US1892832A - Process of preparing uni-directional current carrying devices - Google Patents

Process of preparing uni-directional current carrying devices Download PDF

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Publication number
US1892832A
US1892832A US55523A US5552325A US1892832A US 1892832 A US1892832 A US 1892832A US 55523 A US55523 A US 55523A US 5552325 A US5552325 A US 5552325A US 1892832 A US1892832 A US 1892832A
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United States
Prior art keywords
blank
oxide
copper
uni
heating
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US55523A
Inventor
Paul H Geiger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Rail STS USA Inc
Original Assignee
Union Switch and Signal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR595909D priority Critical patent/FR595909A/en
Application filed by Union Switch and Signal Inc filed Critical Union Switch and Signal Inc
Priority to US55523A priority patent/US1892832A/en
Priority to DEW71965D priority patent/DE529305C/en
Priority to NL32884A priority patent/NL19973C/xx
Priority to BE332988D priority patent/BE332988A/xx
Priority to FR32129D priority patent/FR32129E/en
Priority to US131620A priority patent/US1704734A/en
Priority to GB11611/27A priority patent/GB276622A/en
Priority to DEW76784D priority patent/DE487733C/en
Priority to NL37905A priority patent/NL23279C/xx
Priority to FR34002D priority patent/FR34002E/en
Priority to BE344478D priority patent/BE344478A/xx
Application granted granted Critical
Publication of US1892832A publication Critical patent/US1892832A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
    • H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
    • H01L21/164—Oxidation and subsequent heat treatment of the foundation plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
    • H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
    • H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
    • H01L21/165—Reduction of the copper oxide, treatment of the oxide layer

Definitions

  • Fig. 1 1s a view showing, in elevation, one form of blank ready to be prepared as a uni-directional current-carrying device according to my invention.
  • Fig. 2 is a view showing in vertical section, auni-directional currentcarrying device as it would appear at pne point in a process embodying my invention.
  • Fig. 3 is a view showing acompleted unidirectional current-carrying device constructed in accordance with my invention.
  • the reference character A designates a blank of suitable material such as, copper. As shown, thls blank is of circular configuration and is provided with a central aperture A, although this particular form is not essential.
  • the copper blank is chemically cleaned in a suitable manner, as by a sand blast, or by 1mmersing it for an instant in a caustic solution such as an aqueous solution of sodium hydroxide or common lye and afterward washing in water to remove the cleansing agent.
  • the blank is then heated in the presence of air, as in an electric furnace. If the temperature of the copper reaches approximately 1040 centigrade, the surface of-the blank assumes a glazed appearance. The temperature of the blank should be so controlled that it is close to and preferably just below this glazing temperature or, say 101 5 centigrade.
  • the application of heat causes a layer of red oxide of copper, or cuprous oxlde, to be formed on each side of the blank. This layer is of comparatively low resistance.
  • the heating process is continued until the cuprous oxide layer is sufficiently thick to be mechanically strong. During this process there is formed also a thin coating of black oxide of copper or cupric oxide, over the outside of the blank. This black oxide coating has a comparatively high electrical
  • the blank is transferred immediately to a second furnace which is maintained at a temperature of about 600 centigrade. In the second furnace the blank gradually cools in the presence of air.
  • Fig. 2 In which A is the copper blank, 1 and 1 are the two layers of cuprous oxide, and 2 and 2 are the coatings of black copper oxide which cover the blank. the oxide coatings being greatly magnified in thickness in this view.
  • the black oxide is removed from Both the black oxide coating 2 and the red oxide coating 1 may be similarly removed from the other side to permit connection with the copper member A. I have found it advantageous toapply powdered petroleum coke to the oxide coating at this stage to decrease contact resistance.
  • Fig. 3 One convenient arrangement for connecting the device to an outside circuit is illustrated in Fig. 3.
  • the aperture A of the copper disk A is provided with a bolt 6 which is insulated from the disk by means of an insulating sleeve 8.
  • This bolt also carriestwo terminal plates 4 and 4 of some suitable electro-conducting material such as copper, one of th ese plates being disposed on each side of the disk A.
  • a number of thicknesses of tinfoil or leadfoil 3 are interposed between each plate and the disk for the purpose of securing more perfect contact. This tinfoil is particularly desirable adjacent the oxide coating, but may be disclaimedd with on the other side of the disk.
  • the bolt 6 is provided with a nut-6 for clamping the parts rigidly together, it being noticed that insulating washers 5 and 5 are interposed between the bolt head and the nut and the adjacent terminal plates to prevent short-circuiting the device.
  • the connec tions to the external circuit may then be conveniently made by means of wires 7 and 7* attached to plates 4 and 4, respectively.
  • the device When assembled in the manner shown in the drawing the device will offer considerably higher resistance to current flowing from wire 7 to wire 7 than to current fiowlng'in the opposite direction.
  • the asymmetrical properties of the devices can be improved by repeating the heating process several times.
  • the blank is oxidized, gradually cooled, and quenched as before, the black oxide removed, and the blank is then returned to the furnace fora second heating after which it is gradually cooled and quenched as before. After each quenching the black oxide is removed, and this process is repeated till the surfaces attain the desired characteristics, after which the device may be assembled-as described hereinbefore.
  • Devices prepared in accordance with my invention maybe used for numerous purposes, such for examples as charging'storage batteries from alternating current sources, and operating direct current electrical instruments from sources of alternating current supply.

Description

Jan. 3, 1933.
P. H. GEIGER 1,892,832
PROCESS OF PREPARING UNI-DIRECTIONAL CURRENT CARRYING DEVICES Filed Sept. 10, 1 5
INVENTOR S H wATTQRNEY Patented Jan. 3, 1933 UNITED STATES PATENT OFFICE PAUL H. GEIGER, 0F WILKINSBURG, PENNSYLVANIA, ASSIGNOR TO THE UNION SWITCH & SIGNAL company, SYLVANIA OF SWISSVALE, PENNSYLVANIA, A CORPORATION OF PENN- PROCESS OF PREPARING UNI-DIRECTIONAL CURRENT CARRYING DEVICES Application filed September 10, 1925. Serial No. 55,523.
.#670482, filed Oct. 24, 1923, for process of preparing uni-directional current-carrying devices, in so far as the subject matter common to the two is concerned.-
I will describe one method of preparing such devices, and will then point out thenovel features thereof in claims.
In the accompanying drawing, Fig. 1 1s a view showing, in elevation, one form of blank ready to be prepared as a uni-directional current-carrying device according to my invention. Fig. 2 is a view showing in vertical section, auni-directional currentcarrying device as it would appear at pne point in a process embodying my invention. Fig. 3 is a view showing acompleted unidirectional current-carrying device constructed in accordance with my invention.
Similar reference characters refer to similar parts in each of the three views.
Referring to the drawing, the reference character A designates a blank of suitable material such as, copper. As shown, thls blank is of circular configuration and is provided with a central aperture A, although this particular form is not essential. The
copper blank is chemically cleaned in a suitable manner, as by a sand blast, or by 1mmersing it for an instant in a caustic solution such as an aqueous solution of sodium hydroxide or common lye and afterward washing in water to remove the cleansing agent. The blank is then heated in the presence of air, as in an electric furnace. If the temperature of the copper reaches approximately 1040 centigrade, the surface of-the blank assumes a glazed appearance. The temperature of the blank should be so controlled that it is close to and preferably just below this glazing temperature or, say 101 5 centigrade. The application of heat causes a layer of red oxide of copper, or cuprous oxlde, to be formed on each side of the blank. This layer is of comparatively low resistance. The heating process is continued until the cuprous oxide layer is sufficiently thick to be mechanically strong. During this process there is formed also a thin coating of black oxide of copper or cupric oxide, over the outside of the blank. This black oxide coating has a comparatively high electrical resistance.
After a suflicient amount of oxide has been formed on the copper, the blank is transferred immediately to a second furnace which is maintained at a temperature of about 600 centigrade. In the second furnace the blank gradually cools in the presence of air. I
have. discovered that this gradual cooling to an intermediate temperature materially improves the asymmetrical properties of the device.
When the temperature of the blank has decreased to substantially the temperature of the furnace the blank is removed from the furnace and suddenly cooled or quenched, a preferred'method of accomplishing this being to plunge the blank into a spray of cold water or a current of cold air. The blank now appears as in Fig. 2, in which A is the copper blank, 1 and 1 are the two layers of cuprous oxide, and 2 and 2 are the coatings of black copper oxide which cover the blank. the oxide coatings being greatly magnified in thickness in this view.
It has been found that a blank prepared in this manner will have the characterist c of offering a great deal higher resistance to an electric current flowing from the metallic copper A to the oxide 1 or 1 than to current flowing in the other direction.
Since the resistance of the block oxide is very high it is desirable to make electrical connection directly with the red oxide coating and with the copper. To accomplish this result the black oxide is removed from Both the black oxide coating 2 and the red oxide coating 1 may be similarly removed from the other side to permit connection with the copper member A. I have found it advantageous toapply powdered petroleum coke to the oxide coating at this stage to decrease contact resistance.
One convenient arrangement for connecting the device to an outside circuit is illustrated in Fig. 3. In this view. the aperture A of the copper disk A is provided with a bolt 6 which is insulated from the disk by means of an insulating sleeve 8. This bolt also carriestwo terminal plates 4 and 4 of some suitable electro-conducting material such as copper, one of th ese plates being disposed on each side of the disk A. A number of thicknesses of tinfoil or leadfoil 3 are interposed between each plate and the disk for the purpose of securing more perfect contact. This tinfoil is particularly desirable adjacent the oxide coating, but may be dis pensed with on the other side of the disk. The bolt 6 is provided with a nut-6 for clamping the parts rigidly together, it being noticed that insulating washers 5 and 5 are interposed between the bolt head and the nut and the adjacent terminal plates to prevent short-circuiting the device. The connec tions to the external circuit may then be conveniently made by means of wires 7 and 7* attached to plates 4 and 4, respectively. When assembled in the manner shown in the drawing the device will offer considerably higher resistance to current flowing from wire 7 to wire 7 than to current fiowlng'in the opposite direction.
It has been found that in some cases the asymmetrical properties of the devices can be improved by repeating the heating process several times. In such cases the blankis oxidized, gradually cooled, and quenched as before, the black oxide removed, and the blank is then returned to the furnace fora second heating after which it is gradually cooled and quenched as before. After each quenching the black oxide is removed, and this process is repeated till the surfaces attain the desired characteristics, after which the device may be assembled-as described hereinbefore.
Devices prepared in accordance with my invention maybe used for numerous purposes, such for examples as charging'storage batteries from alternating current sources, and operating direct current electrical instruments from sources of alternating current supply.
Although I have herein shown and described only one process for preparing unidirectional current-carrying devices embodying my invention, it is understood that various changes and modifications may be made therein within the scope of the appended claims without departing from the spirit and scope of my invention.
Having thus described my invention, what I claim is:
1. The process of preparing metal for use in a uni-directional current-carrying device which consists in heating a chemically clean blank of copper in the presence of air to form cuprous oxide on the-blank, and quenching the blank.
2. The process of preparing metal for use in a uni-directional current-carrying device which consists in heating a copper blank in the presence of oxygen to form cuprous oxide thereon, and quenching said blank in water.
3. The process of preparing metal for use in a uni-directional current-carrying device which consists in cleaning a metallic blank, successively heating the blank a number of times to form cuprous oxide thereon, and quenching the blank after each heating.
4. The process of preparing metal for use in a uni-directional current-carrying device which consists in cleaning a copper blank, heating the blank in the presence of air to a temperature just below the glazing tempera ture to form cuprous oxide thereon, and quenching the blank.
5. In the process of preparing metal for use in a uni-directional current-carrying device the steps of cleaning a copper blank, heating the blank to form oxide thereon, gradually cooling the blank to an intermedi ate temperature, and quenching the blank.
6. In the process of preparing metal for use in a uni-directional current-carrying device the steps of heating a copper blank in air to form oxide thereon, gradually cooling the blank in air to an intermediate temperature, and quenching the blank in water.
7. In the process of preparing metal for use in a uni-directional current-carrying device the steps of heating a copper blank in the presence of air to a temperature just below the glazing temperature, gradually cooling the blank to an intermediate temperature, and quenching the blank.
8. In the process of preparing metal for use in a uni-directional current-carrying device the steps of heating a metallic blank to form oxide thereon, gradually cooling the blank to substantially 600 centigrade, and quenching the blank 9. In the process of preparing metal for use in a uni-directional current-carrying device the steps of heating a copper blank to substantially 1015 centigrade, to form cuprous oxide thereon, gradually cooling the blank to an intermediate temperature, and quenching the blank.
10. In the process of preparing metal for use in a uni-directional current-carrying device the steps of heating a copper blank to substantially 1015 centigrade to form cuprous oxide thereon, gradually cooling the blank to substantially 600 centigrade, and then quenching the blank.
11. In the rocess of preparing metal for use in a uniirectional current-carrying device the steps of heating a copper blank to substantially 1015 centigrade to form cuprous oxide thereon, gradually cooling the blank to substantially 600 centigrade in the presence of air, and then quenching the blank.
12. The process of preparing metal for use in a uni-directional current-carrying device 1 which consists in cleaning a copper blank, heating the blank in the presence of air to substantially 1015 centigrade to form an inner low resistance oxide coating and an outer high resistance oxidecoating thereon, gradually cooling the blank in air to substantially 600 centigrade, quenching the blank, removin both oxide coatings from a portion of the lank, removing only the high resistance oxide coating from other portions of the blank, and applying finely divided carbon to said blank.
13. The process of preparing metal for use in a unidirectional current-carrying) device which consists in heating a metallic lank to form oxide thereon, and then quenching the blank from a temperature of about 600 centigrade.
14. The process of preparing metal for use in a unidirectional current-carryin device which consists in heating a 'metallic blank to a forming temperature to produce oxide thereon,-and then quenching the blank from a temperature substantially lower than the forming temperature.
15. The process of preparing metal for use in a unidirectional current-carrying device which consists in heating a metallic blank to i a forming temperature to produce oxide thereon, and then quenching said blank when- 40 the blank is at a temperature intermediate the forming temperature and the temperature of the quenching medium.
In testimony whereof I aflixmy signature.
PAUL H. GEIGER.
US55523A 1925-09-10 1925-09-10 Process of preparing uni-directional current carrying devices Expired - Lifetime US1892832A (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
FR595909D FR595909A (en) 1925-09-10 1925-03-28 Improvements in current rectifier devices
US55523A US1892832A (en) 1925-09-10 1925-09-10 Process of preparing uni-directional current carrying devices
DEW71965D DE529305C (en) 1925-09-10 1926-03-12 Valve element for AC valves or rectifiers
NL32884A NL19973C (en) 1925-09-10 1926-03-18
BE332988D BE332988A (en) 1925-09-10 1926-03-26
FR32129D FR32129E (en) 1925-09-10 1926-08-09 Improvements in current rectifier devices
US131620A US1704734A (en) 1925-09-10 1926-08-26 Manufacture of electrical rectifiers
GB11611/27A GB276622A (en) 1925-09-10 1927-04-30 Improvements relating to current rectifying apparatus
DEW76784D DE487733C (en) 1925-09-10 1927-08-06 Method of forming rectifier elements
NL37905A NL23279C (en) 1925-09-10 1927-08-09
FR34002D FR34002E (en) 1925-09-10 1927-08-19 Improvements in current rectifier devices
BE344478D BE344478A (en) 1925-09-10 1927-08-24

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55523A US1892832A (en) 1925-09-10 1925-09-10 Process of preparing uni-directional current carrying devices
US131620A US1704734A (en) 1925-09-10 1926-08-26 Manufacture of electrical rectifiers

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US1892832A true US1892832A (en) 1933-01-03

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US55523A Expired - Lifetime US1892832A (en) 1925-09-10 1925-09-10 Process of preparing uni-directional current carrying devices
US131620A Expired - Lifetime US1704734A (en) 1925-09-10 1926-08-26 Manufacture of electrical rectifiers

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Application Number Title Priority Date Filing Date
US131620A Expired - Lifetime US1704734A (en) 1925-09-10 1926-08-26 Manufacture of electrical rectifiers

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US (2) US1892832A (en)
BE (2) BE332988A (en)
DE (2) DE529305C (en)
FR (3) FR595909A (en)
GB (1) GB276622A (en)
NL (2) NL19973C (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2496721A (en) * 1945-10-19 1950-02-07 Westinghouse Electric Corp Rectifier
US2990300A (en) * 1957-12-16 1961-06-27 Mc Graw Edison Co Protective device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2462218A (en) * 1945-04-17 1949-02-22 Bell Telephone Labor Inc Electrical translator and method of making it
DE972433C (en) * 1951-10-07 1959-07-23 Siemens Ag Process for the production of copper oxide rectifier disks

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2496721A (en) * 1945-10-19 1950-02-07 Westinghouse Electric Corp Rectifier
US2990300A (en) * 1957-12-16 1961-06-27 Mc Graw Edison Co Protective device

Also Published As

Publication number Publication date
FR34002E (en) 1929-04-29
GB276622A (en) 1928-07-30
DE529305C (en) 1931-07-11
US1704734A (en) 1929-03-12
DE487733C (en) 1929-12-19
BE344478A (en) 1927-08-30
NL19973C (en) 1929-05-15
NL23279C (en) 1930-12-15
BE332988A (en) 1928-04-30
FR595909A (en) 1925-10-12
FR32129E (en) 1927-09-10

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