US11581260B2 - Package structure and manufacturing method thereof - Google Patents
Package structure and manufacturing method thereof Download PDFInfo
- Publication number
- US11581260B2 US11581260B2 US17/097,263 US202017097263A US11581260B2 US 11581260 B2 US11581260 B2 US 11581260B2 US 202017097263 A US202017097263 A US 202017097263A US 11581260 B2 US11581260 B2 US 11581260B2
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- Prior art keywords
- redistribution layer
- chip
- layer
- molding compound
- redistribution
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 28
- 238000000465 moulding Methods 0.000 claims abstract description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 4
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 229920006336 epoxy molding compound Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000708 deep reactive-ion etching Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 241000723873 Tobacco mosaic virus Species 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
Definitions
- the subject matter relates to semiconductor packages, and in particular to a package structure and a manufacturing method thereof.
- a silicon interposer (Silicon Interposer) technology is a technical solution for implementing interconnection between dies, and interconnection between a die and a substrate in the 3D IC technology and the 2.5D IC packaging technology.
- 2.5D IC packaging is used as an example.
- at least two dies are integrated into a fan-out unit (Fan out Unit) by using a fan-out wafer level package technology, and the fan-out unit is packaged on a substrate by using a silicon interposer.
- Both interconnection between the at least two dies and interconnection between a die and a substrate are implemented by using the silicon interposer.
- an interconnection line whose line width and node spacing are much less than those of a resin substrate is fabricated on a silicon chip by a semiconductor process.
- a central processing unit (CPU) and a dynamic random access memory (DRAM) may be connected to one silicon interposer, and massive operations and data exchange can be completed by using the silicon interposer.
- the silicon interposer implements wiring by a through silicon via (TSV) technology.
- TSV through silicon via
- DRIE deep reactive ion etching
- a seed layer is first generated on a surface of a TSV by a physical vapor deposition (PVD) technology, and then the process is completed by electroplating.
- PVD physical vapor deposition
- FIG. 1 is a cross-sectional view of a package structure in accordance with a first embodiment.
- FIG. 2 is a cross-sectional view of a package structure in accordance with a second embodiment.
- FIG. 3 is a cross-sectional view showing a first redistribution layer and a second redistribution layer respectively formed on a first chip and a second chip.
- FIG. 4 is a cross-sectional view showing the structure of FIG. 3 mounted on a temporary carrier.
- FIG. 5 is a cross-sectional view showing a molding compound layer formed on the structure of FIG. 4 .
- FIG. 6 is a cross-sectional view showing a structure of FIG. 5 after removing the temporary carrier.
- FIG. 7 is a cross-sectional view showing a third redistribution layer formed on a carrier.
- FIG. 8 is a cross-sectional view showing the structure of FIG. 7 bonded on the structure of FIG. 6 .
- FIG. 1 illustrates a first embodiment of a package structure.
- the package structure includes a base board 10 , a first chip 20 , a first redistribution layer 30 , a second chip 40 , a second redistribution layer 50 , a carrier 60 , a third redistribution layer 70 , and a first molding compound layer 80 .
- the base board 10 includes a first surface 11 and a second surface 12 facing away from the first surface 11 .
- the first chip 20 , the first redistribution layer 30 , the second chip 40 , the second redistribution layer 50 , the carrier 60 , the third redistribution layer 70 , and the first molding compound layer 80 are all located above the first surface 11 of the base board 10 .
- the first surface 11 is provided with a plurality of connecting portions 112 which are electrically connected to the first chip 20 and the second chip 40 .
- the second surface 12 is electrically connected to a circuit board of an electronic device.
- the second surface 12 may be provided with a plurality of connections (not shown) which electrically connect with the circuit board of the electronic device.
- the base board 10 is provided with a wiring layer (not shown) therein, and the wiring layer electrically connects the connecting portions 112 on the first surface 11 and the connections on the second surface 12 .
- Both of the connecting portions 112 and the connections are made of conductive materials, such as copper, aluminum, tungsten, gold, silver, nickel, or alloys thereof.
- Each of the connecting portions 112 and the connections may be a metal bump, a conductive pillar, or a solder ball.
- the first redistribution layer 30 is arranged on a surface of the first chip 20 and is electrically connected to pins (not shown) of the first chip 20 .
- the first redistribution layer 30 includes a first wiring 31 and a dielectric layer 32 , and the first wiring 31 is electrically connected to the pins of the first chip 20 .
- the dielectric layer 32 may include an organic material, such as polyimide, or an inorganic material, such as silicon nitride, silicon oxide or the like, not limited thereto.
- a first connection terminal 33 and a second connection terminal 34 are arranged on a surface of the first redistribution layer 30 facing away from the first chip 20 .
- the first wiring 31 electrically connects the first connection terminal 33 and the second connection terminal 34 .
- the second redistribution layer 50 is arranged on a surface of the second chip 40 and is electrically connected to pins (not shown) of the second chip 40 .
- the second redistribution layer 50 includes a second wiring 51 and a dielectric layer 52 , and the second wiring 51 is electrically connected to the pins of the second chip 40 .
- a surface of the second redistribution layer 50 facing away from the second chip 40 is provided with a first connection terminal 53 and a second connection terminal 54 , the second wiring 51 electrically connects the first connection terminal 53 and the second connection terminal 54 .
- the surface of the second redistribution layer 50 facing away from the second chip 40 is flush with the surface of the first redistribution layer 30 facing away from the first chip 40 .
- the first chip 20 and the second chip 40 are functional chips, such as a radio frequency (RF) chip, a field programmable gate array (FPGA) chip, a digital signal processing (DSP) chip, a graphics processing unit (GPU) chip, or a central processing unit (CPU) chip.
- RF radio frequency
- FPGA field programmable gate array
- DSP digital signal processing
- GPU graphics processing unit
- CPU central processing unit
- the third redistribution layer 70 is located on a same side of the first redistribution layer 30 and the second redistribution layer 50 , and electrically connects the first redistribution layer 30 and the second redistribution layer 50 .
- the third redistribution layer 70 includes a third wiring 71 and a dielectric layer 72 .
- a surface of the third redistribution layer 70 facing away from the carrier 60 is provided with a plurality of third connection terminals 73 which are electrically connected to the third wiring 71 .
- the third connection terminals 73 are respectively connected to the second connection terminals 34 on the first redistribution layer 30 and the second connection terminals 54 on the second redistribution layer 50 , so that the third redistribution layer 70 electrically connects the first redistribution layer 30 and the second redistribution layer 50 , thereby achieving electrical connection between the first chip 20 and the second chip 40 .
- the third connection terminals 73 are electrically connected to the second connection terminals 34 and 54 by a plurality of solder balls 76 .
- the carrier 60 is arranged on a surface of the third redistribution layer 70 facing away from the first redistribution layer 30 and the second redistribution layer 50 and supports the third redistribution layer 70 .
- the carrier is a dummy die.
- a process for manufacturing each of the first redistribution layer 30 , the second redistribution layer 50 , and the third redistribution layer 70 may be implemented by using a layer-adding process which is similar to a method for manufacturing a circuit layer on a surface of a circuit board in the prior art. Redistribution layers made in this way are easy to manufacture, and the cost is low.
- the first connection terminal 33 on the first redistribution layer 30 is electrically connected to a portion of the connecting portions 112 to achieve electrical connection between the first chip 20 and the base board 10 .
- the first connection terminal 53 on the second redistribution layer 50 is electrically connected to the remaining connecting portions 112 to achieve electrical connection between the second chip 40 and the first base board 10 .
- the package structure further includes a plurality of wires 18 , the first connection terminal 33 on the first redistribution layer 30 and the first connection terminal 53 on the second redistribution layer 50 are electrically connected to the connecting portions 112 by the wires 18 .
- the first molding compound layer 80 covers the first chip 20 , the first redistribution layer 30 , the second chip 40 , and the second redistribution layer 50 .
- the surface of the first redistribution layer 30 facing away from the first chip 20 and the surface of the second redistribution layer 50 facing away from the second chip 40 are exposed from the first molding compound layer 80 .
- the first molding compound layer 80 is disposed adjacent to the base board 10 , and the carrier 60 is disposed away from the base board 10 .
- the first molding compound layer 80 is made of a non-conductive material which includes one or more of EMC (epoxy molding compound), ABS (acrylonitrile-butadiene-styrene), PC (polycarbonate), PET (polyethylene terephthalate), and other injection molding materials.
- EMC epoxy molding compound
- ABS acrylonitrile-butadiene-styrene
- PC polycarbonate
- PET polyethylene terephthalate
- FIG. 2 illustrates that the first molding compound layer 80 is arranged away from the base board 10 , and the carrier 60 is arranged adjacent to the base board 10 .
- the package structure further includes a second molding compound layer 90 which covers the first molding compound layer 80 , the first redistribution layer 30 , and the second redistribution layer 50 .
- the second molding compound layer 90 defines a plurality of through mold vias (TMVs) 92 , the first connection terminal 33 on the first redistribution layer 30 and the first connection terminal 53 on the second redistribution layer 50 are exposed from the TMVs 92 .
- the package structure further includes a plurality of conductive structures 96 which infill the TMVs 92 and are electrically connected to the connecting portions 112 of the base board 10 .
- a manufacturing method of the package structure in one embodiment includes steps as follows.
- a first chip 20 and a second chip 40 are provided, a first redistribution layer 30 is formed on a surface of the first chip 20 , and a second redistribution layer 50 is formed on a surface of the second chip 40 .
- the first redistribution layer 30 includes a first wiring 31 and a dielectric layer 32 , and the first wiring 31 is electrically connected to pins (not shown) of the first chip 20 .
- the dielectric layer 32 may include an organic material, such as polyimide, or an inorganic material, such as silicon nitride, silicon oxide or the like, not limited thereto.
- the first redistribution layer 30 on the first chip 20 and the second redistribution layer 50 on the second chip 40 are formed by using a layer-adding process.
- the first chip 20 and the second chip 40 are functional chips, such as a radio frequency (RF) chip, a field programmable gate array (FPGA) chip, a digital signal processing (DSP) chip, a graphics processing unit (GPU) chip, or a central processing unit (CPU) chip.
- RF radio frequency
- FPGA field programmable gate array
- DSP digital signal processing
- GPU graphics processing unit
- CPU central processing unit
- the first redistribution layer 30 and the second redistribution layer 50 are both attached to a surface of a temporary carrier 200 , a surface of the first redistribution layer 30 facing away from the first chip 20 being in contact with the temporary carrier 200 , and a surface of the second redistribution layer 50 facing away from the second chip 40 being in contact with the temporary carrier 200 .
- the surface of the second redistribution layer 50 facing away from the second chip 40 is flush with the surface of the first redistribution layer 30 facing away from the first chip 20 .
- a first molding compound layer 80 is formed to cover the first chip 20 , the first redistribution layer 30 , the second chip 40 , and the second redistribution layer 50 .
- the first molding compound layer 80 is made of a non-conductive material which includes one or more of EMC (epoxy molding compound), ABS (acrylonitrile-butadiene-styrene), PC (polycarbonate), PET (polyethylene terephthalate), and other injection molding materials.
- EMC epoxy molding compound
- ABS acrylonitrile-butadiene-styrene
- PC polycarbonate
- PET polyethylene terephthalate
- the temporary carrier 200 is removed to expose the surface of the first redistribution layer 30 facing away from the first chip 20 and the surface of the second redistribution layer 50 facing away from the second chip 40 outside the first molding compound layer 80 .
- a carrier 60 is provided, and a third redistribution layer 70 is formed on a surface of the carrier 60 .
- the carrier 60 supports the third redistribution layer 70 .
- the carrier is a dummy die.
- the third redistribution layer 70 includes a third wiring 71 and a dielectric layer 72 .
- the third redistribution layer 70 is bonded to the first redistribution layer 30 and the second redistribution layer 50 , and the third redistribution layer 70 is electrically connected to the first redistribution layer 30 and the second redistribution layer 50 .
- a surface of the third redistribution layer 70 facing away from the carrier 60 is provided with a plurality of third connection terminals 73 which are electrically connected to the third wiring 71 .
- a surface of the first redistribution layer 30 facing away from the first chip 20 is provided with a second connection terminal 34 which is electrically connected to the first wiring 31 .
- a surface of the second redistribution layer 50 facing away from the second chip 40 is provided with a second connection terminal 54 which is electrically connected to the second wiring 51 .
- the third connection terminals 73 are connected to the second connection terminals 34 on the first redistribution layer 30 and the second connection terminals 54 on the second redistribution layer 50 , so that the third redistribution layer 70 electrically connects the first redistribution layer 30 and the second redistribution layer 50 , thereby achieving electrical connection between the first chip 20 and the second chip 40 .
- the third connection terminals 73 are electrically connected to the second connection terminals 34 and 54 by a plurality of solder balls 76 .
- the first chip 20 and the second chip 40 are both electrically connected to the base board 10 .
- the base board 10 includes a first surface 11 and a second surface 12 facing away from the first surface 11 .
- the first surface 11 is provided with a plurality of connecting portions 112 which are electrically connected to the first chip 20 and the second chip 40 .
- the second surface 12 is electrically connected to a circuit board of an electronic device.
- the second surface 12 may be provided with a plurality of connections (not shown) which are electrically connected to the circuit board of the electronic device.
- the base board 10 is provided with a wiring layer (not shown) therein, and the wiring layer electrically connects the connecting portions 112 on the first surface 11 and the connections on the second surface 12 .
- the surface of the first redistribution layer 30 facing away from the first chip 20 is further provided with a first connection terminal 33 , and the first wiring 31 electrically connects the first connection terminal 33 and the second connection terminal 34 .
- the surface of the second redistribution layer 50 facing away from the second chip 40 is further provided with a first connection terminal 53 , and the second wiring 51 electrically connects the first connection terminal 53 and the second connection terminal 54 .
- the first connection terminal 33 on the first redistribution layer 30 and the first connection terminal 53 on the second redistribution layer 50 are electrically connected to the connecting portions 112 by the wires 18 .
- the package structure further includes a second molding compound layer 90 which covers the first molding compound layer 80 , the first redistribution layer 30 , and the second redistribution layer 50 .
- the second molding compound layer 90 defines a plurality of TMVs (TMV) 92 , the first connection terminal 33 on the first redistribution layer 30 and the first connection terminal 53 on the second redistribution layer 50 are exposed from the TMVs 92 .
- the package structure further includes a plurality of conductive structures 96 which infill the TMVs 92 and are electrically connected to the connecting portions 112 of the base board 10 .
- the first chip 20 is electrically connected to the second chip 40 by the first redistribution layer 30 , the second redistribution layer 50 , and the third redistribution layer 70 , and the redistribution layer is formed by a layer-adding process, fabrication of a through via is not required. Therefore, it is easy to fabricate the redistribution layer, and the cost is low.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (4)
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CN107104096A (en) | 2017-05-19 | 2017-08-29 | 华为技术有限公司 | Chip-packaging structure and circuit structure |
US20180269188A1 (en) * | 2017-03-15 | 2018-09-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor packages and methods of forming same |
WO2019161641A1 (en) | 2018-02-24 | 2019-08-29 | 华为技术有限公司 | Chip and packaging method |
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US20180269188A1 (en) * | 2017-03-15 | 2018-09-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor packages and methods of forming same |
CN107104096A (en) | 2017-05-19 | 2017-08-29 | 华为技术有限公司 | Chip-packaging structure and circuit structure |
WO2019161641A1 (en) | 2018-02-24 | 2019-08-29 | 华为技术有限公司 | Chip and packaging method |
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