JP2013121694A - Circuit member, head and device for ejecting liquid - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow easy inspection of a connection state between multiple electrodes 6 formed on a substrate 3 and multiple wires 8 formed on a flexible board 4.SOLUTION: In a circuit member, a base 3 having on a surface thereof n electrodes 6 arranged in a row and n electrode terminals 7 for inspection arranged in the vicinity thereof and a flexible board 4 having on a first surface thereof n electrodes 6 arranged in a row and n electrode terminals 7 for inspection arranged in the vicinity thereof are disposed opposite and joined to each other via an anisotropic conductive material 5, and n connection points in which the n electrode terminals 7 and n wire terminals 9 are joined and connected are connected in series from inspection wires H. The connection state is determined by applying a voltage to both end parts of the inspection wires H connected in series.

Description

  The present invention relates to a circuit member formed of a base and a flexible substrate bonded to the base, and a liquid ejecting head and a liquid ejecting apparatus using the circuit member.

  In recent years, in many electronic devices, a large number of electrodes formed on a substrate surface and a large number of wirings formed on a flexible substrate are electrically connected via an anisotropic conductive film. Recently, the pitch between the electrodes is narrow, and a large number of 100 or more electrodes and a large number of wirings are simultaneously connected by thermocompression bonding. However, with the narrowing of the pitch between electrodes and the increase in the number of electrodes, the frequency of occurrence of connection failures is increasing. Therefore, if it is possible to easily determine the quality of the connected state after thermocompression bonding the electrode and the wiring through the anisotropic conductive film, than when performing the quality determination of the connected state after assembling other parts, It is possible to prevent waste of assembly man-hours due to poor connection.

  An ink jet head is one that requires connection of a large number of electrodes at such a narrow pitch. In recent years, ink jet heads have been increasingly narrowed in pitch and nozzles for ejecting ink, and electrodes for supplying drive signals to pressure chambers for ejecting ink droplets have also been narrowed in pitch and number. For example, the electrode pitch is 100 μm to 50 μm, and several hundreds or more electrodes are collectively and electrically connected simultaneously.

  FIGS. 16 and 17 are an exploded perspective view and a schematic cross-sectional view of a part of the inkjet head chip 126 described in Patent Document 1. FIG. The inkjet head chip 126 is bonded to a piezoelectric ceramic plate 144 in which a number of long grooves 145 are formed in parallel, an ink chamber plate 155 bonded to the piezoelectric ceramic plate 144, and an end of the piezoelectric ceramic plate 144, and a nozzle opening 152 is formed. The nozzle plate 151 is formed. Each long groove 145 is partitioned by a side wall 146, and a drive electrode portion 150 is formed on a side surface of each side wall 146. Each long groove 145 includes a front flat surface 144a, an inclined surface 144b that gradually decreases from the rear portion of the front flat surface 144a toward the rear side, and a rear flat surface 144c that extends from the rear portion of the inclined surface 144b toward the rear side. . The drive electrode portion 150 extends on the rear flat surface 144 c and is electrically connected to the wire 147.

  The inkjet head chip 126 is driven as follows. Ink is supplied to the opening 156 of the ink chamber plate 155 and the long groove 145 is filled with ink. Then, the drive signal given to the wire 147 is applied to the drive electrode portion 150 of the side wall 146, and the side wall 146 is sheared to change the volume of the long groove 145. Thereby, the ink filled in the long groove 145 is ejected as an ink droplet from the nozzle opening 152 communicating with the long groove 145.

  Here, as the wire 147, a wiring formed on a flexible substrate is usually used. A large number of electrode terminals are formed on the rear flat surface 144c of the piezoelectric ceramic plate 144 opposite to the nozzle plate 151 to be electrically connected to the drive electrode portions 150 installed in the long grooves 145. This electrode terminal has the number of the long grooves 145 (or twice the number thereof) and becomes the arrangement pitch of the long grooves 145 (or twice the arrangement pitch thereof). A substrate provided with the same number of wirings at the same pitch on the electrode terminals, for example, a flexible substrate, is joined via an anisotropic conductive film, and a large number of electrode terminals and a large number of wirings are electrically connected simultaneously. A sealing portion 148 is installed at the end of the ink chamber plate 155 to prevent leakage of ink filled in the long groove 145.

  Further, a detection electrode 160 is formed on the bottom surface of the piezoelectric ceramic plate 144 opposite to the surface on which the long groove 145 is formed. The detection electrode 160 is used to determine whether or not the electrical connection between the electrode terminal and the wire 147 (wiring of the flexible substrate) is good. That is, a capacitor that sandwiches the bottom of the piezoelectric ceramic plate 144 is configured between the drive electrode unit 150 and the detection electrode 160 installed on the side wall 146. When an inspection signal is applied to the drive electrode unit 150 via the wire 147, the detection electrode 160 detects whether the inspection signal has reached the drive electrode unit 150 normally. A dedicated voltage detection circuit for connection state inspection is provided, and an inspection signal is selectively given sequentially to each wire 147 (each wiring of the flexible substrate) to detect a signal appearing on the detection electrode 160, and this is amplified, and the wire The quality of the electrical connection between 147 (wiring of the flexible substrate) and the electrode terminal on the piezoelectric ceramic plate 144 is determined.

JP 2008-230222 A

  In the conventional method, the circuit is completed by connecting the flexible substrate to the base, and the circuit is actually driven to inspect the electrical connection state between the wiring of the flexible substrate and the electrode terminal of the base. That is, not only the connection state is inspected immediately after the flexible substrate is connected, but the drive circuit and the detection circuit are connected and assembled into a drivable state, and then actually driven sequentially to inspect the connection state. Therefore, when a connection failure is found, the number of assembly steps for assembling a finished product is wasted compared to the case where inspection is possible immediately after connecting the flexible substrate.

  Further, in the determination method disclosed in Patent Document 1, a dedicated voltage detection circuit for determining whether the connection state is good or bad must be formed. Further, in the pass / fail judgment inspection, after the inkjet head chip 126 is actually assembled to a state where droplets can be ejected, the drive signal is switched to the inspection signal and the inspection is performed. Therefore, when a connection failure is found, the number of assembling steps assembled to a dischargeable state is wasted compared to the case where the inspection can be performed immediately after connecting the flexible substrate as in the conventional method.

  In order to eliminate the waste of assembly man-hours, instead of connecting one end of the flexible board to the inkjet head chip 126 and then connecting the other end of the flexible board to the circuit board for actual driving. The inspection can be performed by pressing against an inspection jig substrate on which electrodes corresponding to the number of nozzles are formed. In this case, an inspection signal is applied to each electrode of the flexible substrate from the inspection jig substrate to inspect one nozzle at a time. As a result, the connection state between the flexible substrate and the inkjet head chip 126 can be inspected without connecting the actual drive circuit board. However, it is necessary to align each electrode of the flexible substrate and each electrode of the inspection jig substrate using a microscope or the like, and it takes time for alignment and an electrode alignment jig equipped with a microscope or the like, or one nozzle A dedicated inspection device for supplying and detecting inspection signals is required one by one, the inspection process is complicated and time consuming, and productivity is inevitably low and high cost.

  Further, in the case of a conventional ink jet head, when a missing dot occurs, the apparatus cannot determine whether it is due to dust or filling failure (bubbles) or due to poor electrical connection. Therefore, when a dot dropout occurs, an attempt is made to restore by flowing ink. However, if the cause of the dot dropout is a poor electrical connection, the ink is wasted for the return.

  INDUSTRIAL APPLICABILITY According to the present invention, in a circuit member in which a large number of electrical connection portions are formed by joining a flexible substrate on which a large number of wirings are formed to a base on which a large number of electrodes are formed, the electrical connection state can be easily inspected. Provide structure.

  The circuit member of the present invention includes a substrate having n electrodes (n is an integer of 2 or more) arranged in a row and n electrode terminals for inspection installed in the vicinity of the electrodes on the surface. A flexible board having n wirings arranged in a row and n wiring terminals for inspection installed in the vicinity of each of the wirings on a first surface, and the n electrode terminals The n number of connection points to which the n number of wiring terminals are joined and connected are counted in order, and the kth connection point (k is an integer not less than 1 and not more than (n−1)) is defined as the kth connection point. The k-th inspection wiring that electrically connects the k-th connection point and the (k + 1) -th connection point is formed on one or both of the base body and the flexible substrate.

  Further, the k-th inspection wiring with an even number k is formed on one of the base and the flexible substrate, and the k-th inspection wiring with an odd k is formed on the other.

  The k-th inspection wiring formed on the base is formed on the end surface of the base.

  Further, a groove is formed between the kth electrode terminal and the (k + 1) th electrode terminal on the surface of the base, and the kth inspection wiring is formed on the inner surface of the groove. .

  The electrode terminal is at least partially surrounded by the single electrode.

  Further, the k-th inspection wiring of the flexible substrate is installed on a second surface opposite to the first surface, and the wiring terminal connected to the k-th connection point and the (k + 1) -th connection point; The k-th inspection wiring is electrically connected through a through electrode penetrating the flexible substrate.

  Further, an additional wiring straddling the (k + 1) -th inspection wiring installed on the substrate is installed on the second surface, and the additional wiring is connected to the wiring via a through electrode penetrating the flexible substrate. I decided to do it.

  Each of the wiring terminals has a first wiring terminal and a second wiring terminal that are separated from each other, and the kth connection point electrically connects the kth electrode terminal and the kth first wiring terminal. The k-th inspection wiring having an odd number k and k-th connection point electrically connecting the k-th electrode terminal and the k-th second wiring terminal. Electrically connects the k1 connection point and the (k + 1) 1 connection point, and the k-th inspection wiring having an even number k is the k2 connection point and the (k + 1) 2 connection point. Are electrically connected to each other.

  The k-th inspection wiring is formed on the flexible substrate.

  The k-th inspection wiring is installed on the second surface opposite to the first surface, and the k-th and (k + 1) -th wiring terminals and the k-th inspection wiring are formed on the flexible substrate. Electrical connection is made through a penetrating electrode that penetrates.

  The electrode terminal is at least partially surrounded by the single electrode.

  In addition, the base and the flexible substrate include n electrodes, n wires, and n electrode terminals and n wire terminals with an anisotropic conductive material interposed therebetween, respectively. It was decided to be joined facing each other.

  The liquid ejecting head according to the aspect of the invention includes any one of the circuit members described above, and the flexible substrate supplies a driving signal generated by a driving circuit to the n electrodes through the n wires. The substrate is provided with a pressure chamber for discharging liquid, and the driving signal is supplied to the pressure chamber via the n electrodes.

The liquid ejecting apparatus according to the aspect of the invention includes the liquid ejecting head, a moving mechanism that reciprocates the liquid ejecting head, a liquid supply pipe that supplies the liquid to the liquid ejecting head, and the liquid that is supplied to the liquid supply pipe. And a liquid tank.
Liquid jet head.

  The circuit member of the present invention comprises a substrate having n (n is an integer of 2 or more) electrodes arranged in a row and n electrode terminals for inspection installed in the vicinity of each electrode on the surface, And a flexible substrate having n wirings arranged in a row and n wiring terminals for inspection installed in the vicinity of each wiring on the first surface. The n number of connection points where the n electrode terminals and the n wiring terminals are joined and connected to each other are counted in order, kth (k is an integer not less than 1 and not more than (n−1)) th. With the connection point as the kth connection point, the kth inspection wiring for electrically connecting the kth connection point and the (k + 1) th connection point is formed on one or both of the base and the flexible substrate.

  With this configuration, if the electrical connection state between the inspection wiring connected to the first connection point and the inspection wiring connected to the nth connection point is inspected, the n electrodes and the n wirings Since each connection between them is inspected at once, the inspection of the connection state becomes very simple.

It is explanatory drawing of the circuit member which concerns on 1st embodiment of this invention. It is a partial top view of the circuit member concerning a first embodiment of the present invention. It is a longitudinal cross-sectional schematic diagram of part AA of the circuit member which concerns on 1st embodiment of this invention. It is explanatory drawing of the circuit member which concerns on 2nd embodiment of this invention. It is a fragmentary top view of the circuit member which concerns on 2nd embodiment of this invention. It is a longitudinal cross-sectional schematic diagram of the part BB of the circuit member which concerns on 2nd embodiment of this invention. It is a partial top view before joining the base | substrate and flexible substrate of the circuit member which concerns on 3rd embodiment of this invention. It is a fragmentary top view of the circuit member which concerns on 3rd embodiment of this invention. It is a longitudinal cross-sectional schematic diagram of the part CC of the circuit member which concerns on 3rd embodiment of this invention. It is a partial top view before joining the base | substrate and flexible substrate of the circuit member which concerns on 4th embodiment of this invention. It is a fragmentary top view of the circuit member which concerns on 4th embodiment of this invention. It is a longitudinal cross-sectional schematic diagram of the part DD of the circuit member which concerns on 4th embodiment of this invention. It is a top view of the flexible substrate which comprises the circuit member of this invention. FIG. 9 is a schematic perspective view of a liquid jet head according to a fifth embodiment of the present invention. FIG. 10 is a schematic perspective view of a liquid ejecting apparatus according to a sixth embodiment of the present invention. It is a disassembled perspective view of a part of conventionally well-known inkjet head chip. It is a cross-sectional schematic diagram of a conventionally well-known inkjet head chip.

  The circuit member of the present invention includes a base and a flexible substrate joined to the base via an anisotropic conductive material. The base body has n (n is an integer of 2 or more) electrodes arranged in a row on the surface, and n electrode terminals for inspection installed in the vicinity of each electrode. The flexible substrate has n wirings arranged in a row on the first surface, and n wiring terminals for inspection installed in the vicinity of each wiring. Further, n connection points where n electrode terminals and n wiring terminals are joined and connected are counted in order, and the k-th (k is an integer not less than 1 and not more than (n−1)) is k-th. As a connection point, a k-th inspection wiring that electrically connects the k-th connection point and the (k + 1) -th connection point is formed on one or both of the base body and the flexible substrate.

  When the electrode formed on the substrate and the wiring formed on the flexible substrate are electrically connected through, for example, an anisotropic conductive material, the flexible substrate is partially peeled from the substrate surface, or a connection failure occurs due to a bonding failure. There is a case. This partial peeling or poor bonding usually occurs in a region wider than the electrode width than a minute region narrower than the electrode width. Therefore, by forming an electrode terminal or wiring terminal for monitoring in the immediate vicinity of the electrode or wiring to be electrically connected and inspecting the connection state between the electrode terminal and the wiring terminal, the base electrode and the flexible substrate The electrical connection between the wires can be monitored. Since the monitoring accuracy increases as the inspection electrode terminal or wiring terminal approaches the electrode or wiring, the monitoring accuracy improves as the pitch or width of the electrode or wiring decreases.

  In the present invention, an inspection electrode terminal and a wiring terminal are formed in the immediate vicinity of an electrode to be connected and a wiring, and a connection point between the electrode terminal and the wiring terminal is connected in series by the inspection wiring. A voltage is applied to both ends of the plurality of inspection wirings connected in series to detect the connection state. If there is a defective connection point at one of the plurality of connection points, both ends of the inspection wiring connected in series are disconnected, so that it can be determined that the connection is defective. Therefore, since each connection between the n electrodes and the n wires is inspected at a time, the inspection of the connection state becomes extremely simple. Hereinafter, the present invention will be described in detail with reference to the drawings.

(First embodiment)
1-3 is a figure for demonstrating the circuit member 1 which concerns on 1st embodiment of this invention. FIG. 1A is a partial plan view before joining the base 3 and the flexible substrate 4, and FIG. 1B is a schematic perspective view of the base 3. FIG. 2 is a partial plan view in which the base body 3 and the flexible substrate 4 are joined via the anisotropic conductive material 5, and FIG. 3 is a schematic longitudinal sectional view of the portion AA seen from the direction of the arrow.

The k-th electrode 6 counted in the arrangement order is represented as an electrode 6 _k , and the electrode terminal 7 installed in the vicinity of the electrode 6 _k is represented as an electrode terminal 7 _k . As shown in FIG. 1 (a), the substrate 3, test a plurality of electrodes 6 _k ~6 _k + ₅ to be arranged in rows on the surface, it is installed in each vicinity of the electrode 6 _k ~6 _k + ₅ A plurality of electrode terminals 7 _{k to} 7 _{k + 5,} and (k + 1) -th inspection wiring H _{k + 1} electrically connecting the electrode terminal 7 _{k + 1} and the electrode terminal 7 _{k + 2} and the electrode terminal 7 _k And (k + 3) -th inspection wiring H _{k + 3} that electrically connects ₊₃ and the electrode terminal 7 _{k + 4} . As shown in FIG. 1B, the electrode terminal 7 _{k + 1} and the electrode terminal 7 _{k + 2} are electrically connected via an inspection wiring H _{k + 1} formed on the end face of the base 3. Similarly, the electrode terminal 7 _{k + 3} and the electrode terminal 7 _{k + 4} are electrically connected by an inspection wiring H _{k + 3} formed on the end face of the base 3. The other electrode terminals 7 _{k + 5} , 7 _{k + 6} , inspection wiring H _{k + 5} ... Are connected in the same manner.

K-th marked wiring 8 and the wiring 8 _k counted in sorted, mark the wiring terminals 9 installed in the vicinity of the wiring 8 _k and the wiring terminal 9 _k. The flexible substrate 4 includes a plurality of wires 8 _{k + 1} ~8 _{k + 5} to be arranged in rows on the first surface F1 of the inner side toward the paper surface to be bonded with the substrate 3, the wiring 8 _{k + 1} ~8 _k A plurality of inspection wiring terminals 9 _{k to} 9 _{k + 5} are provided near each of ₊₅ . The conductive pattern formed on the first surface F1 (see FIG. 3) below the paper surface is represented by a solid line. The wirings 8 _k to 8 _{k + 5} are arranged at the same pitch as the electrodes 6 _{k to} 6 _{k + 5} so as to overlap the electrodes 6 _{k to} 6 _{k + 5} when bonded to the base 3. Similarly, the wiring terminals 9 _{k to} 9 _{k + 5} are arranged at the same pitch so as to overlap the electrode terminals 7 _{k to} 7 _{k + 5} when bonded to the base 3. Each of the wiring terminals 9 _{k to} 9 _{k + 5} is formed on the upper side of the lower edge of the flexible substrate 4, and each of the wirings 8 _{k + 1} to 8 _{k + 5} is bent so as to pass between the two wiring terminals. Has a shape.

The flexible substrate 4 has a k-th inspection wiring H _k formed so as to straddle the wiring 8 _{k + 1} on the first surface F1 on the second surface F2 (see FIG. 3) above the paper surface as indicated by a broken line. . The k-th inspection wiring H _k is electrically connected to the wiring terminal 9 _k and the wiring terminal 9 _{k + 1} installed on the first surface F1 through the through electrode 12 (see FIG. 3). Similarly, the flexible substrate 4 has the (k + 2) inspection wiring H _{k + 2} formed on the second surface F2 so as to straddle the wiring 8 _{k + 3} of the first surface F1, and the (k + 2) inspection. The wiring H _{k + 2} is electrically connected to the wiring terminal 9 _{k + 2} and the wiring terminal 9 _{k + 3} through a through electrode 12 (see FIG. 3) (not shown). Other inspection wiring lines H _{k + 4} , wiring terminals 9 _{k + 4} , wiring terminals 9 _{k + 5} ... Are formed in the same manner.

  Conductive patterns to be formed on the surface of the substrate 3 and the first and second surfaces of the flexible substrate 4 are formed by depositing a conductive material such as metal by sputtering, vapor deposition, plating, or the like, and using this as photolithography and etching. It can be formed by patterning, etc.

As shown in FIGS. 2 and 3, the flexible substrate 4 is bonded to the upper surface of the base 3 via an anisotropic conductive material 5. As a result, the electrodes 6 _{k to} 6 _{k + 5} and the wirings 8 _k to 8 _{k + 5} are electrically connected to each other through the anisotropic conductive material 5. The electrode terminals 7 _{k to} 7 _{k + 3} and the wiring terminals 9 _{k to} 9 _{k + 3} are electrically connected to each other through the anisotropic conductive material 5, and the electrode terminals 7 _k and the wiring terminals 9 _k are connected. the connection point as a k connecting point S _k, the k connection point to the sorted S _k ~ the (k + 3) connecting point S _{k + 3} · · · are formed. The inspection wiring is the k-th inspection wiring Hk formed on the flexible substrate 4, the (k + 1) -th inspection wiring H _{k + 1} formed on the base 3, and the (k + 2) -th inspection wiring formed on the flexible substrate 4. The wiring H _{k + 2} , the (k + 3) inspection wiring H _{k + 3} formed on the base 3, the (k + 4) inspection wiring H _{k + 4} ... Formed on the flexible substrate 4 are connected in series. Will be.

As a result, the electrodes 6 _{k + 1 to} 6 _{k + 4} and the wiring 8 _k are inspected by checking the electrical connection state between the k-th inspection wiring H _k and the (k + 4) inspection wiring H _{k + 4.} The respective electrical connection states of ₊₁ to 8 _{k + 4} can be determined. If the k-th inspection wiring H _k and the (k + 4) inspection wiring H _{k + 4} are disconnected, the electrodes 6 _{k + 1 to} 6 _{k + 4} and the wirings 8 _{k + 1} to 8 _{k + 4} are connected. It can be determined that there is an electrical connection failure at any location in each connection. For example, even when the base 3 on which 100 or more (k> 100) electrodes 6 are formed and the flexible substrate 4 on which 100 or more wirings 8 are formed are joined, the electrical connection of the inspection wirings at both ends is performed. By inspecting the state, it is possible to determine the quality of the electrical connection at all 100 or more connection points by a single inspection.

As described above, in the first embodiment, when the k-th inspection wiring H _k with k being an even number (odd number) is formed on one of the base 3 and the flexible substrate 4, k is an odd number (even number) on the other side. ) K-th inspection wiring H _k is formed. Since the (k + 1) -th inspection wiring H _{k + 1} , the (k + 3) inspection wiring H _{k + 3} ,... Are formed on the end face of the base 3, the base 3 and the flexible substrate 4 are anisotropic. Even if they are joined through the conductive material 5, they are not electrically connected to the wirings 8 _{k + 2} , 8 _{k + 4} . The k-th inspection wiring H _k of the flexible substrate 4 is installed on the second surface F2 opposite to the first surface F1, and the wiring terminals 9 _k and 9 _{k + 1} formed on the first surface F1. Since the connection is made through the through electrode 12, the wiring 8 _{k + 1} can be straddled without being electrically connected. Other (k + 2) inspection wiring H _{k + 2} , wiring terminal 9 _{k + 2} , wiring terminal 9 _{k + 3} , and (k + 4) inspection wiring H _{k + 4} , wiring terminal 9 _{k + 4} , wiring terminal The same applies to 9 _{k + 5} .

(Second embodiment)
4-6 is a figure for demonstrating the circuit member 1 which concerns on 2nd embodiment of this invention. FIG. 4A is a partial plan view before the base 3 and the flexible substrate 4 are joined, and FIG. 4B is a schematic perspective view of the base 3. FIG. 5 is a partial plan view in which the base 3 and the flexible substrate 4 are joined via the anisotropic conductive material 5, and FIG. 6 is a schematic longitudinal sectional view of the portion BB as seen from the direction of the arrow. The portions different from the first embodiment are formed on the surface of the substrate 3 with grooves M _{k + 1} , M _{k + 3} , M _{k + 5} ..., And the grooves M _{k + 1} , M _{k + 3} , M _{k +.} ... ( ₅ + 1) inspection wiring H _{k + 1} , (k + 3) inspection wiring H _{k + 3} , (k + 5) inspection wiring H _{k + 5} ... Are formed, and the electrode terminals 7 _k , 7 _{k + 1} , 7 _{k + 2} ... Of the substrate 3 have electrodes 6 _k , 6 _{k + 1} , 6. It is a point surrounded by _{k + 2} ... Other basic configurations are the same as those of the first embodiment.

As shown in FIG. 4A, the base 3 is inspected in the vicinity of a plurality of electrodes 6 _{k to} 6 _{k + 5} and electrodes 6 _{k to} 6 _{k + 5} arranged in a line on the surface. Electrode terminals 7 _{k to} 7 _{k + 5} . Each of the electrode terminals 7 _{k to} 7 _{k + 5} is surrounded by more than half of the circumference by the electrodes 6 _{k to} 6 _{k + 5} that are adjacent to each other. As shown in FIG. 4B, between the electrode 6 _{k + 1} and the electrode 6 _{k + 2} , between the electrode 6 _{k + 3} and the electrode 6 _{k + 4} , and between the electrode 6 _{k + 5} and the electrode 6 _{k + 6} . Between them, grooves M _{k + 1} , M _{k + 3} , M _{k + 5} are formed, respectively. These grooves _{M k + 1, M k +} 3, M k + respectively on both side and bottom surfaces of ₅ the (k + 1) inspection wire H _{k + 1,} the (k + 3) test wiring H _{k + 3,} the ( k + 5) Inspection wiring H _{k + 5} is formed, and electrode terminal 7 _{k + 1} and electrode terminal 7 _{k + 2} , electrode terminal 7 _{k + 3} and electrode terminal 7 _{k + 4} , and electrode terminal 7 _{k + 5} and The electrode terminals 7 _{k + 6} are electrically connected to each other.

The basic configuration of the flexible substrate 4 is the same as that of the first embodiment. The wiring terminals 9 _{k to} 9 _{k + 5} of the flexible substrate 4 have a circular shape having substantially the same size as the electrode terminals 7 _{k to} 7 _{k + 5} of the base 3. The wirings 8 _k to 8 _{k + 5} of the flexible substrate 4 are arranged at the same pitch as the electrodes 6 _{k to} 6 _{k + 5} so as to overlap the electrodes 6 _{k to} 6 _{k + 5} when bonded to the base 3. Similarly, the wiring terminals 9 _{k to} 9 _{k + 5} are arranged in substantially the same shape and at the same pitch so as to overlap the electrode terminals 7 _{k to} 7 _{k + 5} when bonded to the base 3. Each of the wiring terminals 9 _{k to} 9 _{k + 5} is formed on the upper side of the lower edge of the flexible substrate 4, and each of the wirings 8 _{k + 1} to 8 _{k + 5} is bent so as to pass between the two wiring terminals. Has a shape.

As shown in FIGS. 5 and 6, the flexible substrate 4 is bonded to the upper surface of the base 3 via an anisotropic conductive material 5. As a result, each of the electrodes 6 _{k to} 6 _{k + 5} and each of the wirings 8 _k to 8 _{k + 5} are electrically connected via the anisotropic conductive material 5. In addition, each of the electrode terminals 7 _{k to} 7 _{k + 5} and each of the wiring terminals 9 _{k to} 9 _{k + 5} are electrically connected via the anisotropic conductive material 5, and the k-th connection point S _k to A (k + 5) th connection point S _{k + 5} is formed. The inspection wiring is the k-th inspection wiring H _k formed on the flexible substrate 4, the (k + 1) -th inspection wiring H _{k + 1} formed on the base 3, and the (k + 2) -th inspection formed on the flexible substrate 4. Wiring line H _{k + 2} , (k + 3) inspection line H _{k + 3} formed on base 3, and (k + 4) inspection line H _{k + 4} formed on flexible substrate 4 are connected in series. become.

As a result, the electrodes 6 _{k + 1 to} 6 _{k + 5} and the wiring 8 _{k +} are inspected by inspecting the electrical connection state between the k-th inspection wiring Hk and the (k + 5) inspection wiring H _{k + 5.} Each electrical connection state of ₁ to 8 _{k + 5} can be confirmed. If the k-th inspection wiring H _k and the (k + 5) inspection wiring H _{k + 5} are disconnected, the electrodes 6 _{k + 1 to} 6 _{k + 5} and the wirings 8 _{k + 1} to 8 _{k + 5} are connected. It can be determined that there is an electrical connection failure at any location in each connection.

In the second embodiment, each of the electrode terminals 7 _{k to} 7 _{k + 5} is at least partially surrounded by each of the electrodes 6 _{k to} 6 _{k + 5} (substantially half the circumference in FIG. 5). The inspection accuracy is improved as a monitor for detecting a disconnection state between 6 and the wiring 8.

In addition, although each groove | channel _{Mk + 1} , groove | channel _{Mk + 3} , groove | channel _{Mk + 5} ... is formed in parallel with the electrode 6, this invention is not limited to this, The (k + 1) test | inspection is carried out. The wiring H _{k + 1} , the (k + 3) inspection wiring H _{k + 3} , the (k + 5) inspection wiring H _{k + 5} ... In addition, when a large number of grooves are formed on the surface of the piezoelectric substrate, and a head chip for liquid ejection that drives the large number of grooves as pressure chambers is formed, electrode terminals for inputting drive signals from outside are formed. These grooves can be extended to the region to be formed, and the inspection wiring can be formed in the extended portion.

(Third embodiment)
7-9 is a figure for demonstrating the circuit member 1 which concerns on 3rd embodiment of this invention. 7 is a partial plan view before the base 3 and the flexible substrate 4 are joined, and FIG. 8 is a partial plan view of the base 3 and the flexible substrate 4 joined via the anisotropic conductive material 5. FIG. 4 is a schematic longitudinal sectional view of a portion CC viewed from the direction of an arrow.

The difference from the first embodiment is that the (k + 1) -th inspection wiring H _{k + 1} and the (k + 3) inspection wiring H _{k + 3} formed on the base 3 are installed on the surface near the end of the base 3. It is a point. Further, a region where the wiring 8 _{k + 2} of the flexible substrate 4 straddles the (k + 1) -th inspection wiring H _{k + 1} of the base 3 and a wiring 8 _{k + 4} straddles the (k + 3) -th inspection wiring H _{k + 3} . The additional wirings 10 _{k + 2} and 10 _{k + 4} are respectively installed in the regions, the (k + 1) -th inspection wiring H _{k + 1} and the wiring 8 _{k + 2} and the (k + 3) -th inspection wiring H _{k + 3.} And the wiring 8 _{k + 4} are electrically separated.

The substrate 3 has, on its surface, a plurality of electrodes 6 _{k to} 6 _{k + 5} arranged in rows and a plurality of electrode terminals 7 _k to 7 _k for inspection installed in the vicinity of the electrodes 6 _{k to} 6 _{k + 5.} 7 _{k + 5} , the inspection wiring H _{k + 1} that electrically connects the electrode terminal 7 _{k + 1} and the electrode terminal 7 _{k + 2} , and the electrode terminal 7 _{k + 3} and the electrode terminal 7 _{k + 4} are electrically connected Inspection wiring H _{k + 3} to be connected to electrode electrode 7 _{k + 5} and inspection wiring H _{k + 5} to electrically connect electrode terminal 7 _{k + 6 (} not shown).

The flexible substrate 4 is arranged in the vicinity of each of the plurality of wirings 8 _k to 8 _{k + 5} and the wirings 8 _{k + 1} to 8 _{k + 5} arranged in a row on the first surface F1 below the paper surface joined to the base 3. A plurality of inspection wiring terminals 9 _{k to} 9 _{k + 5} are provided. The wirings 8 _k to 8 _{k + 5} are arranged at the same pitch as the electrodes 6 _{k to} 6 _{k + 5} so as to overlap the electrodes 6 _{k to} 6 _{k + 5} when bonded to the base 3. Similarly, the wiring terminals 9 _{k to} 9 _{k + 5} are arranged at the same pitch so as to overlap the electrode terminals 7 _{k to} 7 _{k + 5} when bonded to the base 3. Each of the wiring terminals 9 _{k to} 9 _{k + 5} is formed on the upper side with respect to the lower side end portion of the flexible substrate 4. Each wiring 8 _k , 8 _{k + 2} , 8 _{k + 4} has a bent shape so as to pass between two wiring terminals.

The flexible substrate 4 has a first k inspection wiring line H _k so as to straddle the wire 8k + 1 of the first surface F1 as indicated by a broken line in the second surface F2. The k-th inspection wiring H _k is electrically connected to the wiring terminal 9 _k and the wiring terminal 9 _{k + 1} installed on the first surface F ₁ through the through electrode 12. Similarly, the flexible substrate 4 has the (k + 2) inspection wiring H _{k + 2} formed on the second surface F2 so as to straddle the wiring 8 _{k + 3} of the first surface F1, and the (k + 2) inspection. The wiring H _{k + 2} is electrically connected to the wiring terminal 9 _{k + 2} and the wiring terminal 9 _{k + 3} through the through electrode 12. The (k + 4) -th inspection wiring H _{k + 4} ... Is formed in the same manner.

Further, the wiring 8 _{k + 2} is removed from the first surface F1 in the region intersecting with the (k + 1) -th inspection wiring H _{k + 1} formed on the base 3, and instead, an additional wiring is formed on the second surface F2. 10 _{k + 2} is formed. The additional wiring 10 _{k + 2} is electrically connected to the wiring 8 _{k + 2} via through electrodes (not shown) at both ends thereof. Similarly, the wiring 8 _{k + 4} is removed from the first surface F1 in the region intersecting with the (k + 3) inspection wiring H _{k + 3} formed on the base 3, and is added to the second surface F2 instead. Wiring 10 _{k + 4} is formed. The additional wiring 10 _{k + 4} is electrically connected to the wiring 8 _{k + 4} via through electrodes (not shown) at both ends thereof. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  Conductive patterns to be formed on the surface of the substrate 3 and the first and second surfaces of the flexible substrate 4 are formed by depositing a conductive material such as metal by sputtering, vapor deposition, plating, or the like, and using this as photolithography and etching. It can be formed by patterning, etc. In particular, any conductor of the substrate 3 is formed on the surface of the substrate 3. This facilitates the formation and patterning of the conductor.

In the second embodiment, grooves M _{k + 1} , M _{k + 3} , M _{k + 5} are formed in the base ₃ , and both side surfaces of each groove M _{k + 1} , groove M _{k + 3} , and groove M _{k + 5} are formed. In addition, the (k + 1) -th inspection wiring H _{k + 1} , the (k + 1) -th inspection wiring H _{k + 3} , and the (k + 5) -th inspection wiring H _{k + 5} are formed on the bottom surface. (K + 1) inspection wiring H _{k + 1} to (k + 5) inspection wiring H _{k + 5} are formed on the surface of the base 3, and wirings 8 _k to 8 _{k +} corresponding to the first surface F1 of the flexible substrate 4 are formed. ₄ is removed, additional wirings 10 _k to 10 _{k + 4} are formed on the second surface F2, and both ends thereof are electrically connected to the wirings 8 _k to 8 _{k + 4} through the through electrodes. It may be configured.

(Fourth embodiment)
FIGS. 10-12 is a figure for demonstrating the circuit member 1 which concerns on 4th embodiment of this invention. FIG. 10 is a partial plan view before the base 3 and the flexible substrate 4 are joined, and FIG. 11A is a partial plan view in which the base 3 and the flexible substrate 4 are joined via the anisotropic conductive material 5. FIG. 11B is a partially enlarged view in which the connection state of the k-th connection point S _k to the (k + 2) -th connection point S _{k + 2} is enlarged, and FIG. 12 is a longitudinal section taken along the dashed line of the part DD. It is a schematic diagram.

In the fourth embodiment, the wiring terminals 9 formed on the flexible substrate 4 have a first wiring terminal 9a and a second wiring terminal 9b that are separated from each other. The k-th connection point S _k is a k-th connection point S _k1 that electrically connects the k-th electrode terminal 7 _k and the k-th first wiring terminal 9 _{ak in the} order of arrangement, and the k-th electrode terminal 7. and _k and k-th second wiring terminal 9b _k having a first k2 connecting point S _k2 electrically connected. Then, k is wiring the k test odd H _k is the a first k1 connecting point S _k1 second (k + 1) 1 connection point S _{(k + 1) 1} and electrically connected, k is an even number k-th The inspection wiring H _k electrically connects the k2 connection point S _k2 and the (k + 1) th connection point S _{(k + 1) 2} . Hereinafter, a specific description will be given with reference to FIGS.

As shown in FIG. 10, the base 3 corresponds to each of the electrodes 6 _{k to} 6 _{k + 5} and the electrodes 6 _{k to} 6 _{k + 5} arranged in a line on the surface, and each of the bases 3 is formed by a single electrode. It has electrode terminals 7 _{k to} 7 _{k + 5} surrounded. The flexible substrate 4 has a plurality of wirings 8 _k arranged in a row on the first surface F1 (the conductive pattern formed on the first surface F1 is represented by a solid line) on the back side toward the paper surface joined to the base 3. To 8 _{k + 5} and a plurality of inspection wiring terminals 9 _{k to} 9 _{k + 5} installed in the vicinity of the wirings 8 _k to 8 _{k + 5} . First wiring terminals 9a _k and and a second wire terminal 9b _k, the first wiring terminal 9a k _{+ 1} and the second wiring terminal 9b wiring terminals 9 _{k + 1} is to be separated from each other wiring terminals 9 _k is to be separated from each other _{k + 1,} and so on. The wirings 8 _k to 8 _{k + 5} are arranged at the same pitch as the electrodes 6 _{k to} 6 _{k + 5} so as to overlap the electrodes 6 _{k to} 6 _{k + 5} when bonded to the base 3. Similarly, the wiring terminals 9 _{k to} 9 _{k + 5} are arranged at the same pitch so as to overlap the electrode terminals 7 _{k to} 7 _{k + 5} when bonded to the base 3. Each of the wiring terminals 9 _{k to} 9 _{k + 5} is formed on the upper side of the lower edge of the flexible substrate 4, and each of the wirings 8 _{k + 1} to 8 _{k + 5} is bent so as to pass between the two wiring terminals. Has a shape.

The flexible substrate 4 includes a k-th inspection wiring H _k to a (k + 4) inspection wiring H _{k + 4} as indicated by a broken line on the second surface F2 above the paper surface. The first k inspection wiring line H _k is formed so as to straddle the wire 8 _{k + 1} formed on the first surface F1, a first wiring terminals 9a _k formed on the first surface F1 via the through electrode 12 (not shown) first One wiring terminal 9a _{(k + 1)} is electrically connected. The (k + 1) -th inspection wiring H _{k + 1} is formed so as to straddle the wiring 8 _{k + 2} formed on the first surface F1, and is formed on the first surface F1 via the through electrode 12 (not shown). 9b _{k + 1} and the second wiring terminal 9b _{k + 2} are electrically connected. The other (k + 2) inspection wiring H _{k + 2} , (k + 3) inspection wiring H _{k + 3} ... Are formed in the same manner.

As shown in FIGS. 11 and 12, the flexible substrate 4 is bonded to the upper surface of the base 3 via an anisotropic conductive material 5. As a result, each of the electrodes 6 _{k to} 6 _{k + 5} and each of the wirings 8 _k to 8 _{k + 5} are electrically connected via the anisotropic conductive material 5. In addition, each of the electrode terminals 7 _{k to} 7 _{k + 5} and each of the wiring terminals 9 _{k to} 9 _{k + 5} are electrically connected via the anisotropic conductive material 5, and the k-th connection point S _k to A (k + 5) th connection point S _{k + 5} is formed.

Here, the k-th wiring terminal 9 _k in the arrangement order has a first wiring terminal 9 _ak and a second wiring terminal 9 b _k that are separated from each other. Furthermore, as shown in FIG. 11B, the k-th connection point S _k in the arrangement order is the k1 connection point S _{k1 where} the first wiring terminal 9 _ak and the electrode terminal 7 _k are electrically connected. And the second wiring terminal 9b _k and the electrode terminal 7 _k have a k2 connection point S _k2 that is electrically connected. The (k + 1) -th, (k + 2) -th... Wiring terminal 9 _{k + 1} , connection point S _{k + 1} .

The k-th inspection wiring H _k formed on the second surface F2 of the flexible substrate 4 is connected to the k1 connection point S _k1 and the (k + 1) 1 connection point S _{(k + 1) 1} through the through-electrodes 12 at both ends. And electrically connect. The (k + 1) -th inspection wiring H _{k + 1} is connected to the (k + 1) -second connection point S _{(k + 1) 2} and the (k + 2) -second connection point S _{(k + 2)} via the through electrodes 12 at both ends. ₂ is electrically connected. The other (k + 3) inspection wiring H _{k + 3} , (k + 4) inspection wiring H _{k + 4} . Accordingly, the k-th inspection wiring Hk with k being an even number (odd number) electrically connects the k1 connection point S _k1 and the (k + 1) th connection point S _{(k + 1) 1,} and k is an odd number ( The (even) k-th inspection wiring H _k electrically connects the k2 connection point S _k2 and the (k + 1) 2 connection point S _{(k + 1) 2} .

As a result, all the inspection wirings are formed on the flexible substrate 4, and the kth inspection wiring _Hk , the (k + 1) th inspection wiring _{Hk + 1} , the (k + 2) th inspection wiring _{Hk + 2} , and the (k + 3) th. ) The inspection wiring H _{k + 3} and the (k + 4) th inspection wiring H _{k + 4} ... Are connected in series. Therefore, the electrodes 6 _{k + 1 to} 6 _{k + 4} and the wiring 8 _{k +} are inspected by checking the electrical connection state between the k-th inspection wiring H _k and the (k + 4) inspection wiring H _{k + 4.} Each electrical connection state of ₁ to 8 _{k + 4} can be determined.

  In this embodiment, since the connection point to be inspected is surrounded by the electrode to be inspected, the monitoring accuracy of the electrical connection state between the electrode 6 of the base 3 and the wiring 8 of the flexible substrate 4 is improved. Further, the conductive film formed on the end face of the substrate 3 can be easily formed without requiring a complicated process such as patterning the conductive film formed on the end surface or forming a groove on the substrate 3 and patterning the electrode formed on the inner wall or bottom surface thereof. it can. In the present embodiment, each electrode terminal 7 is formed so as to be completely surrounded by a single electrode 6, but the present invention is not limited to this, and the electrode terminal 7 may be installed in the vicinity of each electrode 6. In addition, even if each electrode terminal 7 is partially surrounded by the single electrode 6, the effect of the present invention can be obtained.

In each of the above embodiments, the electrode configuration at the end where the arrangement order is k = 1 and the arrangement order is k = n is the 0th 0th inspection wiring H ₀ before the arrangement order is k = 1, and the arrangement. The next (n + 1) -th (n + 1) -th inspection wiring H _{n + 1} in the order of k = n can be used as an extraction electrode for inspection. By inspecting the electrical connection state between the 0th inspection wiring H ₀ and the (n + 1) th inspection wiring H _{n + 1} , the connection state between all the electrodes 6 and the wirings 8 can be changed once. It can be judged by inspection.

  In addition, the structure which electrically connects the wiring terminal 9 with the circuit board 14 shown, for example in FIG. 14 is demonstrated in detail. When the wiring terminal 9 is electrically connected to the circuit board 14, it is preferable to extend the wiring terminal 9 to the end of the flexible board 4 connected to the circuit board 14. This is because when the wiring 8 and the terminal of the circuit board 14 are electrically connected, the wiring terminal 9 and the terminal of the circuit board 14 can be electrically connected simultaneously by the same means. Further, as shown in FIG. 13A, the wiring terminal 9 may be extended and pulled out at both ends in the direction in which the wiring 8 of the flexible substrate 4 is arranged as shown in FIG. Alternatively, the wiring terminal 9 may be drawn out to one end in the arrangement direction. In this case, if the extended wiring terminal 9 needs to straddle the wiring 8, it may be pulled up from the first surface F1 to the second surface F2 using the inspection wiring H. Furthermore, in order to extend the wiring terminal 9 from the second surface F2 to the first surface F1 where the wiring 8 is provided, a through hole can be used. With this configuration, when the wiring 8 and the terminal of the circuit board 14 are electrically connected, the wiring terminal 9 and the terminal of the circuit board 14 can be simultaneously electrically connected by the same means.

  The wiring terminal 9 does not have to be connected to the circuit board 14. For example, it is also possible to provide a land portion having a predetermined range of about 2 to 3 mm on which the wiring terminal 9 is extended and electrically connected on the flexible substrate 4. By bringing the tip of the probe into contact with the land portion, it is possible to confirm the energized state and confirm whether the flexible substrate 4 has been peeled off from the base 3. Whether the circuit board 14 or the probe is used, the inspection voltage may be a predetermined voltage of about 3 to 5 [V].

(Fifth embodiment)
FIG. 14 is a schematic perspective view of the liquid jet head 2 according to the fifth embodiment of the present invention. The liquid ejecting head 2 includes a base 3 made of a piezoelectric material, a cover plate 15 having a liquid supply chamber (not shown) bonded thereto, and a flexible substrate having one end bonded to the end surface of the base 3. 4 and a circuit board 14 to which the other end of the flexible board 4 is joined. A head chip is constituted by the substrate 3 and the cover plate 15, and liquid is discharged from a nozzle hole (not shown) formed in a nozzle plate (not shown) joined to the end face on the left side of the drawing. A driver IC 13 that generates a drive signal for driving the head chip is mounted on the circuit board 14, and the generated drive signal is supplied to the base 3 through the flexible substrate 4.

Here, the configuration of any of the first to fourth embodiments is applied to the electrical connection between the base 3 and the flexible substrate 4. In addition, any of the configurations of the first to fourth embodiments can be applied to the electrical connection between the flexible substrate 4 and the circuit substrate 14. As a result, immediately after the flexible substrate 4 is joined to the base 3 made of a piezoelectric substrate, for example, the electrical connection state between the 0th inspection wiring H ₀ and the (n + 1) th inspection wiring H _{n + 1} is inspected. In this case, each connection between the n electrodes on the substrate 3 and the n wirings on the flexible substrate 4 is collectively checked. Accordingly, the inspection of the connection state is extremely simple.

In this type of liquid jet head 2, the arrangement pitch of electrodes and wiring is 100 μm to 20 μm, and the number of electrodes is 100 or more. Further, the 0th inspection wiring H ₀ and the (n + 1) th inspection wiring H _{n + 1} for inspection can be connected to a control circuit or the like, and the connection state can be inspected by the control circuit or the like. 16 is formed so that the plurality of grooves shown in FIG. 16 extend to the rear end, and an electrode for inputting a drive signal is formed on the upper surface of the rear end of the side wall defining the groove. The configuration of the second embodiment can be applied.

(Sixth embodiment)
FIG. 15 is a schematic perspective view of a liquid ejecting apparatus 30 according to the sixth embodiment of the present invention. The liquid ejecting apparatus 30 includes a moving mechanism 40 that reciprocates the liquid ejecting heads 2 and 2 ′, flow path portions 35 and 35 ′ that supply liquid to the liquid ejecting heads 2 and 2 ′, and flow path portions 35 and 35 ′. Liquid pumps 33 and 33 ′ for supplying liquid and liquid tanks 34 and 34 ′ are provided. Each liquid ejecting head 2, 2 ′ includes a plurality of ejection grooves, and ejects liquid droplets from nozzles communicating with the ejection grooves. The liquid ejecting heads 2 and 2 ′ are the same as those described in the fifth embodiment.

  The liquid ejecting apparatus 30 includes a pair of conveying units 41 and 42 that convey a recording medium 44 such as paper in the main scanning direction, liquid ejecting heads 2 and 2 ′ that eject liquid onto the recording medium 44, and a liquid ejecting head. 2, 2 ′, a carriage unit 43, liquid pumps 33, 33 ′ for supplying the liquid stored in the liquid tanks 34, 34 ′ to the flow path sections 35, 35 ′, and the liquid ejecting head 2, A moving mechanism 40 that scans 2 ′ in the sub-scanning direction orthogonal to the main scanning direction is provided. A control unit (not shown) controls and drives the liquid ejecting heads 2, 2 ′, the moving mechanism 40, and the conveying means 41, 42.

  The pair of conveying means 41 and 42 includes a grid roller and a pinch roller that extend in the sub-scanning direction and rotate while contacting the roller surface. A grid roller and a pinch roller are moved around the axis by a motor (not shown), and the recording medium 44 sandwiched between the rollers is conveyed in the main scanning direction. The moving mechanism 40 couples a pair of guide rails 36 and 37 extending in the sub-scanning direction, a carriage unit 43 slidable along the pair of guide rails 36 and 37, and the carriage unit 43 to move in the sub-scanning direction. An endless belt 38 is provided, and a motor 39 that rotates the endless belt 38 via a pulley (not shown) is provided.

  The carriage unit 43 mounts a plurality of liquid jet heads 2, 2 ′, and discharges four types of liquid droplets, for example, yellow, magenta, cyan, and black. The liquid tanks 34 and 34 'store liquids of corresponding colors and supply them to the liquid jet heads 2 and 2' via the liquid pumps 33 and 33 'and the flow path portions 35 and 35'. Each liquid ejecting head 2, 2 ′ ejects droplets of each color according to the drive signal. An arbitrary pattern is recorded on the recording medium 44 by controlling the timing of ejecting the liquid from the liquid ejecting heads 20 and 20 ′, the rotation of the motor 39 that drives the carriage unit 43, and the conveyance speed of the recording medium 44. I can.

  According to the liquid ejecting apparatus 30 of the present invention, since the electrical connection state between the base 3 constituting the liquid ejecting head 2 and the flexible substrate 4 can be detected on the liquid ejecting apparatus 30 side, a connection failure is discovered early. Since there is no need to perform unnecessary cleaning, there is a merit that ink can be used without wasteful consumption and can be used as a guide for replacement.

DESCRIPTION OF SYMBOLS 1 Circuit member 2 Liquid ejecting head 3 Base | substrate 4 Flexible board 5 Anisotropic conductive material 6 Electrode 7 Electrode terminal 8 Wiring 9 Wiring terminal 10 Additional wiring 12 Through electrode S Connection point H Inspection wiring M Groove F1 1st surface, F2 1st Dihedral

Claims (14)

A substrate having n electrodes (n is an integer of 2 or more) arranged in a row and n electrode terminals for inspection installed in the vicinity of each of the electrodes on the surface;
A flexible substrate having n wirings arranged in a row and n wiring terminals for inspection installed in the vicinity of each of the wirings on the first surface;
The k connection (k is an integer of 1 or more and (n-1) or less) in the order of n connection points where the n electrode terminals and the n wiring terminals are joined and connected. A circuit in which a k-th inspection wiring for electrically connecting the k-th connection point and the (k + 1) -th connection point is formed on one or both of the base and the flexible substrate, with the point being the k-th connection point. Element.   The circuit member according to claim 1, wherein the k-th inspection wiring with an even number k is formed on one of the base and the flexible substrate, and the k-th inspection wiring with an odd k is formed on the other.   The circuit member according to claim 2, wherein the k-th inspection wiring formed on the base is formed on an end surface of the base.   3. The groove is formed between the kth electrode terminal and the (k + 1) th electrode terminal on the surface of the base, and the kth inspection wiring is formed on the inner surface of the groove. Circuit members.   The circuit member according to any one of claims 2 to 4, wherein at least a part of the electrode terminal is surrounded by the single electrode.   The k-th inspection wiring of the flexible substrate is installed on a second surface opposite to the first surface, and the wiring terminal connected to the k-th connection point and the (k + 1) -th connection point and the k-th connection point. The circuit member according to claim 2, wherein the circuit member is electrically connected to the inspection wiring through a through electrode penetrating the flexible substrate.   An additional wiring straddling the (k + 1) -th inspection wiring disposed on the substrate is disposed on the second surface, and the additional wiring is connected to the wiring via a through electrode penetrating the flexible substrate. Item 7. The circuit member according to Item 6. Each of the wiring terminals has a first wiring terminal and a second wiring terminal that are separated from each other,
The k-th connection point is a k-th connection point that electrically connects the k-th electrode terminal and the k-th first wiring terminal, and the k-th electrode terminal and the k-th second wiring terminal. And k2 connection point for electrically connecting
The k-th inspection wiring having an odd k electrically connects the k1 connection point and the (k + 1) 1 connection point, and the k-th inspection wiring having an even k is the k2 connection point. The circuit member according to claim 1, wherein the first and second (k + 1) second connection points are electrically connected.   The circuit member according to claim 8, wherein the k-th inspection wiring is formed on the flexible substrate. The k-th inspection wiring is installed on the second surface opposite to the first surface,
10. The circuit member according to claim 8, wherein the k-th and (k + 1) -th wiring terminals and the k-th inspection wiring are electrically connected through a through electrode penetrating the flexible substrate.   The circuit member according to claim 8, wherein at least a part of the electrode terminal is surrounded by the single electrode.   The base and the flexible substrate face each other with n electrodes, n wires, and n electrode terminals and n wire terminals with an anisotropic conductive material interposed therebetween. The circuit member according to claim 1, wherein the circuit members are joined together. A circuit member according to claim 1,
The flexible substrate supplies a drive signal generated by a drive circuit to the n electrodes via the n wires,
The liquid ejecting head, wherein the base includes a pressure chamber for discharging liquid, and the driving signal is supplied to the pressure chamber via the n electrodes. A liquid ejecting head according to claim 13;
A moving mechanism for reciprocating the liquid jet head;
A liquid supply pipe for supplying a liquid to the liquid ejecting head;
And a liquid tank that supplies the liquid to the liquid supply pipe.

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