US10716214B2 - Hybrid microelectronic substrate and methods for fabricating the same - Google Patents

Hybrid microelectronic substrate and methods for fabricating the same Download PDF

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Publication number
US10716214B2
US10716214B2 US15/771,774 US201515771774A US10716214B2 US 10716214 B2 US10716214 B2 US 10716214B2 US 201515771774 A US201515771774 A US 201515771774A US 10716214 B2 US10716214 B2 US 10716214B2
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substrate
density microelectronic
lower density
high density
microelectronic
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US20180343744A1 (en
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Robert Starkston
Richard C. Stamey
Robert L. Sankman
Scott M. MOKLER
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Intel Corp
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Intel Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Definitions

  • Embodiments of the present description generally relate to the field of microelectronic substrates, and, more particularly, to the fabricating a hybrid microelectronic substrate comprising an embedded high density microelectronic patch substrate within a lower density microelectronic substrate.
  • microelectronic industry is continually striving to produce ever faster and smaller microelectronic devices for use in various electronic products, including, but not limited to portable products, such as portable computers, digital cameras, electronic tablets, cellular phones, wearable electronics, applications for the Internet of Things, and the like.
  • portable products such as portable computers, digital cameras, electronic tablets, cellular phones, wearable electronics, applications for the Internet of Things, and the like.
  • microelectronic substrate entirely with high density electrical routing, as will be understood to those skilled in the art.
  • high density electrical routing requires expensive lithography processes, which can cost between 10 times to 50 times more than standard lithography processes used for fabricating lower density substrates, such as printed circuit boards.
  • an interposer such as a silicon interposer
  • Such interposers can be used to connect the microelectronic device to the microelectronic substrate by providing electrical routes that are high density in the area of the microelectronic device and which spread or fan out through the interposer to a lower density at the microelectronic substrate.
  • interposers can reduce electrical performance and may increase the height or thickness of the resulting microelectronic structure. Therefore, there in a need to develop microelectronic substrates which can economically provide both high density and low density interconnections.
  • FIGS. 1-7 illustrate side cross sectional views of a method of forming a hybrid microelectronic substrate, according to an embodiment of the present description.
  • FIG. 8 illustrates a computing device in accordance with one implementation of the present description.
  • over”, “to”, “between” and “on” as used herein may refer to a relative position of one layer or component with respect to other layers or components.
  • One layer/component “over” or “on” another layer/component or bonded “to” another layer/component may be directly in contact with the other layer/component or may have one or more intervening layers/components.
  • One layer/component “between” layers/components may be directly in contact with the layers/components or may have one or more intervening layers/components.
  • Embodiments of the present description include the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate to form a hybrid microelectronic substrate.
  • Such hybrid microelectronic substrates may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnections and electrical routes in areas where high density interconnections are not required.
  • the hybrid microelectronic substrate may be formed by inserting the high density patch substrate being inserted into a recess extending in the lower density microelectronic substrate from a first surface thereof and electrically connecting the high density patch substrate with the lower density microelectronic substrate with at least one conductive blind via extending from a second surface of the lower density microelectronic substrate.
  • the term “lower density” in “lower density microelectronic substrate” is relative to the term “high density” in “high density microelectronic patch substrate” in that the conductive routes (i.e. the conductive traces and the conductive vias) of the lower density microelectronic substrate are larger and have a greater pitch/spacing than the conductive routes (i.e. the conductive traces and the conductive vias) of the high density microelectronic patch substrate, and vice versa, as will be discussed.
  • the term “patch substrate” refers to a microelectronic structure which merely routes power and signals for a microelectronic device and does not contain active or passive circuitry (i.e. transistors, diodes, resistors, inductors, capacitors, and the like) beyond the conductive routes.
  • FIGS. 1-6 illustrate a method of fabricating a hybrid microelectronic substrate, according to embodiments of the present description.
  • a high density microelectronic patch substrate 110 may be formed comprising a plurality of dielectric material layers 112 1 - 112 3 and a plurality of conductive routes, such as conductive traces 114 1 - 114 3 formed in or on the dielectric material layers 112 1 - 112 3 , respectively, which are connected with conductive vias 116 1 - 116 3 .
  • the high density microelectronic patch substrate 110 may further include a plurality of bond pads 132 in or on a first surface of 122 of the high density microelectronic patch substrate 110 and a plurality of bond pads 134 in or on a second surface 124 of the high density microelectronic patch substrate 110 , wherein at least one conductive route extends between at least one of the plurality of bond pads 132 in or on a first surface of 122 of the high density microelectronic patch substrate 110 and at least one of the plurality of bond pads 134 in or on a second surface 124 of the high density microelectronic patch substrate 110 .
  • the high density microelectronic patch substrate 110 may further include at least one side 126 extending between the first surface 122 and the second surface 124 of the high density microelectronic patch substrate 110 .
  • the conductive traces 114 1 - 114 3 and the conductive vias 116 1 - 116 3 may be made of any appropriate conductive material, including but not limited to, metals, such as copper, silver, nickel, gold, and aluminum, alloys thereof, and the like.
  • the dielectric material layers 112 1 - 112 3 may be any appropriate dielectric material, including but not limited to, bismaleimine triazine resin, fire retardant grade 4 material, polyimide materials, glass reinforced epoxy matrix materials, polyimide materials, and the like, as well as low-k and ultra low-k dielectrics (dielectric constants less than about 3.6), including but not limited to carbon doped dielectrics, fluorine doped dielectrics, porous dielectrics, organic polymeric dielectrics, and the like.
  • a plurality of interconnect structures 118 may be formed on respective bond pads 132 in or on the first surface 122 of the high density microelectronic patch substrate 110 .
  • the interconnect structures 126 can be made of any appropriate material, including, but not limited to, solders materials.
  • the solder materials may be any appropriate material, including but not limited to, lead/tin alloys, such as 63% tin/37% lead solder, and high tin content alloys (e.g. 90% or more tin), such as tin/bismuth, eutectic tin/silver, ternary tin/silver/copper, eutectic tin/copper, and similar alloys.
  • FIG. 1 illustrates a specific number of dielectric material layers and conductive routes, any appropriate number may be fabricated.
  • the various methods for the fabrication of the dielectric material layers 112 1 - 112 3 , the conductive traces 114 1 - 114 3 , the conductive vias 116 1 - 116 3 , the bond pads 132 / 134 , and the interconnect structures 118 are well known in the art, and for the sake of brevity and conciseness will not be described or illustrated herein.
  • a lower density microelectronic substrate 160 may be formed having a plurality of dielectric material layers 162 1 - 162 4 and a plurality of conductive routes, such as conductive traces 164 1 - 164 3 connected with conductive vias 166 1 - 166 3 disposed therein.
  • the lower density microelectronic substrate 160 may also include a plurality of top contact pads 152 formed in or on a first surface 168 of the lower density microelectronic substrate 160 and a plurality of bottom contact pads 154 may be formed in or on a second surface 172 of the lower density microelectronic substrate 160 , wherein the top contact pads 152 and the bottom contact pads 152 and the bottom contact pad 154 may be electrically connected to the conductive routes.
  • FIG. 2 illustrates a specific number of dielectric material layer and conductive routes, any appropriate number may be fabricated.
  • the various methods for the fabrication of the dielectric material layers 162 1 - 162 4 , the conductive traces 164 1 - 164 3 , the conductive vias 166 1 - 166 3 , the top contact pads 152 , and the bottom contact pads 154 are well known in the art, and for the sake of brevity and conciseness will not be described or illustrated herein.
  • the conductive traces 164 1 - 164 3 and the conductive vias 166 1 - 166 3 may be made of any appropriate conductive material, including but not limited to, metals, such as copper, silver, nickel, gold, and aluminum, alloys thereof, and the like.
  • the dielectric material layers 162 1 - 162 4 may be any appropriate dielectric material, including but not limited to, bismaleimine triazine resin, fire retardant grade 4 material, polyimide materials, glass reinforced epoxy matrix materials, polyimide materials, and the like, as well as low-k and ultra low-k dielectrics (dielectric constants less than about 3.6), including but not limited to carbon doped dielectrics, fluorine doped dielectrics, porous dielectrics, organic polymeric dielectrics, and the like.
  • a recess 140 may be formed to extend in the lower density microelectronic substrate 160 from the first surface 168 thereof, wherein the recess 140 is defined by a bottom surface 142 and at least one side 144 .
  • the recess 140 may be formed by any technique known in the art, including, but not limited to, laser ablation, controlled depth routing, etching, and the like.
  • the high density microelectronic patch substrate 110 may be inserted into the recess 180 and secured therein with an adhesive material 148 disposed between the second surface 126 of the high density microelectronic patch substrate 110 and a bottom surface 142 of the recess 140 .
  • a portion of the adhesive material 148 may be disposed between the recess sides 144 and the high density microelectronic patch substrate sides 126 .
  • the term “lower density microelectronic substrate” is relative to the term “high density microelectronic patch substrate” in that the conductive routes (i.e. the conductive traces 164 1 - 164 3 and the conductive vias 166 1 - 166 3 ) of the lower density microelectronic substrate 160 are larger and have a greater pitch/spacing than the conductive routes (i.e. the conductive traces 114 1 - 114 3 and the conductive vias 116 1 - 116 3 ) of the high density microelectronic patch substrate 110 , and vice versa, as will be understood to those skilled in the art.
  • At least one conductive route (i.e. conductive traces 164 1 and 164 2 ) of the lower density microelectronic substrate 160 may be in electrical contact with at least one of the plurality of bond pads 134 in or on a second surface 124 of the high density microelectronic patch substrate 110 through at least one electrical contact, such as at least one conductive blind via 184 , which extends from the second surface 172 of the lower density microelectronic substrate 160 to at least one of the plurality of bond pads 134 in or on a second surface 124 of the high density microelectronic patch substrate 110 .
  • the conductive blind vias 184 may be formed by forming vias 186 with a laser or by mechanical drilling through the dielectric material layers 162 1 - 162 4 to expose at least one of the plurality of bond pads 134 in or on the second surface 124 of the high density microelectronic patch substrate 110 followed by plating a conductive material 188 therein, as known in the art, wherein the conductive material 188 contacts at least one conductive route (i.e. conductive traces 164 1 and 164 2 ) of the lower density microelectronic substrate 160 , thereby forming a hybrid microelectronic substrate 170 .
  • the various specific methods for the fabrication of the conductive blind vias 184 are well known in the art and, for the sake of brevity and conciseness, will not be described or illustrated herein.
  • At least one microelectronic device 192 may be electrically attached to the high density microelectronic patch substrate 110 , such as with at least one of the plurality of interconnect structures 118 .
  • At least one additional microelectronic device 194 may be attached to at least one of the plurality of top contact pads 152 , such as with at least one solder ball 196 .
  • the at least one microelectronic device 192 and the at least one additional microelectronic device 194 may be any appropriate device, including, but not limited to a microprocessor, a chipset, a graphics device, a wireless device, a memory device, an application specific integrated circuit, or the like.
  • the plurality of dielectric material layers 112 1 - 112 3 of the high density microelectronic patch substrate 110 may be a different dielectric material from the dielectric material layers 162 1 - 162 4 of the lower density microelectronic substrate 160 .
  • the first surface 122 of the high density microelectronic patch substrate 110 may be in substantially the same plane as the first surface 168 of the lower density microelectronic substrate 160 .
  • FIG. 8 illustrates a computing device 200 in accordance with one implementation of the present description.
  • the computing device 200 houses a board 202 .
  • the board may include a number of microelectronic components, including but not limited to a processor 204 , at least one communication chip 206 A, 206 B, volatile memory 208 , (e.g., DRAM), non-volatile memory 210 (e.g., ROM), flash memory 212 , a graphics processor or CPU 214 , a digital signal processor (not shown), a crypto processor (not shown), a chipset 216 , an antenna, a display (touchscreen display), a touchscreen controller, a battery, an audio codec (not shown), a video codec (not shown), a power amplifier (AMP), a global positioning system (GPS) device, a compass, an accelerometer (not shown), a gyroscope (not shown), a speaker (not shown), a camera, and a mass storage device (not shown) (such
  • the communication chip enables wireless communications for the transfer of data to and from the computing device.
  • wireless and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communications channels, etc., that may communicate data through the use of modulated electromagnetic radiation through a non-solid medium. The term does not imply that the associated devices do not contain any wires, although in some embodiments they might not.
  • the communication chip may implement any of a number of wireless standards or protocols, including but not limited to Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, derivatives thereof, as well as any other wireless protocols that are designated as 3G, 4G, 5G, and beyond.
  • the computing device may include a plurality of communication chips.
  • a first communication chip may be dedicated to shorter range wireless communications such as Wi-Fi and Bluetooth and a second communication chip may be dedicated to longer range wireless communications such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.
  • processor may refer to any device or portion of a device that processes electronic data from registers and/or memory to transform that electronic data into other electronic data that may be stored in registers and/or memory.
  • any of the microelectronic components within the computing device 200 may include the hybrid substrate 170 , as described in the present description.
  • the computing device may be a laptop, a netbook, a notebook, an ultrabook, a smartphone, a tablet, a personal digital assistant (PDA), an ultra mobile PC, a mobile phone, a desktop computer, a server, a printer, a scanner, a monitor, a set-top box, an entertainment control unit, a digital camera, a portable music player, or a digital video recorder.
  • the computing device may be any other electronic device that processes data.
  • Example 1 is a hybrid microelectronic substrate, comprising a lower density microelectronic substrate having a first surface and an opposing second surface, and having a recess defined by at least one side and a bottom surface, wherein the recess extends into the lower density microelectronic substrate from the lower density microelectronic substrate first surface; a high density microelectronic patch substrate having a first surface, an opposing second surface, and at least one side, wherein the high density patch substrate resides within the lower density microelectronic substrate recess and is attached therein with an adhesive material disposed between the high density microelectronic patch substrate second surface and recess bottom surface of the lower density microelectronic patch substrate; and at least one conductive blind via extending from the second surface of the lower density microelectronic substrate to the second surface of the high density microelectronic patch substrate, wherein at least one of a plurality of conductive routes within the lower density microelectronic substrate
  • Example 2 the subject matter of Example 1 can optionally include the first surface high density microelectronic patch substrate being substantially planar with the first surface of the lower density microelectronic substrate.
  • Example 3 the subject matter of either Example 1 or 2 can optionally include the adhesive material further extending between the at least one side of the high density microelectronic patch substrate and the at least one recess side of the lower density microelectronic patch substrate.
  • Example 4 the subject matter of either Example 1 or 2 can optionally include the high density microelectronic patch substrate further including a plurality of bond pads in or on the first surface of the high density microelectronic patch substrate and a plurality of bond pads in or on the second surface of the high density microelectronic patch substrate, and wherein at least one of the plurality conductive routes within the high density microelectronic patch substrate extends between one of the plurality of bond pads in or on the first surface of the high density microelectronic patch substrate and one of the plurality of bond pads in or on the second surface of the high density microelectronic patch substrate.
  • Example 5 the subject matter of either Example 1 or 2 can optionally include the high density microelectronic patch substrate further including a plurality of dielectric material layers, wherein the lower density microelectronic substrate includes a plurality of dielectric material layers, and wherein the plurality of dielectric material layers of the high density microelectronic patch substrate is a different dielectric material from the dielectric material layers of the lower density microelectronic substrate.
  • Example 6 the subject matter of either Example 1 or 2 can optionally include the lower density microelectronic substrate including at least one top contact pad formed in or on the first surface of the lower density microelectronic substrate, wherein the at least one top contact pad is in electrical contact with at least one of the plurality of conductive routes within the lower density microelectronic substrate.
  • Example 7 the subject matter of either Example 1 or 2 can optionally include the lower density microelectronic substrate including at least one bottom contact pad formed in or on the second surface of the lower density microelectronic substrate, wherein the at least one bottom contact pad is in electrical contact with at least one of the plurality of conductive routes within the lower density microelectronic substrate.
  • Example 8 is a method of forming a hybrid microelectronic substrate, comprising forming a high density microelectronic patch substrate having a first surface, an opposing second surface, and at least one side; forming a lower density microelectronic substrate having a first surface and an opposing second surface; forming a recess extending into the lower density microelectronic substrate from the lower density microelectronic substrate first surface, wherein the recess is defined by at least one side and a bottom surface; attaching the second surface of the high density microelectronic patch substrate to the bottom surface of the recess of the lower density microelectronic substrate with an adhesive material; and forming at least one conductive blind via extending from the second surface of the lower density microelectronic substrate to the second surface of the high density microelectronic patch substrate to electrical connect at least one conductive route of the lower density microelectronic substrate to the high density microelectronic patch substrate.
  • Example 9 the subject matter of Example 8 can optionally include attaching the second surface of the high density microelectronic patch substrate to the bottom surface of the recess of the lower density microelectronic substrate with an adhesive material results in the first surface high density microelectronic patch substrate being substantially planar with the first surface of the lower density microelectronic substrate.
  • Example 10 the subject matter of either Examples 8 or 9 can optionally include the adhesive material further extending between the at least one side of the high density microelectronic patch substrate and the at least one recess side of the lower density microelectronic patch substrate.
  • Example 11 the subject matter of either Example 8 or 9 can optionally include forming the high density microelectronic patch substrate further includes forming a plurality of bond pads in or on the first surface of the high density microelectronic patch substrate and a plurality of bond pads in or on the second surface of the high density microelectronic patch substrate, and forming at least one of the plurality conductive route within the high density microelectronic patch substrate extending between one of the plurality of bond pads in or on the first surface of the high density microelectronic patch substrate and one of the plurality of bond pads in or on the second surface of the high density microelectronic patch substrate.
  • Example 12 the subject matter of either Example 8 or 9 can optionally include forming the high density microelectronic patch substrate further includes forming a plurality of dielectric material layers, wherein forming the lower density microelectronic substrate includes a plurality of dielectric material layers, and wherein the plurality of dielectric material layers of the high density microelectronic patch substrate is a different dielectric material from the dielectric material layers of the lower density microelectronic substrate.
  • Example 13 the subject matter of either Example 8 or 9 can optionally include forming the lower density microelectronic substrate includes forming at least one top contact pad formed in or on the first dielectric material layer, wherein the at least one top contact pad is in electrical contact with at least one of the plurality of conductive routes within the lower density microelectronic substrate.
  • Example 14 the subject matter of either Example 8 or 9 can optionally include forming the lower density microelectronic substrate includes forming at least one bottom contact pad formed in or on the second surface of the lower density microelectronic substrate, wherein the at least one bottom contact pad is in electrical contact with at least one of the plurality of conductive routes within the lower density microelectronic substrate.
  • Example 15 the subject matter of either Example 8 or 9 can optionally include forming at least one conductive blind via comprises forming a via extending from the second surface of the lower density microelectronic substrate to the second surface of the high density microelectronic patch substrate and plating a conductive material in the via.
  • Example 16 is an electronic system, comprising a board; and a microelectronic component attached to the board, wherein at least one of the microelectronic component and the board, includes a hybrid microelectronic substrate, comprising a lower density microelectronic substrate having a first surface and an opposing second surface, and having a recess defined by at least one side and a bottom surface, wherein the recess extends into the lower density microelectronic substrate from the lower density microelectronic substrate first surface; a high density microelectronic patch substrate having a first surface, an opposing second surface, and at least one side, wherein the high density patch substrate resides within the lower density microelectronic substrate recess and is attached therein with an adhesive material disposed between the high density microelectronic patch substrate second surface and recess bottom surface of the lower density microelectronic patch substrate; and at least one conductive blind via extending from the second surface of the lower density microelectronic substrate
  • Example 17 the subject matter of Example 16 can optionally include the first surface high density microelectronic patch substrate being substantially planar with the first surface of the lower density microelectronic substrate.
  • Example 18 the subject matter of either Example 16 or 17 can optionally include the adhesive material further extending between the at least one side of the high density microelectronic patch substrate and the at least one recess side of the lower density microelectronic patch substrate.
  • Example 19 the subject matter of either Example 16 or 17 can optionally include the high density microelectronic patch substrate further including a plurality of bond pads in or on the first surface of the high density microelectronic patch substrate and a plurality of bond pads in or on the second surface of the high density microelectronic patch substrate, and wherein at least one of the plurality conductive routes within the high density microelectronic patch substrate extends between one of the plurality of bond pads in or on the first surface of the high density microelectronic patch substrate and one of the plurality of bond pads in or on the second surface of the high density microelectronic patch substrate.
  • Example 20 the subject matter of either Example 16 or 17 can optionally include the high density microelectronic patch substrate further including a plurality of dielectric material layers, wherein the lower density microelectronic substrate includes a plurality of dielectric material layers, and wherein the plurality of dielectric material layers of the high density microelectronic patch substrate is a different dielectric material from the dielectric material layers of the lower density microelectronic substrate.
  • Example 21 the subject matter of either Example 16 or 17 can optionally include the lower density microelectronic substrate including at least one top contact pad formed in or on the first surface of the lower density microelectronic substrate, wherein the at least one top contact pad is in electrical contact with at least one of the plurality of conductive routes within the lower density microelectronic substrate.
  • Example 22 the subject matter of either Example 16 or 17 can optionally include the lower density microelectronic substrate including at least one bottom contact pad formed in or on the second surface of the lower density microelectronic substrate, wherein the at least one bottom contact pad is in electrical contact with at least one of the plurality of conductive routes within the lower density microelectronic substrate.

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