TWM677979U - LED devices and their LED modules - Google Patents

LED devices and their LED modules

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Publication number
TWM677979U
TWM677979U TW114207676U TW114207676U TWM677979U TW M677979 U TWM677979 U TW M677979U TW 114207676 U TW114207676 U TW 114207676U TW 114207676 U TW114207676 U TW 114207676U TW M677979 U TWM677979 U TW M677979U
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TW
Taiwan
Prior art keywords
led
heat
circuit board
module
load module
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TW114207676U
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Chinese (zh)
Inventor
張瑞祥
廖學科
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廣美科技股份有限公司
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Priority to TW114207676U priority Critical patent/TWM677979U/en
Publication of TWM677979U publication Critical patent/TWM677979U/en

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Abstract

一種LED裝置與其LED模組,該LED模組包含LED單元、導熱件,及溫差發電晶片。該LED單元包括具有相反之正面與背面的電路板,及至少一個電連接設置在該電路板之該正面的LED。該導熱件設置在該電路板之該背面,而能導接該LED單元產生之熱能。該溫差發電晶片設置在該導熱件,且用以電連接一負載模組,可將該導熱件導接之熱能轉換成用以驅動該負載模組運作的電能。透過該LED模組之結構設計,可以該溫差發電晶片將LED單元發光時產生的熱能轉換成電能,而可有效回收用LED單元之熱能,有助於提高能源使用效能。An LED device and its LED module are disclosed. The LED module includes LED units, a heat-conducting component, and a thermoelectric generator. The LED unit includes a circuit board having opposite front and back sides, and at least one LED electrically connected to the front side of the circuit board. The heat-conducting component is disposed on the back side of the circuit board and conducts heat generated by the LED unit. The thermoelectric generator is disposed on the heat-conducting component and electrically connected to a load module, converting the heat conducted by the heat-conducting component into electrical energy to drive the load module. Through the structural design of this LED module, the thermoelectric generator can convert the heat generated by the LED unit when emitting light into electrical energy, effectively recovering the heat energy of the LED unit and helping to improve energy efficiency.

Description

LED裝置與其LED模組 LED devices and their LED modules

本新型是有關於一種發光裝置,特別是指一種LED發光裝置。This invention relates to a light-emitting device, and more particularly to an LED light-emitting device.

由於LED具有低耗能特性,且具有多種色光能供選擇,所以已被廣泛用於各種照明領域,例如但不限於燈泡、手電筒、車燈、路燈與裝飾燈。但LED的一個最大缺點,就是在將電能轉換成光能的過程中會產生高溫。為避免所述高溫影響燈具壽命,目前的作法都是在LED燈具中設置散熱結構,藉以將LED運作產生之熱能導引散除至周遭環境中。如此一來,雖然有助於降低LED燈具的溫度,但卻平白浪廢掉所述熱能。Because of their low energy consumption and the availability of a variety of light colors, LEDs have been widely used in various lighting applications, including but not limited to light bulbs, flashlights, car lights, streetlights, and decorative lights. However, one of the biggest drawbacks of LEDs is the high temperature generated during the conversion of electrical energy into light energy. To avoid these high temperatures affecting the lifespan of the lighting fixtures, current methods involve incorporating heat dissipation structures into LED lights to dissipate the heat generated by the LEDs into the surrounding environment. While this helps reduce the temperature of the LED lights, it also wastes the energy generated.

因此,本新型的目的,即在提供一種能回收再利用LED發光產生之熱能的LED裝置。Therefore, the purpose of this invention is to provide an LED device that can recycle and reuse the heat generated by LED light emission.

於是,本新型LED裝置,包含一個LED模組,及一個電連接於該LED模組的負載模組。Therefore, the present novel LED device includes an LED module and a load module electrically connected to the LED module.

該LED模組包括一個LED單元、一個設置在該LED單元之導熱件,及一個設置在該導熱件上的溫差發電晶片。該LED單元包括一個具有相反之一正面與一背面的電路板,及至少一個電連接設置在該電路板之該正面的LED。該導熱件設置在該電路板之該背面。該溫差發電晶片可將該導熱件導接之熱能轉換成電能。該負載模組電連接於該溫差發電晶片,可被該溫差發電晶片產生之電能驅動運作。The LED module includes an LED unit, a heat-conducting component disposed on the LED unit, and a thermoelectric generator disposed on the heat-conducting component. The LED unit includes a circuit board having a front side and a back side, and at least one LED electrically connected to the front side of the circuit board. The heat-conducting component is disposed on the back side of the circuit board. The thermoelectric generator converts the heat energy conducted by the heat-conducting component into electrical energy. The load module is electrically connected to the thermoelectric generator and can be driven by the electrical energy generated by the thermoelectric generator.

本新型的另一目的,即在提供一種能回收再利用LED發光產生之熱能的LED模組。Another objective of this invention is to provide an LED module that can recycle and reuse the heat generated by LED light emission.

於是,本新型LED模組,適用於電連接一個負載模組。該LED模組包含一個LED單元、一個導熱件,及一個溫差發電晶片。Therefore, this novel LED module is suitable for electrically connecting a load module. The LED module includes an LED unit, a heat-conducting component, and a thermoelectric chip.

該LED單元包括一個具有相反之一正面與一背面的電路板,及至少一個電連接設置在該電路板之該正面的LED。該導熱件設置在該電路板之該背面,而能導接該LED單元產生之熱能。該溫差發電晶片設置在該導熱件,且用以電連接該負載模組,可將該導熱件導接之熱能轉換成用以驅動該負載模組運作的電能。The LED unit includes a circuit board having opposite front and back sides, and at least one LED electrically connected to the front side of the circuit board. A heat-conducting element is disposed on the back side of the circuit board to conduct heat generated by the LED unit. A thermoelectric generator is disposed on the heat-conducting element and electrically connected to the load module, converting the heat conducted by the heat-conducting element into electrical energy to drive the operation of the load module.

本新型之功效在於:透過該LED模組之結構設計,可以該溫差發電晶片將LED單元發光時產生的熱能轉換成電能,而可有效回收用LED單元之熱能,有助於提高能源使用效能。The advantage of this new technology is that, through the structural design of the LED module, the thermoelectric chip can convert the heat energy generated when the LED unit emits light into electrical energy, thereby effectively recovering the heat energy of the LED unit and helping to improve energy efficiency.

參閱圖1,本新型LED裝置100的一個實施例,適用於安裝在一個燈座(圖未示)中,而用以建構出一個燈具。所述燈具例如但不限於手電筒、車燈等。該LED裝置100包含一個用以設置在該燈座的支架機構2,及安裝在該支架機構2的一個LED模組3與一個負載模組4,且該LED模組3與該負載模組4電連接。Referring to Figure 1, one embodiment of the novel LED device 100 is adapted to be installed in a lamp holder (not shown) to construct a lighting fixture. The lighting fixture is, for example, but not limited to, a flashlight, a vehicle light, etc. The LED device 100 includes a support mechanism 2 for mounting in the lamp holder, and an LED module 3 and a load module 4 mounted in the support mechanism 2, wherein the LED module 3 and the load module 4 are electrically connected.

該支架機構2可供該LED模組3與該負載模組4間隔排列設置定位。由於可用以架設定位該LED模組3與該負載模組4的支架機構2類型眾多,所以實施時,該支架機構2不以圖式樣式為限。The bracket mechanism 2 allows the LED module 3 and the load module 4 to be arranged and positioned at intervals. Since there are many types of bracket mechanisms 2 that can be used to mount and position the LED module 3 and the load module 4, the bracket mechanism 2 is not limited to the style shown in the drawing during implementation.

該LED模組3包括層疊設置的一個LED單元31、一個導熱件32與一個溫差發電晶片33。該LED單元31具有一個電路板311,及多個電連接設置在該電路板311的LED314。該電路板311具有相背的一個正面312與一個背面313。該等LED314設置在該電路板311的該正面312。The LED module 3 includes an LED unit 31, a heat-conducting component 32, and a thermoelectric generator chip 33 stacked on top of each other. The LED unit 31 has a circuit board 311 and a plurality of LEDs 314 electrically connected to the circuit board 311. The circuit board 311 has a front side 312 and a back side 313 facing away from each other. The LEDs 314 are disposed on the front side 312 of the circuit board 311.

該導熱件32是由高導熱係數材料製成,例如但不限於鋁合金、銅與鋼等。該導熱件32貼靠固定在該電路板311的該背面313,可用以導接該等LED314產生之熱能。在本實施例中,該導熱件32是設計成板片狀,但實施時,在本新型之其它實施態樣中,該導熱件32也可設計成例如但不限於鰭片式。由於該導熱件32之結構型態眾多,實施時不以上述態樣為限。The heat-conducting element 32 is made of a material with high thermal conductivity, such as, but not limited to, aluminum alloy, copper, and steel. The heat-conducting element 32 is attached to and fixed to the back surface 313 of the circuit board 311, and can be used to conduct heat generated by the LEDs 314. In this embodiment, the heat-conducting element 32 is designed as a plate, but in other embodiments of this invention, the heat-conducting element 32 can also be designed as, for example, but not limited to, a fin type. Since there are many structural forms of the heat-conducting element 32, the embodiments are not limited to the above-described forms.

該溫差發電晶片33是設置固定在該導熱件32背向該LED單元31之一側,具有相背之一熱面331與一冷面332,會以該熱面331朝向該導熱件32。該溫差發電晶片33之該熱面331一側會被該導熱件32導接之熱能加熱升溫,而會根據該熱面331與該冷面332的溫差,透過賽貝克效應(Seebeck Effect)進行發電。由於該溫差發電晶片33可利用該熱面331與該冷面332之溫差進行發電為現有技術,因此不再詳述。The thermoelectric generator chip 33 is disposed and fixed on the side of the heat-conducting element 32 facing away from the LED unit 31, and has a hot side 331 and a cold side 332 facing away from each other, with the hot side 331 facing the heat-conducting element 32. The hot side 331 of the thermoelectric generator chip 33 is heated by the heat energy conducted by the heat-conducting element 32, and generates electricity through the Seebeck effect based on the temperature difference between the hot side 331 and the cold side 332. Since the thermoelectric generator chip 33 can generate electricity using the temperature difference between the hot side 331 and the cold side 332 is existing technology, it will not be described in detail.

該負載模組4電連接於該溫差發電晶片33,可被該溫差發電晶片33產生之電能驅動運作。The load module 4 is electrically connected to the thermoelectric chip 33 and can be driven by the electrical energy generated by the thermoelectric chip 33.

在本實施例中,該負載模組4為風扇,具有一個朝向該LED模組3的進風側41,及一背向該進風側41之出風側42。該負載模組4被驅動運作時,會經該進風側41進行氣體抽吸,也就是對該LED模組3進行散熱。In this embodiment, the load module 4 is a fan, having an air inlet side 41 facing the LED module 3 and an air outlet side 42 facing away from the air inlet side 41. When the load module 4 is driven to operate, it draws in gas through the air inlet side 41, which means it dissipates heat from the LED module 3.

但實施時,在本新型之其它實施態樣中,該負載模組4也可以是其他電子元件,例如但不限於車用負離子產生器與車用霧化器(加濕器)等。However, in other embodiments of this invention, the load module 4 may also be other electronic components, such as, but not limited to, automotive negative ion generators and automotive atomizers (humidifiers).

本實施例中,會以該支架機構2將該LED模組3與該負載模組4架設定位。但實施時,在本新型之其它實施態樣中,不以設置該支架機構2為必要。In this embodiment, the support mechanism 2 is used to mount and position the LED module 3 and the load module 4. However, in other embodiments of this invention, it is not necessary to install the support mechanism 2.

綜上所述,透過該LED模組3與該負載模組4之結構設計,可以該溫差發電晶片33將該LED單元31發光時產生的熱能轉換成電能,而用以驅動該負載模組4,所以可有效回收用該LED單元31之熱能,有助於提高能源使用效能。因此,本新型之該LED裝置100與該LED模組3確實都是相當創新且方便實用的創作,確實能達成本新型的目的。In summary, through the structural design of the LED module 3 and the load module 4, the thermoelectric chip 33 can convert the heat energy generated when the LED unit 31 emits light into electrical energy to drive the load module 4. Therefore, the heat energy of the LED unit 31 can be effectively recovered, which helps to improve energy efficiency. Thus, the LED device 100 and the LED module 3 of this invention are indeed innovative and practical creations, and can effectively achieve the purpose of this invention.

惟以上所述者,僅為本新型的實施例而已,當不能以此限定本新型實施的範圍,凡是依本新型申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾,皆仍屬本新型專利涵蓋的範圍內。However, the above description is merely an embodiment of this invention and should not be construed as limiting the scope of this invention. Any simple equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the patent specification shall still fall within the scope of this invention.

100:LED裝置2:支架機構3:LED模組31:LED單元311:電路板312:正面313:背面314:LED32:導熱件33:溫差發電晶片331:熱面332:冷面4:負載模組41:進風側42:出風側100: LED device 2: Support structure 3: LED module 31: LED unit 311: Circuit board 312: Front 313: Back 314: LED 32: Heat-conducting component 33: Thermoelectric chip 331: Hot side 332: Cold side 4: Load module 41: Air inlet side 42: Air outlet side

本新型的其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是一個立體圖,說明本新型LED裝置的一個實施例的結構。Other features and benefits of this invention will be clearly shown in the embodiments with reference to the drawings, wherein: Figure 1 is a perspective view illustrating the structure of an embodiment of the LED device of this invention.

100:LED裝置 100: LED Device

2:支架機構 2: Support Structure

3:LED模組 3: LED Module

31:LED單元 31: LED Unit

311:電路板 311: Circuit Board

312:正面 312: Front

313:背面 313: Back View

314:LED 314: LED

32:導熱件 32: Thermal conductive components

33:溫差發電晶片 33: Thermoelectric Chip

331:熱面 331: Hot Noodles

332:冷面 332: Cold Noodles

4:負載模組 4: Load Module

41:進風側 41: Air intake side

42:出風側 42: Windward side

Claims (6)

一種LED模組,適用於電連接一個負載模組,並包含: 一個LED單元,包括一個具有相反之一正面與一背面的電路板,及至少一個電連接設置在該電路板之該正面的LED; 一個導熱件,設置在該電路板之該背面,而能導接該LED單元產生之熱能;及 一個溫差發電晶片,設置在該導熱件,且用以電連接該負載模組,可將該導熱件導接之熱能轉換成用以驅動該負載模組運作的電能。An LED module, suitable for electrically connecting a load module, includes: an LED unit including a circuit board having opposite front and back sides, and at least one LED electrically connected to the front side of the circuit board; a heat conductor disposed on the back side of the circuit board, capable of conducting heat generated by the LED unit; and a thermoelectric chip disposed on the heat conductor and for electrically connecting the load module, capable of converting the heat conducted by the heat conductor into electrical energy for driving the operation of the load module. 如請求項1所述的LED模組,其中,該LED單元包括多個電連接於該電路板的該LED。The LED module as described in claim 1, wherein the LED unit includes a plurality of LEDs electrically connected to the circuit board. 一種LED裝置,包含: 一個LED模組,包括一個LED單元、一個設置在該LED單元之導熱件,及一個設置在該導熱件上的溫差發電晶片,該LED單元包括一個具有相反之一正面與一背面的電路板,及至少一個電連接設置在該電路板之該正面的LED,該導熱件設置在該電路板之該背面,該溫差發電晶片可將該導熱件導接之熱能轉換成電能;及 一個負載模組,電連接於該溫差發電晶片,可被該溫差發電晶片產生之電能驅動運作。An LED device includes: an LED module including an LED unit, a heat-conducting element disposed on the LED unit, and a thermoelectric generator disposed on the heat-conducting element; the LED unit includes a circuit board having a front side and a back side, and at least one LED electrically connected to the front side of the circuit board; the heat-conducting element is disposed on the back side of the circuit board; and the thermoelectric generator can convert the heat energy conducted by the heat-conducting element into electrical energy; and a load module electrically connected to the thermoelectric generator and driven by the electrical energy generated by the thermoelectric generator. 如請求項3所述的LED裝置,其中,該LED單元包括多個電連接於該電路板的該LED。The LED device as described in claim 3, wherein the LED unit includes a plurality of LEDs electrically connected to the circuit board. 如請求項3所述的LED裝置,其中,該負載模組為風扇,該負載模組具有一個面向該LED模組之進風側,並可被所述電能驅動而經由該進風側進行氣體抽吸。The LED device as claimed in claim 3, wherein the load module is a fan having an air intake side facing the LED module and being driven by the electrical energy to draw gas through the air intake side. 如請求項3至5任一項所述的LED裝置,還包含一個用以架設定位該LED模組與該負載模組的支架機構。The LED device as described in any one of claims 3 to 5 further includes a support mechanism for mounting and positioning the LED module and the load module.
TW114207676U 2025-07-23 2025-07-23 LED devices and their LED modules TWM677979U (en)

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