TWM641128U - Substrate structure - Google Patents

Abstract

A substrate structure is provided. The substrate structure includes a main body and an inductance component. The main body has a normal direction. The inductance component is disposed in the main body and at least partly penetrates through the main body. The inductance component includes a soft magnetic portion, a dielectric portion, and a coil portion. The soft magnetic portion is disposed in the main body along the normal direction of the main body. The dielectric portion is disposed in the main body and covers the soft magnetic portion. The coil portion is disposed in the main body and surrounds the dielectric portion.

Description

Substrate structure

The present work is about substrate structures, in particular substrate structures with inductive components.

With the high development of the electronic industry, various electronic products have been manufactured and applied in different fields. In order to meet design and application requirements, specific components such as inductance devices can be provided in or on the circuit board or carrier board of the electronic product. For example, the inductance element can be disposed on the surface of the circuit board or the carrier board through a soldering process. However, this method occupies the outer surface of the circuit board/carrier, thereby reducing the connection area for connecting chips. Alternatively, the inductance element can also be disposed inside the circuit board or the carrier board by an embedding process. However, this approach consumes routing space in the circuit board/substrate, requiring additional layers to maintain the original functionality. In this way, the volume of the circuit board or the carrier board will increase, thereby increasing the thickness of the circuit board and the overall packaging volume.

Therefore, although existing substrates such as circuit boards or carrier boards have gradually fulfilled their intended uses, they are not satisfactory in every respect. Therefore, there are still some issues to be overcome regarding the substrate.

In some embodiments, a substrate structure is provided. The substrate structure includes a main body and an inductor component. The body has a normal direction. The inductance component is disposed in the main body and at least partly penetrates through the main body. The inductance component includes a soft magnetic part, a dielectric part and a coil part. The soft magnetic part is arranged in the main body along the normal direction of the main body. The dielectric part is disposed in the main body and covers the soft magnetic part. The coil part is disposed in the main body and surrounds the dielectric part.

In some embodiments, the coil part includes a first coil, a second coil and a first via. The first coil is disposed in the main body and surrounds the dielectric part in a non-closed manner. The second coil is disposed in the main body and surrounds the dielectric part in a non-closed manner. The first guide hole is disposed in the main body, and its two ends are electrically connected to the first coil and the second coil respectively.

In some embodiments, the inductive component is completely embedded in the body.

In some embodiments, the substrate structure further includes a first conductive layer and a second conductive layer. The first conductive layer is disposed in the main body, and the first conductive layer is disposed on the same layer as the first coil. The second conductive layer is disposed in the main body, and the second conductive layer is disposed on the same layer as the second coil.

In some embodiments, the coil portion further includes a third coil, a second via, a fourth coil, and a third via. The third coil is disposed on the first surface of the main body and surrounds the dielectric part in a non-closed manner. The second guide hole is disposed in the main body, and its two ends are electrically connected to the third coil and the first coil respectively. The fourth coil is disposed on the second surface of the main body and surrounds the dielectric part non-closed, wherein the first surface and the second surface are opposite to each other. The third guide hole is disposed in the main body, and its two ends are electrically connected to the fourth coil and the third coil respectively.

In some embodiments, the top surface and the bottom surface of the inductor component are respectively exposed on the first surface and the second surface of the body.

In some embodiments, the substrate structure further includes a third conductive layer and a fourth conductive layer. The third conductive layer is disposed on the first surface of the main body, and the third conductive layer is disposed on the same layer as the third coil. The fourth conductive layer is disposed on the second surface of the main body, and the fourth conductive layer is disposed on the same layer as the fourth coil.

In some embodiments, the first coil, the second coil, the third coil and the fourth coil respectively have openings, and the projections of the openings on the second surface are adjacent to each other but do not overlap.

In some embodiments, projections of the first via hole, the second via hole and the third via hole on the second surface are adjacent to each other but do not overlap.

In some embodiments, the substrate structure further includes a protective layer disposed on the main body.

The disclosed substrate structure can be applied to various types of electronic devices. In order to make the features and advantages of the present disclosure more comprehensible, various embodiments are specially cited below, together with the accompanying drawings, to be described in detail as follows.

1a, 1b, 1c: Substrate structure

10: Basic substrate

100: core layer

100a, 13a, 14a, 19a, 26a, 32a, 35a: top surface

100b, 11a, 12a, 19b, 25a, 32b, 35a: bottom surface

101,231,241: conductive layer

11: First coil

110, 130, 350, 360: opening

110a, 130a, 15a, 350a, 360a, 37a, 38a: projection

12: The first conductive layer

13: Second coil

14: Second conductive layer

15: The first guide hole

16,27,28: guide hole

17,39: coil department

18,20,31,33: through hole

19,32: Dielectric part

21,34: soft magnetic part

21a: Soft Magnetic Materials

21b: Dielectric material

22,40,41,42: inductance components

23,24: Build-up structure

230,240: dielectric layer

25: The third conductive layer

26: The fourth conductive layer

29,39: subject

29a: first surface

29b: second surface

30: protective layer

35: The third coil

36: Fourth coil

37: Second guide hole

38: The third guide hole

40a: top surface

40b: bottom surface

d1, d2: distance

d3, d4: coil diameter

Z: normal direction

The viewpoints of the embodiments of the present disclosure can be better understood through the following detailed description and the accompanying drawings. It is worth noting that, in accordance with the standard practice in the industry, some features may not be drawn to scale. In fact, the dimensions of various components may be increased or decreased for clarity of description.

Fig. 1, Fig. 2, Fig. 4 to Fig. 7, and Fig. 10 to Fig. 12 are some according to the present disclosure respectively Examples, showing schematic cross-sectional views of substrate structures at various stages in the fabrication process.

FIG. 3 is a schematic perspective view showing a coil part according to some embodiments of the present disclosure.

FIG. 8 is an enlarged schematic view showing a soft magnetic portion according to some embodiments of the present disclosure.

FIG. 9 is a schematic perspective view showing an inductor component according to some embodiments of the present disclosure.

13 to 18 , and FIG. 20 are schematic cross-sectional views showing substrate structures at various stages in the manufacturing method according to other embodiments of the present disclosure.

FIG. 19 is a schematic perspective view showing an inductor component according to some embodiments of the present disclosure.

FIG. 21 is a schematic cross-sectional view showing a substrate structure according to still other embodiments of the present disclosure.

The following disclosure provides many different embodiments or examples for implementing different components in the provided substrate structures. Specific examples of components and their configurations are described below to simplify the embodiments of the disclosure, but certainly not to limit the disclosure. For example, if it is mentioned in the description that the first component is formed on the second component, it may include an embodiment in which the first component and the second component are in direct contact, or may include forming an additional component on the first component and the second component An embodiment in which the first component and the second component are not in direct contact. In addition, the present disclosure may repeat element symbols and/or characters in different embodiments or examples. This repetition is for brevity and clarity and does not represent a relationship between the various embodiments and/or examples discussed.

The directional terms mentioned herein, such as "upper", "lower", "left", "right" and similar terms refer to the directions of the drawings. Therefore, the method used The terminology is used to describe, not to limit, the present disclosure.

In some embodiments of the present disclosure, terms such as "arrangement", "connection" and similar terms related to arrangement and connection, unless otherwise specified, may refer to two parts in direct contact, or may also refer to two parts that are not in direct contact. Contact, where there is an extra junction component between the two structures. The terms about installation and connection may also include the case where both structures are movable, or both structures are fixed.

In addition, the "first", "second" and similar terms mentioned in this specification or the scope of the patent application are used to name different components or to distinguish different embodiments or ranges, and are not used to limit the upper limit of the number of components or lower limit, nor is it intended to limit the order of manufacture or arrangement of components.

Hereinafter, "about", "substantially" or similar terms mean within 10%, or within 5%, or within 3%, or within 2%, or within 1% of a given value or range of values within, or within 0.5%. The quantities given here are approximate quantities, that is, the meaning of "approximately" or "substantially" may still be implied if "approximately" or "substantially" is not specified.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It can be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having meanings consistent with the background or context of the related technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner, Unless otherwise specified in the embodiments of the present disclosure.

Some variations of the embodiment are described below. in different diagrams and descriptions In the embodiments, the same or similar reference numerals are used to designate the same or similar components. It is understood that additional steps may be provided before, during, and after the method, and that some recited steps may be substituted or deleted for other embodiments of the method.

In some substrates, in order to meet application requirements, passive elements such as inductance elements can be disposed in or on the substrate. For example, the inductance element and the substrate can be formed separately, and then the inductance element can be embedded in the substrate or bonded on the substrate. However, taking the embedding method as an example, it requires an additional build-up process on the substrate to accommodate the inductor element. On the other hand, taking the bonding method as an example, the overall shape of the product will be complicated because the inductance element protrudes out of the substrate.

Accordingly, the present disclosure provides a substrate structure with an inductor component, which directly forms the inductor component in the circuit board/carrier by utilizing the circuit and blind hole design during the manufacturing process of the substrate structure. In this way, not only the manufacturing process can be simplified, but also the volume occupied by the inductance component can be minimized, so as to realize the thinning of the substrate structure.

Refer to Figures 1 to 11. Among them, FIGS. 1, 2, 4-7 and 10-12 are schematic cross-sectional views showing substrate structures at various stages in the manufacturing method according to some embodiments of the present disclosure; FIG. 3 is a schematic diagram showing FIG. 8 is an enlarged schematic view of the soft magnetic portion according to some embodiments of the present disclosure; and FIG. 9 is a perspective view of an inductor component according to some embodiments of the present disclosure. Referring first to FIG. 1 , in some embodiments, a base substrate 10 is provided, which may be or include a copper foil substrate, but the disclosure is not limited thereto. In some embodiments, the base substrate 10 may include a core layer 100 and a conductive layer 101 . In some embodiments, the core layer 100 may be or may include polymer materials, fiber materials, other A prepreg of suitable material is used, although the disclosure is not limited thereto. For example, the polymer material may be or include epoxy resin, polyimide (PI), other suitable polymer materials or combinations thereof, but the disclosure is not limited thereto. The fiber material may include carbon fiber, glass fiber, other suitable fiber materials or combinations thereof, but the present disclosure is not limited thereto.

In some embodiments, the conductive layer 101 can be disposed on the core layer 100 . For example, the conductive layer 101 can completely cover the top surface 100 a and the bottom surface 100 b of the core layer 100 , or partially cover the top surface 100 a and the bottom surface 100 b of the core layer 100 . In some embodiments, the conductive layer 101 can be or include a conductive material. For example, the conductive material may be aluminum (Al), copper (Cu), alloys thereof or compounds thereof, but the disclosure is not limited thereto. In some embodiments, the conductive layer 101 can be copper foil. For example, the copper foil may be or include brass, phosphor bronze, berylliun alloy or oxygen-free copper, but the disclosure is not limited thereto.

Referring to FIG. 2 and FIG. 3 , in some embodiments, the first coil 11 , the first conductive layer 12 , the second coil 13 , the second conductive layer 14 , the first via hole 15 and the via hole 16 are formed. Wherein, the first guide hole 15 is not located on the cross-section shown in FIG. 2 , so the following will be described as shown in FIG. 3 . In some embodiments, a patterned mask layer is firstly formed on the conductive layer 101 . For example, the patterned mask layer can be or include photoresist, but the disclosure is not limited thereto. Next, through holes penetrating the base substrate 10 are formed. In some embodiments, the via holes may be formed by laser drilling process, mechanical drilling process, other suitable drilling processes or a combination thereof, but the disclosure is not limited thereto. Alternatively, through holes may be formed in the base substrate 10 first, and then a patterned mask layer may be formed on the base substrate 10 .

Continuing the above process, fill the exposed area of the patterned mask layer with conductive material to form the first coil 11 and the first conductive layer 12 on the top surface 100a of the core layer 100, and on the bottom surface 100b of the core layer 100 The second coil 13 and the second conductive layer 14 are formed. In some embodiments, a conductive material is further disposed in the through hole to form the first via hole 15 (as shown in FIG. 3 ) and the via hole 16 (as shown in FIG. 2 ). Wherein, the two ends of the first via 15 are respectively electrically connected to the first coil 11 and the second coil 13 (as shown in FIG. 3 ), and the two ends of the via 16 are respectively electrically connected to the first conductive layer 12 and the second coil. The second conductive layer 14 (as shown in FIG. 2 ). It should be noted that although only one via hole (ie, via hole 16 ) for connecting the first conductive layer 12 and the second conductive layer 14 is shown in the drawings of the present disclosure, the present disclosure is not limited thereto. . The number of guide holes can be determined according to the design, for example, two, three or more than three guide holes can be provided. In some embodiments, the conductive material can be disposed on the core layer 100 and in the through hole by electroplating process, but the disclosure is not limited thereto. In some embodiments, the aforementioned conductive material may be similar or identical to the material of the conductive layer 101 , but the disclosure is not limited thereto.

Following the above process, after forming the first coil 11 , the second coil 13 , the first conductive layer 12 , the second conductive layer 14 , the first via hole 15 and the via hole 16 , the patterned mask layer is removed. Next, the conductive layer 101 not covered by the first coil 11 , the first conductive layer 12 , the second coil 13 , the second conductive layer 14 , the first via hole 15 and the via hole 16 is removed. For example, an etching process can be performed on the conductive layer 101 until the parts not covered by the first coil 11 , the first conductive layer 12 , the second coil 13 , the second conductive layer 14 , the first via hole 15 and the via hole 16 are exposed. Up to 100 core layers. Since the remaining conductive layer 101 can be regarded as the first coil 11, the first conductive layer 12, the second coil 13, the second Parts of the conductive layer 14 , the first via hole 15 and the via hole 16 are not shown separately for the sake of simplification of the drawing.

As shown in FIG. 2, in some embodiments, the first coil 11 and the first conductive layer 12 are disposed on the top surface 100a of the core layer 100 in the same layer through the same process, and therefore the bottom of the first coil 11 The surface 11a and the bottom surface 12a of the first conductive layer 12 are flush with each other. Similarly, the second coil 13 and the second conductive layer 14 are disposed on the bottom surface 100b of the core layer 100 in the same layer by the same process, and thus the top surface 13a of the second coil 13 is the same as that of the second conductive layer 14. The top surface 14a is flush. In some embodiments, the first conductive layer 12 and the second conductive layer 14 can be conductive lines or conductive patterns, but the disclosure is not limited thereto.

As shown in FIG. 3 , in some embodiments, the first coil 11 and the second coil 13 are circular non-closed coils, but the present disclosure is not limited thereto. For example, the first coil 11 and the second coil 13 may be oval non-closed coils, rectangular non-closed coils, or triangular non-closed coils, but the disclosure is not limited thereto. In some embodiments where the first coil 11 and the second coil 13 are circular non-closed coils, the distance d1 between the inner side of the first coil 11 and its center of circle and the distance d2 between the inner side of the second coil 13 and its circle center Can be the same or different. In some embodiments, the coil diameter d3 of the first coil 11 and the coil diameter d4 of the second coil 13 may be the same or different.

In some embodiments, the first coil 11 , the second coil 13 and the first guide hole 15 may be collectively referred to as a coil part 17 and used to generate a magnetic field. In some embodiments, in order to strengthen the magnetic field strength generated by the coil part 17 when energized, the total coil length of the coil part 17 can be increased. For example, the first coil 11 has an opening 110, and the first Both ends of the coil 11 are electrically connected to the first conductive layer 12 and the first via 15 respectively. The second coil 13 has an opening 130 , and two ends of the second coil 13 are electrically connected to the second conductive layer 14 and the first via 15 respectively. On the bottom surface 100b, by making the projection 110a of the opening 110 and the projection 130a of the opening 130 adjacent to each other but not overlapping, and making the projection 15a of the first guide hole 15 be located between the projection 110a of the opening 110 and the projection 130a of the opening 130 In between, the total coil length of the coil part 17 can be increased.

Referring to FIG. 4 , in some embodiments, a through hole 18 is formed in the first coil 11 and the second coil 13 along the normal direction Z of the core layer 100, and the through hole 18 penetrates the top surface 100a and the top surface 100a of the core layer 100. Bottom surface 100b. In some embodiments, the via hole 18 may be formed by a laser drilling process, a mechanical drilling process, other suitable drilling processes or a combination thereof, but the disclosure is not limited thereto.

Referring to FIG. 5 , in some embodiments, a dielectric material is filled in the through hole 18 to form a dielectric portion 19 . In some embodiments, the dielectric material may be or include thermosetting resin, light-activated resin, combinations thereof, or other suitable materials, but the disclosure is not limited thereto. In some embodiments, the distance between the dielectric part 19 and the coil part 17 on the horizontal plane may be 0 mm to 1 mm, but the disclosure is not limited thereto. In some embodiments, the top surface 19a of the dielectric portion 19 may be flush with the top surface 100a of the core layer 100, and/or the bottom surface 19b of the dielectric portion 19 may be flush with the bottom surface 100b of the core layer 100, but The present disclosure is not limited thereto. In some embodiments where the dielectric part 19 protrudes from the top surface 100a and the bottom surface 100b, the dielectric part 19 may directly contact the first coil 11 or the second coil 13 in the coil part 17, but the disclosure is not limited thereto.

Referring to FIG. 6 , in some embodiments, a via hole 20 is formed in the dielectric portion 19 along the normal direction Z of the core layer 100 , and the via hole 20 penetrates the top surface 19 a and the bottom surface 19 b of the dielectric portion 19 . In some embodiments, the via hole 20 may be formed by a laser drilling process, a mechanical drilling process, other suitable drilling processes or a combination thereof, but the disclosure is not limited thereto.

Referring to FIGS. 7 to 9 , in some embodiments, a soft magnetic material is filled in the through hole 20 to form the soft magnetic portion 21 . In some embodiments, the soft magnetic material may be or include iron, cobalt, nickel, alloys thereof, or other suitable materials, but the present disclosure is not limited thereto. As shown in (A) of FIG. 8 , in some embodiments, the soft magnetic portion 21 can be formed by filling columnar soft magnetic material. As shown in FIG. 8(B), in some embodiments, the powdered soft magnetic material 21 a and the dielectric material 21 b may be mixed first, and then the mixed material is injected into the through hole 20 to form the soft magnetic portion 21 . For example, the dielectric material 21 b used for mixing with the soft magnetic material 21 a may be similar or identical to the material of the dielectric portion 19 , but the disclosure is not limited thereto.

As shown in FIG. 9 , in some embodiments, the soft magnetic part 21 , the dielectric part 19 and the coil part 17 may be collectively referred to as an inductor component 22 . Wherein, the soft magnetic portion 21 is disposed in the core layer 100 along the normal direction Z of the core layer 100, the dielectric portion 19 is disposed in the core layer 100 and covers the soft magnetic portion 21, and the coil portion 17 is disposed in the core layer 100 and surrounding dielectric portion 19 . In this way, by applying current to the coil portion 17 , the soft magnetic portion 21 can be magnetized by the magnetic field generated by the coil portion 17 , thereby achieving the effect of interacting with other components or devices.

Referring to FIG. 10, in some embodiments, a build-up structure 23 and a build-up structure 24 are provided on both sides of the core layer 100 to cover the top surface 100a, the bottom surface 100b, the first coil 11, the first The conductive layer 12 , the second coil 13 , the second conductive layer 14 and the guide hole 16 . For example, the build-up structure 23 and the build-up structure 24 can be laminated on the core layer 100 through a build-up process, but the present disclosure is not limited thereto. In some embodiments, the build-up structure 23 includes a dielectric layer 230 and a conductive layer 231 , and the build-up structure 24 includes a dielectric layer 240 and a conductive layer 241 . In some embodiments, the materials of the dielectric layer 230 and the dielectric layer 240 may be similar or identical to the material of the core layer 100 , but the disclosure is not limited thereto. In some embodiments, the materials of the conductive layer 231 and the conductive layer 241 may be similar or identical to the material of the conductive layer 101 , but the disclosure is not limited thereto.

Referring to FIG. 11 , in some embodiments, a third conductive layer 25 , a fourth conductive layer 26 , a via hole 27 and a via hole 28 are formed. In some embodiments, a patterned mask layer is firstly formed on the conductive layer 231 and the conductive layer 241 . For example, the patterned mask layer can be or include photoresist, but the disclosure is not limited thereto. Next, a blind hole penetrating through the dielectric layer 230 and the dielectric layer 240 is formed. In some embodiments, the blind holes may be formed by laser drilling process, mechanical drilling process, other suitable drilling processes or a combination thereof, but the disclosure is not limited thereto. Alternatively, blind holes can be formed in the dielectric layer 230 and the dielectric layer 240 first, and then a patterned mask layer can be formed on the conductive layer 231 and the conductive layer 241 .

Following the above process, the exposed area of the patterned mask layer is filled with conductive material to form the third conductive layer 25 and the fourth conductive layer 26 on the dielectric layer 230 and the dielectric layer 240 respectively. In some embodiments, a conductive material is further disposed in the blind hole to form the guide hole 27 and the guide hole 28 . Wherein, the third conductive layer 25 connects with the first through the guide hole 27 The conductive layer 12 is electrically connected, and the fourth conductive layer 26 is electrically connected to the second conductive layer 14 through the via hole 28 . In some embodiments, the conductive material can be disposed on the conductive layer 231 and the conductive layer 241 and in the blind holes through an electroplating process, but the disclosure is not limited thereto. In some embodiments, the aforementioned conductive material may be similar or identical to the material of the conductive layer 101 , but the disclosure is not limited thereto.

Following the above process, after removing the patterned mask layer, the conductive layer 231 and the conductive layer 241 not covered by the third conductive layer 25 , the fourth conductive layer 26 , the via hole 27 and the via hole 28 are removed. For example, an etching process is performed on the conductive layers 231, 241 until the dielectric layer 230 not covered by the third conductive layer 25 and the via hole 27 and the dielectric layer not covered by the fourth conductive layer 26 and the via hole 28 are exposed. electrical layer 240. Since the remaining conductive layers 231 and 241 can be regarded as part of the third conductive layer 25, the fourth conductive layer 26, the via hole 27 and the via hole 28 respectively, they are not shown separately for the sake of simplifying the drawings. .

In some embodiments, the dielectric layer 230 , the core layer 100 and the dielectric layer 240 may be collectively referred to as the body 29 . In this case, the top surface of the dielectric layer 230 may be referred to as the first surface 29 a of the body 29 . The bottom surface of the dielectric layer 240 may be referred to as the second surface 29b of the body 29 .

Referring to FIG. 12 , in some embodiments, a protection layer 30 is disposed on the first surface 29 a and the second surface 29 b of the body 29 to form the substrate structure 1 a. In some embodiments, protection may be provided by dip coating, roller coating, curtain coating, spraying, screen printing, other suitable processes, or combinations thereof Layer 30, but the present disclosure is not limited thereto. In some embodiments, the material of the protective layer 30 may be or may include resin or other suitable materials material, but the disclosure is not limited thereto. For example, the protective layer 30 can be solder resist ink.

In the above embodiments, the inductor element 22 is formed together with the metal layer or circuit layer (eg, the first conductive layer 12 and the second conductive layer 14 ) in the main body 29 and is completely embedded in the main body 29 . In other words, the present disclosure adopts the design of wiring with blind holes to directly form the inductance component in the circuit board/carrier, and its direction is perpendicular to the wiring direction. In this way, the present disclosure can be provided with an inductor element without reducing the chip connection area of the substrate (eg, a specific area on the outer surface of the main body) and/or without increasing the volume of the substrate. In addition, the substrate structure of the present disclosure can also select coils of different sizes according to user requirements, or make the inductance component span multiple circuit layers to meet the design requirements. Based on the above, although an embodiment of the substrate structure with the inductor component has been provided above, the present disclosure is not limited thereto. Hereinafter, another embodiment of a substrate structure with an inductor component will be provided as a reference.

Refer to Figures 13 to 20. 13-18 and FIG. 20 are schematic cross-sectional views showing substrate structures at various manufacturing stages according to other embodiments of the present disclosure; and FIG. 19 is a perspective view showing inductor components according to other embodiments of the present disclosure. It should be noted that FIG. 13 is a subsequent step following FIG. 2 , and all previous steps can be described with reference to FIG. 1 and FIG. 2 , so details are not repeated here. In addition, steps similar to the aforementioned steps will not be repeated here. The main difference between this embodiment and the previous embodiments is that the inductor component of this embodiment runs through the whole body instead of being embedded in the body, so that the substrate structure can be applied in different electronic devices.

Continuing from FIG. 2, as shown in FIG. 13, in some embodiments, a build-up structure 23 and a build-up structure 24 are arranged on both sides of the core layer 100 to cover the core layer 100 includes a top surface 100 a , a bottom surface 100 b , a first coil 11 , a first conductive layer 12 , a second coil 13 , a second conductive layer 14 and a via 16 . For example, the build-up structure 23 and the build-up structure 24 can be laminated on the core layer 100 through a build-up process, but the present disclosure is not limited thereto. In some embodiments, the build-up structure 23 includes a dielectric layer 230 and a conductive layer 231 , and the build-up structure 24 includes a dielectric layer 240 and a conductive layer 241 . In some embodiments, the materials of the dielectric layer 230 and the dielectric layer 240 may be similar or identical to the material of the core layer 100 , but the disclosure is not limited thereto. In some embodiments, the materials of the conductive layer 231 and the conductive layer 241 may be similar or identical to the material of the conductive layer 101 , but the disclosure is not limited thereto.

In some embodiments, the dielectric layer 230 , the core layer 100 and the dielectric layer 240 may be collectively referred to as the body 29 . In this case, the top surface of the dielectric layer 230 may be referred to as the first surface 29a of the body. The bottom surface of the dielectric layer 240 may be referred to as the second surface 29b of the body.

Referring to FIG. 14 , in some embodiments, a through hole 31 is formed in the main body 29 along the normal direction Z of the main body 29 , and the through hole 31 penetrates through the first surface 29 a and the second surface 29 b of the main body 29 . In some embodiments, the via hole 31 may be formed by a laser drilling process, a mechanical drilling process, other suitable drilling processes or a combination thereof, but the disclosure is not limited thereto.

Referring to FIG. 15 , in some embodiments, a dielectric material is filled in the through hole 31 to form a dielectric portion 32 . In some embodiments, the dielectric material may be or include a thermosetting resin, a photosensitive resin, a combination thereof, or other suitable materials, but the disclosure is not limited thereto. In some embodiments, the dielectric part 32 and the first coil 11 and the second coil 13 The spacing on the horizontal plane may be 0 mm to 1 mm, but the present disclosure is not limited thereto. In some embodiments, the dielectric part 32 may directly contact the first coil 11 and the second coil 13 .

Referring to FIG. 16 , in some embodiments, a via hole 33 is formed in the dielectric portion 32 along the normal direction Z of the main body 29 , and the via hole 33 penetrates the top surface 32 a and the bottom surface 32 b of the dielectric portion 32 . In some embodiments, the via hole 33 may be formed by a laser drilling process, a mechanical drilling process, other suitable drilling processes or a combination thereof, but the disclosure is not limited thereto.

Referring to FIG. 17 , in some embodiments, a soft magnetic material is filled in the through hole 33 to form a soft magnetic portion 34 . In some embodiments, the soft magnetic material may be or include iron, cobalt, nickel, alloys thereof, or other suitable materials, but the present disclosure is not limited thereto. In some embodiments, the soft magnetic portion 34 can be formed by filling columnar soft magnetic material. In some embodiments, the powdered soft magnetic material (for example, the soft magnetic material 21a of FIG. 8(B) ) can be mixed with the dielectric material (for example, the dielectric material 21b of FIG. The mixed material is injected into the through hole 33 to form the soft magnetic portion 34 . For example, the dielectric material mixed with the soft magnetic material may be similar or identical to the material of the dielectric portion 32 , but the disclosure is not limited thereto.

18 and 19, in some embodiments, the third conductive layer 25, the guide hole 27, the third coil 35 and the second guide hole 37 are formed at a position adjacent to the first surface 29a, and are adjacent to the second surface. The fourth conductive layer 26 , the guide hole 28 , the fourth coil 36 and the third guide hole 38 are formed at the position of 29 b. Wherein, the second guide hole 37 and the third guide hole 38 are not located on the cross-section shown in FIG. 18 , so the following will be described as shown in FIG. 19 . In some embodiments, a patterned mask layer is formed on the conductive layer 231 and the conductive layer first. on the electrical layer 241. For example, the patterned mask layer can be or include photoresist, but the disclosure is not limited thereto. Next, a blind hole penetrating through the dielectric layer 230 and the dielectric layer 240 is formed. In some embodiments, the blind holes may be formed by laser drilling process, mechanical drilling process, other suitable drilling processes or a combination thereof, but the disclosure is not limited thereto. Alternatively, blind holes can be formed in the main body 29 first, and then a patterned mask layer can be formed on the conductive layer 231 and the conductive layer 241 .

Continuing the above process, fill the exposed area of the patterned mask layer with conductive material to form the third conductive layer 25 and the third coil 35 on the first surface 29a of the main body 29, and on the second surface 29b of the main body 29 The fourth conductive layer 26 and the fourth coil 36 are formed. In other words, the third conductive layer 25 and the third coil 35 are disposed on the first surface 29a of the main body 29 in the same layer through the same process, and therefore the bottom surface 25a of the third conductive layer 25 and the bottom surface of the third coil 35 The surfaces 35a are flush with each other. Similarly, the fourth conductive layer 26 and the fourth coil 36 are disposed on the second surface 29b of the main body 29 in the same layer through the same process, and therefore the top surface 26a of the fourth conductive layer 26 and the fourth coil 36 The top surface 36a is flush. In some embodiments, the conductive material can be disposed on the conductive layer 231 and the conductive layer 241 through an electroplating process, but the disclosure is not limited thereto. In some embodiments, the aforementioned conductive material may be similar or identical to the material of the conductive layer 101 , but the disclosure is not limited thereto.

In some embodiments, a conductive material is further provided in the blind hole to form a guide hole 27 (as shown in FIG. 18 ), a guide hole 28 (as shown in FIG. 18 ), and a second guide hole 37 (as shown in FIG. 19 ). ) and the third guide hole 38 (as shown in Figure 19). Wherein, the third conductive layer 25 is electrically connected to the first conductive layer 12 through the via hole 27, and the fourth conductive layer 26 is electrically connected to the first conductive layer 12 through the via hole. 28 is electrically connected to the second conductive layer 14 . In addition, the second guide hole 37 is disposed in the main body 29 , and its two ends are electrically connected to the third coil 35 and the first coil 11 respectively. The third guide hole 38 is disposed in the main body 29 , and its two ends are electrically connected to the fourth coil 36 and the second coil 13 respectively. In some embodiments, the conductive material can be disposed in the blind hole by electroplating process, but the disclosure is not limited thereto. In some embodiments, the aforementioned conductive material may be similar or identical to the material of the conductive layer 101 , but the disclosure is not limited thereto.

In some embodiments, after the patterned mask layer is removed, the parts not covered by the third conductive layer 25, the fourth conductive layer 26, the via 27, the via 28, the third coil 35 and the fourth coil 36 are removed. The conductive layer 231 and the conductive layer 241 . For example, an etching process is performed on the conductive layer 231 and the conductive layer 241, until the third conductive layer 25, the fourth conductive layer 26, the via hole 27, the via hole 28, the third coil 35, and the fourth coil 36 are exposed. Covered subject 29 so far. Since the remaining conductive layer 231 and the remaining conductive layer 241 can be regarded as a part of the third conductive layer 25, the fourth conductive layer 26, the guide hole 27, the guide hole 28, the third coil 35 and the fourth coil 36 respectively, it is For the sake of simplifying the drawings, they are not shown separately.

As shown in FIG. 19, in some embodiments, the first coil 11, the second coil 13, the third coil 35, the fourth coil 36, the first guide hole 15, the second guide hole 37 and the third guide hole 38 can be They are collectively referred to as the coil portion 39 . In some embodiments, the soft magnetic portion 34 , the dielectric portion 32 and the coil portion 39 may be collectively referred to as an inductor component 40 . Wherein, the soft magnetic part 34 is arranged in the main body 29 along the normal direction Z of the main body 29, the dielectric part 32 is arranged in the main body 29 and covers the soft magnetic part 34, and the coil part 39 is arranged in the main body 29 and surrounds the dielectric part 32. In this way, by applying current (for example, AC Electricity), the soft magnetic part 34 can be magnetized by the magnetic field generated by the coil part 39, so as to achieve the effect of interacting with other components or devices.

In some embodiments, the distances between the inner sides of the first coil 11 , the second coil 13 , the third coil 35 and the fourth coil 36 and their centers may be the same or different. In some embodiments, the coil diameters of the first coil 11 , the second coil 13 , the third coil 35 and the fourth coil 36 may be the same or different.

In some embodiments, the first coil 11 has an opening 110, and its two ends are respectively electrically connected to the second via 37 and the first via 15; the second coil 13 has an opening 130, and its two ends are respectively electrically connected The third via hole 38 and the first via hole 15; the third coil 35 has an opening 350, and its two ends are respectively electrically connected to the second via hole 37 and the third conductive layer 25; and the fourth coil 36 has an opening 360, and Two ends thereof are electrically connected to the third via 38 and the fourth conductive layer 26 respectively. By having the projections of opening 110, opening 130, opening 350, and opening 360 on second surface 29b of body 29 (e.g., projection 110a, projection 130a, projection 350a, and projection 360a) adjacent to each other but not overlapping, the coil The total coil length of section 17 is relatively large. Alternatively, by making the projections of the first guide hole 15, the second guide hole 37 and the third guide hole 38 on the second surface 29b of the main body 29 (for example, the projection 15a, the projection 37a and the projection 38a) adjacent to each other but Without overlapping, the total coil length of the coil portion 39 can be made larger.

Referring to FIG. 20 , in some embodiments, a protection layer 30 is disposed on the first surface 29 a and the second surface 29 b of the body 29 to form the substrate structure 1 b. Compared with the substrate structure 1a, the top surface 40a and the bottom surface 40b of the inductor element 40 in the substrate structure 1b are respectively exposed to the first surface 29a and the second surface 29b of the main body 29 . In other words, the manufacturing process can be selected according to requirements, so that the substrate structure is provided with an inductance component embedded in the main body, an inductance component penetrating through the main body, or a combination thereof. For example, refer to FIG. 21 , which is a schematic cross-sectional view showing a substrate structure according to still other embodiments of the present disclosure. As shown in the figure, the inductance element 41 embedded in the main body 39 and the inductance element 42 penetrating through the main body 39 can be simultaneously provided by combining the above-mentioned processes at various stages to obtain the substrate structure 1c.

To sum up, according to the embodiments of the present disclosure, a substrate structure with an inductor component is provided. By forming the inductance element during the manufacturing process of the substrate structure, not only the manufacturing process can be simplified, but also the overall volume of the substrate structure can be reduced and/or the area of the chip connection area can be increased, thereby realizing thinning of the substrate structure. In addition, since the inductance components of the present disclosure can be installed independently or in multiples in a manner of being completely embedded or penetrating through the main body according to user requirements, thereby achieving more flexible applicability.

As long as the components in the disclosed embodiments do not violate the spirit of creation or conflict, they can be mixed and matched arbitrarily. In addition, the protection scope of the present disclosure is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the specification, and anyone with ordinary knowledge in the field can understand from the disclosure Processes, machines, manufactures, material compositions, devices, methods and steps developed at present or in the future can be used according to the present disclosure as long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present disclosure includes the above-mentioned process, machine, manufacture, composition of matter, device, method and steps. Any embodiment or claims of the present disclosure need not achieve all the objectives, advantages and/or features disclosed in the present disclosure.

Several embodiments are summarized above so that those skilled in the art can better understand the viewpoints of the embodiments of the present disclosure. Those skilled in the art should understand that other processes and structures can be designed or modified based on the embodiments disclosed herein to achieve the same purpose and/or advantages as the embodiments introduced herein. Those with ordinary knowledge in this field should also understand that such equivalent processes and structures do not deviate from the spirit and scope of this disclosure, and can be made in various ways without departing from the spirit and scope of this disclosure. Such changes, substitutions and substitutions.

1b: Substrate structure

11: First coil

12: The first conductive layer

13: Second coil

14: Second conductive layer

16,27,28: guide hole

25: The third conductive layer

26: The fourth conductive layer

29: subject

29a: first surface

29b: second surface

30: protective layer

32: Dielectric part

34: Soft magnetic part

35: The third coil

36: Fourth coil

40: Inductance components

40a: top surface

40b: bottom surface

Z: normal direction

Claims (10)

A substrate structure, comprising: a main body having a normal direction; and an inductance component disposed in the main body and at least partly passing through the main body, the inductance component comprising: a soft magnetic part along the normal direction of the main body It is arranged in the main body; a dielectric part is arranged in the main body and covers the soft magnetic part; and a coil part is arranged in the main body and surrounds the dielectric part. The substrate structure as claimed in claim 1, wherein the coil portion comprises: a first coil disposed in the main body and surrounding the dielectric portion non-closed; a second coil disposed in the main body and not enclosing the dielectric part; and a first guide hole, which is disposed in the main body, and its two ends are electrically connected to the first coil and the second coil respectively. The substrate structure as claimed in claim 2, wherein the inductor element is completely embedded in the main body. The substrate structure according to claim 2, further comprising: a first conductive layer disposed in the main body, and the first conductive layer is disposed on the same layer as the first coil; and a second conductive layer disposed on the In the main body, and the second conductive layer is set on the same layer as the second coil. The substrate structure as claimed in item 2, wherein the coil portion further includes Comprising: a third coil, arranged on a first surface of the main body, and surrounding the dielectric part in a non-closed manner; a second guide hole, arranged in the main body, and its two ends are respectively electrically connected to the a third coil and the first coil; a fourth coil disposed on a second surface on the body and non-closedly surrounding the dielectric portion, wherein the first surface and the second surface are opposite to each other; and A third guide hole is arranged in the main body, and its two ends are electrically connected to the fourth coil and the third coil respectively. The substrate structure as claimed in claim 5, wherein the top surface and the bottom surface of the inductor component are respectively exposed to the first surface and the second surface of the main body. The substrate structure according to claim 5, further comprising: a third conductive layer disposed on the first surface of the main body, and the third conductive layer is disposed on the same layer as the third coil; and a fourth conductive layer A layer is disposed on the second surface of the main body, and the fourth conductive layer is disposed on the same layer as the fourth coil. The substrate structure according to claim 5, wherein the first coil, the second coil, the third coil and the fourth coil each have an opening, and the projections of the openings on the second surface are adjacent to each other but not overlapping. The substrate structure according to claim 5, wherein projections of the first via, the second via, and the third via on the second surface are adjacent to each other but do not overlap. The substrate structure as claimed in claim 1, further comprising a protective layer, The protective layer is disposed on the main body.

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