US10593582B2 - Transfer head and method for transferring micro devices - Google Patents
Transfer head and method for transferring micro devices Download PDFInfo
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- US10593582B2 US10593582B2 US15/904,442 US201815904442A US10593582B2 US 10593582 B2 US10593582 B2 US 10593582B2 US 201815904442 A US201815904442 A US 201815904442A US 10593582 B2 US10593582 B2 US 10593582B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/002—Aligning microparts
- B81C3/005—Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
- B81C99/002—Apparatus for assembling MEMS, e.g. micromanipulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/05—Aligning components to be assembled
- B81C2203/052—Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus
- B81C2203/054—Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls
Definitions
- the present disclosure relates to a transfer head and a method for transferring a plurality of micro devices to a receiving substrate.
- RF radio frequency
- LED light emitting diode
- MEMS microelectromechanical systems
- micro devices One popular technical issue today for micro devices is transferring large number of micro devices, or mass transfer.
- a method for transferring a plurality of micro devices includes picking up the micro devices from a carrier substrate by a transfer head, and iteratively performing a placing process.
- the placing process includes moving the transfer head to a position, at which an array of the micro devices is positioned over an array of receiving locations of a receiving substrate, and placing said array of the micro devices onto the array of the receiving locations of the receiving substrate.
- a transfer head includes a body having a plurality of arrays of grip regions with each of the arrays comprising at least two columns of the grip regions.
- the grip regions in one of the columns are electrically connected in series.
- the columns in one of the arrays are controlled by a single voltage source, and the columns in two of the arrays are controlled by two voltage sources respectively.
- FIG. 1 is a flow chart of a method for transferring a plurality of micro devices according to some embodiments of the present disclosure
- FIG. 2A is a schematic top view of a carrier substrate with micro devices thereon according to some embodiments of the present disclosure
- FIG. 2B is an enlarged top view of a carrier substrate with micro devices thereon according to some embodiments of the present disclosure
- FIG. 2C is a schematic view of a portion of a transfer head with grip regions thereon according to some embodiments of the present disclosure
- FIG. 2D is a schematic view of receiving locations on a top surface of a receiving substrate according to some embodiments of the present disclosure
- FIG. 2E is a schematic view of receiving locations on a top surface of a receiving substrate according to some embodiments of the present disclosure
- FIG. 3A is a schematic top view of a carrier substrate with micro devices thereon according to some embodiments of the present disclosure
- FIG. 3B is a schematic view of a portion of a transfer head with grip regions thereon according to some embodiments of the present disclosure
- FIG. 3C is a schematic view of receiving locations on a top surface of a receiving substrate according to some embodiments of the present disclosure.
- FIG. 3D is a schematic view of positions of a transfer head between subsequent iterations according to some embodiments of the present disclosure.
- FIG. 4A is a schematic top view of a carrier substrate with micro devices thereon according to some embodiments of the present disclosure
- FIG. 4B is a schematic view of a transfer head with grip regions thereon according to some embodiments of the present disclosure
- FIG. 5A is a schematic top view of a carrier substrate with micro devices thereon according to some embodiments of the present disclosure
- FIG. 5B is an enlarged top view of a carrier substrate with micro devices thereon according to some embodiments of the present disclosure
- FIG. 5C is a schematic view of a portion of a transfer head with grip regions thereon according to some embodiments of the present disclosure
- FIG. 5D is a schematic view of receiving locations on a top surface of a receiving substrate according to some embodiments of the present disclosure.
- FIG. 6A is a schematic diagram of electrical connections of grip regions on a portion of a transfer head according to some embodiments of the present disclosure
- FIG. 6B is a schematic diagram of a definition of a lateral length according to some embodiments of the present disclosure.
- FIG. 6C is a schematic view of a portion of a transfer head with grip regions thereon according to some embodiments of the present disclosure
- FIG. 7A is a schematic view of a portion of a transfer head with grip regions thereon according to some embodiments of the present disclosure
- FIG. 7B is a schematic view of receiving locations on a top surface of receiving substrate according to some embodiments of the present disclosure.
- FIGS. 8A to 8C are schematic views of grip regions and recesses of a portion of some types of transfer head in some embodiments of the present disclosure according to some embodiments of the present disclosure;
- FIG. 8D is a schematic side view of a transfer head when one of placing processes is performed according to some embodiments of the present disclosure.
- FIG. 9 is a schematic enlarged view of a portion of a transfer head in some embodiments of the present disclosure according to some embodiments of the present disclosure.
- FIG. 1 is a flow chart of a method 100 for transferring a plurality of micro devices according to some embodiments of the present disclosure.
- FIGS. 2A to 2 D are schematic views of first iteration i 1 of the method illustrated by FIG. 1 .
- FIGS. 3A to 3C are schematic views of second iteration i 2 of the method illustrated by FIG. 1 . References are made to FIGS. 1 to 3C .
- the method 100 begins with operation 110 in which a plurality of micro devices 210 are picked up from a carrier substrate 220 by a transfer head 230 (referring to FIGS. 2A, 2B, 2C, 3A, and 3B ).
- the method 100 continues with operation 120 in which a placing process is iteratively performed.
- the placing process includes: moving the transfer head 230 to a position at which an array R 1 of the micro devices 210 is positioned over an array R 1 of receiving locations 244 of a receiving substrate 240 (operation 122 ); and placing said array R 1 of the micro devices 210 onto the array R 1 of the receiving locations 244 of the receiving substrate 240 (operation 124 )(referring to FIGS. 2D and 3C ).
- FIG. 2A is a schematic top view of the carrier substrate 220 with micro devices 210 thereon.
- FIG. 2B is an enlarged top view E 1 of a carrier substrate 220 with micro devices 210 thereon in FIG. 2A .
- the micro devices 210 may be transferred from another growth substrate, but should not be limited thereto.
- the carrier substrate 220 may be a rigid substrate. More specifically, the carrier substrate 220 may be made of glass, silicon, polycarbonate (PC), acrylonitrile butadiene styrene (ABS), or any combination thereof. Embodiments of this disclosure are not limited thereto.
- a pitch p 1 as shown in the enlarged view E 1 between two of adjacent micro devices 210 may be slightly larger than a lateral length L of the micro devices 210 .
- the slightly larger pitch p 1 may be due to a trench for dicing, and will not be described in detail herein.
- FIG. 2C is a schematic view of a portion of the transfer head 230 with grip regions 232 thereon.
- the grip regions 232 are used for gripping micro devices 210 as illustrate by FIG. 2A .
- the grip regions 232 are grouped into columns (e.g. R 11 , R 12 , R 13 ), and an array (e.g. R 1 ), in which the array R 1 includes at least one column (e.g. R 11 , R 12 , R 13 , or combinations thereof) as exemplified in FIG. 2C .
- the same notations R 11 , R 12 , R 13 , and R 1 are used in both FIG.
- micro devices 210 of the column R 11 on the carrier substrate 220 grip regions 232 of the column R 11 on the transfer head 230 , and the receiving locations 244 of the column R 11 on the receiving substrate 240 .
- a pitch p 1 along a direction perpendicular to a column of the grip regions 232 and a pitch p 2 along a direction parallel to a column of the grip regions 232 may be different as shown in FIG. 2C .
- the pitch p 1 of the grip regions 232 may be the same as that of the pitch p 1 of the micro devices 210 on the carrier substrate 220
- the pitch p 2 of the grip regions 232 may be the same as that of the pitch p 2 of the receiving locations 244 along one of the columns (e.g. R 11 , R 12 , or R 13 ) on the receiving substrate 240 as will be shown in FIG. 2D .
- pitch p 3 defined as an interval between two adjacent columns (e.g. between R 11 and R 12 ) of the same array (e.g. R 1 ).
- pitch p 2 is N times the pitch p 1
- pitch p 3 is M times the pitch p 1 , in which both n and m are integer, and M may be not equal or equal to N.
- the definition of “pitch” in the present disclosure is an interval between geometrical centers of two micro devices/grip regions/receiving locations, wherein said receiving locations will be illustrated in FIG. 2D .
- a grip force of the transfer head 230 may be an electrostatics force, but should not limited thereto. Details of the transfer head 230 will be illustrated since FIG. 6A .
- FIG. 2D is a schematic view of receiving locations 244 on a top surface 242 of a receiving substrate 240 .
- the transfer head 230 is moved from the carrier substrate 220 to a position above a top surface 242 of the receiving substrate 240 , in which the top surface 242 of the receiving substrate 240 is where the receiving locations 244 are. Then a placing process is performed.
- the receiving substrate 240 may be a display substrate, a lighting substrate, a substrate with functional devices such as transistors or integrated circuits, or a substrate with metal redistribution lines, but should not be limited thereto.
- receiving locations 244 R, receiving locations 244 G, and receiving locations 244 B are just notations to indicate that R, G, and B may come from different carrier substrates.
- receiving locations 244 R, 244 G, and 244 B may be locations for red LEDs, green LEDs, and Blue LEDs respectively, but should not be limited thereto.
- One of the receiving locations 244 R, 244 G, and 244 B may also be a location for a LED with another color (e.g., yellow, cyan), or another type of device.
- the dotted lines of some receiving locations 244 (e.g. the receiving locations 244 G and 244 B in FIG. 2D ) refer to receiving locations 244 that is still absent of micro devices 210 thereon in the current process.
- the micro devices 210 on the array R 1 of the grip regions 232 are placed onto the array R 1 of the receiving locations 244 of the receiving substrate 240 .
- grip regions 232 belonged to columns R 11 , R 12 , and R 13 correspond to receiving locations 244 belonged to columns R 11 , R 12 , and R 13 respectively.
- FIGS. 2A to 2D since the transfer head 230 is controlled in a column basis, micro devices 210 picked up by the transfer head 230 but not belonged to the array R 1 may remain attached on the transfer head 230 when the placing is performed.
- a multi-phase control of the transfer head 230 in a column basis or array basis may be performed.
- the array R 1 is controlled in one phase in which an electrical voltage is adjusted so that the micro devices 210 on the grip regions 232 of the array R 1 are released.
- grip regions 232 not belonged to the array R 1 are controlled in another phase so that the micro devices 210 are kept on said grip regions 232 when the placing is performed.
- iterative placing processes after only one picking up may be performed, as will be shown below.
- FIG. 2E is a schematic view of receiving locations 244 on a top surface 242 of a receiving substrate 240 ′. Comparing to the receiving substrate 240 illustrated in FIG. 2D , the receiving substrate 240 ′ has some receiving locations 244 (e.g. receiving locations 244 G and 244 B) shifted along an extending direction D of columns R 11 , R 12 , R 13 . The receiving locations 244 G and 244 B are shifted along the same direction, and the receiving locations 244 B shift more than the receiving locations 244 G.
- some receiving locations 244 e.g. receiving locations 244 G and 244 B
- the receiving locations 244 G and 244 B are shifted along the same direction, and the receiving locations 244 B shift more than the receiving locations 244 G.
- micro devices 210 are picked up from the carrier substrate 220 by the transfer head 230 .
- micro devices 210 of the array R 1 on the carrier substrate 220 are picked up by the grip regions 232 of the array R 1 on the transfer head 230 .
- another array having at least one column may also be picked up.
- the number of arrays or columns being picked up depends on a design of grip regions 232 on the transfer head 230 and also depends on columns chosen to be picked up by users. For example, in FIGS. 2D and 2E , the array R 1 is picked up, and the array R 1 includes three columns R 11 , R 12 , and R 13 .
- FIGS. 3A to 3D A second iteration i 2 is performed.
- FIG. 3A is a schematic top view of the carrier substrate 220 with micro devices 210 thereon.
- FIG. 3B is a schematic view of a portion of the transfer head 230 with grip regions 232 thereon.
- FIG. 3C is a schematic view of receiving locations 244 on a top surface 242 of the receiving substrate 240 .
- two arrays of the micro devices 210 to be respectively placed by sequent two iterations of the placing process are at least partially embedded to each other on the carrier substrate 220 before the picking up, so that two of the columns adjacent to each other respectively belonged to said two arrays, and two of the micro devices 210 belonged to said two columns respectively are adjacent to one another on the carrier substrate 220 before the picking up.
- the micro devices 210 , the carrier substrate 220 , the transfer head 230 , and the receiving substrate 240 are the same as those illustrated in FIGS. 2A to 2D .
- another array R 2 including columns R 21 , R 22 , and R 23 is marked to assist an illustration of the second iteration i 2 .
- the array R 2 is at least partially embedded into the array R 1 , such that one of the columns R 21 , R 22 , R 23 is adjacent to one of the columns R 11 , R 12 , R 13 .
- the micro devices 210 in the column R 21 are adjacent to the micro devices 210 in the column R 11 , and so do the relation between the columns R 12 and R 22 and the relation between the columns R 13 and R 23 .
- micro devices 210 of the column R 21 on the carrier substrate 220 grip regions 232 of the column R 21 on the transfer head 230 , and the receiving locations 244 of the column R 21 on the receiving substrate 240 .
- the columns R 22 and R 23 also follow said correspondence rule.
- an array R 2 of the receiving locations 244 is not embedded in the array R 1 of the receiving locations, which is different from that shown in FIGS. 3A and 3B .
- micro devices 210 belonged to different arrays may be placed onto different blocks b 1 and b 2 on the receiving substrate 240 after a single picked-up operation, which results in efficiency enhancement on transferring the micro devices 210 .
- not only redundant movement of the transfer head 230 between the carrier substrate 220 and the receiving substrate 240 may be omitted, but also a movement of the transfer head 230 in each of the iterations may be reduced. This may be explained as follows with reference to FIGS. 3B to 3D .
- 3D is a schematic view of locations T 1 , T 2 of the transfer head 230 between subsequent iterations. From the first iteration i 1 to the second iteration i 2 , the transfer head 230 moves from a first location T 1 at which grip regions 232 of the column R 11 overlap with receiving locations 244 of the column R 11 when viewed in a direction normal to a top surface 242 of the receiving substrate to a second place T 2 at which grip regions 232 of the column R 21 overlap with receiving locations 244 of the column R 21 when viewed in the direction normal to the top surface 242 of the receiving substrate. As a result, a moving distance of about one pitch p 1 (i.e.
- an interval between the column R 11 and the column R 21 of the grip regions 232 on the transfer head 230 ) is reduced for the transfer head 230 comparing to an interval between the column R 11 and the column R 21 of the receiving locations 244 on the receiving substrate 240 .
- the reduction of moving distance is about 15 ⁇ m, assuming that the lateral length L of one micro device 210 is about the same as the lateral length L of one grip region 232 for simplicity. Said reduction can have large effect on efficiency enhancement when it comes to massively transferring a large number of micro devices 210 , e.g., about 0.1 to 1 million.
- the transfer head 230 is at least partially superimposed over the receiving substrate 240 when viewed in a direction normal to the top surface 242 of the receiving substrate 240 as shown in FIG. 3 D.
- the top surface 242 of the receiving substrate 240 is where the receiving locations 244 are.
- a slight overlap between positions of the transfer head 230 respectively at the first iteration i 1 and second iteration i 2 may be due to the reduction of moving distance as mentioned previously, but should not be limited thereto.
- the positions T 1 , T 2 of the transfer head 230 respectively at the first iteration i 1 and second iteration i 2 may not overlap with each other.
- FIG. 4A is a schematic top view of the carrier substrate 220 with micro devices 210 thereon.
- FIG. 4B is a schematic view of the transfer head 230 with grip regions 232 thereon.
- two arrays R 1 , R 2 of the micro devices 210 to be respectively placed by sequent two iterations i 1 , i 2 of the placing process are at least partially embedded to each other on the carrier substrate 220 before the picking up, so that two of the columns adjacent to each other are respectively belonged to the two arrays R 1 , R 2 , and two of the micro devices 210 belonged to said two columns (e.g.
- R 21 and R 11 respectively are interposed with one of the micro devices 210 not belonged to said two arrays R 1 , R 2 on the carrier substrate 220 before the picking up.
- a different pitch p 4 between the column R 11 and the column R 21 on the carrier substrate 220 may be present.
- Schematic diagrams are shown in FIGS. 4A and 4B . As shown, intervals between columns R 21 and R 11 , between columns R 22 and R 12 , and between columns R 23 and R 13 increase by about one pitch p 1 as compared to the embodiments illustrated by FIGS. 3A to 3B . As a result, further reduction of moving distance of the transfer head 230 between two subsequent iterations i 1 , i 2 can be performed.
- the reduction of moving distance is about 30 ⁇ m, assuming that the lateral length L of one micro device 210 is about the same as the lateral length L of one grip region 232 for simplicity.
- FIG. 5A is a schematic top view of a carrier substrate 320 with micro devices 310 thereon.
- FIG. 5B is an enlarged top view E 2 of a carrier substrate 320 with micro devices 310 thereon as shown in FIG. 5A .
- FIG. 5C is a schematic view of a portion of the transfer head 330 with grip regions 332 thereon.
- FIG. 5D is a schematic view of receiving locations 244 (including receiving locations 244 R, 244 G, and 244 B) on a top surface 242 of the receiving substrate 240 .
- another picking up and placing processes are performed by picking up another type of micro devices 310 from another carrier substrate 320 by the transfer head 330 and placing some of the micro devices 310 onto the same receiving substrate 240 as mentioned above in FIGS. 2D and 3C .
- the micro devices 210 may be red light micro light emitting diodes (R-pLED), and the micro devices 310 may be green light micro light emitting diodes (G-pLED), but should not be limited thereto. Other types of LEDs or other types of micro devices may not depart from the scope of current disclosure.
- the micro devices 310 on the carrier substrate 320 are grouped into a plurality of arrays, such as arrays G 1 and G 2 .
- Each of the arrays G 1 , G 2 may include a plurality of columns.
- FIG. 5A exemplifies that the array G 1 includes columns G 11 , G 12 , G 13 , and the array G 2 includes columns G 21 , G 22 , G 23 .
- More arrays e.g. arrays G 3 , G 4 . . .
- more columns in the same arrays e.g. columns G 14 , G 15 . . . in the array G 1
- the transfer head 330 also has a plurality of grip regions 332 grouped into arrays G 1 , G 2 , wherein the array G 1 includes columns G 11 , G 12 , G 13 , and the array G 2 includes columns G 21 , G 22 , G 23 , as shown in FIG. 5C .
- FIG. 5D A picking up process and placing processes are similar to those of the embodiments illustrated by FIGS. 2A to 4B , and details will not be repeated herein.
- One result of the processes is shown in FIG. 5D .
- the receiving substrate 240 there are micro devices 310 placed onto arrays G 1 , G 2 of receiving locations 244 , in which the array G 1 is at least partially embedded into the array R 1 , and the array G 2 is at least partially embedded into the array R 2 .
- the column G 11 is adjacent to the column R 11
- the column G 12 is adjacent to the column R 12
- the column G 13 is adjacent to the column R 13 .
- a spatial relation between the array R 2 and the array G 2 is similar to that between the arrays R 1 , G 1 and will not be repeated in detail herein.
- micro devices derived from different carrier substrates can be placed on to the same receiving substrate using the method 100 mentioned above. This is useful in, for example, display industry.
- a transfer head 230 is provided.
- the transfer head 230 may be used in the method 100 mentioned above, but should not be limited thereto.
- FIG. 6A is a schematic diagram of electrical connections of grip regions 232 on a portion of the transfer head 230 .
- the transfer head 230 includes a body B.
- the body B has a plurality of arrays (e.g. the array R 1 as shown in FIG. 6A ) of grip regions 232 .
- Each of the arrays RX (X is an integer) includes at least two columns (e.g.
- the grip regions 232 in one of the columns are electrically connected in series.
- the columns in one of the arrays are controlled by a single voltage source, and the columns in two of the arrays are controlled by two voltage sources respectively.
- the columns R 11 , R 12 , R 13 in the array R 1 are controlled by a single voltage source V 1
- the columns R 21 , R 22 , R 23 in the array R 2 are controlled by another voltage source V 2 .
- Voltage source V 1 and V 2 are electrically isolated from one another. In FIG.
- the arrays such as R 1 and R 2 are at least partially embedded in one another in which two of the columns adjacent to each other are respectively belonged to two of the arrays. It can be explained by FIG. 6A as an example.
- the column R 12 belonged to the array R 1 is adjacent to the columns R 41 and R 22 respectively belonged to the array R 4 and the array R 2 .
- a pitch p 1 between the adjacent columns is less than twice of a lateral length L of one of the grip regions.
- the pitch p 1 of adjacent columns is substantially equal to the pitch p 1 of the micro devices 210 on the carrier substrate 220 , which is less than twice of the lateral length L of one grip region.
- One grip region 232 is designed to have a lateral length L about the same as that of one micro device 210 in these embodiments, but in other embodiments it should not be limited thereto. It should be noted that, the meaning of “adjacent” defined hereinafter has some exclusive cases.
- FIG. 6B is a schematic diagram of a definition of a lateral length L.
- Six different shapes of micro devices 210 /grip regions 232 are shown as an example.
- the lateral length L is defined in a direction perpendicular to an extending direction D of a column as shown in the figure.
- FIG. 6C is a schematic view of a portion of the transfer head 230 ′ with grip regions 232 thereon.
- a pitch between the adjacent columns is more than or equal to twice of a lateral length L of one of the grip regions 232 .
- a pitch p 4 of adjacent columns e.g.
- FIG. 7A is a schematic view of a portion of a transfer head 430 with grip regions 432 thereon.
- FIG. 7B is a schematic view of receiving locations 444 on a top surface 442 of the receiving substrate 440 .
- the columns have an extending direction D.
- the grip regions 432 of a part of the columns are dislocated from the grip regions 432 of a remaining part of the columns along the extending direction D.
- the grip regions 432 of at least one of the columns among columns R 11 ′, R 12 ′, and R 13 ′ are dislocated from the grip regions 432 of a remaining part of the columns along the extending direction D.
- the grip regions 432 of at least one of the columns R 11 ′, R 12 ′, and R 13 ′ are dislocated from the grip regions 432 of a remaining part of the columns along the extending direction D.
- the columns in each of the arrays respectively e.g. R 1 ′ and R 2 ′ in FIG. 7A
- a delta type arrangement such as an array R 1 ′ shown in FIG. 7B may be performed by the transfer head 430 mentioned above.
- the micro devices 210 of the array R 1 (or the array R 1 ′) to be placed by the first iteration i 1 of the placing process and the micro devices 210 of the array R 2 , (or the array R 2 ′) to be placed by the second iteration i 2 of the placing process are arranged in the same arrangement on the carrier substrate 220 , 320 .
- the transfer head 230 is used.
- the transfer head 430 is used.
- FIGS. 8A to 8C are schematic views of grip regions 532 , 632 , 732 and recesses 534 , 634 , 734 of a portion of some types of transfer head 530 , 630 , 730 in some embodiments of the present disclosure.
- the body B further includes a plurality of recesses 534 , 634 , 734 .
- one of the recesses 534 is present between the grip regions 532 in adjacent two of the columns RY, or one of the columns RY is present between adjacent two of the recesses 534 , as exemplified in FIG. 8A .
- one of the recesses 634 is present between adjacent two of the grip regions 632 in one of the columns RY, or one of the grip regions 632 in one of the columns RY is present between adjacent two of the recesses 634 inserting said one of the columns RY, as exemplified in FIG. 8B .
- one of the recesses 534 is isolated from other recesses 534
- one of the recesses 634 is isolated from other recesses 634 .
- recesses 534 , 634 may be combined to form recesses 734 as shown in FIG. 8C , in which recesses 734 crossing one of the columns RY and recesses 734 extending along the extending direction D and between the columns RY co-exist.
- FIG. 8D is a schematic side view of a transfer head 830 when one of the placing processes is performed.
- recesses 834 among the grip regions 832 may be used to accommodate some of micro devices 810 located on the receiving substrate 840 before the placing.
- the receiving locations 844 are illustrated in FIG. 8D .
- each of the receiving locations 844 may include at least one conductive pad 8442 thereon for an electrical contact between at least one micro device 810 and the receiving substrate 840 .
- FIG. 9 is a schematic enlarged view of a portion of a transfer head 930 in some embodiments of the present disclosure.
- One method of electrical connection is shown.
- Each of the metal lines 936 connects a plurality of grip regions 932 in series.
- a plurality of recesses 934 are present.
- Each of the recesses 934 is present between two of the grip regions 932 as shown in the figure.
- the transfer head 930 as shown in FIG. 9 is only an example and should not be limited thereto.
- some embodiments of the present disclosure demonstrate a method that can save time when a mass transfer of micro devices is performed by iterative placing after one picking up. Furthermore, some transfer heads are shown to perform the method. The design of array-based control of grip regions on those transfer heads also reduce the complexity of circuit design, thus costing down the manufacture of a transfer head.
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Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6080650A (en) * | 1998-02-04 | 2000-06-27 | Texas Instruments Incorporated | Method and apparatus for attaching particles to a substrate |
US6669801B2 (en) * | 2000-01-21 | 2003-12-30 | Fujitsu Limited | Device transfer method |
US20050232728A1 (en) * | 2004-03-31 | 2005-10-20 | Rice Michael R | Methods and apparatus for transferring conductive pieces during semiconductor device fabrication |
US20120018494A1 (en) * | 2010-07-22 | 2012-01-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal Compress Bonding |
US20120027557A1 (en) * | 2009-12-17 | 2012-02-02 | Cooledge Lighting, Inc. | Method and electrostatic transfer stamp for transferring semiconductor dice using electrostatic transfer printing techniques |
US20120273455A1 (en) * | 2011-04-29 | 2012-11-01 | Clean Energy Labs, Llc | Methods for aligned transfer of thin membranes to substrates |
US8349116B1 (en) * | 2011-11-18 | 2013-01-08 | LuxVue Technology Corporation | Micro device transfer head heater assembly and method of transferring a micro device |
US8415771B1 (en) * | 2012-05-25 | 2013-04-09 | LuxVue Technology Corporation | Micro device transfer head with silicon electrode |
US20130130416A1 (en) * | 2011-11-18 | 2013-05-23 | Andreas Bibl | Method of fabricating a micro device transfer head |
US8518204B2 (en) * | 2011-11-18 | 2013-08-27 | LuxVue Technology Corporation | Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer |
US9105492B2 (en) * | 2012-05-08 | 2015-08-11 | LuxVue Technology Corporation | Compliant micro device transfer head |
-
2018
- 2018-02-26 US US15/904,442 patent/US10593582B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6080650A (en) * | 1998-02-04 | 2000-06-27 | Texas Instruments Incorporated | Method and apparatus for attaching particles to a substrate |
US6669801B2 (en) * | 2000-01-21 | 2003-12-30 | Fujitsu Limited | Device transfer method |
US20050232728A1 (en) * | 2004-03-31 | 2005-10-20 | Rice Michael R | Methods and apparatus for transferring conductive pieces during semiconductor device fabrication |
US20120027557A1 (en) * | 2009-12-17 | 2012-02-02 | Cooledge Lighting, Inc. | Method and electrostatic transfer stamp for transferring semiconductor dice using electrostatic transfer printing techniques |
US20120018494A1 (en) * | 2010-07-22 | 2012-01-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal Compress Bonding |
US20120273455A1 (en) * | 2011-04-29 | 2012-11-01 | Clean Energy Labs, Llc | Methods for aligned transfer of thin membranes to substrates |
US8349116B1 (en) * | 2011-11-18 | 2013-01-08 | LuxVue Technology Corporation | Micro device transfer head heater assembly and method of transferring a micro device |
US20130130416A1 (en) * | 2011-11-18 | 2013-05-23 | Andreas Bibl | Method of fabricating a micro device transfer head |
US8518204B2 (en) * | 2011-11-18 | 2013-08-27 | LuxVue Technology Corporation | Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer |
US9105492B2 (en) * | 2012-05-08 | 2015-08-11 | LuxVue Technology Corporation | Compliant micro device transfer head |
US8415771B1 (en) * | 2012-05-25 | 2013-04-09 | LuxVue Technology Corporation | Micro device transfer head with silicon electrode |
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