US12343989B2 - Liquid ejection head - Google Patents
Liquid ejection head Download PDFInfo
- Publication number
- US12343989B2 US12343989B2 US18/085,394 US202218085394A US12343989B2 US 12343989 B2 US12343989 B2 US 12343989B2 US 202218085394 A US202218085394 A US 202218085394A US 12343989 B2 US12343989 B2 US 12343989B2
- Authority
- US
- United States
- Prior art keywords
- substrate
- terminal
- liquid ejection
- monitor terminal
- edge side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04541—Specific driving circuit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
Definitions
- a pickup roller 204 supplies the sheets S one by one from the cassette 12 to the upstream conveyance path 13 .
- the upstream conveyance path 13 includes feed roller pairs 131 and 132 , and sheet guide plates 133 and 134 .
- the sheet S is conveyed to an upper surface of the conveyance belt 14 via the upstream conveyance path 13 .
- An arrow 104 in the drawing indicates a conveyance path of the sheet S from the cassette 12 to the conveyance belt 14 .
- the nozzle plate 21 which is an example of a nozzle portion, is a rectangular plate formed of, for example, a resin such as polyimide or a metal such as stainless steel.
- the nozzles 25 of the channels are arranged along a longitudinal direction (X direction) of the nozzle plate 21 .
- a nozzle density is set within a range of, for example, 150 dpi to 1200 dpi.
- An electrode 53 is formed on a bottom surface and both side surfaces of the groove-shaped pressure chamber 51 .
- the electrode 53 of each pressure chamber 51 is connected to an individual wiring 54 (also referred to as a wiring electrode 54 ).
- the electrode 55 is formed on a bottom surface and both side surfaces of the groove-shaped air chamber 52 .
- the electrode 55 of each air chamber 52 is connected to a common wiring 56 (also referred to as a wiring electrode 56 ). That is, a connection point between an electrode 53 of a pressure chamber 51 and individual wiring 54 is one terminal of one actuator 5 .
- a connection point between the electrode 55 of the air chamber 52 and the common wiring 56 is the other terminal of the actuator 5 .
- the individual wiring 54 is connected to a drive circuit D (“driver D”) of the driving IC 31 .
- the pressure chamber 51 for ink is formed sandwiched between a pair of columnar actuators 5 .
- a potential difference is applied to both walls of the columnar actuator 5 , that is, an inner wall and an outer wall of the pressure chamber 51 , and the actuator 5 is deformed by being charged. Accordingly, a volume of the pressure chamber 51 is changed, and as a result, an ink pressure in the pressure chamber 51 is changed.
- ink can be ejected from the nozzle 25 .
- FIG. 4 is a plan view of the actuator substrate 22 , the flexible printed wiring board 3 , and the printed circuit board 4 before being connected to each other.
- FIG. 5 is a partially enlarged view of the actuator substrate 22 .
- FIG. 6 is a plan view illustrating the substrates 22 , 3 , and 4 connected to each other.
- FIG. 7 is a side view illustrating the substrates 22 , 3 , and 4 when connected to each other.
- an actuator 5 has an individual wiring 54 (wire) connected to one terminal thereof.
- a plurality of individual wirings 54 (wires) thus are led out from the respective actuators 5 and formed up (gathered together) at the terminal portion 20 at one edge of the actuator substrate 22 .
- the one edge of the actuator substrate 22 is the edge of the substrate on a side to which the flexible printed wiring board 3 is connected.
- the individual wirings 54 are formed in parallel at equal intervals, for example.
- the common wiring 56 in this example includes a first wiring portion 57 and several second wiring portions 58 .
- the first wiring portion 57 and the second wiring portion 58 are disposed on a side opposite to the terminal portion 20 as viewed from the actuator 5 so as not to intersect with the individual wiring 54 .
- the first wiring portion 57 is formed along an arrangement direction of the actuators 5 on the other edge side of the actuator substrate 22 and is formed up at the terminal portion 20 by folding back both sides, for example, both end portions in the arrangement direction of the actuators 5 in a direction intersecting the arrangement direction of the actuators 5 . Therefore, in the terminal portion 20 , a pair of terminals led out from both end portions of the first wiring portion 57 are positioned symmetrically at both sides of the substrate.
- the direction intersecting the arrangement direction of the actuators 5 is, for example, a direction orthogonal to the arrangement direction of the actuators 5 .
- the plurality of second wiring portions 58 branched from the first wiring portion 57 are formed along the direction intersecting the arrangement direction of the actuators 5 , and each second wiring portion 58 is connected to the other terminal of the corresponding actuator 5 .
- a monitor terminal 59 is disposed on the side to which the flexible printed wiring board 3 is connected.
- the monitor terminal 59 is connected to the first wiring portion 57 of the common wiring 56 and is used when measuring resistance of the first wiring portion 57 .
- the monitor terminal 59 is formed in a wire shape and passes between a pair of otherwise adjacent individual wirings 54 .
- the monitor terminal 59 is connected to the first wiring portion 57 at a position between adjacent actuators 5 .
- a portion of the monitor terminal 59 is formed by an electrode 55 (see FIG. 3 ) of an air chamber 52 and another portion is formed by a second wiring portion 58 .
- the monitor terminal 59 is led out by using the electrode 55 of an air chamber 52 to be connected to the first wiring portion 57 across the arrangement of the actuators 5 without intersecting with other wirings such as the individual wirings 54 and the second wiring portion 58 of another channel.
- the monitor terminal 59 may be an independent wiring connected to the first wiring portion 57 .
- the monitor terminal 59 is formed at a position corresponding to a midpoint or the like along a length direction of the first wiring portion 57 extending along the arrangement direction of the actuators 5 .
- the position is where the first wiring portion 57 is symmetrically divided into two different parts.
- the number of monitor terminals 59 is not necessarily limited to just one at the midpoint position, and a plurality of monitor terminals 59 may be provided using electrodes of a plurality of air chambers 52 . By increasing the number of monitor terminals 59 , electrode resistance can be managed or tracked more finely.
- an interval between individual wirings 54 adjacent to the monitor terminal 59 and the interval between adjacent individual wirings 54 is adjusted so that pitches P of the terminals in the terminal portion 20 are equal (see FIG. 5 ).
- the monitor terminal 59 and an electrostatic capacitance measurement terminal which will be described later, are arranged at equal intervals, and thus there is an advantage that batch probing can be facilitated.
- the individual wirings 54 , the first wiring portion 57 , the second wiring portions 58 , and the monitor terminal(s) 59 are formed of, for example, nickel, aluminum, gold, or an alloy thereof in a thin film shape.
- a wiring width of the individual wirings 54 , the second wiring portions 58 , and the monitor terminal(s) 59 can be selected from a range of, for example, 10 ⁇ m to 30 ⁇ m. Since the first wiring portion 57 needs to supply charging and discharging currents to all the actuators 5 , a wiring width of the first wiring portion 57 is larger than that of the individual second wiring portions 58 .
- the wiring width of the first wiring portion 57 is, for example, 0.8 mm.
- a thickness of the individual wirings 54 , the first wiring portion 57 , the second wiring portions 58 , and the monitor terminal(s) 59 is, for example, 0.4 ⁇ m.
- an insulating layer, an insulating material, or the like may be provided in regions outside the terminal portion 20 .
- the flexible printed wiring board 3 is a flexible printed wiring board comprising, for example, a synthetic resin film of polyimide.
- the driving IC 31 is, for example, a driver chip formed on a silicon semiconductor substrate.
- Output wirings 33 , input wirings 34 , a power supply wiring 35 for the voltage V 1 , a ground wiring 36 , and common passing wirings 37 are formed on the flexible printed wiring board 3 .
- the wirings 33 to 37 and the driving IC 31 are preferably formed on one surface of the flexible printed wiring board 3 .
- the flexible printed wiring board 3 is formed using a chip on film (COF) technique.
- COF chip on film
- the output wirings 33 led out from the driving IC 31 are formed up at the terminal portion 30 .
- the output wirings 33 are individual wirings formed on the flexible printed wiring board 3 .
- the number of output wirings 33 is, for example, the same as the number of the individual wirings 54 on the actuator substrate 22 side.
- the common passing wiring 37 is formed from the terminal portion 30 on a side to which the actuator substrate 22 is connected, to the terminal portion 32 on a side to which the printed circuit board 4 is connected.
- the common passing wirings 37 are formed in pairs on both sides of the substrate to reduce a voltage drop occurring in the first wiring portion 57 during driving.
- the common passing wirings 37 are respectively connected to terminals of the first wiring portion 57 that are formed in a pair on the terminal portion 20 of the actuator substrate 22 .
- the power supply wiring 35 and the ground wiring 36 are connected to the driving IC 31 .
- the power supply wiring 35 and the ground wiring 36 are formed up at the terminal portion 32 on the side to which the printed circuit board 4 is connected.
- the output wirings 33 , the input wirings 34 , the power supply wiring 35 , the ground wiring 36 , and the common passing wiring 37 are formed of, for example, copper thin film.
- the printed circuit board 4 is a hard substrate (e.g., inflexible substrate).
- the printed circuit board 4 in this example permits through holes to be formed in the substrate material.
- the substrate material in this example comprises one or more epoxy resin layer containing glass fibers with one or more copper wiring layers laminated together in multiple layers.
- Output wirings 41 , a power supply wiring 42 , and a ground wiring 43 are formed in a terminal portion 40 .
- the output wirings 41 are connected to the input wirings 34 of the flexible printed wiring board 3 .
- the power supply wiring 42 is connected to the power supply wiring 35 of the flexible printed wiring board 3 .
- the ground wiring 43 is connected to the ground wiring 36 and the common passing wiring 37 of the flexible printed wiring board 3 .
- the terminal portion 20 of the actuator substrate 22 and the terminal portion 30 of the flexible printed wiring board 3 can be connected via an anisotropic conductive film (ACF) 6 . That is, the terminal portion 20 of the actuator substrate 22 and the terminal portion 30 of the flexible printed wiring board 3 are arranged so as to face each other, the ACF 6 is interposed therebetween, and the wirings of the terminal portions 20 and 30 are collectively connected by thermocompression bonding using, for example, a thermocompression bonding tool. Accordingly, the individual wirings 54 and the output wirings 33 , and the common wiring 56 and the common passing wiring 37 can be electrically connected to each other.
- the flexible printed wiring board 3 and the printed circuit board 4 are connected in the same manner.
- the resistance of the first wiring portion 57 can be measured using a four-terminal method.
- the probes 71 connected to a current source 72 are connected to different ends of the first wiring portion 57 as the “Terminal 1 ” and the “Terminal 2 ”, respectively.
- a voltage detection circuit 73 is connected to “Terminal 1 ” of the first wiring portion 57 and the monitor terminal 59 .
- a voltage detection circuit 74 is connected to “Terminal 2 ” of the first wiring portion 57 and the monitor terminal 59 .
- two probes 71 connected to the current source 72 are used as a set to cause a predetermined current to flow.
- a predetermined current from the current source 72 is caused to flow from “Terminal 2 ” to the “Terminal 1 ” of the first wiring portion 57 , and the current is measured.
- the “Terminal 1 ” and “Terminal 2 ” are led out from opposite ends of the first wiring portion 57 in order to prevent a voltage drop that can be caused by current concentration when many actuators 5 are simultaneously driven during printing, and this configuration is also used in the measurement of the resistance.
- a voltage (first detection voltage) between the “Terminal 3 ” and the “Terminal 5 ” is measured.
- “Terminal 3 ” connects to the first wiring portion 57 in close proximity to the “Terminal 1 ”
- “Terminal 5 ” connects to the monitor terminal 59 .
- Terminal 1 and Terminal 2 ′′ are current-supplying terminals of a four terminal method.
- “Terminal 3 and “Terminal 5 ” are voltage detection terminals.
- a voltage (second detection voltage) between the “Terminal 5 ” and the “Terminal 4 ” of the first wiring portion 57 is measured.
- the “Terminal 4 ” is connected to the wiring 57 in proximity to the Terminal 2 .
- the distribution of the wiring resistances along the first wiring portion 57 can be determined in more detail. It is preferable to manage the wiring forming processes in the manufacturing process so that these resistance values for different portions of the first wiring portion 57 fall within some predetermined range of values.
- each actuator 5 is connected to the individual wiring 54 , and each actuator 5 is independently driven by the corresponding driver D of the driving IC 31 .
- the other terminal of each actuator 5 is connected to a common potential via the common wiring 56 ( 57 , 58 ).
- the common potential is constant for each actuator 5 , a net voltage applied to each actuator 5 can be individually controlled for each channel according to an output waveform of each driver D connected to the individual wiring 54 without adjustment/compensation.
- the common wiring 56 (or sub-portions 57 thereof) unavoidably has resistance, the current flow through the common wiring 56 varies when driving different actuators 5 .
- the resistance of the first wiring portion 57 causes a voltage drop when charging and discharging currents from the actuators 5 are concentrated. Since the voltage drop changes depending on which channel is being driven, a phenomenon called crosstalk in which ejection characteristics of each channel change depending on a printing pattern may occur in the inkjet head 100 , and the printing quality deteriorates. In order to prevent this, it is generally necessary to keep the resistance of the first wiring portion 57 to a low value. For the management of this phenomenon, it is generally necessary to measure certain resistance values in the inkjet head 100 .
- the measurement circuit depicted in FIG. 8 can also measures or detect whether each actuator 5 is normal.
- a capacitance measurement circuit 75 can be used to measure a capacitance of each actuator 5 by measuring a waveform of a current flowing through each probe 71 when a predetermined voltage waveform is being applied via the probe 71 - 6 .
- the probe 71 - 6 connects each the individual wirings 54 individually to the capacitance measurement circuit 75 . Then, based on the measured capacitances, it can be determined whether each actuator 5 is normal and/or whether a wiring pattern for each individual wiring 54 is normal.
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022024419A JP7713895B2 (en) | 2022-02-21 | 2022-02-21 | Liquid ejection head |
| JP2022-024419 | 2022-02-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20230264470A1 US20230264470A1 (en) | 2023-08-24 |
| US12343989B2 true US12343989B2 (en) | 2025-07-01 |
Family
ID=85172471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US18/085,394 Active 2043-07-28 US12343989B2 (en) | 2022-02-21 | 2022-12-20 | Liquid ejection head |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12343989B2 (en) |
| EP (1) | EP4230421B1 (en) |
| JP (1) | JP7713895B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024005942A (en) * | 2022-06-30 | 2024-01-17 | ブラザー工業株式会社 | image recording device |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001179995A (en) | 1999-12-28 | 2001-07-03 | Kyocera Corp | Method of manufacturing inkjet head |
| US20010033304A1 (en) * | 1994-10-20 | 2001-10-25 | Hiroyuki Ishinaga | Elements substrate having connecting wiring between heat generating resistor elements and ink jet recording apparatus |
| US20030156163A1 (en) * | 2001-10-02 | 2003-08-21 | Matsushita Electric Industrial Co., Ltd. | Ferroelectric element and actuator using the same, and ink jet head and ink jet recording device |
| US20080100683A1 (en) * | 2006-10-27 | 2008-05-01 | Konica Minolta Ij Technologies, Inc. | Inkjet head |
| US20080186342A1 (en) * | 2007-02-05 | 2008-08-07 | Brother Kogyo Kabushiki Kaisha | Inkjet recording apparatus, manufacturing method of inkjet head, and checking method of the head |
| JP2008188888A (en) | 2007-02-05 | 2008-08-21 | Brother Ind Ltd | Inkjet head manufacturing method, inkjet head inspection method, and inkjet recording apparatus |
| US20110032311A1 (en) * | 2009-08-07 | 2011-02-10 | Toshiba Tec Kabushiki Kaisha | Inkjet print head and method of manufacture therefor |
| JP2012139918A (en) | 2010-12-28 | 2012-07-26 | Seiko Epson Corp | Method for manufacturing liquid jetting head, liquid jetting head, and liquid jetting apparatus |
| US20130050338A1 (en) * | 2011-08-26 | 2013-02-28 | Toshiba Tec Kabushiki Kaisha | Inkjet head and method of manufacturing the inkjet head |
| US20170129239A1 (en) * | 2015-11-09 | 2017-05-11 | Sii Printek Inc. | Manufacturing method of liquid jet head, liquid jet head, and liquid jet apparatus |
| US20170334204A1 (en) * | 2016-05-23 | 2017-11-23 | Toshiba Tec Kabushiki Kaisha | Inkjet head, inkjet printer and manufacturing method of inkjet head |
| US9969163B2 (en) | 2015-11-12 | 2018-05-15 | Canon Kabushiki Kaisha | Liquid discharge head |
| US20190255847A1 (en) | 2018-02-20 | 2019-08-22 | Toshiba Tec Kabushiki Kaisha | Ink jet head and ink jet printer |
| US10611148B2 (en) | 2018-02-20 | 2020-04-07 | Toshiba Tec Kabushiki Kaisha | Ink jet head and ink jet printer |
| US20200180311A1 (en) * | 2018-12-06 | 2020-06-11 | Sii Printek Inc. | Head chip, liquid jet head, and liquid jet recording device |
| US10814616B2 (en) | 2018-02-20 | 2020-10-27 | Toshiba Tec Kabushiki Kaisha | Inkjet head, inkjet printer, and manufacturing method for inkjet head |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2658657B2 (en) | 1991-09-03 | 1997-09-30 | 三菱電機株式会社 | Thermal head and its driving IC |
| JP6352786B2 (en) | 2014-11-28 | 2018-07-04 | 京セラ株式会社 | Thermal head and thermal printer equipped with the same |
-
2022
- 2022-02-21 JP JP2022024419A patent/JP7713895B2/en active Active
- 2022-12-20 US US18/085,394 patent/US12343989B2/en active Active
-
2023
- 2023-02-02 EP EP23154780.3A patent/EP4230421B1/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010033304A1 (en) * | 1994-10-20 | 2001-10-25 | Hiroyuki Ishinaga | Elements substrate having connecting wiring between heat generating resistor elements and ink jet recording apparatus |
| JP2001179995A (en) | 1999-12-28 | 2001-07-03 | Kyocera Corp | Method of manufacturing inkjet head |
| US20030156163A1 (en) * | 2001-10-02 | 2003-08-21 | Matsushita Electric Industrial Co., Ltd. | Ferroelectric element and actuator using the same, and ink jet head and ink jet recording device |
| US20080100683A1 (en) * | 2006-10-27 | 2008-05-01 | Konica Minolta Ij Technologies, Inc. | Inkjet head |
| US20080186342A1 (en) * | 2007-02-05 | 2008-08-07 | Brother Kogyo Kabushiki Kaisha | Inkjet recording apparatus, manufacturing method of inkjet head, and checking method of the head |
| JP2008188888A (en) | 2007-02-05 | 2008-08-21 | Brother Ind Ltd | Inkjet head manufacturing method, inkjet head inspection method, and inkjet recording apparatus |
| US20110032311A1 (en) * | 2009-08-07 | 2011-02-10 | Toshiba Tec Kabushiki Kaisha | Inkjet print head and method of manufacture therefor |
| JP2012139918A (en) | 2010-12-28 | 2012-07-26 | Seiko Epson Corp | Method for manufacturing liquid jetting head, liquid jetting head, and liquid jetting apparatus |
| US20130050338A1 (en) * | 2011-08-26 | 2013-02-28 | Toshiba Tec Kabushiki Kaisha | Inkjet head and method of manufacturing the inkjet head |
| US20170129239A1 (en) * | 2015-11-09 | 2017-05-11 | Sii Printek Inc. | Manufacturing method of liquid jet head, liquid jet head, and liquid jet apparatus |
| US9969163B2 (en) | 2015-11-12 | 2018-05-15 | Canon Kabushiki Kaisha | Liquid discharge head |
| US20170334204A1 (en) * | 2016-05-23 | 2017-11-23 | Toshiba Tec Kabushiki Kaisha | Inkjet head, inkjet printer and manufacturing method of inkjet head |
| US20190255847A1 (en) | 2018-02-20 | 2019-08-22 | Toshiba Tec Kabushiki Kaisha | Ink jet head and ink jet printer |
| US10611148B2 (en) | 2018-02-20 | 2020-04-07 | Toshiba Tec Kabushiki Kaisha | Ink jet head and ink jet printer |
| US10618281B2 (en) | 2018-02-20 | 2020-04-14 | Toshiba Tec Kabushiki Kaisha | Ink jet head and ink jet printer |
| US10814616B2 (en) | 2018-02-20 | 2020-10-27 | Toshiba Tec Kabushiki Kaisha | Inkjet head, inkjet printer, and manufacturing method for inkjet head |
| US20200180311A1 (en) * | 2018-12-06 | 2020-06-11 | Sii Printek Inc. | Head chip, liquid jet head, and liquid jet recording device |
Non-Patent Citations (2)
| Title |
|---|
| Extended European Search Report dated Jul. 11, 2023, mailed in counterpart European Application No. 23154780.3, 45 pages. |
| U.S. Appl. No. 17/834,601, filed Jun. 7, 2022. |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7713895B2 (en) | 2025-07-28 |
| US20230264470A1 (en) | 2023-08-24 |
| EP4230421B1 (en) | 2024-12-11 |
| JP2023121217A (en) | 2023-08-31 |
| EP4230421A1 (en) | 2023-08-23 |
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