US1207218A - Process of producing metallic deposits. - Google Patents

Process of producing metallic deposits. Download PDF

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Publication number
US1207218A
US1207218A US81306414A US1914813064A US1207218A US 1207218 A US1207218 A US 1207218A US 81306414 A US81306414 A US 81306414A US 1914813064 A US1914813064 A US 1914813064A US 1207218 A US1207218 A US 1207218A
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Prior art keywords
articles
metallic
metallic deposits
producing metallic
metal
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US81306414A
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Francois Auguste Roux
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L'ALUMINIUM FRANCAIS Ste
L ALUMINIUM FRANCAIS SOC
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L ALUMINIUM FRANCAIS SOC
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Priority to US81306414A priority Critical patent/US1207218A/en
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Definitions

  • the premnt invention relates to prove-. ments in rocesses of depting metallic layers or i m upon articles construe of difierent metals. Tn cag out processes of this general class or character, it is com-- men to pass an electric current through a solution of the metal to be deposited, and
  • ticles to be coated are rst cleansed in any desired manner, and then subjected to the action of metallic phosphites or hypophosphites, or to the action of alkaline or ammonil phosphites or w a hosphites, or of a salt of the metal to a eposited.
  • hypo sphz'te colation Water 1,000 grams, citrate of nickel or other salt of nickel 100 grams, aonia, alkalis or alkaline salts 100 grams, ammoniacal or alkaline hypophosphite 100 grams.
  • the metallic deposit thus obtained may be utilized as a preparatory film or layer, and deposition may there-- boiling, according as deposition is to be ef-j fected slowly orrapidl
  • a metal may first .be deposited, and the operation may thereafter be continued by depositing a difierent metal upon the first; thus,
  • the articles may first be nick- .eled and then gilded, and thereafter d,
  • the herein-described process of pro- I ducing metallic deposits which consists in subjecting the articles to be coated, until adequately metallized, to the action of a bath containing a solution of a salt of the metal to be deposited and an alkline hypo-' phosphite'.

Description

- neonate. le a To all cut it may concerns."
Be it "a that T, Hangers Aneusrn Rona, a citizen of the Republic of France, and resident of Paris, lErance, have inven anew and useful Process of Producing Metallic e which is y set forth in the following specification.
The premnt invention relates to prove-. ments in rocesses of depting metallic layers or i m upon articles construe of difierent metals. Tn cag out processes of this general class or character, it is com-- men to pass an electric current through a solution of the metal to be deposited, and
it is also coon to employ what is known as the .pulverization treatmt. These proc, however, are not always readily applicable, and it is often preferred tosubstitute therefor, for instance in metalhzmg the interiors of tubes or boxes, the temper. in method. .-Vai-ious ways of. carry ng thismethod into eect have been proposed,
one of which consists in adding to a solution of nickel chlorid, alke chlorids or chloride of a a a or zinc, and
l in utilizing the bath thus obtained in a ho state. According to another process, carbonyl nickel is used. Many other pr are hown, but besides the fact that they do not give a really satisfactory lt from a coercial standpoint, they are not sultable for all metals, particularly for alum, and they are much less satisfactory in forming metallic deposits upon non-metallic articles, such for instance as porcelain.
it is the object of the resent invention to provide a process which shall remedy these defects, and which shall be capable of bringing about the deposition of a good metallic coating both uponany metal, and especially uponalum, and also upon non-metallic. articles or substances.
According to the imfiprov pr, ar
ticles to be coated are rst cleansed in any desired manner, and then subjected to the action of metallic phosphites or hypophosphites, or to the action of alkaline or ammonil phosphites or w a hosphites, or of a salt of the metal to a eposited.
Tn. actually carrying out the invention,
. the clean articles are steeped in a solution such, for instance, as either of the follo which are ven merely by way of peclttton of ltettera )Patent. Pattemtedl meta 5, lmllfia 4 Application at! January re, that. tertal lto. 9100M.
example and which can he more or l varied according as it is desired-to produce the deposit rapidly or slowl Emampl'e I. The hypo sphz'te colation.-Water 1,000 grams, citrate of nickel or other salt of nickel 100 grams, aonia, alkalis or alkaline salts 100 grams, ammoniacal or alkaline hypophosphite 100 grams.
The proportions just given are in no way absolute, as they may be widely varied. The presence of the phosphite or hypophosphite and of the metallic salt is suficient in itself to efl'ect the precipitation of the metal; the metallic salt may be added in proportion, or, on the contrary, the h phophos phite or phosphite may be adde little by little to the said salt. In any case, the articles are left in the bath; until they are sufficiently metallized, after which they are rinsed and dried. The metallic deposit thus obtained may be utilized as a preparatory film or layer, and deposition may there-- boiling, according as deposition is to be ef-j fected slowly orrapidl As a development of the above process, a metal may first .be deposited, and the operation may thereafter be continued by depositing a difierent metal upon the first; thus,
for instance, the articles may first be nick- .eled and then gilded, and thereafter d,
dried and polished.
I claim as my invention- 1. The herein-described process of pro- I ducing metallic deposits, which consists in subjecting the articles to be coated, until suficiently metallized, to the action of a bath containing a solution of a salt of the metal to be deposited and an alkline hypo-' phosphite'. a
2. The herein-described process of PTO. I
ducing metallic deposits, which consists in subjecting the articles to be coated, until sufici'ently metallized, to the action ofL a bath containing 'a solution of a salt of the metal to be deposited, an alkaline hyphophosphite and ammonia. I
3. The herein-described process of pro ducing metallic deposits, which consists in steeping the articles to be treated, until sufficiently metallized, in a, hot bath containing a solution of citrate of nickel, an alkaline hypophosphite and ammonia.
4. The herein-described process of producing metallic deposits upon aluminumsurfaced articles, which consists in subjecting the articles to the action of a bath containing a solution of a salt of the metal to be 'deposited' treated with an alkaline hypophosphite.
5. The herein-described process of producing metallic deposits upon aluminumsurfaced articles, which consists in subjecting the articles to the action of a bath con- FRANQOIS AUGUSTE ROUX.
Witnesses:
EMILE Immm'r, HANSON C. Coxn.
US81306414A 1914-01-19 1914-01-19 Process of producing metallic deposits. Expired - Lifetime US1207218A (en)

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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2485182A (en) * 1945-04-17 1949-10-18 Arthur Arent Lab Inc Aluminum plating process
US2532284A (en) * 1947-05-05 1950-12-05 Brenner Abner Cobalt plating by chemical reduction
US2532283A (en) * 1947-05-05 1950-12-05 Brenner Abner Nickel plating by chemical reduction
US2564661A (en) * 1946-01-10 1951-08-21 Arent Arthur Steel plating method
US2569453A (en) * 1949-09-14 1951-10-02 Poor & Co Vitreous enamel base stock, vitreous enameled articles and method
US2658842A (en) * 1951-01-04 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2658841A (en) * 1950-11-08 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2682702A (en) * 1949-04-06 1954-07-06 Ohio Commw Eng Co Carbonyl metal plated product
US2772183A (en) * 1953-09-24 1956-11-27 Gen Am Transport Chemical nickel plating processes
US2780019A (en) * 1952-02-19 1957-02-05 George C Sullivan Gun barrel of aluminum alloy with metallic coatings
US2791074A (en) * 1953-05-29 1957-05-07 Columbia Southern Chem Corp Packaging of anhydrous alkali metal hydroxide
US2850828A (en) * 1953-03-24 1958-09-09 George C Sullivan Aluminum alloy gun barrel with a lubricating film
US2976181A (en) * 1957-12-17 1961-03-21 Hughes Aircraft Co Method of gold plating by chemical reduction
US2995473A (en) * 1959-07-21 1961-08-08 Pacific Semiconductors Inc Method of making electrical connection to semiconductor bodies
US3032436A (en) * 1960-11-18 1962-05-01 Metal Proc Co Inc Method and composition for plating by chemical reduction
US3162512A (en) * 1961-03-21 1964-12-22 Engelhard Ind Inc Immersion plating with noble metals and the product thereof
US3202529A (en) * 1962-08-08 1965-08-24 Sperry Rand Corp Disposition of nickel-cobalt alloy on aluminum substrates
US3441428A (en) * 1965-09-13 1969-04-29 George C Reinhard Low temperature electroless plating
US3612180A (en) * 1969-08-25 1971-10-12 Shell Oil Co Selective zone consolidation of incompetent formations by metallization
US3658569A (en) * 1969-11-13 1972-04-25 Nasa Selective nickel deposition
US3685582A (en) * 1971-01-14 1972-08-22 Shell Oil Co Electroless metal plating techniques for consolidation of incompetent formations

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2485182A (en) * 1945-04-17 1949-10-18 Arthur Arent Lab Inc Aluminum plating process
US2564661A (en) * 1946-01-10 1951-08-21 Arent Arthur Steel plating method
US2532284A (en) * 1947-05-05 1950-12-05 Brenner Abner Cobalt plating by chemical reduction
US2532283A (en) * 1947-05-05 1950-12-05 Brenner Abner Nickel plating by chemical reduction
US2682702A (en) * 1949-04-06 1954-07-06 Ohio Commw Eng Co Carbonyl metal plated product
US2569453A (en) * 1949-09-14 1951-10-02 Poor & Co Vitreous enamel base stock, vitreous enameled articles and method
US2658841A (en) * 1950-11-08 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2658842A (en) * 1951-01-04 1953-11-10 Gen Am Transport Process of chemical nickel plating and bath therefor
US2780019A (en) * 1952-02-19 1957-02-05 George C Sullivan Gun barrel of aluminum alloy with metallic coatings
US2850828A (en) * 1953-03-24 1958-09-09 George C Sullivan Aluminum alloy gun barrel with a lubricating film
US2791074A (en) * 1953-05-29 1957-05-07 Columbia Southern Chem Corp Packaging of anhydrous alkali metal hydroxide
US2772183A (en) * 1953-09-24 1956-11-27 Gen Am Transport Chemical nickel plating processes
US2976181A (en) * 1957-12-17 1961-03-21 Hughes Aircraft Co Method of gold plating by chemical reduction
US2995473A (en) * 1959-07-21 1961-08-08 Pacific Semiconductors Inc Method of making electrical connection to semiconductor bodies
US3032436A (en) * 1960-11-18 1962-05-01 Metal Proc Co Inc Method and composition for plating by chemical reduction
US3162512A (en) * 1961-03-21 1964-12-22 Engelhard Ind Inc Immersion plating with noble metals and the product thereof
US3202529A (en) * 1962-08-08 1965-08-24 Sperry Rand Corp Disposition of nickel-cobalt alloy on aluminum substrates
US3441428A (en) * 1965-09-13 1969-04-29 George C Reinhard Low temperature electroless plating
US3612180A (en) * 1969-08-25 1971-10-12 Shell Oil Co Selective zone consolidation of incompetent formations by metallization
US3658569A (en) * 1969-11-13 1972-04-25 Nasa Selective nickel deposition
US3685582A (en) * 1971-01-14 1972-08-22 Shell Oil Co Electroless metal plating techniques for consolidation of incompetent formations

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