TWM641595U - Cooling fan module and fan seat thereof - Google Patents
Cooling fan module and fan seat thereof Download PDFInfo
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- TWM641595U TWM641595U TW112201805U TW112201805U TWM641595U TW M641595 U TWM641595 U TW M641595U TW 112201805 U TW112201805 U TW 112201805U TW 112201805 U TW112201805 U TW 112201805U TW M641595 U TWM641595 U TW M641595U
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Abstract
Description
本案是有關於一種散熱風扇模組及其散熱風扇座,尤其是關於一種裝設於電路板之散熱風扇模組及其散熱風扇座。This case relates to a heat dissipation fan module and its heat dissipation fan seat, especially a heat dissipation fan module and its heat dissipation fan seat installed on a circuit board.
電腦內具有中央處理器(CPU)、圖形處理器(GPU)、記憶體等諸多電子元件。這些電子元件運作時會產生熱量。若是未能有效移除這些電子元件運作所產生之熱量,就容易導致電腦系統溫度過高而影響其運作效能。A computer has a central processing unit (CPU), a graphics processing unit (GPU), memory and many other electronic components. These electronic components generate heat when they operate. If the heat generated by the operation of these electronic components cannot be effectively removed, it will easily lead to overheating of the computer system and affect its operating performance.
傳統上,為了移除電子元件所產生的熱量,除了依靠自然對流,也可在電腦機殼上安裝風扇或是在電子元件上安裝散熱片以提升散熱效果。不過,這些散熱方式仍有其限制。首先,依靠自然對流的散熱效率不佳。其次,在電腦機殼上安裝風扇固然有助於增加對流,但對於主機板表面之電子元件的散熱提升有限。另外,主機板上部分電子元件(如記憶體)上並不具有足夠空間可安裝散熱片。Traditionally, in order to remove the heat generated by electronic components, in addition to relying on natural convection, a fan can also be installed on the computer case or a heat sink can be installed on the electronic components to improve the cooling effect. However, these cooling methods still have their limitations. First, heat dissipation that relies on natural convection is not efficient. Secondly, installing a fan on the computer casing certainly helps to increase convection, but the heat dissipation of the electronic components on the surface of the motherboard is limited. In addition, some electronic components (such as memory) on the motherboard do not have enough space to install heat sinks.
本案提供一種散熱風扇座。此散熱風扇座適於裝設於一電路板,電路板設有一插槽,插槽適於插設一電子元件。散熱風扇座包含依固定座以及一導風罩。固定座適於安裝於電路板。導風罩連接於固定座,且具有一入風口與一出風口,出風口朝向電子元件,入風口係用以裝設一風扇。This case provides a cooling fan base. The cooling fan seat is suitable for being installed on a circuit board, and the circuit board is provided with a slot, and the slot is suitable for inserting an electronic component. The cooling fan base includes a fixing base and a wind guide cover. The fixing seat is suitable for being installed on the circuit board. The air guide cover is connected to the fixing seat, and has an air inlet and an air outlet, the air outlet faces the electronic components, and the air inlet is used for installing a fan.
本案並提供一種散熱風扇模組。此散熱風扇模組適於裝設於一電路板,電路板設有一插槽,插槽適於插設一電子元件。此散熱風扇模組包含一散熱風扇座以及一風扇。散熱風扇座包含一固定座以及一導風罩。固定座適於安裝於電路板。導風罩連接於固定座,且具有一入風口與一出風口,出風口朝向電子元件。風扇設置於入風口。This case also provides a cooling fan module. The cooling fan module is suitable for being installed on a circuit board, and the circuit board is provided with a slot, and the slot is suitable for inserting an electronic component. The cooling fan module includes a cooling fan base and a fan. The cooling fan base includes a fixing base and a wind guide cover. The fixing seat is suitable for being installed on the circuit board. The air guide cover is connected to the fixing seat, and has an air inlet and an air outlet, and the air outlet faces the electronic components. The fan is arranged at the air inlet.
本案之散熱風扇座與散熱風扇模組可以有效地引導風扇產生之散熱氣流朝向電子元件之方向吹送,改善傳統技術對於主機板上之電子元件的散熱效果不佳的缺點。此外,對於主機板上無法裝設散熱片之電子元件,本案之散熱風扇座與散熱風扇模組亦有助於提升散熱效果。The heat dissipation fan base and heat dissipation fan module of this case can effectively guide the heat dissipation airflow generated by the fan to blow towards the direction of the electronic components, and improve the shortcomings of the traditional technology for the poor heat dissipation effect of the electronic components on the motherboard. In addition, for electronic components that cannot be installed with heat sinks on the motherboard, the heat dissipation fan base and heat dissipation fan module of this case can also help to improve the heat dissipation effect.
下面將結合示意圖對本案的具體實施方式進行更詳細的描述。根據下列描述和申請專利範圍,本案的優點和特徵將更清楚。需說明的是,圖式均採用非常簡化的形式且均使用非精準的比例,僅用以方便、明晰地輔助說明本案實施例的目的。The specific implementation manner of this case will be described in more detail below with reference to schematic diagrams. According to following description and scope of application for patent, the advantages and characteristics of this case will be clearer. It should be noted that the diagrams are all in a very simplified form and use inaccurate proportions, and are only used to facilitate and clearly illustrate the purpose of the embodiment of this case.
第一圖係依據本案一實施例所提供之散熱風扇模組10之示意圖。此散熱風扇模組10適於裝設於一電路板20,此電路板20具有一插槽(如圖中之記憶體插槽組件22),此散熱風扇模組10係用以對插設於插槽之一電子元件30進行散熱。一實施例中,散熱風扇模組10係用以對插設於記憶體插槽組件22之記憶體32進行散熱。不過本案亦不限於此。其他實施例中,此散熱風扇模組10亦可用於對插設於擴充插槽之顯示卡、圖形處理器(GPU)或是中央處理器(CPU)進行散熱。The first figure is a schematic diagram of a
如圖中所示,散熱風扇模組10包含一散熱風扇座100以及一風扇200。散熱風扇座100包含一固定座120以及一導風罩140。固定座120適於安裝於電路板20,且鄰近於記憶體插槽組件22。以圖中之實施例為例,固定座120係安裝於記憶體插槽組件22之一端。As shown in the figure, the
請一併參照第二與三圖,第二與三圖係由不同視角顯示第一圖中之散熱風扇座100。導風罩140係連接於固定座120,呈現一彎曲管狀結構。導風罩140具有一入風口142與一出風口144,出風口144係朝向電子元件30,且鄰近於記憶體插槽組件22。風扇200設置於入風口142。風扇200產生之散熱氣流就會經由導風罩140引導流向插設於記憶體插槽組件22之記憶體32。Please refer to the second and third figures together. The second and third figures show the
以圖中之實施例為例,導風罩140之出風口144是對準記憶體插槽組件22之一端,且出風口144的方向大致平行於記憶體插槽組件22中各個記憶體插槽222的延伸方向。如此,風扇200產生之散熱氣流就可以沿著電路板表面流動,順利地流入相鄰記憶體插槽222間之通道,而對插設於記憶體插槽222之記憶體32進行散熱。Taking the embodiment in the figure as an example, the
導風罩140之出風口144的尺寸、形狀與方向係配合電子元件30進行設置。以圖中之實施例為例,圖中之散熱風扇模組10所要進行散熱的對象是插設於記憶體插槽組件22上的記憶體32,此記憶體插槽組件22具有四個併排之記憶體插槽222,可支援最多四條記憶體32。出風口144的寬度係對應於四個併排之記憶體插槽222的寬度,以確保散熱風扇模組10所產生之散熱氣流可以對插設於記憶體插槽組件22之所有記憶體32進行散熱。出風口144的位置係緊靠於電路板20,確保散熱氣流會沿著電路板20之表面流動以配合記憶體32的位置,出風口144之高度係對應於記憶體插槽組件22之端部的高度。來自出風口144的散熱氣流會由記憶體插槽222之側面流動至插設於記憶體插槽222上之記憶體32。The size, shape and direction of the
導風罩140之入風口142的尺寸與形狀係配合風扇200之外型進行設置。一實施例中,為了固定正方形的風扇200,入風口142也是呈現正方形,且入風口142的尺寸大致對應於風扇200之尺寸。此風扇200可以透過鎖固、磁吸、卡合等方式固定於入風口142。以圖中之實施例為例,風扇200之四個角落具有鎖固孔220,風扇200係以螺絲鎖固方式固定於入風口142。又,一實施例中,導風罩140之入風口142之尺寸可大於出風口144之尺寸,以提升由出風口144流出之散熱氣流之流速,確保散熱氣流可以有效排除記憶體32運作所產生之熱。The size and shape of the
第四圖係依據本案另一實施例所提供之散熱風扇座400之示意圖。The fourth figure is a schematic diagram of a
相較於第一圖之實施例中之散熱風扇座100,本實施例之散熱風扇座400在導風罩440之入風口442處設有一轉接件460。此轉接件460可用於連結二種不同尺寸之風扇,提供使用者更多的選擇。Compared with the heat
如圖中所示,轉接件460包含複數板塊462,分別透過轉軸樞接於入風口442之四周。以圖中之實施例為例,入風口442係成正方形,轉接件460具有四片板塊462,分別透過轉軸464樞接於入風口442之四個邊。各個板塊462之形狀相同,且呈現梯形。梯形之長邊係位於板塊462靠近轉軸464之一側,短邊則是位於板塊462遠離轉軸464之一側。As shown in the figure, the
請一併參照第五A至五C圖,第五A至五C圖係第四圖之散熱風扇座400搭配不同尺寸之風扇500a, 500b進行使用之示意圖。其中,第五A圖係此散熱風扇座400搭配較大尺寸之風扇500a進行使用之示意圖。第五B圖係此散熱風扇座400搭配較小尺寸之風扇500b進行使用之示意圖。第五C圖係移除第五B圖中之風扇500b以呈現轉接件460的位置。Please also refer to Figures 5A to 5C. Figures 5A to 5C are schematic diagrams of the use of the
如第四與五A圖所示,當板塊462向外翻轉至平行於入風口442之方向D1,這些板塊462之間定義出一第一正方形開孔S1以卡合風扇500a。此第一正方形開孔S1之尺寸係大致相同於入風口442之尺寸。As shown in Figures 4 and 5A, when the
如第五B與五C圖所示,當這些板塊462翻轉至垂直於入風口442之方向D2,這些板塊462係由入風口442之四周朝向入風口442之中間處延伸,而在這些板塊462之間定義出一第二正方形開孔S2以卡合風扇500b。此第二正方形開孔S2之尺寸係由入風口442之尺寸以及各板塊462之尺寸所決定,而會小於第一正方形開孔S1之尺寸。如此,即可搭配二種不同尺寸之風扇500a, 500b進行使用,而毋須改變導風罩440之本體的尺寸。As shown in the fifth B and five C figures, when these
一實施例中,各板塊462遠離轉軸464之一側可額外設置一卡合結構466,以提升在第五圖之使用模式下,各板塊462與風扇500b之間的結合強度。舉例來說,板塊462遠離轉軸464之一側可形成一凸塊,風扇500b之側邊對應於凸塊的位置可形成一缺口,透過凸塊與缺口之耦接結構,即可強化各板塊462與風扇500b之間的結合強度。In one embodiment, an additional
另外,相較於第一圖之實施例,導風罩140係固定地連接於固定座120,而無法調整其與固定座120的相對位置或傾斜角度,第四圖之散熱風扇座400之固定座420係採可調整之設計方式,容許使用者調整導風罩440與固定座420之相對位置以及導風罩440之傾斜角度。In addition, compared with the embodiment in the first figure, the
請一併參照第六圖,第六圖係顯示第四圖中之固定座420。如圖中所示,固定座420包含一底座422以及一連接件424。底座422適於安裝於電路板20,且具有一軌道4222。連接件424具有一活動部4242以及一樞接部4244,活動部4242係可移動地耦接於軌道4222,導風罩(圖未示)樞接於樞接部4244。一實施例中,連接件424係呈L型,其中,水平的部分即為活動部4242,垂直的部分即為樞接部4244。Please also refer to the sixth figure, which shows the fixing
透過此固定座420,使用者可以依據需求改變導風罩440之出風口444與記憶體插槽組件22之距離或是導風罩440相對於電路板20的傾斜角度,確保風扇產生的氣流可以有效流動至記憶體32進行散熱。Through this fixing
請一併參照第七A與七B圖,第七A與七B圖係第四圖之散熱風扇座400以不同導風罩440位置進行使用之示意圖。Please refer to Figures 7A and 7B together. Figures 7A and 7B are schematic views of the cooling
在第七A圖之範例中,連接件424是位於較靠近記憶體插槽組件22,且導風罩440之出風口444的出風方向較為平行於電路板20。在第七B圖之範例中,連接件424是位於遠離記憶體插槽組件22的位置,且導風罩440之出風口444的出風方向較為朝向電路板20之表面。In the example of FIG. 7A , the
此外,如第四圖所示,本實施例之導風罩440之側面具有複數洩壓孔446。以圖中之實施例為例,此導風罩440之上方側與左右兩側面均具有洩壓孔446(圖中僅顯示其中之一)。這些洩壓孔446可用於調節導風罩440內之氣壓,避免導風罩440內氣壓過大而產生震動或噪聲。In addition, as shown in FIG. 4 , the side surface of the
本案之散熱風扇座100, 400與散熱風扇模組10可以有效地引導風扇200, 500a, 500b產生之散熱氣流朝向電子元件30之方向吹送,改善傳統技術對於主機板上之電子元件30的散熱效果不佳的缺點。此外,對於主機板上無法裝設散熱片之電子元件30,本案之散熱風扇座100, 400與散熱風扇模組10亦有助於提升散熱效果。The heat
上述僅為本案較佳之實施例而已,並不對本案進行任何限制。任何所屬技術領域的技術人員,在不脫離本案的技術手段的範圍內,對本案揭露的技術手段和技術內容做任何形式的等同替換或修改等變動,均屬未脫離本案的技術手段的內容,仍屬於本案的保護範圍之內。The above is only a preferred embodiment of this case, and does not limit this case in any way. Anyone skilled in the technical field, within the scope of not departing from the technical means of this case, makes any form of equivalent replacement or modification to the technical means and technical content disclosed in this case, which belongs to the content of the technical means of this case. still fall within the protection scope of this case.
10:散熱風扇模組
100, 400:散熱風扇座
20:電路板
22:記憶體插槽組件
222:記憶體插槽
30:電子元件
32:記憶體
200, 500a, 500b:風扇
220:鎖固孔
120, 420:固定座
140, 440:導風罩
142, 442:入風口
144, 444:出風口
422:底座
424:連接件
4222:軌道
4242:活動部
4244:樞接部
460:轉接件
462:板塊
464:轉軸
466:卡合結構
446:洩壓孔
S1:第一正方形開孔
S2:第二正方形開孔
D1, D2:方向
10: cooling
第一圖係依據本案一實施例所提供之散熱風扇模組之示意圖; 第二與三圖係由不同視角顯示第一圖中之散熱風扇座; 第四圖係依據本案另一實施例所提供之散熱風扇座之示意圖; 第五A至五C圖係第四圖之散熱風扇座搭配不同尺寸之風扇進行使用之示意圖; 第六圖係顯示第四圖中之固定座;以及 第七A與七B圖係第四圖之散熱風扇座以不同導風罩位置進行使用之示意圖。 The first figure is a schematic diagram of a cooling fan module provided according to an embodiment of this case; The second and third pictures show the cooling fan base in the first picture from different angles; The fourth figure is a schematic diagram of a cooling fan base provided according to another embodiment of the present case; Figures 5A to 5C are schematic diagrams of the use of the cooling fan base in Figure 4 with fans of different sizes; The sixth picture shows the fixing seat in the fourth picture; and Figures 7A and 7B are schematic diagrams of the heat dissipation fan base in Figure 4 being used in different positions of the air guide cover.
10:散熱風扇模組 10: cooling fan module
100:散熱風扇座 100: cooling fan seat
20:電路板 20: circuit board
22:記憶體插槽組件 22:Memory slot assembly
220:鎖固孔 220: locking hole
222:記憶體插槽 222: memory slot
30:電子元件 30: Electronic components
32:記憶體 32: Memory
200:風扇 200: fan
120:固定座 120: fixed seat
140:導風罩 140: Wind hood
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