TWM632451U - Liquid-cooling type heat dissipation module - Google Patents

Abstract

A liquid-cooling type heat dissipation module includes a base, a fluid pipe and a heat dissipation component. The base includes a main body, a heat dissipation channel and a plurality of pins connecting the main body. The heat dissipation channel is disposed on the main body, such that fluid flows within the body through the heat dissipation channel. The pins are configured to be plugged into a socket of the circuit board. The fluid pipe is coupled between the circuit board and the base and is in fluid communication with the heat dissipation channel. The heat dissipation component is disposed on the base and thermally coupled to the heat dissipation channel to cool the fluid in the heat dissipation channel.

Description

Water-cooled cooling module

The present disclosure relates to a water-cooled heat dissipation module.

The principle of water-cooled heat dissipation is simple, generally use liquid (such as water or coolant) as the heat dissipation medium, and use a continuously operating water pump or pump to form a continuous circulation in the applied system. Liquids flow in closed conduits that are distributed over the surfaces of the various electronic components in the system, such as the central processing unit. As the relatively cold liquid flows through these relatively hot electronic components, it absorbs its heat to slow its temperature rise. Then, the heat is released by the pipeline to the outside world or other heat dissipation mechanisms to reduce the temperature of the liquid, and then the liquid is returned to the system for circulation and heat dissipation.

However, due to the limited internal space of the general host, it can only be used with the space of the set environment, and the inflow and outflow structure of the water-cooled heat dissipation pipeline has a certain thickness or volume, and must be locked on the casing or It is pulled to the outside of the casing to be fixed, and the design flexibility is low, making this type of water-cooled heat dissipation module difficult to design and assemble.

The present disclosure provides a water-cooled heat dissipation module, which includes a base, a fluid pipe and a heat dissipation element. The base includes a body, a heat dissipation channel and a plurality of pins connected to the body. The heat dissipation channel is arranged on the body, so that the fluid flows into the body through the heat dissipation channel, and the plurality of pins are used to be inserted into the slots of the circuit board. The fluid pipe is coupled between the circuit board and the base and is in fluid communication with the heat dissipation channel. The heat dissipation element is disposed on the base and thermally coupled with the heat dissipation channel to cool the fluid in the heat dissipation channel.

Based on the above, the water-cooled heat dissipation module of the present disclosure utilizes the base to integrate devices such as heat dissipation channels and heat dissipation elements to make it modular, and uses the pins on the base to be inserted into the slots of the circuit board. In this configuration, the water-cooled heat dissipation module can be easily inserted into the slot of the circuit board through the pins to form an electrical connection, and it is not necessary to use screws and other fasteners to be locked on the casing of the electronic device, and then communicate with the electronic device through the circuit. The circuit board is electrically connected, so the assembly steps of the water-cooled heat dissipation module can be simplified, and the water-cooled heat dissipation module can be disassembled and moved together with the circuit board, which improves the convenience of use of the water-cooled heat dissipation module. In addition, the user can utilize the flexibility of the fluid pipe to couple the fluid pipe to any heating element on the circuit board as required, thereby increasing the flexibility of the water-cooled heat dissipation module.

The foregoing and other technical contents, features and effects of the present disclosure will be clearly presented in the following detailed description of each embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as "up", "down", "front", "rear", "left", "right", etc., only refer to the directions of the attached drawings. Accordingly, the directional terminology used is illustrative, not limiting, of the present disclosure. Also, in the following embodiments, the same or similar elements will be given the same or similar reference numerals.

FIG. 1 is a schematic perspective view of a water-cooled heat dissipation module according to an embodiment of the present disclosure. FIG. 2 is a schematic exploded view of components of a water-cooled heat dissipation module according to an embodiment of the present disclosure. Referring first to FIG. 1 and FIG. 2 , in some embodiments, the water-cooled heat dissipation module 100 may include a base 110 , a fluid pipe 120 and a heat dissipation element 130 . In this embodiment, the water-cooled heat dissipation module 100 can be applied to a portable electronic device such as a notebook computer. For example, the water-cooled heat dissipation module 100 may be disposed on the circuit board 200 of the portable electronic device, and thermally coupled with the heating element 210 on the circuit board 200 to dissipate heat from the heating element 210 .

In some embodiments, the base 110 may include a body 112 , a heat dissipation channel 114 , and a plurality of pins 116 connected to the body 112 . In one embodiment, the heat dissipation channel 114 is disposed on the body 112 , so that the fluid can circulate in the body 112 through the heat dissipation channel 114 . The heat dissipation channel 114 is disposed on the body 112 . Specifically, the heat dissipation channel 114 may be a channel defined by the body 112 , which is embedded in the body 112 and distributed around the entire body 112 . The fluid may include heat-dissipating liquid such as water, which may circulate and flow in the body 112 through the heat-dissipating flow channel 114 . In this embodiment, the plurality of pins 116 can be disposed on one side of the main body 112 , and are suitable for being inserted into slots (not shown) of the circuit board 200 to be electrically connected to the circuit board 200 . For example, the slot may include a peripheral controller interface unit (PCIU) slot on the circuit board 200 . With this configuration, the water-cooled heat dissipation module 100 can be easily inserted into the slot of the circuit board 200 via the pins 116 to be electrically connected to it, and it is not necessary to use screws or other fasteners to be fastened to the casing of the electronic device. The circuit is then electrically connected to the circuit board, so that the assembly steps of the water-cooled heat dissipation module 100 can be simplified, and the water-cooled heat dissipation module 100 can be disassembled and moved together with the circuit board 200 to improve the convenience of use of the water-cooled heat dissipation module 100 .

In some embodiments, the fluid tube 120 is coupled between the circuit board 200 and the base 110 and is in fluid communication with the heat dissipation channel 114 . In this embodiment, the fluid pipe 120 is thermally coupled to the heating element 210 on the circuit board 200 , so that the fluid in the fluid pipe 120 can exchange heat with the heating element 210 . In this embodiment, the fluid tube 120 can be a flexible hose, such as heat-resistant plastic or other suitable flexible materials. Of course, this disclosure is not limited to this. In this embodiment, the heat-resistant temperature of the fluid tube 120 is less than or approximately equal to 120 degrees Celsius. Further, the index of the heat resistance of plastic materials is "Heat Deflection Temperature" (HDT). deformation temperature. Therefore, the heat-resistant temperature of the fluid tube 120 in this embodiment can be regarded as the thermal deformation temperature of the fluid tube 120 . With this configuration, the user can utilize the flexibility of the fluid pipe 120 to couple the fluid pipe 120 to any heating element 210 on the circuit board 200 as required, thereby increasing the flexibility of the water-cooled heat dissipation module 100 .

3 is a schematic cross-sectional view of a water-cooled heat dissipation module along a longitudinal axis of a heat dissipation fin according to an embodiment of the present disclosure. Referring to FIGS. 1 to 3 , in some embodiments, the heat dissipation element 130 is disposed on the base 110 and is thermally coupled with the heat dissipation channel 114 to cool the fluid in the heat dissipation channel 114 . That is, the fluid in the heat dissipation channel 114 can flow to the heating element 210 of the circuit board 200 via the fluid pipe 120 for heat exchange therewith. In addition, the fluid heated by the heat exchange can flow back to the body 112 through the fluid pipe 120 and the heat dissipation channel 114 and cool the fluid in the heat dissipation channel 114 through the heat dissipation element 130 . In this embodiment, the heat dissipation element 130 may include a plurality of heat dissipation fins 132 and a fan 134 . In this configuration, the heat dissipation channels 114 can pass through the heat dissipation fins 132 to exchange heat between the fluid in the heat dissipation channels 114 and the heat dissipation fins 132 . Cooling and cooling.

2 and FIG. 3 , further, in some embodiments, the body 112 of the base 110 may include an upper plate 1121 , a lower plate 1122 and a bottom plate 1123 , wherein the upper plate 1121 and the lower plate 1122 are respectively disposed on the bottom plate 1123 On opposite sides (eg, upper and lower sides) of the heat dissipation fins 132 are connected between the upper plate 1121 and the lower plate 1122 and form thermal coupling with the heat dissipation channel 114 . Correspondingly, the heat dissipation channel 114 may include an upper channel 114a, a lower channel 114b and a fin channel 114c. Specifically, the upper plate 1121 and the lower plate 1122 are respectively provided with an upper flow channel 114a and a lower flow channel 114b. The heat dissipation fins 132 have at least one fin flow channel 114c (six are shown in FIG. 2 , but not limited thereto), which respectively extend through the plurality of heat dissipation fins 132 and communicate with the upper flow channel 114a and the lower flow channel 114b. communicated, so that the fluid in the upper flow channel 114a can pass through the cooling fins 132 through the fin flow channel 114c to exchange heat with the cooling fins 132, and the fluid after heat exchange flows to the lower flow channel from the fin flow channel 114c. 114b, and flow back to the fluid pipe 120 to continue to dissipate heat to the heating element 210. In this embodiment, the material of the base 110 may include metal or other materials with high thermal conductivity.

4 is another schematic cross-sectional view of a water-cooled heat dissipation module according to an embodiment of the present disclosure. 1 , 2 and 4 , in some embodiments, the fan 134 may include an air inlet 1341 and an air outlet 1342 , and the air outlet 1342 faces the heat dissipation fins 132 to dissipate heat and cool down. In this embodiment, the fan 134 can be a cross-flow fan, the air inlet 1341 can be located in the center of the fan 134 , and the air outlet 1342 can be located outside the fan 134 . In this configuration, the cooling airflow can flow in along the center of the fan 134, and then flow to the outside of the fan 134 along the radial direction of the fan 134, and then flow out through the air outlet 1342, that is to say, the directions of the air inlet and the air outlet of the fan 134 are in the same direction. The plane is flat, so that the blown cooling air can be evenly distributed along the width direction of the fan 134 , and the overall volume of the fan 134 can be reduced, so that the fan 134 and other components can be integrated into the water-cooled heat dissipation module 100 and inserted into the circuit board 200 on the slot.

Referring back to FIG. 1 and FIG. 2 , in some embodiments, the water-cooled heat dissipation module 100 further includes a pump 140 , which can be coupled between the fluid pipe 120 and the heat dissipation channel 114 to dissipate the fluid in the fluid pipe 120 Pumped into the cooling channel 114 . Specifically, in this embodiment, the fluid heated up after the heat exchange with the heating element 210 flows back to the base 110 via the fluid pipe 120 , and the heated fluid is pumped up to the upper flow channel of the upper plate 1121 via the pump 140 . In 114a, the heated fluid flows through the upper flow channel 114a and then flows down to the fin flow channel 114c to pass through the heat dissipation fins 132 and conduct heat exchange with the heat dissipation fins 132, and the cooled fluid after the heat exchange passes through the lower flow channel 114b and The fluid pipe 120 flows back to the heating element 210 to continue to dissipate heat from the heating element 210 .

To sum up, the water-cooled heat dissipation module of the present disclosure utilizes the base to integrate devices such as heat dissipation channels and heat dissipation elements to make it modular, and uses the pins on the base to be inserted into the slots of the circuit board . In this configuration, the water-cooled heat dissipation module can be easily inserted into the slot of the circuit board through the pins to form an electrical connection, and it is not necessary to use screws and other fasteners to be locked on the casing of the electronic device, and then communicate with the electronic device through the circuit. The circuit board is electrically connected, so the assembly steps of the water-cooled heat dissipation module can be simplified, and the water-cooled heat dissipation module can be disassembled and moved together with the circuit board, which improves the convenience of use of the water-cooled heat dissipation module. In addition, the user can utilize the flexibility of the fluid pipe to couple the fluid pipe to any heating element on the circuit board as required, thereby increasing the flexibility of the water-cooled heat dissipation module.

100: Water-cooled cooling module 110: Pedestal 112: Ontology 1121: Upper board 1122: Lower Board 1123: Bottom Plate 114: Cooling runner 114a: Upper runner 114b: Lower runner 114c: Fin runner 116: pin 120: Fluid Tube 130: cooling element 132: cooling fins 134: Fan 1341: air inlet 1342: Air outlet 140: Pump 200: circuit board 210: Heating element

FIG. 1 is a schematic perspective view of a water-cooled heat dissipation module according to an embodiment of the present disclosure. FIG. 2 is a schematic exploded view of components of a water-cooled heat dissipation module according to an embodiment of the present disclosure. 3 is a schematic cross-sectional view of a water-cooled heat dissipation module according to an embodiment of the present disclosure. 4 is another schematic cross-sectional view of a water-cooled heat dissipation module according to an embodiment of the present disclosure.

100: Water-cooled cooling module

110: Pedestal

112: Ontology

114: Cooling runner

116: pin

120: Fluid Tube

130: cooling element

132: cooling fins

134: Fan

140: Pump

200: circuit board

210: Heating element

Claims (10)

A water-cooled heat dissipation module, comprising: A base includes a body, a heat dissipation channel, and a plurality of pins connected to the body, wherein the heat dissipation channel is disposed on the body, so that a fluid flows into the body through the heat dissipation channel, and the plurality of a pin is used to be inserted into a slot of a circuit board; a fluid pipe coupled between the circuit board and the base and in fluid communication with the heat dissipation channel; and A heat dissipation element is disposed on the base and thermally coupled with the heat dissipation channel to cool the fluid in the heat dissipation channel. The water-cooled heat dissipation module of claim 1, wherein the fluid pipe comprises a flexible hose. The water-cooled heat dissipation module according to claim 1, wherein the material of the fluid pipe comprises heat-resistant plastic. The water-cooled heat dissipation module according to claim 1, wherein the heat-resistant temperature of the fluid tube is less than or equal to 120 degrees Celsius. The water-cooled heat dissipation module of claim 1, wherein the heat dissipation element includes a plurality of heat dissipation fins, which are thermally coupled to the heat dissipation channel. The water-cooled heat dissipation module of claim 5, wherein the heat dissipation element further comprises a fan, the air outlet of which faces the plurality of heat dissipation fins. The water-cooled heat dissipation module of claim 6, wherein the fan comprises a cross-flow fan. The water-cooled heat dissipation module according to claim 1, further comprising a pump coupled between the fluid pipe and the heat dissipation channel to pump the fluid in the fluid tube into the heat dissipation channel. The water-cooled heat dissipation module according to claim 1, wherein the material of the base comprises metal. The water-cooled heat dissipation module of claim 1, wherein the fluid pipe is thermally coupled to a heating element on the circuit board.

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