TWM655211U - Solar cell packaging structure - Google Patents

Abstract

A solar cell packaging structure includes: a lower cover plate, a lower conductive layer, a photovoltaic layer, an upper conductive layer, at least one electrode wire, a packaging layer, an upper cover plate and a filling layer. A lower conductive layer, a photovoltaic layer, an upper conductive layer, an electrode wire, a packaging layer, an upper cover plate and a filling layer are sequentially arranged on one side of the lower cover plate. The upper cover plate does not completely correspond to the lower cover plate, so that a portion of the lower cover plate is left exposed, so that an exposed area is formed between the upper cover plate and the lower cover plate, and the partially exposed electrode wire is attached to the lower cover plate outside the packaging area, so that the upper cover plate does not cover the wire ends exposed outside the packaging area. The filling layer is arranged in the packaging area.

Description

Solar cell packaging structure

This work is about a solar cell, and in particular a thin-film solar cell packaging structure.

Solar cells are devices that directly convert solar energy into electrical energy. They have broad application prospects in environmental protection, energy conservation and renewable energy. Among them, thin-film photovoltaic elements are a newer solar cell technology with advantages such as light weight, thinness, and low production cost. Therefore, they are widely used in building integration, portable power supplies, solar bicycles and other scenarios.

However, if the solar cell component is a glass component, both sides of the component are glass substrates, and the electrode wires are mostly led out from the side of the component, which limits the product's appearance and structural design. If the electrode wires are too long, the effective surface space will be wasted. Referring to known technologies such as Chinese mainland public patent No. CN102856413A, a hole is directly opened on one surface of the glass surface to lead out the electrode wires. The opening of the electrode wire of the glass panel opening is inside the glass surface and is directly led out from the panel, which can fully and effectively utilize the panel structure. However, such structures are only applicable to adhesive structures encapsulated with polymers or plastics, and the water and gas barrier effects are limited, and the component sealing performance is poor.

Therefore, the main purpose of this invention is to provide a solar cell packaging structure, which can be used to package photovoltaic cells using laser technology, and the upper cover plate and the lower cover plate of the structure do not completely correspond to each other, and the lower cover plate is partially exposed, so that the electrode wire can be attached to the substrate and exposed outside the packaging area, and the sealing of the packaging structure can be maintained. Therefore, the process is simple, the packaging structure is more stable, and the product life can be increased.

To achieve the above-mentioned purpose, the invention provides a solar cell packaging structure, comprising: a lower cover plate, a lower conductive layer, a photovoltaic layer, an upper conductive layer, at least one electrode wire, a packaging layer, an upper cover plate and a filling layer. The lower conductive layer is arranged on one side of the lower cover plate, and the lower conductive layer is composed of a plurality of lower electrode circuits. The photovoltaic layer is composed of a plurality of photovoltaic units, and the photovoltaic units are arranged on the lower electrode circuits so that a gap is formed between each of the photovoltaic units. The upper conductive layer is composed of a plurality of upper electrode circuits, and the upper electrode circuits are arranged on one side of the photovoltaic units and are electrically connected to the lower electrode circuits. The electrode wires are electrically connected to the lower conductive layer or the upper conductive layer, and each of the electrode wires has a wire end. The packaging layer is arranged on the periphery of the lower cover plate and the electrode wires, so that the wire ends of the electrode wires are exposed. The upper cover plate is arranged on the packaging layer, and the upper cover plate does not completely correspond to the lower cover plate, so that a part of the lower cover plate is retained to be exposed, so that an exposed area is formed between the upper cover plate and the lower cover plate, and the wire ends of the electrode wires are attached to the lower cover plate and exposed outside the packaging area, so that the upper cover plate does not cover the wire ends exposed outside the packaging area. The filling layer is arranged in the packaging area.

In one embodiment of the present invention, the wire ends of the electrode wires are exposed outside the packaging area in the packaging layer as semicircular notches.

In one embodiment of the present invention, one end of the upper cover plate has a semicircular end edge notch corresponding to the semicircular notch.

In one embodiment of the present invention, the upper cover plate and the lower cover plate are glass substrates or plastics.

In one embodiment of the present invention, the plastic is polyimide, a mixture of polyimide and inorganic materials, polyethylene terephthalate, polyether sulfone, polyethylene naphthalate or cycloolefin polymer.

In one embodiment of the present invention, the upper conductive layer and the lower conductive layer are inorganic conductive materials.

In one embodiment of the present invention, the inorganic conductive material of the upper conductive layer is aluminum or silver.

In one embodiment of the present invention, the inorganic conductive material of the lower conductive layer is indium tin oxide or silver paste.

In one embodiment of the present invention, the thickness of the photovoltaic layer is 0.1 μm~500 μm.

In one embodiment of the present invention, the thickness of the photovoltaic layer is 10 μm~150 μm.

In one embodiment of the present invention, the photovoltaic layer is an organic solar cell, a copper indium gallium selenide thin film solar cell, a cadmium tin film solar cell, a silicon thin film solar cell, a calcium titanium thin film solar cell or a dye-sensitized solar cell.

In one embodiment of the present invention, the photovoltaic units are sequentially stacked by an electron transfer layer, an active layer and a hole transfer layer.

In one embodiment of the present invention, the photovoltaic cells are sequentially stacked by a hole transfer layer, an active layer and an electron transfer layer.

In the solar cell packaging structure described in one embodiment of the present invention, the electrode conductor is copper foil, copper wire or silver glue.

In one embodiment of the present invention, the filling layer is a transparent filling material.

In one embodiment of the present invention, the transparent filler is polyolefin elastomer, polymer, ethylene vinyl acetate or polyvinyl butyral.

In one embodiment of the present invention, the thickness of the packaging layer is 10μm~1000μm.

In one embodiment of the present invention, the packaging layer is glass glue, polyurethane, ethylene vinyl acetate, polyvinyl butyral or polyimide.

In one embodiment of the present invention, the packaging layer is disposed at the periphery of the photovoltaic layer and is not directly adjacent to the photovoltaic layer, and maintains a gap of at least 2 mm with the photovoltaic layer.

The technical content and detailed description of this creation are as follows with diagrams:

Please refer to Figures 1 and 2, which are schematic side cross-sectional views of a semi-finished solar cell packaging structure of the first embodiment of the present invention and a partially enlarged schematic view of the solar cell packaging structure of Figure 1. As shown in the figures: the solar cell packaging structure of the present invention at least includes: a lower cover plate 10, a lower conductive layer 20, a photovoltaic layer 30, an upper conductive layer 40 and an electrode wire 50.

When the solar cell packaging structure is manufactured, a lower cover plate 10 is prepared first. The lower cover plate 10 is a glass substrate or plastic. The plastic is polyimide (PI), hybrid PI, polyethylene terephthalate (PET), polyethers Ulfone (PES), polyethylene naphthalate (PEN) or cycloolefin polymer (COP). In this invention, the lower cover plate 10 is selected as but not limited to a glass substrate.

Next, a lower conductive layer 20 is formed on one side of the lower cover plate 10. The lower conductive layer 20 can be formed into a plurality of transparent lower electrode lines 21 by etching technology containing inorganic conductive materials. In this figure, the inorganic conductive material is indium tin oxide (ITO) or silver paste. This invention selects but is not limited to indium tin oxide ITO.

Next, a photovoltaic layer 30 is fabricated on one side of the lower conductive layer 20. The photovoltaic layer 30 is composed of a plurality of photovoltaic units 31. The photovoltaic units 31 are disposed on one side of the lower electrode lines 21 so that there is a gap 32 between the photovoltaic units 31. The photovoltaic units 31 are sequentially composed of a stacked structure of an electron transfer layer 31a, an active layer 31b, and a hole transfer layer 31c, or sequentially composed of a stacked structure of a hole transfer layer 31c, an active layer 31b, and an electron transfer layer 31a. The photovoltaic layer 30 is an organic solar cell, a copper indium gallium selenide (CIGS) thin film solar cell, a cadmium dTe thin film solar cell, a silicon (α-Si) thin film solar cell, a perovskite thin film solar cell or a dye-sensitized solar cell (DSSC). In this figure, the thickness of the photovoltaic layer 30 is 0.1 μm to 500 μm. The thickness of the photovoltaic layer 30 is 10 μm to 150 μm.

Next, an upper conductive layer 40 is formed on one side of the photovoltaic cells 31 and electrically connected to the lower conductive layer 20. The upper conductive layer 40 can be formed by evaporating, sputtering or coating an inorganic conductive material and then etching to form a plurality of transparent upper electrode lines 41. In this figure, the inorganic conductive material is aluminum or silver.

Finally, the electrode wire 50 is manufactured. The electrode wire 50 is a copper foil, a copper wire or a silver paste and is printed and disposed on one side of the lower cover plate 10, and is electrically connected to the lower conductive layer 20 or the upper conductive layer 40. In this way, a semi-finished solar cell packaging structure is completed. The semi-finished solar cell packaging structure is electrically connected to the electrode wire 50 to complete the manufacturing of the solar cell packaging structure.

Please refer to Figures 3 and 4, which are a side cross-sectional view of a semi-finished solar cell packaging structure of Figure 1 with a packaging layer and an upper cover plate sealed thereon, and a top view schematic diagram of Figure 3. As shown in the figure: Then the semi-finished solar cell packaging structure component is coated with polyimide (PIB) of the packaging layer 70, and the packaging coating is coated on the periphery of the lower cover plate 10 and the two-electrode wire 50 by a glue dispenser, so that the two-wire ends 51 of the two-electrode wire 50 are exposed, and the packaging layer 70 is arranged around the photovoltaic layer 30 without being directly adjacent to the photovoltaic layer 30, and a gap of at least 2 mm is maintained with the photovoltaic layer 30.

Next, a filling layer 80 of a transparent material such as polyolefin elastomer (POE) is coated in the packaging area 71 in the packaging layer. The filling layer 80 is in the packaging area and then aligned with the upper cover plate 60 and fixed with a clamp. The wire ends 51 of the electrode wires 50 corresponding to the upper cover plate 60 are exposed and uncovered, so there is an exposed area 61 with a hollow area, or the upper cover plate 60 and the lower cover plate 10 are not completely corresponding or asymmetrical, so that a part of the lower cover plate 10 is retained and exposed, so that the wire ends 51 of the electrode wires 50 can be attached to the lower cover plate 10 and exposed outside the packaging area 71.

Then, it is placed in a vacuum heating packaging furnace for packaging. The packaging furnace is first evacuated to make the air pressure in the chamber lower than 10 ^-3 torr, and then heated. The heating temperature can be controlled at 100~150℃, which will not damage the photovoltaic layer material. The sealing is continued for about 30 minutes, and then the packaging furnace is returned to room temperature. After breaking the vacuum, the finished packaged photovoltaic element is taken out. In this figure, the thickness of the packaging layer 70 can be 10μm~1000μm. In this figure, the packaging layer 70 is glass glue, polyurethane (Polyurethane, PU), ethylene-vinyl acetate (Ethylene Vinyl Acetate, EVA), polyvinyl butyral (Polyvinyl Butyral, PVB) or polyimide (Polyisobutylene, PIB). In this figure, the filling layer 80 is a transparent filling material, and the transparent filling material is polyolefin elastomer (POE), ionomer, ethylene vinyl acetate (EVA) or polyvinyl butyral (PVB).

Alternatively, the semi-finished product covered with the upper cover plate 60 is fixed by a clamp after alignment, and then placed in a vacuum packaging furnace for packaging. The packaging furnace is first evacuated to make the air pressure in the chamber lower than 10 ^-3 torr, and then the packaging layer is laser-heated externally to solidify the packaging layer 70 to connect the upper cover plate 60 and the lower cover plate 10, and the air is evacuated at the same time without damaging the material of the photovoltaic layer 30. After packaging, the vacuum is broken and the finished packaged photovoltaic element is taken out. In this figure, the upper cover plate 60 is a glass substrate or plastic. The plastic is polyimide (PI), hybrid PI, polyethylene terephthalate (PET), polyethers ulfone (PES), polyethylene naphthalate (PEN) or cycloolefin polymer (COP).

Please refer to Figures 5 and 6, which are the side cross-sectional views of the semi-finished solar cell of the second embodiment of the present invention and the top view schematic diagram of Figure 5. As shown in the figure: This embodiment is substantially the same as the first embodiment of Figures 1 to 4, except that the packaging coating is applied to the periphery of the lower cover plate 10 by a glue dispenser and the semicircular notch 72 for exposing the second wire ends 51 of the second electrode wires 50, and the upper cover plate 60 has a semicircular end edge notch 62 on the end edge corresponding to the semicircular notch 72 for exposing the second wire ends 51.

In summary, the solar cell packaging structure of the present invention changes the electrode wire 50 to be output from one side of the upper cover plate 60 and the lower cover plate 10, making full use of the space in the non-photovoltaic area of the packaging area 71, which can be beneficial to the structural configuration application requirements of the corresponding circuit board. In addition, the filling layer 80 is arranged in the packaging area 71 to strengthen the structural stress in the packaging area 71, and also has the effect of blocking water and air, and the selection of materials for the packaging glue can be more diversified. The present invention structure provides many effects such as structural safety, reliability, durability and good weather resistance.

However, the above is only the preferred embodiment of the present invention and is not intended to limit the scope of patent protection of the present invention. Therefore, any equivalent changes made by using the instructions or diagrams of the present invention are also included in the scope of patent protection of the present invention and are hereby stated.

10: Lower cover plate 20: Lower conductive layer 21: Lower electrode circuit 30: Photovoltaic layer 31: Photovoltaic unit 31a: Electron transfer layer 31b: Active layer 31c: Hole transfer layer 32: Gap 40: Upper conductive layer 41: Upper electrode circuit 50: Electrode wire 51: Wire end 60: Upper cover plate 61: Exposed area 62: Semicircular end notch 70: Packaging layer 71: Packaging area 72: Semicircular notch 80: Filling layer

FIG1 is a schematic side cross-sectional view of a semi-finished solar cell packaging structure of the first embodiment of the present invention;

FIG. 2 is a partial enlarged schematic diagram of the solar cell packaging structure of FIG. 1 ;

FIG3 is a schematic side cross-sectional view of the semi-finished solar cell packaging structure of FIG1 with a packaging layer and an upper cover plate sealed thereon;

FIG4 is a schematic top view of FIG3 ;

FIG. 5 is a schematic side cross-sectional view of a semi-finished solar cell packaging structure of the second embodiment of the present invention;

FIG. 6 is a schematic top view of FIG. 5 .

10: Lower cover

20: Lower conductive layer

21: Lower electrode circuit

30: Photovoltaic layer

31: Photovoltaic unit

32: Gap

40: Upper conductive layer

41: Upper electrode circuit

50: Electrode wire

51: Wire end

60: Upper cover plate

61: Exposure area

71: Packaging area

80: Filling layer

Claims (19)

A solar cell packaging structure comprises: A lower cover plate; A lower conductive layer, which is arranged on one side of the lower cover plate, and the lower conductive layer is composed of a plurality of lower electrode circuits; A photovoltaic layer, which is composed of a plurality of photovoltaic units, and the photovoltaic units are arranged on the lower electrode circuits, so that a gap is formed between each of the photovoltaic units; An upper conductive layer, which is composed of a plurality of upper electrode circuits, and the upper electrode circuits are arranged on one side of the photovoltaic units and electrically connected to the lower electrode circuits; At least one electrode wire is electrically connected to the lower conductive layer or the upper conductive layer, and each of the electrode wires has a wire end; A packaging layer is provided around the lower cover plate and on the electrode wires, so that the wire ends of the electrode wires are exposed; An upper cover plate is provided on the packaging layer, and the upper cover plate does not completely correspond to the lower cover plate, so that a part of the lower cover plate is left exposed, so that an exposed area is formed between the upper cover plate and the lower cover plate, and the wire ends of the electrode wires are attached to the lower cover plate and exposed outside the packaging area, so that the upper cover plate does not cover the wire ends exposed outside the packaging area; A filling layer is provided in the packaging area. The solar cell packaging structure as described in claim 1, wherein the wire ends of the electrode wires are exposed outside the packaging area in the packaging layer as semicircular notches. A solar cell packaging structure as described in claim 2, wherein one end of the upper cover plate has a semicircular end notch corresponding to the semicircular notch. The solar cell packaging structure as described in claim 1, wherein the upper cover plate and the lower cover plate are glass substrates or plastic. A solar cell packaging structure as described in claim 4, wherein the plastic is polyimide, a mixture of polyimide and inorganic, polyethylene terephthalate, polyether sulfone, polyethylene naphthalate or cycloolefin polymer. The solar cell packaging structure as described in claim 1, wherein the upper conductive layer and the lower conductive layer are inorganic conductive materials. The solar cell packaging structure as described in claim 6, wherein the inorganic conductive material of the upper conductive layer is aluminum or silver. The solar cell packaging structure as described in claim 6, wherein the inorganic conductive material of the lower conductive layer is indium tin oxide or silver gel. The solar cell packaging structure as described in claim 1, wherein the thickness of the photovoltaic layer is 0.1μm~500μm. The solar cell packaging structure as described in claim 9, wherein the thickness of the photovoltaic layer is 10μm~150μm. The solar cell packaging structure as described in claim 1, wherein the photovoltaic layer is an organic solar cell, a copper indium gallium selenide thin film solar cell, a cadmium tin film solar cell, a silicon thin film solar cell, a calcium titanium thin film solar cell or a dye-sensitized solar cell. The solar cell packaging structure as described in claim 1, wherein the photovoltaic units are sequentially stacked by an electron transfer layer, an active layer and a hole transfer layer. The solar cell packaging structure as described in claim 1, wherein the photovoltaic units are sequentially stacked by a hole transfer layer, an active layer and an electron transfer layer. A solar cell packaging structure as described in claim 1, wherein the electrode conductor is copper foil, copper wire or silver glue. The solar cell packaging structure as described in claim 1, wherein the filling layer is a transparent filling material. A solar cell packaging structure as described in claim 15, wherein the transparent filler is polyolefin elastomer, polymer, ethylene vinyl acetate or polyvinyl butyral. The solar cell packaging structure as described in claim 1, wherein the packaging layer has a thickness of 10 μm to 1000 μm. The solar cell packaging structure as described in claim 1, wherein the packaging layer is glass glue, polyurethane, ethylene-vinyl acetate, polyvinyl butyral or polyimide. The solar cell packaging structure as described in claim 1, wherein the packaging layer is arranged at the periphery of the photovoltaic layer without being directly adjacent to the photovoltaic layer, and maintains a gap of at least 2 mm with the photovoltaic layer.