US12081849B2 - Photosensitive assembly, camera module and manufacturing method thereof - Google Patents

Photosensitive assembly, camera module and manufacturing method thereof Download PDF

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Publication number
US12081849B2
US12081849B2 US17/635,121 US202017635121A US12081849B2 US 12081849 B2 US12081849 B2 US 12081849B2 US 202017635121 A US202017635121 A US 202017635121A US 12081849 B2 US12081849 B2 US 12081849B2
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Prior art keywords
photosensitive
circuit board
protrusion structure
chip
photosensitive assembly
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US17/635,121
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US20220303436A1 (en
Inventor
Zhongyu LUAN
Zhen Huang
Li Liu
Hongfeng GAN
Tinghua LI
Xinxiang SUN
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Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Assigned to NINGBO SUNNY OPOTECH CO., LTD reassignment NINGBO SUNNY OPOTECH CO., LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, ZHEN, LIU, LI, LUAN, Zhongyu, GAN, Hongfeng, LI, TINGHUA, SUN, Xinxiang
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Definitions

  • the present invention relates to the technical field of camera modules. Specifically, the present invention relates to a camera module, a photosensitive assembly for the camera module, and a manufacturing method thereof.
  • the compact development of mobile phones and the increase in the screen-to-body ratio of the mobile phones makes the space inside the mobile phone for front camera modules smaller and smaller; the number of rear camera modules is increasing, and the area occupied is also increasing, resulting in the other configurations of mobile phones, such as battery size and motherboard size, have been reduced accordingly.
  • the market hopes that the size of rear camera modules can be reduced.
  • the market has also put forward higher and higher demands for the imaging quality of camera modules.
  • the camera module may include a photosensitive assembly and a lens assembly, and lens group of the lens assembly and other optical elements are provided on a photosensitive path of a photosensitive element (usually a photosensitive chip) of the photosensitive assembly.
  • a color filter can be directly installed on the photosensitive assembly to form a part of the photosensitive assembly, but in other solutions, the photosensitive assembly may not include a color filter, but the color filter is made into an independent color filter assembly or installed on the light transmission path in other forms. Therefore, the lens assembly can sometimes be understood as a combination of light transmitting elements such as the lens groups, the color filters, and supporting structures thereof, and this combination can sometimes be referred to as a light transmitting assembly.
  • the photosensitive assembly may include a circuit board and a molding body integrally molded on the circuit board.
  • the photosensitive element is pre-attached to the circuit board, and then the molding body is formed on the circuit board through a molding process.
  • the molding body can embed part of a non-photosensitive area of the photosensitive element.
  • the combination of the circuit board and the molding body, and the combination of the molding body and the photosensitive chip are all rigid combinations. The combination is very strong and often requires destructive methods to be removed.
  • the circuit board and the photosensitive chip are combined by glue, which is a relatively flexible combination.
  • the coefficient of thermal expansion (CTE) of the circuit board, the molding body, and the photosensitive chip are different.
  • FIG. 18 shows a schematic diagram of the principle of the deformation of the photosensitive chip caused by the bending of the circuit board and the molding body.
  • FIG. 18 is exaggerated for ease of understanding.
  • the bending amount may be only ten to twenty microns, but this degree of bending is enough to affect the image quality.
  • this kind of bending may cause the field curvature of the camera module to be too large.
  • the image obtained by the camera module appears to have a normal effect at center but a poor effect at edges.
  • the purpose of the present invention is to overcome the shortcomings of the prior art and provide a solution for a photosensitive assembly and a camera module.
  • the present invention provides a photosensitive assembly including: a circuit board having a first surface for attaching a photosensitive chip and a second surface opposite to the first surface, the first surface having a protrusion structure, and the protrusion structure being distributed on a chip attachment area of the circuit board; a photosensitive chip attached to the first surface through an adhesive, the adhesive being arranged at least between a top surface of the protrusion structure and a bottom surface of the photosensitive chip; and a metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner.
  • the adhesive covers the chip attachment area, and the top surface of the protrusion structure is a flat surface.
  • the adhesive fills a gap between the bottom surface of the photosensitive chip and the chip attachment area, and the thickness of the adhesive is greater than a protrusion height of the protrusion structure.
  • the protrusion structure is a plurality of pillars distributed in the chip attachment area in a hash manner.
  • the protrusion structure is one or more strip-shaped dams.
  • the strip-shaped dam is a linear dam, or a ring-shaped dam, or a tortuous dam formed by zigzag extension within the chip attachment area.
  • the protrusion height of the protrusion structure is 5 micrometers to 40 micrometers.
  • the protrusion height of the protrusion structure is 10 micrometers to 40 micrometers.
  • the circuit board is a PCB board.
  • the photosensitive assembly further includes a molding portion formed on the first surface and surrounding the photosensitive chip.
  • the molding portion extends toward the photosensitive chip and contacts the photosensitive chip, and the molding portion covers the metal wire.
  • a root part of the protrusion structure is located inside the circuit board, and the protrusion structure is grown based on a seed layer inside the circuit board.
  • the root part of the protrusion structure extends to the second surface and penetrates through the circuit board.
  • the protrusion structure is attached to the first surface of the circuit board.
  • the protrusion structure is attached to the first surface of the circuit board through an SMT process.
  • the protrusion structure is a metal pillar or a metal dam.
  • the protrusion structure includes a first annular dam on an outer side and a second annular dam on an inner side, and the protrusion height of the first annular dam is greater than the protrusion height of the second annular dam.
  • the protrusion structure is a ring-shaped dam with at least one opening
  • the adhesive is arranged between the top surface of the protrusion structure and the bottom surface of the photosensitive chip and the adhesive is cured to support the photosensitive chip
  • the protrusion height of the protrusion structure is 10 micrometers to 30 micrometers.
  • a method for manufacturing a photosensitive assembly including: 1) preparing a circuit board, wherein the circuit board has a first surface for attaching a photosensitive chip and a second surface opposite to the first surface, the first surface has a protrusion structure, and the protrusion structure is distributed on a chip attachment area of the circuit board; 2) placing the first surface facing upwards, arranging adhesive on the chip attachment area of the first surface, wherein the adhesive is arranged on at least a top surface of the protrusion structure; 3) contacting a bottom surface of the photosensitive chip with the adhesive, and then curing the adhesive, thereby bonding the photosensitive chip and the circuit board together; and 4) electrically connecting the photosensitive chip and the circuit board by a metal wire based on a wire bonding manner.
  • the method for manufacturing the photosensitive assembly further includes: 5) forming a molding portion on the first surface of the circuit board, wherein the molding portion surrounds the photosensitive chip, and there is a gap between the molding portion and the photosensitive chip, or the molding portion extends to the photosensitive chip and contacts the photosensitive chip.
  • the protrusion structure is a plurality of pillars distributed in the chip attachment area in a hash manner, or one or more strip-shaped dams; in the step 2), the adhesive is coated on the chip attachment area of the circuit board; in the step 3), the bottom surface of the photosensitive chip is brought into contact with the adhesive, and then the photosensitive chip is continuously pressed to squeeze the adhesive so that the adhesive fills the gap between the bottom surface of the photosensitive chip and the chip attachment area.
  • the step 1) includes the following sub-steps: 11) preparing a circuit board embryonic board, wherein the circuit board embryonic board has a through hole or a slot, and the through hole or the slot has a metal seed layer therein; and 12) planting a metal layer on the metal seed layer so that the metal layer grows beyond the first surface to form the protrusion structure.
  • the step 12) inlcudes the following sub-steps: 121) covering an upper surface of the circuit embryonic board with a mask, wherein the mask has an opening, and a longitudinal section of the opening has a first width, and a longitudinal section of the through hole or the slot has a second width, and the difference between the first width and the second width is less than 15% of the second width; 122) using electroplating, deposition or sputtering methods to grow a metal pillar or a metal dam on the seed layer in the through hole or the slot to form a protrusion structure beyond the first surface; and 123) removing the mask.
  • the step 1) further includes: attaching the electronic element and the protrusion structure to the circuit board in a same process step based on the SMT process.
  • a camera module includes: a lens assembly; and any of the aforementioned photosensitive assemblies.
  • the photosensitive assembly and camera module of the present application can avoid or suppress the deformation of the photosensitive chip with the smaller cost of space size.
  • the photosensitive assembly and camera module of the present application can improve the structural strength of the circuit board.
  • the photosensitive assembly and camera module of the present application can improve the heat dissipation efficiency of the photosensitive chip.
  • the photosensitive assembly and camera module of the present application can ensure the imaging quality of the camera module with use a smaller cost of space size.
  • the photosensitive assembly and camera module of the present application are particularly suitable for camera modules with high pixels and high frame rate.
  • the photosensitive assembly and camera module of the present application are particularly suitable for combining with MOC and MOB technologies.
  • the photosensitive assembly and camera module of the present application have higher production efficiency.
  • the photosensitive assembly of the present application can inhibit the bending of the photosensitive chip by two aspects of effects of avoiding excessive heat accumulation and increasing the structural strength. Therefore, the thickness of package part and heat dissipation rib on the back of the circuit board can be relatively reduced. In other words, the present application can achieve the effect of suppressing the bending of the photosensitive chip at a smaller cost of thickness.
  • FIG. 1 shows a schematic cross-sectional view of a photosensitive assembly 1000 in an example of the present application
  • FIG. 2 shows a three-dimensional schematic diagram of a circuit board 10 with a first surface having an array of pillars in an example of the present application
  • FIG. 3 shows a schematic top view of a circuit board 10 according to another example of the present application.
  • FIG. 4 shows a three-dimensional schematic diagram of a circuit board 10 according to still another example of the present application.
  • FIG. 5 shows a schematic cross-sectional view of a photosensitive assembly 1000 in another example of the present application
  • FIG. 6 shows a schematic cross-sectional view of a photosensitive assembly 1000 in a modified example of the present application
  • FIG. 7 shows a schematic cross-sectional view of a photosensitive assembly 1000 according to another example of the present application.
  • FIG. 8 shows a schematic top view of the circuit board 10 in the example of FIG. 7 ;
  • FIG. 9 shows a circuit board embryonic board 10 a in an example of the present application.
  • FIG. 10 shows a circuit board embryonic board 10 b in another example of the present application.
  • FIG. 11 shows a schematic diagram of covering a mask 15 on the upper surface of the circuit board embryonic board 10 a in an example of the present application
  • FIG. 12 shows a schematic diagram of growing metal pillars or metal dams on a seed layer in an example of the present application
  • FIG. 13 shows a schematic diagram after removing the mask in an example of the present application
  • FIG. 14 shows a schematic cross-sectional view of a camera module according to an example of the present application.
  • FIG. 15 shows a schematic cross-sectional view of a camera module according to another example of the present application.
  • FIG. 16 shows a schematic cross-sectional view of a camera module according to still another example of the present application.
  • FIG. 17 shows a schematic cross-sectional view of a camera module according to yet another example of the present application.
  • FIG. 18 shows a schematic diagram of a principle of a deformation of a photosensitive chip caused by bending of a circuit board and a molding body
  • FIG. 19 shows a schematic cross-sectional view of a circuit board 10 with a “homocentric squares”-shaped dam in an example of the present application
  • FIG. 20 shows a schematic top view of a circuit board 10 having a “Union Jack”-shaped protrusion structure 11 in an example.
  • the heat generated by the photosensitive chip is increasing.
  • the inventor of the present application discovered that the superposition of factors such as heat accumulation and the increase in the size of the photosensitive chip (high pixels lead to an increase in the size of the photosensitive chip) makes the photosensitive chip prone to deformation, and the deformation is sufficient to cause the imaging quality of the camera module to decrease.
  • the photosensitive chip itself has a large area, high power, and generates a large amount of heat; second, the photosensitive chip has a large area and small thickness, and this ratio causes the chip itself is easily affected by foreign objects; third, the photosensitive chip is affected by the force generated by foreign objects such as circuit boards and molding deformation, which makes the photosensitive chip more susceptible to deformation.
  • the applicant proposes a composite substrate that can suppress the aforementioned deformation, and a photosensitive assembly and camera module based on the composite substrate.
  • FIG. 1 shows a schematic cross-sectional view of a photosensitive assembly 1000 in an example of the present application.
  • the photosensitive assembly 1000 includes a circuit board 10 , a photosensitive chip 20 , a metal wire 30 and an electronic component 40 .
  • the circuit board 10 has a first surface 12 for attaching the photosensitive chip and a second surface 13 opposite to the first surface 12 , and the first surface has protrusion structures 11 , and the protrusion structures 11 are distributed in the chip attachment area 14 of the circuit board 10 .
  • the photosensitive chip 20 is attached to the first surface 12 through an adhesive 21 , and the adhesive 21 covers the entire chip attachment area 14 .
  • a top surface of the protrusion structure 11 may be a flat surface, so as to arrange adhesive material on the top surface and to enhance the firmness of the bonding between a back surface of the photosensitive chip and the first surface of the circuit board.
  • the top surface of the protrusion structure 11 can be a flat surface, and the height of all protrusion structures is substantially equal, so that the uniformity of the thickness of the glue (i.e., the adhesive 21 ) can be ensured, and the flatness of chip mounting can be increased.
  • the protrusion structure 11 may be made of copper pillars by electroplating or deposition; in another example, the protrusion structure may be soldered to the circuit board using SMT (Surface Mount Technology).
  • the protrusion structure can be attached to the circuit board based on the SMT process in the same process step as attaching the electronic components.
  • the metal wire 30 electrically connects the photosensitive chip 20 and the circuit board 10 by a wire bonding manner.
  • One end of the metal wire 30 can be led out from a top surface of the photosensitive chip 20 , and the other end can be connected to a non-chip attachment area of the first surface 12 of the circuit board 10 .
  • the non-chip attachment area refers to an area outside the chip attachment area 14 . Generally speaking, the non-chip attachment area is located around the chip attachment area 14 .
  • Wire bonding is a process for electrically connecting the photosensitive chip 20 and the circuit board 10 , and its English name is wire bonding, which can also be called “bonding”, “wire bond” or “wire stripping”.
  • a pad of the photosensitive chip can be electrically connected to a pad of the circuit board.
  • the pad here can be regarded as a port for chip data input and output.
  • the pad of the circuit board can be formed by removing an ink layer to expose a copper layer of the circuit board. In this case, the pad is recessed downward.
  • the pad of the circuit board can also be made by tin screen printing. In this case, the pad can be protruded upward, but the pad is different from the protrusion structure 11 described in this example.
  • metal pillars such as copper pillars grown by electroplating or deposition help to form a flat top surface.
  • BGA process that is, a Ball Grid Array packaging process.
  • the chip and the circuit board are generally electrically connected by soldering tin balls on a back of the chip.
  • the electrical connection method may cause the adhesive material on the back of the chip to be difficult to coat evenly, or the adhesive material may contaminate solder joints and cause reliability problems.
  • the wire bonding process in this example can avoid the above problems.
  • the pads on the photosensitive chip are located on a front surface of the photosensitive chip, and pads on the corresponding circuit board are far away from the photosensitive chip mounting area, and the glue on the back of the chip is not easy to contaminate the pad.
  • the electronic component 40 can be mounted on the non-chip attachment area of the first surface 12 of the circuit board 10 . Specifically, the electronic component 40 may be located at outer side of the metal wire 30 .
  • the adhesive 21 fills the gap between a bottom surface of the photosensitive chip 20 and the chip attachment area 14 , and thickness of the adhesive 21 is greater than a protrusion height of the protrusion structure 11 .
  • the protrusion structure 11 can increase the contact area of the adhesive 21 , so that stress per unit area of the chip attachment area 14 of the circuit board 10 is reduced, so that stress acting on the photosensitive chip per unit area of the chip attachment area 14 is reduced, thereby reducing the bending of the photosensitive chip 20 .
  • the protrusion height of the protrusion structure 11 is 5-40 micrometers, and the protrusion structure 11 has a larger surface area, which can absorb more heat, and increase the heat dissipation efficiency. It should be noted that the protrusion height in this example refers to a height from the first surface 12 to the top surface of the protrusion structure 11 .
  • the protrusion height of the protrusion structure 14 may preferably be 10 micrometers to 40 micrometers. Range of the protrusion height can further increase the thickness and structural strength of the photosensitive chip mounting area, enhance ability of this part to resist stress, and reduce the bending of this part of the circuit board 10 .
  • a material of the protrusion structure can have a coefficient of thermal expansion (CTE) of 10*10 ⁇ 6 to 25*10 ⁇ 6 /° C., so as to be close to the coefficient of thermal expansion of materials such as the circuit board.
  • CTE coefficient of thermal expansion
  • the protrusion structure 11 may be a plurality of pillars distributed in the chip attachment area 14 in a hash manner. Specifically, the protrusion structure 11 may be an array of N*M pillars (N and M are both integers).
  • FIG. 2 shows a three-dimensional schematic diagram of a circuit board 10 with a first surface having an array of pillars in an example of the present application. Referring to FIG. 2 , the first surface 12 of the circuit board 10 has a rectangular array of pillars.
  • the circuit board 10 may include a circuit board main body 19 , a flexible connection stripe 18 and a connector 17 .
  • the circuit board main body 19 may be a PCB board, also called a hard board.
  • the circuit board main body 19 is mainly involved herein. For the convenience of description, the circuit board is sometimes used directly as the circuit board main body herein.
  • FIG. 3 shows a schematic top view of a circuit board 10 according to another example of the present application.
  • a plurality of pillars are irregularly distributed in the chip attachment area 14 of the first surface 12 .
  • FIG. 4 shows a three-dimensional schematic diagram of a circuit board 10 according to still another example of the present application.
  • the protrusion structure 11 is a “homocentric squares”-shaped dam.
  • the “homocentric squares”-shaped dam can be composed of two ring-shaped dams, one of which is a large ring and the other is a small ring, and the two ring-shaped dams are in a state where the large ring surrounds the small ring.
  • the protrusion structure 11 may also be other deformed structures, for example, it may be one or more strip-shaped dams.
  • the strip-shaped dam can be a linear dam, it can also be a ring-shaped dam (which can be regarded as a ring formed by the zigzag extension of the strip), or it can be other types of zigzag dams formed by zigzag extension within the range of the chip attachment area.
  • the flexible connection stripe 18 and the connector 17 are also shown.
  • the two ring shapes of the “homocentric squares” shape can be rectangular similar to the shape of the photosensitive chip, and the matching of the shapes can make the stress generated by the chip evenly distributed on the “homocentric squares”-shaped dam and be conducted out through the dam.
  • FIG. 19 shows a schematic cross-sectional view of a circuit board 10 with a “homocentric squares”-shaped dam in an example of the present application.
  • the “homocentric squares”-shaped dam may include an outer ring dam 11 a and an inner ring dam 12 b , and a height of the outer ring dam 11 a may be higher than a height of the inner ring dam 11 b .
  • the outer ring dam 11 a carries at least three sides (or three strip-shaped edge areas) of the photosensitive chip 20 , so flatness of the photosensitive chip 20 can be guaranteed.
  • the height of the inner ring dam 11 b is lower than that of the outer ring dam 11 a .
  • an imaging surface of the lens is also a curved surface similar to a “bowl-shape” (i.e., curvature of field), which makes a shape of a photosensitive surface of the photosensitive chip close to that of the imaging surface of the lens, reduces the field curvature of the camera module, and improves the imaging quality of the camera module.
  • bowl-shape i.e., curvature of field
  • the dam-shaped protrusion structure is not limited to the “homocentric squares” shape.
  • the protrusion structure may also be similar to a “cross” shape, a “Union Jack” shape ( FIG. 20 shows a top view of the board circuit 10 with a “Union Jack”-shaped protrusion structure 11 in an example), or an “X” shape, etc., to strengthen the intensity of the circuit board and the photosensitive chip in multiple directions such as the X direction, the Y direction (the X direction and the Y direction can be a direction along the long and short sides of the photosensitive chip) and the diagonal direction of the photosensitive chip.
  • the photosensitive assembly may further include a molding portion formed on the first surface and surrounding the photosensitive chip.
  • the molding portion may have a top surface suitable for mounting a lens assembly.
  • the molding portion extends to the photosensitive chip and contacts the photosensitive chip, and the molding portion covers the metal wire, which is the MOC solution.
  • FIG. 5 shows a schematic cross-sectional view of a photosensitive assembly 1000 in another example of the present application. Referring to FIG. 5 , in this example, a root part 16 of the protrusion structure 11 is located inside the circuit board 10 .
  • the root part 16 of the protrusion structure 11 extends toward the second surface 13 and penetrates through the circuit board 10 .
  • the protrusion structure 11 penetrates through the circuit board 10 , it is beneficial to conduct heat to the bottom surface of the circuit board, and has a better heat dissipation effect.
  • the protrusion structure extends to the inside of the circuit board, which can strengthen the structural strength of the photosensitive assembly in the chip attachment area, reduces the influence of the bending of the circuit board on the photosensitive assemblys in the area.
  • FIG. 6 shows a schematic cross-sectional view of a photosensitive assembly 1000 in a modified example of the present application.
  • the root part 16 of the protrusion structure 11 of the photosensitive assembly 1000 is located inside the circuit board 10 , but the protrusion structure 11 does not penetrate through the circuit board 10 . That is, the end surface of the root part 16 of the protrusion structure 11 is higher than the second surface 13 (i.e., the bottom surface) of the circuit board.
  • the protrusion structure 11 of the photosensitive assembly is attached to the first surface 12 of the circuit board 10 .
  • the attachment can be welding or gluing.
  • the protrusion structure may be a metal pillar or a metal dam.
  • the metal pillars or metal dams can be obtained by providing a seed layer inside the circuit board and then planting a metal layer.
  • the method of planting the metal layer includes methods such as electroplating, deposition or sputtering.
  • FIG. 7 shows a schematic cross-sectional view of a photosensitive assembly 1000 according to another example of the present application.
  • FIG. 8 shows a schematic top view of the circuit board 10 in the example of FIG. 7 .
  • the photosensitive element 1000 has the protrusion structure 11 and a bonding method that are different from those in the foregoing example.
  • the photosensitive assembly 1000 includes the circuit board 10 , the photosensitive chip 20 , the metal wire 30 and the electronic component 40 .
  • the circuit board 10 has the first surface 12 for attaching the photosensitive chip 20 and the second surface 13 opposite to the first surface 12 .
  • the first surface 12 has the protrusion structure 11 , and the protrusion structure is distributed in the chip attachment area of the circuit board, and the top surface of the protrusion structure is flat. It should be noted that there is a gap between the first surface and the photosensitive chip in this example, and the two are only bonded at the protrusion structure 11 .
  • the protrusion structure is an unclosed ring-shaped dam, that is, the protrusion structure is an unclosed ring when viewed from a top view.
  • the photosensitive chip 20 is attached to the first surface through an adhesive 21 , wherein the adhesive 21 is arranged between the top surface of the protrusion structure 11 and the bottom surface of the photosensitive chip 20 , and the adhesive 21 supports the photosensitive chip 20 after being cured.
  • a protrusion height of the protrusion structure 11 is 10 micrometers to 30 micrometers.
  • the metal wire 30 electrically connects the photosensitive chip 20 and the circuit board 10 by the wire bonding manner.
  • the electronic component 40 is mounted on the first surface 12 . Specifically, the electronic component 40 may be installed on an outer side of the metal wire 30 . This structure makes a cavity between the photosensitive chip and the circuit board, reduces intermediate medium between the photosensitive chip and the circuit board, and reduces transmission of the circuit board stress to the photosensitive chip.
  • Step S 10 is preparing a circuit board.
  • the circuit board has a first surface for attaching a photosensitive chip and a second surface opposite to the first surface, and the first surface has a protrusion structure, and the protrusion structure is distributed on a chip attachment area of the circuit board.
  • a top surface of the protrusion structure may be flat.
  • copper pillars may be formed on a surface of the circuit board by electroplating or deposition.
  • the protrusion structure may also be a pillar of other metal material formed on the first surface by electroplating or deposition.
  • the user can make the circuit board by his/herself, or he/she can buy a circuit board embryonic board on the market for modification (note that there is no such product on the market at present, in other words, the circuit board 10 described in this step is not in prior art).
  • Step S 20 includes: placing the first surface facing upwards, arranging an adhesive on the chip attachment area of the first surface, wherein the adhesive is arranged on at least the top surface of the protrusion structure.
  • the adhesive is coated on the entire chip attachment area of the circuit board.
  • step S 30 the bottom surface of the photosensitive chip is brought into contact with the adhesive, and then the adhesive is cured, thereby bonding the photosensitive chip and the circuit board together.
  • step S 40 the photosensitive chip and the circuit board are electrically connected through a metal wire based on wire bonding.
  • This step may further includes mounting electronic components on the surface of the circuit board.
  • the method for manufacturing the photosensitive assembly may further include step S 50 .
  • Step S 50 is forming a molding portion on the first surface of the circuit board, wherein the molding portion surrounds the photosensitive chip, and there is a gap between the molding portion and the photosensitive chip, or the molding portion extends toward the photosensitive chip and contacts the photosensitive chip.
  • the molding portion can be made on the first surface of the circuit board by a molding process (the molding portion can embed the electronic components and/or metal wires), and the molding portion can be used as a lens holder for mounting a lens assembly.
  • an upper die and a lower die can be used for clamping to form a molding cavity between the upper die and the first surface of the circuit board, and then a liquid molding material is injected into the molding cavity.
  • step S 50 can be replaced by a step of installing a shaped lens bracket. That is, the shaped lens bracket (i.e., lens holder) can be installed on the circuit board, and the lens holder can be used to install lens assemblies.
  • the shaped lens bracket i.e., lens holder
  • the protrusion structure is a plurality of pillars distributed in the chip attachment area in a hash manner, or one or more bar-shaped dams.
  • the adhesive is coated on the chip attachment area of the circuit board.
  • the bottom surface of the photosensitive chip is brought into contact with the adhesive, and then the photosensitive chip is continuously pressed to squeeze the adhesive so that the adhesive fills a gap between the bottom surface of the photosensitive chip and the chip attachment areas.
  • a top surface of the adhesive of the photosensitive assembly produced is flat and uniformly arranged in the chip attachment area, which can enhance the firmness and reliability of the adhesion between the bottom surface of the photosensitive chip and the circuit board.
  • the step S 10 may include the following sub-steps S 11 and S 12 .
  • Step S 11 is preparing a circuit board embryonic board 10 a , wherein the circuit board embryonic board 10 a has a through hole or a slot, and the through hole or the slot has a metal seed layer 11 a .
  • FIG. 9 shows a circuit board embryonic board 10 a in an example of the present application.
  • the circuit board embryonic board 10 a has a metal seed layer 11 a .
  • the metal seed layer 11 a penetrates through the circuit board embryonic board 10 a .
  • FIG. 10 shows a circuit board embryonic board 10 b in another example of the present application.
  • the circuit board embryonic board 10 b has a metal seed layer 10 b , but the metal seed layer 10 b does not penetrate through the circuit board embryonic board 10 b , and is only made in one layer of the circuit board embryonic board 10 b .
  • the circuit board embryonic board 10 b may be a multi-layer board, in which wires can be arranged at each layer.
  • the metal seed layer is made on the lowest bottom layer of the circuit board embryonic board 10 b .
  • the layer with the metal seed layer may not be used for wiring, that is, the layer where the metal seed layer is located does not belong to a part of the functional circuit in the circuit board. In this way, this layer can specifically play a role of structural support to strengthen the structural strength and improve the heat dissipation effect at the same time.
  • Step S 12 is planting a metal layer on the metal seed layer so that the metal layer grows beyond the first surface to form the protrusion structure.
  • step S 12 may further include the following sub-steps.
  • Step 121 is covering an upper surface of the circuit embryonic board with a mask, wherein the mask has an opening, and a longitudinal section of the opening has a first width, and a longitudinal section of the through hole or the slot has a second width, and the difference between the first width and the second width is less than 15% of the second width.
  • FIG. 11 shows a schematic diagram of covering a mask 15 on an upper surface of the circuit board embryonic board 10 a in an example of the present application.
  • Step 122 is using electroplating, deposition or sputtering methods to grow a metal pillar or a metal dam on the seed layer in the through hole or the slot to form the protrusion structure beyond the first surface.
  • FIG. 12 shows a schematic diagram of growing metal pillars or metal dams on a seed layer in an example of the present application.
  • FIG. 12 shows the protrusion structure 11 obtained by growing the metal pillar or the metal dam on the seed layer.
  • Step 123 is removing the mask to obtain the required circuit board.
  • FIG. 13 shows a schematic diagram after removing the mask in an example of the present application. As shown in FIG. 13 , after removing the mask, the circuit board 10 with the required protrusion structure 11 can be obtained.
  • the protrusion structure in the step S 10 , can be attached to the surface of the circuit board based on the SMT process (here, the circuit board can be understood as a circuit board embryonic board). Further, step S 10 may also include attaching the electronic element to the first surface of the circuit board based on the SMT process. In this way, the protrusion structure and the electronic element can be completed in the same process step, so as to improve production efficiency.
  • FIG. 14 shows a schematic cross-sectional view of a camera module of an example of the present application. It can be seen that the camera module include a photosensitive assembly 1000 and a lens assembly 2000 .
  • the photosensitive assembly 1000 is further provided with a lens holder 1001 and a color filter 1002 on the basis of the example in FIG. 1 .
  • the lens holder 1001 is installed on a first surface 12 of the circuit board 10 .
  • the lens holder 1001 has a light window.
  • the color filter is mounted on the lens holder 1001 .
  • a top surface of the lens holder 1001 bears against a bottom surface of the lens assembly 2000 .
  • the lens assembly 2000 includes a motor 2001 , a lens barrel 2002 , and a lens group 2003 .
  • the lens group 2003 is installed on an inner side of the lens barrel 2002 .
  • An outer surface of the lens barrel 2002 is mounted on the motor (usually mounted on the motor carrier).
  • the motor carrier can move relative to a housing of the motor, thereby driving the lens to move relative to the photosensitive assembly.
  • This lens assembly with the motor can be used for autofocus camera modules, zoom camera modules, periscope camera modules, etc.
  • the motor 2001 can also be replaced by a lens carrier.
  • the lens carrier can be directly fixed on a top surface of the photosensitive assembly, and an inner side of the lens carrier and the outer side of the lens barrel can be threadedly connected. This lens assembly without the motor can be used for fixed-focus camera modules.
  • FIG. 15 shows a schematic cross-sectional view of a camera module according to another example of the present application.
  • the camera module includes a photosensitive assembly 1000 and a lens assembly 2000 .
  • the lens assembly 2000 may be the same as the lens assembly 2000 shown in FIG. 14 , and will not be repeated here.
  • the photosensitive assembly 1000 is further provided with a front molding portion 1003 , and the front molding portion 1003 can be formed on a first surface 12 of a circuit board 10 through a molding process.
  • the front molding portion 1003 may embed electronic elements.
  • the front molding portion 1003 surrounds an outer side of a lens holder 1001 , and a top surface of the front molding portion 1003 is a flat surface, which is used for mounting the lens assembly 2000 .
  • FIG. 16 shows a schematic cross-sectional view of a camera module according to still another example of the present application.
  • the camera module includes a photosensitive assembly 1000 and a lens assembly 2000 .
  • the lens assembly 2000 may be the same as the lens assembly 2000 shown in FIG. 14 , and will not be repeated here.
  • the difference between the photosensitive assembly 1000 and that in FIG. 15 is an installation position of the lens holder 1001 .
  • the lens holder 1001 is installed on a top surface of the front molding portion 1003 .
  • the lens assembly 2000 is installed on a top surface of the lens holder 1001 .
  • FIG. 17 shows a schematic cross-sectional view of a camera module according to yet another example of the present application.
  • the camera module include a photosensitive assembly 1000 and a lens component 2000 .
  • the lens assembly 2000 may be the same as the lens assembly 2000 shown in FIG. 14 , and will not be repeated here.
  • the difference between the photosensitive assembly 1000 and that in FIG. 16 is a solution of the front molding portion 1003 .
  • the front molding portion 1003 adopts a MOC scheme, that is, the front molding portion 1003 is formed on a first surface 12 of a circuit board 10 through a molding process, and the front molding portion 1003 extends toward a photosensitive chip and embeds an edge area of the photosensitive chip.
  • the front molding portion 1003 not only eembeds electronic elements, but also embeds metal wires (refers to the metal wires of the wire bonding process).
  • the front molding portion 1003 adopts a MOB scheme. In the MOB scheme, there is a gap between the front molding portion 1003 and the photosensitive chip.
  • a lens holder 1001 is installed on a top surface of the front molding portion 1003 .
  • the lens assembly 2000 is installed on a top surface of the lens holder 1001 .

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
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PCT/CN2020/100862 WO2021027445A1 (fr) 2019-08-15 2020-07-08 Ensemble photosensible, module d'appareil photo et son procédé de fabrication

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112399037B (zh) * 2019-08-15 2022-04-05 宁波舜宇光电信息有限公司 感光组件、摄像模组及其制作方法
EP3840543A1 (fr) * 2019-12-20 2021-06-23 Knowledge Development for POF SL Connecteur à fibre optique
CN114339000B (zh) * 2021-12-31 2024-04-23 昆山丘钛微电子科技股份有限公司 一种摄像头模组及制备方法

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020076537A1 (en) * 2000-12-16 2002-06-20 Unipac Optoelectronics Corporation Laminated structure
US20040226742A1 (en) * 2003-05-14 2004-11-18 Aneta Wyrzykowska Package modification for channel-routed circuit boards
US20060268144A1 (en) * 2005-05-27 2006-11-30 Tan Cheng W Methods for packaging an image sensor and a packaged image sensor
US20060292732A1 (en) 2002-08-29 2006-12-28 Kinsman Larry D Methods of flip-chip image sensor package fabrication
CN104954654A (zh) 2015-07-03 2015-09-30 南昌欧菲光电技术有限公司 双摄像头模组及摄像装置
CN104967767A (zh) 2015-07-03 2015-10-07 南昌欧菲光电技术有限公司 摄像模组及摄像装置
CN105472216A (zh) 2015-12-01 2016-04-06 宁波舜宇光电信息有限公司 具有缓冲结构的电气支架及摄像模组
CN105681637A (zh) 2016-03-15 2016-06-15 宁波舜宇光电信息有限公司 阵列摄像模组及其感光组件和制造方法
CN105721754A (zh) 2016-04-01 2016-06-29 宁波舜宇光电信息有限公司 基于一体封装工艺的摄像模组
CN106303164A (zh) 2015-05-14 2017-01-04 宁波舜宇光电信息有限公司 防止芯片倾斜的摄像模组及其组装方法
CN107734227A (zh) 2017-10-27 2018-02-23 昆山丘钛微电子科技有限公司 图像传感器封装结构、摄像头模组及其制作方法
CN207251755U (zh) 2016-12-23 2018-04-17 宁波舜宇光电信息有限公司 电路板组件和摄像模组以及带有摄像模组的电子设备
JP2018073957A (ja) 2016-10-27 2018-05-10 京セラ株式会社 発熱体収容モジュール、撮像装置、及び移動体
CN208956159U (zh) 2018-09-21 2019-06-07 南昌欧菲光电技术有限公司 感光组件、摄像模组及智能终端
CN209046749U (zh) 2018-11-30 2019-06-28 南昌欧菲光电技术有限公司 电路板、感光组件、摄像模组及智能终端
EP3998768A1 (fr) 2019-08-01 2022-05-18 Ningbo Sunny Opotech Co., Ltd. Module de caméra, et ensemble photosensible et procédé de fabrication associés
US20220303436A1 (en) * 2019-08-15 2022-09-22 Ningbo Sunny Opotech Co., Ltd Photosensitive assembly, camera module and manufacturing method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008108850A (ja) * 2006-10-24 2008-05-08 Toyota Industries Corp ウェハレベルチップサイズパッケージの回路配置方法及びウェハレベルチップサイズパッケージの半導体集積装置
CN106559609B (zh) * 2015-09-29 2019-11-29 宁波舜宇光电信息有限公司 摄像模组及其组装方法
KR102008816B1 (ko) * 2016-02-17 2019-08-07 하나 마이크론(주) 스마트 기기의 지문 인식용 유연 센서 반도체 패키지 및 그 제조 방법
KR102477352B1 (ko) * 2017-09-29 2022-12-15 삼성전자주식회사 반도체 패키지 및 이미지 센서
CN207458943U (zh) * 2017-11-03 2018-06-05 南昌欧菲光电技术有限公司 摄像模组及其感光组件

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020076537A1 (en) * 2000-12-16 2002-06-20 Unipac Optoelectronics Corporation Laminated structure
US20060292732A1 (en) 2002-08-29 2006-12-28 Kinsman Larry D Methods of flip-chip image sensor package fabrication
US20040226742A1 (en) * 2003-05-14 2004-11-18 Aneta Wyrzykowska Package modification for channel-routed circuit boards
US20060268144A1 (en) * 2005-05-27 2006-11-30 Tan Cheng W Methods for packaging an image sensor and a packaged image sensor
CN106303164A (zh) 2015-05-14 2017-01-04 宁波舜宇光电信息有限公司 防止芯片倾斜的摄像模组及其组装方法
CN104954654A (zh) 2015-07-03 2015-09-30 南昌欧菲光电技术有限公司 双摄像头模组及摄像装置
CN104967767A (zh) 2015-07-03 2015-10-07 南昌欧菲光电技术有限公司 摄像模组及摄像装置
CN105472216A (zh) 2015-12-01 2016-04-06 宁波舜宇光电信息有限公司 具有缓冲结构的电气支架及摄像模组
CN105681637A (zh) 2016-03-15 2016-06-15 宁波舜宇光电信息有限公司 阵列摄像模组及其感光组件和制造方法
CN105721754A (zh) 2016-04-01 2016-06-29 宁波舜宇光电信息有限公司 基于一体封装工艺的摄像模组
JP2018073957A (ja) 2016-10-27 2018-05-10 京セラ株式会社 発熱体収容モジュール、撮像装置、及び移動体
CN207251755U (zh) 2016-12-23 2018-04-17 宁波舜宇光电信息有限公司 电路板组件和摄像模组以及带有摄像模组的电子设备
US20190364184A1 (en) 2016-12-23 2019-11-28 Ningbo Sunny Opotech Co., Ltd. Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module
CN107734227A (zh) 2017-10-27 2018-02-23 昆山丘钛微电子科技有限公司 图像传感器封装结构、摄像头模组及其制作方法
CN208956159U (zh) 2018-09-21 2019-06-07 南昌欧菲光电技术有限公司 感光组件、摄像模组及智能终端
CN209046749U (zh) 2018-11-30 2019-06-28 南昌欧菲光电技术有限公司 电路板、感光组件、摄像模组及智能终端
EP3998768A1 (fr) 2019-08-01 2022-05-18 Ningbo Sunny Opotech Co., Ltd. Module de caméra, et ensemble photosensible et procédé de fabrication associés
US20220278151A1 (en) * 2019-08-01 2022-09-01 Ningbo Sunny Opotech Co., Ltd. Camera module, and photosensitive assembly and manufacturing method therefor
US20220303436A1 (en) * 2019-08-15 2022-09-22 Ningbo Sunny Opotech Co., Ltd Photosensitive assembly, camera module and manufacturing method thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Extended European Search Report issued Sep. 9, 2022, in corresponding European Application No. 20853455.2.
International Search Report issued Sep. 22, 2020, in International (PCT) Application No. PCT/CN2020/100862, with English translation.

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CN112399037B (zh) 2022-04-05
CN112399037A (zh) 2021-02-23
US20220303436A1 (en) 2022-09-22
EP4016983A1 (fr) 2022-06-22
WO2021027445A1 (fr) 2021-02-18

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