TWM638560U - Wafer sucking device - Google Patents

Abstract

The present invention is a wafer adsorption device, which comprises a base with an air intake hole running through the base; a guide ring, which comprises a ring body and a plurality of anti-sliding blocks, and each anti-sliding block is protruded on the top surface of the ring body at intervals. The diversion ring is arranged on the base; a diversion cover, one side of which is concaved to form a plurality of flow channels, one end of each flow channel is connected, the other end of each flow channel extends outward and each flow channel is arc-shaped, and the guide The flow cover is set in the ring body of the flow guide ring and fixed on the base, one end of each flow channel is connected with the air inlet, and a distance is kept between the flow guide cover and the flow guide ring; thereby, when placing the wafer, it can To reduce the contact surface with the wafer to reduce the chance of wafer wear, and the use of air blowing can further reduce dust adhesion on the wafer to maintain the cleanliness of the wafer.

Description

Wafer adsorption device

The present invention relates to a wafer adsorption device, in particular to a wafer adsorption device which utilizes air blowing to position wafers thereon.

In the prior art, in the wet manufacturing process of semiconductors, one of the steps is to clean the crystal back, and when cleaning the crystal back, the wafer needs to be positioned on a suction plate first, and the suction plate is formed with a plurality of The suction hole, the wafer is adsorbed on it by the suction force of the suction hole, and then the suction plate is rotated to drive the wafer to rotate, and the cleaning solution is sprayed on the surface of the wafer during the rotation of the wafer to perform cleaning operations.

However, because the suction plate in the prior art adopts the air suction method, in addition to forming a certain number of adsorption holes, the contact surface with the wafer also needs a certain area to maintain stability, but the more the contact area with the wafer When, especially in the process of dynamic rotation, if the wafer slips, the probability of scratching the wafer will increase, which will cause a decline in product yield; therefore, the overall structure of the suction plate in the prior art exists as The aforementioned problems and shortcomings need to be improved.

In view of the deficiencies in the prior art, the present invention provides a wafer adsorption device, which can form a swirling air flow and blow air toward the wafer to fix the wafer on it by setting a guide ring and a guide cover on the base .

In order to achieve the above-mentioned new purpose, the technical means adopted in this new model is to design a wafer adsorption device, which includes: a base, which runs through an air inlet; A guide ring, which includes a ring body and a plurality of anti-sliding blocks, the ring body is a hollow body and has a ring top surface, a ring bottom surface and a ring inner surface, the ring inner surface is located between the ring top surface and the ring bottom surface , each of the anti-sliding blocks is protrudingly arranged on the top surface of the ring at intervals, and the guide ring is arranged on the base with the bottom surface of the ring; A diversion cover, which includes a cover top surface, a cover bottom surface and a cover ring outer surface, the cover ring outer surface is located between the cover top surface and the cover bottom surface, and the cover bottom surface is concavely formed with a plurality of flow channels, One end of each of the flow channels is connected, the other end of each of the flow channels extends outward and forms an opening, each of the flow channels is arc-shaped, the diversion cover is arranged in the ring body of the diversion ring, and the The bottom surface of the cover is fixed on the base, one end of each of the flow channels communicates with the air inlet, and the outer surface of the cover ring is arc-shaped and maintains a distance from the inner surface of the ring.

Further, in the wafer suction device, the inner surface of the ring is an arc surface, and the inner surface of the ring and the outer surface of the cover ring are parallel to each other.

Furthermore, in the above-mentioned wafer adsorption device, a ring slope is formed on the top surface of the ring adjacent to the outer edge, and the ring slope slopes upward toward the outside.

Furthermore, in the wafer suction device, each of the anti-sliding blocks protrudes upward from the top surface of the ring by a certain height.

The advantage of the new model is that it can reduce the contact area between the wafer and the new model, so as to reduce the chance of the wafer being worn due to slipping, and the use of air blowing can further reduce the dust from adhering to the wafer, so as to maintain Wafer cleanliness.

In the following, in conjunction with the drawings and preferred embodiments of the present invention, the technical means adopted by the present invention for achieving the intended purpose of the new model will be further described.

Please refer to FIG. 1 and FIG. 2 , the wafer suction device of the present invention includes a base 10 , a guide ring 20 and a guide cover 30 .

The base 10 is a circular piece, which runs through an air inlet 11, a plurality of inner seat holes 12 and a plurality of outer seat holes 13, the air inlet 11 is located in the center, and each inner seat hole 12 and each outer seat hole 13 are surrounded by intervals. Arranged around the air inlet 11, but not limited thereto, the form of the base 10 can be changed according to the needs of users.

2 and 4, the guide ring 20 includes a ring body 21 and a plurality of anti-slip blocks 22, the ring body 21 is a hollow body, it has a ring top surface 211, a ring bottom surface 212 and a ring inner surface 213, the ring The inner surface 213 is located between the ring top surface 211 and the ring bottom surface 212, and each anti-slip block 22 is protruded on the ring top surface 211 at intervals, and each anti-slider block 22 protrudes upward from the surface of the ring top surface 211 by a height, and the guide ring 20 Through a plurality of locking pieces pierced through each outer seat hole 13 and locked on the bottom surface 212 of the ring, the guide ring 20 is fixed on the base 10. The direction toward the ring top surface 211 is inclined outward, that is, like the shape of a trumpet mouth, the end of the ring top surface 211 adjacent to the outer edge is formed with a ring slope 214, and the ring slope 214 slopes upward toward the outer direction, but it is not limited to this , The form of the guide ring 20 can be changed according to the needs of users.

Please refer to FIG. 2 to FIG. 4, the diversion cover 30 includes a cover top surface 31, a cover bottom surface 32 and a cover ring outer surface 33, the cover ring outer surface 33 is located between the cover top surface 31 and the cover bottom surface 32, The bottom surface 32 of the cover is concavely formed with a plurality of flow channels 34, one end of each flow channel 34 is connected to form a confluence area 35, and the other end of each flow channel 34 extends outward and forms an outlet 36. In this embodiment, each flow channel The channels 34 are arc-shaped and the preferred number is three. The bending direction of each channel 34 is the same. As a limit, the number and form of each flow channel 34 can be changed according to the needs of users. The diversion cover 30 is arranged in the ring body 21 of the diversion ring 20, and a plurality of locking pieces are passed through each inner seat hole 12 and Locked on the bottom surface 32 of the cover, the diversion cover 30 is fixed on the base 10, the confluence area 35 at one end of each flow channel 34 communicates with the air inlet 11, the outer surface 33 of the cover ring is an arc surface, and the outer surface 33 of the cover ring is connected to the The inner sides of the ring 213 are parallel to each other and keep a distance. A ring-shaped air outlet is formed between the diversion cover 30 and the diversion ring 20 viewed from above, and a swirl area is formed between the outer side 33 of the cover ring and the inner side 213 of the ring. 37.

When the present invention is used, please refer to Fig. 2 and Fig. 5, it can be implemented with a wafer 40, the wafer 40 is placed on each anti-slip block 22, and the base 10 is connected to an external air supply device (not shown in the drawings) , the external air supply device inputs the gas from the air inlet 11, and after the gas flows to the confluence area 35, it will diverge from each flow channel 34 and flow out from each outlet 36, and because each outlet 36 is an oblique mouth, it is located in the swirl area 37 The gas will flow in the same direction to form a swirling airflow and be blown upwards, and when the gas hits the wafer 40, it will flow out from the ring slope 214 along the bottom surface of the wafer 40 toward the outside, and because the wafer 40 below The gas flow rate is faster than the gas flow rate above the wafer 40, so the gas pressure above the wafer 40 is greater than the gas pressure below the wafer 40, so that the wafer 40 can be positioned on each of the anti-slip blocks 22 as if in a suspended state. Compared with the prior art, the contact surface of the wafer 40 can be lowered to reduce the probability of the wafer 40 being worn, and the method of blowing air can further reduce dust adhering to the wafer 40 to maintain the cleanliness of the wafer 40 .

In the aforementioned process, since the ring slope 214 can guide the gas to move upward, the gas can directly push against the bottom surface of the wafer 40 to further provide a supporting force, thereby making the force on the wafer 40 more even and improving the positioning of the wafer 40 The stability and the effect of reducing the deformation of the wafer 40.

The above description is only a preferred embodiment of this creation, and does not impose any formal restrictions on this creation. Although this creation has been disclosed as above with a preferred embodiment, it is not used to limit this creation. Anyone in the technical field has Ordinary knowledgeable persons, without departing from the scope of this creative technical solution, may use the technical content disclosed above to make some changes or modifications as equivalent embodiments of equivalent changes, but any content that does not deviate from this creative technical solution, according to this Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence of the creation still belong to the scope of the technical solution of the creation.

10: Base 11: air intake 12: Inner seat hole 13: Outer seat hole 20: guide ring 21: ring body 211: ring top surface 212: ring bottom 213: inner side of the ring 214: ring bevel 22: Stop slider 30: diversion cover 31: cover top surface 32: cover bottom surface 33: Outer side of cover ring 34: Runner 35: Confluence area 36: export 37: Swirl zone 40: Wafer

Fig. 1 is the perspective view of the new model. Fig. 2 is an exploded view of the new model. Fig. 3 is the bottom view of the diversion cover of the present invention. Fig. 4 is a partial sectional view of the present model. Fig. 5 is the sectional view of the present model.

20: guide ring

21: ring body

211: ring top surface

214: ring bevel

22: Stop slider

30: diversion cover

31: cover top surface

Claims (4)

A wafer adsorption device, comprising: a base, which runs through an air inlet; A guide ring, which includes a ring body and a plurality of anti-sliding blocks, the ring body is a hollow body and has a ring top surface, a ring bottom surface and a ring inner surface, and the ring inner surface is located between the ring top surface and the ring bottom surface , each of the anti-sliding blocks is protrudingly arranged on the top surface of the ring at intervals, and the guide ring is arranged on the base with the bottom surface of the ring; A diversion cover, which includes a cover top surface, a cover bottom surface and a cover ring outer surface, the cover ring outer surface is located between the cover top surface and the cover bottom surface, and the cover bottom surface is concavely formed with a plurality of flow channels, One end of each of the flow channels is connected, the other end of each of the flow channels extends outward and forms an opening, each of the flow channels is arc-shaped, the diversion cover is arranged in the ring body of the diversion ring, and the The bottom surface of the cover is fixed on the base, one end of each of the flow channels communicates with the air inlet, and the outer surface of the cover ring is arc-shaped and maintains a distance from the inner surface of the ring. The wafer suction device according to claim 1, wherein the inner surface of the ring is an arc surface, and the inner surface of the ring and the outer surface of the cover ring are parallel to each other. The wafer suction device according to claim 1 or 2, wherein a ring slope is formed on the top surface of the ring adjacent to the outer edge, and the ring slope slopes upward toward the outside. The wafer suction device according to claim 3, wherein each of the anti-sliding blocks protrudes upwards from the top surface of the ring by a certain height.

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