TWM639655U - Electronic device and cooling module thereof - Google Patents
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Abstract
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本創作之實施例係有關於一種冷卻模組,特別係有關於一種應用於電子裝置之冷卻模組。 The embodiment of the present invention relates to a cooling module, in particular to a cooling module applied to electronic devices.
市面上大多數的液體冷卻模組均有因內部氣泡產生,導致流道發生困氣的問題。但在習知技術中,主要的解決方法多是透過更改水路流向來減少水路內氣泡產生。事實上,內部氣泡:(a)冷卻液進水處噴流、(b)紊流、(c)水路流向大幅度變化;或是(d)水路流道截面積突然縮小等等情況。而,氣泡的產生會造成水路流道內的不順暢並降低水路進出端的壓力差,更會造成各區域的散熱效果不穩定,從而使整體冷卻模組的散熱效率降低。 Most of the liquid cooling modules on the market have the problem of trapped air in the flow channel due to internal air bubbles. However, in the prior art, the main solution is mostly to reduce the generation of air bubbles in the waterway by changing the flow direction of the waterway. In fact, internal air bubbles: (a) jet flow at the coolant inlet, (b) turbulent flow, (c) large change in water flow direction; or (d) sudden reduction in cross-sectional area of the water channel, etc. However, the generation of air bubbles will cause unsmoothness in the flow channel of the water channel and reduce the pressure difference between the inlet and outlet of the water channel, and will also cause unstable heat dissipation effects in various regions, thereby reducing the heat dissipation efficiency of the overall cooling module.
本創作之實施例係為了欲解決習知技術之問題而提供之一種冷卻模組,包括一模組殼體。該模組殼體形成有一流體入口、一流體出口、一連接通道、一第一腔室以及一第 二腔室,該流體入口連接該第一腔室,該流體出口連接該第二腔室,該連接通道連接該第一腔室以及該第二腔室。該模組殼體更形成有一排氣通道,該排氣通道連接該第一腔室以及該第二腔室,該排氣通道的通道寬度小於該連接通道的通道寬度。相較於該連接通道,該排氣通道更靠近該流體入口以及該流體出口。 The embodiment of the invention is to provide a cooling module for solving the problems of the prior art, including a module housing. The module housing is formed with a fluid inlet, a fluid outlet, a connecting channel, a first chamber and a first Two chambers, the fluid inlet is connected to the first chamber, the fluid outlet is connected to the second chamber, and the connection channel is connected to the first chamber and the second chamber. The module casing further forms an exhaust channel, the exhaust channel connects the first chamber and the second chamber, and the channel width of the exhaust channel is smaller than the channel width of the connecting channel. Compared with the connection channel, the exhaust channel is closer to the fluid inlet and the fluid outlet.
在一實施例中,一工作流體適於從該流體入口進入該第一腔室,並經過該連接通道抵達該第二腔室,再通過該流體出口離開該模組殼體,該工作流體內形成有至少一氣泡,該氣泡適於從該第一腔室經過該排氣通道而抵達該第二腔室。 In one embodiment, a working fluid is adapted to enter the first chamber from the fluid inlet, reach the second chamber through the connecting channel, and leave the module housing through the fluid outlet. At least one bubble is formed, the bubble is adapted to reach the second chamber from the first chamber through the exhaust channel.
在一實施例中,該排氣通道之一第一端連接該第一腔室,該排氣通道之一第二端連接該第二腔室,該第一端與該流體入口之間的距離大於該第二端與該流體出口之間的距離。 In one embodiment, a first end of the exhaust channel is connected to the first chamber, a second end of the exhaust channel is connected to the second chamber, and the distance between the first end and the fluid inlet is greater than the distance between the second end and the fluid outlet.
在一實施例中,該工作流體沿一U字型路徑,從該流體入口進入該第一腔室,並經過該連接通道抵達該第二腔室,再通過該流體出口離開該模組殼體。 In one embodiment, the working fluid enters the first chamber from the fluid inlet along a U-shaped path, reaches the second chamber through the connecting channel, and leaves the module housing through the fluid outlet. .
在一實施例中,該連接通道的通道寬度等於或大於該排氣通道之通道寬度的5倍。 In one embodiment, the channel width of the connecting channel is equal to or greater than 5 times of the channel width of the exhaust channel.
在一實施例中,該第一腔室包括一第一錐狀區以及一第一冷卻區,該第一錐狀區包括一第一錐狀區壁面,該第一冷卻區包括一第一冷卻區壁面,該第一錐狀區壁面與該第 一冷卻區壁面之間的夾角小於180度,該第一錐狀區壁面與該第一冷卻區壁面之間存在一第一轉折處,該排氣通道之該第一端連接該第一轉折處。 In one embodiment, the first chamber includes a first conical zone and a first cooling zone, the first conical zone includes a wall surface of the first conical zone, the first cooling zone includes a first cooling zone wall, the first tapered zone wall and the second The angle between the walls of a cooling zone is less than 180 degrees, there is a first turning point between the wall surface of the first conical zone and the wall surface of the first cooling zone, and the first end of the exhaust passage is connected to the first turning point .
在一實施例中,該第二腔室包括一第二錐狀區以及一第二冷卻區,該第二錐狀區包括一第二錐狀區壁面,該第二冷卻區包括一第二冷卻區壁面,該第二錐狀區壁面與該第二冷卻區壁面之間的夾角小於180度,該第二錐狀區壁面與該第二冷卻區壁面之間存在一第二轉折處,該排氣通道之該第二端端連接該第二轉折處。 In one embodiment, the second chamber includes a second conical region and a second cooling region, the second conical region includes a second conical region wall, the second cooling region includes a second cooling Zone wall, the angle between the second conical zone wall and the second cooling zone wall is less than 180 degrees, there is a second turning point between the second conical zone wall and the second cooling zone wall, the row The second end of the air channel is connected to the second turning point.
在一實施例中,該模組殼體更形成有複數個第一鰭片以及複數個第二鰭片,該等第一鰭片設於該第一冷卻區並彼此平行,該等第二鰭片設於該第二冷卻區並彼此平行。 In one embodiment, the module housing is further formed with a plurality of first fins and a plurality of second fins, the first fins are arranged in the first cooling area and parallel to each other, the second fins The sheets are arranged in the second cooling zone and parallel to each other.
在一實施例中,該第一錐狀區包括一第三錐狀區壁面,相對於該第一冷卻區壁面,該第三錐狀區壁面的斜率小於該第一錐狀區壁面的斜率。 In one embodiment, the first conical zone includes a wall surface of a third conical zone, and relative to the wall surface of the first cooling zone, the slope of the wall surface of the third conical zone is smaller than the slope of the wall surface of the first conical zone.
在另一實施例中,本創作提供一種電子裝置,包括一電路板、至少一熱源以及一冷卻模組。熱源設於該電路板之上。該冷卻模組包括一模組殼體,該模組殼體熱連接該熱源,該模組殼體形成有一流體入口、一流體出口、一連接通道、一第一腔室以及一第二腔室,該流體入口連接該第一腔室,該流體出口連接該第二腔室,該連接通道連接該第一腔室以及該第二腔室。該模組殼體更形成有一排氣通道,該排氣通道連接該第一腔室以及該第二腔室,該排氣通道的通道寬度小於該連 接通道的通道寬度。相較於該連接通道,該排氣通道更靠近該流體入口以及該流體出口。 In another embodiment, the present invention provides an electronic device including a circuit board, at least one heat source and a cooling module. The heat source is arranged on the circuit board. The cooling module includes a module housing, the module housing is thermally connected to the heat source, the module housing forms a fluid inlet, a fluid outlet, a connecting channel, a first chamber and a second chamber , the fluid inlet is connected to the first chamber, the fluid outlet is connected to the second chamber, and the connecting channel is connected to the first chamber and the second chamber. The module housing is further formed with an exhaust passage, which connects the first chamber and the second chamber, and the passage width of the exhaust passage is smaller than that of the connecting chamber. The channel width of the connection channel. Compared with the connection channel, the exhaust channel is closer to the fluid inlet and the fluid outlet.
應用本創作實施例之冷卻模組,氣泡以走捷徑的方式從該第一腔室經過該排氣通道而抵達該第二腔室,並通過流體出口而排除。因此,氣泡並不會經過或累積於冷卻模組內的工作流體通道。相較於習知技術,本創作實施例之冷卻模組改善了水路流道內不順暢的問題,也提高了整體冷卻模組的散熱效率。 With the cooling module of the present invention, air bubbles take a shortcut from the first chamber to the second chamber through the exhaust channel, and are discharged through the fluid outlet. Therefore, air bubbles do not pass through or accumulate in the working fluid channel in the cooling module. Compared with the conventional technology, the cooling module of the embodiment of the invention has improved the problem of unsmooth flow in the water channel, and also improved the heat dissipation efficiency of the overall cooling module.
E:電子裝置 E: electronic device
M:冷卻模組 M: cooling module
F:工作流體 F: working fluid
B:氣泡 B: Bubbles
C:支架 C: Bracket
11:流體入口 11: Fluid inlet
12:第一腔室 12: The first chamber
121:第一錐狀區 121: The first cone
122:第一冷卻區 122: The first cooling zone
123:第一錐狀區壁面 123: Wall surface of the first conical zone
124:第一冷卻區壁面 124: Wall surface of the first cooling zone
125:第一轉折處 125: The first turning point
126:第三錐狀區壁面 126: Wall surface of the third cone zone
21:流體出口 21: Fluid outlet
22:第二腔室 22: The second chamber
221:第二錐狀區 221:Second cone area
222:第二冷卻區 222: Second Cooling Zone
223:第二錐狀區壁面 223: the wall of the second cone zone
224:第二冷卻區壁面 224: Wall surface of the second cooling zone
225:第二轉折處 225: The second turning point
3:連接通道 3: Connection channel
4:排氣通道 4: exhaust channel
41:第一端 41: first end
42:第二端 42: second end
51:第一鰭片 51: First fin
52:第二鰭片 52: Second fin
7:模組殼體 7:Module housing
81:上蓋 81: top cover
82:下蓋 82: Lower cover
91:電路板 91: circuit board
92:熱源 92: heat source
d1:通道寬度 d1: channel width
d2:通道寬度 d2: channel width
θ1:夾角 θ 1: included angle
第1圖其係顯示本創作實施例之電子裝置的立體圖。 Fig. 1 is a perspective view showing the electronic device of the embodiment of the present invention.
第2圖其係顯示本創作實施例之電子裝置的爆炸圖。 Fig. 2 is an exploded view showing the electronic device of the embodiment of the present invention.
第3圖係顯示本創作實施例之冷卻模組的細部結構。 Figure 3 shows the detailed structure of the cooling module of the embodiment of the present invention.
第4圖係顯示本創作實施例之排氣通道的細部結構。 Fig. 4 shows the detailed structure of the exhaust channel of the present creation embodiment.
第5圖係顯示本創作實施例之電子裝置的應用情形。 Fig. 5 shows the application situation of the electronic device of the embodiment of the present invention.
第1圖其係顯示本創作實施例之電子裝置的立體圖。第2圖其係顯示本創作實施例之電子裝置的爆炸圖。搭配參照第1、2圖,本創作實施例之電子裝置E,包括一電路板91、至少一熱源92以及一冷卻模組M。熱源92設於該電路板
91之上。該冷卻模組M包括一模組殼體7,該模組殼體7熱連接該熱源92。
Fig. 1 is a perspective view showing the electronic device of the embodiment of the present invention. Fig. 2 is an exploded view showing the electronic device of the embodiment of the present invention. With reference to Figures 1 and 2, the electronic device E of the present invention includes a
第3圖係顯示本創作實施例之冷卻模組的細部結構。參照第3圖,本創作實施例之模組殼體7形成有一流體入口11、一流體出口21、一連接通道3、一第一腔室12以及一第二腔室22,該流體入口11連接該第一腔室12,該流體出口21連接該第二腔室22,該連接通道3連接該第一腔室12以及該第二腔室22。該模組殼體7更形成有一排氣通道4,該排氣通道4連接該第一腔室12以及該第二腔室22,該排氣通道4的通道寬度d1小於該連接通道3的通道寬度d2。相較於該連接通道3,該排氣通道4更靠近該流體入口11以及該流體出口21。換言之,當該冷卻模組M被直立設置時,該排氣通道4的高度高於該連接通道3的高度。
Figure 3 shows the detailed structure of the cooling module of the embodiment of the present invention. Referring to Fig. 3, the
參照第3圖,在一實施例中,一工作流體F適於從該流體入口11進入該第一腔室12,並經過該連接通道3抵達該第二腔室22,再通過該流體出口21離開該模組殼體7,該工作流體F內形成有至少一氣泡B,該氣泡B適於從該第一腔室12經過該排氣通道4而抵達該第二腔室22。
Referring to Fig. 3, in one embodiment, a working fluid F is adapted to enter the
第4圖係顯示本創作實施例之排氣通道的細部結構。搭配參照第3、4圖,在一實施例中,該排氣通道4之一第一端41連接該第一腔室12,該排氣通道4之一第二端42連接該第二腔室22,該第一端41與該流體入口11之間的距離大於該第二端42與該流體出口21之間的距離。換言之,當該冷
卻模組M被直立設置時,該第二端42的高度高於該第一端41的高度,因此氣泡B可透過浮力從該第一腔室12經過該排氣通道4而抵達該第二腔室22。
Fig. 4 shows the detailed structure of the exhaust channel of the present creation embodiment. With reference to Figures 3 and 4, in one embodiment, a
參照第3圖,在一實施例中,該工作流體F沿一U字型路徑,從該流體入口11進入該第一腔室12,並經過該連接通道3抵達該第二腔室22,再通過該流體出口21離開該模組殼體7。
Referring to FIG. 3, in one embodiment, the working fluid F enters the
參照第3圖,在一實施例中,該連接通道3的通道寬度d2等於或大於該排氣通道4之通道寬度d1的5倍。由於通過該連接通道3的阻力較小,該工作流體F傾向從該第一腔室12,經由該連接通道3,而抵達該第二腔室22。
Referring to FIG. 3 , in one embodiment, the channel width d2 of the connecting
搭配參照第3、4圖,在一實施例中,該第一腔室12包括一第一錐狀區121以及一第一冷卻區122,該第一錐狀區121包括一第一錐狀區壁面123,該第一冷卻區122包括一第一冷卻區壁面124,該第一錐狀區壁面123與該第一冷卻區壁面124之間的夾角θ1小於180度,該第一錐狀區壁面123與該第一冷卻區壁面124之間存在一第一轉折處125,該排氣通道4之該第一端41連接該第一轉折處125。當該冷卻模組M被直立設置時,該等氣泡B容易累積於該第一錐狀區壁面123與該第一轉折處125,因此該排氣通道4之該第一端41連接該第一轉折處125,以方便排除氣泡B。
With reference to Figures 3 and 4, in one embodiment, the
參照第3圖,在一實施例中,該第二腔室22包括一第二錐狀區221以及一第二冷卻區222,該第二錐狀區221
包括一第二錐狀區壁面223,該第二冷卻區222包括一第二冷卻區壁面224,該第二錐狀區壁面223與該第二冷卻區壁面224之間的夾角小於180度,該第二錐狀區壁面223與該第二冷卻區壁面224之間存在一第二轉折處225,該排氣通道4之該第二端端42連接該第二轉折處225。然而,上述揭露並未限制本創作。例如,在另一實施例中,該第二腔室22的形狀亦可能適度調整。整體而言,基於氣泡浮力與工作流體F的帶動,在該等氣泡B抵達該第二腔室22之後,該等氣泡B可迅速順利的通過該流體出口21而排除。
Referring to Fig. 3, in one embodiment, the
參照第3圖,在一實施例中,該模組殼體7更形成有複數個第一鰭片51以及複數個第二鰭片52,該等第一鰭片51設於該第一冷卻區122並彼此平行,該等第二鰭片52設於該第二冷卻區222並彼此平行。該等第一鰭片51以及該等第二鰭片52增加了工作流體F與模組殼體7的接觸面積,因此提升了散熱效率。在一實施例中,由於該排氣通道4連接該第一錐狀區121以及第二錐狀區221,因此可避免氣泡B進入該第一冷卻區122以及該第二冷卻區222,從而提高該冷卻模組M的散熱效率。
Referring to Fig. 3, in one embodiment, the
參照第3圖,在一實施例中,該第一錐狀區121包括一第三錐狀區壁面126,相對於該第一冷卻區壁面124,該第三錐狀區壁面126的斜率小於該第一錐狀區壁面123的斜率。在一實施例中,該等氣泡B可以較密集的堆積於該第一錐
狀區壁面123,因此可較為有效的通過該排氣通道4而排除氣泡B。
Referring to Fig. 3, in one embodiment, the first
再搭配參照第1、2圖,在一實施例中,本創作實施例之電子裝置E更包括一上蓋81以及一下蓋82,該上蓋81連接該模組殼體7,並覆蓋(或共同構成)前述之流體入口11、流體出口21、連接通道3、排氣通道4、第一腔室12以及第二腔室22。在一實施例中,該上蓋81可以為該冷卻模組M的一部份。該下蓋82連接該模組殼體7,並覆蓋該電路板91。
With reference to Figures 1 and 2, in one embodiment, the electronic device E of the embodiment of the invention further includes an
在此實施例中,該冷卻模組M屬於該電子裝置E之外觀件的一部份。上述揭露並未限制本創作。在另一實施例中,該冷卻模組M亦可以被設置於電子裝置(例如伺服器)的內部。 In this embodiment, the cooling module M is part of the appearance of the electronic device E. The above disclosure does not limit the present work. In another embodiment, the cooling module M can also be disposed inside an electronic device (such as a server).
第5圖係顯示本創作實施例之電子裝置的應用情形。為了提供氣泡排除功能,本創作實施例之電子裝置E(及其冷卻模組)必須以直立的方式設置。例如,在第5圖之實施例中,該流體入口以及該流體出口均朝上。然而,第5圖之揭露並未限制本創作,例如,在另一種直立狀態下,該第二腔室可位於該第一腔室的上方,如此也同樣能提供氣泡排除功能。再參照第5圖,該電子裝置E可透過一支架C而實現直立設置。在一實施例中,該電子裝置E可以為車用電子裝置,並被設置於汽車駕駛座側邊、汽車副駕腳踏板下方、汽車乘客座下方或側方、汽車後車箱內層等等位置。上述揭露並未限制本創作。 Fig. 5 shows the application situation of the electronic device of the embodiment of the present invention. In order to provide the function of removing air bubbles, the electronic device E (and its cooling module) of the present invention must be arranged in an upright manner. For example, in the embodiment of FIG. 5, both the fluid inlet and the fluid outlet are facing upward. However, the disclosure in FIG. 5 does not limit the invention. For example, in another upright state, the second chamber can be located above the first chamber, which can also provide the function of removing air bubbles. Referring to FIG. 5 again, the electronic device E can be installed upright through a bracket C. Referring to FIG. In one embodiment, the electronic device E can be an electronic device for a vehicle, and it is arranged on the side of the driver's seat, under the passenger pedal of the vehicle, below or on the side of the passenger seat of the vehicle, the inner layer of the trunk of the vehicle, etc. Location. The above disclosure does not limit the present work.
應用本創作實施例之冷卻模組,氣泡以走捷徑的方式從該第一腔室經過該排氣通道而抵達該第二腔室,並通過流體出口而排除。因此,氣泡並不會經過或累積於冷卻模組內的工作流體通道。相較於習知技術,本創作實施例之冷卻模組改善了水路流道內不順暢的問題,也提高了整體冷卻模組的散熱效率。 With the cooling module of the present invention, air bubbles take a shortcut from the first chamber to the second chamber through the exhaust channel, and are discharged through the fluid outlet. Therefore, air bubbles do not pass through or accumulate in the working fluid channel in the cooling module. Compared with the conventional technology, the cooling module of the embodiment of the invention has improved the problem of unsmooth flow in the water channel, and also improved the heat dissipation efficiency of the overall cooling module.
雖然本創作已以具體之較佳實施例揭露如上,然其並非用以限定本創作,任何熟習此項技術者,在不脫離本創作之精神和範圍內,仍可作些許的更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。 Although this creation has been disclosed above with specific preferred embodiments, it is not intended to limit this creation. Anyone who is familiar with this technology can still make some changes and modifications without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation should be defined by the scope of the attached patent application.
F:工作流體 F: working fluid
B:氣泡 B: Bubbles
11:流體入口 11: Fluid inlet
12:第一腔室 12: The first chamber
121:第一錐狀區 121: The first cone
122:第一冷卻區 122: The first cooling zone
123:第一錐狀區壁面 123: Wall surface of the first conical zone
124:第一冷卻區壁面 124: Wall surface of the first cooling zone
125:第一轉折處 125: The first turning point
126:第三錐狀區壁面 126: Wall surface of the third cone zone
21:流體出口 21: Fluid outlet
22:第二腔室 22: The second chamber
221:第二錐狀區 221:Second cone area
222:第二冷卻區 222: Second Cooling Zone
223:第二錐狀區壁面 223: the wall of the second cone zone
224:第二冷卻區壁面 224: Wall surface of the second cooling zone
225:第二轉折處 225: The second turning point
3:連接通道 3: Connection channel
4:排氣通道 4: exhaust channel
51:第一鰭片 51: First fin
52:第二鰭片 52: Second fin
7:模組殼體 7:Module housing
d1:通道寬度 d1: channel width
d2:通道寬度 d2: channel width
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW111211272U TWM639655U (en) | 2022-10-17 | 2022-10-17 | Electronic device and cooling module thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW111211272U TWM639655U (en) | 2022-10-17 | 2022-10-17 | Electronic device and cooling module thereof |
Publications (1)
Publication Number | Publication Date |
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TWM639655U true TWM639655U (en) | 2023-04-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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Country Status (1)
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