TWM660368U - Packaging substrate and light emitting module - Google Patents

Abstract

A packaging substrate, including a metal substrate, which has a microstructure layer with a rough surface; a first adhesive layer, disposed on the microstructure layer; a reflection layer, disposed on the first adhesive layer; and a protective layer, disposed on the reflection layer, wherein a surfaces of the first adhesive layer, the reflection layer, and the protective layer all follow the undulations of the rough surface of the microstructure layer. A lighting emitting module including the packaging substrate is also proposed.

Description

Packaging substrate and light-emitting module

This novel invention relates to a substrate and a packaging module, in particular to a packaging substrate and a light-emitting module.

High-brightness light emitting diodes (LEDs) are the future trend of light sources, but as the brightness of LEDs increases, the temperature rise caused by the heat energy released will also increase. LEDs themselves are prone to failure or even damage in high temperature environments. Therefore, how to design a high thermal conductivity LED carrier substrate is a problem that related manufacturers need to face.

On the other hand, if the existing LED adopts Chips on Board (COB) packaging, it has the advantages of low cost, simple process, good light output and heat dissipation. COB packaging is usually packaged using a regular LED, that is, the LED electrodes are all located on the side of the LED away from the carrier substrate, and the LED is electrically connected by wire bonding. However, in the light field distribution of regular LEDs, the side emission accounts for a very high proportion of the overall light output of the LED. As a result, when the LED device density increases, the side emission of the LED is easily absorbed or blocked by other nearby LEDs, resulting in a decrease in the light output efficiency of the light-emitting device.

The "Prior Art" paragraph is only used to help understand the content of this novel creation. Therefore, the content disclosed in the "Prior Art" paragraph may contain some knowledge that does not constitute the common knowledge in the relevant technical field. The content disclosed in the "Prior Art" paragraph does not mean that the content or the problems to be solved by one or more embodiments of this novel creation have been known or recognized by the common knowledge in the relevant technical field before the application of this novel creation.

This novel invention provides a packaging substrate and a light-emitting module, which can increase the light energy utilization rate of the light-emitting element and effectively improve the optical quality.

Other purposes and advantages of this novel creation can be further understood from the technical features disclosed by this novel creation.

An embodiment of the present invention provides a packaging substrate, including a metal substrate having a microstructure layer with a concave-convex surface; a first adhesive layer disposed on the microstructure layer; a reflective layer disposed on the first adhesive layer; and a protective layer disposed on the reflective layer, wherein the surface of the first adhesive layer, the surface of the reflective layer, and the surface of the protective layer all fluctuate along the concave-convex surface of the microstructure layer.

An embodiment of the present invention proposes a light-emitting module, including a packaging substrate and a light-emitting element. The packaging substrate includes a metal substrate, a first adhesive layer, a reflective layer, and a protective layer. The metal substrate has a microstructure layer with a concave-convex surface, and the first adhesive layer is disposed on the microstructure layer. The reflective layer is disposed on the first adhesive layer, and the protective layer is disposed on the reflective layer. The surface of the first adhesive layer, the surface of the reflective layer, and the surface of the protective layer all fluctuate along the concave-convex surface of the microstructure layer, and a heat-conductive adhesive layer is disposed on the protective layer between the light-emitting element and the packaging substrate.

Based on the above, the packaging substrate and light-emitting module of this novel invention, in addition to utilizing the high thermal conductivity of the metal substrate to effectively dissipate heat, add microstructures to the metal substrate and coat a reflective layer with high reflectivity on it. The microstructure with a concave and convex surface allows the surface of the reflective layer to fluctuate along with the concave and convex surface. Therefore, even if the spacing of the LEDs is reduced due to the high-density packaging of the LEDs, the side light of the LEDs is easily diffused when it is irradiated on the surface of the reflective layer, resulting in a larger light angle after the LED light is reflected by the reflective layer, and the light beam is less likely to be blocked or absorbed by nearby LEDs to affect the light output efficiency, resulting in improved light output efficiency, effectively improving the brightness of the light-emitting module, and also improving the light energy utilization rate of the light-emitting element.

In order to make the above features and advantages of this novel creation more clearly understood, the following is a specific example and a detailed description with the attached diagrams.

10A, 10B, 10C: packaging substrate

20A, 20B: Light-emitting module

100:Metal substrate

101: Microstructure layer

101A,111,111A,111B,111C,121,131: Surface

110A: First adhesive layer

110B: Second adhesive layer

110C: The third adhesive layer

120,200:Reflection layer

130: Protective layer

140: Circuit board

141:Pad

150: Light-emitting element

160: Thermal conductive adhesive layer

160S: Contact surface

170: Shading layer

180: Optical conversion layer

CA: Concave

CX: convex part

IB: Illumination beam

L: Conductor

SP: Space

X, Y, Z: direction

Figure 1A is a schematic diagram of a packaging substrate of an embodiment of the present invention.

FIG1B is a schematic top view of the microstructure surface of FIG1A.

Figure 2 is a schematic diagram of a packaging substrate of an embodiment of the present invention.

FIG3A is a schematic diagram of a packaging substrate of an embodiment of the present invention.

FIG3B is a schematic diagram of the manufacturing process of the packaging substrate of the embodiment of FIG3A.

Figure 4 is a schematic diagram of a light-emitting module of an embodiment of the present invention.

Figure 5 is a schematic diagram of a light-emitting module of an embodiment of the present invention.

Figures 6A and 6B are schematic diagrams of the light-emitting module principle of the embodiment of the novel invention.

The aforementioned and other technical contents, features and effects of the novel invention will be clearly presented in the detailed description of the preferred embodiment with reference to the following drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and not to limit the novel invention.

The present invention is described more fully with reference to the drawings of the present embodiment. However, the present invention can also be embodied in various forms and should not be limited to the embodiments described herein. The thickness of the layers and regions in the drawings are exaggerated for clarity and do not represent the proportional relationship between the actual sizes. The same or similar reference numerals represent the same or similar elements, and the following paragraphs will not be repeated one by one.

FIG. 1A is a schematic diagram of a packaging substrate of the first embodiment of the present invention. FIG. 1B is a schematic diagram of a top view of the microstructure surface of FIG. 1A. Referring to FIG. 1A and FIG. 1B, the packaging substrate 10A includes a metal substrate 100, which is suitable for arranging electronic components (not shown) on a mounting side (e.g., direction Z in FIG. 1A). On the other hand, the metal substrate 100 has a microstructure layer 101, and the microstructure layer 101 has a concave-convex surface 101A. The first adhesive layer 110A is disposed on the microstructure layer 101. The reflective layer 120 is disposed on the first adhesive layer 110A, and the protective layer 130 is disposed on the reflective layer 120.

The metal substrate 100 is, for example, a circuit substrate, a heat sink, a heat sink fin or other types of packaging substrates with heat dissipation function, but the present invention is not limited thereto. In the present embodiment, the material of the metal substrate 100 is, for example, a metal material, including aluminum, copper, aluminum alloy or any material with good thermal conductivity, but the present invention is not limited thereto.

The surface 101A of the microstructure layer 101 can be formed by, for example, a pressing process, including flat plate pressing or continuous roller pressing of the surface of the metal substrate 100. In other words, the microstructure layer 101 and the metal substrate 100 can be formed of the same material in one piece, but the present invention is not limited thereto. The microstructure layer 101 can be convex, concave, or have a suitable design such as both. In the present embodiment, the surface 101A of the microstructure layer 101 has a plurality of concave portions CA and a plurality of convex portions CX, which can cause the light beam or electromagnetic wave irradiated to the package substrate 10A to produce diffuse reflection, so as to achieve the effect of increasing the divergence angle.

The first adhesive layer 110A is, for example, a metal material or an inorganic material with high thermal conductivity, such as titanium dioxide (TiO ₂ ), silicon oxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), titanium (Ti), nickel (Ni), cadmium (Cr), copper (Cu) or alloys thereof, but the present invention is not limited thereto. In some embodiments, the first adhesive layer 110A may be a single layer or a multi-layer structure of different materials, but the present invention is not limited thereto. The first adhesive layer 110A may be disposed on the microstructure layer 101 by electroplating, for example, wet electroplating or physical vapor deposition (PVD) to dispose the first adhesive layer 110A on the microstructure layer 101. The physical vapor deposition method includes evaporation, sputtering, ion beam assisted deposition (IAD), pulsed laser deposition or other suitable methods to increase the adhesion of subsequent film layers (such as the reflective layer 120 and the protective layer 130, etc.), but the present invention is not limited thereto.

The reflective layer 120 is preferably made of a material having a high reflectivity for the wavelength of the electromagnetic wave to be reflected. For example, in this embodiment, if the electromagnetic wave in the visible light band is to be reflected, the material of the reflective layer 120 may include silver or other suitable materials. The following is an example of the reflective layer 120 being silver. In this embodiment, the method of setting the reflective layer 120 includes setting the metal material on the first adhesive layer 110A by physical vapor deposition (PVD) or wet plating. The physical vapor deposition method includes evaporation, sputtering, ion beam assisted deposition (IAD), pulsed laser deposition or other suitable methods to form a silver metal film on the first adhesive layer 110A, but the present invention is not limited thereto. In some embodiments, the wet plating method includes first plating the metal substrate 100 to form the first adhesive layer 110A, and then plating silver on the first adhesive layer 110A to form the reflective layer 120. In another embodiment, the wet electroplating method may also include first performing an anodic oxidation treatment on the aluminum metal substrate 100 to form a first adhesive layer 110A made of aluminum oxide, and then electroplating silver on the first adhesive layer 110A to form a reflective layer 120, but the present invention is not limited thereto.

The protective layer 130 can be, for example, a metal coating material, which can protect the reflective layer 120 from oxidation or scratches by external forces, and can also improve the thermal conductivity of the joined electronic components. The protective layer 130 includes, for example, suitable materials such as TiO ₂ , SiO ₂ , and Al ₂ O ₃ , but the present invention is not limited thereto. The coating structure of the protective layer 130 can be a single layer or a multi-layer structure, and the multi-layer structure can be a structure of the same material or different materials, but the present invention is not limited thereto.

It is worth mentioning that in this embodiment, since the metal substrate 100 has a concave and convex surface 101A, the surface 111 of the first adhesive layer 110A, the surface 121 of the reflective layer 120, and the surface 131 of the protective layer 130 all follow the concave and convex shape of the surface 101A. It can also be understood that the concave and convex shape of the surface 101A can be transmitted to the surface 111, the surface 121, and the surface 131, so that the above surfaces are substantially conformally arranged, and the surface 131 also has a concave portion CA and a convex portion CX corresponding to the surface 101A (as shown in Figures 1A and 1B).

Through the above configuration, the package substrate 10A has a concave-convex pattern or shape on the surface where the electronic components are placed (e.g., the surface 131 on the Z side in FIG. 1A ). When applied to components or devices that need to expand the electromagnetic wave emission angle, expand the light emission angle of the light-emitting component, or expand the signal coverage range, it can be beneficial to diffuse reflection of the beam to achieve the desired effect. The high thermal conductivity of the metal substrate 100 is also beneficial to the heat dissipation of the electronic components. When applied to high-power electronic components, it helps to maintain the stability and performance of the device and increase the service life of the product.

The following will list some other embodiments to illustrate the new invention in detail, in which the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the above embodiments, and no further description will be given below.

In some embodiments, the package substrate may be further provided with other film layers. For example, FIG. 2 is a schematic diagram of a package substrate of an embodiment of the present invention. In the embodiment of the package substrate 10B of FIG. 2, a second adhesive layer 110B is further included, which is disposed between the protective layer 130 and the reflective layer 120. The second adhesive layer 110B may be an electroplated layer, for example, the aforementioned wet electroplating method or evaporation method, sputtering method, ion beam assisted deposition (IAD), pulse laser deposition or other suitable methods may be included to arrange the second adhesive layer 110B on the reflective layer 120. This can be used to increase the adhesion and reliability between the protective layer 130 and the reflective layer 120, so that the protective layer 130 can fully protect the reflective layer 120 from oxidation or scratches.

Similarly, the second adhesive layer 110B is away from the surface 111B of the metal substrate 100, and can also be arranged along the surface 111A of the first adhesive layer 110A, the surface 121 of the reflective layer 120, and the surface 131 of the protective layer 130, which means that the above surfaces can be substantially conformally arranged with each other. The material of the second adhesive layer 110B is, for example, Ti, Ni, Cr or a composite layer composed of the above materials, but the present invention is not limited thereto.

FIG3A is a schematic diagram of a package substrate of an embodiment of the present invention. Referring to FIG3A , a package substrate 10C is similar to the package substrate 10B of FIG2 , except that the package substrate 10C may further include a circuit board 140 disposed on the protective layer 130, a pad 141 disposed on the circuit board 140 for electrically connecting electronic components, and a third adhesive layer 110C for bonding the circuit board 140 to the protective layer 130. The circuit board 140 may be, for example, a printed circuit board (PCB), a metal core printed circuit board (MCPCB), a flexible printed circuit board (flexible PCB), or other suitable types of circuit boards. The pad 141 can be a suitable conductive material (such as aluminum, silver, copper, etc.) and is suitable for wire bonding packaging. For example, the circuit board 140 can be electrically connected to the required electronic components using the pad 141 and the wire L. The material of the third adhesive layer 110C includes optical clear adhesive (OCA), pressure sensitive adhesive (PSA), thermosetting adhesive (such as epoxy resin), silicone adhesive, polyurethane reactive (PUR) glue, polyurethane (PU) glue, or other suitable adhesive materials. The material of the wire L can be copper, aluminum or gold, but the present invention is not limited thereto.

It is worth mentioning that the surface 111C of the third adhesive layer 110C in contact with the circuit board 140 can be attached to the circuit board 140 and substantially present a plane, which is conducive to ensuring the reliability of the connection of the circuit board 140. In other words, the concave and convex shapes of the surface 101A, the surface 111A, the surface 121, the surface 111B, and the surface 131 can not be transmitted to the surface 111C.

FIG3B is a schematic diagram of the manufacturing process of the package substrate of the embodiment of FIG3A. Referring to FIG3B, the manufacturing process of the package substrate 10C can be to first manufacture the circuit board 140 and the package substrate 10A or the package substrate 10B separately, and then use the third adhesive layer 110C to combine the circuit board 140 and the package substrate 10B. The third adhesive layer 110C can be first arranged on the side of the circuit board 140 facing the package substrate 10B, and then bonded to the package substrate 10B. Or the third adhesive layer 110C is first arranged on the protective layer 130 of the package substrate 10B, and then bonded to the circuit board 140, and the present invention is not limited to this.

FIG4 is a schematic diagram of a light-emitting module of an embodiment of the present invention. Referring to FIG4, in each embodiment of the present invention, the packaging substrate can be applied to a carrier of various packaging components. For example, the light-emitting module 20A of FIG4 may include the aforementioned packaging substrate 10C and the light-emitting element 150 disposed thereon. It is worth mentioning that FIG4 is an exemplary illustration of the packaging substrate 10C carrying a plurality of light-emitting elements 150, but the present invention is not limited thereto. In other embodiments, the packaging substrate in the light-emitting module 20A may not include the second adhesive layer 110B. On the other hand, the number of light-emitting elements 150 may be multiple, and they are arranged in an array on a plane formed by the direction X and the direction Y, and then attached to the protective layer 130 by a thermal conductive adhesive layer 160. In some embodiments, the thermal conductive adhesive layer 160 and the light emitting element 150 may be in direct contact without other film layers, but the present invention is not limited thereto. In FIG. 4 , the number of thermal conductive adhesive layers 160 may be multiple and they may be arranged corresponding to the light emitting elements 150, but the present invention is not limited thereto. In other embodiments, the thermal conductive adhesive layer 160 may be arranged on the protective layer 130 in its entirety, and the multiple light emitting elements 150 may be transferred to the packaging substrate 10C using surface-mount technology (SMT) or die bonder equipment.

In this embodiment, the light emitting element 150 includes a light emitting diode (LED), a micro-LED, a sub-millimeter light emitting diode (mini-LED), and a quantum dot light emitting diode (quantum dot). In addition, in the projection direction of the light emitting module 20A (e.g., direction Z in FIG. 4 ), the light emitting element 150 is disposed so as not to overlap the circuit board 140. In addition, the light emitting element 150 can utilize the pad 141 and a plurality of wires L to electrically connect a plurality of light emitting elements 150 and the pad 141 of the circuit board 140 to each other by wire bonding packaging.

On the other hand, the thermally conductive adhesive layer 160 includes solder paste, silver glue, copper glue or other suitable materials, but the present invention is not limited thereto. In some embodiments, the material of the thermally conductive adhesive layer 160 also includes a non-metallic conductive thermally conductive adhesive. The non-metallic conductive thermally conductive adhesive is, for example, an adhesive layer including conductive particles. For example, the conductive particles may be silver-plated copper ball particles or silver-plated plastic particles, but the present invention is not limited thereto. The thermally conductive adhesive layer 160 can provide a good bonding force between the light-emitting element 150 and the protective layer 130 to fix the light-emitting element 150 to the packaging substrate 10C.

It is worth mentioning that the contact surface 160S between the thermally conductive adhesive layer 160 and the light-emitting element 150 can be substantially flat. In other words, the concave and convex shapes of the surface 101A, the surface 111A, the surface 121, the surface 111B, and the surface 131 can not be transmitted to the contact surface 160S. This ensures that the flat contact surface 160S can effectively fit each light-emitting element 150, and increases the adhesion reliability between the light-emitting element 150 and the packaging substrate 10C.

On the other hand, although not shown, the light-emitting module 20A may also include other packaging layers in its light-emitting direction (e.g., direction Z). The material of the packaging layer may be, for example, optically transparent glue or other optical grade glue to package the wire L, the light-emitting element 150, the pad 141, and other possible electronic components on the circuit board 140 (e.g., capacitors, diodes, or switch components, etc.), but the present invention is not limited thereto.

FIG5 is a schematic diagram of a light-emitting module of an embodiment of the present invention. Referring to FIG5 , the light-emitting module 20B is similar to the light-emitting module 20A of FIG4 , and the difference is that the light-emitting module 20B further includes a light-shielding layer 170 and an optical conversion layer 180, so as to utilize the optical conversion layer 180 to encapsulate multiple light-emitting elements 150.

Specifically, the light shielding layer 170 can be directly disposed on the circuit board 140, and together with the circuit board 140, form a space SP, and a plurality of light-emitting elements 150 can be further disposed in the space SP. In addition, the optical conversion layer 180 can be filled in the space SP to cover the plurality of light-emitting elements 150, the wire L, the pad 141, and part of the circuit board 140. Therefore, the space SP can also be defined as the light-emitting area of the light-emitting module 20B.

In some embodiments, the light shielding layer 170 may be a light absorbing material doped with carbon black to form a frame, or a barrier material composed of a light-colored or white polymer (white bank), and is arranged around a plurality of light emitting elements 150 in directions X and Y, but the present invention is not limited thereto. The light emitting element 150 may be a blue light or ultraviolet light emitting diode, and the optical conversion layer 180 may have a wavelength conversion material that converts blue light or ultraviolet light into other desired color light (e.g., green light, yellow light, or red light) or non-visible light bands (e.g., infrared light), but the present invention is not limited thereto. In some embodiments, the optical conversion layer 180 can be a packaging substrate such as a packaging resin or epoxy resin, doped with a known wavelength conversion material (such as a fluorescent powder material, a filter layer material, or a quantum dot structure), but the present invention is not limited to this.

FIG6A and FIG6B are schematic diagrams of the principle of the light-emitting module of the embodiment of the present invention. FIG6A is a schematic diagram of a flat reflective layer 200 reflecting a lateral light beam of the light-emitting element 150 in the related art, and FIG6B is a schematic diagram of a reflective layer 120 of the present invention reflecting a lateral light beam of the light-emitting element 150. For the convenience of explanation, FIG6B only schematically depicts the protective layer 130, the second adhesive layer 110B and the reflective layer 120, and omits the drawing of other components. Please refer to FIG6A first. Since the general reflective layer 200 is relatively flat, when the illumination light beam IB of the light-emitting element 150 irradiates the reflective layer 200, mirror reflection will mostly be generated. Therefore, when the side-emitting illumination beam IB is reflected by the reflective layer 200, the reflection angle with the reflective layer 200 is usually larger, so that the illumination beam IB is easily transmitted to other adjacent light-emitting elements 150 and absorbed or blocked, thereby reducing the overall light-emitting efficiency of multiple light-emitting elements 150.

Referring to FIG. 6B , on the other hand, due to the concave-convex surface of the reflective layer 120, the illumination beam IB emitted from the light-emitting element 150 is easily diffusely reflected after being sequentially irradiated to the protective layer 130, the second adhesive layer 110B and the reflective layer 120 at the same angle. In addition to the reflected light having a larger viewing angle (as shown in the cone shape in the figure), it is also less likely to be blocked by other adjacent light-emitting elements 150. Therefore, when LED packaging is arranged in a high density, the light-emitting module using each packaging substrate of the present invention can effectively improve the light output efficiency of the light beam and improve the utilization rate of light energy.

In summary, the packaging substrate and light-emitting module of this novel invention not only utilize the high thermal conductivity of the metal substrate to effectively dissipate heat, but also add microstructures on the metal substrate and coat a reflective layer with high reflectivity on it. The microstructure with a concave and convex surface allows the surface of the reflective layer to fluctuate along with the concave and convex surface. Therefore, even if the spacing of LEDs becomes smaller due to the high-density packaging of LEDs, the side light of the LED is easily diffused when it irradiates the surface of the reflective layer, resulting in a larger light angle after the light of the LED is reflected by the reflective layer, and the light beam is less likely to be blocked or absorbed by nearby LEDs to affect the light output efficiency, resulting in improved light output efficiency, effectively improving the brightness of the light-emitting module, and also improving the light energy utilization rate of the light-emitting element.

However, the above is only the preferred embodiment of the present invention, and it cannot be used to limit the scope of the implementation of the present invention. That is, all simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the description of the present invention are still within the scope of the patent of the present invention. In addition, any embodiment or patent application of the present invention does not need to achieve all the purposes, advantages or features disclosed by the present invention. In addition, the abstract and title are only used to assist in searching for patent documents, and are not used to limit the scope of rights of the present invention. In addition, the terms "first" and "second" mentioned in this specification or patent application are only used to name the element or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

10A:Packaging substrate

100:Metal substrate

101: Microstructure layer

101A,111,121,131: Surface

110A: First adhesive layer

120: Reflective layer

130: Protective layer

CA: Concave

CX: convex part

X, Y, Z: direction

Claims (12)

A packaging substrate comprises: a metal substrate having a microstructure layer with a concave-convex surface; a first adhesive layer disposed on the microstructure layer; a reflective layer disposed on the first adhesive layer; and a protective layer disposed on the reflective layer, wherein the surface of the first adhesive layer, the surface of the reflective layer and the surface of the protective layer all fluctuate along the concave-convex surface of the microstructure layer. A packaging substrate as described in claim 1, wherein the material of the metal substrate includes aluminum. A packaging substrate as described in claim 1, wherein the material of the reflective layer includes silver. The packaging substrate as described in claim 1 further includes a second adhesive layer disposed between the protective layer and the reflective layer. The package substrate as described in claim 1 further comprises: a circuit board disposed on the protective layer; and a third adhesive layer disposed between the protective layer and the circuit board, wherein the circuit board also has a pad suitable for being electrically connected to an electronic component by wire bonding. A light-emitting module includes: a packaging substrate and a light-emitting element, wherein the packaging substrate includes: a metal substrate having a microstructure layer with a concave-convex surface; a first adhesive layer disposed on the microstructure layer; a reflective layer disposed on the first adhesive layer; and a protective layer disposed on the reflective layer; wherein the surface of the first adhesive layer, the surface of the reflective layer and the surface of the protective layer all fluctuate along the concave-convex surface of the microstructure layer, wherein a heat-conductive adhesive layer disposed on the protective layer is further included between the light-emitting element and the packaging substrate. The light-emitting module as described in claim 6, wherein the material of the metal substrate includes aluminum. The light-emitting module as described in claim 6, wherein the material of the reflective layer includes silver. The light-emitting module as described in claim 6 further includes a second adhesive layer disposed between the protective layer and the reflective layer. As described in claim 6, the light-emitting module, wherein the light-emitting element and the thermally conductive adhesive layer are in direct contact and have a contact surface, and the contact surface is substantially flat. The light-emitting module as described in claim 6 further comprises: a circuit board disposed on the protective layer, and in the projection direction of the light-emitting module, the circuit board does not overlap the light-emitting element; and a third adhesive layer disposed between the protective layer and the circuit board, wherein the circuit board also has a pad, and the light-emitting element is electrically connected to the pad by wire bonding. The light-emitting module as described in claim 11 further comprises: A light-shielding layer disposed on the circuit board, wherein the circuit board and the light-shielding layer together form a space, and the light-emitting element is disposed in the space; and an optical conversion layer filled in the space and further covering the light-emitting element.

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