TWM639655U - Electronic device and cooling module thereof - Google Patents

Electronic device and cooling module thereof Download PDF

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Publication number
TWM639655U
TWM639655U TW111211272U TW111211272U TWM639655U TW M639655 U TWM639655 U TW M639655U TW 111211272 U TW111211272 U TW 111211272U TW 111211272 U TW111211272 U TW 111211272U TW M639655 U TWM639655 U TW M639655U
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Taiwan
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chamber
channel
cooling
zone
module
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TW111211272U
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Chinese (zh)
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王生和
曾群運
侯建宇
許珮漪
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廣達電腦股份有限公司
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Priority to TW111211272U priority Critical patent/TWM639655U/en
Publication of TWM639655U publication Critical patent/TWM639655U/en

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Abstract

A cooling module is provided. The cooling module includes a module housing. An fluid inlet, an fluid outlet, a connection path, a first chamber and a second chamber are formed on the module housing. The fluid inlet is communicated to the first chamber. The fluid outlet is communicated to the second chamber. The connection path communicates the first chamber and the second chamber. An air exhausting path is formed on the module housing. The air exhausting path communicates the first chamber and the second chamber. The path width of the air exhausting path is smaller than that of the connection path. Compared with the connection path, the air exhausting path is adjacent to the fluid inlet and the fluid outlet.

Description

電子裝置及其冷卻模組Electronic device and its cooling module

本創作之實施例係有關於一種冷卻模組,特別係有關於一種應用於電子裝置之冷卻模組。 The embodiment of the present invention relates to a cooling module, in particular to a cooling module applied to electronic devices.

市面上大多數的液體冷卻模組均有因內部氣泡產生,導致流道發生困氣的問題。但在習知技術中,主要的解決方法多是透過更改水路流向來減少水路內氣泡產生。事實上,內部氣泡:(a)冷卻液進水處噴流、(b)紊流、(c)水路流向大幅度變化;或是(d)水路流道截面積突然縮小等等情況。而,氣泡的產生會造成水路流道內的不順暢並降低水路進出端的壓力差,更會造成各區域的散熱效果不穩定,從而使整體冷卻模組的散熱效率降低。 Most of the liquid cooling modules on the market have the problem of trapped air in the flow channel due to internal air bubbles. However, in the prior art, the main solution is mostly to reduce the generation of air bubbles in the waterway by changing the flow direction of the waterway. In fact, internal air bubbles: (a) jet flow at the coolant inlet, (b) turbulent flow, (c) large change in water flow direction; or (d) sudden reduction in cross-sectional area of the water channel, etc. However, the generation of air bubbles will cause unsmoothness in the flow channel of the water channel and reduce the pressure difference between the inlet and outlet of the water channel, and will also cause unstable heat dissipation effects in various regions, thereby reducing the heat dissipation efficiency of the overall cooling module.

本創作之實施例係為了欲解決習知技術之問題而提供之一種冷卻模組,包括一模組殼體。該模組殼體形成有一流體入口、一流體出口、一連接通道、一第一腔室以及一第 二腔室,該流體入口連接該第一腔室,該流體出口連接該第二腔室,該連接通道連接該第一腔室以及該第二腔室。該模組殼體更形成有一排氣通道,該排氣通道連接該第一腔室以及該第二腔室,該排氣通道的通道寬度小於該連接通道的通道寬度。相較於該連接通道,該排氣通道更靠近該流體入口以及該流體出口。 The embodiment of the invention is to provide a cooling module for solving the problems of the prior art, including a module housing. The module housing is formed with a fluid inlet, a fluid outlet, a connecting channel, a first chamber and a first Two chambers, the fluid inlet is connected to the first chamber, the fluid outlet is connected to the second chamber, and the connection channel is connected to the first chamber and the second chamber. The module casing further forms an exhaust channel, the exhaust channel connects the first chamber and the second chamber, and the channel width of the exhaust channel is smaller than the channel width of the connecting channel. Compared with the connection channel, the exhaust channel is closer to the fluid inlet and the fluid outlet.

在一實施例中,一工作流體適於從該流體入口進入該第一腔室,並經過該連接通道抵達該第二腔室,再通過該流體出口離開該模組殼體,該工作流體內形成有至少一氣泡,該氣泡適於從該第一腔室經過該排氣通道而抵達該第二腔室。 In one embodiment, a working fluid is adapted to enter the first chamber from the fluid inlet, reach the second chamber through the connecting channel, and leave the module housing through the fluid outlet. At least one bubble is formed, the bubble is adapted to reach the second chamber from the first chamber through the exhaust channel.

在一實施例中,該排氣通道之一第一端連接該第一腔室,該排氣通道之一第二端連接該第二腔室,該第一端與該流體入口之間的距離大於該第二端與該流體出口之間的距離。 In one embodiment, a first end of the exhaust channel is connected to the first chamber, a second end of the exhaust channel is connected to the second chamber, and the distance between the first end and the fluid inlet is greater than the distance between the second end and the fluid outlet.

在一實施例中,該工作流體沿一U字型路徑,從該流體入口進入該第一腔室,並經過該連接通道抵達該第二腔室,再通過該流體出口離開該模組殼體。 In one embodiment, the working fluid enters the first chamber from the fluid inlet along a U-shaped path, reaches the second chamber through the connecting channel, and leaves the module housing through the fluid outlet. .

在一實施例中,該連接通道的通道寬度等於或大於該排氣通道之通道寬度的5倍。 In one embodiment, the channel width of the connecting channel is equal to or greater than 5 times of the channel width of the exhaust channel.

在一實施例中,該第一腔室包括一第一錐狀區以及一第一冷卻區,該第一錐狀區包括一第一錐狀區壁面,該第一冷卻區包括一第一冷卻區壁面,該第一錐狀區壁面與該第 一冷卻區壁面之間的夾角小於180度,該第一錐狀區壁面與該第一冷卻區壁面之間存在一第一轉折處,該排氣通道之該第一端連接該第一轉折處。 In one embodiment, the first chamber includes a first conical zone and a first cooling zone, the first conical zone includes a wall surface of the first conical zone, the first cooling zone includes a first cooling zone wall, the first tapered zone wall and the second The angle between the walls of a cooling zone is less than 180 degrees, there is a first turning point between the wall surface of the first conical zone and the wall surface of the first cooling zone, and the first end of the exhaust passage is connected to the first turning point .

在一實施例中,該第二腔室包括一第二錐狀區以及一第二冷卻區,該第二錐狀區包括一第二錐狀區壁面,該第二冷卻區包括一第二冷卻區壁面,該第二錐狀區壁面與該第二冷卻區壁面之間的夾角小於180度,該第二錐狀區壁面與該第二冷卻區壁面之間存在一第二轉折處,該排氣通道之該第二端端連接該第二轉折處。 In one embodiment, the second chamber includes a second conical region and a second cooling region, the second conical region includes a second conical region wall, the second cooling region includes a second cooling Zone wall, the angle between the second conical zone wall and the second cooling zone wall is less than 180 degrees, there is a second turning point between the second conical zone wall and the second cooling zone wall, the row The second end of the air channel is connected to the second turning point.

在一實施例中,該模組殼體更形成有複數個第一鰭片以及複數個第二鰭片,該等第一鰭片設於該第一冷卻區並彼此平行,該等第二鰭片設於該第二冷卻區並彼此平行。 In one embodiment, the module housing is further formed with a plurality of first fins and a plurality of second fins, the first fins are arranged in the first cooling area and parallel to each other, the second fins The sheets are arranged in the second cooling zone and parallel to each other.

在一實施例中,該第一錐狀區包括一第三錐狀區壁面,相對於該第一冷卻區壁面,該第三錐狀區壁面的斜率小於該第一錐狀區壁面的斜率。 In one embodiment, the first conical zone includes a wall surface of a third conical zone, and relative to the wall surface of the first cooling zone, the slope of the wall surface of the third conical zone is smaller than the slope of the wall surface of the first conical zone.

在另一實施例中,本創作提供一種電子裝置,包括一電路板、至少一熱源以及一冷卻模組。熱源設於該電路板之上。該冷卻模組包括一模組殼體,該模組殼體熱連接該熱源,該模組殼體形成有一流體入口、一流體出口、一連接通道、一第一腔室以及一第二腔室,該流體入口連接該第一腔室,該流體出口連接該第二腔室,該連接通道連接該第一腔室以及該第二腔室。該模組殼體更形成有一排氣通道,該排氣通道連接該第一腔室以及該第二腔室,該排氣通道的通道寬度小於該連 接通道的通道寬度。相較於該連接通道,該排氣通道更靠近該流體入口以及該流體出口。 In another embodiment, the present invention provides an electronic device including a circuit board, at least one heat source and a cooling module. The heat source is arranged on the circuit board. The cooling module includes a module housing, the module housing is thermally connected to the heat source, the module housing forms a fluid inlet, a fluid outlet, a connecting channel, a first chamber and a second chamber , the fluid inlet is connected to the first chamber, the fluid outlet is connected to the second chamber, and the connecting channel is connected to the first chamber and the second chamber. The module housing is further formed with an exhaust passage, which connects the first chamber and the second chamber, and the passage width of the exhaust passage is smaller than that of the connecting chamber. The channel width of the connection channel. Compared with the connection channel, the exhaust channel is closer to the fluid inlet and the fluid outlet.

應用本創作實施例之冷卻模組,氣泡以走捷徑的方式從該第一腔室經過該排氣通道而抵達該第二腔室,並通過流體出口而排除。因此,氣泡並不會經過或累積於冷卻模組內的工作流體通道。相較於習知技術,本創作實施例之冷卻模組改善了水路流道內不順暢的問題,也提高了整體冷卻模組的散熱效率。 With the cooling module of the present invention, air bubbles take a shortcut from the first chamber to the second chamber through the exhaust channel, and are discharged through the fluid outlet. Therefore, air bubbles do not pass through or accumulate in the working fluid channel in the cooling module. Compared with the conventional technology, the cooling module of the embodiment of the invention has improved the problem of unsmooth flow in the water channel, and also improved the heat dissipation efficiency of the overall cooling module.

E:電子裝置 E: electronic device

M:冷卻模組 M: cooling module

F:工作流體 F: working fluid

B:氣泡 B: Bubbles

C:支架 C: Bracket

11:流體入口 11: Fluid inlet

12:第一腔室 12: The first chamber

121:第一錐狀區 121: The first cone

122:第一冷卻區 122: The first cooling zone

123:第一錐狀區壁面 123: Wall surface of the first conical zone

124:第一冷卻區壁面 124: Wall surface of the first cooling zone

125:第一轉折處 125: The first turning point

126:第三錐狀區壁面 126: Wall surface of the third cone zone

21:流體出口 21: Fluid outlet

22:第二腔室 22: The second chamber

221:第二錐狀區 221:Second cone area

222:第二冷卻區 222: Second Cooling Zone

223:第二錐狀區壁面 223: the wall of the second cone zone

224:第二冷卻區壁面 224: Wall surface of the second cooling zone

225:第二轉折處 225: The second turning point

3:連接通道 3: Connection channel

4:排氣通道 4: exhaust channel

41:第一端 41: first end

42:第二端 42: second end

51:第一鰭片 51: First fin

52:第二鰭片 52: Second fin

7:模組殼體 7:Module housing

81:上蓋 81: top cover

82:下蓋 82: Lower cover

91:電路板 91: circuit board

92:熱源 92: heat source

d1:通道寬度 d1: channel width

d2:通道寬度 d2: channel width

θ1:夾角 θ 1: included angle

第1圖其係顯示本創作實施例之電子裝置的立體圖。 Fig. 1 is a perspective view showing the electronic device of the embodiment of the present invention.

第2圖其係顯示本創作實施例之電子裝置的爆炸圖。 Fig. 2 is an exploded view showing the electronic device of the embodiment of the present invention.

第3圖係顯示本創作實施例之冷卻模組的細部結構。 Figure 3 shows the detailed structure of the cooling module of the embodiment of the present invention.

第4圖係顯示本創作實施例之排氣通道的細部結構。 Fig. 4 shows the detailed structure of the exhaust channel of the present creation embodiment.

第5圖係顯示本創作實施例之電子裝置的應用情形。 Fig. 5 shows the application situation of the electronic device of the embodiment of the present invention.

第1圖其係顯示本創作實施例之電子裝置的立體圖。第2圖其係顯示本創作實施例之電子裝置的爆炸圖。搭配參照第1、2圖,本創作實施例之電子裝置E,包括一電路板91、至少一熱源92以及一冷卻模組M。熱源92設於該電路板 91之上。該冷卻模組M包括一模組殼體7,該模組殼體7熱連接該熱源92。 Fig. 1 is a perspective view showing the electronic device of the embodiment of the present invention. Fig. 2 is an exploded view showing the electronic device of the embodiment of the present invention. With reference to Figures 1 and 2, the electronic device E of the present invention includes a circuit board 91, at least one heat source 92, and a cooling module M. Heat source 92 is located on the circuit board Above 91. The cooling module M includes a module housing 7 , and the module housing 7 is thermally connected to the heat source 92 .

第3圖係顯示本創作實施例之冷卻模組的細部結構。參照第3圖,本創作實施例之模組殼體7形成有一流體入口11、一流體出口21、一連接通道3、一第一腔室12以及一第二腔室22,該流體入口11連接該第一腔室12,該流體出口21連接該第二腔室22,該連接通道3連接該第一腔室12以及該第二腔室22。該模組殼體7更形成有一排氣通道4,該排氣通道4連接該第一腔室12以及該第二腔室22,該排氣通道4的通道寬度d1小於該連接通道3的通道寬度d2。相較於該連接通道3,該排氣通道4更靠近該流體入口11以及該流體出口21。換言之,當該冷卻模組M被直立設置時,該排氣通道4的高度高於該連接通道3的高度。 Figure 3 shows the detailed structure of the cooling module of the embodiment of the present invention. Referring to Fig. 3, the module housing 7 of the present creation embodiment forms a fluid inlet 11, a fluid outlet 21, a connecting channel 3, a first chamber 12 and a second chamber 22, and the fluid inlet 11 is connected to The first chamber 12 and the fluid outlet 21 are connected to the second chamber 22 , and the connecting channel 3 is connected to the first chamber 12 and the second chamber 22 . The module housing 7 is further formed with an exhaust passage 4, the exhaust passage 4 connects the first chamber 12 and the second chamber 22, the passage width d1 of the exhaust passage 4 is smaller than the passage of the connecting passage 3 width d2. Compared with the connection channel 3 , the exhaust channel 4 is closer to the fluid inlet 11 and the fluid outlet 21 . In other words, when the cooling module M is set upright, the height of the exhaust channel 4 is higher than that of the connecting channel 3 .

參照第3圖,在一實施例中,一工作流體F適於從該流體入口11進入該第一腔室12,並經過該連接通道3抵達該第二腔室22,再通過該流體出口21離開該模組殼體7,該工作流體F內形成有至少一氣泡B,該氣泡B適於從該第一腔室12經過該排氣通道4而抵達該第二腔室22。 Referring to Fig. 3, in one embodiment, a working fluid F is adapted to enter the first chamber 12 from the fluid inlet 11, and arrive at the second chamber 22 through the connecting channel 3, and then pass through the fluid outlet 21 Leaving the module housing 7 , at least one air bubble B is formed in the working fluid F, and the air bubble B is adapted to reach the second chamber 22 from the first chamber 12 through the exhaust channel 4 .

第4圖係顯示本創作實施例之排氣通道的細部結構。搭配參照第3、4圖,在一實施例中,該排氣通道4之一第一端41連接該第一腔室12,該排氣通道4之一第二端42連接該第二腔室22,該第一端41與該流體入口11之間的距離大於該第二端42與該流體出口21之間的距離。換言之,當該冷 卻模組M被直立設置時,該第二端42的高度高於該第一端41的高度,因此氣泡B可透過浮力從該第一腔室12經過該排氣通道4而抵達該第二腔室22。 Fig. 4 shows the detailed structure of the exhaust channel of the present creation embodiment. With reference to Figures 3 and 4, in one embodiment, a first end 41 of the exhaust passage 4 is connected to the first chamber 12, and a second end 42 of the exhaust passage 4 is connected to the second chamber 22 , the distance between the first end 41 and the fluid inlet 11 is greater than the distance between the second end 42 and the fluid outlet 21 . In other words, when the cold When the cooling module M is set upright, the height of the second end 42 is higher than the height of the first end 41, so the air bubbles B can pass through the first chamber 12 through the exhaust channel 4 through the buoyancy to reach the second end. Chamber 22.

參照第3圖,在一實施例中,該工作流體F沿一U字型路徑,從該流體入口11進入該第一腔室12,並經過該連接通道3抵達該第二腔室22,再通過該流體出口21離開該模組殼體7。 Referring to FIG. 3, in one embodiment, the working fluid F enters the first chamber 12 from the fluid inlet 11 along a U-shaped path, and reaches the second chamber 22 through the connecting channel 3, and then It exits the module housing 7 through the fluid outlet 21 .

參照第3圖,在一實施例中,該連接通道3的通道寬度d2等於或大於該排氣通道4之通道寬度d1的5倍。由於通過該連接通道3的阻力較小,該工作流體F傾向從該第一腔室12,經由該連接通道3,而抵達該第二腔室22。 Referring to FIG. 3 , in one embodiment, the channel width d2 of the connecting channel 3 is equal to or greater than 5 times the channel width d1 of the exhaust channel 4 . Due to the low resistance of the connecting channel 3 , the working fluid F tends to pass through the connecting channel 3 from the first chamber 12 to reach the second chamber 22 .

搭配參照第3、4圖,在一實施例中,該第一腔室12包括一第一錐狀區121以及一第一冷卻區122,該第一錐狀區121包括一第一錐狀區壁面123,該第一冷卻區122包括一第一冷卻區壁面124,該第一錐狀區壁面123與該第一冷卻區壁面124之間的夾角θ1小於180度,該第一錐狀區壁面123與該第一冷卻區壁面124之間存在一第一轉折處125,該排氣通道4之該第一端41連接該第一轉折處125。當該冷卻模組M被直立設置時,該等氣泡B容易累積於該第一錐狀區壁面123與該第一轉折處125,因此該排氣通道4之該第一端41連接該第一轉折處125,以方便排除氣泡B。 With reference to Figures 3 and 4, in one embodiment, the first chamber 12 includes a first conical zone 121 and a first cooling zone 122, and the first conical zone 121 includes a first conical zone Wall surface 123, the first cooling zone 122 includes a first cooling zone wall surface 124, the angle θ1 between the first conical zone wall surface 123 and the first cooling zone wall surface 124 is less than 180 degrees, the first conical zone wall surface There is a first turning point 125 between 123 and the wall surface 124 of the first cooling zone, and the first end 41 of the exhaust passage 4 is connected to the first turning point 125 . When the cooling module M is set upright, the air bubbles B are easy to accumulate on the wall surface 123 of the first tapered region and the first turning point 125, so the first end 41 of the exhaust passage 4 is connected to the first Turning point 125 to facilitate the removal of bubble B.

參照第3圖,在一實施例中,該第二腔室22包括一第二錐狀區221以及一第二冷卻區222,該第二錐狀區221 包括一第二錐狀區壁面223,該第二冷卻區222包括一第二冷卻區壁面224,該第二錐狀區壁面223與該第二冷卻區壁面224之間的夾角小於180度,該第二錐狀區壁面223與該第二冷卻區壁面224之間存在一第二轉折處225,該排氣通道4之該第二端端42連接該第二轉折處225。然而,上述揭露並未限制本創作。例如,在另一實施例中,該第二腔室22的形狀亦可能適度調整。整體而言,基於氣泡浮力與工作流體F的帶動,在該等氣泡B抵達該第二腔室22之後,該等氣泡B可迅速順利的通過該流體出口21而排除。 Referring to Fig. 3, in one embodiment, the second chamber 22 includes a second conical zone 221 and a second cooling zone 222, the second conical zone 221 Including a second conical zone wall surface 223, the second cooling zone 222 includes a second cooling zone wall surface 224, the angle between the second conical zone wall surface 223 and the second cooling zone wall surface 224 is less than 180 degrees, the There is a second turning point 225 between the wall surface 223 of the second conical zone and the wall surface 224 of the second cooling zone, and the second end 42 of the exhaust passage 4 is connected to the second turning point 225 . However, the above disclosure does not limit the present invention. For example, in another embodiment, the shape of the second chamber 22 may also be appropriately adjusted. Overall, based on the buoyancy of the bubbles and the drive of the working fluid F, after the bubbles B reach the second chamber 22 , the bubbles B can be quickly and smoothly discharged through the fluid outlet 21 .

參照第3圖,在一實施例中,該模組殼體7更形成有複數個第一鰭片51以及複數個第二鰭片52,該等第一鰭片51設於該第一冷卻區122並彼此平行,該等第二鰭片52設於該第二冷卻區222並彼此平行。該等第一鰭片51以及該等第二鰭片52增加了工作流體F與模組殼體7的接觸面積,因此提升了散熱效率。在一實施例中,由於該排氣通道4連接該第一錐狀區121以及第二錐狀區221,因此可避免氣泡B進入該第一冷卻區122以及該第二冷卻區222,從而提高該冷卻模組M的散熱效率。 Referring to Fig. 3, in one embodiment, the module case 7 is further formed with a plurality of first fins 51 and a plurality of second fins 52, and the first fins 51 are arranged in the first cooling area 122 and parallel to each other, the second fins 52 are disposed on the second cooling area 222 and parallel to each other. The first fins 51 and the second fins 52 increase the contact area between the working fluid F and the module housing 7 , thus improving the heat dissipation efficiency. In one embodiment, since the exhaust passage 4 connects the first conical region 121 and the second conical region 221, it is possible to avoid air bubbles B from entering the first cooling region 122 and the second cooling region 222, thereby improving The cooling efficiency of the cooling module M.

參照第3圖,在一實施例中,該第一錐狀區121包括一第三錐狀區壁面126,相對於該第一冷卻區壁面124,該第三錐狀區壁面126的斜率小於該第一錐狀區壁面123的斜率。在一實施例中,該等氣泡B可以較密集的堆積於該第一錐 狀區壁面123,因此可較為有效的通過該排氣通道4而排除氣泡B。 Referring to Fig. 3, in one embodiment, the first conical zone 121 includes a third conical zone wall surface 126, with respect to the first cooling zone wall surface 124, the slope of the third conical zone wall surface 126 is smaller than the The slope of the wall surface 123 of the first tapered region. In one embodiment, the bubbles B can be densely packed in the first cone The wall surface 123 of the shape zone, so the air bubbles B can be removed through the exhaust channel 4 more effectively.

再搭配參照第1、2圖,在一實施例中,本創作實施例之電子裝置E更包括一上蓋81以及一下蓋82,該上蓋81連接該模組殼體7,並覆蓋(或共同構成)前述之流體入口11、流體出口21、連接通道3、排氣通道4、第一腔室12以及第二腔室22。在一實施例中,該上蓋81可以為該冷卻模組M的一部份。該下蓋82連接該模組殼體7,並覆蓋該電路板91。 With reference to Figures 1 and 2, in one embodiment, the electronic device E of the embodiment of the invention further includes an upper cover 81 and a lower cover 82, the upper cover 81 is connected to the module housing 7, and covers (or jointly constitutes ) the aforementioned fluid inlet 11 , fluid outlet 21 , connecting channel 3 , exhaust channel 4 , first chamber 12 and second chamber 22 . In one embodiment, the upper cover 81 can be a part of the cooling module M. As shown in FIG. The lower cover 82 is connected to the module housing 7 and covers the circuit board 91 .

在此實施例中,該冷卻模組M屬於該電子裝置E之外觀件的一部份。上述揭露並未限制本創作。在另一實施例中,該冷卻模組M亦可以被設置於電子裝置(例如伺服器)的內部。 In this embodiment, the cooling module M is part of the appearance of the electronic device E. The above disclosure does not limit the present work. In another embodiment, the cooling module M can also be disposed inside an electronic device (such as a server).

第5圖係顯示本創作實施例之電子裝置的應用情形。為了提供氣泡排除功能,本創作實施例之電子裝置E(及其冷卻模組)必須以直立的方式設置。例如,在第5圖之實施例中,該流體入口以及該流體出口均朝上。然而,第5圖之揭露並未限制本創作,例如,在另一種直立狀態下,該第二腔室可位於該第一腔室的上方,如此也同樣能提供氣泡排除功能。再參照第5圖,該電子裝置E可透過一支架C而實現直立設置。在一實施例中,該電子裝置E可以為車用電子裝置,並被設置於汽車駕駛座側邊、汽車副駕腳踏板下方、汽車乘客座下方或側方、汽車後車箱內層等等位置。上述揭露並未限制本創作。 Fig. 5 shows the application situation of the electronic device of the embodiment of the present invention. In order to provide the function of removing air bubbles, the electronic device E (and its cooling module) of the present invention must be arranged in an upright manner. For example, in the embodiment of FIG. 5, both the fluid inlet and the fluid outlet are facing upward. However, the disclosure in FIG. 5 does not limit the invention. For example, in another upright state, the second chamber can be located above the first chamber, which can also provide the function of removing air bubbles. Referring to FIG. 5 again, the electronic device E can be installed upright through a bracket C. Referring to FIG. In one embodiment, the electronic device E can be an electronic device for a vehicle, and it is arranged on the side of the driver's seat, under the passenger pedal of the vehicle, below or on the side of the passenger seat of the vehicle, the inner layer of the trunk of the vehicle, etc. Location. The above disclosure does not limit the present work.

應用本創作實施例之冷卻模組,氣泡以走捷徑的方式從該第一腔室經過該排氣通道而抵達該第二腔室,並通過流體出口而排除。因此,氣泡並不會經過或累積於冷卻模組內的工作流體通道。相較於習知技術,本創作實施例之冷卻模組改善了水路流道內不順暢的問題,也提高了整體冷卻模組的散熱效率。 With the cooling module of the present invention, air bubbles take a shortcut from the first chamber to the second chamber through the exhaust channel, and are discharged through the fluid outlet. Therefore, air bubbles do not pass through or accumulate in the working fluid channel in the cooling module. Compared with the conventional technology, the cooling module of the embodiment of the invention has improved the problem of unsmooth flow in the water channel, and also improved the heat dissipation efficiency of the overall cooling module.

雖然本創作已以具體之較佳實施例揭露如上,然其並非用以限定本創作,任何熟習此項技術者,在不脫離本創作之精神和範圍內,仍可作些許的更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。 Although this creation has been disclosed above with specific preferred embodiments, it is not intended to limit this creation. Anyone who is familiar with this technology can still make some changes and modifications without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation should be defined by the scope of the attached patent application.

F:工作流體 F: working fluid

B:氣泡 B: Bubbles

11:流體入口 11: Fluid inlet

12:第一腔室 12: The first chamber

121:第一錐狀區 121: The first cone

122:第一冷卻區 122: The first cooling zone

123:第一錐狀區壁面 123: Wall surface of the first conical zone

124:第一冷卻區壁面 124: Wall surface of the first cooling zone

125:第一轉折處 125: The first turning point

126:第三錐狀區壁面 126: Wall surface of the third cone zone

21:流體出口 21: Fluid outlet

22:第二腔室 22: The second chamber

221:第二錐狀區 221:Second cone area

222:第二冷卻區 222: Second Cooling Zone

223:第二錐狀區壁面 223: the wall of the second cone zone

224:第二冷卻區壁面 224: Wall surface of the second cooling zone

225:第二轉折處 225: The second turning point

3:連接通道 3: Connection channel

4:排氣通道 4: exhaust channel

51:第一鰭片 51: First fin

52:第二鰭片 52: Second fin

7:模組殼體 7:Module housing

d1:通道寬度 d1: channel width

d2:通道寬度 d2: channel width

Claims (10)

一種冷卻模組,包括: 一模組殼體,其中,該模組殼體形成有一流體入口、一流體出口、一連接通道、一第一腔室以及一第二腔室,該流體入口連接該第一腔室,該流體出口連接該第二腔室,該連接通道連接該第一腔室以及該第二腔室; 其中,該模組殼體更形成有一排氣通道,該排氣通道連接該第一腔室以及該第二腔室,該排氣通道的通道寬度小於該連接通道的通道寬度; 其中,相較於該連接通道,該排氣通道更靠近該流體入口以及該流體出口。 A cooling module comprising: A module housing, wherein the module housing forms a fluid inlet, a fluid outlet, a connecting channel, a first chamber and a second chamber, the fluid inlet is connected to the first chamber, the fluid The outlet is connected to the second chamber, and the connection channel is connected to the first chamber and the second chamber; Wherein, the module housing is further formed with an exhaust channel, the exhaust channel connects the first chamber and the second chamber, and the channel width of the exhaust channel is smaller than the channel width of the connecting channel; Wherein, compared with the connection channel, the exhaust channel is closer to the fluid inlet and the fluid outlet. 如請求項1所述之冷卻模組,其中,一工作流體適於從該流體入口進入該第一腔室,並經過該連接通道抵達該第二腔室,再通過該流體出口離開該模組殼體,該工作流體內形成有至少一氣泡,該氣泡適於從該第一腔室經過該排氣通道而抵達該第二腔室。The cooling module as claimed in claim 1, wherein a working fluid is adapted to enter the first chamber from the fluid inlet, reach the second chamber through the connecting channel, and leave the module through the fluid outlet In the casing, at least one air bubble is formed in the working fluid, and the air bubble is suitable to reach the second chamber from the first chamber through the exhaust channel. 如請求項2所述之冷卻模組,其中,該排氣通道之一第一端連接該第一腔室,該排氣通道之一第二端連接該第二腔室,該第一端與該流體入口之間的距離大於該第二端與該流體出口之間的距離。The cooling module as described in claim 2, wherein, one first end of the exhaust passage is connected to the first chamber, one second end of the exhaust passage is connected to the second chamber, and the first end is connected to the second chamber. The distance between the fluid inlet is greater than the distance between the second end and the fluid outlet. 如請求項3所述之冷卻模組,其中,該工作流體沿一U字型路徑,從該流體入口進入該第一腔室,並經過該連接通道抵達該第二腔室,再通過該流體出口離開該模組殼體。The cooling module as described in claim 3, wherein the working fluid enters the first chamber from the fluid inlet along a U-shaped path, and reaches the second chamber through the connecting channel, and then passes through the fluid An outlet exits the module housing. 如請求項3所述之冷卻模組,其中,該連接通道的通道寬度等於或大於該排氣通道之通道寬度的5倍。The cooling module according to claim 3, wherein the channel width of the connecting channel is equal to or greater than 5 times of the channel width of the exhaust channel. 如請求項3所述之冷卻模組,其中,該第一腔室包括一第一錐狀區以及一第一冷卻區,該第一錐狀區包括一第一錐狀區壁面,該第一冷卻區包括一第一冷卻區壁面,該第一錐狀區壁面與該第一冷卻區壁面之間的夾角小於180度,該第一錐狀區壁面與該第一冷卻區壁面之間存在一第一轉折處,該排氣通道之該第一端連接該第一轉折處。The cooling module as described in claim 3, wherein the first chamber includes a first conical region and a first cooling region, the first conical region includes a wall surface of the first conical region, the first The cooling zone includes a wall surface of the first cooling zone, the angle between the wall surface of the first conical zone and the wall surface of the first cooling zone is less than 180 degrees, and there is a At the first turning point, the first end of the exhaust passage is connected to the first turning point. 如請求項6所述之冷卻模組,其中,該第二腔室包括一第二錐狀區以及一第二冷卻區,該第二錐狀區包括一第二錐狀區壁面,該第二冷卻區包括一第二冷卻區壁面,該第二錐狀區壁面與該第二冷卻區壁面之間的夾角小於180度,該第二錐狀區壁面與該第二冷卻區壁面之間存在一第二轉折處,該排氣通道之該第二端端連接該第二轉折處。The cooling module according to claim 6, wherein the second chamber includes a second conical region and a second cooling region, the second conical region includes a second conical region wall surface, the second The cooling zone includes a wall surface of the second cooling zone, the angle between the wall surface of the second conical zone and the wall surface of the second cooling zone is less than 180 degrees, and there is a At the second turning point, the second end of the exhaust channel is connected to the second turning point. 如請求項7所述之冷卻模組,其中,該模組殼體更形成有複數個第一鰭片以及複數個第二鰭片,該等第一鰭片設於該第一冷卻區並彼此平行,該等第二鰭片設於該第二冷卻區並彼此平行。The cooling module according to claim 7, wherein the module housing is further formed with a plurality of first fins and a plurality of second fins, and the first fins are arranged in the first cooling area and mutually Parallel, the second fins are arranged in the second cooling zone and parallel to each other. 如請求項6所述之冷卻模組,其中,該第一錐狀區包括一第三錐狀區壁面,相對於該第一冷卻區壁面,該第三錐狀區壁面的斜率小於該第一錐狀區壁面的斜率。The cooling module according to claim 6, wherein the first conical zone includes a third conical zone wall, and the slope of the third conical zone wall is smaller than the first conical zone wall with respect to the first cooling zone The slope of the wall of the cone. 一種電子裝置,包括: 一電路板; 至少一熱源,設於該電路板之上;以及 一冷卻模組,其中,該冷卻模組包括一模組殼體,該模組殼體熱連接該熱源,該模組殼體形成有一流體入口、一流體出口、一連接通道、一第一腔室以及一第二腔室,該流體入口連接該第一腔室,該流體出口連接該第二腔室,該連接通道連接該第一腔室以及該第二腔室; 其中,該模組殼體更形成有一排氣通道,該排氣通道連接該第一腔室以及該第二腔室,該排氣通道的通道寬度小於該連接通道的通道寬度; 其中,相較於該連接通道,該排氣通道更靠近該流體入口以及該流體出口。 An electronic device comprising: a circuit board; at least one heat source located on the circuit board; and A cooling module, wherein the cooling module includes a module casing, the module casing is thermally connected to the heat source, and the module casing is formed with a fluid inlet, a fluid outlet, a connecting channel, and a first cavity chamber and a second chamber, the fluid inlet is connected to the first chamber, the fluid outlet is connected to the second chamber, and the connecting channel is connected to the first chamber and the second chamber; Wherein, the module housing is further formed with an exhaust channel, the exhaust channel connects the first chamber and the second chamber, and the channel width of the exhaust channel is smaller than the channel width of the connecting channel; Wherein, compared with the connection channel, the exhaust channel is closer to the fluid inlet and the fluid outlet.
TW111211272U 2022-10-17 2022-10-17 Electronic device and cooling module thereof TWM639655U (en)

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