UA13467A1 - Флюс для низькотемпературного паяння - Google Patents
Флюс для низькотемпературного паянняInfo
- Publication number
- UA13467A1 UA13467A1 UA4830342A UA4830342A UA13467A1 UA 13467 A1 UA13467 A1 UA 13467A1 UA 4830342 A UA4830342 A UA 4830342A UA 4830342 A UA4830342 A UA 4830342A UA 13467 A1 UA13467 A1 UA 13467A1
- Authority
- UA
- Ukraine
- Prior art keywords
- flux
- low
- temperature soldering
- carboxylic acid
- solvent
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyesters Or Polycarbonates (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP88200097A EP0324194B1 (de) | 1988-01-12 | 1988-01-12 | Verfahren zur Herstellung von elektronischen Komponenten unter Verwendung eines Weichlötflussmittels auf Carbonsäurebasis |
PCT/EP1988/000017 WO1989006584A1 (en) | 1988-01-12 | 1988-01-12 | Process for manufacturing electronic components using a soft soldering flux based on carboxylic acid |
Publications (1)
Publication Number | Publication Date |
---|---|
UA13467A1 true UA13467A1 (uk) | 1997-02-28 |
Family
ID=8199740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
UA4830342A UA13467A1 (uk) | 1988-01-12 | 1990-07-11 | Флюс для низькотемпературного паяння |
Country Status (10)
Country | Link |
---|---|
US (1) | US5116432A (de) |
EP (2) | EP0324194B1 (de) |
JP (1) | JPH0825058B2 (de) |
AT (1) | ATE80822T1 (de) |
DE (1) | DE3874897D1 (de) |
ES (1) | ES2047019T3 (de) |
FI (1) | FI92660C (de) |
RU (1) | RU2009032C1 (de) |
UA (1) | UA13467A1 (de) |
WO (1) | WO1989006584A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5009725A (en) * | 1990-03-30 | 1991-04-23 | Air Products And Chemicals, Inc. | Fluxing agents comprising β-diketone and β-ketoimine ligands and a process for using the same |
GB2257988B (en) * | 1990-05-04 | 1994-07-27 | Delco Electronics Corp | Low-residue rosin-free soldering flux |
US5192360A (en) * | 1990-05-15 | 1993-03-09 | Hughes Aircraft Company | Water-soluble flux for cored solder |
DE4126913A1 (de) * | 1991-08-14 | 1993-02-18 | Siemens Ag | Verfahren zum beloten und montieren von leiterplatten mit bauelementen |
US5437738A (en) * | 1994-06-21 | 1995-08-01 | Gerenrot; Yum | Fluxes for lead-free galvanizing |
US5507882A (en) * | 1994-02-28 | 1996-04-16 | Delco Electronics Corporation | Low residue water-based soldering flux and process for soldering with same |
US5817190A (en) * | 1995-05-25 | 1998-10-06 | Matsushita Electric Industrial Co., Ltd. | Flux for soft soldering |
JP3378139B2 (ja) * | 1996-03-19 | 2003-02-17 | 株式会社デンソー | はんだ付け用のフラックス |
US6059894A (en) * | 1998-04-08 | 2000-05-09 | Hewlett-Packard Company | High temperature flip chip joining flux that obviates the cleaning process |
RU2463144C2 (ru) * | 2010-12-15 | 2012-10-10 | Открытое акционерное общество "Авангард" | Флюс для низкотемпературной пайки |
JP6215633B2 (ja) * | 2013-09-30 | 2017-10-18 | 株式会社タムラ製作所 | ロジン含有量を低減させたはんだ付け用フラックスおよびはんだペースト組成物 |
JP5790862B1 (ja) | 2014-12-25 | 2015-10-07 | 千住金属工業株式会社 | やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ及びフラックスコートはんだ |
CN114289932B (zh) * | 2022-01-24 | 2023-02-24 | 云南锡业锡材有限公司 | 一种无卤免清洗无铅焊锡丝助焊剂及其制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3734791A (en) * | 1970-10-23 | 1973-05-22 | Ibm | Surfactant-containing soldering fluxes |
DE2114927C3 (de) * | 1971-03-27 | 1980-06-04 | Stannol-Loetmittelfabrik Wilhelm Paff, 5600 Wuppertal | LötfluBmittel |
US4342607A (en) * | 1981-01-05 | 1982-08-03 | Western Electric Company, Inc. | Solder flux |
EP0215773B2 (de) * | 1984-05-14 | 1997-01-22 | KERNER, Rudolf A. | Verfahren zur herstellung von elektronischen komponenten unter verwendung eines weichlötflussmittels auf carbonsäurebasis |
SE457335B (sv) * | 1984-07-20 | 1988-12-19 | Ytkemiska Inst | Flussmedel foer mjukloedning samt foerfarande foer mjukloedning med anvaendning av flussmedlet |
US4988395A (en) * | 1989-01-31 | 1991-01-29 | Senju Metal Industry Co., Ltd. | Water-soluble soldering flux and paste solder using the flux |
-
1988
- 1988-01-12 AT AT88901033T patent/ATE80822T1/de not_active IP Right Cessation
- 1988-01-12 US US07/499,401 patent/US5116432A/en not_active Expired - Fee Related
- 1988-01-12 WO PCT/EP1988/000017 patent/WO1989006584A1/de active IP Right Grant
- 1988-01-12 JP JP63501135A patent/JPH0825058B2/ja not_active Expired - Lifetime
- 1988-01-12 EP EP88200097A patent/EP0324194B1/de not_active Expired - Lifetime
- 1988-01-12 EP EP88901033A patent/EP0398871B1/de not_active Expired - Lifetime
- 1988-01-12 ES ES88200097T patent/ES2047019T3/es not_active Expired - Lifetime
- 1988-01-12 DE DE8888901033T patent/DE3874897D1/de not_active Expired - Lifetime
-
1990
- 1990-07-11 FI FI903524A patent/FI92660C/fi not_active IP Right Cessation
- 1990-07-11 UA UA4830342A patent/UA13467A1/uk unknown
- 1990-07-11 RU SU904830342A patent/RU2009032C1/ru active
Also Published As
Publication number | Publication date |
---|---|
FI92660C (fi) | 1994-12-27 |
FI92660B (fi) | 1994-09-15 |
EP0398871B1 (de) | 1992-09-23 |
US5116432A (en) | 1992-05-26 |
DE3874897D1 (de) | 1992-10-29 |
EP0324194B1 (de) | 1993-10-20 |
ES2047019T3 (es) | 1994-02-16 |
FI903524A0 (fi) | 1990-07-11 |
EP0398871A1 (de) | 1990-11-28 |
RU2009032C1 (ru) | 1994-03-15 |
JPH03502662A (ja) | 1991-06-20 |
WO1989006584A1 (en) | 1989-07-27 |
ATE80822T1 (de) | 1992-10-15 |
JPH0825058B2 (ja) | 1996-03-13 |
EP0324194A1 (de) | 1989-07-19 |
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