TWM644147U - Connection components and communication modules - Google Patents

Abstract

Connection components and communication modules, including a support plate, the support plate having a plurality of first openings provided at intervals, the plurality of first openings running through the support plate along a thickness direction; a conductive part is provided in the first opening, and the opposite ends of the conductive part along the thickness direction of the support plate are located outside the first opening, and an orthographic projection of the conductive part located outside the first opening on the support plate does not exceed a hole edge of the corresponding first opening. As a result, the area of the support plate occupied by the conductive parts is small, so that there are more of the conductive parts that can be set on a carrier board, and the integration of the communication modules is higher. In addition, setting more of the conductive parts on the carrier board will not lead to a larger volume of the carrier board, which is conducive to the miniaturization of the communication modules, so as to meet the development trend of small size and high integration of the communication modules. Therefore, the size of the conductive parts on the connection components and communication modules provided by the present application is small, which is conducive to the miniaturization of the connection components and communication modules.

Description

Interconnect components and communication modules

The invention relates to the technical field of communication, in particular to an interconnection component and a communication module.

In the field of communication technology, with the increasing demand for data processing, future data centers will introduce more optical interconnection systems to improve the communication bandwidth between cabinets, boards, chips and even chips. Among them, light has the advantages of small signal attenuation, low energy consumption, and high bandwidth. Ultra-small and highly integrated optical communication modules can adapt to the huge bandwidth requirements of optical interconnection systems.

In the related art, the optical chip and the electric chip are integrated in the optical communication module, and the optical chip and the electric chip can be electrically connected through the metal conductive member on the carrier board, so as to realize the driving of the electric chip to the optical chip.

However, the size of the above-mentioned metal conductive member is large, which is not conducive to the miniaturization of the optical communication module.

The inventive embodiment of the present invention provides an interconnection component and a communication module. The size of the conductive parts on the interconnection component is small, which is beneficial to the miniaturization of the interconnection component and the communication module.

The first aspect of the new creative embodiment provides an interconnection component, including a support plate, the support plate has a plurality of first openings arranged at intervals, and the plurality of first openings penetrate the support plate along the thickness direction; There is a conductive part, the opposite ends of the conductive part along the thickness direction of the support plate are located outside the first opening, and the orthographic projection of the conductive part outside the first opening on the support plate does not exceed the hole edge of the corresponding first opening .

In the interconnection component provided in this embodiment, the interconnection component may include a support plate, and the support plate may be used to carry the parts to be connected (for example, the parts to be connected may be optical chips and/or electric chips). The support plate has a plurality of first openings arranged at intervals, the plurality of first openings penetrate the support plate along the thickness direction, a conductive member is arranged in the first opening, the conductive member is passed through the first opening, and the conductive member The opposite ends along the thickness direction of the support plate are located outside the first opening, so as to facilitate the electrical connection of the conductive part with the external part to be connected. Wherein, the orthographic projection of the conductive member outside the first opening on the support plate does not exceed the hole edge of the corresponding first opening, so that the area of the support plate occupied by the conductive member is small, so that the support plate can be arranged There are many conductive parts, and the integration degree of the communication module is high. In addition, arranging more conductive parts on the carrier board will not lead to a larger volume of the carrier board, which is conducive to the miniaturization of the communication module, thereby satisfying the development trend of small size and high integration of the communication module.

In a possible implementation manner, a ground layer is also included, and the ground layer is connected to the support plate; the plurality of first openings include signal holes and ground holes, and the conductive elements located in the ground holes are electrically connected to the ground layer, and are located in the signal holes. Conductive elements in the ground plane are electrically isolated.

In this way, a better shielding effect can be produced on the signal hole, so as to realize high-speed communication.

In a possible implementation manner, the ground layer includes a first ground layer, the support plate includes two board surfaces opposite and spaced apart along a thickness direction, and at least one board surface is covered with the first ground layer.

In this way, the arrangement of the first ground layer is relatively simple.

In a possible implementation manner, the ground layer includes a second ground layer, the support plate includes a first support layer and a second support layer stacked, and the second ground layer is located between the first support layer and the second support layer; The two ground layers have a plurality of second openings arranged at intervals, the second openings are arranged corresponding to the first openings and communicate with each other, and the conductive elements are inserted into the corresponding first openings and the second openings.

In this way, the first support layer and the second support layer protect the second ground layer.

In a possible implementation manner, a conductive layer is further included, the conductive layer is located on the surface of the support plate, and at least part of the conductive layer is electrically connected to the ground layer.

In this way, the conductive layer can increase the shielding area of the ground layer and improve the shielding effect.

In a possible implementation manner, the conductive layer is located on the side wall of the support plate, and the conductive layer located on the side wall is electrically connected to the ground layer.

In this way, the conductive layer on the side wall surface can increase the shielding area of the ground layer and improve the shielding effect.

In a possible implementation manner, the conductive layer is located on the wall of the ground hole and the signal hole, the conductive layer on the wall of the ground hole is electrically connected to the ground layer, and the conductive layer on the wall of the signal hole is connected to the ground layer. Formation is electrically isolated.

In this way, the conductive layer located on the hole wall surface of the ground hole can increase the shielding area of the ground layer and improve the shielding effect.

In a possible implementation manner, the conductive member includes conductive glue.

In this way, the conductive adhesive has strong plasticity, can form conductive parts of various shapes, and can make the volume of the conductive parts smaller, so that the conductive parts occupy a smaller area of the support plate, so as to meet the small size and high integration of the communication module. development trend.

The second aspect of the new creation embodiment provides a communication module, including a first to-be-connected part, a second to-be-connected part, and the interconnection component in the above-mentioned first aspect. The first to-be-connected part and the second to-be-connected part are respectively located at The opposite sides of the interconnection component along the thickness direction are electrically connected through the conductive parts of the interconnection component.

In the communication module provided in this embodiment, the communication module includes an interconnection component, and the interconnection component may include a support plate, and the support plate may be used to carry the parts to be connected (for example, the parts to be connected may be optical chips and/or electric chips). The support plate has a plurality of first openings arranged at intervals, the plurality of first openings penetrate the support plate along the thickness direction, a conductive member is arranged in the first opening, the conductive member is passed through the first opening, and the conductive member The opposite ends along the thickness direction of the support plate are located outside the first opening, so as to facilitate the electrical connection of the conductive part with the external part to be connected. Wherein, the orthographic projection of the conductive member outside the first opening on the support plate does not exceed the hole edge of the corresponding first opening, so that the area of the support plate occupied by the conductive member is small, so that the support plate can be arranged There are many conductive parts, and the integration degree of the communication module is high. In addition, arranging more conductive parts on the carrier board will not lead to a larger volume of the carrier board, which is conducive to the miniaturization of the communication module, thereby satisfying the development trend of small size and high integration of the communication module.

In a possible implementation manner, it also includes a connecting piece, a first pressing piece and a second pressing piece that are oppositely arranged, and the first piece to be connected, the interconnection component and the second piece to be connected are press-fitted on the first pressing piece and the second pressing part; the connector is inserted into the first pressing part, the first part to be connected, the interconnection assembly, the second part to be connected and the second pressing part, and one end of the connecting part is connected to the first pressing part. The setting part is connected, and the other end of the connecting part is connected with the second pressing part.

In this way, the first pressing part and the second pressing part can enable a stable connection between the first to-be-connected part and the second to-be-connected part.

The structure of the new creation as well as its other purposes and beneficial effects will be more clearly understood through the description of the preferred embodiments in conjunction with the accompanying drawings.

The terms used in the implementation of the new creation are only used to explain specific embodiments of the new creation, and are not intended to limit the new creation.

In the related art, the optical chip and the electric chip are integrated in the optical communication module, and the optical chip and the electric chip can be electrically connected through a carrier board, so as to realize the driving of the electric chip to the optical chip. Wherein, a through hole is arranged in the carrier board, and a metal conductive part is arranged in the through hole, and the metal conductive part is formed by punching a metal material.

However, limited by the stamping process, the metal conductive parts formed by stamping have a large volume, and the orthographic projection of the metal conductive parts on the carrier board exceeds the through holes more, resulting in the metal conductive parts occupying a larger area of the carrier board, making Fewer metal conductive parts can be arranged on the carrier board, resulting in a lower integration degree of the optical communication module. In addition, if more metal conductive parts are arranged on the carrier board, the volume of the carrier board will be larger, which is not conducive to the miniaturization of the optical communication module, and cannot meet the requirements of small size and high integration of the optical communication module. development trend.

Based on the above problems, the new creative embodiment provides an interconnection component and a communication module. The interconnection component can include a support plate, and the support plate can be used to carry the parts to be connected (for example, the parts to be connected can be optical chips and/or electric chips) . The support plate has a plurality of first openings arranged at intervals, the plurality of first openings penetrate the support plate along the thickness direction, a conductive member is arranged in the first opening, the conductive member is passed through the first opening, and the conductive member The opposite ends along the thickness direction of the support plate are located outside the first opening, so as to facilitate the electrical connection of the conductive part with the external part to be connected. Wherein, the orthographic projection of the conductive member outside the first opening on the support plate does not exceed the hole edge of the corresponding first opening, so that the area of the support plate occupied by the conductive member is small, so that the support plate can be arranged There are many conductive parts, and the integration degree of the communication module is high. In addition, arranging more conductive parts on the carrier board will not lead to a larger volume of the carrier board, which is conducive to the miniaturization of the communication module, thereby satisfying the development trend of small size and high integration of the communication module.

The communication module 100 provided by the embodiment of the present invention will be described below with reference to FIGS. 1-13 .

The communication module 100 provided by the embodiment of the present invention, as shown in FIGS. Between one to-be-connected piece 310 and the second to-be-connected piece 320, the first to-be-connected piece 310 and the second to-be-connected piece 320 are respectively located on opposite sides of the interconnection assembly 200 along the thickness direction, the first to-be-connected piece 310 and the second to-be-connected piece 320 The components to be connected 320 are electrically connected through the interconnection component 200 .

The first part to be connected 310 may include any one or more of a chip (such as an optical chip, an electric chip), and a circuit board, and the second part to be connected 320 may include any one of a chip (such as an optical chip, an electric chip), and a circuit board. One or more types; Of course, the first to-be-connected component 310 and the second to-be-connected component 320 may also include other electronic components, which is not limited in this new creative embodiment.

Wherein, the first to-be-connected part 310 is located on one side of the interconnection assembly 200 along the thickness direction, and the number of the first to-be-connected part 310 on this side may be at least one. When there are multiple first to-be-connected pieces 310, each first to-be-connected piece 310 may be the same or different. In addition, the second to-be-connected piece 320 is located on the other side of the interconnection assembly 200 along the thickness direction, and the number of the second to-be-connected piece 320 on this side may be at least one. When there are multiple second to-be-connected pieces 320, each second to-be-connected piece 320 may be the same or different.

Exemplarily, the first to-be-connected part 310 can be an optical chip, and the optical chip is located on one side of the interconnection assembly 200, and the optical chip is electrically connected to the interconnection assembly 200, and the second to-be-connected part 320 can be a circuit board, and the circuit board is located on On the other side of the interconnection component 200 , the circuit mainboard is electrically connected to the interconnection component 200 , so that the optical chip and the circuit mainboard are interconnected.

Exemplarily, the first to-be-connected part 310 can be an optical chip, and the optical chip is located on one side of the interconnection component 200, and the optical chip is electrically connected to the interconnection component 200, and the second to-be-connected component 320 can be an electrical chip, and the electrical chip is located on On the other side of the interconnection component 200 , the electric chip is electrically connected to the interconnection component 200 , so that the interconnection between the optical chip and the electric chip is realized.

Exemplarily, the first to-be-connected part 310 may be a first circuit mainboard, the first circuit mainboard is located on one side of the interconnection assembly 200, the first circuit mainboard is electrically connected to the interconnection assembly 200, and the second to-be-connected part 320 may be The second circuit main board, the second circuit main board is located on the other side of the interconnection component 200, and the second circuit main board is electrically connected to the interconnection component 200, so that the first circuit main board and the second circuit main board are interconnected.

The inventive embodiment of the present invention is described by taking the first to-be-connected part 310 as an optical chip, the second to-be-connected part 320 as an electric chip, and the communication module 100 as an optical communication module as examples.

The communication module 100 is an optical communication module, and the optical chip and the electronic chip are packaged on the same interconnection component 200, and the packaging density of the optical communication module is improved by adopting a hybrid packaging method, and then under the same area, the The channel of the optical communication module is used to support the optical interconnection of large-capacity data.

Wherein, the electric chip can be a chip including components such as a driver or a transimpedance amplifier, and is used to generate, amplify and/or receive electrical signals; the optical chip can be a chip with optical signal transmission/processing functions, so that optical signals and electrical Interconversion of signals.

Exemplarily, the electrical chip and the optical chip are electrically connected through the interconnection component 200 , the electrical signal generated or amplified by the electrical chip can be transmitted to the optical chip through the interconnection component 200 , and the optical chip can convert the electrical signal into an optical signal for transmission.

In some embodiments, as shown in FIG. 1 , the communication module 100 further includes a first pressing part 610 and a second pressing part 620 that can be arranged oppositely. The first pressing part 610 is located away from the first part 310 to be connected. On one side of the two parts to be connected 320, the second pressing part 620 is located on the side of the second part to be connected 320 away from the first part to be connected 310, and the first pressing part 610 and the second pressing part 620 will connect the first part to be connected. The connecting piece 310, the interconnection assembly 200 and the second piece to be connected 320 are press-fitted between the first pressing piece 610 and the second pressing piece 620, so that the first piece to be connected 310 and the second piece to be connected 320 Stable connection for stable signal transmission.

Wherein, the first pressing part 610 can be directly pressed on the first to-be-connected part 310 , or indirectly pressed on the first to-be-connected part 310 through other structural parts. The second pressing part 620 may be directly pressed on the second to-be-connected part 320 , or indirectly pressed on the second to-be-connected part 320 through other structural members.

Exemplarily, the material of the first pressing member 610 may include plastic, metal, ceramics, etc., and the material of the second pressing member 620 may include plastic, metal, ceramics, and the like.

Exemplarily, as shown in FIG. 1 , the communication module 100 may further include a connecting piece 500 for connecting the first pressing part 610 and the second pressing part 620 . The connecting piece 500 can be inserted into any one or more of the first pressing piece 610, the first piece to be connected 310, the interconnection assembly 200, the second piece to be connected 320 and the second pressing piece 620, thereby avoiding the first The structural components inserted by the connecting piece 500 among the first pressing part 610 , the first to-be-connected part 310 , the interconnection assembly 200 , the second to-be-connected part 320 and the second pressing part 620 are misplaced. Wherein, one end of the connecting piece 500 is connected to the first pressing piece 610, and the other end of the connecting piece 500 is connected to the second pressing piece 620, so that the first pressing piece 610 and the second pressing piece 620 are connected through the connecting piece 500. connection between.

The interconnection component 200 provided by the embodiment of the present invention will be described below.

The interconnection component 200 provided by the embodiment of the present invention can be used in the communication module 100 in the above embodiment.

As shown in FIG. 3 and FIG. 4 , the interconnection assembly 200 may include a support plate 210 for carrying a first to-be-connected piece 310 and a second to-be-connected piece 320 .

As shown in FIG. 5 and FIG. 6 , the support plate 210 may have a plurality of first openings 220 arranged at intervals, the plurality of first openings 220 penetrate the support plate 210 along the thickness direction, and the first openings 220 are provided with conductive elements. 230 , the conductive member 230 is used to realize electrical connection between the first to-be-connected member 310 and the second to-be-connected member 320 .

As shown in Figure 1 and Figure 3, the first to-be-connected part 310 is provided with a first pin 311 on the side facing the interconnection assembly 200, and the second to-be-connected part 320 is provided with a second pin 321 on the side facing the interconnection assembly 200 . The support plate 210 includes two plate surfaces opposite and spaced apart along the thickness direction, and the two plate surfaces include a first plate surface 211 and a second plate surface 212 . Both opposite ends of the conductive member 230 along the thickness direction of the support plate 210 are located outside the first opening 220 , that is, both ends of the conductive member 230 protrude from the first opening 220 and are exposed outside the first opening 220 . One end of the conductive member 230 is located outside the first board surface 211, and the conductive member 230 located outside the first board surface 211 is electrically connected to the first pin 311 of the first connecting member 310; the other end of the conductive member 230 is located on the second Outside the second board surface 212, the conductive member 230 located outside the second board surface 212 is electrically connected to the second pin 321 of the second to-be-connected piece 320, so as to realize the connection between the first to-be-connected piece 310 and the second to-be-connected piece 320 electrical connection between.

In this embodiment, the orthographic projection of the conductive member 230 located outside the first opening 220 on the support plate 210 does not exceed the edge of the corresponding first opening 220 . That is, the size of the conductive member 230 located outside the first opening 220 is smaller than or equal to the size of the first opening 220, and the conductive member 230 will not additionally occupy the area of the support plate 210, so that the area of the support plate 210 occupied by the conductive member 230 is smaller. Small, so that more conductive elements 230 can be arranged on the support plate 210, and the integration degree of the communication module 100 is higher. In addition, when more conductive elements 230 are arranged on the support plate 210, the volume of the support plate 210 will not be large, which is conducive to the miniaturization of the communication module 100, thereby satisfying the small size and high integration of the communication module 100. development trend.

It can be understood that when the size of the conductive member 230 is small, its transmission loss is small, which is beneficial to realize high-speed transmission.

Exemplarily, the size of the conductive member 230 located outside the first opening 220 may be smaller than the size of the first opening 220, and the orthographic projection of the conductive member 230 located outside the first opening 220 on the support plate 210 is located in the first opening. Inside the hole 220 , there is a distance from the edge of the first opening 220 . Alternatively, the size of the conductive member 230 outside the first opening 220 may be equal to the size of the first opening 220 , and the orthographic projection of the conductive member 230 outside the first opening 220 on the support plate 210 is the same as that of the first opening 220 . The edges of the holes overlap, so that the contact area between the conductive member 230 and the first to-be-connected member 310 and the second to-be-connected member 320 is larger, and the connection stability is higher.

Exemplarily, the conductive member 230 includes conductive glue. Conductive adhesive is an adhesive with certain conductivity after curing or drying. It connects a variety of conductive materials together to form a conductive path between the connected conductive materials. The conductive adhesive may include an elastic medium, such as a silicone medium or a rubber medium, and conductive particles such as carbon or metal are arranged in the medium. Due to the strong plasticity of the conductive glue, various shapes of conductive elements 230 can be formed, and the volume of the conductive element 230 can be made smaller, so that the area occupied by the conductive element 230 on the support plate 210 is smaller, thereby satisfying the small size of the communication module 100 and the The development trend of high accumulation degree. For example, the conductive member 230 can be formed by a stencil printing process or an automatic glue injection process, and its preparation is relatively simple. In addition, the elastic medium can produce better deformation, so that the interconnection assembly 200 can have lower requirements on the surface flatness of the first to-be-connected piece 310 and the second to-be-connected piece 320, and the first to-be-connected piece 310 and the second to-be-connected piece 320 have lower requirements for surface flatness. Even when the flatness of the surface of the connecting member 320 is poor, better connection can also be achieved, thereby improving the fault tolerance rate of the interconnection component 200 . The hole wall of the first opening 220 can provide support for the conductive adhesive, avoiding the conductive adhesive being squeezed and swelled in the horizontal direction, and avoiding the excessive deformation of the conductive adhesive so that it cannot be connected with the first to-be-connected part 310 and the second to-be-connected part 320 connections.

In this embodiment, the plurality of first openings 220 include a plurality of signal holes 221 and a plurality of ground holes 222, the signal holes 221 are used to transmit signals and form signal channels; the ground holes 222 are used to form isolation protection for the signal holes 221, Avoid electromagnetic waves from interfering with the signal transmission of the signal hole 221 .

Wherein, the interfering electromagnetic wave may be generated in the adjacent signal hole 221 , may also be generated by electronic components in the communication module 100 , or may be generated by electronic components outside the communication module 100 .

Exemplarily, a plurality of ground holes 222 are arranged around the outer periphery of the signal hole 221 , for example, the number of ground holes 222 arranged on the outer periphery of the signal hole 221 includes but not limited to 2, 3, 4 or 5 or more. The ground holes 222 form half or full surrounds on the signal holes 221 , and two adjacent ground holes 222 may be in contact or have a gap. In addition, the number of signal holes 221 surrounded by a plurality of ground holes 222 may include but not limited to one or two or more. As shown in part A of FIG. 5 , ten ground holes 222 are arranged around the outer circumference of two signal holes 221 to provide better isolation protection for the signal holes 221 .

In this embodiment, the interconnection component 200 may include a ground layer, the ground layer is connected to the support plate 210, and the ground layer is used to form an isolation protection. The conductive element 230 in the ground hole 222 is electrically connected to the ground layer, so that the conductive element 230 in the ground hole 222 is grounded to form isolation protection for the signal hole 221 . For example, the electrical connection between the conductive member 230 in the ground hole 222 and the ground layer can be realized through connection (including contact connection, fixed connection, etc.). In addition, the conductive member 230 located in the signal hole 221 is electrically isolated from the ground layer, thereby forming a signal channel and realizing signal transmission. For example, the conductive element 230 located in the signal hole 221 and the ground layer may be separated by means of spacing, isolated by insulating elements, etc. to achieve electrical isolation.

The support plate 210 provided by the embodiment of the present invention will be described below.

In the first implementation manner, as shown in FIG. 3 , the support plate 210 may be one piece. For example, the support plate 210 may be an injection-molded porous support structure, the manufacturing process of which is relatively simple and the preparation difficulty is relatively low. Alternatively, the support plate 210 may first form an initial support structure, and holes are opened on the initial support structure to form a porous support structure. In this way, the overall structural stability of the integrally formed support plate 210 is relatively high.

In the second implementation manner, the support plate 210 may include a plurality of support layers stacked in sequence, and the materials of the multiple support layers may be the same or different, so as to meet different requirements of the support plate 210 . For example, the number of supporting layers may include but not limited to 2, 3, 4 or 5 or more. As shown in FIG. 4 , the plurality of support layers may include a first support layer 214 and a second support layer 215 , and the first support layer 214 and the second support layer 215 are stacked.

The ground plane provided by the embodiments of the present invention will be described below.

In the first implementation manner, as shown in FIG. 5, FIG. 6 and FIG. at least one. The first ground layer 241 may cover the first board surface 211 ; or, the second board surface 212 ; or, the first board surface 211 and the second board surface 212 .

Wherein, the conductive member 230 located in the ground hole 222 is electrically connected to the first ground layer 241 to achieve grounding. The conductive member 230 located in the signal hole 221 is electrically isolated from the first ground layer 241 to form a signal channel.

Exemplarily, the first ground layer 241 may cover the first board surface 211 . A plurality of first hollows 244 may be disposed on the first ground layer 241, one first hollow 244 covers at least one signal hole 221, and is located between the signal hole 221 inside the first hollow 244 and the first ground layer 241 spaced so that the signal hole 221 located inside the first hollow portion 244 is electrically isolated from the first ground layer 241, and the conductive member 230 located in the signal hole 221 is electrically isolated from the first ground layer 241 to form a signal aisle. For example, the number of signal holes 221 inside the first hollow portion 244 is one or two or more.

Exemplarily, the first ground layer 241 may cover the second board surface 212 . A plurality of first hollows 244 may be disposed on the first ground layer 241, one first hollow 244 covers at least one signal hole 221, and is located between the signal hole 221 inside the first hollow 244 and the first ground layer 241 spaced so that the signal hole 221 located inside the first hollow portion 244 is electrically isolated from the first ground layer 241, and the conductive member 230 located in the signal hole 221 is electrically isolated from the first ground layer 241 to form a signal aisle. For example, the number of signal holes 221 inside the first hollow portion 244 is one or two or more.

Exemplarily, both the first board surface 211 and the second board surface 212 may be provided with a first ground layer 241 , the principle of which is similar to that of the above-mentioned embodiment, and will not be repeated here. At this time, the area covered by the first ground layer 241 is relatively large, so that the first ground layer 241 and the conductive member 230 in the ground hole 222 form a relatively closed ground network, and its shielding effect is better, thereby reducing the impact on the signal hole 221. Medium signal interference, reduce signal loss, and enable high-speed transmission.

It can be understood that, in the various embodiments of the support board 210 described above, the first ground layer 241 may be provided on at least one board surface.

Exemplarily, the first ground layer 241 may include metal plating. Metal plating can be formed on the surface of the support plate 210 by means of electroplating, electroless plating, and the like. Then laser engrave the metal coating on the surface of the support plate 210, remove the metal coating near the signal hole 221 to form the first hollow part 244, and the metal coating outside the first hollow part 244 forms the first ground layer 241, so that The signal hole 221 is separated from the first ground layer 241 outside the first hollow portion 244 to form an independent signal channel. Wherein, the metal plating layer on the board surface of the first hollow portion 244 can be completely or partially removed, as long as the conductive member 230 in the signal hole 221 can be electrically isolated from the first ground layer 241 .

Figure 8 shows that part of the first ground layer 241 is removed by laser engraving in the actual product to form the first hollow part 244, so that the signal hole 221 inside the first hollow part 244 is spaced from the first ground layer 241 on the board surface It is set to realize electrical isolation between the signal hole 221 and the first ground layer 241 to form a signal channel.

In the second implementation manner, the ground layer may include a second ground layer 242 . The second ground layer 242 is located in the supporting board 210 . For example, the second ground layer 242 may be embedded in the support plate 210 . In this way, the support plate 210 protects the second ground layer 242 .

Specifically, as shown in FIG. 4 and FIG. 9 , the support plate 210 may include a first support layer 214 and a second support layer 215 , and the second ground layer 242 is located between the first support layer 214 and the second support layer 215 . The second ground layer 242 may have a plurality of second openings 243 arranged at intervals. The second openings 243 are provided in one-to-one correspondence with the first openings 220 and communicate with each other. A conductive member 230 is inserted into a corresponding first opening. hole 220 and a second opening 243 . The sizes of at least part of the first opening 220 and at least part of the second opening 243 may be the same or different. When the first opening 220 and the second opening 243 have the same size, they can be formed at one time, and the manufacturing process is relatively simple.

Wherein, the conductive member 230 located in the ground hole 222 is electrically connected to the second ground layer 242 to achieve grounding. The conductive member 230 located in the signal hole 221 is electrically isolated from the second ground layer 242 to form a signal channel.

Exemplarily, the first supporting layer 214, the second supporting layer 215 and the second grounding layer 242 can form a circuit board, that is, the first supporting layer 214, the second supporting layer 215 and the second grounding layer are manufactured using a circuit board manufacturing process 242, its manufacturing process is relatively mature, and existing equipment can be used, and the cost is relatively low.

Exemplarily, a second hollow part may be provided on the second ground layer 242 to electrically isolate the signal hole 221 from the second ground layer 242, which is similar to the principle of forming the first hollow part 244 on the first ground layer 241. No longer. The second hollow part may surround the outer periphery of the second opening 243 corresponding to the signal hole 221, or the second hollow part may coincide with the second opening 243 (the second hollow part is the second opening 243) .

It should be noted that, the first ground layer 241 and the second ground layer 242 may be provided separately or simultaneously.

In some embodiments, as shown in FIG. 7 , the interconnection component 200 may further include a conductive layer 245, and at least part of the conductive layer 245 may be electrically connected to the ground layer (the first ground layer 241 and/or the second ground layer 242), so as to The shielding area of the ground layer is increased to improve the shielding effect and improve the transmission performance of the interconnection component 200 . Wherein, the conductive layer 245 may cover the surface of the support plate 210 or be embedded in the support plate 210 .

The conductive layer 245 provided by the embodiment of the present invention will be described below.

As shown in FIG. 10 , the conductive layer 245 may cover part or all of the side wall of the support plate 210 . The side wall surface of the support plate 210 is a wall surface extending in the thickness direction of the support plate 210 . The conductive layer 245 on the sidewall surface can be connected to the ground layer, thereby increasing the shielding area of the ground layer and improving the shielding effect of the ground layer. In addition, the conductive layer 245 on the side wall is surrounded by the support plate 210 , which can better isolate the electromagnetic wave interference outside the support plate 210 .

In other examples, as shown in FIG. 11 , a conductive layer 245 may be disposed in the first opening 220 , that is, the wall surface of the first opening 220 may be covered with the conductive layer 245 . Wherein, part or all of the hole wall surface of a first opening 220 can be covered with a conductive layer 245; the hole wall surfaces of a part of the number of ground holes 222 or all of the number of ground holes 222 can be covered with a conductive layer 245, part of the number of signal Hole wall surfaces of the hole 221 or all signal holes 221 may be covered with a conductive layer 245 .

In the embodiment in which the conductive layer 245 is disposed in the signal hole 221, the conductive layer 245 in the signal hole 221 may be electrically isolated from the ground layer, so that the conductive member 230 in the signal hole 221 is electrically isolated from the ground layer, to form a signal channel. It can be understood that the conductive layer 245 in the signal hole 221 may extend outside the signal hole 221 and cover the area of the first hollow portion 244 close to the signal hole 221 , the conductive layer 245 extending outside the signal hole 221 and the first contact The formations 241 are arranged at intervals for electrical isolation.

In the embodiment where the conductive layer 245 is disposed in the ground hole 222, the conductive layer 245 in the ground hole 222 can be electrically connected to the ground layer, thereby increasing the shielding area of the ground layer and improving the shielding effect of the ground layer. In addition, the connection between the conductive layer 245 located in the ground hole 222 and the conductive element 230 is relatively stable, so that the electrical connection between the conductive element 230 and the ground layer is relatively stable. At this time, the conductive element 230 in the ground hole 222 can be electrically connected to the ground layer through the conductive layer 245 in the ground hole 222 .

When the conductive layer 245 is disposed in both the signal hole 221 and the ground hole 222 , the principle is similar to that of the above-mentioned embodiment, and will not be repeated here.

Exemplarily, the conductive layer 245 may include metal plating. The metal plating layer can be formed on the side wall surface of the support plate 210 or the hole wall surface of the first opening 220 by means of electroplating, electroless plating, and the like. In the embodiment where the first ground layer 241 and the conductive layer 245 are provided at the same time, both the first ground layer 241 and the conductive layer 245 can include metal plating, and the first ground layer 241 and the conductive layer 245 can be molded at one time, thereby simplifying manufacturing process, improving the connection stability between the first ground layer 241 and at least part of the conductive layer 245 .

It can be understood that, using the ground layer and the conductive layer 245 attached to the support plate 210 to achieve isolation protection, compared with the use of a metal cover to achieve isolation protection, the volume occupied by the ground layer and the conductive layer 245 is small, which is beneficial to The miniaturization of the communication module 100 satisfies the development trend of the communication module 100 with small size and high integration. In addition, the grounding layer and the conductive layer 245 cover a wider area, have a better shielding effect and less signal loss, and can effectively ensure the high-speed transmission rate of the interconnection component 200 .

In some embodiments, as shown in FIG. 12 , the interconnection component 200 may include a positioning hole 250 , and the positioning hole 250 penetrates the support plate 210 and the ground layer along the thickness direction of the interconnection component 200 . The size of the positioning hole 250 on the ground layer may be greater than or equal to the size of the positioning hole 250 on the support plate 210 .

As shown in Fig. 12 and Fig. 13, in the process of preparing the conductive member 230, the positioning member 730 can be inserted into the positioning hole 250 to fix the support plate 210, and then through glue dispensing or printing etc. on the first Conductive elements 230 are formed in the openings 220 to avoid misalignment of the support plate 210 . In other examples, during the process of preparing the conductive member 230, the steel mesh 720 may be provided on opposite sides of the support plate 210 along the thickness direction, and the steel mesh 720 is provided with printing openings corresponding to the first openings 220 one-to-one. . The dispensing head 710 can be used to inject conductive glue into the printing opening of the stencil 720 and the first opening 220, and the excess conductive glue can be removed with a scraper, so that the printing opening and the first opening 220 are compacted and filled with conductive glue. glue, after the conductive glue is solidified (for example, by means of light, heat, etc.), the steel mesh 720 is removed, so as to obtain the formed conductive member 230 . Wherein, the length and size of the conductive element 230 extending out of the first opening 220 can be effectively controlled by controlling the thickness of the stencil 720 and the size of the printing opening.

It can be understood that, as shown in FIG. 1 , when the connector 500 is inserted into the interconnection component 200 , it can be inserted into the positioning hole 250 . The positioning hole 250 has more functions, and there is no need to provide a separate hole for the connector 500 .

In the description of the embodiment of the new creation, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a It is an indirect connection through an intermediary, which can be the internal communication of two elements or the interaction relationship between two elements. Those with ordinary knowledge in the field can understand the specific meanings of the above terms in the embodiments of the present invention according to specific situations.

The terms "first", "second", "third", "fourth", etc., if present, are used to distinguish similar items and not necessarily to describe a particular order or sequence.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the new creation embodiments, not to limit them; although the new creation embodiments have been described in detail with reference to the foregoing embodiments, there are those in the field Those with ordinary knowledge should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from this The scope of the technical solutions of each embodiment of the new creation embodiment.

100: Communication module 200:Interconnect components 210: support plate 211: The first board 212: Second board 214: The first support layer 215: Second support layer 220: The first opening 221: signal hole 222: Ground hole 230: Conductive parts 241: The first ground layer 242: Second ground layer 243: Second opening 244: The first hollow part 245: conductive layer 250: positioning hole 310: the first piece to be connected 311: the first pin 320: the second part to be connected 321: the second pin 500: connector 610: The first pressing part 620: the second pressing part 710: dispensing head 720: steel mesh 730: positioning parts

Fig. 1 is a schematic structural diagram of the communication module provided by the embodiment of the invention. Fig. 2 is a structural schematic diagram of the interconnection component, the first to-be-connected part and the second to-be-connected part provided by the inventive embodiment of the present invention. Fig. 3 is a schematic structural diagram of the support plate provided by the embodiment of the invention. Fig. 4 is another schematic diagram of the structure of the support plate provided by the embodiment of the present invention. Fig. 5 is a schematic structural diagram of the first ground layer provided by the embodiment of the present invention. Fig. 6 is a top view of the first ground layer provided by the embodiment of the present invention. Fig. 7 is a schematic structural diagram of the first ground layer and the conductive layer provided by the embodiment of the present invention. Fig. 8 is a schematic structural diagram of the first hollow part in the actual product provided by the embodiment of the present invention. Fig. 9 is a schematic structural diagram of the second ground layer provided by the embodiment of the present invention. Fig. 10 is a schematic structural diagram of the conductive layer on the side wall provided by the inventive embodiment of the present invention. Fig. 11 is a schematic structural diagram of the conductive layer in the first opening provided by the embodiment of the present invention. Fig. 12 is a schematic structural view of the conductive member prepared by the embodiment of the present invention. Fig. 13 is a top view of the prepared conductive member provided by the embodiment of the present invention.

100: Communication module

200:Interconnect components

250: positioning hole

310: the first piece to be connected

311: the first pin

320: the second part to be connected

321: the second pin

500: connector

610: The first pressing part

620: the second pressing part

Claims (10)

An interconnection assembly, comprising a support plate, the support plate has a plurality of first openings arranged at intervals, and the plurality of first openings penetrate the support plate along the thickness direction; The first opening is provided with a conductive member, and the opposite ends of the conductive member along the thickness direction of the support plate are located outside the first opening, and all the conductive members located outside the first opening are The orthographic projection of the conductive member on the support plate does not exceed the edge of the corresponding first opening. The interconnection component according to claim 1, further comprising a ground layer, the ground layer being connected to the support plate; The plurality of first openings include a signal hole and a ground hole, the conductive element located in the ground hole is electrically connected to the ground layer, and the conductive element located in the signal hole is connected to the ground layer. Formation is electrically isolated. The interconnection assembly according to claim 2, wherein the ground layer includes a first ground layer, and the support plate includes two board surfaces opposite and spaced apart along the thickness direction, at least one of the board surfaces is covered with the first ground layer. The interconnection assembly according to claim 2, wherein the ground layer includes a second ground layer, the support plate includes a first support layer and a second support layer stacked, and the second ground layer is located on the first between the support layer and the second support layer; The second ground layer has a plurality of second openings arranged at intervals, the second openings are arranged corresponding to the first openings and communicate with each other, and the conductive elements are inserted into the corresponding first openings. hole and the second opening. The interconnection component according to any one of claims 2-4, further comprising a conductive layer, the conductive layer is located on the surface of the support plate, and at least part of the conductive layer is electrically connected to the ground layer. The interconnection assembly according to claim 5, wherein the conductive layer is located on the side wall of the support plate, and the conductive layer located on the side wall is electrically connected to the ground layer. The interconnection component according to claim 5, wherein the conductive layer is located on the hole wall surface of the ground hole and the hole wall surface of the signal hole, and the conductive layer on the hole wall surface of the ground hole is connected to the The ground layer is electrically connected, and the conductive layer located on the hole wall of the signal hole is electrically isolated from the ground layer. The interconnection assembly according to any one of claims 1-4, wherein the conductive member includes conductive glue. A communication module, comprising a first to-be-connected part, a second to-be-connected part, and the interconnection assembly described in any one of the above-mentioned claim items 1-8, the first to-be-connected part and the second to-be-connected part are respectively located at the The opposite sides of the interconnection component along the thickness direction are electrically connected through the conductive parts of the interconnection component. The communication module according to claim 9, further comprising a connector, a first press-fitting part and a second press-fitting part arranged oppositely, the first to-be-connected part, the interconnection component and the second to-be-connected A piece is pressed between the first pressing piece and the second pressing piece; The connecting piece is inserted into the first pressing piece, the first piece to be connected, the interconnection assembly, the second piece to be connected and the second pressing piece, and the connecting piece One end is connected to the first pressing part, and the other end of the connecting part is connected to the second pressing part.