TWM643512U - Anti-deposition object for use in vacuum environment - Google Patents

Anti-deposition object for use in vacuum environment Download PDF

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TWM643512U
TWM643512U TW112203234U TW112203234U TWM643512U TW M643512 U TWM643512 U TW M643512U TW 112203234 U TW112203234 U TW 112203234U TW 112203234 U TW112203234 U TW 112203234U TW M643512 U TWM643512 U TW M643512U
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Taiwan
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vacuum environment
coating layer
main structure
deposition
fluorine coating
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TW112203234U
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Chinese (zh)
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陳建勳
孫世源
吳旻叡
方志強
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日揚科技股份有限公司
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Priority to TW112203234U priority Critical patent/TWM643512U/en
Publication of TWM643512U publication Critical patent/TWM643512U/en

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Abstract

An anti-deposition object for use in a vacuum environment comprises a main structure and a fluorinated coating layer, wherein the fluorinated coating layer covers at least one surface of the main structure, wherein the anti-deposition object is in contact with a process material used or exhausted by a process equipment during a process in the vacuum environment, the fluorinated coating layer has a higher water droplet contact angle to the process substances than the surface of the main structure, the fluorinated coating layer has an approximate or higher hardness than the surface of the main structure, and the fluorinated coating layer has a lower roughness than the surface of the main structure. The fluorinated coating layer has a lower roughness than the surface of the main structure. The invention is used in the vacuum environment to prevent the vacuum parts from being scratched by the impact of process substances such as particles, and to achieve the effect of self-cleaning and easy cleaning, so as to reduce the costs and manpower for frequent maintenance.

Description

用於真空環境之防沉積物件Anti-deposition articles for vacuum environment

本創作是有關於一種真空用部件,特別是有關於一種用於真空環境之防沉積物件。The invention relates to a vacuum component, in particular to an anti-deposition object used in a vacuum environment.

近年來,由於半導體技術不斷地蓬勃發展,使得科技類產品得以大步躍進。在半導體晶片的製程中,晶片通常置於製程設備中以進行相關的製程作業,且搭配真空幫浦來將製程設備中的空氣或氣體抽出,使製程設備保持在負壓狀態,亦即到某種程度的真空。然而,於半導體製程中,製程氣體或製程廢氣等製程物質容易沉積或累積在流體通道中,進而導致維修周期越來越短,進而影響製造成本與時程。In recent years, due to the continuous vigorous development of semiconductor technology, technological products have made great strides. In the process of semiconductor wafers, wafers are usually placed in process equipment for related process operations, and a vacuum pump is used to extract air or gas from the process equipment to keep the process equipment in a negative pressure state, that is, to a certain degree of vacuum. However, in the semiconductor manufacturing process, process substances such as process gas or process exhaust gas are easily deposited or accumulated in the fluid channel, which leads to shorter and shorter maintenance cycles, thereby affecting manufacturing costs and schedules.

有鑑於此,本創作之一目的就是在提供一種用於真空環境之防沉積物件,以解決上述習知技藝之問題。In view of this, one purpose of this creation is to provide an anti-deposition object used in a vacuum environment to solve the above-mentioned problems in the prior art.

為達前述目的,本創作提出一種用於真空環境之防沉積物件,包含:一主體結構,具有至少一表面;以及一氟素鍍膜層,覆蓋於該主體結構之該表面上,其中該防沉積物件於一真空環境中接觸一製程設備進行一製程時所使用或排放之一製程物質,且該氟素鍍膜層相較於該主體結構之該表面對該製程物質具有較高之一水滴接觸角,該氟素鍍膜層相較於該主體結構之該表面具有近似或較高之一硬度,並且該氟素鍍膜層相較於該主體結構之該表面具有較低之一粗糙度。In order to achieve the aforementioned purpose, the invention proposes an anti-deposition object used in a vacuum environment, comprising: a main structure having at least one surface; and a fluorine coating layer covering the surface of the main structure, wherein the anti-deposition object contacts a process substance used or discharged when a process equipment performs a process in a vacuum environment, and the fluorine coating layer has a higher water droplet contact angle for the process substance than the surface of the main structure, and the fluorine coating layer has a higher water droplet contact angle than the surface of the main structure The hardness is similar to or higher, and the fluorine coating layer has a lower roughness than the surface of the main structure.

其中,該主體結構為該製程設備之一出口管件或該製程設備之一週邊設備之管件或部件。Wherein, the main structure is an outlet pipe of the process equipment or a pipe or part of a peripheral equipment of the process equipment.

其中,該氟素鍍膜層係位於該主體結構之一部位之該表面上,該部位為該主體結構之一傾斜部位、一平面部位或一彎曲部位。Wherein, the fluorine coating layer is located on the surface of a part of the main structure, and the part is an inclined part, a plane part or a curved part of the main structure.

其中,該氟素鍍膜層相較於該主體結構之該表面具有較高之一抗酸腐蝕性與一抗電漿蝕刻性。Wherein, the fluorine coating layer has higher acid corrosion resistance and plasma etching resistance than the surface of the main structure.

其中,該主體結構之該表面係經過粗糙化處理而形成具有粗糙結構之粗糙表面,用以增加表面粗糙度。Wherein, the surface of the main structure is roughened to form a rough surface with a rough structure to increase surface roughness.

其中,該主體結構之該表面係經過酸洗或噴砂粗糙化處理以增加表面粗糙度。Wherein, the surface of the main structure is roughened by pickling or sandblasting to increase the surface roughness.

其中,該氟素鍍膜層之成分係由氟碳化合物(Fluoro-carbons)佔0.01~20%wt、烷氧基矽烷類佔5~50wt、催化添加物佔0.01%~20%wt及溶劑佔10~90wt所組成。Among them, the composition of the fluorine coating layer is composed of 0.01-20%wt of fluorocarbons (Fluoro-carbons), 5-50wt of alkoxysilanes, 0.01%-20%wt of catalytic additives and 10-90wt of solvents.

其中,該氟碳化合物係選自於由全氟烷(PFAS)、氟氯烴(CFC)、半氟烷(HFC)、氟聚合物(PTFE)及氫氟氯烴(HCFC)所組成之族群。主要材料由氟素、奈米鈦、矽、矽彈性體之有機/無機高分子共聚物Wherein, the fluorocarbons are selected from the group consisting of perfluoroalkanes (PFAS), fluorochlorocarbons (CFCs), hemifluoroalkanes (HFCs), fluoropolymers (PTFE) and hydrofluorochlorocarbons (HCFCs). The main material is an organic/inorganic polymer copolymer of fluorine, nano-titanium, silicon, and silicon elastomer

其中,該氟碳化合物為含有1-20個碳原子之含氟單體或聚合物。Wherein, the fluorocarbon is a fluorine-containing monomer or polymer containing 1-20 carbon atoms.

其中,該烷氧基矽烷類係選自於由烷氧基矽烷寡聚體(Alkoxylsilane Oligomer)、烷氧基矽烷化合物(Alkoxylsilane compound)、烷氧基矽烷高分子(Alkoxylsilane polymer)、烷氧基矽氧烷寡聚體(Alkoxylsiloxane Oligomer)、烷氧基矽氧烷化合物(Alkoxylsiloxane compound)、烷氧基矽氧烷高分子(Alkoxylsiloxane polymer)、烷氧基矽氮烷寡聚體(Alkoxylaminosiloxane Oligomer)、烷氧基矽氮烷化合物(Alkoxylaminosiloxane compound)及烷氧基矽氮烷高分子(Alkoxylaminosiloxane polymer)所組成之族群。Wherein, the alkoxysilanes are selected from alkoxysilane oligomer (Alkoxylsilane Oligomer), alkoxysilane compound (Alkoxylsilane compound), alkoxysilane polymer (Alkoxylsilane polymer), alkoxysiloxane oligomer (Alkoxylsiloxane Oligomer), alkoxylsiloxane compound (Alkoxylsiloxane compound), alkoxylsilane polymer (Alkoxylsil oxane polymer), alkoxylaminosiloxane oligomer, alkoxylaminosiloxane compound and alkoxylaminosiloxane polymer.

其中,該催化添加物係選自於由白金、鈦、錫、鋅、鋁、銀、鈣、鎂、鉀、鈉、鎳、鉻、鉬、釩、銅、鐵、鈷、鍺、鉿、鑭、鉛、釕、鉭、鎢、鋯之金屬、金屬氧化物、磷酸鹽及羧酸鹽所組成之族群。Wherein, the catalytic additive is selected from the group consisting of platinum, titanium, tin, zinc, aluminum, silver, calcium, magnesium, potassium, sodium, nickel, chromium, molybdenum, vanadium, copper, iron, cobalt, germanium, hafnium, lanthanum, lead, ruthenium, tantalum, tungsten, zirconium metal, metal oxide, phosphate and carboxylate.

其中,該溶劑係選自於由醇類、酮類、酯類、氟醇類、氟醚和醚類所組成之族群。Wherein, the solvent is selected from the group consisting of alcohols, ketones, esters, fluoroalcohols, fluoroethers and ethers.

其中,該烷氧基矽烷類中具有反應官能基,該反應官能基係於室溫下1至7天時間進行自縮合反應或於攝氏40至60度溫度下進行自縮合反應1至24小時。Wherein, the alkoxysilanes have reactive functional groups, and the reactive functional groups perform self-condensation reaction at room temperature for 1-7 days or at 40-60 degrees Celsius for 1-24 hours.

其中,該製程設備所進行之該製程為一原子層沉積(ALD)製程,該製程物質為四氯化鈦(TiCl 4)。 Wherein, the process performed by the process equipment is an atomic layer deposition (ALD) process, and the process substance is titanium tetrachloride (TiCl 4 ).

其中,該製程設備所進行之該製程為一有機金屬化學氣相沉積(MOCVD)製程,該製程物質為製程氣體或製程廢氣。Wherein, the process performed by the process equipment is a metal organic chemical vapor deposition (MOCVD) process, and the process substance is process gas or process waste gas.

其中,該製程設備所進行之該製程為一鋁墊(Al-pad)製程,該製程物質為製程氣體反應物或製程廢氣。Wherein, the process performed by the process equipment is an Al-pad process, and the process substance is process gas reactant or process waste gas.

其中,該氟素鍍膜層之該水滴接觸角之範圍為100度至120度。Wherein, the water droplet contact angle of the fluorine coating layer ranges from 100° to 120°.

其中,該氟素鍍膜層之耐受溫度係達到攝氏600度。Among them, the withstand temperature of the fluorine coating layer reaches 600 degrees Celsius.

其中,該氟素鍍膜層之該硬度之範圍為8H至9H。Wherein, the hardness of the fluorine coating layer ranges from 8H to 9H.

其中,該氟素鍍膜層與該主體結構之該表面之間之一附著力以百格測試所得之數值範圍為4B至5B。Wherein, the adhesion force between the fluorine coating layer and the surface of the main body structure is in the range of 4B to 5B by a 100-grid test.

承上所述,本創作之用於真空環境之防沉積物件,具有以下優點:Based on the above, the anti-deposition object used in the vacuum environment of this creation has the following advantages:

(1)藉由在真空部件上塗佈高硬度之氟素鍍膜層可防止真空部件受到微粒等製程物質撞擊而刮傷。(1) By coating the high-hardness fluorine coating layer on the vacuum parts, it can prevent the vacuum parts from being scratched by the impact of process substances such as particles.

(2)藉由在真空部件上塗佈高水滴接觸角之氟素鍍膜層可防止真空部件產生沉積現象,且可達到自清潔及易清潔之效果。(2) By coating the fluorine coating layer with a high water droplet contact angle on the vacuum parts, it can prevent the vacuum parts from depositing, and can achieve the effect of self-cleaning and easy cleaning.

(3)氟素鍍膜層對於主體結構具有良好之密著性,可避免製程中產生剝離現象。(3) The fluorine coating layer has good adhesion to the main structure, which can avoid peeling during the manufacturing process.

(4) 藉由提供具有氟素鍍膜層之防沉積物件,可節省頻繁維修的資金和人力。(4) By providing an anti-deposition object with a fluorine coating layer, it is possible to save money and manpower for frequent maintenance.

茲為使鈞審對本創作的技術特徵及所能達到的技術功效有更進一步的瞭解與認識,謹佐以較佳的實施例及配合詳細的說明如後。In order to make Jun Shen have a further understanding and understanding of the technical characteristics of this creation and the technical effects that can be achieved, I would like to accompany it with a better embodiment and a detailed description as follows.

為利瞭解本創作之技術特徵、內容與優點及其所能達成之功效,茲將本創作配合圖式,並以實施例之表達形式詳細說明如下,而其中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本創作實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係解讀、侷限本創作於實際實施上的權利範圍。此外,為使便於理解,下述實施例中的相同元件係以相同的符號標示來說明。In order to facilitate the understanding of the technical features, content and advantages of this creation and the effects it can achieve, this creation is combined with the diagrams and described in detail in the form of embodiments as follows. The purpose of the diagrams used in it is only for illustration and auxiliary instructions, and may not be the true proportion and precise configuration of this creation after implementation. Therefore, the scale and configuration relationship of the attached diagrams should not be interpreted to limit the scope of rights of this creation in actual implementation. In addition, for ease of understanding, the same elements in the following embodiments are described with the same symbols.

另外,在全篇說明書與申請專利範圍所使用的用詞,除有特別註明外,通常具有每個用詞使用在此領域中、在此揭露的內容中與特殊內容中的平常意義。某些用以描述本創作的用詞將於下或在此說明書的別處討論,以提供本領域技術人員在有關本創作的描述上額外的引導。In addition, the terms used in the entire specification and patent claims generally have the ordinary meanings of each term used in this field, in the disclosed content and in the special content, unless otherwise specified. Certain terms used to describe the invention are discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance in describing the invention.

關於本文中如使用“第一”、“第二”、“第三”、“第四”等,並非特別指稱次序或順位的意思,亦非用以限定本創作,其僅僅是為了區別以相同技術用語描述的組件或操作而已。Regarding the use of "first", "second", "third", "fourth" etc. in this article, it is not intended to specifically refer to a sequence or order, nor is it used to limit the invention, but only to distinguish components or operations described with the same technical terms.

其次,在本文中如使用用詞“包含”、“包括”、“具有”、“含有”等,其均為開放性的用語,即意指包含但不限於。Secondly, if the words "comprising", "including", "having", "containing" etc. are used in this article, they are all open terms, meaning including but not limited to.

請參閱圖1至圖6,圖1為本創作之用於真空環境之防沉積物件之局部結構示意圖。圖2為本創作之用於真空環境之防沉積物件應用於製程設備之示意圖。圖3為本創作之用於真空環境之防沉積物件之第一種實施範例之剖面結構示意圖。圖4為本創作之用於真空環境之防沉積物件之第二種實施範例之剖面結構示意圖。圖5為本創作之用於真空環境之防沉積物件之第三種實施範例之剖面結構示意圖。圖6為本創作之用於真空環境之防沉積物件之第四種實施範例之立體結構示意圖。Please refer to Fig. 1 to Fig. 6, Fig. 1 is a partial structure diagram of the anti-deposition object used in the vacuum environment of the present invention. Fig. 2 is a schematic diagram of the application of the anti-deposition object for vacuum environment in the present invention to the process equipment. Fig. 3 is a schematic cross-sectional structure diagram of the first implementation example of the anti-deposition object used in the vacuum environment of the present invention. Fig. 4 is a schematic cross-sectional structure diagram of the second implementation example of the anti-deposition object used in the vacuum environment of the present invention. Fig. 5 is a schematic cross-sectional structure diagram of a third embodiment of the anti-deposition object used in a vacuum environment according to the present invention. Fig. 6 is a three-dimensional structure diagram of the fourth implementation example of the anti-deposition object used in the vacuum environment of the present invention.

如圖1至圖6所示,本創作之用於真空環境之防沉積物件10包含主體結構20及氟素鍍膜層30,氟素鍍膜層30覆蓋主體結構20。本創作之防沉積物件10係應用於真空環境中,且於真空環境中接觸製程設備100進行製程時所使用或排放之製程物質110,其中上述之真空環境並不侷限於特定真空度,其可依據製程設備100之需求而定。氟素鍍膜層30覆蓋於主體結構20之至少一表面22上。本創作之防沉積物件10之氟素鍍膜層30可例如覆蓋於主體結構20之全部或部分表面上,例如主體結構20之一部位24之表面22上。其中,此部位24可為通常較常發生製程物質沉積之位置,例如彎曲處或傾斜處等非平面處,且例如但不限於內壁表面。因此,在本創作中,上述之部位24例如為主體結構20之彎曲部位(如圖3所示)或傾斜部位(如圖4所示),惟本創作不限於此,本創作之氟素鍍膜層30亦可覆蓋於主體結構20之平面部位(如圖5所示)上。除此之外,本創作之防沉積物件10之主體結構20例如為製程設備100之出口管(如圖3至圖5所示)或製程設備100之週邊設備(如真空抽氣幫浦)之管件(如圖3至圖5所示)或部件(如圖6之具有螺旋導流槽26之Holweck幫浦零件所示)。上述雖列舉多種防沉積物件10之主體結構20之態樣,惟本創作不限於此,所有可應用於真空環境中之物件之態樣均屬於本創作請求保護之範圍。舉例而言,本創作之防沉積物件10及其主體結構20亦可例如為真空幫浦之腔體或零組件等,例如渦輪分子式真空幫浦(TMP)之轉子葉片及/或定子葉片。舉例而言,本創作之防沉積物件10及其主體結構20亦可例如為閥門結構之腔體或零組件等。簡言之,本創作可選擇性將氟素鍍膜層30形成於所有可能會接觸製程物質110之物件之表面上。As shown in FIGS. 1 to 6 , the anti-deposition object 10 used in a vacuum environment of the present invention includes a main structure 20 and a fluorine coating layer 30 , and the fluorine coating layer 30 covers the main structure 20 . The anti-deposition object 10 of the present invention is applied in a vacuum environment, and contacts the process substance 110 used or discharged during the process of the process equipment 100 in the vacuum environment. The above-mentioned vacuum environment is not limited to a specific vacuum degree, which can be determined according to the requirements of the process equipment 100. The fluorine coating layer 30 covers at least one surface 22 of the main structure 20 . The fluorine coating layer 30 of the anti-deposition object 10 of the present invention can, for example, cover all or part of the surface of the main structure 20 , such as the surface 22 of a portion 24 of the main structure 20 . Wherein, the portion 24 may be a position where deposition of process substances usually occurs, such as non-planar places such as bends or slopes, and is for example but not limited to the surface of the inner wall. Therefore, in this invention, the above-mentioned part 24 is, for example, the curved part (as shown in FIG. 3 ) or the inclined part (as shown in FIG. 4 ) of the main structure 20, but the present invention is not limited thereto, and the fluorine coating layer 30 of the present invention can also be covered on the plane part of the main structure 20 (as shown in FIG. 5 ). In addition, the main structure 20 of the anti-deposition object 10 of the present invention is, for example, the outlet pipe of the process equipment 100 (as shown in FIGS. 3 to 5 ) or the pipe fittings (as shown in FIGS. 3 to 5 ) or parts of the peripheral equipment (such as a vacuum pump) of the process equipment 100 (as shown in FIGS. 3 to 5 ) or parts (as shown in the Holweck pump part with the spiral guide groove 26 in FIG. 6 ). Although the above-mentioned forms of the main structure 20 of various anti-deposition objects 10 are listed, this creation is not limited thereto, and all forms of objects that can be applied in a vacuum environment belong to the protection scope of this creation. For example, the anti-deposition article 10 and its main structure 20 of the present invention can also be, for example, the cavity or parts of a vacuum pump, such as the rotor blade and/or stator blade of a turbomolecular vacuum pump (TMP). For example, the anti-sedimentation article 10 and its main structure 20 of the present invention can also be, for example, a cavity or components of a valve structure. In short, the present invention can selectively form the fluorine coating layer 30 on the surfaces of all objects that may contact the process substance 110 .

本創作之用於真空環境之防沉積物件之一特色在於藉由氟素鍍膜層30覆蓋主體結構20之表面22,因此氟素鍍膜層30可代替主體結構20之表面22接觸製程設備100進行製程時所使用或排放之製程物質110。其中,氟素鍍膜層30可例如藉由塗佈方式覆蓋主體結構20之表面22,其中塗佈方式例如但不限於噴塗、刷塗、浸塗或擦塗等方式。其中,本創作可例如直接將液態(流體狀態)之氟素鍍膜層30塗佈於主體結構20之表面22上,或者是在將液態之氟素鍍膜層30塗佈於主體結構20之表面22之前,先對主體結構20之表面22進行粗糙化處理以增加表面粗糙度。粗糙化處理可例如但不限於酸洗或噴砂處理等,藉以在主體結構20之表面22形成具有更多凹槽或刻痕等粗糙結構120之粗糙表面,以增加氟素鍍膜層30與主體結構20之表面22之間之密著性。本創作並不侷限於特定之酸洗或噴砂手段,亦即無論粗糙化處理採用何種技術手段,只要可增加主體結構20之表面粗糙度即屬於本創作請求保護之範圍,故此處不另贅述。One of the characteristics of the anti-deposition object used in the vacuum environment of the present invention is that the surface 22 of the main structure 20 is covered by the fluorine coating layer 30, so the fluorine coating layer 30 can replace the surface 22 of the main structure 20 to contact the process substance 110 used or discharged during the process of the process equipment 100. Wherein, the fluorine coating layer 30 can cover the surface 22 of the main structure 20 by coating methods such as but not limited to spray coating, brush coating, dip coating or wiping coating. Wherein, the present invention can, for example, directly coat the liquid (fluid state) fluorine coating layer 30 on the surface 22 of the main structure 20, or before coating the liquid fluorine coating layer 30 on the surface 22 of the main structure 20, roughen the surface 22 of the main structure 20 to increase the surface roughness. The roughening treatment can be, for example but not limited to, pickling or sandblasting, so as to form a rough surface with more grooves or notches on the surface 22 of the main structure 20, so as to increase the adhesion between the fluorine coating layer 30 and the surface 22 of the main structure 20. This creation is not limited to specific pickling or sandblasting methods, that is, no matter what kind of technical means is used for roughening treatment, as long as the surface roughness of the main structure 20 can be increased, it belongs to the scope of protection of this creation, so it will not be repeated here.

本創作在將液態(流體狀態)之氟素鍍膜層30塗佈主體結構20之表面22上之後,可選擇性於室溫下約1至7天時間使其進行自縮合反應或於攝氏40度至攝氏60度之溫度下約1至24小時使其進行自縮合反應,亦即使得氟素鍍膜層30固化於主體結構20之表面22上,而形成固化狀態之氟素鍍膜層30。氟素鍍膜層30之厚度範圍可從1μm至3,000μm,且可為此範圍當中任意數值區間或上、下限端點值,例如從10μm至300μm。氟素鍍膜層30之物性與化性等特性優於主體結構20之表面22之原有物性與化性。舉例而言,在真空環境中,氟素鍍膜層30相較於主體結構20之表面22對製程物質110具有較高之水滴接觸角θ,亦即氟素鍍膜層30與製程物質110之間之水滴接觸角(範圍約為100度至140度,且可為此範圍當中任意數值區間或上、下限端點值,如106.5度)高於製程物質110與製程物質110之間之水滴接觸角(範圍約為89至95度)。本創作藉由在真空部件上塗佈高水滴接觸角之氟素鍍膜層30可防止真空部件產生沉積現象,且可達到自清潔及易清潔之效果。氟素鍍膜層30相較於主體結構20之表面22具有近似或較高之硬度,亦即氟素鍍膜層30之硬度(範圍約從8H至9H,且可為此範圍當中任意數值區間或上、下限端點值)接近、相同或高於主體結構20之表面22之硬度(範圍約為4H至6.5H)。本創作藉由在真空部件上塗佈高硬度之氟素鍍膜層30可防止真空部件受到微粒等製程物質撞擊而刮傷。氟素鍍膜層30與主體結構20之表面22之間之附著力(百格試驗(Cross-Cut test)之範圍約為4B至5B))高於製程物質110施加在氟素鍍膜層30之接觸力(如,製程物質110排放時撞擊氟素鍍膜層30之外力或吸附力),藉此本創作之氟素鍍膜層30對於主體結構20具有良好之密著性,可避免製程中產生剝離現象。氟素鍍膜層30相較於主體結構20之表面22具有較高之抗酸腐蝕性與抗電漿蝕刻性,藉此本創作之氟素鍍膜層30可保護真空部件防止受到酸蝕及自由基侵蝕。氟素鍍膜層30相較於主體結構20之表面22具有較低之粗糙度,亦即氟素鍍膜層30之粗糙度(約為0.2)低於主體結構20之表面22之粗糙度,甚至氟素鍍膜層30還可提供填補或滲入主體結構20之表面22上之凹槽或刻痕等粗糙結構120之效果,達到平整化之功效。此外,本創作之氟素鍍膜層30可承受相當高之溫度,且其工作溫度範圍相當廣,耐受溫度可高達約攝氏600度。氟素鍍膜層30之工作溫度範圍例如為小於或等於約攝氏600度,較佳例如約從攝氏260度至攝氏600度,且可為小於或攝氏600度之任意數值區間或上、下限端點值。反觀,傳統之撥水塗層或抗污塗層通常不能承受高溫,例如傳統之鐵氟龍之使用溫度低於攝氏260度。更何況,傳統之撥水塗層或抗污塗層之硬度僅約為1H至3H,例如傳統之鐵氟龍之硬度為1H至2H。由此可知,傳統之撥水層或抗污層無法承受製程設備100進行半導體製程時之高溫、高真空、高腐蝕性、高衝擊性及高沉積性環境。換言之,本創作之防沉積物件10藉由結合氟素鍍膜層30與主體結構20,可節省頻繁維修的資金和人力。In this invention, after the liquid (fluid state) fluorine coating layer 30 is coated on the surface 22 of the main structure 20, the self-condensation reaction can be carried out at room temperature for about 1 to 7 days or at a temperature of 40 to 60 degrees Celsius for about 1 to 24 hours, so that the fluorine coating layer 30 is cured on the surface 22 of the main structure 20, and the fluorine coating layer 30 in a cured state is formed. The thickness of the fluorine coating layer 30 can range from 1 μm to 3,000 μm, and can be any numerical range or upper and lower endpoints of this range, for example, from 10 μm to 300 μm. The physical and chemical properties of the fluorine coating layer 30 are better than the original physical and chemical properties of the surface 22 of the main structure 20 . For example, in a vacuum environment, the fluorine coating layer 30 has a higher water drop contact angle θ to the process substance 110 than the surface 22 of the main structure 20, that is, the water drop contact angle between the fluorine coating layer 30 and the process substance 110 (the range is about 100 degrees to 140 degrees, and can be any numerical interval or upper and lower limit endpoint value in this range, such as 106.5 degrees) is higher than the water drop contact between the process substance 110 and the process substance 110 angle (range approximately 89 to 95 degrees). In this invention, by coating the fluorine coating layer 30 with a high water droplet contact angle on the vacuum component, it can prevent the deposition phenomenon of the vacuum component, and can achieve the effect of self-cleaning and easy cleaning. The fluorine coating layer 30 has similar or higher hardness than the surface 22 of the main structure 20, that is, the hardness of the fluorine coating layer 30 (ranging from about 8H to 9H, and can be any numerical interval or upper and lower limit endpoint value in this range) is close to, equal to or higher than the hardness of the surface 22 of the main structure 20 (ranging from about 4H to 6.5H). In this invention, by coating the high-hardness fluorine coating layer 30 on the vacuum components, it can prevent the vacuum components from being scratched by the impact of process substances such as particles. The adhesion between the surface of the fluorine coating layer 30 and the surface of the main structure 20 (the range of the Cross-Cut Test is about 4B to 5B) higher than that of the process material 110 in the contact force (such as the force or adsorption force of the fluorine coating layer 30 when the process material 110 is discharged). The fluorine coating layer 30 has good denseness for the main structure 20, which can avoid the phenomenon of peeling in the process. Compared with the surface 22 of the main structure 20, the fluorine coating layer 30 has higher resistance to acid corrosion and plasma etching, so the fluorine coating layer 30 of the present invention can protect vacuum components from acid corrosion and free radical corrosion. The fluorine coating layer 30 has a lower roughness than the surface 22 of the main structure 20, that is, the roughness of the fluorine coating layer 30 (about 0.2) is lower than the roughness of the surface 22 of the main structure 20, and even the fluorine coating layer 30 can also provide the effect of filling or infiltrating the rough structure 120 such as grooves or nicks on the surface 22 of the main structure 20 to achieve the effect of leveling. In addition, the fluorine coating layer 30 of the present invention can withstand relatively high temperature, and its operating temperature range is quite wide, and the withstand temperature can be as high as about 600 degrees Celsius. The working temperature range of the fluorine coating layer 30 is, for example, less than or equal to about 600 degrees Celsius, preferably from about 260 degrees Celsius to 600 degrees Celsius, and can be any numerical range or upper and lower limit endpoints less than or equal to 600 degrees Celsius. In contrast, traditional water-repellent coatings or anti-fouling coatings usually cannot withstand high temperatures. For example, the use temperature of traditional Teflon is lower than 260 degrees Celsius. What's more, the hardness of traditional water-repellent coatings or antifouling coatings is only about 1H to 3H, for example, the hardness of traditional Teflon is 1H to 2H. It can be seen from this that the traditional water-repellent layer or anti-fouling layer cannot withstand the high temperature, high vacuum, high corrosion, high impact and high deposition environment when the process equipment 100 performs semiconductor manufacturing process. In other words, the anti-deposition article 10 of the present invention can save capital and manpower for frequent maintenance by combining the fluorine coating layer 30 and the main structure 20 .

本創作之氟素鍍膜層30之成分可例如為由氟碳化合物(Fluoro-carbons)約佔0.01~20%wt、烷氧基矽烷類約佔5~50wt、催化添加物約佔0.01%~20%wt及溶劑約佔10~90%wt 所組成。氟碳化合物例如為含有1-20個碳原子之含氟單體或聚合物。舉例而言,氟碳化合物例如為含有約3至約20個碳原子和至少一個末端三氟甲基的含氟單體。舉例而言,氟碳化合物例如為選自於由全氟烷(PFAS)、氟氯烴(CFC)、半氟烷(HFC)、氟聚合物(PTFE)及氫氟氯烴(HCFC)所組成之族群。烷氧基矽烷類係例如選自於由烷氧基矽烷寡聚體(Alkoxylsilane Oligomer)、烷氧基矽烷化合物(Alkoxylsilane compound)、烷氧基矽烷高分子(Alkoxylsilane polymer)、烷氧基矽氧烷寡聚體(Alkoxylsiloxane Oligomer)、烷氧基矽氧烷化合物(Alkoxylsiloxane compound)、烷氧基矽氧烷高分子(Alkoxylsiloxane polymer)、烷氧基矽氮烷寡聚體(Alkoxylaminosiloxane Oligomer)、烷氧基矽氮烷化合物(Alkoxylaminosiloxane compound)及烷氧基矽氮烷高分子(Alkoxylaminosiloxane polymer)所組成之族群。催化添加物係選自於由白金、鈦、錫、鋅、鋁、銀、鈣、鎂、鉀、鈉、鎳、鉻、鉬、釩、銅、鐵、鈷、鍺、鉿、鑭、鉛、釕、鉭、鎢、鋯之金屬、金屬氧化物、磷酸鹽及羧酸鹽所組成之族群。舉例而言,催化添加物例如為選自於由氧化矽、氧化鋁、氧化鈦、氧化鐵、氧化鎂、氧化鉬、氧化鈣及氯化鈣所組成之族群,且例如為奈米尺寸。惟本創作不限於此。微奈米尺寸甚至微米尺寸之催化添加物或成分均屬於本創作請求保護之範圍。溶劑例如為乙醇、丙醇或丁醇等醇類。惟,本創作不限於此,本創作之溶劑可選自於由醇類、酮類、酯類、氟醇類、氟醚和醚類所組成之族群。本創作之烷氧基矽烷類中具有反應官能基,反應官能基係於室溫下1至7天時間(例如7天)進行自縮合反應或於攝氏40至60度溫度下1至24小時(例如24小時)進行自縮合反應。其中,上述之反應官能基例如為矽氫化反應性官能基(如烯基、丙烯醯基、鍵結於矽原子上之氫原子)、縮合反應性官能基(如羥基、烷氧基、醯氧基)或過氧化物硬化反應性官能基(如烷基、烯基、丙烯醯基、羥基)。除此之外,在可行實施態樣中,本創作之氟素鍍膜層30之成分亦可例如為由氟素、奈米鈦、矽及矽彈性體組成之有機/無機高分子共聚物。由於本創作所屬技術領域中具有通常知識者,基於本創作前述內容,應當知道如何選擇與調製,以具有本創作之功效之氟素鍍膜層30之防沉積物件10,故此處不另贅述。The composition of the fluorine coating layer 30 of the present invention can be, for example, composed of about 0.01-20%wt of fluorocarbons, about 5-50wt of alkoxysilanes, about 0.01%-20%wt of catalytic additives, and about 10-90%wt of solvents. Fluorocarbons are, for example, fluorine-containing monomers or polymers containing 1-20 carbon atoms. Fluorocarbons are, for example, fluorine-containing monomers containing from about 3 to about 20 carbon atoms and at least one terminal trifluoromethyl group. For example, fluorocarbons are selected from the group consisting of perfluoroalkanes (PFAS), chlorofluorocarbons (CFC), hemifluorocarbons (HFC), fluoropolymers (PTFE) and hydrochlorofluorocarbons (HCFCs). Alkoxysilanes are, for example, selected from the group consisting of alkoxysilane oligomer (Alkoxylsilane Oligomer), alkoxysilane compound (Alkoxylsilane compound), alkoxysilane polymer (Alkoxylsilane polymer), alkoxysiloxane oligomer (Alkoxylsiloxane Oligomer), alkoxylsiloxane compound (Alkoxylsiloxane compound), alkoxysiloxane polymer (Alkoxylsilox ane polymer), alkoxylaminosiloxane oligomer, alkoxylaminosiloxane compound and alkoxylaminosiloxane polymer. Catalytic additives are selected from the group consisting of platinum, titanium, tin, zinc, aluminum, silver, calcium, magnesium, potassium, sodium, nickel, chromium, molybdenum, vanadium, copper, iron, cobalt, germanium, hafnium, lanthanum, lead, ruthenium, tantalum, tungsten, zirconium metals, metal oxides, phosphates and carboxylates. For example, the catalytic additive is selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, iron oxide, magnesium oxide, molybdenum oxide, calcium oxide and calcium chloride, and is, for example, nano-sized. But this creation is not limited to this. Catalyst additives or components with micronano-sized or even micron-sized all belong to the protection scope of this invention. The solvent is, for example, alcohols such as ethanol, propanol, or butanol. However, the invention is not limited thereto, and the solvent of the invention can be selected from the group consisting of alcohols, ketones, esters, fluoroalcohols, fluoroethers and ethers. The alkoxysilanes of the present invention have reactive functional groups, and the reactive functional groups perform self-condensation reactions at room temperature for 1 to 7 days (for example, 7 days) or at a temperature of 40 to 60 degrees Celsius for 1 to 24 hours (for example, 24 hours). Wherein, the above-mentioned reactive functional group is, for example, a hydrosilation reactive functional group (such as an alkenyl group, an acryl group, a hydrogen atom bonded to a silicon atom), a condensation reactive functional group (such as a hydroxyl group, an alkoxy group, an acyloxy group) or a peroxide hardening reactive functional group (such as an alkyl group, an alkenyl group, acryl group, a hydroxyl group). In addition, in a feasible embodiment, the composition of the fluorine coating layer 30 of the present invention can also be, for example, an organic/inorganic polymer copolymer composed of fluorine, nano-titanium, silicon and silicon elastomer. Because those with ordinary knowledge in the technical field of this creation should know how to select and adjust the anti-deposition object 10 of the fluorine coating layer 30 with the effect of this creation based on the foregoing content of this creation, so no further details are given here.

本創作之表面硬度測試方法是以硬度鉛筆測試氟素鍍膜層30之表面硬度。舉例而言,將硬度鉛筆(三菱標準鉛筆)以45度角裝載於固定荷重之台車上,再以手推動台車滑過防沉積物件10之氟素鍍膜層30之表面,以確認受鉛筆刮傷時之表面硬度。在本創作之防沉積物件10中,氟素鍍膜層30覆蓋於主體結構20之表面22上之表面硬度試驗結果均在8H荷重1Kg 至 9H荷重500g之間。The method for testing the surface hardness of the invention uses a hardness pencil to test the surface hardness of the fluorine coating layer 30 . For example, load a hardness pencil (Mitsubishi standard pencil) on a trolley with a fixed load at an angle of 45 degrees, and then push the trolley by hand to slide over the surface of the fluorine coating layer 30 of the anti-deposition object 10 to confirm the surface hardness when scratched by the pencil. In the anti-deposition article 10 of this invention, the surface hardness test results of the fluorine coating layer 30 covering the surface 22 of the main structure 20 are all between 8H load 1Kg and 9H load 500g.

本創作之百格試驗(Cross-Cut test)依據ASTM D3359 方法B(交叉切法)測試,其測試方法是用百格刀在測試樣本表面劃10×10個(100個)1mm×1mm小格線,每一條劃線應深及防沉積物件10之氟素鍍膜層30的底層;用毛刷將測試區域的碎片刷乾淨;用標準膠帶(3M 600號膠帶)或等同效力的膠帶粘住被測試小格線上,並用橡皮擦用力擦拭膠帶,以加大膠帶與被測區域的接觸面積及力度,用手抓住膠帶一端,在1.5分正負30秒內,以180度夾角迅速撕起膠帶,並觀察氟素鍍膜層30剝落狀態。在本創作之防沉積物件10中,本創作之氟素鍍膜層30披覆於主體結構20之表面22之百格試驗結果均在5B (切口邊緣完全光滑,格子邊緣沒有任何剝落)至4B (切口的相交處有小片剝落,劃格區內實際破損≤5%)之間。由此可知,本創作之氟素鍍膜層30對於主體結構20之表面22之附著力(密著性)相當高。The Cross-Cut test of this creation is tested according to ASTM D3359 Method B (cross-cut method). The test method is to use a cross-cut knife to draw 10×10 (100) small grid lines of 1mm×1mm on the surface of the test sample. Hold the small grid line to be tested, and wipe the tape vigorously with an eraser to increase the contact area and strength between the tape and the area to be tested. Grab one end of the tape with your hand, and within 1.5 minutes plus or minus 30 seconds, quickly tear off the tape at an angle of 180 degrees, and observe the peeling state of the fluorine coating layer 30. In the anti-deposition article 10 of the present invention, the 100-grid test results of the fluorine coating layer 30 of the present invention coated on the surface 22 of the main structure 20 are all between 5B (the edge of the cut is completely smooth, and there is no peeling off at the edge of the grid) to 4B (there are small pieces of peeling at the intersection of the cut, and the actual damage in the cross-cut area is ≤ 5%). It can be seen from this that the adhesion (adhesion) of the fluorine coating layer 30 of the present invention to the surface 22 of the main structure 20 is quite high.

本創作之耐酸蝕檢測實驗係使用5%HCl(鹽酸) 0.05ML,滴於測試樣品上,靜置24小時,等待其HCl溶液揮發,揮發過程中HCl區域濃度會上升,並會增加擴散腐蝕效果。觀察24小時之後,腐蝕擴散面積。經測試結果,未塗佈氟素鍍膜層30之主體結構20之表面22之腐蝕面積(mm²)約為45.13mm,然而有塗佈氟素鍍膜層30之主體結構20之表面22之腐蝕面積(mm²)僅約為19.4mm。The acid corrosion resistance testing experiment of this creation uses 5% HCl (hydrochloric acid) 0.05ML, drops it on the test sample, and waits for the HCl solution to volatilize. After 24 hours of observation, the diffusion area was corroded. According to the test results, the corrosion area (mm²) of the surface 22 of the main structure 20 without the fluorine coating layer 30 is about 45.13mm, but the corrosion area (mm²) of the surface 22 of the main structure 20 coated with the fluorine coating layer 30 is only about 19.4mm.

除此之外,本創作亦經過電漿蝕刻測試,其結果顯示在相同蝕刻條件(CHF 3:Ar 為1:1,60 分鐘,其蝕刻氧化物之速率為750nm/30min)的情況下,本創作之氟素鍍膜層30確實比主體結構20之表面22(陽極氧化鋁材質)具有良好之抗電漿蝕刻的能力。就熱穩定性測試(Thermogravimetric Analyzer,TGA測試)而言,在升溫速率為攝氏5度/分鐘及測試氣氛為N 2之測試環境下,本創作之氟素鍍膜層30之重量在測試溫度範圍(攝氏600度)內,均呈現穩定緩慢下降,並沒有突然的重量變化發生,顯示本創作之防沉積物件10之氟素鍍膜層30沒有裂解(cracking)發生。 In addition, this creation has also undergone a plasma etching test, and the results show that under the same etching conditions (CHF 3 :Ar ratio of 1:1, 60 minutes, the etching rate of oxide is 750nm/30min), the fluorine coating layer 30 of this creation does have better plasma etching resistance than the surface 22 (anodized aluminum material) of the main structure 20. As far as the thermal stability test (Thermogravimetric Analyzer, TGA test) is concerned, under the test environment with a heating rate of 5 degrees Celsius/min and a test atmosphere of N 2 , the weight of the fluorine coating layer 30 of the present invention decreases steadily and slowly within the test temperature range (600 degrees Celsius), and there is no sudden weight change, which shows that the fluorine coating layer 30 of the anti-deposition object 10 of the present invention does not crack.

製程設備100所進行之製程例如為半導體製程。舉例而言,製程設備100所進行之製程為原子層沉積(ALD)製程,製程物質為四氯化鈦(TiCl 4) ,其中防沉積物件10之主體結構20例如為流體輸送管,但不限於此。舉例而言,製程設備100所進行之製程為有機金屬化學氣相沉積(MOCVD)製程,製程物質為製程氣體或製程廢氣,其中防沉積物件10之主體結構20例如為真空抽氣幫浦之出口管,但不限於此。舉例而言,製程設備100所進行之製程為鋁墊(Al-pad)製程,製程物質為製程氣體反應物或製程廢氣,如選自於由N 2、O 2、Ar、SF 6、He、HBr、CF 4、CH 4、Cl 2、BCl 3及CHF 3所組成之族群,其中防沉積物件10之主體結構20例如為具有導流螺旋溝槽之幫浦零件及出口管,但不限於此。本創作之用於真空環境之防沉積物件經過實際測試,在上述之製程中均有良好的效果,例如在鋁墊(Al-pad)製程中,本創作之防沉積物件可延長約20%的維修週期,故可可減少頻繁維修的資金和人力。 The process performed by the process equipment 100 is, for example, a semiconductor process. For example, the process performed by the process equipment 100 is an atomic layer deposition (ALD) process, and the process substance is titanium tetrachloride (TiCl 4 ), wherein the main structure 20 of the anti-deposition object 10 is, for example, a fluid delivery tube, but not limited thereto. For example, the process performed by the process equipment 100 is a metalorganic chemical vapor deposition (MOCVD) process, and the process substance is process gas or process exhaust gas, wherein the main structure 20 of the anti-deposition object 10 is, for example, an outlet pipe of a vacuum pump, but is not limited thereto. For example, the process performed by the process equipment 100 is an Al-pad process, and the process substance is a process gas reactant or a process waste gas, such as being selected from the group consisting of N 2 , O 2 , Ar, SF 6 , He, HBr, CF 4 , CH 4 , Cl 2 , BCl 3 , and CHF 3 . Parts and outlet pipes, but not limited thereto. The anti-deposition object used in vacuum environment has been tested in practice and has good results in the above-mentioned processes. For example, in the aluminum pad (Al-pad) process, the anti-deposition object of this creation can extend the maintenance cycle by about 20%, so it can reduce the capital and manpower for frequent maintenance.

綜上所述,本創作之用於真空環境之防沉積物件,具有以下優點:To sum up, the anti-deposition object used in vacuum environment has the following advantages:

(1)藉由在真空部件上塗佈高硬度之氟素鍍膜層可防止真空部件受到微粒等製程物質撞擊而刮傷。(1) By coating the high-hardness fluorine coating layer on the vacuum parts, it can prevent the vacuum parts from being scratched by the impact of process substances such as particles.

(2)藉由在真空部件上塗佈高水滴接觸角之氟素鍍膜層可防止真空部件產生沉積現象,且可達到自清潔及易清潔之效果。(2) By coating the fluorine coating layer with a high water droplet contact angle on the vacuum parts, it can prevent the vacuum parts from depositing, and can achieve the effect of self-cleaning and easy cleaning.

(3)氟素鍍膜層對於主體結構具有良好之密著性,可避免製程中產生剝離現象。(3) The fluorine coating layer has good adhesion to the main structure, which can avoid peeling during the manufacturing process.

(4) 藉由提供具有氟素鍍膜層之防沉積物件,可減少頻繁維修的資金和人力。(4) By providing an anti-deposition object with a fluorine coating layer, the capital and manpower for frequent maintenance can be reduced.

以上所述僅為舉例性,而非為限制性者。任何未脫離本創作之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。The above descriptions are illustrative only, not restrictive. Any equivalent modification or change that does not deviate from the spirit and scope of this creation shall be included in the scope of the appended patent application.

10:防沉積物件 20:主體結構 22:表面 24:部位 26:螺旋導流槽 30:氟素鍍膜層 100:製程設備 110:製程物質 120:粗糙結構 θ:水滴接觸角 10: Anti-sedimentation objects 20: Main structure 22: surface 24: part 26: Spiral diversion groove 30: Fluorine coating layer 100: Process equipment 110: Process substances 120: rough structure θ: water droplet contact angle

圖1為本創作之用於真空環境之防沉積物件之局部結構示意圖。Fig. 1 is a partial structural schematic diagram of the anti-deposition object used in the vacuum environment of the present invention.

圖2為本創作之用於真空環境之防沉積物件應用於製程設備之示意圖。Fig. 2 is a schematic diagram of the application of the anti-deposition object for vacuum environment in the present invention to the process equipment.

圖3為本創作之用於真空環境之防沉積物件之第一種實施範例之剖面結構示意圖。Fig. 3 is a schematic cross-sectional structure diagram of the first implementation example of the anti-deposition object used in the vacuum environment of the present invention.

圖4為本創作之用於真空環境之防沉積物件之第二種實施範例之剖面結構示意圖。Fig. 4 is a schematic cross-sectional structure diagram of the second implementation example of the anti-deposition object used in the vacuum environment of the present invention.

圖5為本創作之用於真空環境之防沉積物件之第三種實施範例之剖面結構示意圖。Fig. 5 is a schematic cross-sectional structure diagram of a third embodiment of the anti-deposition object used in a vacuum environment according to the present invention.

圖6為本創作之用於真空環境之防沉積物件之第四種實施範例之立體結構示意圖。Fig. 6 is a three-dimensional structure diagram of the fourth implementation example of the anti-deposition object used in the vacuum environment of the present invention.

10:防沉積物件 10: Anti-sedimentation objects

20:主體結構 20: Main structure

22:表面 22: surface

30:氟素鍍膜層 30: Fluorine coating layer

110:製程物質 110: Process substances

120:粗糙結構 120: rough structure

θ:水滴接觸角 θ: water droplet contact angle

Claims (20)

一種用於真空環境之防沉積物件,包含: 一主體結構,具有至少一表面;以及 一氟素鍍膜層,覆蓋於該主體結構之該表面上,其中該防沉積物件於一真空環境中接觸一製程設備進行一製程時所使用或排放之一製程物質,且該氟素鍍膜層相較於該主體結構之該表面對該製程物質具有較高之一水滴接觸角,該氟素鍍膜層相較於該主體結構之該表面具有近似或較高之一硬度,並且該氟素鍍膜層相較於該主體結構之該表面具有較低之一粗糙度。 An anti-deposition article for a vacuum environment, comprising: a body structure having at least one surface; and A fluorine coating layer covering the surface of the main structure, wherein the anti-deposition object contacts a process substance used or discharged by a process equipment in a vacuum environment, and the fluorine coating layer has a higher water droplet contact angle compared with the surface of the main structure, the fluorine coating layer has a similar or higher hardness than the surface of the main structure, and the fluorine coating layer has a lower roughness than the surface of the main structure. 如請求項1所述之用於真空環境之防沉積物件,其中該主體結構為該製程設備之一出口管件或該製程設備之一週邊設備之管件或部件。The anti-deposition article for vacuum environment according to claim 1, wherein the main structure is an outlet pipe of the process equipment or a pipe or part of a peripheral equipment of the process equipment. 如請求項1所述之用於真空環境之防沉積物件,其中該氟素鍍膜層係位於該主體結構之一部位之該表面上,該部位為該主體結構之一傾斜部位、一平面部位或一彎曲部位。The anti-deposition article for vacuum environment as described in claim 1, wherein the fluorine coating layer is located on the surface of a part of the main structure, and the part is an inclined part, a flat part or a curved part of the main structure. 如請求項1所述之用於真空環境之防沉積物件,其中該氟素鍍膜層相較於該主體結構之該表面具有較高之一抗酸腐蝕性與一抗電漿蝕刻性。The anti-deposition article for vacuum environment as described in claim 1, wherein the fluorine coating layer has higher acid corrosion resistance and plasma etching resistance than the surface of the main structure. 如請求項1所述之用於真空環境之防沉積物件,其中該主體結構之該表面係經過粗糙化處理而形成具有粗糙結構之粗糙表面,用以增加表面粗糙度。The anti-deposition article for vacuum environment as claimed in claim 1, wherein the surface of the main structure is roughened to form a rough surface with a rough structure to increase surface roughness. 如請求項1所述之用於真空環境之防沉積物件,其中該主體結構之該表面係經過酸洗或噴砂粗糙化處理以增加表面粗糙度。The anti-deposition article for vacuum environment as claimed in claim 1, wherein the surface of the main structure is roughened by pickling or sandblasting to increase surface roughness. 如請求項1所述之用於真空環境之防沉積物件,其中該氟素鍍膜層之成分係由氟碳化合物(Fluoro-carbons)佔0.01~20%wt、烷氧基矽烷類佔5~50wt、催化添加物佔0.01%~20%wt及溶劑佔10~90%wt所組成。The anti-deposition article for vacuum environment as described in claim 1, wherein the composition of the fluorine coating layer is composed of 0.01-20%wt of fluorocarbons (Fluoro-carbons), 5-50wt of alkoxysilanes, 0.01%-20%wt of catalytic additives and 10-90%wt of solvents. 如請求項7所述之用於真空環境之防沉積物件,其中該氟碳化合物係選自於由全氟烷(PFAS)、氟氯烴(CFC)、半氟烷(HFC)、氟聚合物(PTFE)及氫氟氯烴(HCFC)所組成之族群。The anti-deposition article for vacuum environment as described in claim 7, wherein the fluorocarbon is selected from the group consisting of perfluoroalkane (PFAS), fluorochlorocarbon (CFC), hemifluoroalkane (HFC), fluoropolymer (PTFE) and hydrofluorochlorocarbon (HCFC). 如請求項7所述之用於真空環境之防沉積物件,其中該氟碳化合物為含有1-20個碳原子之含氟單體或聚合物。The anti-deposition article for vacuum environment as described in claim 7, wherein the fluorocarbon compound is a fluorine-containing monomer or polymer containing 1-20 carbon atoms. 如請求項7所述之用於真空環境之防沉積物件,其中該烷氧基矽烷類係選自於由烷氧基矽烷寡聚體(Alkoxylsilane Oligomer)、烷氧基矽烷化合物(Alkoxylsilane compound)、烷氧基矽烷高分子(Alkoxylsilane polymer)、烷氧基矽氧烷寡聚體(Alkoxylsiloxane Oligomer)、烷氧基矽氧烷化合物(Alkoxylsiloxane compound)、烷氧基矽氧烷高分子(Alkoxylsiloxane polymer)、烷氧基矽氮烷寡聚體(Alkoxylaminosiloxane Oligomer)、烷氧基矽氮烷化合物(Alkoxylaminosiloxane compound)及烷氧基矽氮烷高分子(Alkoxylaminosiloxane polymer)所組成之族群。The anti-deposition article for vacuum environment as described in Claim 7, wherein the alkoxysilanes are selected from alkoxysilane oligomer (Alkoxylsilane Oligomer), alkoxysilane compound (Alkoxylsilane compound), alkoxylsilane polymer (Alkoxylsilane polymer), alkoxylsiloxane oligomer (Alkoxylsiloxane Oligomer), alkoxylsiloxane compound (Alkoxylsiloxane compound) , Alkoxylsiloxane polymer, Alkoxylaminosiloxane Oligomer, Alkoxylaminosiloxane compound and Alkoxylaminosiloxane polymer. 如請求項7所述之用於真空環境之防沉積物件,其中該催化添加物係選自於由白金、鈦、錫、鋅、鋁、銀、鈣、鎂、鉀、鈉、鎳、鉻、鉬、釩、銅、鐵、鈷、鍺、鉿、鑭、鉛、釕、鉭、鎢、鋯之金屬、金屬氧化物、磷酸鹽及羧酸鹽所組成之族群。The anti-deposition article for vacuum environment as described in claim 7, wherein the catalytic additive is selected from the group consisting of platinum, titanium, tin, zinc, aluminum, silver, calcium, magnesium, potassium, sodium, nickel, chromium, molybdenum, vanadium, copper, iron, cobalt, germanium, hafnium, lanthanum, lead, ruthenium, tantalum, tungsten, zirconium metal, metal oxide, phosphate and carboxylate. 如請求項7所述之用於真空環境之防沉積物件,其中該溶劑係選自於由醇類、酮類、酯類、氟醇類、氟醚和醚類所組成之族群。The anti-deposition article for vacuum environment as described in claim 7, wherein the solvent is selected from the group consisting of alcohols, ketones, esters, fluoroalcohols, fluoroethers and ethers. 如請求項7所述之用於真空環境之防沉積物件,其中該烷氧基矽烷類中具有反應官能基,該反應官能基係於室溫下1至7天時間進行自縮合反應或於攝氏40至60度溫度下進行自縮合反應1至24小時。The anti-deposition article for vacuum environment as described in Claim 7, wherein the alkoxysilanes have reactive functional groups, and the reactive functional groups perform self-condensation reactions at room temperature for 1 to 7 days or at temperatures of 40 to 60 degrees Celsius for 1 to 24 hours. 如請求項1所述之用於真空環境之防沉積物件,其中該製程設備所進行之該製程為一原子層沉積(ALD)製程,該製程物質為四氯化鈦(TiCl 4)。 The anti-deposition article for vacuum environment as described in claim 1, wherein the process performed by the process equipment is an atomic layer deposition (ALD) process, and the process substance is titanium tetrachloride (TiCl 4 ). 如請求項1所述之用於真空環境之防沉積物件,其中該製程設備所進行之該製程為一有機金屬化學氣相沉積(MOCVD)製程,該製程物質為製程氣體或製程廢氣。The anti-deposition article for vacuum environment as described in Claim 1, wherein the process performed by the process equipment is a metalorganic chemical vapor deposition (MOCVD) process, and the process substance is process gas or process waste gas. 如請求項1所述之用於真空環境之防沉積物件,其中該製程設備所進行之該製程為一鋁墊(Al-pad)製程,該製程物質為製程氣體反應物或製程廢氣。The anti-deposition article for vacuum environment as described in claim 1, wherein the process performed by the process equipment is an Al-pad process, and the process substance is process gas reactant or process exhaust gas. 如請求項1所述之用於真空環境之防沉積物件,其中該氟素鍍膜層之該水滴接觸角之範圍為100度至120度。The anti-deposition article for vacuum environment according to claim 1, wherein the water droplet contact angle of the fluorine coating layer ranges from 100° to 120°. 如請求項1所述之用於真空環境之防沉積物件,其中該氟素鍍膜層之耐受溫度係達到攝氏600度。The anti-deposition article for vacuum environment as described in Claim 1, wherein the withstand temperature of the fluorine coating layer reaches 600 degrees Celsius. 如請求項1所述之用於真空環境之防沉積物件,其中該氟素鍍膜層之該硬度之範圍為8H至9H。The anti-deposition article for vacuum environment as described in claim 1, wherein the hardness of the fluorine coating layer is in the range of 8H to 9H. 如請求項1所述之用於真空環境之防沉積物件,其中該氟素鍍膜層與該主體結構之該表面之間之一附著力以百格測試所得之數值範圍為4B至5B。The anti-deposition article for vacuum environment as described in claim 1, wherein the adhesion force between the fluorine coating layer and the surface of the main structure is in the range of 4B to 5B in a hundred grid test.
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