TWM650750U - An immersion liquid cooling and heat dissipating electronic device with computing power - Google Patents

Abstract

An immersion liquid cooling and heat dissipating electronic device with computing power comprises a sealed case, a circuit motherboard and a three dimensional vapor chamber with two phase flow circulation. The sealed case has a heat exchange cavity, a liquid inlet and a liquid outlet, wherein the liquid inlet and the liquid outlet are threaded with the heat exchange cavity respectively. The circuit motherboard is arranged in the heat exchange cavity and comprises a first heat source and a second heat source. The three dimensional vapor chamber with two phase flow circulation is arranged on the circuit motherboard to be contacted with the first heat source. Wherein, a non-conductive cooling liquid can be filled in the heat exchange cavity and the circuit motherboard, the three dimensional vapor chamber with two phase flow circulation and the second heat source are immersed in the non-conductive cooling liquid. Moreover, the heat flow direction of the three dimensional vapor chamber is perpendicular to the heat flow in the heat exchange cavity.

Description

An electronic device with computing power and immersed liquid cooling

The invention relates to an electronic device, in particular to an immersed liquid-cooled electronic device with computing capabilities.

The current demand for electronic products is increasing day by day. In order to meet consumer needs and respond to the trend of big data, the performance requirements of chips used in big data electronic devices are also getting higher and higher. In particular, the power of a single chip in a server has Up to 500W or 700W, there will even be demand for the design of high-computing chip products with power exceeding 1000W in the future. Generally speaking, the faster the computing speed of a chip, the more powerful its performance, but at the same time, the thermal design power and heat generation of the chip also increase greatly. If the heat of the chip cannot be effectively dissipated, it may cause the chip to overheat, causing the chip to work at a reduced frequency or even burn out.

It is known that liquid cooling technology mainly includes cold plate type liquid cooling technology and immersion type liquid cooling technology. Cold plate liquid cooling is to install a cold plate heat dissipation module on the high-power chip on the circuit motherboard, and then connect the circulating coolant to the water inlet and outlet of the cold plate heat dissipation module. In the cold plate type liquid cooling, the micro-channels in the water-cooling plate are used to exchange heat with the wafer, and then the heated hot water is taken away from the water-cooling plate to achieve the purpose of reducing the temperature of the wafer. However, it is known that the cold plate liquid cooling technology uses micro-channels as heat dissipation. The water-cooled plate liquid cooling module has an upper limit on the heat dissipation power. When the power of a single chip reaches more than 500W, it has already reached an upper limit. It cannot meet the increasing trend of high computing power chips.

Immersion liquid cooling technology immerses the entire circuit motherboard and electronic heating components directly in a non-conductive liquid, and directly conducts the heat energy generated by the operation of the electronic device to the cooling liquid. It is known that immersion liquid cooling technology can be divided into the following two types according to different operating principles. First, the operating method of single-phase immersion liquid cooling technology: immerse the heat source into a thermally conductive dielectric liquid tank. The non-conductive liquid can be synthesized from hydrocarbons with high boiling points and low viscosity. A circulating pump must be installed in the liquid tank to promote fluid circulation in the liquid tank; second, the two-phase immersion liquid cooling technology operates: the heat source is immersed in a low-viscosity, non-conductive coolant, and through the interaction between the coolant and the heat source Direct contact and liquid circulation take away the heat generated by the heat source; at the same time, due to the low-temperature boiling process of the liquid, heat is transferred from the liquid pool to the space outside the pool. Through heat exchange, such as a condenser tube, the vapor is cooled and condensed again and flows back to the cooling liquid pool. , through continuous circulation to achieve the purpose of heat dissipation. However, the coolant (ie fluorocarbon) used in the conventional two-phase immersion liquid cooling system is a man-made harmful chemical substance. During the heat dissipation process of the system, the evaporated fluorocarbon vapor may spread through the air, further causing corrosion and pollution to the human body, the environment, or equipment.

In addition, in addition to the main heat sources such as high-power central processing units (CPUs) and graphics chips (GPUs), the printed circuit boards (PCBs) on conventional electronic components also include passive components, Settings for secondary heat sources such as memory. However, it is known that the heat dissipation devices required by the primary heat source and the secondary heat source are not necessarily the same. When conventional electronic components are used to select and install corresponding heat dissipation devices for the primary heat source and secondary heat source, there will be problems in setting and installing the required number of heat dissipation devices with various heat dissipation efficiencies, which often leads to conventional problems. The installation cost of heat dissipation devices on electronic components has increased, and the installation complexity and time have also increased accordingly.

For the heat energy on the main heat source, the vapor chamber vapor chamber (VC) It is a commonly used structure to solve the problem of heat dissipation of wafers. Generally, VC is in the shape of a flat plate and can be used to solve the problem of two-dimensional heat diffusion. As the power of the wafer becomes larger and larger, the flat-type vapor chamber vapor chamber element cannot meet the heat dissipation needs, and a three-dimensional vapor chamber vapor chamber element structure is produced, so that the heat absorption zone and the condensation zone of the two-phase flow circulation are located respectively. on different planes to increase the three-dimensional heat dissipation function.

Therefore, in order to solve the problems of the conventional technology, it is necessary to improve the heat dissipation device so as to reduce the cost, installation time and complexity of the heat dissipation device required for conventional electronic devices (such as servers) and at the same time develop a heat dissipation device that can target more The cooling system for dissipating heat from high-power and high-power chips has reached a low-cost and high-efficiency heat dissipation device.

In view of this, the present invention provides an immersed liquid-cooled electronic device with computing capabilities to solve the above-mentioned conventional problems.

This invention provides an immersed liquid-cooled electronic device with computing capabilities, including a closed case, a circuit board and a three-dimensional vapor chamber component. The closed housing has a heat exchange cavity, a liquid inlet and a liquid outlet. The liquid inlet and the liquid outlet are respectively connected with the heat exchange cavity, and the electronic device can be placed in a combined cabinet frame. The circuit board is arranged in the closed shell and located in the heat exchange cavity. The circuit board is provided with a first heating element and a plurality of second heating elements. The three-dimensional vapor chamber component is disposed on the circuit board and includes a copper upper cover and a copper lower cover. The copper lower cover has a first area relative to the copper upper cover. The first area has a first lower surface. When the copper The upper plastic cover is joined to the first area of the copper lower cover to form a first two-phase flow circulation sealed air cavity, and the first lower surface of the first area is used to contact the first heating element. Among them, the heat exchange cavity is used to contain a non-conductive coolant, and the liquid inlet and liquid outlet are used respectively. The non-conductive coolant is input and output into the heat exchange cavity, as well as the circuit board, the three-dimensional vapor chamber components and a plurality of second heating elements are immersed in the non-conductive coolant, so that the first two-phase flow circulates the heat flow in the closed air cavity. The direction is perpendicular to the direction of heat flow in the heat exchange cavity to increase the heat exchange rate between the three-dimensional vapor cavity component and the non-conductive coolant.

Among them, a first heat dissipation fin is provided on the copper upper cover.

The copper lower cover also has a second area, the second area has a second lower surface, and the second lower surface of the second area is used to contact the second heating element.

It also includes a two-dimensional vapor chamber element, which is formed in the second area of the copper lower cover and has a lower surface of the vapor chamber, and the lower surface of the vapor chamber is used to contact the second heating element.

Among them, the two-dimensional vapor chamber element includes a flat plate, and relative to the second area of the copper lower cover, the second area has a lower cover cavity. When the flat plate is joined to the second area of the copper lower cover, the lower cover cavity A second two-phase flow circulation closed air cavity is formed.

Wherein, the copper upper cover includes a base plate and a tube body. The base plate has a base plate cavity, an opening and an upper outer surface. The tube body has a tube body cavity. The tube body is located on the upper outer surface and is located above the opening. Protruding outward from the upper outer surface, when the copper upper cover is joined to the first area of the copper lower cover, the tube body cavity and the substrate cavity form a first two-phase flow circulation closed air cavity.

Among them, the tube body is coupled with a first heat dissipation fin, and the closed shell is a closed shell that meets the 1u size specification.

Wherein, the non-conductive coolant is a non-conductive single-phase cooling liquid or a non-conductive two-phase cooling liquid.

Among them, there are a plurality of third heating elements on the circuit board. The circuit board, the three-dimensional vapor chamber element, the two-dimensional vapor chamber element and the plurality of third heating elements are all immersed in the non-conductive cold In the liquid.

The tube body also has a top end, and the top end has an injection port sealing structure. The injection port sealing structure consists of a liquid injection port pre-set at the top, through which a working fluid is injected into the first two phases. It is formed after the flow circulates in the sealed air cavity and seals the liquid injection port.

To sum up, the present invention provides an immersed liquid-cooled electronic device with computing capabilities, which has the following advantages over the conventional technology. First of all, this invention simultaneously sets the three-dimensional vapor chamber element and the non-conductive cooling liquid in the closed shell. When the circuit board is connected, the components inside the three-dimensional vapor chamber element can directly heat the first heating element (the main heat source). Exchange and heat transfer quickly transfer the heat energy from the heat-absorbing end to the condensing end through phase change. Then, the non-conductive cooling liquid in the closed housing can directly conduct heat exchange with the second heating element and the third heating element together. The directions of heat flow circulation between the above two are vertical to increase the heat exchange rate between the three-dimensional vapor chamber component and the non-conductive coolant. When this invention is applied to an electronic device, the two heat dissipation effects can be superimposed at the same time, thus effectively improving the overall heat dissipation efficiency of the electronic device and reducing the complexity of the heat dissipation device to save costs.

1, 2, 3, 4: Immersion liquid-cooled electronic devices with computing capabilities

10, 10': closed shell

101:Heat exchange cavity

102:Liquid inlet

103:Liquid outlet

20:Circuit board

2001:Circuit motherboard

2002:Circuit daughter board

201: The first heating element

202: Second heating element

203: The third heating element

30:Three-dimensional vapor chamber components

301, 301': copper upper cover

3011:The first cooling fin

3012:Second cooling fin

302:Copper lower cover

303: First lower surface

304: The first two-phase flow circulation closed air chamber

305: Second lower surface

306: Two-dimensional vapor chamber component

3061: Lower surface of vapor chamber

3062: Tablet

3063: The second two-phase flow circulation closed air chamber

3064: Lower cover cavity

3065: Lower surface of flat plate

307:Substrate

3071:Substrate cavity

308: Pipe body

3081:Top

3082: Nozzle sealing structure

3083: Capillary structure

3084: Tube body cavity

50: Combined cabinet rack

A:First area

B:Second area

F: Heat flow direction of heat exchange cavity

G: Heat flow direction in the first two-phase flow circulation closed air cavity

FIG. 1 is a schematic diagram of an immersed liquid-cooled electronic device with computing capabilities according to an embodiment of the present invention.

FIG. 2 is a schematic diagram illustrating an immersed liquid-cooled electronic device with computing capabilities installed in a cabinet according to another specific embodiment of the present invention.

FIG. 3 is a schematic diagram of an immersed liquid-cooled electronic device with computing capabilities according to another embodiment of the present invention.

FIG. 4 is an enlarged view of area B according to FIG. 3 .

FIG. 5 is a schematic diagram of an immersed liquid-cooled electronic device with computing capabilities according to another embodiment of the present invention.

FIG. 6 is an enlarged view of area B according to FIG. 5 .

FIG. 7 is a schematic diagram of an immersed liquid-cooled electronic device with computing capabilities according to another embodiment of the present invention.

FIG. 8 is a cross-sectional view of the three-dimensional vapor chamber component according to FIG. 1 .

In order to make the advantages, spirit and characteristics of this invention more easily and clearly understood, specific embodiments will be described and discussed in detail with reference to the attached drawings. It should be noted that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, each element in the figure is only used to express its relative position and is not drawn according to its actual proportion. The step numbers of this creation are only to distinguish different steps, and do not represent the sequence of the steps, which are explained in advance.

Please refer to FIG. 1 , which is a schematic diagram of an immersed liquid-cooled electronic device with computing capabilities according to an embodiment of the present invention. As shown in FIG. 1 , the present invention provides an immersion liquid-cooled electronic device 1 with computing capabilities, including a closed case 10 , a circuit board 20 and a three-dimensional vapor chamber component 30 . Among them, the closed shell 10 has a heat exchange cavity 101, a liquid inlet 102 and a liquid outlet 103. The liquid inlet 102 and the liquid outlet 103 are respectively connected with the heat exchange cavity 101 and the invention has computing capabilities. The electronic device 1 with immersed liquid cooling is placed in a modular cabinet rack. Next, the circuit board 20 is placed in the closed housing 10 and located in the heat exchange cavity 101. The circuit board 20 is provided with a first heating element 201 and a plurality of second heating elements 202. Three-dimensional steaming The air cavity component 30 is disposed on the circuit board 20 and includes a copper upper cover 301 and a copper lower cover 302. The copper lower cover 302 has a first area A relative to the copper upper cover 301. The first area A has a first Lower surface 303, when the copper upper cover 301 is joined to the first area A of the copper lower cover 302, a first two-phase flow circulation closed air cavity 304 is formed, and the first lower surface 303 of the first area A is used to contact the first Heating element 201. Further, the heat exchange cavity 101 is used to accommodate non-conductive cooling liquid, and the liquid inlet 102 and the liquid outlet 103 are used to input and output the non-conductive cooling liquid into the heat exchange cavity 101, as well as the circuit board 20 and the three-dimensional The vapor chamber element 30 and the plurality of second heating elements 202 are immersed in the non-conductive cooling liquid, so that the heat flow direction G in the first two-phase flow closed air chamber and the heat flow direction F of the heat exchange cavity are vertically intersecting. In practice, a non-conductive coolant is a non-conductive single-phase cooling liquid or a non-conductive two-phase cooling liquid. And the horizontal flow arrow in the figure indicates the flow direction of the non-conductive coolant.

Please refer to FIG. 2 . FIG. 2 is a schematic diagram of an immersed liquid-cooled electronic device with computing capabilities installed in a cabinet according to another embodiment of the present invention. As shown in Figure 2, the entire closed housing 10' is installed in layers in the combined cabinet frame 50, and the closed housing 10' is a closed housing that meets the 1u size specification. Please note that the difference between this embodiment and the embodiment of Figure 1 is that the liquid inlet 102 and the liquid outlet 103 on the closed housing 10' are on the same side; the liquid inlet 102 and the liquid outlet 103 of Figure 1 are located on the closed housing. Body 10' front and back. And when the closed housing 10' is installed on the combined cabinet frame 50, the liquid inlet 102 therein is disposed on the same side of the combined cabinet frame 50. Please continue to refer to Figure 2. In this embodiment, the liquid inlets 102 are all located on the right side, and the non-conductive coolant is simultaneously input into the closed housing 10' through the liquid inlets 102 using the parallel connection of the main infusion shafts. , and then after the heat exchange is performed inside the closed housing 10', the non-conductive coolant is uniformly output from the liquid outlet 103 on the left through the liquid outlet 103, and then connected to the infusion main pipe shaft on the other side, and finally flows into the heat exchanger , complete a heat cycle ring.

Please refer to FIG. 3 , which is a schematic diagram of an immersed liquid-cooled electronic device with computing capabilities according to another embodiment of the present invention. As shown in Figure 3, the present invention provides an electronic device 2 with computing capabilities that is immersed in liquid cooling. The copper lower cover 302 also has a second area B, and the electronic device with computing capabilities is immersed in liquid cooling. 2 also includes a two-dimensional vapor chamber element 306. This two-dimensional vapor chamber element 306 is formed in the second area B of the copper lower cover 302 and has a vapor chamber lower surface 3061. The vapor chamber lower surface 3061 is used for to contact the second heating element 202.

Please refer to FIG. 3 and FIG. 4 together. FIG. 4 is an enlarged view of area B according to FIG. 3 . As shown in FIGS. 3 and 4 , the two-dimensional vapor chamber element 306 further includes a flat plate 3062, and relative to the second area B of the copper lower cover 302, the second area B has a lower cover cavity 3064. When the flat plate 3062 is joined to the second area B of the copper lower cover 302, the lower cover cavity 3064 forms a second two-phase flow circulation closed air cavity 3063. In practice, the lower surface 3061 of the vapor chamber contacts the second heating element 202 .

Please refer to FIGS. 5 and 6 . FIG. 5 is a schematic diagram of an immersed liquid-cooled electronic device with computing capabilities according to another embodiment of the present invention. FIG. 6 is an enlarged view of area B according to FIG. 5 . As shown in Figures 5 and 6, the present invention provides a two-dimensional vapor chamber component 306 of an electronic device 3 with computing power that is immersed in liquid cooling and further includes a flat plate 3062. This flat plate 3062 is relative to the copper lower cover 302. The second area B has a lower cover cavity 3064 . When the flat plate 3062 is joined to the second area B of the copper lower cover 302, the lower cover cavity 3064 forms a second two-phase flow circulation closed air cavity 3063, and the lower surface 3065 of the flat plate contacts the second heating element 202.

The above-mentioned flat plate can be adjusted according to design requirements, or only a copper plate can be used to connect the copper lower cover, and the second lower surface of the copper plate corresponding to the second area can be used to contact the second heating element. In addition, the first heat dissipation fin 3011 and the second heat dissipation fin in the above-mentioned FIG. 3 and FIG. 5 The styles of tablet 3012 are different. The first heat dissipation fin 3011 is a metal plate made of copper. The diameter of the metal plate is slightly smaller than the diameter of the pipe body, and is slowly inserted from the top of the pipe body to form a fixed and arranged pattern. The second heat dissipation fins 3012 are stacked by folding the corners of the second heat dissipation fins 3012 through a punching process. The second heat dissipation fins 3012 have gaps in the middle. This gap allows non-conductive coolant to flow through. . Please note that the number of first heat dissipation fins 3011 in Figures 3 and 5 is three, but the number and spacing can be designed according to requirements.

Please refer to FIG. 7 , which is a schematic diagram of an immersed liquid-cooled electronic device with computing capabilities according to another embodiment of the present invention. As shown in FIG. 7 , the circuit board can also electrically connect the circuit daughter board 2002 provided with the first heating element 201 to the circuit motherboard 2001 through slot connection. This arrangement of circuit boards can also be applied to the combined cabinet frame 50 in Figure 2 . In addition, a plurality of third heating elements 203 are provided on the circuit motherboard 2001, so the three-dimensional vapor chamber element 30, the two-dimensional vapor chamber element 306 and the plurality of third heating elements 203 are all immersed in the non-conductive cooling liquid. The heat energy of the third heating element 203 and the three-dimensional vapor chamber element 30 contacting the first heating source 201 and the second heating element 202 is effectively taken away through the non-conductive cooling liquid in the closed housing 10 .

The internal structure of the three-dimensional vapor chamber will be introduced below. Please refer to FIG. 8 , which is a cross-sectional view of the three-dimensional vapor chamber component according to FIG. 1 . As shown in FIG. 8 , the copper upper cover 301 of the three-dimensional vapor chamber component 30 includes a base plate 307 and a tube body 308 . Among them, the substrate 307 has a substrate cavity 3071, an opening and an upper outer surface. The tube body 308 has a tube body cavity 3084. The tube body 308 is disposed on the upper outer surface and is located above the opening and protrudes outward from the upper outer surface. When the copper upper cover 301 is joined to the copper lower cover 302, the tube cavity 3084 and the substrate cavity 3071 form a first two-phase flow circulation closed air cavity 304. Please note that the previous introduction of other forms of electronic devices (i.e., an immersed liquid with computing capabilities) The three-dimensional vapor chamber components 30 of the electronic devices 2, 3, and 4) for cold and heat dissipation are all manufactured in the same process. In reality, the three-dimensional vapor chamber component 30 can also be designed without a substrate 307 structure, and the tube body 308 is directly joined to the copper lower cover 302 to form a three-dimensional vapor chamber component. However, the method is not limited to this and can be based on the design requirements. Make adjustments.

Please continue to refer to Figure 8. The tube body 308 of the three-dimensional vapor chamber element 30 also has a top end 3081. The top end 3081 has a sprue sealing structure 3082. The spout sealing structure 3082 is composed of a liquid spout pre-set at the top. , formed by injecting the working fluid into the first two-phase flow circulation sealed air chamber 304 through the liquid injection port, and finally sealing the liquid injection port. In practice, the working fluid may be one of water, acetone, ammonia, methanol, tetrachloroethane and hydrofluorocarbon chemical refrigerants. When the working fluid is injected into the first two-phase flow closed air chamber 304, the working fluid adheres to the capillary structure 3083 of the three-dimensional vapor chamber element 30. In practice, when the three-dimensional vapor chamber element 30 contacts a heat source, the internal working fluid absorbs heat energy and undergoes a phase change into a gaseous working fluid. It encounters a lower-temperature non-conductive coolant at the top 3081 and transfers the remaining heat energy through heat exchange. Take away. At this time, the gaseous working fluid condenses into a liquid working fluid upon encountering cold. Further, the liquid working fluid flows back to the bottom through the capillary structure 3083 to complete the thermal cycle in the first two-phase flow circulation sealed air chamber.

To sum up, the present invention provides an immersed liquid-cooled electronic device with computing capabilities, which has the following advantages over the conventional technology. First of all, this invention simultaneously sets the three-dimensional vapor chamber element and the non-conductive cooling liquid in the closed shell. When the circuit board is connected, the components inside the three-dimensional vapor chamber element can directly heat the first heating element (the main heat source). Exchange and heat transfer quickly transfer the heat energy from the heat-absorbing end to the condensing end through phase change. Then, the non-conductive cooling liquid in the closed housing can directly conduct heat exchange with the second heating element and the third heating element together. The directions of heat flow circulation between the two above are vertical. When this creation is used on an electronic device, the two The heat dissipation effects can be superimposed at the same time, so the overall heat dissipation efficiency of the electronic device can be effectively improved, and the complexity of the heat dissipation device can also be reduced to save costs.

Through the above detailed description of the preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be more clearly described, but the scope of the present invention is not limited by the above-mentioned preferred embodiments. On the contrary, the purpose is to cover various modifications and equivalent arrangements within the scope of the patent application for this invention. Therefore, the scope of the patentable scope of this invention should be interpreted in the broadest manner according to the above description, so that it covers all possible changes and equivalent arrangements.

1: Immersion liquid-cooled electronic device with computing power

10: Closed shell

101:Heat exchange cavity

102:Liquid inlet

103:Liquid outlet

20:Circuit board

201: The first heating element

202: Second heating element

30:Three-dimensional vapor chamber components

301: Copper upper cover

302:Copper lower cover

303: First lower surface

304: The first two-phase flow circulation closed air chamber

A:First area

F: Heat flow direction of heat exchange cavity

G: Heat flow direction in the first two-phase flow circulation closed air cavity

Claims (10)

An immersed liquid-cooled electronic device with computing capabilities, including: a closed housing with a heat exchange cavity, a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are respectively connected with The heat exchange cavities are interconnected, and the electronic device can be placed in a combined cabinet frame; a circuit board is disposed in the closed housing and located in the heat exchange cavity, and a first circuit board is disposed on the circuit board. A heating element and a plurality of second heating elements; and a three-dimensional vapor chamber element, which is provided on the circuit board and includes a copper upper cover and a copper lower cover, the copper lower cover has a The first area has a first lower surface. When the copper upper cover is joined to the first area of the copper lower cover, a first two-phase flow circulation closed air cavity is formed, and the first The first lower surface of the area is used to contact the first heating element; wherein, the heat exchange cavity is used to contain a non-conductive cooling liquid, and the liquid inlet and the liquid outlet are used to cool the non-conductive liquid respectively. The liquid input and output of the heat exchange cavity, and the circuit board, the three-dimensional vapor chamber element and the plurality of second heating elements are immersed in the non-conductive cooling liquid, so that the first two-phase flow circulates the heat flow in the sealed air cavity The direction is perpendicular to the direction of heat flow in the heat exchange cavity. As described in item 1 of the patent application, the electronic device with computing power is immersed in liquid cooling, wherein the copper upper cover is provided with a first heat dissipation fin. As described in item 1 of the patent application, the electronic device with computing power is immersed in liquid cooling, wherein the copper lower cover further has a second area, the second area has a second lower surface, and the third The second lower surface of the two regions is used to contact the second heating elements. The immersed liquid-cooled electronic device with computing capabilities described in item 3 of the patent application further includes a two-dimensional vapor chamber component formed in the second area of the copper lower cover and has a uniform The lower surface of the temperature plate is used to contact the second heating elements. For example, in the immersion liquid-cooled electronic device with computing power described in item 4 of the patent application, the two-dimensional vapor chamber element includes a flat plate, and the second area is relative to the second area of the copper lower cover. The two areas have a lower cover cavity. When the flat plate is joined to the second area of the copper lower cover, the lower cover cavity forms a second two-phase flow circulation closed air cavity. As described in item 2 of the patent application, the electronic device with computing power is immersed in liquid cooling, wherein the copper upper cover includes a substrate and a tube body, and the substrate has a substrate cavity, an opening and an upper outer cover. surface, the tube body has a tube body cavity, the tube body is located on the upper outer surface and is located above the opening and protrudes outward from the upper outer surface. When the copper upper cover is joined to the copper lower cover In the first region, the tube cavity and the substrate cavity form the first two-phase flow circulation closed air cavity. As described in item 6 of the patent application, the electronic device with computing power is immersed in liquid cooling, wherein the tube body is coupled with the first heat dissipation fin, and the closed case is a closed case that meets the 1u size specification. body. As described in item 1 of the patent application, the electronic device with computing power is immersed in liquid cooling, wherein the non-conductive cooling liquid is a non-conductive single-phase cooling liquid or a non-conductive two-phase cooling liquid. For example, as described in item 4 of the patent application, the electronic device with computing power is immersed in liquid cooling, wherein the circuit board is further provided with a plurality of third heating elements. The circuit board, the three-dimensional vapor chamber element, the two The dimensional vapor chamber element and the third heating elements are all immersed in the non-conductive in the coolant. As described in item 6 of the patent application, the electronic device with computing power is immersed in liquid cooling, wherein the tube body also has a top end, and the top end has a sprue sealing structure, and the sprue sealing structure is made of A liquid injection port is preset at the top, and a working fluid is injected into the first two-phase flow circulation sealed air chamber through the liquid injection port, and the liquid injection port is sealed.

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