CN112820721B - Integrated packaging antenna and packaging method thereof - Google Patents

Integrated packaging antenna and packaging method thereof Download PDF

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Publication number
CN112820721B
CN112820721B CN202110056692.1A CN202110056692A CN112820721B CN 112820721 B CN112820721 B CN 112820721B CN 202110056692 A CN202110056692 A CN 202110056692A CN 112820721 B CN112820721 B CN 112820721B
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layer
antenna
radio frequency
module substrate
aluminum
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CN112820721A (en
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罗燕
高求
丁蕾
刘凯
黄一
王立春
曹向荣
陈凯
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Shanghai Spaceflight Electronic and Communication Equipment Research Institute
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Shanghai Spaceflight Electronic and Communication Equipment Research Institute
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76895—Local interconnects; Local pads, as exemplified by patent document EP0896365
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
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  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

The invention discloses an integrated packaging antenna, which comprises at least one semiconductor chip, an antenna module substrate, an aluminum-silicon adapter plate and a radio frequency module substrate, wherein the antenna module substrate, the aluminum-silicon adapter plate and the radio frequency module substrate are sequentially laminated from top to bottom, the antenna module substrate comprises an antenna layer LCP (liquid Crystal Polymer) substrate, and an antenna pattern layer and an antenna grounding layer which are respectively arranged on the top surface and the bottom surface of the antenna layer LCP substrate, and the radio frequency module substrate comprises a radio frequency layer LCP substrate, and a radio frequency grounding layer and a radio frequency transmission wiring layer which are respectively arranged on the top surface and the bottom surface of the radio frequency layer LCP substrate.

Description

Integrated packaging antenna and packaging method thereof
Technical Field
The invention belongs to the technical field of electronic packaging, and particularly relates to an integrated packaging antenna and a packaging method thereof.
Background
With the rapid development of wireless communication technology, especially the wide application of mobile communication and wireless local area network, the packaging requirements for radio frequency transceiver systems are also higher and higher, and small size, low cost, high integration level and the like are required.
For the interconnection of the antenna and the system, the antenna and the system are usually implemented by adopting a separate design and then assembled, and although the separate design of each antenna and each system is facilitated, the interconnection loss between the antenna and the module, the system size and the cost are greatly increased.
Disclosure of Invention
The invention aims to provide an integrated packaging antenna and a packaging method thereof, which solve the problems that a common adapter plate has relatively poor heat dissipation and cannot be used as a mechanical support, and simultaneously complete the integration of a substrate and a shell, realize the structural function integration of the substrate and the shell, and obtain the integration, miniaturization and lightweight packaging of an antenna module and a radio frequency module.
In order to solve the problems, the technical scheme of the invention is as follows:
an integrated package antenna comprises at least one semiconductor chip, an antenna module substrate, an aluminum-silicon adapter plate and a radio frequency module substrate, wherein the antenna module substrate, the aluminum-silicon adapter plate and the radio frequency module substrate are sequentially laminated from top to bottom:
the antenna module substrate comprises an antenna layer LCP substrate, an antenna pattern layer and an antenna grounding layer, wherein the antenna pattern layer and the antenna grounding layer are respectively arranged on the top surface and the bottom surface of the antenna layer LCP substrate;
the radio frequency module substrate comprises a radio frequency layer LCP matrix, a radio frequency grounding layer and a radio frequency transmission wiring layer, wherein the radio frequency grounding layer and the radio frequency transmission wiring layer are respectively arranged on the top surface and the bottom surface of the radio frequency layer LCP matrix;
a plurality of first interconnection conductors are arranged between the antenna grounding layer and the radio frequency grounding layer for electrical interconnection, and a plurality of second interconnection conductors are arranged between the antenna pattern layer and the radio frequency transmission wiring layer for electrical interconnection;
the semiconductor chip is attached to one side of the radio frequency module substrate and electrically connected with the radio frequency transmission wiring layer.
Preferably:
a plurality of through columns are processed at the electrically interconnected positions of the aluminum-silicon adapter plate, and glass slurry is filled at the peripheries of the through columns;
a plurality of first upper metal columns penetrating through the first connecting layer are arranged at positions of the first connecting layer corresponding to the through columns, a plurality of first lower metal columns which correspond to the first upper metal columns in position and penetrate through the second connecting layer are arranged on the second connecting layer, and the first upper metal columns, the through columns and the first lower metal columns form the first interconnection conductors;
the antenna module substrate with lead to the corresponding department in post position and be provided with a plurality of link up metal post on the second of antenna module substrate, be provided with on the radio frequency module substrate a plurality of with metal post position corresponds on the second and link up metal post under the second of radio frequency module substrate, metal post on the second lead to the post with metal post constitutes under the second the second interconnection conductor.
Preferably, conductive paste is arranged between the first upper metal column and the through column, between the through column and the first lower metal column, between the second upper metal column and the through column, and between the through column and the second lower metal column.
Preferably, the conductive paste is a nano silver paste or a nano copper paste.
Preferably, the semiconductor chip comprises a wire-bond chip and/or a flip-chip bond chip.
Preferably:
a chip embedding groove penetrating through the radio frequency module substrate is formed in the radio frequency module substrate, the lead bonding chip is arranged in the chip embedding groove and attached to the lower surface of the aluminum-silicon adapter plate, and the lead bonding chip is electrically connected with the radio frequency transmission wiring layer by adopting a bonding lead; and/or
The flip chip is attached to the radio frequency transmission wiring layer through a solder ball.
Preferably, the material of the aluminum-silicon adapter plate is Al30Si70.
Based on the same inventive concept, the invention also provides a packaging method of the integrated packaging antenna, which comprises the following steps:
s1: providing an aluminum-silicon adapter plate, wherein a plurality of through columns are processed at the electrically interconnected positions of the aluminum-silicon adapter plate, and glass slurry is filled at the peripheries of the through columns;
s2: providing two LCP substrates, photoetching the upper side surface and the lower side surface of the LCP substrates to obtain wiring substrates, and defining the two wiring substrates as an antenna module substrate and a radio frequency module substrate respectively, wherein the antenna module substrate comprises an antenna layer LCP matrix, an antenna pattern layer and an antenna grounding layer which are arranged on the top surface and the bottom surface of the antenna layer LCP matrix respectively, and the radio frequency module substrate comprises a radio frequency layer LCP matrix, a radio frequency grounding layer and a radio frequency transmission wiring layer which are arranged on the top surface and the bottom surface of the radio frequency layer LCP matrix respectively;
s3: mounting a first connecting layer on the bottom surface of the antenna grounding layer, performing pre-curing and laminating, and mounting a second connecting layer on the top surface of the radio frequency grounding layer, performing pre-curing and laminating;
s4: forming a chip embedding groove penetrating through the radio frequency module substrate on the radio frequency module substrate by adopting laser processing;
s5: processing a plurality of first upper blind holes penetrating through the first connecting layer, a plurality of first lower blind holes penetrating through the second connecting layer, a plurality of first upper through holes penetrating through the antenna module substrate, and a plurality of first lower through holes penetrating through the radio frequency module substrate, and metallizing the first upper blind holes, the first lower blind holes, the first upper through holes, and the first lower through holes to respectively form a first upper metal column, a first lower metal column, a second upper metal column, and a second lower metal column;
s6: coating conductive paste on the upper and lower surfaces of the through column, and performing alignment lamination on the antenna module substrate, the aluminum-silicon adapter plate and the radio frequency module substrate from top to bottom, wherein the first upper metal column, the through column and the first lower metal column are aligned, and the second upper metal column, the through column and the second lower metal column are aligned;
s7: and placing a lead bonding chip in the chip embedding groove, attaching the lead bonding chip to the lower surface of the aluminum-silicon adapter plate, and electrically connecting the lead bonding chip with the radio frequency transmission wiring layer through a bonding lead.
Preferably, the step S1 further includes:
s11: providing an aluminum-silicon substrate;
s12: ablating the periphery of the electrical interconnection part of the aluminum-silicon substrate by laser to obtain the through column for electrical interconnection and a groove surrounding the through column, wherein the depth of the groove is smaller than the thickness of the aluminum-silicon substrate;
s13: filling glass slurry in the groove and sintering;
s14: and thinning and polishing the lower surface of the aluminum-silicon substrate until the depth of the groove is consistent with the thickness of the aluminum-silicon substrate, so as to obtain the aluminum-silicon adapter plate.
Preferably, when performing the pre-curing in step S3, specifically, when the first connection layer is mounted on the bottom surface of the antenna ground layer, the antenna ground layer and the first connection layer are heated on a heating table at 130-150 ℃ for 30S to achieve the pre-curing, and when the second connection layer is mounted on the top surface of the radio frequency ground layer, the radio frequency ground layer and the second connection layer are heated on a heating table at 130-150 ℃ for 30S to achieve the pre-curing.
Preferably, in the step S6, during the lamination, specifically, the lamination is performed in vacuum, the lamination temperature is 180 to 220 ℃, and the pressure is 300psi.
Preferably, in step S4, the laser processing uses an all-solid-state ultraviolet laser with a wavelength of 355 nm.
Based on the same inventive concept, the invention also provides a packaging method of the integrated packaging antenna, which comprises the following steps:
a1: providing an aluminum-silicon adapter plate, wherein a plurality of through columns are processed at the electrically interconnected positions of the aluminum-silicon adapter plate, and glass slurry is filled at the peripheries of the through columns;
a2: providing two LCP substrates, photoetching the upper side surface and the lower side surface of the LCP substrates to obtain wiring substrates, and defining the two wiring substrates as an antenna module substrate and a radio frequency module substrate respectively, wherein the antenna module substrate comprises an antenna layer LCP matrix, an antenna pattern layer and an antenna grounding layer which are arranged on the top surface and the bottom surface of the antenna layer LCP matrix respectively, and the radio frequency module substrate comprises a radio frequency layer LCP matrix, a radio frequency grounding layer and a radio frequency transmission wiring layer which are arranged on the top surface and the bottom surface of the radio frequency layer LCP matrix respectively;
a3: mounting a first connecting layer on the bottom surface of the antenna grounding layer, performing pre-curing and laminating, and mounting a second connecting layer on the top surface of the radio frequency grounding layer, performing pre-curing and laminating;
a4: processing a plurality of first upper blind holes penetrating through the first connecting layer, a plurality of first lower blind holes penetrating through the second connecting layer, a plurality of first upper through holes penetrating through the antenna module substrate, and a plurality of first lower through holes penetrating through the radio frequency module substrate, and metallizing the first upper blind holes, the first lower blind holes, the first upper through holes, and the first lower through holes to respectively form a first upper metal column, a first lower metal column, a second upper metal column, and a second lower metal column;
a5: coating conductive paste on the upper and lower surfaces of the through post, and carrying out contraposition lamination on the antenna module substrate, the aluminum-silicon adapter plate and the radio frequency module substrate from top to bottom, wherein the first upper metal post, the through post and the first lower metal post are contrapositioned, and the second upper metal post, the through post and the second lower metal post are contrapositioned;
a6: and attaching a flip chip to the radio frequency transmission wiring layer through a solder ball.
Preferably, the step A1 further comprises:
a11: providing an aluminum-silicon substrate;
a12: ablating the periphery of the electrical interconnection part of the aluminum-silicon substrate by laser to obtain the through column for electrical interconnection and a groove surrounding the through column, wherein the depth of the groove is smaller than the thickness of the aluminum-silicon substrate;
a13: filling glass slurry in the groove and sintering;
a14: and thinning and polishing the lower surface of the aluminum-silicon substrate until the depth of the groove is consistent with the thickness of the aluminum-silicon substrate, so as to obtain the aluminum-silicon adapter plate.
Preferably, when performing the pre-curing in step A3, specifically, when the first connection layer is attached to the bottom surface of the antenna ground layer, the antenna ground layer and the first connection layer are pre-cured by heating on a heating table at 130-150 ℃ for 30s, and when the second connection layer is attached to the top surface of the rf ground layer, the rf ground layer and the second connection layer are pre-cured by heating on a heating table at 130-150 ℃ for 30 s.
Preferably, the lamination in the step A5 is performed in vacuum, and the lamination temperature is 180 to 220 ℃ and the pressure is 300psi.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects:
1) The invention provides an integrated packaging antenna, which comprises at least one semiconductor chip, an antenna module substrate, an aluminum-silicon adapter plate and a radio frequency module substrate, wherein the antenna module substrate, the aluminum-silicon adapter plate and the radio frequency module substrate are sequentially laminated from top to bottom, the antenna module substrate comprises an antenna layer LCP (liquid Crystal Polymer) substrate, and an antenna pattern layer and an antenna grounding layer which are respectively arranged on the top surface and the bottom surface of the antenna layer LCP substrate, and the radio frequency module substrate comprises a radio frequency layer LCP substrate, and a radio frequency grounding layer and a radio frequency transmission wiring layer which are respectively arranged on the top surface and the bottom surface of the radio frequency layer LCP substrate.
Drawings
Fig. 1 is a schematic structural diagram of an integrated package antenna based on a wire-bonded chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a flip chip-based integrated package antenna according to an embodiment of the present invention;
fig. 3 is a flowchart illustrating a packaging method for an integrated package antenna according to a second embodiment of the present invention;
fig. 4 is a schematic cross-sectional view of a structure obtained in step S1 of a packaging method for an integrated package antenna according to a second embodiment of the present invention;
fig. 5 is a schematic cross-sectional view of a structure obtained in step S2 of a packaging method for an integrated package antenna according to a second embodiment of the present invention;
fig. 6 is a schematic cross-sectional view of a structure obtained in step S3 of the packaging method for an integrated package antenna according to the second embodiment of the present invention;
fig. 7 is a schematic cross-sectional view of a structure obtained in step S4 of the packaging method for an integrated package antenna according to the second embodiment of the present invention;
fig. 8 is a schematic cross-sectional view of a structure obtained in step S5 of a packaging method for an integrated package antenna according to a second embodiment of the present invention;
fig. 9-10 are schematic cross-sectional views illustrating a structure obtained in step S6 of a packaging method for an integrated package antenna according to a second embodiment of the present invention;
fig. 11 is a schematic cross-sectional view of a structure obtained in step S7 of the packaging method for an integrated package antenna according to the second embodiment of the present invention;
fig. 12 is a flowchart illustrating a method for packaging an integrated package antenna according to a third embodiment of the present invention;
fig. 13 is a schematic cross-sectional view of a structure obtained in step A2 of a packaging method for an integrated package antenna according to a third embodiment of the present invention;
fig. 14 is a schematic cross-sectional view of a structure obtained in step A3 of a packaging method for an integrated package antenna according to a third embodiment of the present invention;
fig. 15 is a schematic cross-sectional view of a structure obtained in step A4 of a packaging method for an integrated package antenna according to a third embodiment of the present invention;
fig. 16-17 are schematic cross-sectional views of structures obtained in step A5 of a packaging method for an integrated package antenna according to a third embodiment of the present invention;
fig. 18 is a schematic cross-sectional view of a structure obtained in step A6 of a packaging method for an integrated package antenna according to a third embodiment of the present invention;
description of reference numerals:
100: an antenna module substrate; 101: an antenna layer LCP substrate; 102: an antenna pattern layer; 103: an antenna ground plane; 104: a first tie layer; 105: a first upper metal pillar; 106: a second upper metal pillar; 200: an aluminum-silicon adapter plate; 201: passing through a column; 202: glass paste; 300: a radio frequency module substrate; 301: a radio frequency layer LCP matrix; 302: a radio frequency ground plane; 303: a radio frequency transmission wiring layer; 304: a second connection layer; 305: a first lower metal pillar; 306: a second lower metal pillar; 307: a chip embedding slot; 308: laser penetrates through the hole; 400: a first interconnection conductor; 500: a second interconnection conductor; 601: a wire bonding chip; 602: flip chip bonding of the chip; 700: conductive paste; 800: bonding a lead; 900: and (7) solder balls.
Detailed Description
The integrated package antenna and the packaging method thereof according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims.
Example one
Referring to fig. 1 to 2, the present embodiment provides an integrated package antenna, which includes at least one semiconductor chip, and an antenna module substrate 100, an aluminum-silicon interposer 200, and a radio frequency module substrate 300 laminated in sequence from top to bottom:
the aluminum-silicon adapter plate 200 is made of Al30Si70, the aluminum-silicon adapter plate 200 is placed between the antenna module substrate 100 and the radio frequency module substrate 300 to provide mechanical support and electrical interconnection, and the aluminum-silicon adapter plate has the advantages of high heat dissipation, low thermal expansion coefficient and high strength, and compared with a traditional silicon adapter plate or an LTCC substrate, the cost can be reduced, and the heat dissipation is improved.
The antenna module substrate 100 includes an antenna layer LCP substrate 101, and an antenna pattern layer 102 and an antenna ground layer 103 respectively disposed on a top surface and a bottom surface of the antenna layer LCP substrate 101, the bottom surface of the antenna ground layer 103 is further covered with a first connection layer 104, and the antenna module substrate 100 is placed above the aluminum-silicon interposer 200 to radiate a signal to the outside.
The rf module substrate 300 includes an rf layer LCP substrate 301, and an rf grounding layer 302 and an rf transmission wiring layer 303 respectively disposed on the top surface and the bottom surface of the rf layer LCP substrate 301, and the top surface of the rf grounding layer 302 is further covered with a second connection layer 304.
A plurality of first interconnection conductors 400 are arranged between the antenna grounding layer 103 and the radio frequency grounding layer 302 for electrical interconnection, and a plurality of second interconnection conductors 500 are arranged between the antenna pattern layer 102 and the radio frequency transmission wiring layer 303 for electrical interconnection;
in the present embodiment, the aluminum-silicon interposer 200 is processed with a plurality of through pillars 201 at the positions where the aluminum-silicon interposer 200 is electrically interconnected, in the present embodiment, four through pillars 201 are processed on the aluminum-silicon interposer 200 and run through from top to bottom, and the peripheries of the through pillars 201 are filled with the glass paste 202;
a plurality of first upper metal columns 105 penetrating through the first connection layer 104 are arranged at positions corresponding to the through columns 201 of the first connection layer 104, in this embodiment, two first upper metal columns 105 are arranged on the first connection layer 104, the two first upper metal columns 105 respectively correspond to positions of the through columns 201 at outermost sides of the left side and the right side, a plurality of first lower metal columns 305 corresponding to positions of the first upper metal columns 105 and penetrating through the second connection layer 304 are arranged on the second connection layer 304, the first upper metal columns 105, the through columns 201 and the first lower metal columns 305 form a first interconnection conductor 400, preferably, when the antenna module substrate 100, the aluminum-silicon adapter plate 200 and the radio frequency module substrate 300 are laminated in an aligned manner, conductive paste 700 is coated on upper and lower surfaces of the through columns 201, and further, a conductive paste layer is arranged between the first upper metal columns 105 and the through columns 201, and between the through columns 201 and the first lower metal columns 305, and the conductive paste 700 is preferably nano silver paste or nano copper paste;
in this embodiment, two second upper metal pillars 106 penetrating through the antenna module substrate 100 are disposed at positions corresponding to the through pillars 201 of the antenna module substrate 100, the two second upper metal pillars 106 correspond to the middle two through pillars 201, respectively, a plurality of second lower metal pillars 306 penetrating through the rf module substrate 300 are disposed on the rf module substrate 300, the second upper metal pillars 106, the through pillars 201, and the second lower metal pillars 306 correspond to the second upper metal pillars 106, and preferably, when the antenna module substrate 100, the aluminum-silicon interposer 200, and the rf module substrate 300 are laminated, the conductive paste 700 is coated on upper and lower surfaces of the through pillars 201, and further, conductive paste is disposed between the second upper metal pillars 106 and the through pillars 201, and between the through pillars 201 and the second lower metal pillars 306, and the conductive paste 700 is preferably a nano silver paste layer or a nano copper paste layer.
The semiconductor chip is attached to one side of the radio frequency module substrate 300 and electrically connected with the radio frequency transmission wiring layer 303, in this embodiment, the semiconductor chip may be a wire bonding chip 601, a flip chip bonding chip 602, and may also include the wire bonding chip 601 and the flip chip bonding chip 602 at the same time, and multiple chips may be concentrated to form a multi-channel antenna array package;
referring to fig. 1, when the semiconductor chip is a wire bonding chip 601, a chip embedding groove 307 penetrating through the radio frequency module substrate 300 is formed in the radio frequency module substrate 300, the wire bonding chip 601 is disposed in the chip embedding groove 307 and attached to the lower surface of the aluminum-silicon interposer 200, and the wire bonding chip 601 is electrically connected to the radio frequency transmission wiring layer 303 by using a bonding wire 800;
referring to fig. 2, if the semiconductor chip is a flip chip 602, the flip chip 602 is directly mounted on the rf transmission wiring layer 303 through the solder balls 900
In the millimeter wave frequency band, because the effective size of the antenna is greatly reduced, the design of the millimeter wave antenna needs to be changed from the traditional separation design to the antenna and system cooperative design, the millimeter wave antenna is not only favorable for reducing the system size, the system integration level is improved, the interconnection loss of the antenna and the system can be reduced, the embodiment provides the integrated packaging antenna based on the aluminum-silicon adapter plate and the LCP substrate, the LCP substrate with high frequency stability and low loss is used for wiring the antenna and a radio frequency module, the aluminum-silicon adapter plate is used for heat dissipation and electrical interconnection, the problems that the common adapter plate is poor in heat dissipation and cannot serve as a mechanical support are solved, the structural function integration of the substrate and the shell is realized, and the integration of the antenna module and the radio frequency module is obtained, the miniaturization and the light-weight packaging are realized.
Example two
Referring to fig. 3 to fig. 11, based on the same inventive concept, the present embodiment provides a packaging method of an integrated package antenna, including the following steps:
s1: referring to fig. 4, an aluminum-silicon interposer 200 is provided, the aluminum-silicon interposer 200 is provided with a plurality of through pillars 201 at positions where electrical interconnection is performed, the peripheries of the through pillars 201 are filled with glass paste 202, in this embodiment, the aluminum-silicon interposer 200 is made of Al30Si70, and the thickness of the aluminum-silicon interposer 200 is 0.1 to 1mm;
in this embodiment, the step S1 specifically includes the following steps:
s11: providing an aluminum-silicon substrate;
s12: ablating the periphery of the electrical interconnection part of the aluminum-silicon substrate by laser to obtain a through column for electrical interconnection and a groove surrounding the through column, wherein the depth of the groove is smaller than the thickness of the aluminum-silicon substrate, namely after the laser ablation is finished, the through column is still interconnected with the bottom of the aluminum-silicon substrate to ensure that the through column cannot fall off;
s13: filling glass slurry in the groove and sintering, and realizing insulation between the through column and the substrate through sintered glass;
s14: and thinning and polishing the lower surface of the aluminum-silicon substrate until the depth of the groove is consistent with the thickness of the aluminum-silicon substrate, namely removing the connecting part of the through column and the substrate to obtain the aluminum-silicon adapter plate 200.
S2: providing two LCP substrates, wherein the thickness of each LCP substrate is 100 microns, copper is coated on two sides, the thickness of each LCP substrate and the thickness of each copper layer can be selected according to requirements, the LCP substrates are cut into circles according to the size of a laminating tool, and the LCP substrates are cleaned by a chemical method to remove oil stains and impurities on the surfaces;
referring to fig. 5, the upper and lower sides of the LCP substrate are lithographically formed to obtain wiring substrates, the two wiring substrates are respectively defined as an antenna module substrate 100 and a radio frequency module substrate 300, the antenna module substrate 100 includes an intermediate antenna layer LCP matrix 101, and an antenna pattern layer 102 and an antenna ground layer 103 respectively disposed on the top surface and the bottom surface of the antenna layer LCP matrix 101, the radio frequency module substrate 300 includes an intermediate radio frequency layer LCP matrix 301, and a radio frequency ground layer 302 and a radio frequency transmission wiring layer 303 respectively disposed on the top surface and the bottom surface of the radio frequency layer LCP matrix 301, in this embodiment, the circuit patterns of the antenna pattern layer 102, the antenna ground layer 103, the radio frequency ground layer 302 and the radio frequency transmission wiring layer 303 can be obtained by means of lithography corrosion, or by means of sputtering a copper layer;
s3: referring to fig. 6, a first connection layer 104 is mounted on the bottom surface of the antenna ground layer 103 and is pre-cured and laminated, and a second connection layer 304 is mounted on the top surface of the rf ground layer 302 and is pre-cured and laminated, in this embodiment, when pre-curing is performed, specifically, when the first connection layer 104 is mounted on the bottom surface of the antenna ground layer 103, the antenna ground layer 103 and the first connection layer 104 are pre-cured by heating on a heating table at 130-150 ℃ for 30s, and when the second connection layer 304 is mounted on the top surface of the rf ground layer 302, the rf ground layer 302 and the second connection layer 304 are pre-cured by heating on a heating table at 130-150 ℃ for 30 s;
s4: referring to fig. 7, a chip embedding groove 307 penetrating through the rf module substrate 300 is formed on the rf module substrate 300 by laser processing, and in this embodiment, the chip embedding groove 307 is processed by an all-solid-state ultraviolet laser having a wavelength of 355 nm;
s5: referring to fig. 8, processing a plurality of first upper blind holes penetrating through the first connection layer 104, a plurality of first lower blind holes penetrating through the second connection layer 304, a plurality of first upper through holes penetrating through the antenna module substrate 100, and a plurality of first lower through holes penetrating through the radio frequency module substrate 300, and metallizing the first upper blind holes, the first lower blind holes, the first upper through holes, and the first lower through holes to respectively form first upper metal pillars 105, first lower metal pillars 305, second upper metal pillars 106, and second lower metal pillars 306, wherein when processing the through holes, laser energy can simultaneously ablate metal materials such as LCP materials and copper, when processing the blind holes, laser energy can only ablate LCP materials, which are insufficient to ablate, a Ti seed layer is sputtered in the laser-processed through holes and blind holes, and then the plated gold is thickened, and metallizing of the through holes and blind holes is performed, and the metallizing method can also sputter a copper seed layer first, and then plate copper;
s6: referring to fig. 9, the upper and lower surfaces of the via 201 are coated with a conductive paste 700, and the conductive paste 700 is preferably a nano silver paste or a nano copper paste, and the coverage area during coating is slightly larger than the area of the via 201 to ensure the interconnection between the via 201 and the upper and lower metal pillars, but the overflow area cannot be too large, and if the overflow area is too large, the conductive paste will short-circuit the substrate; referring to fig. 10, the antenna module substrate 100, the aluminum-silicon interposer 200, and the rf module substrate 300 are laminated from top to bottom, specifically, laminated in vacuum at a temperature of 180 to 220 ℃ and a pressure of 300psi, the first upper metal pillar 105, the through pillar 201, and the first lower metal pillar 305 are aligned, and the second upper metal pillar 106, the through pillar 201, and the second lower metal pillar 306 are aligned;
s7: referring to fig. 11, a wire bonding chip 601 is placed in the chip embedding groove 307, the wire bonding chip 601 is attached to the lower surface of the aluminum-silicon interposer 200, the wire bonding chip 601 is electrically connected to the radio frequency transmission wiring layer 303 through a bonding wire 800, and the chip is electrically connected to the metallization wiring by the bonding wire 800.
EXAMPLE III
Referring to fig. 12 to 18, based on the same inventive concept, the present embodiment further provides a packaging method of an integrated package antenna, including the following steps:
a1: providing an aluminum-silicon adapter plate 200, wherein a plurality of through columns 201 are processed at the positions of electrical interconnection of the aluminum-silicon adapter plate 200, and glass slurry 202 is filled at the peripheries of the through columns 201, in the embodiment, the aluminum-silicon adapter plate 200 is made of Al30Si70, and the thickness of the aluminum-silicon adapter plate 200 is 0.1-1 mm;
in this embodiment, the step A1 specifically includes the following steps:
a11: providing an aluminum-silicon substrate;
a12: ablating the periphery of the electrical interconnection part of the aluminum-silicon substrate by laser to obtain a through column for electrical interconnection and a groove surrounding the through column, wherein the depth of the groove is smaller than the thickness of the aluminum-silicon substrate, namely after the laser ablation is finished, the through column is still interconnected with the bottom of the aluminum-silicon substrate to ensure that the through column cannot fall off;
a13: filling glass slurry in the groove and sintering, and realizing insulation between the through column and the substrate through sintered glass;
a14: and thinning and polishing the lower surface of the aluminum-silicon substrate until the depth of the groove is consistent with the thickness of the aluminum-silicon substrate, namely removing the connecting part of the through column and the substrate to obtain the aluminum-silicon adapter plate 200.
A2: providing two LCP substrates, wherein the thickness of the LCP substrates is 100 microns, copper is coated on two sides, the thickness of the LCP substrates and the thickness of a copper layer can be selected according to requirements, the LCP substrates are cut into circles according to the size of a laminating tool, the LCP substrates are cleaned by a chemical method, and oil stains and impurities on the surfaces of the LCP substrates are removed;
referring to fig. 13, the upper and lower sides of the LCP substrate are lithographically etched to obtain wiring substrates, the two wiring substrates are respectively defined as an antenna module substrate 100 and a radio frequency module substrate 300, the antenna module substrate 100 includes a middle antenna layer LCP matrix 101, and an antenna pattern layer 102 and an antenna ground layer 103 respectively disposed on the top surface and the bottom surface of the antenna layer LCP matrix 101, the radio frequency module substrate 300 includes a middle radio frequency layer LCP matrix 301, and a radio frequency ground layer 302 and a radio frequency transmission wiring layer 303 respectively disposed on the top surface and the bottom surface of the radio frequency layer LCP matrix 301, in this embodiment, the circuit patterns of the antenna pattern layer 102, the antenna ground layer 103, the radio frequency ground layer 302 and the radio frequency transmission wiring layer 303 can be obtained by photolithography and etching, or by removing a copper layer by sputtering a film, and at the same time, a laser transmission hole 308 is formed on the radio frequency transmission wiring layer 303 at the position of a welding chip by laser;
a3: referring to fig. 14, the first connection layer 104 is mounted on the bottom surface of the antenna ground layer 103 and is pre-cured and laminated, and the second connection layer 304 is mounted on the top surface of the rf ground layer 302 and is pre-cured and laminated, in this embodiment, when pre-curing is performed, specifically, when the first connection layer 104 is mounted on the bottom surface of the antenna ground layer 103, the antenna ground layer 103 and the first connection layer 104 are pre-cured by heating on a heating table at 130-150 ℃ for 30s, and when the second connection layer 304 is mounted on the top surface of the rf ground layer 302, the rf ground layer 302 and the second connection layer 304 are pre-cured by heating on a heating table at 130-150 ℃ for 30 s;
a4: referring to fig. 15, a plurality of first upper blind holes penetrating through the first connection layer 104, a plurality of first lower blind holes penetrating through the second connection layer 304, a plurality of first upper through holes penetrating through the antenna module substrate 100, and a plurality of first lower through holes penetrating through the rf module substrate 300 are processed, and the first upper blind holes, the first lower blind holes, the first upper through holes, and the first lower through holes are metalized to respectively form a first upper metal pillar 105, a first lower metal pillar 305, a second upper metal pillar 106, and a second lower metal pillar 306, when the through holes are processed, the laser energy can simultaneously ablate the LCP material and the metal material such as copper, when the blind holes are processed, the laser energy can only ablate the LCP material and is not enough to ablate the metal material such as copper, a Ti seed layer is sputtered in the laser processed through holes and blind holes, then the gold is electroplated, the metallization of the through holes and blind holes is performed, and the metallization of the through holes and blind holes can also be sputtered with a copper seed layer first, and then electroplated with copper and nickel;
a5: referring to fig. 16, the upper and lower surfaces of the through pillar 201 are coated with a conductive paste 700, and the conductive paste 700 is preferably a nano silver paste or a nano copper paste, and the coverage area during coating is slightly larger than the area of the through pillar 201 to ensure the interconnection between the through pillar 201 and the upper and lower metal pillars, but the overflow area cannot be too large, and if the overflow area is too large, the conductive paste will short-circuit with the substrate; referring to fig. 17, the antenna module substrate 100, the aluminum-silicon interposer 200, and the rf module substrate 300 are laminated from top to bottom, specifically, laminated in vacuum at a temperature of 180 to 220 ℃ and a pressure of 300psi, the first upper metal pillar 105, the through pillar 201, and the first lower metal pillar 305 are aligned, and the second upper metal pillar 106, the through pillar 201, and the second lower metal pillar 306 are aligned;
a6: referring to fig. 18, flip chip 602 is attached to rf transmission wiring layer 303 via solder balls 900, and the chip is electrically connected to the metallization wiring using solder balls 900.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is still within the scope of the present invention if they fall within the scope of the claims of the present invention and their equivalents.

Claims (15)

1. An integrated package antenna, comprising at least one semiconductor chip, and an antenna module substrate, an aluminum-silicon adapter plate and a radio frequency module substrate laminated in sequence from top to bottom:
the antenna module substrate comprises an antenna layer LCP substrate, an antenna pattern layer and an antenna grounding layer, wherein the antenna pattern layer and the antenna grounding layer are respectively arranged on the top surface and the bottom surface of the antenna layer LCP substrate;
the radio frequency module substrate comprises a radio frequency layer LCP matrix, a radio frequency grounding layer and a radio frequency transmission wiring layer, wherein the radio frequency grounding layer and the radio frequency transmission wiring layer are respectively arranged on the top surface and the bottom surface of the radio frequency layer LCP matrix;
a plurality of first interconnection conductors are arranged between the antenna grounding layer and the radio frequency grounding layer for electrical interconnection, and a plurality of second interconnection conductors are arranged between the antenna pattern layer and the radio frequency transmission wiring layer for electrical interconnection;
the semiconductor chip is attached to one side of the radio frequency module substrate and electrically connected with the radio frequency transmission wiring layer;
a plurality of through columns are processed at the electrically interconnected positions of the aluminum-silicon adapter plate, and glass slurry is filled at the peripheries of the through columns;
a plurality of first upper metal columns penetrating through the first connecting layer are arranged at positions of the first connecting layer corresponding to the through columns, a plurality of first lower metal columns which correspond to the first upper metal columns in position and penetrate through the second connecting layer are arranged on the second connecting layer, and the first upper metal columns, the through columns and the first lower metal columns form the first interconnection conductor;
the antenna module substrate with lead to the corresponding department in post position and be provided with a plurality of link up metal post on the second of antenna module substrate, be provided with on the radio frequency module substrate a plurality of with metal post position corresponds on the second and link up metal post under the second of radio frequency module substrate, metal post on the second lead to the post with metal post constitutes under the second the second interconnection conductor.
2. The integrated package antenna of claim 1, wherein conductive paste is disposed between the first upper metal pillar and the through pillar, between the through pillar and the first lower metal pillar, between the second upper metal pillar and the through pillar, and between the through pillar and the second lower metal pillar.
3. The integrated package antenna of claim 2, wherein the conductive paste is a nano silver paste or a nano copper paste.
4. The integrated package antenna of claim 1, wherein the semiconductor chip comprises a wire-bond chip and/or a flip-chip bond chip.
5. The integrated package antenna of claim 4, wherein:
a chip embedding groove penetrating through the radio frequency module substrate is formed in the radio frequency module substrate, the lead bonding chip is arranged in the chip embedding groove and attached to the lower surface of the aluminum-silicon adapter plate, and the lead bonding chip is electrically connected with the radio frequency transmission wiring layer by adopting a bonding lead; and/or
The flip chip is attached to the radio frequency transmission wiring layer through a solder ball.
6. The integrated package antenna of claim 1, wherein the aluminum-silicon interposer is selected from Al30Si70.
7. A packaging method for an integrated package antenna is characterized by comprising the following steps:
s1: providing an aluminum-silicon adapter plate, wherein a plurality of through columns are processed at the electrically interconnected positions of the aluminum-silicon adapter plate, and glass slurry is filled at the peripheries of the through columns;
s2: providing two LCP substrates, photoetching the upper side surface and the lower side surface of the LCP substrates to obtain wiring substrates, and defining the two wiring substrates as an antenna module substrate and a radio frequency module substrate respectively, wherein the antenna module substrate comprises an antenna layer LCP matrix, an antenna pattern layer and an antenna grounding layer which are arranged on the top surface and the bottom surface of the antenna layer LCP matrix respectively, and the radio frequency module substrate comprises a radio frequency layer LCP matrix, a radio frequency grounding layer and a radio frequency transmission wiring layer which are arranged on the top surface and the bottom surface of the radio frequency layer LCP matrix respectively;
s3: mounting a first connecting layer on the bottom surface of the antenna grounding layer, performing pre-curing and laminating, and mounting a second connecting layer on the top surface of the radio frequency grounding layer, performing pre-curing and laminating;
s4: forming a chip embedding groove penetrating through the radio frequency module substrate on the radio frequency module substrate by adopting laser processing;
s5: processing a plurality of first upper blind holes penetrating through the first connecting layer, a plurality of first lower blind holes penetrating through the second connecting layer, a plurality of first upper through holes penetrating through the antenna module substrate, and a plurality of first lower through holes penetrating through the radio frequency module substrate, and metallizing the first upper blind holes, the first lower blind holes, the first upper through holes, and the first lower through holes to respectively form a first upper metal column, a first lower metal column, a second upper metal column, and a second lower metal column;
s6: coating conductive paste on the upper and lower surfaces of the through column, and performing alignment lamination on the antenna module substrate, the aluminum-silicon adapter plate and the radio frequency module substrate from top to bottom, wherein the first upper metal column, the through column and the first lower metal column are aligned, and the second upper metal column, the through column and the second lower metal column are aligned;
s7: and placing a lead bonding chip in the chip embedding groove, attaching the lead bonding chip to the lower surface of the aluminum-silicon adapter plate, and electrically connecting the lead bonding chip with the radio frequency transmission wiring layer through a bonding lead.
8. The integrated package antenna packaging method of claim 7, wherein the step S1 further comprises:
s11: providing an aluminum-silicon substrate;
s12: ablating the periphery of the electrical interconnection part of the aluminum-silicon substrate by laser to obtain the through column for electrical interconnection and a groove surrounding the through column, wherein the depth of the groove is smaller than the thickness of the aluminum-silicon substrate;
s13: filling glass slurry in the groove and sintering;
s14: and thinning and polishing the lower surface of the aluminum-silicon substrate until the depth of the groove is consistent with the thickness of the aluminum-silicon substrate, so as to obtain the aluminum-silicon adapter plate.
9. The method for packaging an integrated package antenna of claim 7, wherein during the pre-curing in step S3, specifically, during the mounting of the first connection layer on the bottom surface of the antenna ground layer, the antenna ground layer and the first connection layer are pre-cured by heating the antenna ground layer on a heating table at 130-150 ℃ for 30S, and during the mounting of the second connection layer on the top surface of the rf ground layer, the rf ground layer and the second connection layer are pre-cured by heating the antenna ground layer on a heating table at 130-150 ℃ for 30S.
10. The method for packaging an integrated package antenna according to claim 7, wherein the step S6 is performed in vacuum during the lamination, and the lamination temperature is 180-220 ℃ and the pressure is 300psi.
11. The method for packaging an integrated package antenna of claim 7, wherein in the step S4, the laser processing is performed by using an all-solid-state UV laser with a wavelength of 355 nm.
12. A packaging method for an integrated packaging antenna is characterized by comprising the following steps:
a1: providing an aluminum-silicon adapter plate, wherein a plurality of through columns are processed at the electrically interconnected positions of the aluminum-silicon adapter plate, and glass slurry is filled at the peripheries of the through columns;
a2: providing two LCP substrates, photoetching the upper side surface and the lower side surface of the LCP substrates to obtain wiring substrates, and defining the two wiring substrates as an antenna module substrate and a radio frequency module substrate respectively, wherein the antenna module substrate comprises an antenna layer LCP matrix, an antenna pattern layer and an antenna grounding layer which are arranged on the top surface and the bottom surface of the antenna layer LCP matrix respectively, and the radio frequency module substrate comprises a radio frequency layer LCP matrix, a radio frequency grounding layer and a radio frequency transmission wiring layer which are arranged on the top surface and the bottom surface of the radio frequency layer LCP matrix respectively;
a3: mounting a first connecting layer on the bottom surface of the antenna grounding layer, performing pre-curing and laminating, and mounting a second connecting layer on the top surface of the radio frequency grounding layer, performing pre-curing and laminating;
a4: processing a plurality of first upper blind holes penetrating through the first connecting layer, a plurality of first lower blind holes penetrating through the second connecting layer, a plurality of first upper through holes penetrating through the antenna module substrate, and a plurality of first lower through holes penetrating through the radio frequency module substrate, and metallizing the first upper blind holes, the first lower blind holes, the first upper through holes, and the first lower through holes to respectively form a first upper metal column, a first lower metal column, a second upper metal column, and a second lower metal column;
a5: coating conductive paste on the upper and lower surfaces of the through column, and performing alignment lamination on the antenna module substrate, the aluminum-silicon adapter plate and the radio frequency module substrate from top to bottom, wherein the first upper metal column, the through column and the first lower metal column are aligned, and the second upper metal column, the through column and the second lower metal column are aligned;
a6: and attaching a flip chip to the radio frequency transmission wiring layer through a solder ball.
13. The method for packaging an integrated package antenna according to claim 12, wherein the step A1 further comprises:
a11: providing an aluminum-silicon substrate;
a12: ablating the periphery of the electrical interconnection part of the aluminum-silicon substrate by laser to obtain the through column for electrical interconnection and a groove surrounding the through column, wherein the depth of the groove is smaller than the thickness of the aluminum-silicon substrate;
a13: filling glass slurry in the groove and sintering;
a14: and thinning and polishing the lower surface of the aluminum-silicon substrate until the depth of the groove is consistent with the thickness of the aluminum-silicon substrate, so as to obtain the aluminum-silicon adapter plate.
14. The method for packaging an integrated package antenna of claim 12, wherein during the pre-curing in step A3, specifically, during the mounting of the first connection layer on the bottom surface of the antenna ground layer, the antenna ground layer and the first connection layer are pre-cured by heating the antenna ground layer on a heating table at 130-150 ℃ for 30s, and during the mounting of the second connection layer on the top surface of the rf ground layer, the rf ground layer and the second connection layer are pre-cured by heating the antenna ground layer on a heating table at 130-150 ℃ for 30 s.
15. The method for packaging an integrated package antenna according to claim 12, wherein the step A5 is performed in a vacuum, and the lamination temperature is 180-220 ℃ and the pressure is 300psi.
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