TWM650056U - Vehicle control device with multifunctional modules combined - Google Patents

Vehicle control device with multifunctional modules combined Download PDF

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Publication number
TWM650056U
TWM650056U TW112208288U TW112208288U TWM650056U TW M650056 U TWM650056 U TW M650056U TW 112208288 U TW112208288 U TW 112208288U TW 112208288 U TW112208288 U TW 112208288U TW M650056 U TWM650056 U TW M650056U
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Taiwan
Prior art keywords
circuit substrate
electronic component
control device
vehicle control
heat dissipation
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TW112208288U
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Chinese (zh)
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蘇仁濬
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帥群微電子股份有限公司
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Priority to TW112208288U priority Critical patent/TWM650056U/en
Priority to DE202023105539.7U priority patent/DE202023105539U1/en
Priority to JP2023003805U priority patent/JP3244982U/en
Publication of TWM650056U publication Critical patent/TWM650056U/en

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/03Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for supply of electrical power to vehicle subsystems or for
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20872Liquid coolant without phase change
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2240/00Control parameters of input or output; Target parameters
    • B60L2240/10Vehicle control parameters
    • B60L2240/36Temperature of vehicle components or parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/03Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for supply of electrical power to vehicle subsystems or for
    • B60R16/033Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for supply of electrical power to vehicle subsystems or for characterised by the use of electrical cells or batteries

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)

Abstract

本創作揭露一種多功能模組合一車用控制裝置,其包含:一第一電路基板、一充電模組、一馬達驅動模組及一水冷器。第一電路基板的彼此相反的兩側分別定義為第一側及第二側;充電模組包含第一電子元件,第一電子元件設置於第一電路基板的第一側,第一電子元件具有一第一散熱面;馬達驅動模組包含第二電子元件,第二電子元件設置於第一電路基板的第一側,第二電子元件具有一第二散熱面;水冷器設置於第一電路基板的第一側,且水冷器抵靠第一散熱面及第二散熱面,用以對第一電子元件以及第二電子元件進行散熱。其中,充電模組與馬達驅動模組係整合於第一電路基板之該第一側,且共用水冷器進行散熱。The invention discloses a multifunctional module combined with a vehicle control device, which includes: a first circuit substrate, a charging module, a motor drive module and a water cooler. Opposite sides of the first circuit substrate are defined as the first side and the second side respectively; the charging module includes a first electronic component, the first electronic component is disposed on the first side of the first circuit substrate, and the first electronic component has a first heat dissipation surface; the motor drive module includes a second electronic component, the second electronic component is disposed on the first side of the first circuit substrate, the second electronic component has a second heat dissipation surface; the water cooler is disposed on the first circuit substrate The first side of the water cooler is against the first heat dissipation surface and the second heat dissipation surface to dissipate heat from the first electronic component and the second electronic component. The charging module and the motor driving module are integrated on the first side of the first circuit substrate, and share a water cooler for heat dissipation.

Description

多功能模組合一車用控制裝置Multifunctional module combined with a vehicle control device

本創作涉及一種控制裝置,特別是一種應用於電動車中的多功能模組合一車用控制裝置。 The invention relates to a control device, in particular, a multi-function module combined with a vehicle control device used in electric vehicles.

現有常見的各式電動車或高功率裝置所包含的多種控制裝置是採分散式配置的方式,且各自配置專屬的散熱器。此種設計,需要佔據相對較大的空間,且存在成本高昂的缺點。若要將多種控制裝置整合在有限的空間內,又容易產生散熱效果不佳的問題。 Currently, various control devices included in common electric vehicles or high-power devices are distributed in a distributed manner, and each is equipped with its own dedicated radiator. This kind of design requires a relatively large space and has the disadvantage of high cost. If you want to integrate multiple control devices in a limited space, it is easy to cause poor heat dissipation.

本創作公開一種多功能模組合一車用控制裝置,主要用以改善習知的電動車或高功率裝置中,充電模組及馬達驅動模組為完全獨立的設計,為此,需要佔據相對較大的空間,且還存在有散熱效果不佳的問題。 This invention discloses a multifunctional module combined with a vehicle control device, which is mainly used to improve conventional electric vehicles or high-power devices. In conventional electric vehicles or high-power devices, the charging module and the motor drive module are completely independent designs. For this reason, they need to occupy a relatively large area. Large space, and there is also the problem of poor heat dissipation.

本創作的其中一實施例公開一種多功能模組合一車用控制裝置,其包含:一第一電路基板、一充電模組、一馬達驅動模組及一水冷器。第一電路基板的彼此相反的兩側分別定義為一第一側及一第二側;充電模組包含一第一電子元件,第一電子元件設置於第一電路基板的第一側,第一電子元件具有一第一散熱面;馬達驅動模組包含一第二電子元件,第二電子元件設置於第一電路基板的第一側,第二電子元件具有一第二散熱面;水冷器設置於第一電路基板的第一側,且水冷器抵靠第一散熱面及第二散熱面,水冷器用以對第一電子元件及第二電子元件進行散熱。其中,充電模組與馬達驅動模組是整合於第一電路基板的第一側,且共用水冷器進行散熱。 One embodiment of the present invention discloses a multifunctional module combined with a vehicle control device, which includes: a first circuit substrate, a charging module, a motor drive module and a water cooler. Opposite sides of the first circuit substrate are defined as a first side and a second side respectively; the charging module includes a first electronic component, the first electronic component is disposed on the first side of the first circuit substrate, and the first The electronic component has a first heat dissipation surface; the motor drive module includes a second electronic component, the second electronic component is disposed on the first side of the first circuit substrate, the second electronic component has a second heat dissipation surface; the water cooler is disposed on The first side of the first circuit substrate, and the water cooler is against the first heat dissipation surface and the second heat dissipation surface, and the water cooler is used to dissipate heat from the first electronic component and the second electronic component. The charging module and the motor driving module are integrated on the first side of the first circuit substrate, and share a water cooler for heat dissipation.

綜上所述,本創作的多功能模組合一車用控制裝置,通過第一電路基板、充電模組、馬達驅動模組及水冷器等設計,可以有效地改善習 知的電動車中,充電模組及馬達驅動模組需要佔據相對較大的空間,及散熱效果不佳的問題。 To sum up, the multi-function module combined with a vehicle control device of this invention can effectively improve the habit through the design of the first circuit substrate, charging module, motor drive module and water cooler. In known electric vehicles, the charging module and motor drive module need to occupy a relatively large space and suffer from poor heat dissipation.

為能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與附圖,但是此等說明與附圖僅用來說明本創作,而非對本創作的保護範圍作任何的限制。 In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings about this creation. However, these descriptions and drawings are only used to illustrate this creation and do not make any reference to the scope of protection of this creation. limit.

100:多功能模組合一車用控制裝置 100: Multifunctional module combined with a vehicle control device

1:第一電路基板 1: First circuit substrate

11:第一側 11: First side

12:第二側 12: Second side

13:第一區 13:The first area

14:第二區 14:Second District

15:第一連接埠 15:First connection port

16:電路走線 16:Circuit routing

2:充電模組 2:Charging module

21:第一電子元件 21:First electronic components

211:第一散熱面 211: First heat dissipation surface

22:電容 22: Capacitor

3:馬達驅動模組 3: Motor drive module

31:第二電子元件 31: Second electronic component

311:第二散熱面 311: Second heat dissipation surface

32:電容 32: Capacitor

34:霍爾感測器 34: Hall sensor

4:水冷器 4:Water cooler

5:控制電路板 5:Control circuit board

51:第二連接埠 51: Second port

52:控制器 52:Controller

6:直流轉換元件 6: DC conversion components

7:車用壓縮機驅動元件 7: Vehicle compressor driving components

8:輔助導電片體 8: Auxiliary conductive sheet body

9:連通導電結構 9: Connected conductive structures

200:變壓器 200:Transformer

300:電容 300: Capacitor

400:電感 400:Inductor

500:輔助電路基板 500: Auxiliary circuit substrate

600:第二電路基板 600: Second circuit substrate

601:第三電子元件 601:Third electronic components

A:馬達 A: Motor

B:本體 B:Body

B1:底面 B1: Bottom

B2:頂面 B2: Top surface

B3:導熱結構 B3: Thermal conductive structure

B4:溝槽 B4:Trench

C:接腳 C:pin

S:間隙 S: gap

圖1為本創作的多功能模組合一車用控制裝置的第一實施例的示意圖。 Figure 1 is a schematic diagram of a first embodiment of a multi-function module combined with a vehicle control device of the present invention.

圖2為圖1的俯視圖。 FIG. 2 is a top view of FIG. 1 .

圖3為本創作的多功能模組合一車用控制裝置的第一實施例的局部分解示意圖。 Figure 3 is a partially exploded schematic diagram of the first embodiment of the multi-function module combined with a vehicle control device of the present invention.

圖4為本創作的多功能模組合一車用控制裝置的第一實施例的另一局部分解示意圖。 Figure 4 is another partially exploded schematic diagram of the first embodiment of the multi-function module combined with a vehicle control device of the present invention.

圖5及圖6分別為本創作的多功能模組合一車用控制裝置的第一實施例的不同視角的側視圖。 Figures 5 and 6 are respectively side views from different perspectives of the first embodiment of the multi-function module combined with a vehicle control device of the present invention.

圖7為本創作的多功能模組合一車用控制裝置的第二實施例的第一電子元件及第二電子元件的示意圖。 FIG. 7 is a schematic diagram of the first electronic component and the second electronic component of the second embodiment of the multifunctional module-in-vehicle control device of the present invention.

圖8為本創作的多功能模組合一車用控制裝置的第二實施例的另一局部分解示意圖。 Figure 8 is another partially exploded schematic diagram of the second embodiment of the multifunctional module combined with a vehicle control device of the present invention.

圖9及圖10為本創作的多功能模組合一車用控制裝置的第二實施例的不同視角的側視圖。 Figures 9 and 10 are side views from different perspectives of the second embodiment of the multifunctional module-in-vehicle control device of the present invention.

圖11及圖12為本創作的多功能模組合一車用控制裝置的其中一實施例的第一電子元件及第二電子元件對應於不同視角的示意圖。 11 and 12 are schematic diagrams of the first electronic component and the second electronic component corresponding to different viewing angles of one embodiment of the multi-function module combined with a vehicle control device of the present invention.

圖13為本創作的多功能模組合一車用控制裝置的其中一實施例的局部分解示意圖。 Figure 13 is a partially exploded schematic diagram of one embodiment of the multi-function module combined with a vehicle control device of the present invention.

於以下說明中,如有指出請參閱特定圖式或是如特定圖式所示,其僅是用以強調於後續說明中,及的相關內容大部份出現於特定圖式中,但不限制後續說明中僅可參考特定圖式。 In the following description, if it is pointed out that please refer to a specific diagram or as shown in a specific diagram, it is only used to emphasize in the subsequent explanations, and most of the relevant content appears in the specific diagram, but it is not limiting. In the description that follows, only specific drawings may be referenced.

請一併參閱圖1至圖5,圖1為本創作的多功能模組合一車用控制裝置的第一實施例的示意圖,圖2為圖1的俯視圖,圖3為本創作的多功能模組合一車用控制裝置的第一實施例的局部分解示意圖,圖4為本創作的多功能模組合一車用控制裝置的第一實施例的另一局部分解示意圖,圖5及圖6分別為本創作的多功能模組合一車用控制裝置的第一實施例的不同視角的側視圖。 Please refer to Figures 1 to 5 together. Figure 1 is a schematic diagram of the first embodiment of the multi-function module combined with a vehicle control device of the present invention. Figure 2 is a top view of Figure 1. Figure 3 is a multi-functional module of the present invention. Figure 4 is another partially exploded schematic view of the first embodiment of the multifunctional module combined with a vehicle control device. Figures 5 and 6 are respectively. Side views from different angles of the first embodiment of the multifunctional module combination vehicle control device of the present invention.

本創作的多功能模組合一車用控制裝置100包含一第一電路基板1、一充電模組2、一馬達驅動模組3及一水冷器4。本創作的多功能模組合一車用控制裝置100適合應用於一電動車中,電動車包含一充電電池組及一馬達A。第一電路基板1為電路板,充電模組2用以與所述充電電池組連接,而充電模組2用以將外部電源,轉換為充電電池所需的電流及電壓。馬達驅動模組3用以與所述馬達A及所述充電電池組連接,而馬達驅動模組3用以將所述充電電池組提供的電力,轉換為馬達A運作所需的電壓及電流。水冷器4例如可以是常見的各式水冷盤、水冷排等,於此不加以限制。 The multifunctional module combined vehicle control device 100 of the present invention includes a first circuit substrate 1, a charging module 2, a motor driving module 3 and a water cooler 4. The multifunctional module combined with a vehicle control device 100 of the invention is suitable for use in an electric vehicle. The electric vehicle includes a rechargeable battery pack and a motor A. The first circuit substrate 1 is a circuit board, and the charging module 2 is used to connect to the rechargeable battery pack, and the charging module 2 is used to convert the external power supply into the current and voltage required by the rechargeable battery. The motor drive module 3 is used to connect to the motor A and the rechargeable battery pack, and the motor drive module 3 is used to convert the power provided by the rechargeable battery pack into the voltage and current required for the operation of the motor A. The water cooler 4 can be, for example, various common water cooling plates, water cooling radiators, etc., which are not limited thereto.

請參閱圖3,第一電路基板1的彼此相反的兩側分別定義為一第一側11及一第二側12。充電模組2包含多個第一電子元件21,多個第一電子元件21的至少一個設置於第一電路基板1的第一側11,第一電子元件21具有一第一散熱面211。第一電子元件21在充電模組2運作時(即外部電源通過充電模組2對充電電池進行充電時),會產生大量熱能的元件,舉例來說,第一電子元件21例如是功率因數校正控制器(Power Factor Correction,PFC)、全 橋轉換元件(F-bridge、D-bridge)等,但不以此為限。在其中一個實施例中,此充電模組2可以是一車載充電器(On-Board Battery Charger,OBC)。 Referring to FIG. 3 , two opposite sides of the first circuit substrate 1 are respectively defined as a first side 11 and a second side 12 . The charging module 2 includes a plurality of first electronic components 21 . At least one of the plurality of first electronic components 21 is disposed on the first side 11 of the first circuit substrate 1 . The first electronic component 21 has a first heat dissipation surface 211 . The first electronic component 21 is a component that generates a large amount of heat energy when the charging module 2 is operating (that is, when the external power source charges the rechargeable battery through the charging module 2). For example, the first electronic component 21 is a power factor corrector. Controller (Power Factor Correction, PFC), full Bridge conversion components (F-bridge, D-bridge), etc., but are not limited to this. In one embodiment, the charging module 2 may be an on-board battery charger (OBC).

需說明的是,於本實施例圖3中,是以充電模組2所包含的三個第一電子元件21(例如是FPC、F-bridge、D-bridge)設置於第一電路基板1的第一側11為例,但充電模組2設置於第一電路基板1的第一側11的第一電子元件21的數量不以此為限。在實際應用中,可以是依據第一電路基板1的尺寸、電路走線(layout)等設計,以增減設置於第一電路基板1的第一側11的第一電子元件21的數量。 It should be noted that in FIG. 3 of this embodiment, three first electronic components 21 (such as FPC, F-bridge, and D-bridge) included in the charging module 2 are disposed on the first circuit substrate 1 The first side 11 is taken as an example, but the number of the first electronic components 21 of the charging module 2 disposed on the first side 11 of the first circuit substrate 1 is not limited to this. In practical applications, the number of first electronic components 21 disposed on the first side 11 of the first circuit substrate 1 may be increased or decreased based on the size, circuit layout, and other designs of the first circuit substrate 1 .

在圖3中,馬達驅動模組3包含三個功率單元,每個功率單元是由兩個第二電子元件31所構成,這些第二電子元件31中的至少一個設置於第一電路基板1的第一側11,第二電子元件31具有一第二散熱面311。第二電子元件31在馬達驅動模組3運作時(例如是充電電池提供電力給馬達A,而使馬達A運轉時),會產生大量熱能的元件,舉例來說,第二電子元件31例如是各式開關元件(例如功率晶片)等,但不以此為限。另外,本實施例中,各個功率單元是由兩個第二電子元件31所構成,此兩個第二電子元件31互相並聯,以利於提供較大的驅動電流驅動馬達,但關於第二電子元件31的連接方式,不過上述說明為限。依據實際需求,各個功率單元亦可以設置單一個第二電子元件31,或是設置更多數量的第二電子元件31。又,這些互相並聯的第二電子元件31可以是具有相同規格(如相同的輸出電流)的電子元件,也可以是具有不同規格的電子元件。功率單元所產生的驅動電流則是透過一金屬插片,由第一電路基板1的第二側12向外傳送。在其中一個實施例中,此馬達驅動模組3可以是一逆變器(traction inverter)。 In FIG. 3 , the motor drive module 3 includes three power units. Each power unit is composed of two second electronic components 31 . At least one of these second electronic components 31 is disposed on the first circuit substrate 1 . On the first side 11 , the second electronic component 31 has a second heat dissipation surface 311 . The second electronic component 31 is a component that generates a large amount of heat energy when the motor driving module 3 is operating (for example, when the rechargeable battery provides power to the motor A to run the motor A). For example, the second electronic component 31 is Various switching elements (such as power chips), etc., but are not limited thereto. In addition, in this embodiment, each power unit is composed of two second electronic components 31. The two second electronic components 31 are connected in parallel to facilitate providing a larger driving current to drive the motor. However, regarding the second electronic components 31 connection method, but the above description is limited. According to actual needs, each power unit can also be equipped with a single second electronic component 31 or a larger number of second electronic components 31 . Furthermore, these second electronic components 31 connected in parallel may be electronic components with the same specifications (such as the same output current), or they may be electronic components with different specifications. The driving current generated by the power unit is transmitted outward from the second side 12 of the first circuit substrate 1 through a metal insert. In one embodiment, the motor driving module 3 may be an inverter (traction inverter).

需說明的是,於本實施例中,是以馬達驅動模組3所包含的六個第二電子元件31(例如是六個開關單元)設置於第一電路基板1的第一側11為例,但馬達驅動模組3設置於第一電路基板1的第一側11的第二電子元件31 的數量不以此為限。在實際應用中,可以是依據第一電路基板1的尺寸、電路走線等設計,以增減設置於第一電路基板1的第一側11的第二電子元件31的數量。 It should be noted that in this embodiment, it is taken as an example that the six second electronic components 31 (for example, six switch units) included in the motor drive module 3 are disposed on the first side 11 of the first circuit substrate 1 , but the motor drive module 3 is disposed on the second electronic component 31 on the first side 11 of the first circuit substrate 1 The quantity is not limited to this. In practical applications, the number of second electronic components 31 disposed on the first side 11 of the first circuit substrate 1 may be increased or decreased based on the size, circuit wiring, and other designs of the first circuit substrate 1 .

在實際應用中,如圖1所示,充電模組2及馬達驅動模組3所分別包含的多個電容22、32、電感、感測元件中的至少一個,則可以是設置於第一電路基板1的第二側12。這些電容22、32可以透過貫穿第一電路基板1的金屬插片電性連接於第一電路基板1之第一側11的第一電子元件21或第二電子元件31。在其中一個實施例中,充電模組2及馬達驅動模組3的部分電子零件也可以是設置於多功能模組合一車用控制裝置100所包含的另一輔助電路基板500。輔助電路基板500例如還可以是設置有變壓器200、電容300、電感400等。 In practical applications, as shown in Figure 1, at least one of the plurality of capacitors 22, 32, inductors, and sensing elements included in the charging module 2 and the motor drive module 3 respectively can be disposed in the first circuit. Second side 12 of substrate 1 . These capacitors 22 and 32 can be electrically connected to the first electronic component 21 or the second electronic component 31 on the first side 11 of the first circuit substrate 1 through metal inserts penetrating the first circuit substrate 1 . In one embodiment, some of the electronic components of the charging module 2 and the motor driving module 3 may also be provided on another auxiliary circuit substrate 500 included in the vehicle control device 100 of the multifunctional module assembly. The auxiliary circuit substrate 500 may also be provided with a transformer 200, a capacitor 300, an inductor 400, etc., for example.

在其中一個實施例中,如圖1所示,馬達驅動模組3還可以包含一霍爾感測器34。霍爾感測器34設於第二側12且具有多個穿孔。馬達驅動模組3與馬達間之連接線穿設於穿孔中。馬達驅動模組3產生電流流過連接線時,會在連接線周圍產生磁場。霍爾感測器34用以偵測磁場變化,以產生相對應的訊號,而與霍爾感測器34相連接的相關處理器,則能依據該些訊號,以確認馬達的轉動狀態。 In one embodiment, as shown in FIG. 1 , the motor driving module 3 may further include a Hall sensor 34 . The Hall sensor 34 is provided on the second side 12 and has a plurality of through holes. The connection line between the motor drive module 3 and the motor is passed through the through hole. When the motor drive module 3 generates current and flows through the connecting wire, a magnetic field will be generated around the connecting wire. The Hall sensor 34 is used to detect changes in the magnetic field to generate corresponding signals, and the relevant processor connected to the Hall sensor 34 can confirm the rotation state of the motor based on these signals.

如圖3至圖4所示,在其中一個具體實施例中,第一電路基板1的第二側12可以是具有一第一區13及一第二區14,第一電子元件21及第二電子元件31設置於第一電路基板1的第一側11對應於第一區13的位置,充電模組2及馬達驅動模組3所分別包含的電容22、32可以是設置於第一區13。在其中一個實施例中,馬達驅動模組3所包含之驅動電路可以是設置於第二區14。 As shown in FIGS. 3 to 4 , in one specific embodiment, the second side 12 of the first circuit substrate 1 may have a first region 13 and a second region 14 , and the first electronic component 21 and the second The electronic component 31 is disposed on the first side 11 of the first circuit substrate 1 at a position corresponding to the first area 13 . The capacitors 22 and 32 included in the charging module 2 and the motor driving module 3 respectively may be disposed in the first area 13 . In one embodiment, the driving circuit included in the motor driving module 3 may be disposed in the second region 14 .

在其中一個實施例中,多功能模組合一車用控制裝置100更包含一控制電路板5。此控制電路板5可以是對應設置於第二區14,且架設於第 二區14上。較佳地,第一電路基板1的厚度可以是大於控制電路板5的厚度,以確保多功能模組合一車用控制裝置100的整體結構強度。 In one embodiment, the multifunctional module combined with a vehicle control device 100 further includes a control circuit board 5 . The control circuit board 5 may be correspondingly arranged in the second area 14 and installed on the District 2 14 on. Preferably, the thickness of the first circuit substrate 1 may be greater than the thickness of the control circuit board 5 to ensure the overall structural strength of the multi-function module combined with the vehicle control device 100.

多功能模組合一車用控制裝置100包含的控制器52(例如是MCU),例如可以是設置於所述控制電路板5。在其中一個實施例中,第一電路基板1的第二側12,還可以是設置有多個第一連接埠15,控制電路板5的一側,則對應設置有多個第二連接埠51,而控制電路板5能通過多個第二連接埠51與多個第一連接埠15相連接,如此設計,可以讓控制電路板5架高地設置於第一電路基板1的第二側12,從而可以有效地減少多功能模組合一車用控制裝置100的整體長度及整體寬度,而且,還可以讓控制電路板5與第一電路基板1之間形成有間隙,從而讓空氣得以於其中流動,據以協助散熱。 The controller 52 (such as an MCU) included in the multi-function module combined with the vehicle control device 100 may, for example, be provided on the control circuit board 5 . In one embodiment, the second side 12 of the first circuit substrate 1 may also be provided with a plurality of first connection ports 15, and one side of the control circuit board 5 may be provided with a plurality of second connection ports 51. , and the control circuit board 5 can be connected to the plurality of first connection ports 15 through the plurality of second connection ports 51. With this design, the control circuit board 5 can be mounted on the second side 12 of the first circuit substrate 1, This can effectively reduce the overall length and overall width of the multifunctional module assembly vehicle control device 100, and also allow a gap to be formed between the control circuit board 5 and the first circuit substrate 1 to allow air to flow therethrough. , to assist in heat dissipation.

水冷器4設置於第一電路基板1的第一側11,且水冷器4面對第一電路基板1的一側面,抵靠於第一散熱面211及第二散熱面311,而水冷器4用以對第一電子元件21以及第二電子元件31進行散熱。在實際應用中,為了使各個第一電子元件21及各個第二電子元件31更好地抵靠水冷器4,可以於第一散熱面211與水冷器4之間,及第二散熱面311與水冷器4之間,分別設置一導熱結構,導熱結構例如可以是散熱膠等。 The water cooler 4 is disposed on the first side 11 of the first circuit substrate 1 , and the water cooler 4 faces one side of the first circuit substrate 1 and abuts against the first heat dissipation surface 211 and the second heat dissipation surface 311 , and the water cooler 4 Used to dissipate heat from the first electronic component 21 and the second electronic component 31 . In practical applications, in order to make each first electronic component 21 and each second electronic component 31 better abut against the water cooler 4, there may be between the first heat dissipation surface 211 and the water cooler 4, and between the second heat dissipation surface 311 and the water cooler 4. A thermal conductive structure is respectively provided between the water coolers 4. The thermal conductive structure may be, for example, heat dissipation glue.

關於第一電路基板1與水冷器4的固定方式,可依據實際需求加以設計,舉例來說,可以是於第一電路基板1及水冷器4上分別設置多個螺孔或是具有螺孔的結構,以與多個螺絲配合,從而讓第一電路基板1與水冷器4相互固定,或者,可以是利用相關夾具等機構,同時夾持第一電路基板1及水冷器4,或者,第一電路基板1及水冷器4可以是分別固定於相關支架,而兩者固定後水冷器4將對應抵靠第一電子元件21及第二電子元件31。在實際應用中,第一電路基板1可以是選用厚度相對較厚的規格,藉此,可以確保第一電路基板1具有足夠的支撐強度,以使第一電路基板1可以與水冷器4相互固定。 The fixing method of the first circuit substrate 1 and the water cooler 4 can be designed according to actual needs. For example, multiple screw holes or screw holes can be provided on the first circuit substrate 1 and the water cooler 4 respectively. structure to cooperate with a plurality of screws to fix the first circuit substrate 1 and the water cooler 4 to each other, or the first circuit substrate 1 and the water cooler 4 can be clamped simultaneously by using relevant clamps and other mechanisms, or the first The circuit substrate 1 and the water cooler 4 can be respectively fixed on relevant brackets, and after the two are fixed, the water cooler 4 will correspondingly abut against the first electronic component 21 and the second electronic component 31 . In practical applications, the first circuit substrate 1 can be of relatively thick thickness, thereby ensuring that the first circuit substrate 1 has sufficient support strength so that the first circuit substrate 1 and the water cooler 4 can be fixed to each other. .

如圖3所示,在本實施例的其中一個具體實施例中,多功能模組合一車用控制裝置100還可以包含一直流轉換元件6及一車用壓縮機驅動元件7,直流轉換元件6及車用壓縮機驅動元件7設置於第一電路基板1的第一側11,且水冷器4抵靠於直流轉換元件6及車用壓縮機驅動元件7。直流轉換元件6是用來進行直流電的電壓/電流轉換(即俗稱的DC-DC轉換器),車用壓縮機驅動元件7是用來控制/驅動,電動車上的相關空氣壓縮器(air compressor)的元件。通過使直流轉換元件6及車用壓縮機驅動元件7設置於第一電路基板1的第一側11,並使兩者抵靠水冷器4,將可以進一步地讓多功能模組合一車用控制裝置100運作時,具有更好的散熱效果。 As shown in FIG. 3 , in one specific embodiment of this embodiment, the multifunctional module combined with a vehicle control device 100 may also include a DC conversion element 6 and a vehicle compressor driving element 7 . The DC conversion element 6 The vehicle compressor driving element 7 is disposed on the first side 11 of the first circuit substrate 1 , and the water cooler 4 abuts against the DC conversion element 6 and the vehicle compressor driving element 7 . The DC conversion element 6 is used to perform voltage/current conversion of DC (commonly known as a DC-DC converter), and the vehicle compressor driving element 7 is used to control/drive the relevant air compressor (air compressor) on the electric vehicle. ) component. By arranging the DC conversion element 6 and the vehicle compressor driving element 7 on the first side 11 of the first circuit substrate 1 and making them abut against the water cooler 4, the multi-function module can be further integrated into a vehicle control system. When the device 100 is operating, it has better heat dissipation effect.

如圖5及圖6所示,第一電子元件21及第二電子元件31位於水冷器4及第一電路基板1之間,第一電子元件21的第一散熱面211與第一電路基板1之間的高度定義為一第一高度,第二電子元件31的第二散熱面311與第一電路基板1之間高度定義為一第二高度,在較佳的應用中,第二高度與第一高度的差值不超過第一高度的10%。 As shown in FIGS. 5 and 6 , the first electronic component 21 and the second electronic component 31 are located between the water cooler 4 and the first circuit substrate 1 . The first heat dissipation surface 211 of the first electronic component 21 and the first circuit substrate 1 The height between the second heat dissipation surface 311 of the second electronic component 31 and the first circuit substrate 1 is defined as a second height. In a preferred application, the second height is The difference between one height shall not exceed 10% of the first height.

依上所述,本創作的多功能模組合一車用控制裝置100將充電模組2及馬達驅動模組3所分別包含的大部分電子元件,整合於同一個第一電路基板1上,並且使充電模組2所包含的第一電子元件21及馬達驅動模組3所包含的第二電子元件31,設置於第一電路基板1的第一側11,並使第一電子元件21及第二電子元件31抵靠水冷器4,如此設計,不但可以有效地縮小多功能模組合一車用控制裝置100整體的尺寸外,還可以有效地提升多功能模組合一車用控制裝置100的散熱效果。 As mentioned above, the multifunctional module combined with a vehicle control device 100 of the present invention integrates most of the electronic components included in the charging module 2 and the motor driving module 3 respectively on the same first circuit substrate 1, and The first electronic component 21 included in the charging module 2 and the second electronic component 31 included in the motor drive module 3 are disposed on the first side 11 of the first circuit substrate 1, and the first electronic component 21 and the second electronic component 31 are arranged on the first side 11 of the first circuit substrate 1. The two electronic components 31 are against the water cooler 4. This design can not only effectively reduce the overall size of the multi-function module assembly and a vehicle control device 100, but also effectively improve the heat dissipation of the multi-function module assembly and a vehicle control device 100. Effect.

值得一提的是,在實際應用中,水冷器4的尺寸大致與第一電路基板1相同,且設置第一電路基板1的第一側11的第一電子元件21及第二電子元件31,基本上都能抵靠於水冷器4,但不以此為限。只要第一電子元件 21及第二電子元件31能抵靠水冷器4,水冷器4的尺寸及外型,都可依據需求加以變化。 It is worth mentioning that in practical applications, the size of the water cooler 4 is approximately the same as that of the first circuit substrate 1, and the first electronic component 21 and the second electronic component 31 are disposed on the first side 11 of the first circuit substrate 1. Basically, it can be against the water cooler 4, but it is not limited to this. As long as the first electronic component 21 and the second electronic component 31 can abut the water cooler 4, and the size and appearance of the water cooler 4 can be changed according to needs.

在現有技術中,電動車中所包含的充電模組及馬達驅動模組,通常是由不同的廠商所製造,兩模組是具有彼此獨立的電路板,因此,電動車廠商必須使用兩組風扇,來分別對充電模組及馬達驅動模組進行散熱。為此,使得充電模組及馬達驅動模組必須佔用大量的空間,且此種設計,還必須針對兩組風扇的設置位置進行額外的設計,否則充電模組及馬達驅動模組所分別產生的熱能,可能會無法有效地被排出。 In the existing technology, the charging module and the motor drive module included in electric vehicles are usually manufactured by different manufacturers. The two modules have independent circuit boards. Therefore, the electric vehicle manufacturer must use two sets of fans. , to dissipate heat of the charging module and motor drive module respectively. For this reason, the charging module and the motor drive module must occupy a lot of space, and this design must also make additional designs for the placement positions of the two sets of fans. Otherwise, the charging module and the motor drive module will generate Thermal energy may not be efficiently discharged.

請一併參閱圖7至圖10,圖7為本創作的多功能模組合一車用控制裝置的第二實施例的第一電子元件及第二電子元件的示意圖,圖8為本創作的多功能模組合一車用控制裝置的第二實施例的另一局部分解示意圖,圖9及圖10為本創作的多功能模組合一車用控制裝置的第二實施例的不同視角的側視圖。 Please refer to FIGS. 7 to 10 together. FIG. 7 is a schematic diagram of the first electronic component and the second electronic component of the second embodiment of the multi-function module combined with a vehicle control device of the present invention. FIG. 8 is a schematic diagram of the multi-function module of the present invention. Another partially exploded schematic diagram of a second embodiment of a functional module combined with a vehicle control device. Figures 9 and 10 are side views from different angles of the second embodiment of a multifunctional module combined with a vehicle control device.

如圖7至圖9所示,本實施例與前述實施例的其中一個差異在於:前述的第一電子元件21及第二電子元件31,可以是分別包含一本體B及多個接腳C。各個接腳C是由本體B面對第一電路基板1的一底面B1向外延伸,而各個接腳C與本體B相連接的位置,不是位於本體B的側邊。另外,依據實際需求,位於本體B兩側的接腳C配置(如數量與位置)可以不同。第一電子元件21及第二電子元件31是分別通過多個接腳C固定於第一電路基板1,而本體B與第一電路基板1之間則對應形成有一間隙S(如圖9所示)。舉例來說,前述第一電子元件21以及第二電子元件31可以透過表面貼裝技術(SMT)或雙排直插封裝(DIP)的方式設置於第一電路基板1。較佳地,間隙S可以是介於1~5公釐(mm)。如圖10所示,第一電路基板1所包含的電路走線16的一部分則可以對應位於間隙S中。通過上述設計,第一電子元件21及第二電子元件31運作時,周圍的空氣也可以於間隙S中流動,以協助散熱。 As shown in FIGS. 7 to 9 , one of the differences between this embodiment and the previous embodiment is that the first electronic component 21 and the second electronic component 31 may include a body B and a plurality of pins C respectively. Each pin C extends outward from the body B facing a bottom surface B1 of the first circuit substrate 1, and the position where each pin C is connected to the body B is not located on the side of the body B. In addition, according to actual needs, the configuration (such as number and location) of the pins C located on both sides of the body B can be different. The first electronic component 21 and the second electronic component 31 are respectively fixed to the first circuit substrate 1 through a plurality of pins C, and a gap S is formed between the body B and the first circuit substrate 1 (as shown in Figure 9 ). For example, the first electronic component 21 and the second electronic component 31 can be disposed on the first circuit substrate 1 through surface mount technology (SMT) or dual in-line packaging (DIP). Preferably, the gap S can be between 1 and 5 millimeters (mm). As shown in FIG. 10 , a part of the circuit traces 16 included in the first circuit substrate 1 may be correspondingly located in the gap S. Through the above design, when the first electronic component 21 and the second electronic component 31 are operating, the surrounding air can also flow in the gap S to assist in heat dissipation.

較佳地,本體B的頂面B2(即前述的第一散熱面及第二散熱面),還可以是具有一導熱結構B3。在實際應用中,導熱結構B3如是以電鍍、塗佈等方式,形成於所述本體B頂面B2的一金屬層。通過導熱結構B3的設計,當水冷器4抵靠於第一電子元件21及第二電子元件31的第一散熱面及第二散熱面時,導熱結構B3將會與水冷器4相接觸,如此,可以讓第一電子元件21及第二電子元件31運作產生的熱能更好地通過導熱結構B3傳遞至水冷器4。關於導熱結構B3的形成方式、外型及其佔據的面積等,皆可依據需求加以變化,不以圖中所示為限。 Preferably, the top surface B2 of the body B (ie, the aforementioned first heat dissipation surface and the second heat dissipation surface) may also have a thermal conductive structure B3. In practical applications, the thermal conductive structure B3 is formed on a metal layer on the top surface B2 of the body B by electroplating, coating, or other methods. Through the design of the heat conduction structure B3, when the water cooler 4 is against the first heat dissipation surface and the second heat dissipation surface of the first electronic component 21 and the second electronic component 31, the heat conduction structure B3 will be in contact with the water cooler 4, so , the heat energy generated by the operation of the first electronic component 21 and the second electronic component 31 can be better transferred to the water cooler 4 through the thermal conductive structure B3. The formation method, appearance and area occupied by the thermal conductive structure B3 can be changed according to the needs, and are not limited to those shown in the figure.

需說明的是,在實際應用中,設置於第一電路基板1的第一側11的所有電子元件,都可以是具有上述本體B、多個接腳C及導熱結構B3的設計,也就是說,前述直流轉換元件6及車用壓縮機驅動元件7同樣也可以是包含本體B、多個接腳C及導熱結構B3。 It should be noted that in practical applications, all electronic components disposed on the first side 11 of the first circuit substrate 1 may be designed with the above-mentioned body B, multiple pins C and thermal conductive structure B3, that is to say , the aforementioned DC conversion element 6 and vehicle compressor driving element 7 can also include a body B, a plurality of pins C and a thermal conductive structure B3.

如圖2、圖4、圖8至圖10所示,在實際應用中,第一電路基板1於第一側11的電路走線16的部分區段具有焊錫區,還可以是焊錫區設置有一輔助導電片體8,輔助導電片體8的厚度小於間隙S,而輔助導電片體8的部分區段對應位於間隙S中。 As shown in Figures 2, 4, 8 to 10, in practical applications, the first circuit substrate 1 has a soldering area on part of the circuit traces 16 on the first side 11. The soldering area can also be provided with a soldering area. The thickness of the auxiliary conductive sheet 8 is smaller than the gap S, and some sections of the auxiliary conductive sheet 8 are correspondingly located in the gap S.

具體來說,其中兩個輔助導電片體8可以是設置於第二電子元件31與第一電路基板1之間的間隙S中,且兩個輔助導電片體8的一端,可以是突出於第一電路基板1的一側,兩個輔助導電片體8突出於第一電路基板1的一端,則用以與充電電池連接,各個第二電子元件31的部分接腳C,則是與設置有輔助導電片體8的電路走線16相連接。通過輔助導電片體8的設置,可以便於充電電池與第一電路基板1上的電路走線16連接,且還可以減少阻抗。 Specifically, the two auxiliary conductive sheets 8 may be disposed in the gap S between the second electronic component 31 and the first circuit substrate 1 , and one end of the two auxiliary conductive sheets 8 may protrude from the first circuit board 1 . On one side of a circuit substrate 1, two auxiliary conductive sheets 8 protrude from one end of the first circuit substrate 1 and are used to connect to the rechargeable battery. Some pins C of each second electronic component 31 are provided with The circuit traces 16 of the auxiliary conductive sheet 8 are connected. Through the arrangement of the auxiliary conductive sheet 8, the connection between the rechargeable battery and the circuit traces 16 on the first circuit substrate 1 can be facilitated, and the impedance can also be reduced.

三個第二電子元件31所分別包含的部分接腳C,還與第一電路基板1的第二側12的三個連通導電結構9相連接,而三個連通導電結構9則 是用以與馬達A的三相線相連接。通過間隙S的設計,可以讓位於第一電路基板1的第一側11,用以與三個連通導電結構9相連接的電路走線16,得以設置於間隙中,藉此,可以讓第一電路基板1的空間更有效地被利用,進而讓多功能模組合一車用控制裝置100的整體體積得以縮小。 Some of the pins C included in the three second electronic components 31 are also connected to the three connected conductive structures 9 on the second side 12 of the first circuit substrate 1 , and the three connected conductive structures 9 It is used to connect to the three-phase line of motor A. Through the design of the gap S, the first side 11 of the first circuit substrate 1 can be located, and the circuit traces 16 used to connect the three connected conductive structures 9 can be disposed in the gap, thereby allowing the third The space of the circuit substrate 1 is utilized more effectively, thereby reducing the overall volume of the multifunctional module assembly and the vehicle control device 100 .

請一併參閱圖11及圖12,其為本創作的多功能模組合一車用控制裝置的其中一實施例的第一電子元件及第二電子元件對應於不同視角的示意圖。本體B的頂面B2是作為一散熱面(即為前述的第一電子元件的第一散熱面或第二電子元件的第二散熱面),導熱結構B3是對應設置於散熱面。 Please refer to FIG. 11 and FIG. 12 together, which are schematic diagrams of the first electronic component and the second electronic component corresponding to different viewing angles of one embodiment of the multi-function module combined with a vehicle control device of the present invention. The top surface B2 of the body B serves as a heat dissipation surface (ie, the first heat dissipation surface of the first electronic component or the second heat dissipation surface of the second electronic component), and the thermal conductive structure B3 is correspondingly provided on the heat dissipation surface.

本實施例與前述實施例最大不同之在於:第一電子元件21及第二電子元件31,所包含的本體B還可以是包含有兩個溝槽B4,各個溝槽B4則是鄰近於散熱面的邊緣處設置,兩個溝槽B4是由本體B設置有導熱結構B3的一側內凹形成,且各個溝槽B4是鄰近於位於同一排的多個接腳C。通過兩個溝槽B4的設計,可以增加各個接腳C至導熱結構B3的爬電距離(Creepage),以滿足接腳C與導熱結構B3(通常為導體)以及外接的水冷器間之絕緣效果。關於各個溝槽B4的深度、寬度、尺寸等,都不以圖中所示為限,在實際應用中,都可依據需求加以變化。 The biggest difference between this embodiment and the previous embodiment is that the body B included in the first electronic component 21 and the second electronic component 31 may also include two grooves B4, and each groove B4 is adjacent to the heat dissipation surface. The two grooves B4 are formed by the concave side of the body B where the thermal conductive structure B3 is provided, and each groove B4 is adjacent to a plurality of pins C located in the same row. Through the design of two grooves B4, the creepage distance (Creepage) from each pin C to the thermal conductive structure B3 can be increased to meet the insulation effect between pin C and the thermal conductive structure B3 (usually a conductor) and the external water cooler. . The depth, width, size, etc. of each trench B4 are not limited to those shown in the figure. In actual applications, they can be changed according to requirements.

需說明的是,於本實施例的圖式中,是以各個接腳C由本體的一側向外向下延伸形成,且在接腳C的末端具有一水平段,用以連接至第一電路基板,但接腳C與本體B的設置方式不以此為限,在本實施例的其中一個變化實施例中,接腳C與本體B的設置方式,也可以是如圖7所示(即,接腳C是由本體B的底面B1向外延伸)。本實施例之接腳C設計為適於以表面貼裝技術(SMT)進行安裝。不過本案亦不限於此。 It should be noted that in the drawings of this embodiment, each pin C is formed by extending outward and downward from one side of the body, and there is a horizontal section at the end of the pin C for connecting to the first circuit. The substrate, but the arrangement of the pins C and the body B is not limited to this. In one variation of this embodiment, the arrangement of the pins C and the body B can also be as shown in Figure 7 (i.e. , pin C extends outward from the bottom surface B1 of body B). The pin C of this embodiment is designed to be installed using surface mount technology (SMT). However, this case is not limited to this.

請參閱圖13,其為本創作的多功能模組合一車用控制裝置的其中一實施例的局部分解示意圖。本實施例與前述實施例最大不同之處在 於:多功能模組合一車用控制裝置100可以是還包含有一第二電路基板600,第二電路基板600與第一電路基板1設置於水冷器4的同一側。 Please refer to FIG. 13 , which is a partially exploded schematic diagram of one embodiment of the multi-function module combined with a vehicle control device of the present invention. The biggest difference between this embodiment and the previous embodiment is that The multifunctional module combined vehicle control device 100 may further include a second circuit substrate 600 , and the second circuit substrate 600 and the first circuit substrate 1 are disposed on the same side of the water cooler 4 .

在實際應用中,第二電路基板600與水冷器4之間的垂直距離,可以是與第一電路基板1與水冷器4之間的垂直距離相同或不相同。第二電路基板600面對水冷器4的一側,設置有兩個第三電子元件601,舉例來說,兩個第三電子元件601例如可以是直流轉換元件及車用壓縮機驅動元件。關於第二電路基板600所設置的第三電子元件601的種類及數量,都不以圖中或上述說明為限。 In practical applications, the vertical distance between the second circuit substrate 600 and the water cooler 4 may be the same as or different from the vertical distance between the first circuit substrate 1 and the water cooler 4 . On the side of the second circuit substrate 600 facing the water cooler 4, two third electronic components 601 are provided. For example, the two third electronic components 601 may be a DC conversion component and a vehicle compressor driving component. The type and quantity of the third electronic components 601 provided on the second circuit substrate 600 are not limited to the figures or the above description.

在實際應用中,第二電路基板600例如可以是通過螺絲、螺帽等相關鎖固件,可拆卸地或不可拆卸地設置於水冷器4的一側,且第二電路基板600與水冷器4之間存在有一間隙,該間隙用以容置設置於第二電路基板600的第三電子元件601。 In practical applications, the second circuit substrate 600 may be detachably or non-detachably disposed on one side of the water cooler 4 through screws, nuts and other related fasteners, and the connection between the second circuit substrate 600 and the water cooler 4 There is a gap between them, and the gap is used to accommodate the third electronic component 601 provided on the second circuit substrate 600 .

需說明的是,多功能模組合一車用控制裝置100所包含的第一電路基板1及第二電路基板600彼此間,例如可以是通過相關的電連接器、排線等構件相互電性連接,但不以此為限。 It should be noted that the first circuit substrate 1 and the second circuit substrate 600 included in the multi-function module combined with a vehicle control device 100 may be electrically connected to each other through relevant electrical connectors, cables and other components. , but not limited to this.

通過使多功能模組合一車用控制裝置100包含第一電路基板1及第二電路基板600的設計,相關人員可以是依據第一電子元件21及第二電子元件31的數量、尺寸、體積及高度,及第三電子元件601的數量、尺寸、體積及高度等,設計相對應的第一電路基板1及第二電路基板600的尺寸、第一電路基板1與水冷器4之間的垂直距離、第二電路基板600與水冷器4之間的垂直距離、第一電路基板1的厚度、第二電路基板600的厚度等,藉此,可以讓第一電子元件21、第二電子元件31及第三電子元件601都得到最佳的散熱效果。 By integrating the multifunctional module into a vehicle control device 100 including the first circuit substrate 1 and the second circuit substrate 600 , the relevant personnel can design the first electronic component 21 and the second electronic component 31 according to the number, size, volume and height, and the number, size, volume and height of the third electronic component 601, etc., design the corresponding dimensions of the first circuit substrate 1 and the second circuit substrate 600, and the vertical distance between the first circuit substrate 1 and the water cooler 4 , the vertical distance between the second circuit substrate 600 and the water cooler 4, the thickness of the first circuit substrate 1, the thickness of the second circuit substrate 600, etc., thereby allowing the first electronic component 21, the second electronic component 31 and The third electronic component 601 obtains the best heat dissipation effect.

舉例來說,假設各個第一電子元件21(或各個第二電子元件31)與各個第三電子元件601設置於第一電路基板1後,第一電子元件21(或各 個第二電子元件31)的頂面及第三電子元件601的頂面,分別與第一電路基板1的高度不同,則若第一電子元件21(或各個第二電子元件31)及第三電子元件601設置於同一個第一電路基板1的一側時,可能會發生第一電子元件21(或各個第二電子元件31)及第三電子元件601只有其中一個可以貼附於水冷器4,為此,無法貼附於水冷器4的電子元件,相對於可以貼附於水冷器4的電子元件,將無法得到較佳的散熱效果。 For example, assuming that each first electronic component 21 (or each second electronic component 31) and each third electronic component 601 are disposed behind the first circuit substrate 1, the first electronic component 21 (or each second electronic component 31) The top surface of the second electronic component 31) and the top surface of the third electronic component 601 are respectively at different heights from the first circuit substrate 1. If the first electronic component 21 (or each second electronic component 31) and the third When the electronic component 601 is disposed on one side of the same first circuit substrate 1 , it may happen that only one of the first electronic component 21 (or each second electronic component 31 ) and the third electronic component 601 can be attached to the water cooler 4 , for this reason, electronic components that cannot be attached to the water cooler 4 will not be able to obtain a better heat dissipation effect compared to electronic components that can be attached to the water cooler 4 .

相對地,本實施例的多功能模組合一車用控制裝置100通過第二電路基板600的設計,可以讓相關技術人員能依據實際需求,而使具有大致相同的高度的電子元件(第一電子元件21及第二電子元件31),安裝於第一電路基板1,並將其他的第三電子元件601設置於第二電路基板600,藉此,可以讓第一電子元件21、第二電子元件31及第三電子元件601,基本上都可以與水冷器4接觸,據以取得良好的散熱效果。 In contrast, the multi-function module combined with a vehicle control device 100 of this embodiment allows relevant technicians to make electronic components (first electronic components) of approximately the same height according to actual needs through the design of the second circuit substrate 600 . The component 21 and the second electronic component 31) are mounted on the first circuit substrate 1, and the other third electronic component 601 is disposed on the second circuit substrate 600, whereby the first electronic component 21 and the second electronic component can be 31 and the third electronic component 601 can basically be in contact with the water cooler 4, thereby achieving good heat dissipation effect.

另外,通過第二電路基板600的設計,相關人員可以藉此縮小第一電路基板1的尺寸,而第一電路基板1的變形量也會相對變小。通過第二電路基板600的設計,還可以有利於氣流通過位於第一電路基板1或第二電路基板600與水冷器4之間的間隙,從而進一步提升散熱效果。 In addition, through the design of the second circuit substrate 600, relevant personnel can reduce the size of the first circuit substrate 1, and the deformation amount of the first circuit substrate 1 will also be relatively small. The design of the second circuit substrate 600 can also facilitate air flow through the gap between the first circuit substrate 1 or the second circuit substrate 600 and the water cooler 4, thereby further improving the heat dissipation effect.

綜上所述,本創作的多功能模組合一車用控制裝置可將多種控制裝置(如充電模組與馬達驅動模組)整合在一起,並且讓這些控制裝置共用水冷器,如此設計,可以有效地縮小整體體積及尺寸,且本創作的多功能模組合一車用控制裝置將第一電子元件以及第二電子元件設置於電路基板的同一側,而使第一電子元件的第一散熱面及第二電子元件的第二散熱面抵靠水冷器等設計,可以有效地提升整體的散熱效果。本創作的多功能模組合一控制裝置除適用於電動車上,亦可適用一般高功率裝置使用,達到有效集中散熱效果。 To sum up, the multifunctional module combined with a vehicle control device of this invention can integrate multiple control devices (such as charging module and motor drive module) and allow these control devices to share a water cooler. With this design, Effectively reducing the overall volume and size, the multifunctional module of the present invention is combined with a vehicle control device to dispose the first electronic component and the second electronic component on the same side of the circuit substrate, so that the first heat dissipation surface of the first electronic component Designs such as the second heat dissipation surface of the second electronic component against the water cooler can effectively improve the overall heat dissipation effect. The multifunctional module integrated control device of this invention is not only suitable for electric vehicles, but also can be used in general high-power devices to achieve effective centralized heat dissipation.

以上僅為本創作的較佳可行實施例,非因此侷限本創作的專利範圍,故舉凡運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的保護範圍內。 The above are only the best possible embodiments of this invention, and do not limit the patent scope of this invention. Therefore, all equivalent technical changes made by using the contents of the description and drawings of this invention are included in the protection scope of this invention.

100:多功能模組合一車用控制裝置 100: Multifunctional module combined with a vehicle control device

1:第一電路基板 1: First circuit substrate

11:第一側 11: First side

12:第二側 12: Second side

15:第一連接埠 15:First connection port

21:第一電子元件 21:First electronic components

211:第一散熱面 211: First heat dissipation surface

22:電容 22: Capacitor

2:充電模組 2:Charging module

31:第二電子元件 31: Second electronic component

311:第二散熱面 311: Second heat dissipation surface

4:水冷器 4:Water cooler

5:控制電路板 5:Control circuit board

51:第二連接埠 51: Second port

6:直流轉換元件 6: DC conversion components

7:車用壓縮機驅動元件 7: Vehicle compressor driving components

8:輔助導電片體 8: Auxiliary conductive sheet body

Claims (15)

一種多功能模組合一車用控制裝置,其包含: 一第一電路基板,其彼此相反的兩側分別定義為一第一側及一第二側; 一充電模組,其包含一第一電子元件,所述第一電子元件設置於所述第一電路基板的所述第一側,所述第一電子元件具有一第一散熱面; 一馬達驅動模組,其包含一第二電子元件,所述第二電子元件設置於所述第一電路基板的所述第一側,所述第二電子元件具有一第二散熱面;以及 一水冷器,其設置於所述第一電路基板的所述第一側,且抵靠所述第一散熱面及所述第二散熱面,所述水冷器用以對所述第一電子元件及所述第二電子元件進行散熱; 其中,所述充電模組與所述馬達驅動模組是整合於所述第一電路基板的所述第一側,且共用所述水冷器進行散熱。 A multifunctional module combined with a vehicle control device includes: A first circuit substrate, the two opposite sides of which are respectively defined as a first side and a second side; A charging module, which includes a first electronic component, the first electronic component is disposed on the first side of the first circuit substrate, and the first electronic component has a first heat dissipation surface; A motor drive module including a second electronic component disposed on the first side of the first circuit substrate, the second electronic component having a second heat dissipation surface; and A water cooler, which is disposed on the first side of the first circuit substrate and is against the first heat dissipation surface and the second heat dissipation surface. The water cooler is used to cool the first electronic component and the second heat dissipation surface. The second electronic component dissipates heat; Wherein, the charging module and the motor driving module are integrated on the first side of the first circuit substrate, and share the water cooler for heat dissipation. 如請求項1所述的多功能模組合一車用控制裝置,其中,所述第一電子元件及所述第二電子元件位於所述水冷器及所述第一電路基板之間;所述第一散熱面與所述第一電路基板之間的高度定義為一第一高度,所述第二散熱面與所述第一電路基板之間的高度定義為一第二高度,所述第二高度與所述第一高度的差值不超過所述第一高度的10%。The multifunctional module combined with a vehicle control device according to claim 1, wherein the first electronic component and the second electronic component are located between the water cooler and the first circuit substrate; The height between a heat dissipation surface and the first circuit substrate is defined as a first height, the height between the second heat dissipation surface and the first circuit substrate is defined as a second height, and the second height The difference from the first height does not exceed 10% of the first height. 如請求項1所述的多功能模組合一車用控制裝置,其中,所述多功能模組合一車用控制裝置還包含一直流轉換元件及一車用壓縮機驅動元件,所述直流轉換元件及所述車用壓縮機驅動元件設置於所述第一電路基板的所述第一側,且所述水冷器抵靠於所述直流轉換元件及所述車用壓縮機驅動元件。The multifunctional module combined with a vehicle control device as claimed in claim 1, wherein the multifunctional module combined with a vehicle control device further includes a DC conversion element and a vehicle compressor driving element, and the DC conversion element And the vehicle compressor driving element is disposed on the first side of the first circuit substrate, and the water cooler is against the DC conversion element and the vehicle compressor driving element. 如請求項1所述的多功能模組合一車用控制裝置,其中,所述充電模組及所述馬達驅動模組所分別包含的電容、電感、感測元件中的至少一個,設置於所述第一電路基板的所述第二側。The multifunctional module combined with a vehicle control device according to claim 1, wherein at least one of the capacitor, the inductor, and the sensing element included in the charging module and the motor drive module is disposed on the the second side of the first circuit substrate. 如請求項1所述的多功能模組合一車用控制裝置,其中,所述第一散熱面設置有一導熱結構,所述第一電子元件通過所述導熱結構與所述水冷器接觸;所述導熱結構是導熱膠體或形成於所述第一電子元件的一金屬層。The multifunctional module combined with a vehicle control device according to claim 1, wherein the first heat dissipation surface is provided with a thermal conductive structure, and the first electronic component contacts the water cooler through the thermal conductive structure; The thermally conductive structure is thermally conductive colloid or a metal layer formed on the first electronic component. 如請求項1所述的多功能模組合一車用控制裝置,其中,所述第二散熱面設置有一導熱結構,所述第二電子元件通過所述導熱結構與所述水冷器接觸;所述導熱結構是導熱膠體或形成於所述第二電子元件的一金屬層。The multifunctional module combined with a vehicle control device according to claim 1, wherein the second heat dissipation surface is provided with a thermal conductive structure, and the second electronic component contacts the water cooler through the thermal conductive structure; The thermally conductive structure is thermally conductive colloid or a metal layer formed on the second electronic component. 如請求項1所述的多功能模組合一車用控制裝置,其中,所述第一電子元件及所述第二電子元件分別包含一本體及多個接腳,所述本體通過多個所述接腳固定於所述第一電路基板的所述第一側,且所述本體與所述第一電路基板之間形成有一間隙;所述間隙介於1~5公釐。The multifunctional module combined with a vehicle control device according to claim 1, wherein the first electronic component and the second electronic component respectively include a body and a plurality of pins, and the body passes through a plurality of the The pins are fixed on the first side of the first circuit substrate, and a gap is formed between the body and the first circuit substrate; the gap is between 1 and 5 mm. 如請求項7所述的多功能模組合一車用控制裝置,其中,各個所述接腳是由所述本體面對所述第一電路基板的一底面向外延伸。The multifunctional module combined with a vehicle control device according to claim 7, wherein each of the pins extends outward from a bottom surface of the body facing the first circuit substrate. 如請求項8所述的多功能模組合一車用控制裝置,其中,所述第一電路基板於所述第一側的多個電路走線的部分區段設置有一輔助導電片體,所述輔助導電片體的厚度小於所述間隙,而所述輔助導電片體的部分區段對應位於所述間隙中。The multifunctional module combined with a vehicle control device according to claim 8, wherein the first circuit substrate is provided with an auxiliary conductive sheet in a partial section of the plurality of circuit traces on the first side, and the The thickness of the auxiliary conductive sheet is smaller than the gap, and some sections of the auxiliary conductive sheet are correspondingly located in the gap. 如請求項7所述的多功能模組合一車用控制裝置,其中,所述本體還包含一散熱面及多個溝槽,各個所述溝槽是位於所述散熱面的邊緣處。The multifunctional module combined with a vehicle control device according to claim 7, wherein the body further includes a heat dissipation surface and a plurality of grooves, and each of the grooves is located at an edge of the heat dissipation surface. 如請求項1所述的多功能模組合一車用控制裝置,其中,所述第一電路基板的所述第二側具有一第一區及一第二區,所述第一電子元件及所述第二電子元件設置於所述第一電路基板的所述第一側對應於所述第一區的位置,所述充電模組及所述馬達驅動模組所分別包含電容設置於所述第一區,所述多功能模組合一車用控制裝置的一控制電路板設置於所述第二區。The multifunctional module combined with a vehicle control device according to claim 1, wherein the second side of the first circuit substrate has a first area and a second area, and the first electronic component and the The second electronic component is disposed on the first side of the first circuit substrate at a position corresponding to the first area, and the capacitors included in the charging module and the motor drive module are disposed on the third In the first area, the multi-function module is combined with a control circuit board of a vehicle control device and is arranged in the second area. 如請求項1所述的多功能模組合一車用控制裝置,其中,所述第一電路基板的所述第二側,設置有多個第一連接埠,所述多功能模組合一車用控制裝置還包含一控制電路板,所述控制電路板的一側設置有多個第二連接埠,所述控制電路板通過多個所述第二連接埠與多個所述第一連接埠相連接。The multifunctional module combined with a vehicle control device according to claim 1, wherein the second side of the first circuit substrate is provided with a plurality of first connection ports, and the multifunctional module combined with a vehicle control device The control device also includes a control circuit board. A plurality of second connection ports are provided on one side of the control circuit board. The control circuit board communicates with the plurality of first connection ports through the plurality of second connection ports. connection. 如請求項12所述的多功能模組合一車用控制裝置,其中,所述第一電路基板的厚度大於所述控制電路板的厚度。The multifunctional module combined with a vehicle control device according to claim 12, wherein the thickness of the first circuit substrate is greater than the thickness of the control circuit board. 如請求項1所述的多功能模組合一車用控制裝置,更包含一第二電路基板及至少一第三電子元件,所述第二電路基板與所述第一電路基板設置於所述水冷器的同一側,所述第三電子元件設於所述第二電路基板朝向所述水冷器的一側,且所述第三電子元件抵靠於所述水冷器。The multifunctional module combined with a vehicle control device according to claim 1 further includes a second circuit substrate and at least a third electronic component, the second circuit substrate and the first circuit substrate are arranged on the water-cooled The third electronic component is disposed on the side of the second circuit substrate facing the water cooler, and the third electronic component is against the water cooler. 如請求項14所述的多功能模組合一車用控制裝置,其中,所述第一電路基板與所述水冷器的垂直距離,不同於所述第二電路基板與所述水冷器的垂直距離。The multifunctional module combined with a vehicle control device according to claim 14, wherein the vertical distance between the first circuit substrate and the water cooler is different from the vertical distance between the second circuit substrate and the water cooler. .
TW112208288U 2023-08-07 2023-08-07 Vehicle control device with multifunctional modules combined TWM650056U (en)

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TW112208288U TWM650056U (en) 2023-08-07 2023-08-07 Vehicle control device with multifunctional modules combined
DE202023105539.7U DE202023105539U1 (en) 2023-08-07 2023-09-22 Vehicle control unit combining several functional modules
JP2023003805U JP3244982U (en) 2023-08-07 2023-10-19 Vehicle control device equipped with multi-function module

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