistance to current flowing from wire 7 to wire 7 than to current fiowlng'in the opposite direction.
- the asymmetrical properties of the devices can be improved by repeating the heating process several times.
- the blank is oxidized, gradually cooled, and quenched as before, the black oxide removed, and the blank is then returned to the furnace fora second heating after which it is gradually cooled and quenched as before. After each quenching the black oxide is removed, and this process is repeated till the surfaces attain the desired characteristics, after which the device may be assembled-as described hereinbefore.
- Devices prepared in accordance with my invention maybe used for numerous purposes, such for examples as charging'storage batteries from alternating current sources, and operating direct current electrical instruments from sources of alternating current supply.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Manufacture Of Switches (AREA)
- Chemical Treatment Of Metals (AREA)
- Primary Cells (AREA)
- Contacts (AREA)
- Braking Arrangements (AREA)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR595909D FR595909A (fr) | 1925-09-10 | 1925-03-28 | Perfectionnements dans les dispositifs redresseurs de courants |
US55523A US1892832A (en) | 1925-09-10 | 1925-09-10 | Process of preparing uni-directional current carrying devices |
DEW71965D DE529305C (de) | 1925-09-10 | 1926-03-12 | Ventilglied fuer Wechselstromventile oder Gleichrichter |
NL32884A NL19973C (de) | 1925-09-10 | 1926-03-18 | |
BE332988D BE332988A (de) | 1925-09-10 | 1926-03-26 | |
FR32129D FR32129E (fr) | 1925-09-10 | 1926-08-09 | Perfectionnements dans les dispositifs redresseurs de courants |
US131620A US1704734A (en) | 1925-09-10 | 1926-08-26 | Manufacture of electrical rectifiers |
GB11611/27A GB276622A (en) | 1925-09-10 | 1927-04-30 | Improvements relating to current rectifying apparatus |
DEW76784D DE487733C (de) | 1925-09-10 | 1927-08-06 | Verfahren zur Bildung von Gleichrichterelementen |
NL37905A NL23279C (de) | 1925-09-10 | 1927-08-09 | |
FR34002D FR34002E (fr) | 1925-09-10 | 1927-08-19 | Perfectionnements dans les dispositifs redresseurs de courant |
BE344478D BE344478A (de) | 1925-09-10 | 1927-08-24 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55523A US1892832A (en) | 1925-09-10 | 1925-09-10 | Process of preparing uni-directional current carrying devices |
US131620A US1704734A (en) | 1925-09-10 | 1926-08-26 | Manufacture of electrical rectifiers |
Publications (1)
Publication Number | Publication Date |
---|---|
US1892832A true US1892832A (en) | 1933-01-03 |
Family
ID=26734321
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US55523A Expired - Lifetime US1892832A (en) | 1925-09-10 | 1925-09-10 | Process of preparing uni-directional current carrying devices |
US131620A Expired - Lifetime US1704734A (en) | 1925-09-10 | 1926-08-26 | Manufacture of electrical rectifiers |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US131620A Expired - Lifetime US1704734A (en) | 1925-09-10 | 1926-08-26 | Manufacture of electrical rectifiers |
Country Status (6)
Country | Link |
---|---|
US (2) | US1892832A (de) |
BE (2) | BE332988A (de) |
DE (2) | DE529305C (de) |
FR (3) | FR595909A (de) |
GB (1) | GB276622A (de) |
NL (2) | NL19973C (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2496721A (en) * | 1945-10-19 | 1950-02-07 | Westinghouse Electric Corp | Rectifier |
US2990300A (en) * | 1957-12-16 | 1961-06-27 | Mc Graw Edison Co | Protective device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2462218A (en) * | 1945-04-17 | 1949-02-22 | Bell Telephone Labor Inc | Electrical translator and method of making it |
DE972433C (de) * | 1951-10-07 | 1959-07-23 | Siemens Ag | Verfahren zur Herstellung von Kupferoxydul-Gleichrichterscheiben |
-
1925
- 1925-03-28 FR FR595909D patent/FR595909A/fr not_active Expired
- 1925-09-10 US US55523A patent/US1892832A/en not_active Expired - Lifetime
-
1926
- 1926-03-12 DE DEW71965D patent/DE529305C/de not_active Expired
- 1926-03-18 NL NL32884A patent/NL19973C/xx active
- 1926-03-26 BE BE332988D patent/BE332988A/xx unknown
- 1926-08-09 FR FR32129D patent/FR32129E/fr not_active Expired
- 1926-08-26 US US131620A patent/US1704734A/en not_active Expired - Lifetime
-
1927
- 1927-04-30 GB GB11611/27A patent/GB276622A/en not_active Expired
- 1927-08-06 DE DEW76784D patent/DE487733C/de not_active Expired
- 1927-08-09 NL NL37905A patent/NL23279C/xx active
- 1927-08-19 FR FR34002D patent/FR34002E/fr not_active Expired
- 1927-08-24 BE BE344478D patent/BE344478A/xx unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2496721A (en) * | 1945-10-19 | 1950-02-07 | Westinghouse Electric Corp | Rectifier |
US2990300A (en) * | 1957-12-16 | 1961-06-27 | Mc Graw Edison Co | Protective device |
Also Published As
Publication number | Publication date |
---|---|
NL19973C (de) | 1929-05-15 |
NL23279C (de) | 1930-12-15 |
US1704734A (en) | 1929-03-12 |
BE344478A (de) | 1927-08-30 |
FR34002E (fr) | 1929-04-29 |
DE529305C (de) | 1931-07-11 |
BE332988A (de) | 1928-04-30 |
DE487733C (de) | 1929-12-19 |
FR595909A (fr) | 1925-10-12 |
GB276622A (en) | 1928-07-30 |
FR32129E (fr) | 1927-09-10 |
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