US10741581B2 - Fabrication method for a 3-dimensional NOR memory array - Google Patents
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- US10741581B2 US10741581B2 US16/510,610 US201916510610A US10741581B2 US 10741581 B2 US10741581 B2 US 10741581B2 US 201916510610 A US201916510610 A US 201916510610A US 10741581 B2 US10741581 B2 US 10741581B2
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000004065 semiconductor Substances 0.000 claims abstract description 53
- 239000004020 conductor Substances 0.000 claims abstract description 44
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 27
- 238000005530 etching Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000000059 patterning Methods 0.000 claims abstract description 6
- 238000002955 isolation Methods 0.000 claims description 38
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 31
- 229920005591 polysilicon Polymers 0.000 claims description 31
- 229920002120 photoresistant polymer Polymers 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 16
- 238000011065 in-situ storage Methods 0.000 claims description 5
- 101100476609 Arabidopsis thaliana SAC4 gene Proteins 0.000 description 12
- 239000010408 film Substances 0.000 description 10
- 239000011232 storage material Substances 0.000 description 8
- 239000010937 tungsten Substances 0.000 description 7
- 229910052721 tungsten Inorganic materials 0.000 description 7
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000003491 array Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- -1 tungsten nitride Chemical class 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/50—EEPROM devices comprising charge-trapping gate insulators characterised by the boundary region between the core and peripheral circuit regions
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- H01L27/11582—
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
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- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02595—Microstructure polycrystalline
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
-
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- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
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- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
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- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
Definitions
- the present invention relates to non-volatile NOR-type memory strings.
- the present invention relates to fabrication processes for 3-dimensional arrays of non-volatile NOR-type memory strings.
- Copending Applications I and II High-density structures representing arrays of generally non-volatile memory cells have been described in Copending Applications I and II.
- the memory arrays of Copending Applications I and II are organized as stacks of connected storage transistors (“active stacks”) fabricated over a semiconductor substrate.
- Copending Applications I and II disclose multiple strips of semiconductor layers (“active strips”) in each active stack, with each strip providing storage transistors organized as NOR-type memory strings or “NOR memory strings”.
- the semiconductor substrate on which the memory array is constructed include various types of support circuitry, such as power supply circuits, address decoders, sense amplifiers, input and output circuits, comparators, and control and other logic circuits.
- FIG. 1 a illustrates schematically memory structure 100 containing NOR memory strings that can be fabricated using methods of the present invention.
- NOR memory string consists of individually and independently addressable storage transistors sharing a common source region and a common drain region.
- each memory string may be formed along one side of an active strip, which includes multiple layers of semiconductor and conductor materials.
- Memory structure 100 is organized as m active stacks each containing n active strips, where m and n can be any integer.
- m may be 1, 2, 4, 8, 16, 32, 64, . . . , 8192 or greater.
- n may be 1, 2, 4, 8, . . . , 64 or greater.
- memory structure 100 is represented by active stacks 130 -( p ⁇ 1), 130 - p , 130 -( p+ 1).
- n active strips labeled 101 - 1 , 102 - 1 , . . . , 101 - n , are separated and electrically isolated from each other by isolation layers 106 .
- Isolation layer 106 may be, for example, a silicon nitride.
- Each active stack is covered on the outside by a layer charge storage material 121 , which may be provided, for example, by an oxide-nitride-oxide (“ONO”) triple-layer, as is known to those of ordinary skill in the art.
- ONO oxide-nitride-oxide
- conductive columns (not shown), separated from the active strips by charge storage material 121 , are provided in the space between active stacks. These conductive columns provide gate electrodes, which are used to select and operate the storage transistors formed along the active strips on either side of the adjacent active stacks during read, write and erase operations.
- the direction substantially perpendicular to the surface of the semiconductor substrate (“vertical”) is labeled z.
- the direction along the length of each active strip is labeled y
- the direction along the width of each active strip is labeled x.
- the x and y directions are also referred to as “horizontal”.
- One or more interconnect layers (“global interconnect layers”) may be formed above or below memory structure 100 to provide conductors to interconnect the terminals of the storage transistors in NOR memory strings of memory structure 100 to circuitry in the semiconductor substrate.
- portions 108 in each active stack are dedicated for forming “staircase” or “reverse staircase” structures, which allow one or more of the semiconductor or conductor material layers in each active strip (e.g., the semiconductor layers providing a common drain region or “bit line” in the active strip) to be accessed electrically from the global interconnect layers, through conductors in vias (and buried contacts).
- portions 108 (“staircase portions”) are provided in the front and at the back of each active stack.
- Storage transistors are formed in the portion or portions of the active strips (“array portion” or “array portions”) in each active stack outside of the staircase portion or portions.
- array portion 109 is provided between staircase portions 108 .
- FIG. 1 b illustrates schematically the semiconductor and conductor layers of active strip 101 .
- active strip 101 includes (i) n + semiconductor layers 103 and 104 (e.g., n-type polysilicon) which may provide a common source region (or “source line”) and a common drain region (or “bit line”) for a NOR memory string; and (ii) intrinsic or lightly doped p-type (p ⁇ ) semiconductor layer 102 , which may provide channel regions for the storage transistors of the NOR memory string.
- charge storage material layer 121 Between the dashed lines and separated from each active strip by charge storage material layer 121 would be provided conductors (not shown) that serve as gate electrodes for the storage transistors of the NOR string.
- the dashed lines in FIG. 1 b indicate the positions of conductors 122 -( k ⁇ 1), 122 - k , and 122 -( k+ 1) which are representative of such conductors.
- conductor layers 105 e.g., tungsten with adhesion and barrier films
- Conductor layers 105 reduce resistance in the common source and drain regions of the NOR memory string.
- Isolation layers 106 e.g., silicon nitride
- the present invention provides a desired efficient process for fabricating memory structure 100 .
- a process for manufacturing a 3-dimensional memory structure includes: (a) providing one or more active layers over a planar surface of a semiconductor substrate, each active layer comprising (i) first and second semiconductor layers of a first conductivity; (ii) a dielectric layer separating the first and second semiconductor layer; and (ii) one or more sacrificial layers, at least one of sacrificial layers being adjacent the first semiconductor layer; (b) etching the active layers to create a plurality of active stacks and a first set of trenches each separating and exposing sidewalls of adjacent active stacks; (c) filling the first set of trenches by a silicon oxide; (d) patterning and etching the silicon oxide to create silicon oxide columns each abutting adjacent active stacks and to expose portions of one or more sidewalls of the active stacks; (e) removing the sacrificial layers from exposed portions of the sidewalls by isotropic etching through the exposed portions of the sidewalls of the
- the process further includes recessing the metallic or conductor layer from the exposed sidewalls of the active step, wherein filling recesses in the dielectric layer also fills recesses in the metallic or conductor layer.
- the process further includes: (a) removing the silicon oxide columns prior to recessing the dielectric layer and (b) re-creating the silicon oxide columns after filling the recesses in the dielectric layer by the second semiconductor layer.
- the process further includes providing a charge material over the exposed sidewalls of the active stack and forming word lines by filling spaces surrounded by adjacent silicon oxide columns and adjacent active stacks with a conductor material.
- the third semiconductor layer includes an in situ boron-doped polysilicon.
- the first and second semiconductor layers of each active layer respectively form a common drain region and a common drain region of a plurality of storage transistors organized as a NOR memory string;
- the third semiconductor layer forms channel regions of the storage transistors in the NOR memory string; and
- the word lines form gate electrodes of the storage transistors in the NOR memory string.
- a staircase structure for accessing one or more semiconductor layers in a 3-dimensional memory structure includes: (i) providing a first active layer; (ii) providing a first isolation layer on top of the first active layer; (iii) providing a second active layer on top of the first isolation layer, wherein the first and second active layers each comprise (a) a first semiconductor layer of a first conductivity; (b) a dielectric layer of an insulative material underneath the first semiconductor layer; and (c) a second semiconductor layer underneath the dielectric layer; (iv) providing a second isolation layer on top of the second active layer; (iv) providing and patterning a photoresist layer over the second isolation layer to create an opening in the photoresist layer, thereby exposing a first area of the second isolation layer; (v) anisotropically removing the exposed first area of the second isolation layer and the portion of the second active layer under the first area of the second isolation layer so as to expose a first area of the first isolation layer; (vi) rece
- FIG. 1 a illustrates schematically memory structure 100 containing NOR memory strings of the type that can be fabricated using methods of the present invention.
- FIG. 1 b illustrates schematically the semiconductor and conductor layers of an active strip 101 in memory structure 100 of FIG. 1 a.
- FIGS. 2( i ) , 2 ( ii ), 2 ( iii ), 2 ( iv ), 2 ( v ) and 2 ( vi ) illustrate staircase portions 108 of memory structure 100 , in accordance with one embodiment of the present invention.
- FIG. 3( i ) is an x-z plane cross sectional view of array portion 109 of memory structure 100 , showing patterned photoresist layer 205 defining a 45-nm width for each active stack and 65-nm width for each trench between adjacent active stacks.
- FIG. 3 ( ii ) shows resulting memory structure 100 , with active stacks 207 a - 207 e , after the trenches are filled using the silicon oxide, photoresist 206 is removed, and the resulting surface planarized by CMP.
- FIGS. 3 ( iii ) and 3 ( iv ) are top and x-z plane cross-sectional views, respectively, showing resulting memory structure 100 after etching trenches 209 for the word lines to be formed.
- FIG. 3( v ) shows resulting memory structure 100 after removal of SAC4 layers 105 s - b and 105 s - t from the active stacks, thereby creating cavities 211 in their place.
- FIGS. 3 ( vi ) and 3 ( vii ) are top and x-z plane cross-sectional views, respectively, showing resulting memory structure 100 after trenches 209 and cavities 211 are filled using a metallic/conductor material.
- FIGS. 3 ( viii ) and 3 ( ix ) are top and x-z plane cross-sectional views, respectively, showing resulting memory structure 100 after both metallic/conductor layers 105 and spline oxide 102 o are recessed.
- FIG. 3( x ) shows an x-z plane cross sectional view through the word line trenches, showing channel polysilicon 102 filling the recesses in metallic/conductor layer 105 and spline oxide 102 o.
- FIG. 3 ( xi ) is a x-z plane cross sectional view of memory structure 100 after charge storage material 213 and word lines 214 are deposited and planarized
- FIG. 3 ( xii ) is a top view illustrating array portion 108 of memory structure 100 , after formation of a global interconnect layer.
- FIG. 4 shows a top view of memory structure 100 after the word line spacer columns are patterned and etched.
- the present invention provides efficient processes for fabricating a memory structure containing an array of NOR memory strings.
- the parameters of each step e.g., temperatures, pressures, precursors, compositions and dimensions
- the parameters of each step are provided for exemplary purposes only. Upon consideration of this detailed description, one of ordinary skill in the art will be able to modify or vary these parameters without departing from the scope of the present invention.
- a process is provided by which a memory structure containing NOR memory strings may be formed over a planar surface of a semiconductor substrate.
- various types of support circuitry may be formed in—or at the surface of—the semiconductor substrate (e.g., power supply circuits, address decoders, sense amplifiers, input and output circuits, comparators, and control and other logic circuits are fabricated).
- An isolation layer (e.g., silicon oxide) may be formed on the planar surface. Buried contacts may be formed in the isolation layer for connection to the circuitry underneath. One or more global interconnect layers may then be formed above the isolation layer. (In the following detailed description, these layers are collectively referred to as substrate 150 .)
- base oxide film 107 e.g., 50-nm silicon oxide film
- active layer The semiconductor and conductor layers of an active strip (collectively, an “active layer”) are then provided. Multiple active layers may be provided, layer by layer, with each active layer being isolated from the next active layer by isolation films 106 (e.g., a 30-nm nitride layer).
- each active layer may include (a) sacrificial layer 105 s - b (“SAC4 layer 105 s - b ”; e.g., a 40-nm layer of silicon germanium); (b) n + doped polysilicon layer 104 (“drain polysilicon 104 ”; e.g., 30-nm in situ arsenic-doped polysilicon film); (c) silicon oxide layer 102 o (“spline oxide 102 o ”; 80-nm silicon oxide film); (d) n + polysilicon layer 103 (“source polysilicon 103 ”; e.g., 30-nm in situ arsenic-doped polysilicon film); and (e) sacrificial layer 105 s - t (“SAC4 layer 105 s - t ”; e.g., a 40-nm layer of silicon germanium).
- SAC4 layers 105 s - b sacrificial layer
- staircase structures for electrically accessing drain polysilicon 104 of each active strip to be formed are formed in staircase portions 108 .
- Array portion 109 is protected from the staircase formation steps by a mask over array portion 109 .
- the staircase structures may be formed using one photolithography step for every two active layers.
- FIGS. 2( i ) to 2 ( vi ) illustrate staircase structure formation in staircase portions 108 of memory structure 100 , in accordance with one embodiment of the present invention.
- FIG. 2( i ) shows memory structure 100 after depositions of active layers 101 - 1 and 101 - 2 . Thereafter, photoresist layer 201 is deposited and patterned over memory structure 100 .
- a first etching step removes from the area not protected by photoresist 201 , film by film, (a) isolation layer 106 and (b) active layer 101 - 2 (i.e., “SAC4 layer 105 s - tb ; source polysilicon 103 , spline oxide 102 o , drain polysilicon 104 , and SAC4 layer 105 s - b of active layer 101 - 2 ).
- This first etching step stops at isolation 106 immediately above active layer 101 - 1 .
- the resulting structure is shown in FIG. 2 ( ii ).
- Photoresist layer 201 is then recessed to further expose addition areas of active layer 101 - 2 .
- the resulting structure is shown in FIG. 2 ( iii ).
- a second etching step removes from the exposed portions of isolation films 106 immediately above active layers 101 - 1 and 101 - 2 , (a) SAC4 layers 105 s - t of both active layers 101 - 1 and 101 - 2 , and (b) source polysilicon 103 of both active layers 101 - 1 and 101 - 2 .
- This second etching step stops at spline oxide layers 102 o of both active layers 101 - 1 and 101 - 2 .
- the resulting structure which is a two-step staircase structure, is shown in FIG. 2 ( iv ). Photoresist layer 201 is then removed.
- Silicon oxide 202 is then provided to fill the cavities created by the first and second etching steps.
- a following planarization step e.g., chemical-mechanical polishing (CMP) planarizes the resulting surface.
- CMP chemical-mechanical polishing
- the resulting structure is shown in FIG. 2( v ) .
- Vias can then be created in silicon oxide 202 and the underlying spline oxide 102 o of each of active layers 101 - 1 and 101 - 2 to allow access to drain polysilicon 104 of each of active layers 101 - 1 and 101 - 2 . These vias are created in a subsequent oxide etch after all active layers are deposited, as discussed below.
- FIG. 2 ( vi ) After all active layers of memory structure 100 are deposited and the cavities from the last first and second etching steps on the final two active layers are filled, an oxide etch may be performed at an appropriate time to create vias to reach drain polysilicon layer 104 of each active layer.
- the resulting structure is shown in FIG. 2 ( vi ).
- FIG. 2 ( vi ) and in each figure discussed below, only for exemplary purposes, four active layers 101 - 1 , 101 - 2 , 101 - 3 and 101 - 4 are shown.
- vias 203 - 1 , 203 - 2 , 203 - 3 and 203 - 4 are vias illustrative of the vias that can be created to access the semiconductor and conductor material layers of the active layers present.
- these vias provide electrical connectivity between drain polysilicon 104 and circuitry in semiconductor substrate 150 through the conductors in one or more global interconnect layers to be formed above memory structure 100 .
- FIG. 3( i ) is an x-z plane cross-sectional view of array portion 109 of memory structure 100 , showing patterned photoresist layer 206 defining a 45-nm width for each active stack and a 65-nm width for each trench between adjacent active stacks.
- An etch through hard mask layer 205 and the active layers not protected by photoresist layer 206 creates the active stacks and trenches therebetween.
- Silicon oxide 208 is then deposited to fill the trenches.
- FIGS. 3( ii ) shows resulting memory structure 100 , with active stacks 207 a to 207 e , after filling the trenches using silicon oxide, removal of photoresist 206 and planarization by CMP. Unless specified, all x-z plane cross-sectional views in FIGS. 3( i ) - 3 ( xii ) are made in array portion 109 of memory structure 100 .
- FIGS. 3 ( iii ) and 3 ( iv ) are top and x-z plane cross-sectional views, respectively, showing resulting memory structure 100 after etching word line trenches 209 .
- FIGS. 3 ( iii ) and 3 ( iv ) the word line trenches and remaining oxide column as both 65 nm wide.
- the cross-section of FIG. 3 ( iv ) is taken along dashed line A-A′ shown in FIG. 3 ( iii ).
- the isotropic etching proceeds laterally from word line trenches 209 until all the sacrificial materials in SAC4 layers 105 s - t and 105 s - b are removed.
- the silicon oxide columns provide mechanical support to the active stacks (e.g., active stacks 207 a - 207 e of FIG. 3 ( iv )).
- FIG. 3( v ) shows resulting memory structure 100 after all SAC4 layers 105 s - b and 105 s - t are removed from the active stacks, thereby creating cavities 211 in their place.
- FIGS. 3 ( vi ) and 3 ( vii ) are top and x-z plane cross-sectional views, respectively, showing resulting memory structure 100 after word line trenches 209 and cavities 211 are filled using a metallic/conductor material.
- cavities 211 in the active strips are replaced by metallic/conductor layers 305 .
- the x-z plane cross-sectional view of FIG. 3 ( vii ) is taken along dashed line B-B′ shown in FIG. 3 ( vi ).
- an anisotropic etch removes the metallic/conductor material 305 from the word line trenches.
- silicon oxide columns 208 continues to provide mechanical support after replacement of the SAC4 layers by metallic/conductor layers 305 .
- the silicon oxide columns can be removed by an anisotropic oxide at this time.
- a selective isotropic etches to recess metallic/conductor layers 105 and spline oxide 102 o can then be made.
- the selective isotropic etch recesses each metallic/conductor layer 305 from the sidewalls of the active stacks by 5-6 nm.
- the isotropic oxide etch recesses spline oxide 102 o by, for example, 5-6 nm from the sidewalls of the active stacks. If silicon oxide columns 208 are not removed, the isotropic oxide etch also recess the exposed side walls of silicon oxide columns 208 along the y direction by the same amount on each side.
- FIG. 3 ( viii ) and 3 ( ix ) are top and x-z plane cross-sectional views, respectively, showing resulting memory structure 100 after both metallic/conductor layers 305 and spline oxide 102 o are recessed.
- FIG. 3 ( viii ) refers to the embodiment in which silicon oxide columns 208 are retained.
- a lightly-doped p ⁇ polysilicon (“channel polysilicon 102 ”) may then be deposited to fill both the recesses in metallic/conductor layer 305 and spline oxide 102 o , and the word line trenches.
- An anisotropic etch of channel polysilicon 102 may be followed to remove channel polysilicon 102 from word line trenches 209 .
- Channel polysilicon 102 may be provided by deposition of in situ boron-doped polysilicon with a dopant concentration, for example, at 5.0 ⁇ 10 18 cm ⁇ 3 .
- 3( x ) is a x-z plane cross-sectional view through word line trenches 209 , showing channel polysilicon 102 filling the recesses in metallic/conductor layer 305 and spline oxide 102 o .
- One disadvantage from not removing silicon oxide columns 208 prior to the isotropic oxide etch is that the portions of spline oxide 102 o behind silicon oxide column 208 are protected and not recessed.
- channel polysilicon 102 deposited on an active strip is not continuous along the y direction, and each memory cell on the active strip has its very small separate, discrete region of channel polysilicon, which may not be efficient in providing sufficient charge carriers during storage transistor operations (e.g., an erase operation).
- word line spacer columns may be provided at this time by filling the trenches (resulting from removing silicon oxide columns 208 ) between adjacent active stacks using a silicon oxide, patterning and etching the silicon oxide.
- the resulting word line spacer columns are similar and are referred to, going forward, silicon oxide columns 208 , had they been retained.
- FIG. 4 shows a top view of memory structure 100 after the word line spacer columns are patterned and formed. To simplify the following detailed description, these word line spacer columns may be treated the same as silicon oxide columns 208 in the remainder of the processing. Accordingly, these word line spacer columns are also labeled 208 and no further distinction is made between these two sets of columns in the remainder of this detailed description.
- Charge storage material 213 may then be deposited, which lines conformally the side walls of word line trenches 209 .
- Charge storage material 213 may be achieved by successive depositions (in order) of: a 2-nm thick tunnel oxide, a 6-nm thick silicon-rich nitride, a 6-nm thick silicon oxide and 2-nm thick aluminum oxide (Al 2 O 3 ).
- charge storage material-lined word line trenches 209 can then be filled by conductor material 214 (e.g., p + polysilicon) to provide the word lines.
- Planarization by CMP can then remove the excess charge storage material 213 and conductor material 214 from the top surface of memory structure 100 .
- FIG. 3 ( xi ) is a x-z plane cross-sectional view of memory structure 100 after charge storage material 213 and word lines 214 have been deposited and planarized.
- Buffer oxide 215 may be deposited over memory structure 100 , patterned and etched to provide contact vias to word lines 214 under buffer oxide 215 . These contact vias may be filled by tungsten (“tungsten plugs”). Tungsten plugs may also be provided at the same time in the vias made in staircase portions 108 to contact drain polysilicon or bit lines 104 . Global interconnect lines may be provided above memory structure 100 subsequently to interconnect word lines 214 and bit lines 104 to circuitry in semiconductor substrate 150 .
- FIG. 3 ( xii ) shows a top view of a portion of array portion 108 of memory structure 100 . As shown in FIG.
- connections by global interconnect lines 216 to word lines 214 are staggered (i.e., each of global interconnect lines 216 connects every other one of word lines 214 ; another global interconnect lines connects the remaining word lines along the first global interconnect line).
Abstract
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/510,610 US10741581B2 (en) | 2018-07-12 | 2019-07-12 | Fabrication method for a 3-dimensional NOR memory array |
US16/914,089 US11177281B2 (en) | 2018-07-12 | 2020-06-26 | Fabrication method for a 3-dimensional NOR memory array |
US17/382,126 US11751391B2 (en) | 2018-07-12 | 2021-07-21 | Methods for fabricating a 3-dimensional memory structure of nor memory strings |
US17/501,917 US11751392B2 (en) | 2018-07-12 | 2021-10-14 | Fabrication method for a 3-dimensional NOR memory array |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862697085P | 2018-07-12 | 2018-07-12 | |
US16/510,610 US10741581B2 (en) | 2018-07-12 | 2019-07-12 | Fabrication method for a 3-dimensional NOR memory array |
Related Parent Applications (1)
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US62697085 Continuation | 2018-07-12 |
Related Child Applications (1)
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US16/914,089 Continuation US11177281B2 (en) | 2018-07-12 | 2020-06-26 | Fabrication method for a 3-dimensional NOR memory array |
Publications (2)
Publication Number | Publication Date |
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US20200020718A1 US20200020718A1 (en) | 2020-01-16 |
US10741581B2 true US10741581B2 (en) | 2020-08-11 |
Family
ID=69138215
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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US16/510,610 Active US10741581B2 (en) | 2018-07-12 | 2019-07-12 | Fabrication method for a 3-dimensional NOR memory array |
US16/914,089 Active US11177281B2 (en) | 2018-07-12 | 2020-06-26 | Fabrication method for a 3-dimensional NOR memory array |
US17/501,917 Active 2039-07-17 US11751392B2 (en) | 2018-07-12 | 2021-10-14 | Fabrication method for a 3-dimensional NOR memory array |
Family Applications After (2)
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US16/914,089 Active US11177281B2 (en) | 2018-07-12 | 2020-06-26 | Fabrication method for a 3-dimensional NOR memory array |
US17/501,917 Active 2039-07-17 US11751392B2 (en) | 2018-07-12 | 2021-10-14 | Fabrication method for a 3-dimensional NOR memory array |
Country Status (3)
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US (3) | US10741581B2 (en) |
CN (1) | CN112567516A (en) |
WO (1) | WO2020014655A1 (en) |
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