US1543237A - Process for improving the physical properties of electrolytically deposited copper sheets - Google Patents
Process for improving the physical properties of electrolytically deposited copper sheets Download PDFInfo
- Publication number
- US1543237A US1543237A US644962A US64496223A US1543237A US 1543237 A US1543237 A US 1543237A US 644962 A US644962 A US 644962A US 64496223 A US64496223 A US 64496223A US 1543237 A US1543237 A US 1543237A
- Authority
- US
- United States
- Prior art keywords
- sheet
- electrolytically deposited
- improving
- physical properties
- deposited copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/30—Foil or other thin sheet-metal making or treating
- Y10T29/301—Method
Definitions
- This invention relates to a process for improving the physical properties of electrolytically deposited copper sheets whose utilization has been heretofore limited on account of its inferior qualities.
- This invention has for its object to increase the duetility and malleability as well as strength of said sheet and to make it more able to resist corrosive action by mechanical and heat treatment.
- ordinary electrolytically deposited sheet is smooth on one side and rough on the other, so thatit is sometimes called a one side polished sheet.
- An electrolytically deposited copper sheet is inferior to the ordinary polished sheet manufactured by the ordinary dry process on account of its poor tensile strength and many other properties, which restrict the scope of application of the electrolytically deposited sheet.
- the ordinary electro lytically deposited sheet is only used for roofing purposes or the like where mechanical strength is not so required.
- the ordinary electrolytically deposited sheet is brittle, nonductile or fragile, nonmalleable, corrosive and not uniform in its structure.
- This invention comprises a series of mechanical and heat treatments of an electrolytically deposited sheet that is, annealing an electrolytically deposited sheet at a temperature of from 300 C. to 800 C. for a duration of 5 minutes or more, rolling the sheet at a circumferential speed of not more than 450 feet per minute, and pickling with dilute sulphuric acid. The three steps in the treatment are repeated until desired thickness of the sheet is obtained. In cold rolling, the plate easily cracks at its edges if Application filed June 12, 1923. Serial mi. $14,982.
- each rolling step is not moderate. .Therefore care should be taken not to reduce its thickness too quickly in each rolling step.
- the initial annealing step is however not so important that it cannot be conveniently omitted without serious disadvantage.
- the copper sheet thus treated is very ductile and malleable, and is no more inferior in any properties to the copper sheet manufactured by the ordinary process in which the raw material is melted, cast, annealed and rolled.
- the improved plate is especially. good for electrical purposes, for which high purity and considerable ductility are required.
- this improved sheet contains no blow holes and pin holes which are apt to form in sheets made by the ordinary dry process, so that sheetsv made according to the improved process are also, very desirable for mechanical purposes.
- this improved sheet is homo geneous in its structure and resists corrosive action better than ordinary sheet.
- Another characteristic of this invention lies in the fact that the cost of sheets manufactured by this process is lower than that of sheets made by other processes. This is true because, first, an electrolytic sheet is used and second, a thick electrolytic sheet is used. In the manufacture of electrolytic sheet, itis not necessary to melt, cast, and
- this improved plate has polished surfaces on both sides by the treatment of annealing, pickling and rolling. Therefore, this novel plate can replace the ordinary both sides polished sheet, which is far more expensive than the former on account of the necessary steps of melting, casting, hot rolling or any such mechanical and heat treatments.
- a process for improving the physical properties of an electrolytically deposited copper sheet comprising annealing the sheet at a temperature of from 300 C. to 800 C.
- a process for improving the physical properties of an electrolytically deposited copper sheet comprising annealing the sheet 7 at a temperature of from 300C. to 800 C.
- rolling properties of an electrolytically de osited non-ferrous metal comprising annea ing a mass ofthe metal, rolling the same, and pickling.
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Description
Patented June 23, 1925.
UNITED STATE-S'IPATENT OFFICE.
.' sumac SONODA, or KYOTO, JAPAN.
PROCESS FOR IMPROVING PHYSICAL PROPERTIES OF ELECTROLYTIOALLY DE- POSI'IED COPPER SHEETS.
No Drawing.
To all whom it ma concern:
Be it known that SHINco SoNoDA, a subject of the Empire of Japan, residing at N o. 458, Zaimoku-cho, Shimokyo-ku, Kyoto, Japan, has invented certain new and useful Improvements in Processes for Improving the Physical Properties of Electrolytically Deposited Copper Sheets; and he does hereby declare the following to be a full, clear, and exact description of the invention, such as will enable others skilled in the art to which it appertains to make and use the same.
This invention relates to a process for improving the physical properties of electrolytically deposited copper sheets whose utilization has been heretofore limited on account of its inferior qualities. This invention has for its object to increase the duetility and malleability as well as strength of said sheet and to make it more able to resist corrosive action by mechanical and heat treatment.
It is well known that ordinary electrolytically deposited sheet is smooth on one side and rough on the other, so thatit is sometimes called a one side polished sheet. An electrolytically deposited copper sheet is inferior to the ordinary polished sheet manufactured by the ordinary dry process on account of its poor tensile strength and many other properties, which restrict the scope of application of the electrolytically deposited sheet. Thus the ordinary electro lytically deposited sheet is only used for roofing purposes or the like where mechanical strength is not so required. In short, the ordinary electrolytically deposited sheet is brittle, nonductile or fragile, nonmalleable, corrosive and not uniform in its structure.
This invention comprises a series of mechanical and heat treatments of an electrolytically deposited sheet that is, annealing an electrolytically deposited sheet at a temperature of from 300 C. to 800 C. for a duration of 5 minutes or more, rolling the sheet at a circumferential speed of not more than 450 feet per minute, and pickling with dilute sulphuric acid. The three steps in the treatment are repeated until desired thickness of the sheet is obtained. In cold rolling, the plate easily cracks at its edges if Application filed June 12, 1923. Serial mi. $14,982.
each rolling step is not moderate. .Therefore care should be taken not to reduce its thickness too quickly in each rolling step.
The initial annealing step is however not so important that it cannot be conveniently omitted without serious disadvantage.
The copper sheet thus treated is very ductile and malleable, and is no more inferior in any properties to the copper sheet manufactured by the ordinary process in which the raw material is melted, cast, annealed and rolled. As an electrolytically deposited sheet is pure copper, the improved plate is especially. good for electrical purposes, for which high purity and considerable ductility are required.
Further, this improved sheet contains no blow holes and pin holes which are apt to form in sheets made by the ordinary dry process, so that sheetsv made according to the improved process are also, very desirable for mechanical purposes.
Furthermore, this improved sheet is homo geneous in its structure and resists corrosive action better than ordinary sheet.
Another characteristic of this invention lies in the fact that the cost of sheets manufactured by this process is lower than that of sheets made by other processes. This is true because, first, an electrolytic sheet is used and second, a thick electrolytic sheet is used. In the manufacture of electrolytic sheet, itis not necessary to melt, cast, and
then hot-roll in order to obtain a sheet of superior physical quality as is required in an ordinary process and, furthermore, a thick electrolytic sheet is cheaper than a thin electrolytic sheet per unit weight. In this connection, it is not necessary for the raw sheet to have a uniform thickness or smooth surface, so that ordinary commercial electrolytically deposited sheet of fair thickness and produced at low cost may be used as raw material.
Lastly, this improved plate has polished surfaces on both sides by the treatment of annealing, pickling and rolling. Therefore, this novel plate can replace the ordinary both sides polished sheet, which is far more expensive than the former on account of the necessary steps of melting, casting, hot rolling or any such mechanical and heat treatments.
-' What I claim is p 1. A process for improving the physical properties of an electrolytically deposited copper sheet comprising annealing the sheet at a temperature of from 300 C. to 800 C.
for a duration of minutes or more, rolling the same at a circumferential speed of not more than 50 feet per minute, and pickling the sheet with dilute sulphuric acid.
2. A process for improving the physical properties of an electrolytically deposited copper sheet comprising annealing the sheet 7 at a temperature of from 300C. to 800 C.
v for a duration of 5 minutes or more, rolling properties of an electrolytically de osited non-ferrous metal comprising annea ing a mass ofthe metal, rolling the same, and pickling.
4. The process of improving the physical properties of an electrolytically deposited properties of an electrolytically deposited non-ferrous metal comprising annealing a mass of the metal, rolling the same, and,
pickling, and then repeating all of the steps of the treatment until desired thickness of the sheet is obtained.
6. The process of improving the physical properties of an electrolytically deposited copper sheet comprising annealing the sheet, rolling the same, and pickling, and then repeating all of the steps of the treatment until desired thickness of the sheet is obtained.
7. The process of improving the physical properties of an electrolytically deposited copper sheet comprising rolling the same at a circumferential speed of not more than 450 feet per minute and then pickling.
In testimony whereof I hereunto afiix my signature in the presence of two witnesses. v
Witnesses W. OBIHARAH,
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US644962A US1543237A (en) | 1923-06-12 | 1923-06-12 | Process for improving the physical properties of electrolytically deposited copper sheets |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US644962A US1543237A (en) | 1923-06-12 | 1923-06-12 | Process for improving the physical properties of electrolytically deposited copper sheets |
Publications (1)
Publication Number | Publication Date |
---|---|
US1543237A true US1543237A (en) | 1925-06-23 |
Family
ID=24587084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US644962A Expired - Lifetime US1543237A (en) | 1923-06-12 | 1923-06-12 | Process for improving the physical properties of electrolytically deposited copper sheets |
Country Status (1)
Country | Link |
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US (1) | US1543237A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3974043A (en) * | 1974-03-27 | 1976-08-10 | Kabel-Und Metallwerke Gutehoffnungshutte Aktiengesellschaft | Making a stabilized superconductor |
-
1923
- 1923-06-12 US US644962A patent/US1543237A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3974043A (en) * | 1974-03-27 | 1976-08-10 | Kabel-Und Metallwerke Gutehoffnungshutte Aktiengesellschaft | Making a stabilized superconductor |
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