TWM640824U - Module having components preventing power reverse flow and device integrating the same - Google Patents

Abstract

A device integrating a module with a power supply backflow prevention component includes a main circuit board and a module with a power supply backflow prevention component. The module with components for preventing power backflow includes a sub-circuit board and a device for preventing power backflow. The device for preventing power backflow includes a power backflow prevention element and a control circuit. The sub-circuit board is arranged on the main circuit board. A power backflow prevention device is provided on the sub-circuit board. The control circuit is coupled with the anti-power backflow element, and is used for controlling the turn-on and shutdown of the anti-power backflow element.

Description

Module with components for preventing power backflow and device integrating the module

The invention relates to a module with a power backflow prevention element and a device integrating the module, especially a space-reduced module with a power backflow prevention element and a device integrating the module.

The ORing power switch (i.e. implementing-or-operating a power switch such as MOSFET) is the most commonly used anti-backflow device for redundant power supply, which has relatively small power loss. Traditionally, the technical design of ORing power switches uses ORing diodes on each supply side to protect the backup supply voltage when one of the supplies is shorted. When a short circuit occurs between the power supply and the ground line, this diode can prevent reverse current flow (that is, prevent the reverse flow of the power supply), so the system can isolate the faulty power supply and then take over from the backup power supply.

As shown in FIG. 1 , it is a schematic circuit diagram of an existing ORing power switch control circuit. The ORing power switch is controlled through the switch controller (that is, the ORing power switch controller). Furthermore, as shown in FIG. 2 , it is a schematic diagram of the printed circuit board wiring of the existing ORing power switch and its control circuit. According to the prior art, the wiring space of the printed circuit board 100 occupied by the ORing power switch and its control circuit (collectively referred to as the ORing module 10 ) is about 22.50mm*20.50mm. However, the ORing module 10 (including the ORing circuit) usually occupies a relatively large space on the motherboard (PCB 100 ), which is not conducive to the requirements of high-density and miniaturized power supply design.

For this reason, how to design an integrated module with a power supply backflow prevention device to solve the problems and technical bottlenecks in the existing technology is an important topic studied by the creators of this project.

One purpose of the present invention is to provide a module with components for preventing power backflow, so as to solve the problems in the prior art.

In order to achieve the purpose of the previous disclosure, the module with power backflow prevention components proposed in this creation includes a sub-circuit board and a power backflow prevention device. A power backflow prevention device is provided on the sub-circuit board. The device for preventing power backflow includes a power backflow prevention element and a control circuit. The control circuit is coupled with the anti-power backflow element, and is used for controlling the turn-on and shutdown of the anti-power backflow element.

In one embodiment, the device for preventing power backflow is an ORing power switch.

In one embodiment, the area of the sub-circuit board (200) is less than or equal to 4.00mm*20.50mm.

Another purpose of the present invention is to provide a device integrating a module with components for preventing power backflow, so as to solve the problems in the prior art.

In order to achieve the purpose of the previous disclosure, the device integrating the module with the power backflow prevention component proposed in this creation includes a main circuit board and the module with the power backflow prevention component. The module with components for preventing power backflow includes a sub-circuit board and a device for preventing power backflow. A power backflow prevention device is provided on the sub-circuit board. The device for preventing power backflow includes a power backflow prevention element and a control circuit. The control circuit is coupled with the anti-power backflow element, and is used for controlling the turn-on and shutdown of the anti-power backflow element.

In one embodiment, the sub-circuit board is disposed adjacent to the main circuit board providing power output.

In one embodiment, the sub-circuit board is plugged vertically on the main circuit board.

In one embodiment, the device for preventing power backflow is an ORing power switch.

In one embodiment, the area of the sub-circuit board is less than or equal to 4.00mm*20.50mm.

By means of the proposed module with components for preventing power backflow and the device integrating the module, technical effects can be achieved: 1. Through the use of ORing MOSFET, when the power supply is abnormal (such as short circuit abnormality), the faulty power supply can be isolated and used To protect the backup power supply; 2. By arranging the ORing power switch and its control circuit on the sub-circuit board 200, the space occupied by the printed circuit board can be reduced to meet the needs of high-density and miniaturized power supply design; 3. By placing the sub-circuit board 200 near the power output provided by the main circuit board 100, when the power supply is abnormal, the ORing MOSFET isolates the faulty power supply, protects the response time of the backup power supply, and reduces the response time caused by setting it away from the power supply output. The derivative line in the premises is affected by interference, which causes misoperation or miscontrol of the ORing MOSFET; by plugging the sub-circuit board 200 into the main circuit board 100, the electrical connection of the line can also be achieved, and the control of the ORing power switch can be realized. And once the electronic components on the sub-circuit board 200 are damaged, the sub-circuit board 200 can be directly replaced without replacing the entire main circuit board 100, which can simplify the circuit replacement procedure and save replacement costs.

In order to further understand the technology, means and effects of this creation to achieve the intended purpose, please refer to the following detailed description and drawings about this creation. For specific understanding, however, the attached drawings are only for reference and illustration, and are not used to limit the creation.

10: Equipped with a device to prevent power backflow

100: Main circuit board

200: sub circuit board

101: input side

102: output side

Figure 1: It is a schematic circuit diagram of the existing ORing power switch control circuit.

Figure 2: It is a schematic diagram of the printed circuit board wiring of the existing ORing power switch and its control circuit.

Figure 3: This is the top view of the module with power backflow prevention components.

Figure 4: It is the top view of the device integrating the module with power backflow prevention components in this creation.

Figure 5: It is a side view of the device integrating the module with power backflow prevention components in this invention.

Hereby, the technical content and detailed description of this creation are described as follows with the drawings.

Please refer to Fig. 3, which is a top view of the module with power backflow prevention components of the present invention. The module with components for preventing power backflow includes a sub-circuit board 200, wherein the sub-circuit board 200 can be a printed circuit board (PCB), used as a support for electronic components, and the metal conductors on the circuit board are used as Circuits and wiring connecting electronic components.

The power backflow preventing device 10 is disposed on the sub-circuit board 200 . The power backflow prevention device 10 includes a power backflow prevention element and a control circuit. In one embodiment, the power reverse current prevention device is an ORing power switch, such as but not limited to an ORing MOSFET. Among them, ORing MOSFET (with power backflow preventing element) is the most commonly used anti-power backflow element in redundant power supply, which has a small power loss, and ORing MOSFET is usually set in the power supply to provide power output On the output side, when the power supply is abnormal (such as short-circuit abnormality), the faulty power supply can be isolated to protect the backup power supply.

The control circuit is coupled with the anti-power backflow element, which is used to control the turn-on and turn-off of the anti-power backflow element, so as to realize the control of the output power of the power supply during normal operation, and to isolate the faulty power supply when the power supply is abnormal. Protect the control of backup power supply.

In order to reduce the space occupied by the printed circuit board and facilitate the design of high-density and miniaturized power supplies, in this creation, the area of the sub-circuit board 200 is set to be less than or equal to 4.00mm*20.50mm, such as Figure 3 shows. In other words, it has the ability to prevent the reverse flow of the power supply and the control circuit It is sufficient to be disposed on the sub-circuit board 200 so that the usable space occupied by it can be within the area (4.00mm*20.50mm).

Please refer to Fig. 4 and Fig. 5, which are respectively the top view of the device integrating the module with power backflow preventing components of the invention and the side view of the device integrating the module with power backflow preventing components of the invention. The device integrating a module with a power backflow prevention component includes a main circuit board 100 and the module with a power backflow prevention component shown in FIG. 3 . As mentioned above, the module with power backflow prevention components includes the sub-circuit board 200 and the power backflow prevention device 10 . The power backflow preventing device 10 is disposed on the sub-circuit board 200 . It is worth mentioning that the sub-circuit board 200 is arranged near the main circuit board 100 that provides the power output (that is, the output side 102 of the power supply of the main circuit board 100, relative to the input side 101 that provides the power input), so that when the power supply is abnormal, ORing MOSFET isolates the faulty power supply, protects the response time of the control of the backup power supply, and reduces the influence of interference on the derivative lines installed far away from the power supply output, which causes ORing MOSFET misoperation or miscontrol.

The power backflow prevention device 10 includes a power backflow prevention element and a control circuit. In one embodiment, the power reverse current prevention device is an ORing power switch, such as but not limited to an ORing MOSFET. ORing MOSFETs are usually installed at the output side of the power supply to provide power output. When the power supply is abnormal (such as short circuit abnormality), it can isolate the faulty power supply to protect the backup power supply.

The control circuit is coupled with the anti-power backflow element, which is used to control the turn-on and turn-off of the anti-power backflow element, so as to realize the control of the output power of the power supply during normal operation, and to isolate the faulty power supply when the power supply is abnormal. Protect the control of backup power supply.

In order to reduce the space occupied by the printed circuit board and facilitate the design of high-density and miniaturized power supplies, in this creation, the area of the sub-circuit board 200 is set to be less than or equal to 4.00mm*20.50mm, so that With anti-power backflow components and control lines can be fully configured in the On the sub-circuit board 200, the usable space occupied by it can be within the area (4.00mm*20.50mm).

As shown in FIG. 5 , preferably, the sub-circuit board 200 can be plugged vertically on the main circuit board 100 , so the space occupied by the sub-circuit board 100 can be effectively reduced. In other words, through this invention, the ORing power switch and its control circuit that originally need to be installed on the main circuit board 100 can be installed on the sub-circuit board 200, and by plugging the sub-circuit board 200 onto the main circuit board 100, the same can be achieved. To achieve the electrical connection of the line and realize the control of the ORing power switch. When the power supply is abnormal, the faulty power supply can be isolated to protect the control of the backup power supply. Therefore, once the electronic components on the sub-circuit board 200 are damaged, the sub-circuit board 200 can be directly replaced without replacing the entire main circuit board 100 , which can simplify the circuit replacement procedure and save replacement costs.

To sum up, this creative system has the following characteristics and advantages:

1. Through the use of ORing MOSFET, when the power supply is abnormal (such as short circuit abnormality), the faulty power supply can be isolated to protect the backup power supply.

2. By arranging the ORing power switch and its control circuit on the sub-circuit board 200, the space occupied by the printed circuit board can be reduced to meet the requirements of high-density and miniaturized power supply design.

3. By setting the sub-circuit board 200 near the main circuit board 100 to provide the power output, it is convenient for the ORing MOSFET to isolate the faulty power supply and protect the response time of the control of the backup power supply when the power supply is abnormal, and reduce the response time caused by setting it far away from the main circuit board 100. The derived lines at the output of the power supply are affected by interference, resulting in misoperation or miscontrol of the ORing MOSFET.

4. By plugging the sub-circuit board 200 onto the main circuit board 100, the electrical connection of the circuit can also be achieved, and the control of the ORing power switch can be realized. Once the electronic components on the sub-circuit board 200 are damaged, they can be replaced directly The sub-circuit board 200 does not need to replace the entire main circuit board 100, which can simplify the circuit replacement procedure and save the replacement cost.

The above is only a detailed description and diagram of a preferred embodiment of this creation, but the characteristics of this creation are not limited to this, and are not used to limit this creation. The entire scope of this creation should be based on the scope of the following patent application As the standard, all embodiments that conform to the spirit of the patent scope of this creation and its similar changes should be included in the scope of this creation. Any person familiar with the technology can easily think of changes or changes in the field of this creation. Modifications can all be covered by the patent scope of the following case.

10: Equipped with a device to prevent power backflow

200: sub circuit board

Claims (8)

A module with components for preventing power backflow, comprising: a sub-circuit board; The control circuit is coupled to the power backflow prevention element of the tool, and is used to control the power backflow prevention element of the tool to be turned on and off. The module with a power backflow prevention element as described in claim 1, wherein the power backflow prevention element is an implement-or-operate power switch. The module with components for preventing power backflow as described in Claim 1, wherein the sub-circuit board has an area less than or equal to 4.00mm*20.50mm. A device integrating a module with a power supply backflow prevention component, comprising: a main circuit board; and a module with a power supply backflow prevention component, including a sub-circuit board arranged on the main circuit board; The reverse current device is arranged on the sub-circuit board. The power reverse current prevention device includes: a power reverse current prevention element, and a control circuit, which is coupled to the power reverse current prevention element, and is used to control the power supply reverse current prevention element to conduct with shutdown. According to claim 4, the device integrating a module with a power backflow prevention element, wherein the sub-circuit board is arranged near the main circuit board that provides power output. According to claim 4, the device integrating a module with components for preventing power backflow, wherein the sub-circuit board is plugged vertically on the main circuit board. The device integrating a module with a power backflow prevention element as described in claim 4, wherein the power supply backflow prevention element is an implement-or-operate power switch. The device integrating a module with a power backflow prevention element as described in Claim 4, wherein the sub-circuit board has an area less than or equal to 4.00mm*20.50mm.

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