TWM666641U - Optical transceiver module housing and optical transceiver module - Google Patents

Abstract

An optical transceiver module housing includes a housing body and a heat sink. The housing body has an electronic component accommodating space and an opening communicated with the electronic component accommodating space. The heat sink is detachably assembled to the housing body. The heat sink includes a thermally conductive plate and at least one thermally conductive fin fixed on the thermally conductive plate. The thermally conductive plate is accommodated in the electronic component accommodating space. The at least one thermally conductive fin is exposed from the opening. An Optical transceiver module includes a circuit board assembly and the above optical transceiver module housing. The circuit board assembly has a board edge connector. The circuit board assembly is accommodated in the electronic component accommodating space and extends out of the electronic device accommodating space to expose the board edge connector. The thermally conductive plate is thermally coupled with the circuit board assembly.

Description

Optical transceiver module housing and optical transceiver module

The invention relates to an optical transceiver module, and more particularly to an optical transceiver module housing with a heat dissipation structure.

In the field of optical communications, the transmission rate of optical transceiver modules is constantly increasing, and the power of optical transceiver modules during operation is also increasing, causing optical transceiver modules to often operate at higher temperatures. In order to avoid excessive operating temperatures, some optical transceiver modules are currently equipped with heat sinks on the module housing to effectively dissipate internal heat. However, this structure in which the internal heat first passes through the module housing and then dissipates through the external heat sink fins has gradually failed to meet the use scenarios of continuously increasing transmission rates, resulting in a design bottleneck for optical transceiver modules.

In view of the problems in the prior art, the purpose of the present invention is to provide an optical transceiver module housing, whose heat sink can pass through the housing body, thereby directly absorbing heat energy from the inside of the housing body and dissipating the absorbed heat energy outside the housing body, thereby increasing the heat dissipation efficiency.

According to an embodiment of the present invention, an optical transceiver module housing includes a housing body and a heat sink. The housing body has an electronic device accommodating space and an opening connected to the electronic device accommodating space. The heat sink is removably assembled to the housing body. The heat sink includes a heat conductive substrate and at least one heat conductive fin fixed on the heat conductive substrate, the heat conductive substrate is accommodated in the electronic device accommodating space, and the at least one heat conductive fin is exposed from the opening. Thereby, the heat sink can directly absorb heat energy from the inside of the housing body and dissipate the absorbed heat energy outside the housing body, thereby increasing the heat dissipation efficiency.

Another purpose of the present invention is to provide an optical transceiver module, which includes the aforementioned optical transceiver module housing, so that its heat sink can pass through the housing body and can be directly thermally coupled with the light-emitting component accommodated inside the housing body to increase heat dissipation efficiency.

According to an embodiment of the present invention, an optical transceiver module includes a circuit board assembly and the aforementioned optical transceiver module housing. The circuit board assembly has a board edge connector. The circuit board assembly is accommodated in the electronic device accommodating space and extends out of the electronic device accommodating space to expose the board edge connector, and the heat conductive substrate is thermally coupled with the circuit board assembly. Thereby, the heat sink can directly absorb heat energy from the circuit board assembly inside the housing body and dissipate the absorbed heat energy outside the housing body, thereby increasing the heat dissipation efficiency.

The advantages and spirit of this creation can be further understood through the following creation details and attached diagrams.

Please refer to Figures 1 to 3. According to an embodiment, the optical transceiver module 1 includes a circuit board assembly 12 and an optical transceiver module housing 14. The optical transceiver module housing 14 accommodates the circuit board assembly 12. The circuit board assembly 12 has a board edge connector 122 exposed from the optical transceiver module housing 14 so as to be connected to a connector socket (not shown) of the optical transceiver module socket.

In this embodiment, the optical transceiver module housing 14 has a length direction 14a as a whole and includes a housing body 142 and two heat sinks (an upper heat sink 144 and a lower heat sink 146) detachably assembled to the housing body 142. The housing body 142 includes an upper cover 1422 and a lower cover 1424 in a vertical direction Dv (indicated by a bidirectional arrow in the figure, perpendicular to the length direction 14a), and the upper cover 1422 and the lower cover 1424 are connected to form an electronic device accommodating space 142a. The circuit board assembly 12 is accommodated in the electronic device accommodating space 142a and extends out of the electronic device accommodating space 142a to expose the board edge connector 122 in the length direction 14a; wherein the upper cover 1422 and the lower cover 1424 have corresponding restraining structures to restrain the long side (parallel to the length direction 14a) of the circuit board 120 of the circuit board assembly 12. The upper cover 1422 has an opening 1422a in the vertical direction Dv, and the opening 1422a is connected to the electronic device accommodating space 142a; the lower cover 1424 also has an opening 1424a in the vertical direction Dv, and the opening 1424a is connected to the electronic device accommodating space 142a. The upper heat sink 144 is assembled to the upper cover 1422, and the upper heat sink 144 partially extends into the electronic device accommodating space 142a through the opening 1422a and is exposed at the opening 1422a. The lower heat sink 146 is assembled to the lower cover 1424, and the lower heat sink 146 partially extends into the electronic device accommodating space 142a through the opening 1424a and is exposed at the opening 1424a. The upper heat sink 144 and the lower heat sink 146 are thermally coupled to the circuit board assembly 12 to directly absorb heat energy from the circuit board assembly 12 and dissipate the absorbed heat energy outside the housing body 142.

Please refer to Figures 2 to 4; Figure 4 is a top view of the upper heat sink 144, in which the hidden line of the upper heat sink 144 is shown in dotted lines. The upper heat sink 144 includes a heat-conducting substrate 1442, at least one heat-conducting fin 1444 fixed on the heat-conducting substrate 1442, and a cover 1446. The cover 1446 is arranged opposite to the heat-conducting substrate 1442 and is fixedly connected to the at least one heat-conducting fin 1444. The heat-conducting substrate 1442 is accommodated in the electronic device accommodating space 142a, the at least one heat-conducting fin 1444 is exposed from the opening 1422a of the upper cover 1422 and extends out of the shell body 142, and the cover 1446 is located outside the shell body 142. The heat-conducting substrate 1442 has a fin connection portion 1442a (i.e., equivalent to the range surrounded by the chain frame in FIG. 4 ) and a stop portion 1442b (i.e., equivalent to the range between the chain frame in FIG. 4 and the outline of the heat-conducting substrate 1442, in the form of a rectangular frame). The at least one heat-conducting fin 1444 is connected to the fin connection portion 1442a, and there is no fin on the stop portion 1442b. The stop portion 1442b is adjacent to the fin connection portion 1442a and surrounds the fin connection portion 1442a. The heat conductive substrate 1442 is larger than the opening 1422a of the upper cover 1422, so that the stopper 1442b is stopped by the edge of the opening 1422a in the electronic device accommodating space 142a; in other words, the upper heat sink 144 will not separate from the housing body 142 from the opening 1422a, and the highest position of the cover 1446 (relative to the protruding height of the upper cover 1422) can be controlled to ensure that the external dimensions of the optical transceiver module housing 14 meet the specifications. In actual assembly (from the perspective of FIG. 2), the upper heat sink 144 moves upward from the bottom of the upper cover 1422 so that part of the structure passes through the opening 1422a, and is then assembled to the upper cover 1422.

In addition, in this embodiment, the entire opening 1422a of the upper cover 1422 can be projected on the thermal conductive substrate 1442 in the vertical direction, but the implementation is not limited to this. For example, only a portion of the opening 1422a is projected on the thermal conductive substrate 1442 (for example, the short side of the rectangular stopper 1442b is exposed from the opening 1422a, and the long side of the stopper 1442b is still covered by the upper cover 1422); at this time, the stopper 1442b can still effectively stop the edge of the opening 1422a, preventing the upper heat sink 144 from detaching from the housing body 142 from the opening 1422a. In addition, in practice, the stopper 1442b can be fixed to an inner surface 1422b of the upper cover 1422 (see FIG. 3 ), for example, by gluing, soldering, locking, structural tightness, etc.

In addition, as shown in FIG. 2 and FIG. 3 , in the upper heat sink 144 , the number of the at least one heat conductive fin 1444 is 6, but this is not limited in practice. The heat conductive fin 1444 extends parallel to the length direction 14a of the upper heat sink 144 (or the optical transceiver module 1 ), and is connected between the heat conductive substrate 1442 and the cover plate 1446 to form a plurality of air flow channels (parallel to the length direction 14a). These air flow channels allow airflow (such as cooling airflow of the equipment into which the optical transceiver module 1 is inserted) to circulate, which can increase the heat dissipation efficiency of the heat conductive fin 1444 . In addition, the upper heat sink 144 is located between the vertical plates 1422c on both sides of the upper cover 1422, and the upper heat sink 144 and the vertical plates 1422c are substantially at the same height (relative to the top surface of the upper cover 1422 body). The top of the cover plate 1446 of the upper heat sink 144 is a flat surface, which is beneficial for the cover plate 1446 to contact the inner surface of the socket housing through its top after the optical transceiver module 1 is inserted into the socket, thereby increasing the heat dissipation efficiency.

As shown in FIG. 2 and FIG. 3 , in this embodiment, a plurality of electronic components 124 (select one mark) are disposed on one side of the circuit board assembly 12 facing the upper heat sink 144. A heat conductive substrate 1442 is thermally coupled to the electronic components 124 via a heat conductive material 148 (such as but not limited to a heat conductive sheet), so that the heat conductive substrate 1442 can quickly absorb the heat generated by the electronic components 124 during operation, thereby preventing the electronic components 124 from overheating and causing performance degradation or failure.

Please refer to FIG. 2, FIG. 3 and FIG. 5; among them, FIG. 5 is a top view of the lower heat sink 146. The lower heat sink 146 includes a heat conductive substrate 1462 and at least one heat conductive fin 1464 fixed on the heat conductive substrate 1462 (the number of which is 7, but not limited to this in practice). The heat conductive substrate 1462 is accommodated in the electronic device accommodating space 142a, and the at least one heat conductive fin 1464 extends parallel to the length direction 14a and is exposed from the opening 1424a of the lower cover 1424. Similarly, the thermally conductive substrate 1462 has a fin connection portion 1462a (i.e., equivalent to the range surrounded by the chain frame in FIG. 5 ) and a stop portion 1462b (i.e., equivalent to the range between the chain frame in FIG. 5 and the outline of the thermally conductive substrate 1462, which is a rectangular frame). The at least one thermally conductive fin 1464 is connected to the fin connection portion 1462a, and there is no fin on the stop portion 1462b. The stop portion 1462b is adjacent to the fin connection portion 1462a and surrounds the fin connection portion 1462a. The heat-conducting substrate 1462 is larger than the opening 1424a of the lower cover 1424, so that the stopper 1462b is stopped by the edge of the opening 1424a in the electronic device accommodating space 142a; in other words, the lower heat sink 146 will not separate from the housing body 142 from the opening 1424a, and the position of the lower heat sink 146 relative to the lower cover 1424 can be controlled to ensure that the external dimensions of the optical transceiver module housing 14 meet the specifications. In actual assembly (from the perspective of FIG. 2 ), the lower heat sink 146 moves downward from the upper part of the lower cover 1424 so that the at least one heat-conducting fin 1464 is placed in the opening 1422a, and then assembled to the lower cover 1424.

In addition, other descriptions about the relative arrangement relationship between the thermal conductive substrate 1462 and the opening 1424a (including descriptions of variations) can be directly referred to the descriptions about the relative arrangement relationship between the thermal conductive substrate 1442 of the upper heat sink 144 and the opening 1422a of the upper cover 1422 in the previous text, and will not be elaborated on separately.

In addition, as shown in FIG. 2 and FIG. 3 , the at least one heat conductive fin 1464 of the lower heat sink 146 does not protrude from the opening 1424a (i.e., does not protrude from the bottom surface of the lower cover 1424), so during the process of inserting the optical transceiver module 1 into the socket, the at least one heat conductive fin 1464 will not interfere with the aforementioned insertion operation. In this embodiment, the end of the at least one heat conductive fin 1464 is substantially coplanar with the bottom surface of the lower cover 1424, but the practice is not limited thereto.

Similarly, as shown in FIG. 2 and FIG. 3 , in this embodiment, the circuit board assembly 12 is provided with a plurality of electronic components 126 (select one mark) on one side facing the lower heat sink 146. The heat conductive substrate 1462 is thermally coupled to the electronic components 126 via a heat conductive material 150 (such as but not limited to a heat conductive sheet), so that the heat conductive substrate 1462 can quickly absorb the heat generated by the electronic components 126 during operation, thereby preventing the electronic components 126 from overheating and reducing performance or failing.

As described above, in the optical transceiver module housing 14 of the optical transceiver module 1, the upper heat sink 144 and the lower heat sink 146 are designed to be assembled with the upper cover 1422 and the lower cover 1424 respectively. Therefore, in practice, the upper heat sink 144, the lower heat sink 146, the upper cover 1422 and the lower cover 1424 can be made of different materials. For example, the upper cover 1422 and the lower cover 1424 are zinc alloys to provide the required structural strength of the optical transceiver module 1; the upper heat sink 144 and the lower heat sink 146 are aluminum alloys, which have higher heat dissipation efficiency (relative to zinc alloys). However, this is not limited to this in practice. In addition, in this embodiment, the upper heat sink 144 has a cover plate 1446, and the lower heat sink 146 has a heat conductive fin 1464, but the implementation is not limited to this. For example, in the optical transceiver module 1' shown in FIG6, the upper heat sink 144' does not have an upper cover; in this example, the heat conductive fin 1444 of the upper heat sink 144' is at the same height as the vertical plate 1422c. In addition, in this embodiment, the optical transceiver module housing 14 is provided with heat sinks on both the upper and lower sides (respectively, the upper heat sink 144 and the lower heat sink 146), but the implementation is not limited to this; for example, the optical transceiver module housing 14 is provided with a heat sink only on the upper side or the lower side (i.e., the upper heat sink 144 and the lower heat sink 146 are provided).

The above is only the best embodiment of the present invention. All equivalent changes and modifications made within the scope of the present invention should fall within the scope of the present invention.

1,1': Optical transceiver module 12: Circuit board assembly 120: Circuit board 122: Board edge connector 124,126: Electronic components 14: Optical transceiver module housing 14a: Length direction 142: Housing body 1422: Upper cover 1422a: Opening 1422b: Inner surface 1422c: Vertical plate 1424: Lower cover 1424a: Opening 142a: Electronic device storage space 144,144': Upper heat sink 1442: Thermally conductive substrate 1442a: Fin connection part 1442b: Stopper 1444: Thermally conductive fin 1446: Cover plate 146: Lower heat sink 1462: Thermally conductive substrate 1462a: Fin connection part 1462b: Stopper 1464: Thermally conductive fin 148,150: Thermally conductive material Dv: Vertical direction

FIG. 1 is a schematic diagram of an optical transceiver module according to an embodiment. FIG. 2 is a partial exploded view of the optical transceiver module in FIG. 1. FIG. 3 is a cross-sectional view of the optical transceiver module along line X-X in FIG. 1. FIG. 4 is a top view of an upper heat sink of an optical transceiver module housing of the optical transceiver module in FIG. 2. FIG. 5 is a top view of a lower heat sink of an optical transceiver module housing of the optical transceiver module in FIG. 2. FIG. 6 is a schematic diagram of an optical transceiver module according to another embodiment.

1: Optical transceiver module

12: Circuit board assembly

120: Circuit board

122: Board edge connector

124,126: Electronic components

14a: Length direction

1422: Upper cover

1422a: Open mouth

1422c: Vertical board

1424: Lower cover

1424a: Open mouth

144: Upper heat sink

1442: Thermally conductive substrate

1444: Thermal fins

1446: Cover plate

146: Lower heat sink

1462: Thermally conductive substrate

1464: Thermal fins

148,150: Thermal conductive materials

Dv: vertical direction

Claims (11)

An optical transceiver module housing comprises: a housing body having an electronic device accommodating space and an opening connected to the electronic device accommodating space; and a heat sink detachably assembled to the housing body, the heat sink comprising a heat conductive substrate and at least one heat conductive fin fixed on the heat conductive substrate, the heat conductive substrate is accommodated in the electronic device accommodating space, and the at least one heat conductive fin is exposed from the opening. The optical transceiver module housing as described in claim 1, wherein the at least one thermally conductive fin extends out of the housing body from the opening. The optical transceiver module housing as described in claim 1, wherein the heat sink comprises a cover plate, the cover plate is arranged opposite to the thermally conductive substrate and is fixedly connected to the at least one thermally conductive fin. The optical transceiver module housing as described in claim 1, wherein the thermally conductive substrate has a fin connecting portion and a stopping portion, the stopping portion is adjacent to the fin connecting portion, and the stopping portion is stopped by the edge of the opening in the electronic device accommodating space. An optical transceiver module housing as described in claim 4, wherein the blocking portion surrounds the fin connecting portion. An optical transceiver module housing as described in claim 4, wherein the stopping portion is fixed to an inner surface of the housing body. The optical transceiver module housing as described in claim 1, wherein the housing body includes an upper cover and a lower cover, the upper cover and the lower cover are connected to form the electronic device accommodating space, and the opening is arranged on the upper cover or the upper cover. An optical transceiver module housing as described in claim 1, wherein the housing body and the heat sink are made of different materials. The optical transceiver module housing as described in claim 1, wherein the at least one thermally conductive fin does not protrude from the opening. An optical transceiver module comprises: An optical transceiver module housing as described in any one of claims 1 to 9; and A circuit board assembly having a board edge connector, the circuit board assembly is accommodated in the electronic device accommodating space and extends out of the electronic device accommodating space to expose the board edge connector, and the thermally conductive substrate is thermally coupled to the circuit board assembly. An optical transceiver module as described in claim 10, wherein the circuit board assembly has an electronic component, and the thermally conductive substrate is thermally coupled to the electronic component via a thermally conductive material.

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