TWM641595U - Cooling fan module and fan seat thereof - Google Patents

Abstract

A cooling fan seat for being mounted on a circuit board having a slot for locating an electronic device is provided. The cooling fan seat comprises a fastening seat and an air guide. The fastening seat is utilized for being mounted on the circuit board. The air guide is connected to the fastening seat and has an inlet and an outlet. The outlet faces toward the electronic device. The inlet is utilized for assembling a fan. A cooling fan module with the cooling fan seat is also provided.

Description

Cooling fan module and its cooling fan base

This case relates to a heat dissipation fan module and its heat dissipation fan seat, especially a heat dissipation fan module and its heat dissipation fan seat installed on a circuit board.

A computer has a central processing unit (CPU), a graphics processing unit (GPU), memory and many other electronic components. These electronic components generate heat when they operate. If the heat generated by the operation of these electronic components cannot be effectively removed, it will easily lead to overheating of the computer system and affect its operating performance.

Traditionally, in order to remove the heat generated by electronic components, in addition to relying on natural convection, a fan can also be installed on the computer case or a heat sink can be installed on the electronic components to improve the cooling effect. However, these cooling methods still have their limitations. First, heat dissipation that relies on natural convection is not efficient. Secondly, installing a fan on the computer casing certainly helps to increase convection, but the heat dissipation of the electronic components on the surface of the motherboard is limited. In addition, some electronic components (such as memory) on the motherboard do not have enough space to install heat sinks.

This case provides a cooling fan base. The cooling fan seat is suitable for being installed on a circuit board, and the circuit board is provided with a slot, and the slot is suitable for inserting an electronic component. The cooling fan base includes a fixing base and a wind guide cover. The fixing seat is suitable for being installed on the circuit board. The air guide cover is connected to the fixing seat, and has an air inlet and an air outlet, the air outlet faces the electronic components, and the air inlet is used for installing a fan.

This case also provides a cooling fan module. The cooling fan module is suitable for being installed on a circuit board, and the circuit board is provided with a slot, and the slot is suitable for inserting an electronic component. The cooling fan module includes a cooling fan base and a fan. The cooling fan base includes a fixing base and a wind guide cover. The fixing seat is suitable for being installed on the circuit board. The air guide cover is connected to the fixing seat, and has an air inlet and an air outlet, and the air outlet faces the electronic components. The fan is arranged at the air inlet.

The heat dissipation fan base and heat dissipation fan module of this case can effectively guide the heat dissipation airflow generated by the fan to blow towards the direction of the electronic components, and improve the shortcomings of the traditional technology for the poor heat dissipation effect of the electronic components on the motherboard. In addition, for electronic components that cannot be installed with heat sinks on the motherboard, the heat dissipation fan base and heat dissipation fan module of this case can also help to improve the heat dissipation effect.

The specific implementation manner of this case will be described in more detail below with reference to schematic diagrams. According to following description and scope of application for patent, the advantages and characteristics of this case will be clearer. It should be noted that the diagrams are all in a very simplified form and use inaccurate proportions, and are only used to facilitate and clearly illustrate the purpose of the embodiment of this case.

The first figure is a schematic diagram of a cooling fan module 10 provided according to an embodiment of the present application. This cooling fan module 10 is suitable for being installed on a circuit board 20, and this circuit board 20 has a slot (such as the memory slot assembly 22 in the figure), and this cooling fan module 10 is used for inserting in The electronic component 30 in one of the slots is used for heat dissipation. In one embodiment, the cooling fan module 10 is used to dissipate heat from the memory 32 inserted in the memory slot assembly 22 . However, this case is not limited to this. In other embodiments, the cooling fan module 10 can also be used to dissipate heat from a display card, graphics processing unit (GPU) or central processing unit (CPU) inserted in the expansion slot.

As shown in the figure, the cooling fan module 10 includes a cooling fan base 100 and a fan 200 . The cooling fan base 100 includes a fixing base 120 and a wind guide cover 140 . The fixing seat 120 is suitable for being installed on the circuit board 20 and adjacent to the memory socket assembly 22 . Taking the embodiment in the figure as an example, the fixing seat 120 is installed at one end of the memory slot assembly 22 .

Please refer to the second and third figures together. The second and third figures show the cooling fan base 100 in the first figure from different angles of view. The air guide cover 140 is connected to the fixing seat 120 and presents a curved tubular structure. The air guide cover 140 has an air inlet 142 and an air outlet 144 , the air outlet 144 faces the electronic component 30 and is adjacent to the memory slot assembly 22 . The fan 200 is disposed at the air inlet 142 . The heat dissipation airflow generated by the fan 200 is directed to the memory 32 inserted in the memory slot assembly 22 through the air guide cover 140 .

Taking the embodiment in the figure as an example, the air outlet 144 of the air guide cover 140 is aligned with one end of the memory socket assembly 22, and the direction of the air outlet 144 is approximately parallel to each memory slot in the memory socket assembly 22 222 in the direction of extension. In this way, the heat-dissipating airflow generated by the fan 200 can flow along the surface of the circuit board, smoothly flow into the channel between the adjacent memory slots 222 , and dissipate heat to the memory 32 inserted in the memory slots 222 .

The size, shape and direction of the air outlet 144 of the air guide cover 140 are set according to the electronic component 30 . Taking the embodiment in the figure as an example, the heat dissipation object of the heat dissipation fan module 10 in the figure is the memory 32 inserted on the memory socket assembly 22, and the memory socket assembly 22 has four side-by-side The memory slot 222 can support up to four memories 32 . The width of the air outlet 144 corresponds to the width of the four memory slots 222 side by side, so as to ensure that the heat dissipation airflow generated by the cooling fan module 10 can dissipate heat from all the memories 32 inserted in the memory slot assembly 22 . The position of the air outlet 144 is close to the circuit board 20 to ensure that the cooling air flow will flow along the surface of the circuit board 20 to match the position of the memory 32. The height of the air outlet 144 is corresponding to the end of the memory slot assembly 22 the height of. The cooling air from the air outlet 144 will flow from the side of the memory slot 222 to the memory 32 inserted on the memory slot 222 .

The size and shape of the air inlet 142 of the air guide cover 140 are set according to the shape of the fan 200 . In one embodiment, in order to fix the fan 200 with a square shape, the air inlet 142 is also in a square shape, and the size of the air inlet 142 roughly corresponds to the size of the fan 200 . The fan 200 can be fixed to the air inlet 142 by means of locking, magnetic attraction, engagement, and the like. Taking the embodiment in the figure as an example, the four corners of the fan 200 have locking holes 220 , and the fan 200 is fixed to the air inlet 142 by means of screw locking. Also, in one embodiment, the size of the air inlet 142 of the air guide cover 140 can be larger than the size of the air outlet 144, so as to increase the flow rate of the heat dissipation airflow flowing out from the air outlet 144, and ensure that the heat dissipation airflow can effectively eliminate the operation of the memory 32. heat.

The fourth figure is a schematic diagram of a cooling fan base 400 provided according to another embodiment of the present application.

Compared with the heat dissipation fan base 100 in the embodiment of the first figure, the heat dissipation fan base 400 of this embodiment is provided with an adapter 460 at the air inlet 442 of the air guide cover 440 . The adapter 460 can be used to connect two fans of different sizes, providing users with more choices.

As shown in the figure, the adapter 460 includes a plurality of plates 462 pivotally connected around the air inlet 442 through rotating shafts. Taking the embodiment in the figure as an example, the air inlet 442 is in a square shape, and the adapter 460 has four plates 462 , which are respectively pivotally connected to the four sides of the air inlet 442 through rotating shafts 464 . Each plate 462 has the same shape and is trapezoidal. The long side of the trapezoid is located on the side of the plate 462 close to the rotating shaft 464 , and the short side is located on the side of the plate 462 away from the rotating shaft 464 .

Please also refer to Figures 5A to 5C. Figures 5A to 5C are schematic diagrams of the use of the cooling fan base 400 in Figure 4 with fans 500a, 500b of different sizes. Among them, the fifth figure A is a schematic diagram of using the heat dissipation fan base 400 with a fan 500a of a larger size. FIG. 5B is a schematic diagram of using the cooling fan base 400 with a fan 500b of a smaller size. In the fifth figure C, the fan 500b in the fifth figure B is removed to show the position of the adapter 460 .

As shown in Figures 4 and 5A, when the plates 462 are turned outwards to be parallel to the direction D1 of the air inlet 442 , a first square opening S1 is defined between these plates 462 to engage the fan 500a. The size of the first square opening S1 is substantially the same as the size of the air inlet 442 .

As shown in the fifth B and five C figures, when these plates 462 are overturned to the direction D2 perpendicular to the air inlet 442, these plates 462 extend from around the air inlet 442 towards the middle of the air inlet 442, and on these plates 462 A second square opening S2 is defined therebetween for engaging the fan 500b. The size of the second square opening S2 is determined by the size of the air inlet 442 and the size of each plate 462, and is smaller than the size of the first square opening S1. In this way, two fans 500a, 500b of different sizes can be used without changing the size of the air guide cover 440 body.

In one embodiment, an additional engaging structure 466 may be provided on the side of each plate 462 away from the rotating shaft 464 to enhance the bonding strength between each plate 462 and the fan 500b in the use mode shown in FIG. 5 . For example, a protrusion can be formed on the side of the plate 462 away from the rotating shaft 464, and a notch can be formed on the side of the fan 500b corresponding to the position of the protrusion. Through the coupling structure between the protrusion and the notch, each plate 462 can be strengthened. The bonding strength with the fan 500b.

In addition, compared with the embodiment in the first figure, the wind guide cover 140 is fixedly connected to the fixed base 120, and its relative position or inclination angle with the fixed base 120 cannot be adjusted. The seat 420 is designed in an adjustable manner, allowing the user to adjust the relative position of the air guide cover 440 and the fixed seat 420 and the inclination angle of the air guide cover 440 .

Please also refer to the sixth figure, which shows the fixing seat 420 in the fourth figure. As shown in the figure, the fixing seat 420 includes a base 422 and a connecting piece 424 . The base 422 is suitable for being installed on the circuit board 20 and has a track 4222 . The connecting member 424 has a movable part 4242 and a pivot part 4244 , the movable part 4242 is movably coupled to the track 4222 , and the wind deflector (not shown) is pivotally connected to the pivot part 4244 . In one embodiment, the connecting member 424 is L-shaped, wherein the horizontal part is the movable part 4242 , and the vertical part is the pivot part 4244 .

Through this fixing seat 420, the user can change the distance between the air outlet 444 of the air guide cover 440 and the memory slot assembly 22 or the inclination angle of the air guide cover 440 relative to the circuit board 20 according to requirements, so as to ensure that the airflow generated by the fan can effectively flow to the memory 32 for heat dissipation.

Please refer to Figures 7A and 7B together. Figures 7A and 7B are schematic views of the cooling fan base 400 in Figure 4 being used in different positions of the air guide cover 440 .

In the example of FIG. 7A , the connector 424 is located closer to the memory socket assembly 22 , and the air outlet direction of the air outlet 444 of the air guide cover 440 is relatively parallel to the circuit board 20 . In the example of FIG. 7B , the connector 424 is located away from the memory socket assembly 22 , and the air outlet 444 of the air guide cover 440 is directed towards the surface of the circuit board 20 .

In addition, as shown in FIG. 4 , the side surface of the air guide cover 440 of this embodiment has a plurality of pressure relief holes 446 . Taking the embodiment in the figure as an example, the air guide cover 440 has pressure relief holes 446 on the upper side and the left and right sides (only one of them is shown in the figure). These pressure relief holes 446 can be used to adjust the air pressure inside the air guide cover 440 to avoid excessive air pressure inside the air guide cover 440 to generate vibration or noise.

The heat dissipation fan base 100, 400 and the heat dissipation fan module 10 of this case can effectively guide the heat dissipation airflow generated by the fans 200, 500a, 500b to blow towards the direction of the electronic component 30, improving the heat dissipation effect of the traditional technology on the electronic component 30 on the motherboard Poor disadvantages. In addition, for the electronic components 30 that cannot be installed with cooling fins on the main board, the cooling fan base 100, 400 and the cooling fan module 10 of this case are also helpful to improve the cooling effect.

The above is only a preferred embodiment of this case, and does not limit this case in any way. Anyone skilled in the technical field, within the scope of not departing from the technical means of this case, makes any form of equivalent replacement or modification to the technical means and technical content disclosed in this case, which belongs to the content of the technical means of this case. still fall within the protection scope of this case.

10: cooling fan module 100, 400: cooling fan seat 20: circuit board 22:Memory slot assembly 222: memory slot 30: Electronic components 32: memory 200, 500a, 500b: Fan 220: locking hole 120, 420: fixed seat 140, 440: wind deflector 142, 442: air inlet 144, 444: air outlet 422: base 424: connector 4222: track 4242: Activities Department 4244: pivot joint 460: Adapter 462: plate 464: Shaft 466: Snap structure 446: pressure relief hole S1: The first square opening S2: The second square opening D1, D2: direction

The first figure is a schematic diagram of a cooling fan module provided according to an embodiment of this case; The second and third pictures show the cooling fan base in the first picture from different angles; The fourth figure is a schematic diagram of a cooling fan base provided according to another embodiment of the present case; Figures 5A to 5C are schematic diagrams of the use of the cooling fan base in Figure 4 with fans of different sizes; The sixth picture shows the fixing seat in the fourth picture; and Figures 7A and 7B are schematic diagrams of the heat dissipation fan base in Figure 4 being used in different positions of the air guide cover.

10: cooling fan module

100: cooling fan seat

20: circuit board

22:Memory slot assembly

220: locking hole

222: memory slot

30: Electronic components

32: Memory

200: fan

120: fixed seat

140: Wind hood

Claims (14)

A cooling fan base is suitable for installation on a circuit board, the circuit board is provided with a slot, the slot is suitable for inserting an electronic component, the cooling fan base includes: a mount, suitable for mounting on the circuit board, adjacent to the slot; and A wind guide cover is connected to the fixing seat, and has an air inlet and an air outlet, the air outlet faces the electronic component, and the air inlet is used to install a fan. The cooling fan base according to claim 1, wherein the size of the air inlet is larger than the size of the air outlet. The heat dissipation fan base according to claim 1, wherein the position of the air outlet is close to the circuit board. The heat dissipation fan base according to claim 1, wherein a plurality of locking holes are formed around the air inlet for fixing the fan. The heat dissipation fan base as described in claim 1, wherein the air inlet is square, and the heat dissipation fan base further includes an adapter, the adapter is arranged at the air inlet, and includes a plurality of plates, the The plates are respectively pivotally connected around the air inlet, and when the plates are turned over to be parallel to the direction of the air inlet, the plates define a first square opening for engaging the fan. The heat dissipation fan base as described in claim 5, wherein each of the plates is trapezoidal. The heat dissipation fan base as described in claim 1, wherein the air inlet is square, and the heat dissipation fan base further includes an adapter, the adapter is arranged at the air inlet, and includes a plurality of plates, the The plates are respectively pivotally connected around the air inlet, and when the plates are turned over to be perpendicular to the direction of the air inlet, the plates define a second square opening for engaging the fan. The cooling fan base according to claim 7, wherein each of the plates has an engaging structure for engaging with the fan. The cooling fan base according to claim 1, wherein the air guide cover is pivotally connected to the fixing base. The heat dissipation fan seat as described in claim 9, wherein the fixed seat includes a base and a connecting piece, the base is suitable for being installed on the circuit board, and has a track, and the connecting piece has a movable part and a pivot joint part, the movable part is movably coupled to the track, and the wind deflector is pivotally connected to the pivotal part. The cooling fan base according to claim 10, wherein the connecting piece is L-shaped. The heat dissipation fan base according to claim 1, wherein a plurality of pressure relief holes are provided on the side of the wind guide cover. The cooling fan base according to claim 1, wherein the electronic component is a memory. A cooling fan module is suitable for being installed on a circuit board. The circuit board is provided with a slot suitable for inserting an electronic component. The cooling fan module includes: A cooling fan base, including: a mount, suitable for mounting on the circuit board, adjacent to the slot; and an air guide cover, connected to the fixing seat, and has an air inlet and an air outlet, and the air outlet faces the electronic component; and A fan is arranged at the air inlet.

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