TWM660696U - Pumpless heat dissipation element and electronic device - Google Patents

Abstract

The present invention discloses a pumpless heat dissipation element and an electronic device. The pumpless heat dissipation element includes a tubular body and a cooling fluid. The tubular body has a heat absorption section, a first transport section, a second transport section and a heat discharge section. The first transport section is connected to the heat absorption section and the heat discharge section, and the second transport section is connected to the heat absorption section and the heat discharge section. The heat absorption section and the heat discharge section are one-way valves. The cooling fluid is located inside the tubular body. When the cooling fluid located in the heat absorption section absorbs heat energy outside the heat absorption section, the cooling fluid changes from liquid to vapor and expands, and flows toward the first transport section and the heat discharge section through the kinetic energy generated by the expansion. When the steam is in the heat dissipation section, the heat energy of the steam is transferred to the heat dissipation section and converted into liquid, and flows toward the second transport section and the heat absorption section.

Description

Pumpless cooling elements and electronics

The invention relates to a pumpless heat sink and an electronic device, and in particular to a miniaturized pumpless heat sink and an electronic device that can circulate, conduct heat and dissipate heat continuously without using a pump.

Electronic products are constantly increasing their functionality and efficiency as consumer demand demands, and this can only be achieved through complex calculations. However, this will generate a large amount of heat in the increasingly miniaturized electronic products, so heat dissipation has become an important issue that electronic products or their electronic components must face.

In current heat dissipation technology, the heat sink used is installed on the semiconductor component, and the heat generated by the semiconductor component is taken away by continuously replenishing a flow channel with a lower temperature cooling liquid. However, although this water cooling design can improve the heat dissipation efficiency, the force that drives the cooling liquid to flow in the heat sink comes from a pump; therefore, the large-volume heat sink not only cannot keep up with the miniaturization of semiconductor components, but also occupies too much space in electronic products.

Therefore, how to overcome the above-mentioned defects through the improvement of structural design has become one of the important issues that this industry wants to solve.

The technical problem to be solved by this invention is to provide a pump-free heat dissipation element and an electronic device to address the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a pumpless heat dissipation element, which includes a tubular body and a cooling fluid. The tubular body has a heat absorption section, a first transport section, a second transport section and a heat discharge section, the first transport section is connected to the heat absorption section and the heat discharge section, the second transport section is connected to the heat absorption section and the heat discharge section, and the heat absorption section and the heat discharge section are one-way valves. The cooling fluid is located inside the tubular body. When the cooling fluid located in the heat absorption section absorbs the heat energy outside the heat absorption section, the cooling fluid changes from a liquid to a vapor and expands, and flows toward the first transport section and the heat discharge section through the kinetic energy generated by the expansion. When the steam is located in the heat dissipation section, the heat energy of the steam is transferred to the heat dissipation section and is converted into the liquid state and flows toward the second transport section and the heat absorption section.

In one feasible or preferred embodiment, the one-way valve body is a Tesla valve; wherein the first transport section and the second transport section are Tesla valves; wherein the heat absorption section and the heat discharge section are in a winding shape, and the first transport section and the second transport section are in a straight shape.

In one feasible or preferred embodiment, the material of the tubular body is metal, plastic, ceramic or silicon; wherein the inner diameter of the tubular body is between 10µm and 300µm.

In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide an electronic device, which includes a packaging component, a heat-generating electronic component and a pumpless heat dissipation component. The heat-generating electronic component is located in the packaging component. The pumpless heat dissipation component includes a tubular body and a cooling fluid. The tubular body is located on the packaging component and corresponds to the heat-generating electronic component. The tubular body has a heat absorption section, a first transport section, a second transport section and a heat discharge section. The first transport section is connected to the heat absorption section and the heat discharge section, and the second transport section is connected to the heat absorption section and the heat discharge section. The heat absorption section and the heat discharge section are one-way valves. The cooling fluid is located inside the tubular body. When the cooling fluid in the heat absorption section absorbs the heat energy of the heat-generating electronic component, the cooling fluid changes from a liquid state to a vapor and expands, and flows toward the first delivery section and the heat dissipation section through the kinetic energy generated by the expansion. When the vapor is in the heat dissipation section, the heat energy of the vapor is transferred to the heat dissipation section, and changes into the liquid state, and flows toward the second delivery section and the heat absorption section.

In one feasible or preferred embodiment, the electronic device further includes a heat-driving electronic element corresponding to the tubular body, and the heat-driving electronic element is configured to accelerate the condensation rate of the vapor; wherein the heat-generating electronic element is a silicon carbide (SiC) power element, and the heat-driving electronic element is a fan or a water cooling module.

In one feasible or preferred embodiment, the one-way valve is a Tesla valve; wherein the first transport section and the second transport section are Tesla valves; wherein the heat absorption section and the heat discharge section are in a winding shape, and the first transport section and the second transport section are in a straight shape; wherein the material of the tubular body is metal, plastic, ceramic or silicon; wherein the inner diameter of the tubular body is between 10 µm and 300 µm.

One of the beneficial effects of the invention is that the pumpless heat dissipation element and electronic device provided by the invention can be provided by "a tubular body having a heat absorption section, a first delivery section, a second delivery section and a heat discharge section, the first delivery section is connected to the heat absorption section and the heat discharge section, the second delivery section is connected to the heat absorption section and the heat discharge section, and the heat absorption section and the heat discharge section are one-way valves. The cooling fluid is located inside the tubular body. Among them, when located in the heat absorption section When the cooling fluid in the heat absorbing section absorbs the heat energy outside the heat absorbing section, the cooling fluid changes from a liquid state to a vapor and expands, and flows toward the first conveying section and the heat dissipating section through the kinetic energy generated by the expansion. Wherein, when the vapor is located in the heat dissipating section, the heat energy of the vapor is transferred to the heat dissipating section and changes into the liquid state, and flows toward the second conveying section and the heat absorbing section. The pump is omitted, the space occupied is reduced, and the practicality is improved.

In order to further understand the features and technical content of this work, please refer to the following detailed description and diagrams of this work. However, the diagrams provided are only used for reference and explanation and are not used to limit this work.

The following is an explanation of the implementation of the "pumpless heat dissipation element, its manufacturing method and electronic device" disclosed in this creation through specific concrete embodiments. Technical personnel in this field can understand the advantages and effects of this creation from the content disclosed in this manual. This creation can be implemented or applied through other different specific embodiments, and the details in this manual can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings of this creation are only simple schematic illustrations and are not depicted according to actual dimensions. Please note in advance. The following implementation will further explain the relevant technical content of this creation in detail, but the disclosed content is not intended to limit the scope of protection of this creation.

It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are mainly used to distinguish one component from another. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[First embodiment]

Please refer to Figures 1 to 4, which are respectively a top view schematic diagram of a pumpless heat sink element of the first embodiment of the present invention, an enlarged schematic diagram of part II of Figure 1, an enlarged schematic diagram of part III of Figure 1, and a cross-sectional schematic diagram of section IX-IX of Figure 1. As shown in the above figures, the first embodiment of the present invention provides a pumpless heat sink element D, which can be applied to electronic devices, and the electronic devices can be portable electronic devices (such as mobile phones, tablet computers, etc., but not limited thereto), wearable electronic devices (such as VR/AR helmets, smart watches, etc., but not limited thereto), electronic components (such as chips, but not limited thereto), etc., but not limited thereto. The pumpless heat sink element D includes a tubular body D1 and a cooling fluid D2.

As shown in FIG. 1 and FIG. 4 , the tubular body D1 may have a heat absorbing section D10, a first conveying section D11, a second conveying section D12, and a heat dissipating section D13. The first conveying section D11 is connected to the heat absorbing section D10 and the heat dissipating section D13, and the second conveying section D12 is connected to the heat absorbing section D10 and the heat dissipating section D13. The heat absorbing section D10 and the heat dissipating section D13 may be one-way valves. For example, the heat absorbing section D10 and the heat dissipating section D13 may use one-way valves, and the one-way valves may be Tesla valves; and in other preferred embodiments, the first conveying section D11 and the second conveying section D12 may also be Tesla valves. The tubular body D1 can be made of metal, plastic, ceramic or silicon, and the metal can be copper, tin, silver, nickel, gold, aluminum, or any combination thereof. The inner diameter h of the tubular body D1 can be between 10 µm and 300 µm, preferably between 50 µm and 100 µm. The heat absorption section D10 and the heat discharge section D13 can be in a winding shape, and the first conveying section D11 and the second conveying section D12 can be in a straight shape. The two ends of the first conveying section D11 are respectively connected to one end of the heat absorption section D10 and one end of the heat discharge section D13, and the two ends of the first conveying section D11 are respectively connected to the other end of the heat absorption section D10 and the other end of the heat discharge section D13.

Next, as shown in FIGS. 2 to 4 , the cooling fluid D2 may be located inside the tubular body D1. For example, the cooling fluid D2 may be an organic solvent (such as acetone, methanol, ethanol, etc., but not limited thereto), water, fluorinated liquid, R32 environmentally friendly refrigerant, low-temperature liquid alloy metal (such as gallium, indium, tin, bismuth, etc., but not limited thereto) or other liquids used for cooling or heat conduction.

Therefore, when the cooling fluid D2 located in the heat absorption section D10 absorbs the heat energy outside the heat absorption section D10, the cooling fluid D2 can be transformed from a liquid state (e.g., liquid) into a vapor (e.g., liquid and gas) and expand, and flow toward the first conveying section D11 and the heat dissipation section D13 through the kinetic energy generated by the expansion. When the gas in the vapor and the cooling fluid D2 are located in the heat dissipation section D13, the heat energy of the gas and the cooling fluid D2 is transferred to the heat dissipation section D13 and cooled, so that the vapor is transformed into a liquid state and flows toward the second conveying section D12 and the heat absorption section D10.

For example, as shown in FIGS. 1 to 4 , the pumpless heat dissipation element D of the invention can be used to be arranged on at least one object (such as electronic products or other heat-generating objects), and the heat absorption section D10 of the tubular body D1 can be connected to the object. Therefore, when the object generates heat and generates thermal energy, the thermal energy of the object can be transferred to the cooling fluid D2 in the heat absorption section D10 through the tubular body D1, so that the cooling fluid D2 absorbs the heat and quickly vaporizes, that is, changes from liquid to steam; at the same time, the steam can flow toward the first delivery section D11 and the heat dissipation section D13 by using the kinetic energy generated by the expansion due to vaporization and the structural setting of the one-way valve of the heat absorption section D10.

Next, when the gas in the steam and the cooling fluid D2 flow into the heat dissipation section D13 through the first conveying section D11, the tubular body D1 can absorb the heat of the gas in the steam and the cooling fluid D2 through the heat dissipation section D13, and exchange heat with the gas and the cooling fluid D2, that is, the heat of the gas in the steam and the cooling fluid D2 can be transferred to the heat dissipation section D13; at this time, the cooling fluid D2 in the steam will condense into liquid, and through the structural setting of the one-way valve of the heat dissipation section D13, it can flow toward the second conveying section D12 and the heat absorption section D10, that is, return to the heat absorption section D10, and then circulate over and over again.

It is worth mentioning that the locations of the heat absorbing section D10 and the heat dissipating section D13 of the tubular body D1 of the present invention are only exemplary. When applied, the heat dissipating section D13 can also be used to absorb the heat of an object, while the heat absorbing section D10 is used to discharge the heat of the cooling fluid D2.

Thus, the pumpless heat sink D of the present invention provides a pumpless heat sink D that does not require a pump through the above-mentioned technical solution, so that the cooling fluid D2 can circulate, conduct heat, and dissipate heat continuously inside the tubular body D1. Therefore, not only can the setting of the pump be omitted, but the space occupied by the pump can also be reduced, thereby improving practicality.

However, the above example is only one possible implementation example and is not intended to limit the present invention.

[Second embodiment]

Please refer to Figures 5 and 6, which are respectively the side view and top view of the electronic device of the second embodiment of the present invention, and please refer to Figures 1 to 4 together. As shown in the above figures, the pumpless heat dissipation element D mentioned in this embodiment is roughly similar to the pumpless heat dissipation element D of the above embodiment, so the setting or operation of the same element will not be repeated here. The difference between this embodiment and the above first embodiment is that in this embodiment, the present invention provides an electronic device Z, which includes a packaging component 1, a heat-generating electronic component 2 and a pumpless heat dissipation element D. Among them, the electronic device Z can be a portable electronic device (such as a mobile phone, a tablet computer, etc., but not limited thereto), a wearable electronic device (such as a VR/AR helmet, a smart watch, etc., but not limited thereto), an electronic component (such as a chip, a circuit board, etc., but not limited thereto), etc., but not limited thereto.

5 and 6 , the package component 1 may be a carrier or a housing for accommodating or encapsulating one or more semiconductor components or integrated circuits, and the material of the carrier or the housing may be metal, plastic, glass, or ceramic.

5 and 6 , the heat-generating electronic component 2 may be located in the package component 1. For example, the heat-generating electronic component 2 may be a semiconductor component, such as a silicon carbide (SiC) power component or other high-power IC (integrated circuit).

Next, as shown in FIGS. 1 to 6 , the heat dissipation element D without a pump may include a tubular body D1 and a cooling fluid D2. The tubular body D1 is located on the package element 1 and corresponds to the heat-generating electronic element 2. The tubular body D1 may have a heat-absorbing section D10, a first transport section D11, a second transport section D12, and a heat-dissipating section D13. The first transport section D11 is connected to the heat-absorbing section D10 and the heat-dissipating section D13. The second transport section D12 is connected to the heat-absorbing section D10 and the heat-dissipating section D13. The heat-absorbing section D10 and the heat-dissipating section D13 may be one-way valves. The cooling fluid D2 is located inside the tubular body D1. Among them, the one-way valve can be a Tesla valve; and, in other preferred embodiments, the first conveying section D11 and the second conveying section D12 can be Tesla valves. The heat absorption section D10 and the heat dissipation section D13 can be in a winding shape, and the first conveying section D11 and the second conveying section D12 can be in a straight shape. In addition, the material of the tubular body D1 can be metal, plastic, ceramic or silicon, and the metal can be copper, tin, silver, nickel, gold, aluminum or any combination thereof. The inner diameter of the tubular body D1 can be between 10 µm and 300 µm, preferably between 50 µm and 100 µm.

Therefore, when the cooling fluid D2 in the heat absorbing section D10 absorbs the heat energy of the heat generating electronic component 2, the cooling fluid D2 can be transformed from a liquid state into a vapor and expand, and flow toward the first conveying section D11 and the heat dissipating section D13 through the kinetic energy generated by the expansion. When the vapor is in the heat dissipating section D13, the heat energy of the vapor is transferred to the heat dissipating section D13, and is transformed into a liquid state, and flows toward the second conveying section D12 and the heat absorbing section D10.

For example, as shown in FIGS. 1 to 6 , the pumpless heat sink D of the invention can be used to be arranged on the heat-generating electronic component 2, and the heat-absorbing section D10 of the tubular body D1 can be connected to and in contact with the heat-generating electronic component 2. Therefore, when the heat-generating electronic component 2 generates heat energy during operation, the heat energy of the heat-generating electronic component 2 can be transferred to the heat-absorbing section D10, so that the cooling fluid D2 in the heat-absorbing section D10 absorbs the heat energy and quickly vaporizes after the heat, that is, it changes from liquid to steam; at the same time, the steam can flow toward the first delivery section D11 and the heat dissipation section D13 by using the kinetic energy generated by the expansion due to vaporization and the structural setting of the one-way valve of the heat-absorbing section D10.

Next, when the gas in the steam and the cooling fluid D2 flow into the heat dissipation section D13 through the first conveying section D11, the tubular body D1 can absorb the heat of the gas in the steam and the cooling fluid D2 through the heat dissipation section D13, and exchange heat with the gas and the cooling fluid D2, that is, the heat of the gas in the steam and the cooling fluid D2 can be transferred to the heat dissipation section D13; at this time, the cooling fluid D2 in the steam will condense into a liquid state, and through the structural setting of the one-way valve of the heat dissipation section D13, it can flow toward the second conveying section D12 and the heat absorption section D10, that is, return to the heat absorption section D10, and absorb the thermal energy and heat of the heat-generating electronic component 2 again, thereby repeating the cycle of heat absorption and heat dissipation.

It is worth mentioning that the electronic device Z of the present invention may also include a heat-driving electronic component 3, which may be located in the package component 1 and corresponds to the tubular body D1, and the heat-driving electronic component 3 is configured to accelerate the condensation speed of the vapor. For example, the heat-driving electronic component 3 may be a semiconductor component or other heat-dissipating component, such as an IC (integrated circuit) component, a fan, or a water-cooling module. Furthermore, the heat-dissipating section D13 of the tubular body D1 of the pumpless heat dissipating component D may be disposed on the heat-driving electronic component 3.

Therefore, when the heat-driving electronic component 3 is a heat dissipation component, the condensation speed of the vapor cooling fluid D2 can be accelerated, thereby improving the heat dissipation efficiency.

However, the above example is only one possible implementation example and is not intended to limit the present invention.

[Third Embodiment]

Please refer to Figures 7 to 9, which are respectively a first process diagram of the manufacturing method of the pumpless heat sink element of the third embodiment of the present invention, a second process diagram of the manufacturing method of the pumpless heat sink element, and a partial exploded diagram of the pumpless heat sink element, and please refer to Figures 1 to 6 together. As shown in the above figures, the present embodiment provides a method for manufacturing a pumpless heat sink element D, which includes the following steps:

A tubular body D1 is provided (step S102). The tubular body D1 may have a heat absorbing section D10, a first conveying section D11, a second conveying section D12, and a heat dissipating section D13. The first conveying section D11 is connected to the heat absorbing section D10 and the heat dissipating section D13. The second conveying section D12 is connected to the heat absorbing section D10 and the heat dissipating section D13. The heat absorbing section D10 and the heat dissipating section D13 may be one-way valves. For example, as shown in FIG. 1 and FIG. 7 , the tubular body D1 may be divided into four sections, and the one-way valves used in the heat absorbing section D10 and the heat dissipating section D13 may be Tesla valves; and, in other preferred embodiments, the first conveying section D11 and the second conveying section D12 may be Tesla valves. The heat absorption section D10 and the heat dissipation section D13 may be in a winding shape, and the first conveying section D11 and the second conveying section D12 may be in a straight shape. In addition, the material of the tubular body D1 may be metal, plastic, ceramic or silicon, and the metal may be copper, tin, silver, nickel, gold, aluminum or any combination thereof. The inner diameter of the tubular body D1 may be between 10 µm and 300 µm, preferably between 50 µm and 100 µm.

Furthermore, the manufacturing method of the pumpless heat sink D of the present invention further includes the following steps in the step S102 of providing the tubular body D1:

A specific forming method is used to form the tubular body D1 (step S1020). For example, in conjunction with FIG. 1 , FIG. 7 and FIG. 8 , the specific forming method may be a semiconductor process using exposure, development and etching, evaporation, electroplating, chemical vapor deposition, 3D printing, injection molding, stamping, die casting, casting, powder metallurgy or electric column. The tubular body D1 of the present invention can be formed into an integrated structure of the tubular body D1 by the above-mentioned specific forming method.

In other embodiments, the manufacturing method of the pumpless heat sink D of the present invention further includes the following steps in the step S102 of providing the tubular body D1:

A base member D14, a side wall member D15 and a closing member D16 are provided (step S1022). For example, as shown in FIG. 1 and FIG. 7 to FIG. 9, the base member D14 and the closing member D16 can be metal plates, and the side wall member D15 can be a hollow metal plate.

Next, the side wall member D15 is disposed on the base member D14, and the closing member D16 is disposed on the side wall member D15 to obtain the tubular body D1 (step S1024). For example, as shown in FIG. 1 , FIG. 8 and FIG. 9 , the tubular body D1 is obtained by disposing the side wall member D15 on the base member D14 and then disposing the closing member D16 on the side wall member D15, or by connecting the side wall member D15 to the closing member D16 and then connecting the side wall member D15 to the base member D14. The connection method between the base member D14, the side wall member D15 and the closing member D16 belongs to the known technology and will not be specifically described here.

Then, after step S102, a cooling fluid D2 is added to the interior of the tubular body D1 to obtain a pumpless heat sink D (step S104). For example, in conjunction with FIGS. 1 to 4 and 8, the pumpless heat sink D of the present invention can be added to the tubular body D1 during the manufacturing process of the tubular body D1, i.e., the cooling fluid D2 is first added to the tubular body D1. For example, in step S1020, the cooling fluid D2 is added to the tubular body D1 before the tubular body D1 is formed, or, in step S1024, the cooling fluid D2 is added to the tubular body D1 after two of the base member D14, the side wall member D15, and the closing member D16 are combined. Alternatively, the cooling fluid D2 may be added to the tubular body D1 after the tubular body D1 is manufactured; more specifically, the tubular body D1 may have a plurality of openings D17 penetrating the body, and the step S104 of adding the cooling fluid D2 to the interior of the tubular body D1 may further include the following steps:

Adding cooling fluid D2 to the interior of the tubular body D1 through one of the ports D17 (step S1040); and

The plurality of ports D17 of the tubular body D1 are closed (step S1042).

For example, as shown in FIGS. 1 to 4 and 8, a plurality of ports D17 may be formed on the tubular body D1, each of which connects the inside and outside of the tubular body D1. Then, the cooling fluid D2 is added to the inside of the tubular body D1 through one of the ports D17. Next, the plurality of ports D17 on the tubular body D1 are closed, and the pumpless heat sink D is obtained and completed.

When the cooling fluid D2 located in the heat absorption section D10 absorbs the heat energy outside the heat absorption section D10, the cooling fluid D2 can be transformed from a liquid state into a vapor and expand, and flow toward the first conveying section D11 and the heat dissipation section D13 through the kinetic energy generated by the expansion; when the vapor cooling fluid D2 is located in the heat absorption section D10, the heat energy of the cooling fluid D2 is transferred to the heat absorption section D10, and can be transformed from vapor into a liquid state, and flow toward the second conveying section D12 and the heat absorption section D10; the specific implementation method has been clearly described in the aforementioned embodiment, so it will not be repeated here.

However, the above example is only one possible implementation example and is not intended to limit the present invention.

[Beneficial Effects of the Embodiments]

One of the beneficial effects of the invention is that the pumpless heat dissipation element D and the electronic device Z provided by the invention can be provided by "the tubular body D1 may have a heat absorption section D10, a first delivery section D11, a second delivery section D12 and a heat discharge section D13, the first delivery section D11 is connected to the heat absorption section D10 and the heat discharge section D13, the second delivery section D12 is connected to the heat absorption section D10 and the heat discharge section D13, the heat absorption section D10 and the heat discharge section D13 are one-way valves. The cooling fluid D2 is located inside the tubular body D1. . When the cooling fluid D2 in the heat absorption section D10 absorbs the heat energy outside the heat absorption section D10, the cooling fluid D2 can be transformed from a liquid into a vapor and expand, and flow toward the first delivery section D11 and the heat dissipation section D13 through the kinetic energy generated by the expansion. When the vapor is in the heat dissipation section D13, the heat energy of the vapor is transferred to the heat dissipation section D13 and transformed into a liquid, and flows toward the second delivery section D12 and the heat absorption section D10. The technical solution omits the setting of pumps, reduces the space occupied, and thus improves practicality.

Another beneficial effect of the invention is that the manufacturing method of the pumpless heat dissipation element D provided by the invention can form a tubular body D1 by "adopting a specific forming method; wherein the tubular body D1 may have a heat absorption section D10, a first conveying section D11, a second conveying section D12 and a heat discharge section D13, the first conveying section D11 is connected to the heat absorption section D10 and the heat discharge section D13, the second conveying section D12 is connected to the heat absorption section D10 and the heat discharge section D13, the heat absorption section D10 and the heat discharge section D13 are one-way valves; and adding a cooling fluid The cooling fluid D2 is transferred to the inside of the tubular body D1. When the cooling fluid D2 in the heat absorbing section D10 absorbs the heat energy outside the heat absorbing section D10, the cooling fluid D2 can be transformed from a liquid state into a vapor and expand, and flow toward the first delivery section D11 and the heat dissipation section D13 through the kinetic energy generated by the expansion. When the vapor is in the heat absorbing section D10, the heat energy of the vapor is transferred to the heat absorbing section D10 and transformed into a liquid state, and flows toward the second delivery section D12 and the heat absorbing section D10. The pump is omitted, the space occupied is reduced, and the practicality is improved.

Furthermore, the pumpless heat dissipation element D and its manufacturing method and the electronic device Z of the present invention provide a pumpless heat dissipation element D that does not require a pump through the above-mentioned technical solution, so that the cooling fluid D2 can circulate, conduct heat, and dissipate heat continuously inside the tubular body D1. Therefore, not only can the setting of the pump be omitted, but the space occupied by the pump can also be reduced, thereby improving practicality.

The above disclosed contents are only the preferred feasible embodiments of this creation, and do not limit the scope of patent application of this creation. Therefore, all equivalent technical changes made by using the description and diagram contents of this creation are included in the scope of patent application of this creation.

Z: electronic device 1: packaged component 2: heat-generating electronic component D: heat dissipation component without pump D1: tubular body D10: heat absorption section D11: first transport section D12: second transport section D13: heat dissipation section D14: base component D15: side wall component D16: closing component D17: port D2: cooling fluid 3: heat-driving electronic component h: internal pipe diameter

FIG1 is a schematic top view of a pumpless heat dissipation element of the first embodiment of the present invention.

FIG. 2 is an enlarged schematic diagram of part II of FIG. 1 .

FIG. 3 is an enlarged schematic diagram of portion III of FIG. 1 .

FIG. 4 is a schematic cross-sectional view of the IV-IV section of FIG. 1 .

FIG5 is a side view schematic diagram of the electronic device of the second embodiment of the present invention.

FIG6 is a schematic top view of an electronic device according to a second embodiment of the present invention.

FIG. 7 is a schematic diagram of the first process of the manufacturing method of the pumpless heat dissipation element of the third embodiment of the present invention.

FIG8 is a schematic diagram of the second process of the method for manufacturing a pumpless heat dissipation element according to the third embodiment of the present invention.

FIG9 is a schematic diagram of a partial exploded view of the main body of a pumpless heat dissipation element in the third embodiment of the present invention.

D: Heat sink without pump

D1: Tubular body

D10: Heat absorption section

D11: First transport section

D12: Second transport section

D13: Heat dissipation section

D17: Port

Claims (6)

A pumpless heat dissipation element, comprising: a tubular body, which has a heat absorption section, a first delivery section, a second delivery section and a heat discharge section, the first delivery section is connected to the heat absorption section and the heat discharge section, the second delivery section is connected to the heat absorption section and the heat discharge section, the heat absorption section and the heat discharge section are one-way valves; and a cooling fluid, which is located inside the tubular body; wherein, when the cooling fluid located in the heat absorption section absorbs heat energy outside the heat absorption section, the cooling fluid changes from a liquid state to a vapor and expands, and flows toward the first delivery section and the heat discharge section through the kinetic energy generated by the expansion; When the steam is in the heat dissipation section, the heat energy of the steam is transferred to the heat dissipation section and converted into the liquid state, and flows toward the second transport section and the heat absorption section. A pumpless heat dissipation element as described in claim 1, wherein the one-way valve body is a Tesla valve; wherein the first transport section and the second transport section are Tesla valves; wherein the heat absorption section and the heat discharge section are in a winding shape, and the first transport section and the second transport section are in a straight shape. A pumpless heat sink as described in claim 1, wherein the material of the tubular body is metal, plastic, ceramic or silicon; wherein the inner diameter of the tubular body is between 10 µm and 300 µm. An electronic device, comprising: A packaging component; A heat-generating electronic component, which is located in the packaging component; and A pumpless heat dissipation component, which comprises: A tubular body, which is located on the packaging component and corresponds to the heat-generating electronic component, the tubular body having a heat absorption section, a first transport section, a second transport section and a heat discharge section, the first transport section is connected to the heat absorption section and the heat discharge section, the second transport section is connected to the heat absorption section and the heat discharge section, the heat absorption section and the heat discharge section are one-way valves; and A cooling fluid, which is located inside the tubular body; When the cooling fluid in the heat absorption section absorbs the heat energy of the heat-generating electronic component, the cooling fluid changes from a liquid state to a vapor and expands, and flows toward the first transport section and the heat dissipation section through the kinetic energy generated by the expansion; When the vapor is in the heat dissipation section, the heat energy of the vapor is transferred to the heat dissipation section, and changes into the liquid state, and flows toward the second transport section and the heat absorption section. The electronic device as described in claim 4 further includes a heat-driving electronic component corresponding to the tubular body, and the heat-driving electronic component is configured to accelerate the condensation rate of the vapor; wherein the heat-generating electronic component is a silicon carbide power component, and the heat-driving electronic component is a fan or a water cooling module. An electronic device as described in claim 4, wherein the one-way valve is a Tesla valve; wherein the first transport section and the second transport section are Tesla valves; wherein the heat absorption section and the heat discharge section are in a winding shape, and the first transport section and the second transport section are in a straight shape; wherein the material of the tubular body is metal, plastic, ceramic or silicon; wherein the inner diameter of the tubular body is between 10 µm and 300 µm.

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