US10985645B2 - Alternatingly-switched parallel circuit, integrated power module and integrated power package - Google Patents
Alternatingly-switched parallel circuit, integrated power module and integrated power package Download PDFInfo
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- US10985645B2 US10985645B2 US16/798,588 US202016798588A US10985645B2 US 10985645 B2 US10985645 B2 US 10985645B2 US 202016798588 A US202016798588 A US 202016798588A US 10985645 B2 US10985645 B2 US 10985645B2
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- 239000002184 metal Substances 0.000 description 125
- 229910052751 metal Inorganic materials 0.000 description 125
- 239000003990 capacitor Substances 0.000 description 27
- 238000009826 distribution Methods 0.000 description 12
- 239000000306 component Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
- H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
- H02M3/1584—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load with a plurality of power processing stages connected in parallel
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
- H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
- H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
- H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
- H02M3/325—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
- H02M3/335—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/33569—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
- H02M3/33573—Full-bridge at primary side of an isolation transformer
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
- H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
- H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
- H02M3/325—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
- H02M3/335—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/33569—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
- H02M3/33576—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements having at least one active switching element at the secondary side of an isolation transformer
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0048—Circuits or arrangements for reducing losses
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0048—Circuits or arrangements for reducing losses
- H02M1/0054—Transistor switching losses
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0048—Circuits or arrangements for reducing losses
- H02M1/0054—Transistor switching losses
- H02M1/0058—Transistor switching losses by employing soft switching techniques, i.e. commutation of transistors when applied voltage is zero or when current flow is zero
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- H02M2001/0048—
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
- H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
- H02M3/1582—Buck-boost converters
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
- H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
- H02M3/1584—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load with a plurality of power processing stages connected in parallel
- H02M3/1586—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load with a plurality of power processing stages connected in parallel switched with a phase shift, i.e. interleaved
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
- H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
- H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
- H02M3/325—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
- H02M3/335—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/33569—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
- H02M3/33576—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements having at least one active switching element at the secondary side of an isolation transformer
- H02M3/33584—Bidirectional converters
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
Definitions
- the present disclosure relates to electrical and electronic technology, and more particularly, to an alternatingly-switched parallel circuit, an integrated power module and an integrated power package.
- Power semiconductor devices are core components of energy conversion and system power supply equipment.
- the performances of the power semiconductor devices directly affect the overall efficiency of the industrial applications, especially for power supply configurations of processors, communication systems and data centers in a large number of electronic products.
- power supply circuits for processors in order to meet the requirement of a long system running time, it poses a great challenge to the entire circuit in terms of efficiency and power consumption.
- high power consumption also means temperature rise and waste of power, which threatens reliable operation of the processor system in a long run, and causes additional cost for heat dissipation for the circuit.
- the rapid improvement of the performance of the core processor and the enhanced integration of the core processor impose high requirements on the power density and efficiency of the power supply.
- the conduction loss includes not only the loss on the power devices, but also the loss on the metal connection in the circuit system. Accordingly, there is a demand for reducing the conduction loss in design of the devices and the circuits.
- FIG. 1 is a conventional topology of a power source, which includes a power switch Q 1 , a power switch Q 2 , an input power V IN , an inductor L and a filtering capacitor C o .
- An ideal power package does not have any stray parameters. While in practice, the power package has package stray parameters Z 1 and Z 2 generated by an interconnect metal layer (RDL), an external pin, a package interconnection, a system board interconnection. When there is a large current flowing in the circuit, the conduction loss will be generated on Q 1 and Q 2 as well as on the stray parameters Z 1 and Z 2 .
- RDL interconnect metal layer
- a conduction impedance of a metal layer of the device is up to 20% of the entire impedance.
- how to reduce conduction loss of other parts than the semiconductor itself and how to fully utilize the interconnect conduction path becomes an important topic.
- FIG. 2( a ) is a typical circuit in which the conduction paths are conducted in a discontinuous way, delivering power cycle by cycle.
- FIG. 2( b ) shows ideal evenly conducted current in which power is transferred continuously through the circuit.
- the power transferred through the two circuits is of the same amount, the conduction loss in the discontinuous conduction mode of FIG. 2( a ) is significantly higher than the continuous mode in FIG. 2( b ) .
- the present disclosure provides an alternatingly-switched parallel circuit at least partly formed in a power chip, an integrated power module and an integrated power package, which are capable of reducing loss of the metal layers of the power device by integrating the chip, reducing the overall loss of the power supply circuit and improving the system efficiency.
- an alternatingly-switched parallel circuit including a first bridge arm and a second bridge arm
- the first bridge arm includes: a first upper bridge-arm switch including a first terminal, a second terminal and a control terminal; and a first lower bridge-arm switch including a first terminal, a second terminal and a control terminal; wherein the second terminal of the first upper bridge-arm switch is electrically connected to the first terminal of the first lower bridge-arm switch;
- the second bridge arm includes: a second upper bridge-arm switch including a first terminal, a second terminal and a control terminal; and a second lower bridge-arm switch including a first terminal, a second terminal and a control terminal; wherein the second terminal of the second upper bridge-arm switch is electrically connected to the first terminal of the second lower bridge-arm switch; wherein the first bridge arm and the second bridge arm are at least partly formed in a chip containing a plurality of first cell groups and a plurality of second cell groups; wherein the plurality of first cell
- an integrated power module which is applied in an alternatingly-switched parallel circuit, including a first bridge arm and a second bridge arm
- the first bridge arm includes: a first upper bridge-arm switch including a first terminal, a second terminal and a control terminal; and a first lower bridge-arm switch including a first terminal, a second terminal and a control terminal; a first electrode electrically connected to the first terminal of the first upper bridge-arm switch; a second electrode electrically connected to the second terminal of the first lower bridge-arm switch; and a third electrode electrically connected to the second terminal of the first upper bridge-arm switch and the first terminal of the first lower bridge-arm switch;
- the second bridge arm includes: a second upper bridge-arm switch including a first terminal, a second terminal and a control terminal, the first electrode being electrically connected to the first terminal of the second upper bridge-arm switch; a second lower bridge-arm switch including a first terminal, a second terminal and a control terminal, the second electrode being electrically
- an integrated power package which is applied in a power circuit including a first bridge arm and a second bridge arm, the first bridge arm including a first upper bridge-arm switch and a first lower bridge-arm switch, the second bridge arm including a second upper bridge-arm switch and a second lower bridge-arm switch, wherein the integrated power package includes a first switch and a second switch, the first switch and second switch are formed in a chip, and the chip contains a plurality of first cell groups and a plurality of second cell groups; wherein the plurality of first cell groups are configured to form the first switch as the first upper bridge-arm switch of the first bridge arm, the plurality of second cell groups are configured to form the second switch as the second upper bridge-arm switch of the second bridge arm, or the plurality of first cell groups are configured to form the first switch as the first lower bridge-arm switch of the first bridge arm, the plurality of second cell groups are configured to form the second switch as the second lower bridge-arm switch of the second bridge arm; and the plurality
- an alternatingly-switched parallel circuit comprising a first bridge arm and a second bridge arm
- the first bridge arm comprises: a first upper bridge-arm switch comprising a first terminal, a second terminal and a control terminal; and a first lower bridge-arm switch comprising a first terminal, a second terminal and a control terminal; wherein the second terminal of the first upper bridge-arm switch is electrically connected to the first terminal of the first lower bridge-arm switch;
- the second bridge-arm comprises: a second upper bridge-arm switch comprising a first terminal, a second terminal and a control terminal; and a second lower bridge-arm switch comprising a first terminal, a second terminal and a control terminal; wherein the second terminal of the second upper bridge-arm switch is electrically connected to the first terminal of the second lower bridge-arm switch; wherein the first bridge arm and the second bridge arm are at least partly formed in a chip including a plurality of first cell groups and a plurality of second cell groups; wherein the
- an integrated power module which is applied in an alternatingly-switched parallel circuit comprising a first bridge arm and a second bridge arm
- the first bridge arm comprises: a first upper bridge-arm switch comprising a first terminal, a second terminal and a control terminal; and a first lower bridge-arm switch comprising a first terminal, a second terminal and a control terminal; a first electrode electrically connected to the first terminal of the first upper bridge-arm switch; a second electrode electrically connected to the second terminal of the first lower bridge-arm switch; and a third electrode electrically connected to the second terminal of the first upper bridge-arm switch and the first terminal of the first lower bridge-arm switch;
- the second bridge arm comprises: a second upper bridge-arm switch comprising a first terminal, a second terminal and a control terminal, the first electrode being electrically connected to the first terminal of the second upper bridge-arm switch; a second lower bridge-arm switch comprising a first terminal, a second terminal and a control terminal, the
- an integrated power package which is applied in a power circuit comprising a first bridge arm and a second bridge arm, the first bridge arm comprising a first upper bridge-arm switch and a first lower bridge-arm switch, the second bridge arm comprising a second upper bridge-arm switch and a second lower bridge-arm switch, wherein the integrated power package comprises a first switch and a second switch, the first switch and second switch are formed in a chip, and the chip includes a plurality of first cell groups and a plurality of second cell groups; wherein the plurality of first cell groups are configured to form the first switch as one of the first upper bridge-arm switch of the first bridge arm and the first lower bridge-arm switch of the first bridge arm, and the plurality of second cell groups are configured to form the second switch as one of the second upper bridge-arm switch of the second bridge arm and the second lower bridge-arm switch of the second bridge arm; and the plurality of first cell groups and the plurality of second cell groups are switched on and off alternatingly; where
- the technical solution of the present disclosure may have advantages and beneficial effects compared with the related art.
- the upper bridge-arm switches and/or lower bridge-arm switches of the bridge arms may be formed in the same chip.
- Cells of the groups on the chip are disposed in parallel and switched on alternatingly so that current may be conducted evenly in time domain.
- the conduction loss on the metal interconnection layer inside the chip can be reduced and the overall efficiency of the power supply system can be improved.
- FIG. 1 schematically illustrates an existing power supply topology
- FIG. 2( a ) schematically illustrates a time sequence chart of current conduction in the switch circuit as shown in FIG. 1 ;
- FIG. 2( b ) illustrates an ideal time sequence chart of evenly conducted current
- FIG. 3 schematically illustrates a circuit diagram based on theory analysis of the circuit as shown in FIG. 1 ;
- FIG. 4 schematically illustrates a circuit diagram of an alternatingly-switched parallel circuit according to a first exemplary embodiment of the present disclosure
- FIG. 5 schematically illustrates a circuit diagram of an alternatingly-switched parallel circuit according to a second exemplary embodiment of the present disclosure
- FIG. 6 schematically illustrates a circuit diagram of an alternatingly-switched parallel circuit according to a third exemplary embodiment of the present disclosure
- FIG. 7( a ) schematically illustrates a time sequence chart of current conduction of the power device as shown in FIG. 3 ;
- FIG. 7( b ) schematically illustrates a time sequence chart of current conduction of the alternatingly-switched parallel circuit as shown in FIG. 4 ;
- FIG. 8( a ) schematically illustrates a time sequence chart of current conduction of the input side of the power device as shown in FIG. 3 ;
- FIG. 8( b ) schematically illustrates a time sequence chart of current conduction of the input side of the alternatingly-switched parallel circuit as shown in FIG. 4 ;
- FIG. 9( a ) schematically illustrates two cell groups switched on simultaneously inside a power chip operated in the same phase
- FIG. 9( b ) schematically illustrates two cell groups switched off simultaneously inside a power chip operated in the same phase
- FIGS. 10( a ) and 10( b ) respectively schematically illustrate two cell groups switched on and off alternatingly inside a power chip operated in alternatingly-switched mode
- FIG. 11( a ) respectively schematically illustrate cell groups switched on and off alternatingly, with an external pin disposed near an edge position of a power chip operated in alternatingly-switched mode;
- FIGS. 12( a ) and 12( b ) respectively schematically illustrate cell groups switched on and off alternatingly, with an external pin disposed near a central position of a power chip operated in alternatingly-switched mode;
- FIGS. 13( a ) and 13( b ) respectively schematically illustrate cell groups switched on and off alternatingly, with the cell groups arranged alternatingly and an external pin disposed near an edge position of a power chip operated in alternatingly-switched mode;
- FIGS. 14( a ) and 14( b ) respectively schematically illustrate cell groups switched on and off alternatingly, with the cell groups arranged alternatingly and an external pin disposed near a central position of a power chip operated in alternatingly-switched mode;
- FIG. 15 schematically illustrates an external pin disposed near an edge position of a power chip inside a power chip operated in the same phase
- FIG. 16 schematically illustrates an external pin disposed near a central position of a power chip inside a power chip operated in the same phase
- FIG. 17 schematically illustrates distribution of external pins of a power package operated in alternatingly-switched mode as shown in FIG. 4 ;
- FIG. 18 schematically illustrates another distribution of external pins of a power package operated in alternatingly-switched mode as shown in FIG. 4 ;
- FIG. 18( a ) schematically illustrates a distribution of cell groups and pin or metal pads
- FIG. 19 schematically illustrates a first distribution of external pins of a power package operated in alternatingly-switched mode as shown in FIG. 6 ;
- FIGS. 19( a )-19( e ) schematically illustrates distributions of cell groups and pin or metal pads
- FIG. 20 schematically illustrates a second distribution of external pins of a power package operated in alternatingly-switched mode as shown in FIG. 6 ;
- FIG. 21 schematically illustrates a third distribution of external pins of a power package operated in alternatingly-switched mode as shown in FIG. 6 ;
- FIG. 22 schematically illustrates two cell groups disposed in respective regions inside a power chip operated in alternatingly-switched mode
- FIG. 23 schematically illustrates two strip-shaped cell groups arranged alternatingly and in parallel along a lateral direction inside a power chip operated in alternatingly-switched mode
- FIG. 24 schematically illustrates two polygon-shaped cell groups arranged alternatingly inside a power chip operated in alternatingly-switched mode
- FIG. 25 schematically illustrates a BUCK circuit in which an alternatingly-switched parallel circuit according to the embodiments of the present disclosure is applied;
- FIG. 26 schematically illustrates a BOOST circuit in which an alternatingly-switched parallel circuit according to the embodiments of the present disclosure is applied;
- FIG. 27 schematically illustrates a Totem-Pole circuit in which an alternatingly-switched parallel circuit according to the embodiments of the present disclosure is applied;
- FIG. 28 schematically illustrates a Full-Bridge circuit in which an alternatingly-switched parallel circuit according to the embodiments of the present disclosure is applied;
- FIG. 29 schematically illustrates a Buck-Boost circuit in which an alternatingly-switched parallel circuit according to the embodiments of the present disclosure is applied.
- FIG. 30 schematically illustrates the top view of an integrated power package with a power chip and a PVIN pin, with the geometric center of the PVIN pin overlapping the surface of the chip.
- the reference “couple” may generally refer to one component connected indirectly to another component through other components, or one component connected directly to another component without other components interposed in between.
- an article word “a/an” and “the” may refer to one or more than one, unless specifically specified.
- FIG. 3 schematically illustrates a circuit diagram based on theory analysis of FIG. 1 .
- the part in the dash-line box represents a power device such as a switch Q 1 which may be divided into two cell groups S 1 and S 2 .
- a first cell group S 1 and a second cell group S 2 form the switch Q 1 of a single bridge arm in FIG. 1 .
- a cell group S 3 and a cell group S 4 form the switch Q 2 of a single bridge arm in FIG. 1 .
- FIG. 3 shows only one bridge, as the point SW is represented.
- the two cell groups S 1 and S 2 are connected in parallel and switched on and off simultaneously.
- the current of the system is as shown in FIG. 7( a ) .
- the input current of the parallel circuit is a switch current with a peak value of 2i, as shown in FIG. 8( a ) .
- the said separated devices contain a first switch or a plurality of first switches (designated Q 1 ) and a second switch or a plurality of second switches (designated Q 2 ), wherein Q 1 and Q 2 are switched on and off alternatingly.
- Q 1 first switch or a plurality of first switches
- Q 2 second switch or a plurality of second switches
- FIG. 7( b ) shows a particular case of alternatingly-switched mode
- a first switch Q 1 and a second switch Q 2 are switched on and off alternatingly, wherein the first switch Q 1 conducts current i when the second switch Q 2 is switched off and the second switch Q 2 conducts current i when the first switch Q 1 is switched off.
- the parts outside the power device such as connection metal on the system board may be more fully utilized in the time domain, however, it cannot reduce conduction loss of metal inside the chip. Therefore, embodiments of the present disclosure provide a design of an alternatingly-switched parallel circuit inside the chip, in order to reduce conduction loss in the layers inside the chip and improve the efficiency of the entire power supply system.
- FIG. 4 schematically illustrates a circuit diagram of an alternatingly-switched parallel circuit according to a first exemplary embodiment of the present disclosure.
- the alternatingly-switched parallel circuit 200 includes a first bridge arm and a second bridge arm.
- the first bridge arm includes a first upper bridge-arm switch Q 1 and a first lower bridge-arm switch Q 3 .
- a second terminal 12 of the first upper bridge-arm switch Q 1 is electrically connected to a first terminal 31 of the first lower bridge-arm switch Q 3 .
- the second bridge arm includes a second upper bridge-arm switch Q 2 and a second lower bridge-arm switch Q 4 .
- a second terminal 22 of the second upper bridge-arm switch Q 2 is electrically connected to a first terminal 41 of the second lower bridge-arm switch Q 3 .
- each of the switches Q 1 -Q 4 may be a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET).
- MOSFET Metal-Oxide-Semiconductor Field-Effect Transistor
- Each of the switches may have a source electrode, a drain electrode and a gate electrode connected to a gate driver.
- the source electrode of the switch of the upper bridge-arm switch may be respectively connected to the drain electrode of the switch of the corresponding lower bridge-arm switch.
- the source electrode of the upper bridge-arm switch may also be respectively connected to a gate driver connected to the same upper bridge-arm switch.
- the source electrode of the first lower bridge-arm switch or the second lower bridge-arm switch may also be respectively connected to a gate driver connected to the same lower bridge-arm switch. It may be appreciated by those skilled in the art that the terms “upper” and “lower” used for describing the upper bridge-arm switches and the lower bridge-arm switches do not refer to actual and physical arrangement.
- the circuit includes a first bridge arm and a second bridge arm connected in parallel
- the alternatingly-switched parallel circuit may have a number n (n ⁇ 2) of parallel bridge arms, such as a third bridge arm, a fourth bridge arm, . . . and a n th bridge arm.
- Each of the n bridge arms includes at least two bridge-arm switches, i.e. an upper bridge-arm switch and a lower bridge-arm switch.
- the first bridge arm and the second bridge arm may be at least partly formed in a chip.
- the first upper bridge-arm switch Q 1 of the first bridge arm and the second upper bridge-arm switch Q 2 of the second bridge arm are formed in a chip 20 .
- the circuit includes n parallel bridge arms, all of the upper bridge-arm switches of the n parallel bridge arms may be formed in the same chip 20 .
- any two, three or (n ⁇ 1) of the upper bridge-arm switches of the n parallel bridge arms may be formed in the chip 20 . This is not limited in the present disclosure.
- the chip 20 includes a plurality of first cell groups S 1 and a plurality of second cell groups S 2 .
- Each of the first cell groups S 1 and the second cell groups S 2 may include one or more cells.
- the plurality of first cell groups S 1 form the first upper bridge-arm switch Q 1 of the first bridge arm, and the plurality of second cell groups S 2 form the second upper bridge-arm switch Q 2 of the second bridge arm.
- the plurality of first cell groups S 1 and the plurality of second cell groups S 2 may be independently operated in alternatingly-switched mode with a phase difference of 180 degrees, for example.
- the outlet terminals of the switches are respectively connected to a load inductor L 1 and a load inductor L 2 .
- the current in the operation mode is as shown in FIG. 7( b ) .
- S 1 and S 2 are switched on, a discontinuous current with a duty cycle D and a peak value i flows through S 1 and a discontinuous current with a duty cycle D and a peak value i flows through S 2 , respectively as shown in FIG. 4 .
- S 1 and S 2 in FIG. 4 are operated in alternatingly-switched mode (for example with a phase difference of 180°)
- the current through S 1 and S 2 flows through the input side and the input-side current has a decreased peak value i, as shown in FIG. 8( b ) .
- the chip may have only a plurality of first cell groups and a plurality of second cell groups.
- the cells inside the chip may be grouped to form different upper bridge-arm switches, and the switches may be controlled in alternatingly-switched mode. In this way, when a power of the same level is transferred, the loss may be reduced.
- Rdson is a conduction impedance of a switch
- D is a duty cycle of a current through the switch.
- the power device operated in the same phase and the power device operated in alternatingly-switched mode has the same conduction loss on the semiconductors, but the input-side current of the power device operated in alternatingly-switched mode may be more approximate to a desirable continuous conducted state.
- D is less than 50% and phase difference between Q 1 and Q 2 is 180° for the simplicity of calculation and ease of comparison, the same conclusions hold even if D is equal to or greater than 50% or phase difference is other than 180°.
- the first bridge arm and the second bridge arm may be at least partly formed in a chip.
- the first lower bridge-arm switch Q 3 of the first bridge arm and the second lower bridge-arm switch Q 4 of the second bridge arm are formed in a chip 30 .
- the alternatingly-switched parallel circuit includes n parallel bridge arms, all of the lower bridge-arm switches of the n parallel bridge arms may be formed in the chip 30 .
- any two, three or (n ⁇ 1) of the lower bridge-arm switches of the n parallel bridge arms may be formed in the chip 30 . This is not limited in the present disclosure.
- the chip which forms the first lower bridge-arm switch Q 3 and the second lower bridge-arm switch Q 4 may be a different chip from the chip which forms the first upper bridge-arm switch Q 1 and the second upper bridge-arm switch Q 2 , but the disclosure is not limited thereto.
- the chip 30 includes a plurality of first cell groups S 1 and a plurality of second cell groups S 2 .
- Each of the first cell groups S 1 and the second cell groups S 2 may include one or more cells.
- the plurality of first cell groups S 1 form the first lower bridge-arm switch Q 3 of the first bridge arm, and the plurality of second cell groups S 2 form the second lower bridge-arm switch Q 4 of the second bridge arm.
- the first bridge arm and the second bridge arm may at least partly formed in a chip.
- the first upper bridge-arm switch Q 1 and the first lower bridge-arm switch Q 3 of the first bridge arm, and the second upper bridge-arm switch Q 2 and the second lower bridge-arm switch Q 4 of the second bridge arm are formed in a chip 40 .
- the alternatingly-switched parallel circuit includes n parallel bridge arms, all of the upper and lower bridge-arm switches of the n parallel bridge arms may be formed in the chip 40 .
- any two, three or (n ⁇ 1) pairs of the upper and lower bridge-arm switches of the n parallel bridge arms may be formed in the chip 40 . This is not limited in the present disclosure.
- the chip 40 includes a plurality of first cell groups S 1 , a plurality of second cell groups S 2 , a plurality of third cell groups S 3 and a plurality of fourth cell groups S 4 .
- Each of the first cell groups S 1 , the plurality of second cell groups S 2 , the plurality of third cell groups S 3 and the plurality of fourth cell groups S 4 may include one or more cells.
- the plurality of first cell groups S 1 form the first upper bridge-arm switch Q 1 of the first bridge arm
- the plurality of second cell groups S 2 form the second upper bridge-arm switch Q 2 of the second bridge arm
- the plurality of third cell groups S 3 form the first lower bridge-arm switch Q 3 of the first bridge arm
- the plurality of fourth cell groups S 4 form the second lower bridge-arm switch Q 4 of the second bridge arm.
- the above alternatingly-switched parallel circuit 200 , 300 or 400 also includes a first inductor L 1 and a second inductor L 2 .
- a first terminal of the first inductor L 1 is electrically connected to the second terminal of the first upper bridge-arm switch Q 1 and the first terminal of the first lower bridge-arm switch Q 3 .
- a first terminal of the second inductor L 2 is electrically connected to the second terminal of the second upper bridge-arm switch Q 2 and the first terminal of the second lower bridge-arm switch Q 4 .
- a second terminal of the first inductor L 1 is electrically connected to a second terminal of the second inductor L 2 .
- the integrated power module includes at least part of a first bridge arm and a second bridge arm.
- the first bridge arm includes a first upper bridge-arm switch Q 1 and a first lower bridge-arm switch Q 3 .
- the first bridge arm also includes a first electrode PVIN electrically connected to a first terminal 11 of the first upper bridge-arm switch Q 1 , a second electrode GND electrically connected to a second terminal 32 of the first lower bridge-arm switch Q 3 , and a third electrode SW 1 electrically connected to a second terminal 12 of the first upper bridge-arm switch Q 1 and a first terminal 31 of the first lower bridge-arm switch Q 3 .
- the second bridge includes a second upper bridge-arm switch Q 2 and a second lower bridge-arm switch Q 4 .
- the first electrode MIN is electrically connected to a first terminal 21 of the second upper bridge-arm switch Q 2 .
- the second electrode GND is electrically connected to a second terminal 42 of the second lower bridge-arm switch Q 4 .
- the second bridge arm also includes a fourth electrode SW 2 electrically connected to a second terminal 22 of the second upper bridge-arm switch Q 2 and a first terminal 41 of the second lower bridge-arm switch Q 4 .
- the integrated power module also includes a first inductor L 1 and a second inductor L 2 .
- a first terminal of the first inductor L 1 is electrically connected to the third electrode SW 1 .
- a first terminal of the second inductor L 2 is electrically connected to the fourth electrode SW 2 .
- a second terminal of the first inductor L 1 is electrically connected to a second terminal of the second inductor L 2 .
- the first upper bridge-arm switch Q 1 of the first bridge arm and the second upper bridge-arm switch Q 2 of the second bridge arm are formed in a chip 20 .
- the first lower bridge-arm switch Q 3 of the first bridge arm and the second lower bridge-arm switch Q 4 of the second bridge arm are formed in a chip 30 .
- the first upper bridge-arm switch Q 1 and the first lower bridge-arm switch Q 3 of the first bridge arm, and the second upper bridge-arm switch Q 2 and the second lower bridge-arm switch Q 4 of the second bridge arm are formed in a chip 40 .
- the structure of the chips 20 , 30 and 40 are described as above, which will not be repeated herein. Also as shown in FIG. 4 , FIG. 5 and FIG.
- the power circuit further comprises an input capacitor or a plurality of capacitors connected in parallel with the first bridge arm and the second bridge arm.
- the capacitor or the plurality of capacitors should be positioned as close as possible to the said first bridge arm and/or the second bridge arm in order to reduce the effective parasitic inductance of the input loop, thus improving high-frequency switching performance of the circuit.
- the said capacitor or plurality of capacitors are integrated in the power module and disposed on top of the chip 20 , 30 or 40 to reduce the distance between the capacitors and the bridge-arm switches. That is, the capacitor overlaps with the chip 20 , 30 or 40 from a vertical view of the chip.
- the capacitor or plurality of capacitors are formed in the chip, rendering them even closer to the bridge-arm switches.
- an integrated power package which is applied in a power circuit.
- the power circuit includes a first bridge arm and a second bridge arm, the structure and configuration of which may be the same as those of the first bridge arm and the second bridge arm in the above embodiments.
- the integrated power package includes a first switch and a second switch.
- the first switch and the second switch are formed in a chip.
- a plurality of first cell groups S 1 and a plurality of second cell groups S 2 are disposed on the chip. As shown in FIG. 4 , the plurality of first cell groups S 1 are configured to form the first switch which is used as the first upper bridge-arm switch Q 1 of the first bridge arm.
- the plurality of second cell groups S 2 are configured to form the second switch which is used as the second upper bridge-arm switch Q 2 of the second bridge arm.
- the plurality of first cell groups S 1 are configured to form the first switch which is used as the first lower bridge-arm switch Q 3 of the first bridge arm.
- the plurality of second cell groups S 2 are configured to form the second switch which is used as the second lower bridge-arm switch Q 4 of the second bridge arm.
- the plurality of first cell groups S 1 and the plurality of second cell groups S 2 are switched on and off alternatingly.
- the power circuit may further comprise an input capacitor or a plurality of capacitors connected in parallel with the first bridge arm and the second bridge arm.
- the capacitor or the plurality of capacitors should be placed close to the bridge arm switches Q 1 ⁇ Q 4 .
- the capacitors are formed in the chip or the integrated power package in order to reduce the effective parasitic inductance of the input loop, thus improving high-frequency switching performance of the circuit.
- an integrated power package which is applied in a power circuit.
- the power circuit includes a first bridge arm and a second bridge arm, the structure and configuration of which may be the same as those of the first bridge arm and the second bridge arm in the above embodiments.
- the integrated power package includes a first switch, a second switch, a third switch and a fourth switch.
- the first switch, the second switch, the third switch and the fourth switch are formed in a chip.
- a plurality of first cell groups S 1 , a plurality of second cell groups S 2 , a plurality of third cell groups S 3 , and a plurality of fourth cell groups S 4 are disposed on the chip. As shown in FIG.
- the plurality of first cell groups S 1 are configured to form the first switch which is used as the first upper bridge-arm switch Q 1 of the first bridge arm.
- the plurality of second cell groups S 2 are configured to form the second switch which is used as the second upper bridge-arm switch Q 2 of the second bridge arm.
- the plurality of third cell groups S 3 are configured to form the third switch which is used as the first lower bridge-arm switch Q 3 of the first bridge arm.
- the plurality of fourth cell groups S 4 are configured to form the fourth switch which is used as the second lower bridge-arm switch Q 4 of the second bridge arm.
- the plurality of first cell groups S 1 and the plurality of second cell groups S 2 are switched on and off alternatingly.
- the power circuit further comprises an input capacitor or a plurality of capacitors connected in parallel with the first bridge arm and the second bridge arm. Similar to the previous embodiments, the capacitor or the plurality of capacitors should be placed close to the bridge arm switches Q 1 ⁇ Q 4 .
- the capacitors are formed in the chip or in the integrated power package in order to reduce the effective parasitic inductance of the input loop, thus improving high-frequency switching performance of the circuit.
- each power chip may be divided into numerous minimum functional units.
- the minimum functional units (referred to as cells in the present disclosure) may be connected to one another in parallel through conductive paths, to collectively form a semiconductor power device with current conduction capability.
- the power capacity i.e. the current conduction capability
- the cells in the power chip are divided into a number m (m ⁇ 2) of groups. Cells in each group are connected in parallel, and controlled by the same control terminal to be switched on and off simultaneously. Cells in different groups are controlled by different control terminals, and are operated in different phases (the range of the phases may be for example 0 ⁇ 180°).
- the cells are divided into groups of the number m which corresponds to the number of the switches integrated in the chip.
- an alternatingly-switched parallel circuit includes a number n of parallel bridge arms, and the upper bridge-arm switches or the lower bridge-arm switches of the n parallel bridge arms are integrated in the same chip, m is equal to n and the m groups of cells are configured to respectively form the n upper bridge-arm switches or the n lower bridge-arm switches.
- the 2n groups of cells are configured to respectively form the n upper bridge-arm switches and the n lower bridge-arm switches.
- the upper bridge-arm switches and/or lower bridge-arm switches of the k parallel bridge arms may be integrated in the same chip.
- m and n each is a positive integer.
- the plurality of first cell groups S 1 and the plurality of second cell groups S 2 are switched on and off alternatingly.
- the plurality of first cell groups S 1 and the plurality of second cell groups S 2 are switched on and off in an alternatingly-switched mode, wherein the plurality of first cell groups S 1 and the plurality of second cell groups S 2 are switched on and off alternatingly and cyclically with the same period and a certain phase difference.
- the plurality of first cell groups S 1 and the plurality of second cell groups S 2 may be switched on and off in an alternatingly-switched mode with a phase difference of 180 degrees.
- the plurality of first cell groups S 1 and the plurality of second cell groups S 2 may be switched on and off in an alternatingly-switched mode with a phase difference of 120 degrees. In another embodiment, the plurality of first cell groups S 1 and the plurality of second cell groups S 2 may be switched on and off in an alternatingly-switched mode with a phase difference of 90 degrees. As an example, the alternatingly-switched mode with a phase difference of 180 degrees will be described in detail below.
- FIGS. 9( a ), 9( b ), 10( a ) and 10( b ) each being a cross-sectional schematic representation of a power chip
- a first cell group S 1 and a second cell group S 2 are disposed adjacent to each other, respectively represented by a dash-line box.
- a first metal layer M 1 is interconnection metal inside the chip, and configured to interconnect different cell groups.
- the impedance of the metal interconnection between the first cell group S 1 and the second cell group S 2 is r.
- the impedance of the path leading outside to the first electrode PVIN at the input side is R. Since the distance between the two groups of cells are generally far less than the distance between one group of cells and the PVIN PAD, it can be presumed that r ⁇ R and r may be negligible.
- surface metal for packaging the chip will also cause conduction loss.
- conduction loss will be influenced by the position of the packaged pin (the position where the pin leads out), distribution of the cell groups operated in alternatingly-switched mode, and other factors. Therefore, more cells need to be analyzed.
- the cells inside the power chip which are operated in alternatingly-switched mode are divided into S 1 and S 2 , and in each group, more cells are connected in parallel.
- first cell groups S 1 and a plurality of second cell groups S 2 are disposed inside one power chip. It should be noted that, although in the figure only two first cell groups S 1 and two second cell groups S 2 are shown for illustration, in practice, the number of the first cell groups S 1 and the second cell groups S 2 are not limited. Moreover, the cells may not only be divided into two cell groups, but there may be a third cell group, a fourth cell group, . . . , a m th cell group, where m is a positive integer.
- the m cell groups are switched on and off in alternatingly-switched mode, and adjacent two cell groups have phase difference of 2 ⁇ /m, the cell groups of the same ordinal number are switched simultaneously.
- the plurality of first cell groups S 1 are switched on and off simultaneously
- the plurality of second cell groups S 2 are switched on and off simultaneously
- the first cell groups S 1 and the second cell groups S 2 are operated in alternatingly-switched mode.
- the plurality of first cell groups S 1 have a first external pin or a plurality of first external pins.
- the plurality of second cell groups S 2 have a second external pin or a plurality of second external pins.
- the said first external pin or one of the plurality of first external pins and the said second external pin or one of the plurality of second external pins may be electrically connected.
- S 1 and S 2 may share the same external pin, shown as pin P in FIGS. 11 ⁇ 16 .
- the cells are connected to a second metal layer M 2 through surface PADs, that is, the package of the surface pads are connected to the metal layer. It may be assumed that the impedance of the interconnect metal of the package metal between the PADs is R 0 .
- the external pin of the power device operated in alternatingly-switched mode is near an edge (for example, the leftmost side) of the power chip and the two cell groups S 1 and S 2 are respectively distributed in two regions of the power chip.
- two first cell groups S 1 are disposed on the left side of the power chip
- two second cell groups S 2 are disposed on the right side of the power chip.
- the two first cell groups S 1 are simultaneously switched on
- the two second cell groups S 2 are simultaneously switched off.
- the two first cell groups S 1 are simultaneously switched off, and the two second cell groups S 2 are simultaneously switched on.
- the external pin p is disposed at the first one of the two first cell groups S 1 .
- the external pin of the power device operated in alternatingly-switched mode is near the central position of the power chip and the two cell groups S 1 and S 2 are respectively distributed in two regions of the power chip.
- the FIGS. 12( a ) and 12( b ) differ from the FIGS. 11( a ) and 11( b ) in that, the external pin p is disposed at the second one of the two first cell groups S 1 .
- the external pin of the power device operated in alternatingly-switched mode is near an edge of the power chip.
- Cell groups S 1 are disposed in a plurality of first sub-regions of the power chip
- cell groups S 2 are disposed in a plurality of second sub-regions of the power chip, the first sub-regions and the second sub-regions are arranged alternatingly.
- one of the said first cell groups disposed in the first sub-regions is positioned between two of the said second cell groups disposed in the second sub-regions and one of the said second cell groups disposed in the second sub-regions is positioned between two of the said first cell groups disposed in the first sub-regions along a particular direction or from a certain cross-sectional view.
- a first one of the second cell groups S 2 is disposed between a first one of the first cell groups S 1 and a second one of the first cell groups S 1
- a second one of the first cell groups S 1 is disposed between the first one of the second cell groups S 2 and the second one of the second cell groups S 2 .
- the plurality of first cell groups S 1 and the plurality of second cell groups S 2 may be arranged similarly.
- the external pin p is disposed at the first one of the first cell groups S 1 .
- the external pin of the power device operated in alternatingly-switched mode is near the central position of the power chip and the two cell groups S 1 and S 2 are arranged alternatingly.
- the FIGS. 14( a ) and 14( b ) differ from the FIGS. 13( a ) and 13( b ) in that the external pin p is disposed at the first one of the second cell groups S 2 .
- the external pin of the power device operated in the same phase is near an edge of the power chip.
- the plurality of first cell groups S 1 and the plurality of second cell groups S 2 are simultaneously switched on and off.
- the external pin p is disposed at the first one of the first cell groups S 1 .
- FIG. 16 differs from FIG. 15 in that the external pin p is disposed at the second one of the first cell groups S 1 .
- FIG. 16 10i 2 R0 ⁇ D 6i 2 R0 ⁇ D 8i 2 R0 ⁇ D 4i 2 R0 ⁇ D 14i 2 R0 ⁇ D 6i 2 R0 ⁇ D
- the power device operated in alternatingly-switched mode is advantageous in reducing the loss of the package metal layer.
- the geometric center of one of the pins with the same reference (such as PVIN) or the geometric center of one of the metal PADs with the same reference is overlapping with the surface of the chip, when viewed from top view or bottom view of the chip, to reduce the distance between the pin and the center of the chip. That is, the outline of the pin or pad is projected to the plane containing the surface of the chip in a direction perpendicular to the surface of the chip, and the geometric center of the projection of such pin or pad may be located within the area of the surface of the chip (as shown in FIG. 30 ).
- the distance between the geometric center of one of the pins with the same reference and the geometric center of the surface of the chip is less than half of the width or length of the chip.
- “arranged alternatingly” means that the cells in different cell groups in the power chip operated in alternatingly-switched mode are arranged alternatingly, that is, a distance between the geometric centers of cell groups of any two ordinal numbers is less than half of the width of the chip.
- the leading out position of the package pin or the position of the metal PAD on the surface of the chip is required to be defined at the near-central position of the chip based on the above discussion.
- the distribution of the external pins of the power package or the metal PADs of the power chip operated in alternatingly-switched mode of FIG. 4 may be shown in FIG. 17 .
- the first electrode PVIN is led out at the central position of the power package or power chip, and the surface of the first electrode PVIN is overlapped with the geometric center of surface of the chip.
- a reference number 50 represents an edge of the power package or the power chip.
- different pins or metal PADs are evenly distributed on the surface of the power package or the power chip.
- a reference number 60 represents an edge of the power package or the power chip.
- Q 1 and Q 2 are defined in the same power chip which operate in alternatingly-switched mode.
- the power chip further contains a plurality of PVIN pins or metal PADs, a plurality of SW 1 pins or metal PADs, and a plurality of SW 2 pins or metal PADs.
- PVIN metal pads are electrically connected to the first terminals of both of the upper bridge-arm switches Q 1 and Q 2
- SW 1 metal pads are electrically connected to the second terminal of the first upper bridge-arm switch Q 1
- SW 2 metal pads are electrically connected to the second terminal of the second upper bridge-arm switch Q 2 .
- the pad PVIN is in parallel with the pads SW 1 and SW 2 .
- SW 1 and SW 2 pads are located at one side of the pad PVIN. And the pads SW 1 and SW 2 are in an alternating arrangement.
- cell groups S 1 are configured to form switches Q 1
- cell groups S 2 are configured to form switches Q 2 .
- Cell groups S 1 and S 2 are arranged alternatingly in the chip. At least one of the cell groups S 1 is positioned overlapping with the metal pads PVIN and SW 1 . That is to say, the projection of the at least one of the cell group S 1 to the bottom surface of the chip and the projection of its nearest pad PVIN to the bottom surface of the chip are at least partially overlapped with each other.
- the projection of the at least one of the cell group S 1 to the bottom surface of the chip and the projection of the pads SW 1 to the bottom surface of the chip are at least partially overlapped with each other.
- at least one of the cell groups S 2 is positioned overlapping with the pads PVIN and SW 2 . That is to say, the projection of the at least one of the cell group S 2 to the bottom surface of the chip is at least partially overlapped with the projection of PVIN and SW 2 to the bottom surface of the chip.
- Switches Q 1 and Q 2 are switched on and off alternatingly. By this arrangement, cell groups S 1 and S 2 are close to and share the same PVIN metal pad. According to the formula (3) and formula (4), the conduction loss of metal pads PVIN is much lower than the case where only one switch (e.g., Q 1 or Q 2 ) is formed in the chip.
- one power chip may also be defined as a plurality of lower bridge-arm switches Q 3 and Q 4 , and may even be defined as a plurality of upper bridge-arm switches Q 1 and Q 2 and a plurality of lower bridge-arm switches Q 3 and Q 4 .
- the above discussed design method and principle are all applicable.
- Q 1 , Q 2 , Q 3 and Q 4 are defined in the same power chip operated in alternatingly-switched mode.
- the power chip requires more different pins or metal PADs. However, the pins and the metal PADs are still arranged symmetrically close to the center.
- a reference number 70 represents an edge of the power package or the power chip.
- Q 1 , Q 2 , Q 3 and Q 4 are defined in the same power chip operated in alternatingly-switched mode.
- the power chip further contains a PVIN pin or metal PAD, a GND pin or metal PAD, a SW 1 pin or metal PAD, and a SW 2 pin or metal PAD.
- the SW 1 and SW 2 metal pads are arranged between the PVIN metal pad and the GND metal pad.
- PVIN metal pad is electrically connected to the first terminals of both of the upper bridge-arm switches Q 1 and Q 2
- GND metal pad is electrically connected to the second terminals of both of the lower bridge-arm switches Q 3 and Q 4
- SW 1 metal pad is electrically connected to the second terminal of the first upper bridge-arm switch Q 1 and the first terminal of the first lower bridge-arm switch Q 3
- SW 2 metal pad is electrically connected to the second terminal of the second upper bridge-arm switch Q 2 and the first terminal of the second lower bridge-arm switch Q 4 .
- cell groups S 1 are configured to form switches Q 1
- cell groups S 2 are configured to form switches Q 2
- cell groups S 3 are configured to form switches Q 3
- cell groups S 4 are configured to form switches Q 4 .
- At least one of the cell groups S 1 and one of the cell groups S 2 are positioned overlapping with the same PVIN metal pad, and at least one of the cell groups S 3 and one of the cell groups S 4 are positioned overlapping with the same GND metal pad.
- at least one of the cell groups S 1 and one of the cell groups S 3 are positioned overlapped with pad SW 1
- at least one of the cell groups S 2 and one of the cell groups S 4 are positioned overlapped with pad SW 2 .
- the projections of the cell groups to the bottom surface of the chip are at least partially overlapped with the corresponding projections of the pads to the bottom surface of the chip.
- Switches Q 1 and Q 2 are switched on and off alternatingly, and switches Q 3 and Q 4 are switched on and off alternatingly.
- cell groups S 1 and S 2 are close to and share the same PVIN metal pad
- cell groups S 3 and S 4 are close to and share the same GND metal pad.
- the conduction losses of metal pads PVIN and GND are much lower h the case where only one bridge arm (e.g., Q 1 and Q 3 ) is formed in the chip.
- the geometric center of all of the pins or metal PADs is close to the central position of the surface of the chip, thereby further improving the utilization of the metals in the whole and reducing metal conduction loss for the chip and for the package of the chip.
- Q 1 , Q 2 , Q 3 and Q 4 are defined in the same power chip operated in alternatingly-switched mode.
- the power chip further contains a plurality of PVIN pins or metal PADs, a plurality of GND pins or metal PADs, a plurality of SW 1 pins or metal PADs, and a plurality of SW 2 pins or metal PADs.
- the SW 1 and SW 2 metal pads are arranged between the PVIN metal pads and the GND metal pads. In FIG. 19( b ) , SW 1 and SW 2 pads are almost in a line.
- PVIN metal pads are electrically connected to the first terminals of both of the upper bridge-arm switches Q 1 and Q 2
- GND metal pads are electrically connected to the second terminals of both of the lower bridge-arm switches Q 3 and Q 4
- SW 1 metal pads are electrically connected to the second terminal of the first upper bridge-arm switch Q 1 and the first terminal of the first lower bridge-arm switch Q 3
- SW 2 metal pads are electrically connected to the second terminal of the second upper bridge-arm switch Q 2 and the first terminal of the second lower bridge-arm switch Q 4 .
- cell groups S 1 are configured to form switches Q 1
- cell groups S 2 are configured to form switches Q 2
- groups S 3 are configured to form switches Q 3
- cell groups S 4 are configured to form switches Q 4 .
- Cell groups S 1 and S 3 are arranged alternatingly in the chip in a first direction e.g. the vertical direction in FIG. 19( b ) .
- Cell groups S 2 and S 4 are arranged alternatingly in the chip in the first direction, e.g. the vertical direction. At least one of the cell groups S 1 and one of the cell groups S 2 are positioned overlapping with the same PVIN metal pad, and at least one of the cell groups S 3 and one of the cell groups S 4 are positioned overlapping with the same GND metal pad.
- At least one of the cell groups S 1 and one of the cell groups S 3 are positioned overlapped with pad SW 1
- at least one of the cell groups S 2 and one of the cell groups S 4 are positioned overlapped with pad SW 2 . That is to say, the projections of the cell groups to the bottom surface of the chip are at least partially overlapped with the corresponding projections of the pads to the bottom surface of the chip.
- Switches Q 1 and Q 2 are switched on and off alternatingly, and switches Q 3 and Q 4 are switched on and off alternatingly.
- cell groups S 1 and S 2 are close to and share the same PVIN metal pad
- cell groups S 3 and S 3 are close to and share the same GND metal pad.
- the conduction losses of metal pads PVIN and GND are much lower than the case where only one bridge arm (e.g., Q 1 and Q 3 ) is formed in the chip. Also, the geometric center of all of the pins or metal PADs is close to the central position of the surface of the chip, thereby further improving the utilization of the metals in the whole and reducing metal conduction loss for the chip and for the package of the chip.
- Q 1 , Q 2 , Q 3 and Q 4 are defined in the same power chip operated in alternatingly-switched mode.
- the power chip further contains a PVIN pin or metal PAD, a GND pin or metal PAD, a plurality of SW 1 pins or metal PADs, and a plurality of SW 2 pins or metal PADs.
- the SW 1 and SW 2 metal pads are arranged alternatingly between the PVIN metal pad and the GND metal pad.
- SW 1 and SW 2 pads are in parallel with PVIN and GNDs pads and are almost arranged alternatingly in a line.
- SW 1 and SW 2 pads may be arranged in a zig-zag way alternatingly between the PVIN and GND pads as shown in FIG. 19( d ) .
- PVIN metal pad is electrically connected to the first terminals of both of the upper bridge-arm switches Q 1 and Q 2
- GND metal pad is electrically connected to the second terminals of both of the lower bridge-arm switches Q 3 and Q 4
- SW 1 metal pads are electrically connected to the second terminal of the first upper bridge-arm switch Q 1 and the first terminal of the first lower bridge-arm switch Q 3
- SW 2 metal pads are electrically connected to the second terminal of the second upper bridge-arm switch Q 2 and the first terminal of the second lower bridge-arm switch Q 4 .
- cell groups S 1 are configured to form switches Q 1
- cell groups S 2 are configured to form switches Q 2
- cell groups S 3 are configured to form switches Q 3
- cell groups S 3 are configured to form switches Q 4
- Cell groups S 1 and S 2 are arranged alternatingly in the chip in a second direction e.g. the horizontal direction.
- Cell groups S 3 and S 4 are arranged alternatingly in the chip in the second direction e.g. the horizontal direction.
- At least one of the cell groups S 1 and one of the cell groups S 2 are positioned overlapping with the same PVIN metal pad
- at least one of the cell groups S 3 and one of the cell groups S 4 are positioned overlapping with the same GND metal pad.
- At least one of the cell groups S 1 and one of the cell groups S 3 are positioned overlapped with pad SW 1 . While at least one of the cell groups S 2 and one of the cell groups S 4 are positioned overlapped with pad SW 2 . That is to say, the projections of the cell groups to the bottom surface of the chip are at least partially overlapped with the corresponding projections of the pads to the bottom surface of the chip. Switches Q 1 and Q 2 are switched on and off alternatingly, and switches Q 3 and Q 4 are switched on and off alternatingly. By this arrangement, cell groups S 1 and S 2 are close to and share the same PVIN metal pad, cell groups S 3 and S 4 are close to and share the same GND metal pad in the time domain.
- the conduction losses of metal pads PVIN and GND are much lower than the case where only one bridge arm (e.g., Q 1 and Q 3 ) is formed in the chip. Also, the geometric center of all of the pins or metal PADs is close to the central position of the surface of the chip, thereby further improving the utilization of the metals in the whole and reducing metal conduction loss for the chip and for the package of the chip.
- FIG. 19( c ) can be combined with that in FIG. 19( b ) . That is to say, as shown in FIG. 19( e ) , cell groups S 1 and S 2 are arranged alternatingly in the chip in the second direction; and cell groups S 3 and S 4 are also arranged alternatingly in the chip in the second direction. While cell groups S 1 and S 3 or cell groups S 2 and S 4 are arranged alternatingly in the chip in the first direction.
- At least one of the cell groups S 1 and one of the cell groups S 2 are positioned overlapping with the same PVIN metal pad, and at least one of the cell groups S 3 and one of the cell groups S 4 are positioned overlapping with the same GND metal pad.
- at least one of the cell groups S 1 and one of the cell groups S 3 are positioned overlapped with pad SW 1
- at least one of the cell groups S 2 and one of the cell groups S 4 are positioned overlapped with pad SW 2 . That is to say, the projections of the cell groups to the bottom surface of the chip are at least partially overlapped with the corresponding projections of the pads to the bottom surface of the chip.
- SW 1 and SW 2 metal pads are arranged alternatingly between the PVIN metal pad and the GND metal pad.
- SW 1 and SW 2 pads are in parallel with PVIN and GNDs pads and are almost arranged alternatingly in a line.
- SW 1 and SW 2 pads may be arranged in a zig-zag way alternatingly between the PVIN and GND pads.
- the geometric center of all of the pins or metal PADs is close to the central position of the surface of the chip, thereby further improving the utilization of the metals in the whole and reducing metal conduction loss for the chip and for the package of the chip.
- FIG. 20 schematically shows a second distribution of the external pins of the power package or the metal PADs of the power chip operated in alternatingly-switched mode as shown in FIG. 6 .
- FIG. 21 schematically shows a third distribution of the external pins of the power package or the metal PADs of the power chip operated in alternatingly-switched mode as shown in FIG. 6 .
- the shapes of the electrodes are shown in hexagons for example. Along a particular direction of a hexagon, the first electrode PVIN and the second electrode GND are distributed alternatingly and the third electrode SW 1 and the fourth electrode SW 2 are distributed alternatingly.
- FIGS. 22-24 illustrate different distribution of the chip.
- a first cell group or a plurality of first cell groups S 1 are disposed in a first region of a chip 20
- a second cell group or a plurality of second cell groups S 2 are disposed in a second region of a chip 20 .
- two cell groups S 1 and S 2 inside a power chip are respectively disposed in a first region and a second region.
- a reference number 80 represents an edge of the power chip.
- cell groups S 1 and cell groups S 2 are arranged alternatingly in lateral direction, and disposed in parallel.
- the first region which contains cell groups S 1 includes a plurality of first sub-regions
- the second region which contains cell groups S 2 includes a plurality of second sub-regions.
- Each of the first sub-regions and the second sub-regions is in a strip shape.
- the plurality of first sub-regions and the plurality of second sub-regions are arranged alternatingly and disposed in parallel.
- the cells on the chip are disposed in different regions, and each sub-electrode leading out of each cell has a shape corresponding to the shape of a respective region.
- a reference number 90 represents an edge of the power chip.
- FIG. 24 different cell groups are distributed alternatingly and each of the cell groups is in a polygon.
- the cell groups on the chip operated in alternatingly-switched mode are arranged alternatingly not only in the lateral direction but also in other directions.
- the first region includes a plurality of first sub-regions
- the second region includes a plurality of second sub-regions.
- Each of the first sub-regions and the second sub-regions is in a polygon shape.
- the plurality of first sub-regions and the plurality of second sub-regions are arranged alternatingly.
- FIG. 24 only shows cell groups each in a quadrilateral shape, in practice, the shape of the cell group may be any polygon, such as pentagon, hexagon, and so on.
- a reference number 100 represents an edge of the power chip.
- the above power chip operated in alternatingly-switched mode may be applied to almost any existing circuit topology which allows operation in alternatingly-switched mode or interleaved mode, such as any of a BUCK circuit, a BOOST circuit or a Totem-Pole circuit, a Full-Bridge circuit, and a Buck-Boost circuit.
- FIG. 25 schematically illustrates a BUCK circuit in which an alternatingly-switched parallel circuit according to the embodiments of the present disclosure is applied.
- the BUCK circuit i.e. buck chopper circuit is one of a basic DC-DC circuit, generally used for DC to DC step-down conversion.
- the BUCK circuit is a single-tube non-isolated DC to DC converter with an output voltage lower than the input voltage, also known as a buck converter.
- the BUCK circuit includes a first bridge arm and a second bridge arm which are switched on alternatingly and connected in parallel.
- the first bridge arm includes a first upper bridge-arm switch Q 1 and a first lower bridge-arm switch Q 2 .
- the second bridge arm includes a second upper bridge-arm switch Q 3 and a second lower bridge-arm switch Q 4 .
- a first terminal of the first upper bridge-arm switch Q 1 of the first bridge arm and a first terminal of the second upper bridge-arm switch Q 3 of the second bridge arm are electrically connected to a power source V IN .
- a second terminal of the first lower bridge-arm switch Q 2 of the first bridge arm and a second terminal of the second lower bridge-arm switch Q 4 of the second bridge arm are electrically connected to ground.
- the BUCK circuit also includes stray parameters Z 1 and Z 2 .
- the BUCK circuit also includes a first inductor L 1 and a second inductor L 2 .
- the first inductor L 1 is electrically connected to a second terminal of the first upper bridge-arm switch Q 1 and a first terminal of the first lower bridge-arm switch Q 2 .
- the second inductor L 2 is electrically connected to a second terminal of the second upper bridge-arm switch Q 3 and a first terminal of the second lower bridge-arm switch Q 4 .
- a second terminal of the first inductor L 1 and a second terminal of the second inductor L 2 are electrically connected to a load capacitor C O .
- Q 1 -Q 4 are switches generally driven by a Pulse Width Modulation (PWM) signal.
- PWM Pulse Width Modulation
- FIG. 26 schematically illustrates a BOOST circuit in which an alternatingly-switched parallel circuit according to the embodiments of the present disclosure is applied.
- the BOOST circuit is a DC to DC converter with an output voltage higher than the input voltage, also known as a boost converter.
- the BOOST circuit includes a first bridge arm and a second bridge arm which are switched on alternatingly and connected in parallel.
- the first bridge arm includes a first upper bridge-arm switch Q 1 and a first lower bridge-arm switch Q 2 .
- the second bridge arm includes a second upper bridge-arm switch Q 3 and a second lower bridge-arm switch Q 4 .
- a second terminal of the first upper bridge-arm switch Q 1 of the first bridge arm and a first terminal of the first lower bridge-arm switch Q 2 of the first bridge arm are electrically connected to a power source V IN through a first inductor L 1 .
- a second terminal of the second upper bridge-arm switch Q 3 of the second bridge arm and a first terminal of the second lower bridge-arm switch Q 4 of the second bridge arm are electrically connected to the power source V IN through a second inductor L 2 .
- a second terminal of the first lower bridge-arm switch Q 2 of the first bridge arm and a second terminal of the second lower bridge-arm switch Q 4 of the second bridge arm are connected to ground.
- the BOOST circuit also includes stray parameters Z 1 and Z 2 .
- the first terminal of the first upper bridge-arm switch Q 1 and the first terminal of the second upper bridge-arm switch Q 3 are electrically connected to a first terminal of a load capacitor C O through the stray parameter Z 1 .
- the second terminal of the first lower bridge-arm switch Q 2 and the second terminal of the second lower bridge-arm switch Q 4 are electrically connected to a second terminal of the load capacitor C O through the stray parameter Z 2 .
- Q 1 -Q 4 are switches generally driven by a Pulse Width Modulation (PWM) signal.
- PWM Pulse Width Modulation
- the duty cycle of Q 1 -Q 4 is restricted to less than 1, and they are not allowed to operate with a duty cycle of 1.
- the first inductor L 1 and the second inductor L 2 are at the input side and referred to as boost inductors.
- FIG. 27 schematically illustrates a Totem-Pole circuit in which an alternatingly-switched parallel circuit according to the embodiments of the present disclosure is applied.
- the Totem-Pole circuit includes a first bridge arm and a second bridge arm which are switched on alternatingly and connected in parallel.
- the first bridge arm includes a first upper bridge-arm switch Q 1 and a first lower bridge-arm switch Q 2 .
- the second bridge arm includes a second upper bridge-arm switch Q 3 and a second lower bridge-arm switch Q 4 .
- a second terminal of the first upper bridge-arm switch Q 1 of the first bridge arm and a first terminal of the first lower bridge-arm switch Q 2 of the first bridge arm are electrically connected to a first terminal of a power source V IN through a first inductor L 1 .
- a second terminal of the second upper bridge-arm switch Q 3 of the second bridge arm and a first terminal of the second lower bridge-arm switch Q 4 of the second bridge arm are electrically connected to the first terminal of the power source V IN through a second inductor L 2 .
- a second terminal of the first lower bridge-arm switch Q 2 of the first bridge arm and a second terminal of the second lower bridge-arm switch Q 4 of the second bridge arm are connected to ground.
- the Totem-Pole circuit also includes a first diode D 1 and a second diode D 2 connected in series. The branch of the first diode D 1 and the second diode D 2 is connected to the first bridge arm and the second bridge arm in parallel.
- the anode of the first diode D 1 is electrically connected to the cathode of the second diode D 2 .
- the cathode of the first diode D 1 is electrically connected to a first terminal of the first bridge arm and the second bridge arm.
- the second terminal of the second diode D 2 is connected to ground.
- the anode of the first diode D 1 and the cathode of the second diode D 2 are electrically connected to a second terminal of the power source V IN .
- the Totem-Pole circuit also includes stray parameters Z 1 and Z 2 .
- the first terminal of the first upper bridge-arm switch Q 1 and the first terminal of the second upper bridge-arm switch Q 3 are electrically connected to a first terminal of a load capacitor C O through the parameter Z 1 .
- the second terminal of the first lower bridge-arm switch Q 2 and the second terminal of the second lower bridge-arm switch Q 4 are electrically connected to a second terminal of the load capacitor C O through the parameter Z 2 .
- a Full-Bridge circuit is a circuit wherein a first bridge arm and a second bridge arm are connected in parallel and a passive device (such as a capacitor, an inductor, or a transformer) or a plurality of passive devices are connected to the mid-terminals of the first bridge arm and the second bridge arm.
- FIG. 28 shows one example of the Full-Bridge circuit.
- the primary side of Full-Bridge circuit includes a first bridge arm and a second bridge arm which are switched on alternatingly and connected in parallel.
- the first bridge arm includes a first upper bridge-arm switch Q 1 and a first lower bridge-arm switch Q 2 .
- the second bridge arm includes a second upper bridge-arm switch Q 3 and a second lower bridge-arm switch Q 4 .
- a first terminal of the first upper bridge-arm switch Q 1 of the first bridge arm and a first terminal of the second upper bridge-arm switch Q 3 of the second bridge arm are electrically connected to a power source Vin+.
- a second terminal of the first lower bridge-arm switch Q 2 of the first bridge arm and a second terminal of the second lower bridge-arm switch Q 4 of the second bridge arm are electrically connected to Vin ⁇ .
- the secondary side of Full-Bridge circuit may include a third bridge arm and a fourth bridge arm which are switched on alternatingly and connected in parallel.
- the third bridge arm includes a third upper bridge-arm switch Q 5 and a third lower bridge-arm switch Q 6 .
- the fourth bridge arm includes a fourth upper bridge-arm switch Q 7 and a fourth lower bridge-arm switch Q 8 .
- a first terminal of the third upper bridge-arm switch Q 5 of the third bridge arm and a first terminal of the fourth upper bridge-arm switch Q 7 of the fourth bridge arm are electrically connected to the positive terminal of the load V O +.
- a second terminal of the third lower bridge-arm switch Q 6 of the third bridge arm and a second terminal of the fourth lower bridge-arm switch Q 8 of the fourth bridge arm are electrically connected to the negative terminal of the load V O ⁇ .
- the Full-Bridge circuit also includes a magnetic component, such as a transformer Tr.
- the primary side of the transformer Tr is connected in series with an inductor Lr and a capacitor Cr.
- a first terminal of the capacitor Cr is electrically connected to a second terminal of the first upper bridge-arm switch Q 1 and a first terminal of the first lower bridge-arm switch Q 2 (as the mid-terminal of the first bridge arm).
- a second terminal of the primary side of the transformer Tr is connected to a second terminal of the second upper bridge-arm switch Q 3 and a first terminal of the second lower bridge-arm switch Q 4 (as the mid-terminal of the second bridge arm).
- a first terminal of the secondary side of the transformer Tr is electrically connected to a second terminal of the third upper bridge-arm switch Q 5 and a first terminal of third first lower bridge-arm switch Q 6 (as the mid-terminal of the third bridge arm).
- a second terminal of the secondary side of the transformer Tr is electrically connected to a second terminal of the fourth upper bridge-arm switch Q 7 and a first terminal of the fourth lower bridge-arm switch Q 8 (as the mid-terminal of the fourth bridge arm).
- Q 1 -Q 8 are switches generally driven by a Pulse Width Modulation (PWM) signal.
- PWM Pulse Width Modulation
- the full-bridges are provided in both primary and secondary sides, wherein the first bridge arm and the second bridge arm form the first full-bridge and the third bridge arm and the fourth bridge arm form the second full bridge, that is to say, the circuit in FIG. 28 has two “full-bridges”.
- a circuit may have one “full-bridge”, such as a circuit having a full-bridge in its primary side and a full-wave rectifier in its secondary side. And this kind of circuit is also one example of “Full-Bridge circuit”.
- a Buck-Boost circuit includes a first bridge arm and a second bridge arm which are switched on alternatingly.
- the first bridge arm includes a first upper bridge-arm switch Q 1 and a first lower bridge-arm switch Q 2 .
- the second bridge arm includes a second upper bridge-arm switch Q 3 and a second lower bridge-arm switch Q 4 .
- a first terminal of the first upper bridge-arm switch Q 1 of the first bridge arm is electrically connected to a power source Vin+.
- a first terminal of the second upper bridge-arm switch Q 3 of the second bridge arm is electrically connected to a load Vo+.
- the Buck-Boost circuit also includes a magnetic component, such as an inductor Lr.
- a first terminal of the inductor Lr is electrically connected to a second terminal of the first upper bridge-arm switch Q 1 and a first terminal of the first lower bridge-arm switch Q 2 .
- a second terminal of the inductor Lr is electrically connected to a second terminal of the second upper bridge-arm switch Q 3 and a first terminal of the second lower bridge-arm switch Q 4 . That is to say, the inductor Lr is connected to the mid-terminals of the first bridge arm and the second bridge arm.
- Q 1 -Q 4 are switches generally driven by a Pulse Width Modulation (PWM) signal.
- PWM Pulse Width Modulation
- alternatingly-switched parallel circuit integrated power module and the integrated power package of the present disclosure
- utilization of the interconnection conduction paths such as the metal layers inside the chip, in the package and in the system board can be significantly improved when the power chip is operated in alternatingly-switched mode, and the unevenness of theses metal conductors due to the switch operation mode can be effectively reduced.
- the loss of the conduction paths can be significantly reduced and it facilitates reducing the volume of the power module which contains the chip and improving its efficiency.
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Abstract
Description
(2i)2×(Rdson/2)×D=2i 2 Rdson×D (1)
((i)2×(Rdson)+(i)2×(Rdson))×D=2i 2 Rdson×D (2)
(2i)2×(R/2)×D=2i 2 R×D (3)
i 2×(R/2)×D×i 2×(R/2)×D=i 2 R×D (4)
TABLE 1 | |||||
FIGS. 11(a) | FIG. 12(a) | FIG. 13(a) | FIG. 14(a) | ||
and 11(b) | and 12(b) | and 13(b) | and 14(b) | FIG. 15 | FIG. 16 |
10i2R0 × D | 6i2R0 × D | 8i2R0 × D | 4i2R0 × D | 14i2R0 × D | 6i2R0 × D |
Claims (17)
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CN201610783952.4A CN107800294B (en) | 2016-08-31 | 2016-08-31 | Crisscross parallel circuit, power integration module and power integrated chip |
US15/482,982 US10198020B2 (en) | 2016-08-31 | 2017-04-10 | Interleaved parallel circuit, integrated power module and integrated power chip |
US16/231,969 US10620654B2 (en) | 2016-08-31 | 2018-12-25 | Alternatingly-switched parallel circuit, integrated power module and integrated power package |
US16/798,588 US10985645B2 (en) | 2016-08-31 | 2020-02-24 | Alternatingly-switched parallel circuit, integrated power module and integrated power package |
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US11277912B2 (en) * | 2018-02-01 | 2022-03-15 | Delta Electronics (Shanghai) Co., Ltd | System of providing power |
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US10620654B2 (en) * | 2016-08-31 | 2020-04-14 | Delta Electronics (Shanghai) Co., Ltd | Alternatingly-switched parallel circuit, integrated power module and integrated power package |
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US11277912B2 (en) * | 2018-02-01 | 2022-03-15 | Delta Electronics (Shanghai) Co., Ltd | System of providing power |
US11693459B2 (en) | 2018-02-01 | 2023-07-04 | Delta Electronics (Shanghai) Co., Ltd | System of providing power to chip on mainboard |
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