TWM642475U - Detection device - Google Patents
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- TWM642475U TWM642475U TW112201065U TW112201065U TWM642475U TW M642475 U TWM642475 U TW M642475U TW 112201065 U TW112201065 U TW 112201065U TW 112201065 U TW112201065 U TW 112201065U TW M642475 U TWM642475 U TW M642475U
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Abstract
本案關於一種檢測裝置,設置於電路板上,且用以檢測晶片,其中檢測裝置包含殼體及彈性導體,殼體具有軸孔,貫穿殼體,其中軸孔具有內徑,彈性導體設置於軸孔內,且包含第一連接部、第二連接部及卡合部,卡合部位於第一連接部及第二連接部之間,且具有第一外徑,其中卡合部的第一外徑等於軸孔的內徑,使彈性導體的卡合部接觸且卡合固定於軸孔的壁面。This case relates to a detection device, which is arranged on a circuit board and is used to detect wafers. The detection device includes a housing and an elastic conductor. The housing has a shaft hole that penetrates the housing. inside the hole, and includes a first connecting portion, a second connecting portion and an engaging portion, the engaging portion is located between the first connecting portion and the second connecting portion, and has a first outer diameter, wherein the first outer diameter of the engaging portion The diameter is equal to the inner diameter of the shaft hole, so that the engaging part of the elastic conductor is in contact with and engaged with the wall surface of the shaft hole.
Description
本案關於一種檢測裝置,尤指一種具有彈性導體的檢測裝置。This case relates to a detection device, especially a detection device with an elastic conductor.
集成電路的晶片通常利用檢測裝置進行測試,例如檢測裝置為晶片測試插座(IC socket)。檢測裝置設置於電路板上,並容置檢測晶片,且檢測裝置包含上殼體、下殼體及彈性導體。上殼體與檢測晶片相接觸,下殼體與電路板相接觸。彈性導體為彈簧連接器(pogo pin)或彈片所構成,且其最大外徑具有一致性,即彈性導體於軸向上的每一處的最大外徑皆相等,彈性導體設置於上殼體及下殼體之間所形成的軸孔中,並利用上殼體的上壁面及下殼體的下壁面分別相接觸並壓合於彈性導體的兩端,以使彈性導體被固定夾持於上殼體及下殼體之間,其中檢測晶片的訊號經由彈性導體傳遞至電路板上。然而,為了固定彈性導體,傳統檢測裝置的整體外殼必須具備上殼體及下殼體兩個部件,而使傳統檢測裝置的設置成本較高。此外,傳統檢測裝置的彈性導體的最大外徑小於上殼體及下殼體之間所形成的軸孔的最小內徑,因此,彈性導體與上殼體及下殼體之間所形成的軸孔之間具有間隙,而使得彈性導體無法與上殼體的側壁或下殼體的側壁相接觸,造成彈性導體的電阻較高而降低訊號的傳送速度。Chips of integrated circuits are usually tested using a testing device, such as a chip testing socket (IC socket). The detection device is arranged on the circuit board and accommodates the detection chip, and the detection device includes an upper casing, a lower casing and an elastic conductor. The upper casing is in contact with the detection chip, and the lower casing is in contact with the circuit board. The elastic conductor is composed of a spring connector (pogo pin) or a shrapnel, and its maximum outer diameter is consistent, that is, the maximum outer diameter of the elastic conductor in each axial direction is equal, and the elastic conductor is arranged on the upper shell and the lower shell. In the shaft hole formed between the housings, the upper wall surface of the upper housing and the lower wall surface of the lower housing are respectively contacted and pressed to the two ends of the elastic conductor, so that the elastic conductor is fixedly clamped on the upper housing Between the body and the lower casing, the signal of the detection chip is transmitted to the circuit board through the elastic conductor. However, in order to fix the elastic conductor, the overall casing of the traditional detection device must have two parts, an upper case and a lower case, which makes the installation cost of the traditional detection device relatively high. In addition, the maximum outer diameter of the elastic conductor of the conventional detection device is smaller than the minimum inner diameter of the shaft hole formed between the upper case and the lower case, therefore, the shaft formed between the elastic conductor and the upper case and the lower case There is a gap between the holes, so that the elastic conductor cannot be in contact with the side wall of the upper casing or the side wall of the lower casing, resulting in high resistance of the elastic conductor and reducing the transmission speed of the signal.
因此,如何發展一種克服上述缺點的檢測裝置,實為目前迫切之需求。Therefore, how to develop a kind of detecting device that overcomes the above-mentioned shortcoming is actually an urgent need at present.
本案之目的在於提供一種檢測裝置,檢測裝置的彈性導體的卡合部的第一外徑等於殼體的軸孔的第二容置區域的第二內徑,而使卡合部接觸且卡合固定於殼體4的軸孔的第二容置區域的壁面,因此,本案的檢測裝置的殼體可僅需為單一部件,即可利用殼體的軸孔的壁面卡扣彈性導體的卡合部的方式,以將彈性導體固定於殼體上,使得本案的檢測裝置的設置成本較低。此外,由於本案的檢測裝置的彈性導體的卡合部接觸於殼體的軸孔的壁面,因此晶片上的訊號具有更多的傳遞路徑,而提升了本案的檢測裝置傳送訊號的速度。The purpose of this case is to provide a detection device. The first outer diameter of the engaging part of the elastic conductor of the detection device is equal to the second inner diameter of the second accommodation area of the shaft hole of the casing, so that the engaging part contacts and engages It is fixed on the wall surface of the second accommodating area of the shaft hole of the
為達上述目的,本案之一實施例為一種檢測裝置,設置於電路板上,且用以檢測晶片,其中檢測裝置包含殼體及彈性導體。殼體具有軸孔,貫穿殼體,其中軸孔具有內徑。彈性導體設置於軸孔內,且包含第一連接部、第二連接部及卡合部,卡合部位於第一連接部及第二連接部之間,且具有第一外徑,其中卡合部的第一外徑等於軸孔的內徑,使彈性導體的卡合部接觸且卡合固定於軸孔的壁面。To achieve the above purpose, an embodiment of the present application is a detection device, which is arranged on a circuit board and used for detecting chips, wherein the detection device includes a casing and an elastic conductor. The housing has a shaft hole extending through the housing, wherein the shaft hole has an inner diameter. The elastic conductor is arranged in the shaft hole, and includes a first connecting portion, a second connecting portion and an engaging portion, the engaging portion is located between the first connecting portion and the second connecting portion, and has a first outer diameter, wherein the engaging The first outer diameter of the portion is equal to the inner diameter of the shaft hole, so that the engaging portion of the elastic conductor contacts and is engaged and fixed on the wall surface of the shaft hole.
體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖式在本質上系當作說明之用,而非用於限制本案。Some typical embodiments embodying the features and advantages of the present application will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different aspects without departing from the scope of this case, and the descriptions and drawings therein are used as illustrations in nature rather than limiting this case.
請參閱第1圖至第3圖,其中第1圖為本案的檢測裝置設置於電路板上的結構示意圖,第2圖為第1圖所示的檢測裝置、晶片及電路板的爆炸結構示意圖,第3圖為第1圖所示的檢測裝置的部分剖面結構示意圖。如第1圖、第2圖及第3圖所示,本實施例的檢測裝置1設置於電路板2上,且用以容置晶片3以進行檢測,其中檢測裝置1更將晶片3上的訊號傳遞至電路板2上。檢測裝置1包含殼體4及彈性導體5。如第2圖所示,殼體4包含上表面41、下表面42、容置槽43及複數個軸孔44。殼體4的上表面41及下表面42相對設置,且殼體4利用下表面42設置於電路板2上,容置槽43係由上表面41內凹所構成,且容置槽43的底部431用以容置晶片3。Please refer to Figures 1 to 3, wherein Figure 1 is a schematic diagram of the structure of the detection device installed on the circuit board in this case, and Figure 2 is a schematic diagram of the exploded structure of the detection device, chip and circuit board shown in Figure 1, Fig. 3 is a partial cross-sectional structural schematic diagram of the detection device shown in Fig. 1 . As shown in Fig. 1, Fig. 2 and Fig. 3, the
為了便於說明,於第3圖中僅示出三個軸孔44及一個彈性導體5,軸孔44的數量並不侷限如第3圖所示的三個,為了便於說明,第3圖中僅一個軸孔44內放置對應的彈性導體5,然可清楚知道,每一軸孔44內皆可放置對應的彈性導體5。如第3圖所示,每一軸孔44係貫穿於殼體4的容置槽43的底部431及下表面42之間,且軸孔44包含第一容置區域441及第二容置區域442。第一容置區域441相較第二容置區域442而相鄰於容置槽43的底部431,且第一容置區域441具有第一內徑r1。第二容置區域442相較第一容置區域441而相鄰於殼體4的下表面42,且第二容置區域442具有第二內徑r2,其中第二內徑r2大於第一內徑r1。For ease of description, only three
彈性導體5設置於對應的殼體4的軸孔44內,且包含第一連接部51、第二連接部52、卡合部53、第一導電部54及第二導電部55。請參閱第4圖並配合第2圖及第3圖,其中第4圖為第1圖所示的檢測裝置的彈性導體的結構示意圖。第一連接部51為螺旋型的導電金屬所構成,且相鄰於容置槽43的底部431,並位於軸孔44的第二容置區域442內,第一連接部51具有第二外徑51a。第二連接部52為螺旋型的導電金屬所構成,且相鄰於殼體4的下表面42,並位於軸孔44的第二容置區域442內,第二連接部52具有第三外徑52a。卡合部53位於第一連接部51及第二連接部52之間,並位於軸孔44的第二容置區域442內,且卡合部53具有第一外徑53a,其中卡合部53的第一外徑53a等於軸孔44的第二容置區域442的第二內徑r2,而使卡合部53接觸且卡合固定於軸孔44的第二容置區域442的壁面。第一連接部51的第二外徑51a小於卡合部53的第一外徑53a,即代表第一連接部51的第二外徑51a小於軸孔44的第二容置區域442的第二內徑r2,故第一連接部51並未接觸於軸孔44的第二容置區域442的壁面,而使第一連接部51具有彈性恢復力。相似地,第二連接部52的第三外徑52a小於卡合部53的第一外徑53a,即代表第二連接部52的第三外徑52a小於軸孔44的第二容置區域442的第二內徑r2,故第二連接部52並未接觸於軸孔44的第二容置區域442的壁面,而使第二連接部52具有彈性恢復力。The
第一導電部54與第二導電部55分別位於彈性導體5的兩端,於本實施例中,第一導電部54由直線型的導電金屬所構成,且第一導電部54連接於第一連接部51,而第一連接部51位於第一導電部54及卡合部53之間,且至少部分的第一導電部54位於第二容置區域442,至少另外部分的第一導電部54突出於容置槽43的底部431,使彈性導體5利用第一導電部54而與容置槽43內的晶片3相接觸。於本實施例中,第二導電部55由螺旋型的導電金屬所構成,第二導電部55連接於第二連接部52,而第二連接部52位於第二導電部55及卡合部53之間,至少部分的第二導電部55突出於殼體4的下表面42,使彈性導體5利用第二導電部55而與電路板2相接觸,進而使檢測裝置1利用彈性導體5將晶片3上的訊號傳遞至電路板2。The first
由上可知,本案的檢測裝置1的彈性導體5的卡合部53的第一外徑53a等於殼體4的軸孔44的第二容置區域442的第二內徑r2,而使卡合部53接觸且卡合固定於殼體4的軸孔44的第二容置區域442的壁面,因此,相較於傳統檢測裝置的彈性導體的外殼必須具備上殼體及下殼體兩個部件以固定彈性導體,本案的檢測裝置1的殼體4可僅需為單一部件,即可利用殼體4的軸孔44的壁面卡扣彈性導體5的卡合部53的方式,以將彈性導體5固定於殼體4上,使得本案的檢測裝置1的設置成本較低。此外,由於本案的檢測裝置1的彈性導體5的卡合部53接觸於殼體4的軸孔44的壁面,因此晶片3上的訊號具有更多的傳遞路徑,而提升了本案的檢測裝置1傳送訊號的速度。It can be seen from the above that the first
請重新參閱第3圖,檢測裝置1更可包含導電層6,以第3圖中右側的軸孔44為例,導電層6貼合於軸孔44的壁面上,且導電層6位於彈性導體5的卡合部53及軸孔44的壁面之間,以使彈性導體5利用導電層6而降低整體電阻,進而提升本案的檢測裝置1傳送訊號的速度。Please refer to Figure 3 again, the
於一些實施例中,第一導電部54除了可為直線型,亦可為螺旋型所構成,當然,第二導電部55除了可為螺旋型亦可為直線型所構成。以下將示例性的以第一導電部54為直線型進行說明。請參閱第5A圖並配合第4圖,其中第5A圖為第1圖所示的檢測裝置的彈性導體的第一導電部的部分結構示意圖。如圖所示,本實施例的彈性導體5的第一導電部54與晶片3相接觸的一端為斜切結構。而於一些實施例中,彈性導體5的第一導電部54與晶片3相接觸的一端為平面結構,如第5B圖所示。而於另一些實施例中,彈性導體5的第二導電部55與電路板2相接觸的一端可為斜切結構或平面結構,而本案的檢測裝置可利用上述的導電部的不同態樣的結構以更精確地與晶片或電路板連接。In some embodiments, the first
當然,當導電部為螺旋型時亦可有不同態樣,以下將示例性的以第二導電部55為螺旋型進行說明。請參閱第6A圖並配合第4圖,其中第6A圖為第1圖所示的檢測裝置的彈性導體的第二導電部的部分結構示意圖。如圖所示,彈性導體5的第二導電部55與電路板2相接觸的一端為斷面結構。而於一些實施例中,彈性導體5的第二導電部55與電路板2相接觸的一端為內折結構,如第6B圖所示。而於另一些實施例中,彈性導體5的第一導電部54與晶片3相接觸的一端為斷面結構或內折結構,而本案的檢測裝置利用上述的導電部的不同態樣的結構以更精確地與晶片或電路板連接。Certainly, there may be different forms when the conductive portion is in a spiral shape, and the second
於一些實施例中,彈性導體5的第一導電部54可為圓錐型的導電金屬所構成,如第7A圖所示。於另一些實施例中,彈性導體5的第一導電部54可為皇冠型的導電金屬所構成,如第7B圖所示。於另一些實施例中,彈性導體5的第一導電部54可為導電膠所構成,如第7C圖所示。當然,彈性導體5的第二導電部55亦可為圓錐型、皇冠型的導電金屬或導電膠所構成,於此不再贅述。In some embodiments, the first
綜上所述,本案的檢測裝置的彈性導體的卡合部的第一外徑等於殼體的軸孔的第二容置區域的第二內徑,而使卡合部接觸且卡合固定於殼體4的軸孔的第二容置區域的壁面,因此,本案的檢測裝置的殼體可僅需為單一部件,即可利用殼體的軸孔的壁面卡扣彈性導體的卡合部的方式,以將彈性導體固定於殼體上,使得本案的檢測裝置的設置成本較低。此外,由於本案的檢測裝置的彈性導體的卡合部接觸於殼體的軸孔的壁面,因此晶片上的訊號具有更多的傳遞路徑,而提升了本案的檢測裝置傳送訊號的速度。To sum up, the first outer diameter of the engaging portion of the elastic conductor of the detection device of the present case is equal to the second inner diameter of the second accommodation area of the shaft hole of the casing, so that the engaging portion contacts and is engaged and fixed on the The wall surface of the second accommodating area of the shaft hole of the
1:檢測裝置1: Detection device
2:電路板2: circuit board
3:晶片3: Wafer
4:殼體4: Shell
41:上表面41: upper surface
42:下表面42: lower surface
43:容置槽43: storage tank
431:底部431: bottom
44:軸孔44: shaft hole
441:第一容置區域441: The first storage area
r1:第一內徑r1: the first inner diameter
442:第二容置區域442:Second storage area
r2:第二內徑r2: second inner diameter
5:彈性導體5: Elastic conductor
51:第一連接部51: The first connecting part
51a:第二外徑51a: second outer diameter
52:第二連接部52: The second connecting part
52a:第三外徑52a: third outer diameter
53:卡合部53:Catching part
53a:第一外徑53a: first outer diameter
54:第一導電部54: The first conductive part
55:第二導電部55: The second conductive part
6:導電層6: Conductive layer
第1圖為本案的檢測裝置設置於電路板上的結構示意圖。 第2圖為第1圖所示的檢測裝置、晶片及電路板的爆炸結構示意圖。 第3圖為第1圖所示的檢測裝置的部分剖面結構示意圖。 第4圖為第1圖所示的檢測裝置的彈性導體的結構示意圖。 第5A圖為第1圖所示的檢測裝置的彈性導體的第一導電部的部分結構示意圖。 第5B圖為本案的檢測裝置的彈性導體的另一實施例的第一導電部的部分結構示意圖。 第6A圖為第1圖所示的檢測裝置的彈性導體的第二導電部的部分結構示意圖。 第6B圖為本案的檢測裝置的彈性導體的另一實施例的第二導電部的部分結構示意圖。 第7A、7B及7C圖分別為本案的檢測裝置的不同實施例的彈性導體的結構示意圖。 Fig. 1 is a structural schematic diagram of the detection device of this case arranged on the circuit board. Figure 2 is a schematic diagram of the exploded structure of the detection device, chip and circuit board shown in Figure 1 . Fig. 3 is a partial cross-sectional structural schematic diagram of the detection device shown in Fig. 1 . Fig. 4 is a schematic structural view of the elastic conductor of the detection device shown in Fig. 1 . FIG. 5A is a partial structural diagram of the first conductive portion of the elastic conductor of the detection device shown in FIG. 1 . FIG. 5B is a partial structural diagram of the first conductive part of another embodiment of the elastic conductor of the detection device of the present application. FIG. 6A is a partial structural diagram of the second conductive portion of the elastic conductor of the detection device shown in FIG. 1 . FIG. 6B is a partial structural diagram of the second conductive portion of another embodiment of the elastic conductor of the detection device of the present application. Figures 7A, 7B and 7C are structural schematic diagrams of elastic conductors in different embodiments of the detection device of the present application.
1:檢測裝置 1: Detection device
4:殼體 4: Housing
42:下表面 42: lower surface
431:底部 431: bottom
44:軸孔 44: shaft hole
441:第一容置區域 441: The first storage area
r1:第一內徑 r1: the first inner diameter
442:第二容置區域 442:Second storage area
r2:第二內徑 r2: second inner diameter
5:彈性導體 5: Elastic conductor
51:第一連接部 51: The first connecting part
51a:第二外徑 51a: second outer diameter
52:第二連接部 52: The second connecting part
52a:第三外徑 52a: third outer diameter
53:卡合部 53:Catching part
53a:第一外徑 53a: first outer diameter
54:第一導電部 54: The first conductive part
55:第二導電部 55: The second conductive part
6:導電層 6: Conductive layer
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112201065U TWM642475U (en) | 2023-02-07 | 2023-02-07 | Detection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112201065U TWM642475U (en) | 2023-02-07 | 2023-02-07 | Detection device |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM642475U true TWM642475U (en) | 2023-06-11 |
Family
ID=87804827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112201065U TWM642475U (en) | 2023-02-07 | 2023-02-07 | Detection device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM642475U (en) |
-
2023
- 2023-02-07 TW TW112201065U patent/TWM642475U/en unknown
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