TWM626707U - Test socket providing convective flow and burn-in test board including the test socket - Google Patents

Test socket providing convective flow and burn-in test board including the test socket

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Publication number
TWM626707U
TWM626707U TW110211289U TW110211289U TWM626707U TW M626707 U TWM626707 U TW M626707U TW 110211289 U TW110211289 U TW 110211289U TW 110211289 U TW110211289 U TW 110211289U TW M626707 U TWM626707 U TW M626707U
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Taiwan
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channel
fluid
test socket
test
detection
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TW110211289U
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Chinese (zh)
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孫偉志
陳蘊函
鮑昱如
劉少淇
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伊士博國際商業股份有限公司
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Priority to TW110211289U priority Critical patent/TWM626707U/en
Publication of TWM626707U publication Critical patent/TWM626707U/en

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Abstract

本創作提供一種具有對流的測試插座,包括:一本體部,具有:一 容置空間,配置為收容一檢測物;一檢測部,配置於該容置空間之底側,該檢測部配置有複數個探針以接觸該檢測物之底側進行檢測;一上蓋,配置於本體部之頂側,該上蓋具有:一導熱部件,配置為可接觸該檢測物之頂側;其中,該本體部的一側面和該側面的另一相對側面之間穿設有一流體通道,且該流體通道通過該複數個探針之一部分。 The present invention provides a test socket with convection, including: a body part, having: a The accommodating space is configured to accommodate a detection object; a detection part is arranged on the bottom side of the accommodating space, and the detection part is configured with a plurality of probes to contact the bottom side of the detection object for detection; an upper cover is arranged on the bottom side of the detection object The top side of the main body part, the upper cover has: a heat-conducting component configured to be able to contact the top side of the detection object; wherein a fluid channel is pierced between one side surface of the main body part and the other opposite side surface of the side surface, and The fluid channel passes through a portion of the plurality of probes.

Description

提供有對流的測試插座及包含該測試插座的燒機測試板 Provides a test socket with convection and a burn-in test board containing the test socket

本創作係關於一種測試插座,尤指一種應用於燒機測試(Burn-in test)下,能利用流體的流動來對於測試插座中的探針部分進行散熱。 The present invention relates to a test socket, especially a test socket used in a burn-in test, which can utilize the flow of fluid to dissipate heat from the probe part in the test socket.

在現今,電子元件於製作完成後,常需於高溫環境下進行燒機測試(Burn-in test)作業,燒機測試是利用探針接觸檢測物(例如:晶片)而給予測試訊號以進行各種參數檢測,藉以淘汰出不良品,確保產品品質。但在探針接觸檢測物的檢測過程中會產生一定程度的積熱,此不利於某些測試的條件。目前對於在燒機測試中,對於上述散熱的解決方案,常見的有在燒機板(Burn-in board)上方的燒機插座(Socket)裝設有散熱鰭片,或是在燒機板的背面提供類似的散熱手段。在以往的燒機插座設計上並沒有辦法對於位於燒機插座內部的探針區域進行散熱,只要燒機插座通電後進行燒機測試時,探針就會造成積熱在附近的殼體中(housing)裡,導致檢測物上所焊接錫球熔解。 Nowadays, after the fabrication of electronic components, burn-in tests are often performed in a high-temperature environment. Burn-in tests use probes to contact a test object (such as a chip) to give test signals to perform various tests. Parameter testing to eliminate defective products and ensure product quality. However, a certain degree of accumulated heat will be generated during the detection process when the probe contacts the test object, which is not conducive to certain test conditions. At present, in the burn-in test, for the above-mentioned heat dissipation solutions, it is common that the burn-in socket above the burn-in board is equipped with heat dissipation fins, or the burn-in board is equipped with heat dissipation fins. A similar means of cooling is provided on the back. In the previous burn-in socket design, there is no way to dissipate heat from the probe area located inside the burn-in socket. As long as the burn-in socket is powered on and the burn-in test is performed, the probe will cause heat to accumulate in the nearby housing ( housing), causing the solder balls soldered on the detection object to melt.

因此在現行的燒機測試中,對於晶片的效能越來越強大,進而高功率下產生的熱也更高,而只具有散熱鰭片的燒機插座在散熱功能上也漸漸的不敷現行的燒機測試的需求。 Therefore, in the current burn-in test, the performance of the chip is getting stronger and stronger, and the heat generated under high power is also higher, and the burn-in socket with only heat dissipation fins is gradually less than the current heat dissipation function. Burn-in test requirements.

有鑑於此,本創作人研創出一種提供有氣流的測試插座,以有效改善先前技術之缺點,此即為本創作之設計宗旨。 In view of this, the creator has developed a test socket with airflow to effectively improve the shortcomings of the prior art, which is the design purpose of this creation.

鑑於前述,本創作提供了一種散熱結構,可以將探針的積熱排出,可以達到最佳的散熱效果。 In view of the foregoing, the present invention provides a heat dissipation structure, which can discharge the accumulated heat of the probe to achieve the best heat dissipation effect.

為達到上述之目的,本創作提供了一種具有對流的測試插座,包括:一本體部,具有:一容置空間,配置為收容一檢測物;一檢測部,配置於該容置空間之底側,該檢測部配置有複數個探針以接觸該檢測物之底側進行檢測;一上蓋,配置於本體部之頂側,該上蓋具有:一導熱部件,配置為可接觸該檢測物之頂側;其中,該本體部的一側面和該側面的另一相對側面之間穿設有一流體通道,且該流體通道通過該複數個探針之一部分。 In order to achieve the above-mentioned purpose, the present invention provides a test socket with convection, comprising: a main body part, which has: an accommodating space configured to accommodate a detection object; and a detection part disposed on the bottom side of the accommodating space , the detection part is equipped with a plurality of probes to contact the bottom side of the detection object for detection; an upper cover is arranged on the top side of the main body part, and the upper cover has: a heat conduction part, which is configured to contact the top side of the detection object ; wherein, a fluid channel is pierced between one side surface of the body portion and the other opposite side surface of the side surface, and the fluid channel passes through a part of the plurality of probes.

為達到上述之目的,本創作提供了另一種提供有對流的測試插座,包括:一本體部,具有:一容置空間,配置為收容一檢測物;一檢測部,配置於該容置空間之底側,該檢測部具有:一殼體,配置有一第一通道;複數個探針,穿設於該殼體,以接觸該檢測物之底側進行檢測,以及該探針之一部分係暴露於該第一通道內;一上蓋,配置於本體部之頂側,該上蓋具有:一導熱部件,配置為可接觸該檢測物之頂側;其中,該本體部的一側面穿設有一第二通道,且該側面的另一相對側面穿設有一第三通道,該第一通道、該第二通道與該第三通道相連形成一流體通道。 In order to achieve the above purpose, the present invention provides another test socket provided with convection, comprising: a main body part, having: an accommodating space, configured to accommodate a detection object; a detection part, arranged in the accommodating space On the bottom side, the detection part has: a casing with a first channel; a plurality of probes penetrated through the casing to contact the bottom side of the detection object for detection, and a part of the probes is exposed to In the first channel; an upper cover, disposed on the top side of the main body, the upper cover has: a heat-conducting component configured to contact the top side of the detection object; wherein, a side surface of the main body is provided with a second channel , and the other opposite side of the side is provided with a third channel, the first channel, the second channel and the third channel are connected to form a fluid channel.

如上所述之具有對流的測試插座,其中暴露於該第一通道的該複數個探針的一部分位於該流體通道的兩端開口之間。 The test socket with convection as described above, wherein a portion of the plurality of probes exposed to the first channel is located between the two end openings of the fluid channel.

如上所述之具有對流的測試插座,其中該本體部的周圍提供有一流體導入部件以及一流體導出部件,其中該流體導入部件流體連通該第二通道,該流體導出部件流體連通該第三通道。 The test socket with convection as described above, wherein a fluid introduction part and a fluid outlet part are provided around the body part, wherein the fluid introduction part is in fluid communication with the second channel, and the fluid outlet part is in fluid communication with the third channel.

如上所述之具有對流的測試插座,該流體導入部件更具備一第一開口,流體連通該第二通道;該流體導出部件更具備一第二開口,流體連通該第三通道。 In the above-mentioned test socket with convection, the fluid introduction part further has a first opening which is in fluid communication with the second channel; the fluid outlet part further has a second opening which is in fluid communication with the third channel.

如上所述之具有對流的測試插座,其中該流體導入部件、該流體導出部件、該第二通道與該第三通道都位在一載板的頂側。 The test socket with convection as described above, wherein the fluid inlet part, the fluid outlet part, the second channel and the third channel are all located on the top side of a carrier board.

如上所述之具有對流的測試插座,其中該流體導出部件與相對於該本體部之具有該第三通道的側面之間具有一間隙。 The test socket with convection as described above, wherein there is a gap between the fluid lead-out member and the side with the third channel relative to the body portion.

如上所述之具有對流的測試插座,其中該流體導出部件能相對於一載板平行或垂直地設置。 A test socket with convection as described above, wherein the fluid outlet member can be arranged parallel or perpendicular to a carrier plate.

為達到上述之目的,本創作提供一種燒機測試板,複數個測試插座,配置於該燒機測試板上,每一個測試插座包括:一本體部,具有:一容置部,配置為收容一檢測物;一檢測部,配置有複數個探針以接觸該檢測物之底側進行檢測;一上蓋,具有:一導熱部件,配置為接觸該檢測物之頂側;其中,該本體部的一側面開設有一第一通道,且對應該側面的另一側面開設有對應該第一通道的一第二通道,該第一通道與第二通道相通形成一流體通道,該流體通道延伸通過該檢測部的一部分;一流體導入部件,流體連通該第一通道;以及一流體導出部件,流體連通該第二通道。 In order to achieve the above purpose, the present invention provides a burn-in test board, and a plurality of test sockets are arranged on the burn-in test board. a detection object; a detection part is configured with a plurality of probes to contact the bottom side of the detection object for detection; an upper cover has: a heat-conducting component configured to contact the top side of the detection object; wherein, a A first channel is opened on the side surface, and a second channel corresponding to the first channel is opened on the other side surface corresponding to the side surface. The first channel communicates with the second channel to form a fluid channel, and the fluid channel extends through the detection part. a part of the fluid introduction part, which is in fluid communication with the first channel; and a fluid outlet part, which is in fluid communication with the second channel.

為達到上述之目的,本創作提供一種提供有對流的測試插座,該測試插座配置於一載板上用於容置一檢測物,其特徵在於:該測試插座具有用於 在該檢測物和該載板之間傳遞測試訊號的複數個探針,一流體通道貫穿該測試插座,使該複數個探針的至少一部份暴露於該流體通道,藉此使該複數個探針於一測試程序中產生的熱得以經由該流體通道之對流而自該測試插座排除。 In order to achieve the above purpose, the present invention provides a test socket with convection, the test socket is configured on a carrier board for accommodating a test object, and is characterized in that: the test socket has a A plurality of probes that transmit test signals between the test object and the carrier board, a fluid channel runs through the test socket, and at least a portion of the plurality of probes is exposed to the fluid channel, thereby allowing the plurality of probes Heat generated by the probe during a test procedure is removed from the test socket via convection of the fluid channel.

如上所述之測試插座,更提供有一或多個流體輸送部件,該一或多個流體輸送部件配置於該測試插座的周圍用強化該流體通道之對流。 The above-mentioned test socket further provides one or more fluid delivery components, and the one or more fluid delivery components are arranged around the test socket to enhance the convection of the fluid channel.

如上所述之測試插座,其中該一或多個流體輸送部件包含一流體導入部件及一流體導出部件,分別配置於該流體通道的兩端以建立一單向對流。 In the test socket as described above, the one or more fluid delivery components include a fluid introduction component and a fluid output component, which are respectively disposed at both ends of the fluid channel to establish a unidirectional convection.

1000:測試插座 1000: Test socket

1100:本體部 1100: body part

1110:檢測部 1110: Detection Department

1111:殼體 1111: Shell

1112:探針 1112: Probe

1113:第一通道 1113: first channel

1114:凹口 1114: Notch

1115:浮動板 1115: Floating Board

1116:彈性部 1116: Elastic part

1130:流體通道 1130: Fluid channel

1130A:第二通道 1130A: Second channel

1130B:第三通道 1130B: Third channel

1200:容置部 1200: accommodating part

1300:上蓋 1300: upper cover

1310:導熱部件 1310: Thermally conductive parts

1500:頂部散熱鰭片組 1500: Top cooling fin set

1600:底部散熱鰭片組 1600: Bottom cooling fin group

1700:固定手柄 1700: Fixed handle

1900:流體輸送部件 1900: Fluid Delivery Components

1900A:流體導入部件 1900A: Fluid Induction Components

1900B:流體導出部件 1900B: Fluid Outlet Parts

1910:開口 1910: Opening

1910A:第一開口 1910A: First Opening

1910B:第二開口 1910B: Second Opening

1920:扇葉 1920: Fan Blade

1920A:流體導入部件的扇葉 1920A: Fan blades for fluid introduction components

1920B:流體導出部件的扇葉 1920B: Fan blades for fluid outlet parts

2000:燒機測試板 2000: Burn-in test board

3000:載板 3000: carrier board

G:間隙 G: Gap

W:檢測物 W: detected object

圖1係顯示提供有對流的測試插座的立體圖。 Figure 1 is a perspective view showing a test socket provided with convection.

圖2係顯示提供有對流的測試插座的側視圖。 Figure 2 is a side view showing a test socket provided with convection.

圖3係顯示具有對流的測試插座的剖視圖。 3 is a cross-sectional view showing a test socket with convection.

圖4係顯示測試插座中檢測部之第一實施例的立體圖。 FIG. 4 is a perspective view showing the first embodiment of the detection part in the test socket.

圖5係顯示流體輸送部件的立體圖。 Figure 5 is a perspective view showing a fluid delivery component.

圖6係顯示提供有流體輸送部件的測試插座的立體圖。 6 is a perspective view showing a test socket provided with fluid delivery components.

圖7係顯示提供有流體輸送部件的測試插座的另一立體圖。 Figure 7 is another perspective view showing a test socket provided with fluid delivery components.

圖8係顯示提供有流體輸送部件的測試插座的剖視圖,其中標示有流體流動的方向。 8 is a cross-sectional view showing a test socket provided with a fluid delivery component, with the direction of fluid flow indicated.

圖9係顯示測試插座中檢測部之第二實施例的立體圖。 FIG. 9 is a perspective view showing a second embodiment of the detection part in the test socket.

圖10係顯示測試插座中檢測部之第二實施例的側視圖。 FIG. 10 is a side view showing a second embodiment of the detection portion in the test socket.

圖11係顯示提供有流體輸送部件的測試插座之第二實施例的立體圖。 Figure 11 is a perspective view showing a second embodiment of a test socket provided with fluid delivery components.

圖12係顯示具有對流的測試插座之第二實施例的剖視圖。 12 is a cross-sectional view showing a second embodiment of a test socket with convection.

圖13係顯示提供有流體輸送部件的測試插座之第二實施例的剖視圖,其中標示有流體流動的方向。 13 is a cross-sectional view showing a second embodiment of a test socket provided with fluid delivery components, with the direction of fluid flow indicated.

圖14係顯示裝設有複數個測試插座燒機測試板的示意圖。 FIG. 14 is a schematic diagram showing a burn-in test board equipped with a plurality of test sockets.

以下說明本創作測試插座1000之第一實施例,請參閱圖1之提供有對流的測試插座1000的立體圖、圖2之提供有對流的測試插座1000的側視圖以及圖3之提供有對流的測試插座的剖視圖。如圖所示,該提供有對流的測試插座1000屬於掀蓋式的測試插座,具有一本體部(基座)1100,其可固接於燒機載板上或者印刷電路板(Printed Circuit Board,PCB)上(後述說明統稱載板3000)。請參閱圖3,該本體部1100中具有一容置空間1200,配置為收容一檢測物W,該檢測物W可為一積體電路或其他客製化的晶片等。請參閱圖1或2,該本體部1100具有一檢測部1110,配置於該容置空間1200之底側,使檢測部1110位於本體部1100和載板3000之間。 The first embodiment of the inventive test socket 1000 will be described below. Please refer to the perspective view of the test socket 1000 provided with convection in FIG. 1 , the side view of the test socket 1000 provided with convection in FIG. 2 , and the test provided with convection in FIG. 3 Cutaway view of the socket. As shown in the figure, the test socket 1000 provided with convection is a flip type test socket, and has a main body (base) 1100, which can be fixed on the burner carrier board or the Printed Circuit Board (Printed Circuit Board, PCB) (the following description is collectively referred to as the carrier board 3000). Referring to FIG. 3 , the body portion 1100 has an accommodating space 1200 configured to accommodate a detection object W, and the detection object W may be an integrated circuit or other customized chips. Please refer to FIG. 1 or 2 , the body portion 1100 has a detection portion 1110 disposed on the bottom side of the accommodating space 1200 such that the detection portion 1110 is located between the body portion 1100 and the carrier board 3000 .

請參閱圖4之測試插座中檢測部1110之第一實施例的立體圖,如圖所示,該檢測部1110配置有複數個探針1112。每一個探針1112其具有一頂端、一底端及頂端和底端之間延伸的本體,其中探針1112的頂端用於電性接觸連接檢測物W的一底端,探針1112的底端用於電性連接至載板3000的電路。在一實施例中,該探針1112較佳的選擇為彈簧針(pogo pin),使檢測物W和探針1112可彈性接觸。該檢測部1110配置有一殼體1111,基本上由一頂側、一底面及四個側面定義而成。殼體1111為一板體,其中複數個探針1112以垂直的方式穿設地配置於該殼體1111的頂側和底面之間,且探針1112的頂端暴露於殼體1111的頂側,形成一探針接觸陣列。該殼體1111配置有一第一通道1113,其於殼體1111的相對兩側面 之間延伸,使流體(如空氣)可以流動於該第一通道1113之中。在此實施方式中,該檢測部1110可如圖4所示之實施方式,以一矩形狀可拆卸地配置於該容置空間1200之底側。該殼體1111也可如圖3所示之第二實施態樣,即該殼體1111的頂側形成有一斜面,使該檢測物W可隨著該導引面置放於該複數個探針1112之上進行檢測。或者,該檢測部1110是與該本體部1100一體成形,上述之各種實施方式,該複數個探針1112為設置於該容置空間1200之底側,以接觸該檢測物W之底側進行檢測。 Please refer to the perspective view of the first embodiment of the detection part 1110 in the test socket in FIG. 4 , as shown in the figure, the detection part 1110 is configured with a plurality of probes 1112 . Each probe 1112 has a top end, a bottom end and a body extending between the top end and the bottom end, wherein the top end of the probe probe 1112 is used to electrically contact a bottom end of the test object W, and the bottom end of the probe probe 1112 A circuit for electrically connecting to the carrier board 3000 . In one embodiment, the probe 1112 is preferably selected as a pogo pin, so that the detection object W and the probe 1112 can be elastically contacted. The detection part 1110 is configured with a casing 1111 which is basically defined by a top side, a bottom side and four side surfaces. The housing 1111 is a plate body, wherein a plurality of probes 1112 are vertically disposed between the top side and the bottom surface of the housing 1111 , and the tops of the probes 1112 are exposed to the top side of the housing 1111 , A probe contact array is formed. The casing 1111 is configured with a first channel 1113 on opposite sides of the casing 1111 extending therebetween, so that fluid (such as air) can flow in the first channel 1113 . In this embodiment, the detection portion 1110 can be detachably disposed on the bottom side of the accommodating space 1200 in a rectangular shape as shown in FIG. 4 . The casing 1111 can also be a second embodiment as shown in FIG. 3 , that is, a slope is formed on the top side of the casing 1111, so that the detection object W can be placed on the plurality of probes along with the guiding surface. 1112 above for detection. Alternatively, the detection part 1110 is integrally formed with the main body part 1100 . In the above-mentioned various embodiments, the plurality of probes 1112 are disposed on the bottom side of the accommodating space 1200 to contact the bottom side of the detection object W for detection .

請回到圖1至圖3所示,該測試插座1000具有一上蓋1300,配置於本體部1100之頂側並與本體部1100可拆卸地連接。上蓋1300固持有一導熱部件1310,其配置為當上蓋1300覆蓋本體部1100時可接觸該檢測物W之頂側。在一實施方式中,該上蓋1300為獨立構件,可直接地加裝在該本體部1100上面,使該導熱部件1310直接接觸於該檢測物W之頂側以傳導該檢測物W於測試程序中的排熱。在另一實施方式中,該上蓋1300的一側端可利用一軸桿對應地耦接於該本體部1100的一側端,使該上蓋1300能以該軸桿為軸心與本體部1100可樞轉地連接,而相對於該本體部1100樞轉,使該導熱部件1310接觸於該檢測物W之頂側以傳導該檢測物W於測試程序中的排熱。該測試插座1000更配置有一頂部散熱鰭片組1500,其連接於該導熱部件1310之頂側,以接收該導熱部件1310的熱量進行散熱。該測試插座1000更配置有一底部散熱鰭片組1600,其連接於該載板3000之底部(背面),用以接收由該複數個探針1112的底端產生而累績於載板3000底部的排熱。該測試插座1000更具備有一固定手柄1700,其用於將該上蓋1300之導熱部件1310在接觸該檢測物W時,將上蓋1300能夠鎖固於該本體部1100上,以確保該檢測物W能夠完全接觸到該探針1112之底面,以及該導熱部件1310能夠完全貼合於該檢測物W之頂面。 Referring back to FIG. 1 to FIG. 3 , the test socket 1000 has an upper cover 1300 disposed on the top side of the main body 1100 and detachably connected to the main body 1100 . The upper cover 1300 holds a thermally conductive member 1310 configured to contact the top side of the detection object W when the upper cover 1300 covers the body portion 1100 . In one embodiment, the upper cover 1300 is an independent component, which can be directly installed on the body portion 1100, so that the thermally conductive member 1310 directly contacts the top side of the test object W to conduct the test object W during the test procedure. of heat removal. In another embodiment, one side end of the upper cover 1300 can be correspondingly coupled to one side end of the body portion 1100 by a shaft, so that the upper cover 1300 can pivot with the body portion 1100 around the shaft. It is rotatably connected and pivoted relative to the body portion 1100 so that the thermally conductive member 1310 contacts the top side of the test object W to conduct the heat dissipation of the test object W during the test procedure. The test socket 1000 is further configured with a top heat dissipation fin set 1500 connected to the top side of the thermally conductive member 1310 to receive the heat of the thermally conductive member 1310 for heat dissipation. The test socket 1000 is further configured with a bottom heat dissipation fin set 1600, which is connected to the bottom (back surface) of the carrier board 3000 for receiving the heat generated by the bottom ends of the plurality of probes 1112 and accumulated on the bottom of the carrier board 3000. heat rejection. The test socket 1000 is further provided with a fixed handle 1700, which is used to lock the upper cover 1300 on the main body 1100 when the heat conducting member 1310 of the upper cover 1300 contacts the detection object W, so as to ensure that the detection object W can be The bottom surface of the probe 1112 is completely contacted, and the thermally conductive member 1310 can be completely attached to the top surface of the detection object W.

請參閱圖1至圖3所示,為了使該檢測部1110之探針1112能夠進行排熱,本創作採用熱對流的方式進行該複數個探針1112的排熱,也就是在該測試插座1000之本體部1100的兩側以朝向內部配置一流體通道1130。該流體通道1130是以延伸通過該檢測部1110之該複數個探針1112的一部分的方式,與該測試插座1000之外部相通。以另一角度來說明,該流體通道1130的配置位置是相對於該複數個探針1112的一部份的位置所界定,從而以該複數個探針1112的一部份的位置朝向該本體部1100的外部開設通道以形成一流體通道1130。 Please refer to FIG. 1 to FIG. 3 , in order to enable the probes 1112 of the detection part 1110 to discharge heat, the present invention uses thermal convection to discharge heat from the plurality of probes 1112 , that is, in the test socket 1000 A fluid channel 1130 is disposed on both sides of the main body portion 1100 toward the inside. The fluid channel 1130 communicates with the outside of the test socket 1000 by extending through a portion of the plurality of probes 1112 of the detection portion 1110 . To illustrate from another angle, the disposition position of the fluid channel 1130 is defined relative to the position of a part of the plurality of probes 1112, so that the position of the part of the plurality of probes 1112 faces the body part The outside of 1100 is channeled to form a fluid channel 1130 .

具體而言,流體通道1130延伸於本體部1100的相對兩側之間且與本體部1100的容置空間1200連通。當檢測部1110容置於本體部1100的容置空間1200,檢測部1110的第一通道1113的兩端開口和本體部1100的流體通道1130的兩端開口相對應,使得檢測部1110的第一通道1113與本體部1100的流體通道1130相互連通。在可能的實施例中,檢測部1110的第一通道1113的兩端開口和本體部1100的流體通道1130的兩端開口可為不相對應的配置,但仍可維持兩者流體連通。 Specifically, the fluid channel 1130 extends between opposite sides of the body portion 1100 and communicates with the accommodating space 1200 of the body portion 1100 . When the detection part 1110 is accommodated in the accommodating space 1200 of the body part 1100 , the openings at both ends of the first channel 1113 of the detection part 1110 correspond to the openings at both ends of the fluid channel 1130 of the body part 1100 , so that the first The channel 1113 communicates with the fluid channel 1130 of the body part 1100 . In a possible embodiment, the openings at both ends of the first channel 1113 of the detection part 1110 and the openings at both ends of the fluid channel 1130 of the main body part 1100 may be in different configurations, but the fluid communication between the two can still be maintained.

請參考圖3所示,該檢測部1110之第一通道1113至該本體部1100的一側面之流體通道1130開口處定義為一第二通道1130A,相同地,該檢測部1110之第一通道1113至該本體部1100的另一相對側面之流體通道1130開口處定義為一第三通道1130B。第二通道1130A、第三通道1130B與第一通道1113在同一個平面上相通形成如板形狀的橫向通道。在其他實施例中,所述橫向通道可以是於該本體部1100之相鄰接的兩個側面之間延伸。或者,於該本體部1100的一側面與本體部1100的底面之間可延伸有與橫向通道連通的一縱向通道,使氣流有縱向流動的可能。據此可知,上述各種實施例為舉例說明流體通道1130的可能配置,但本創作不以此為限制。本創作較佳的實施方式為以如板形狀的橫向通道進行配置,從而配合後續說明的流體輸送部件1900設置在載板3000上,以達到整體排熱的配 置。除此之外,處於具有第一通道1113之檢測部1110的實施方式下,橫向通道是由第二通道1130A、第三通道1130B與第一通道1113所界定。 Please refer to FIG. 3 , the first channel 1113 of the detection part 1110 to the opening of the fluid channel 1130 on one side of the body part 1100 is defined as a second channel 1130A. Similarly, the first channel 1113 of the detection part 1110 is defined as a second channel 1130A. The opening of the fluid channel 1130 to the other opposite side of the body portion 1100 is defined as a third channel 1130B. The second channel 1130A, the third channel 1130B and the first channel 1113 communicate on the same plane to form a plate-shaped transverse channel. In other embodiments, the transverse channel may extend between two adjacent side surfaces of the body portion 1100 . Alternatively, between one side surface of the main body portion 1100 and the bottom surface of the main body portion 1100 , a longitudinal channel communicated with the transverse channel may extend, so that the airflow may flow longitudinally. From this, it can be seen that the above-mentioned various embodiments are examples of possible configurations of the fluid channel 1130 , but the present invention is not limited thereto. The preferred embodiment of the present invention is to configure a transverse channel in the shape of a plate, so as to cooperate with the fluid conveying component 1900 described later to be arranged on the carrier plate 3000 to achieve the overall heat dissipation distribution. set. In addition, in the embodiment of the detection part 1110 having the first channel 1113 , the lateral channel is defined by the second channel 1130A, the third channel 1130B and the first channel 1113 .

另外,當使用者沿著該流體通道1130的兩開口之間延伸方向觀看時,該複數個探針1112的一部分是位於且暴露於該流體通道1130內。具體來說,所述的複數個探針1112的一部分為非用以接觸檢測物W之探針1112的部位,例如每個探針1112之中段。在其他實施例中,所述的複數個探針1112的一部分也可為全部複數個探針1112中的一部份探針,也就是除了位於該流體通道1130中的複數個探針1112外,其餘的複數個探針1112仍為埋沒於前述檢測部1110中,從而將本創作之特徵適實現於各種可拆卸的檢測部1110的實施方式中。 In addition, when the user looks along the extending direction between the two openings of the fluid channel 1130 , a part of the plurality of probes 1112 is located and exposed in the fluid channel 1130 . Specifically, a part of the plurality of probes 1112 is a portion of the probes 1112 that is not used to contact the detection object W, such as the middle of each probe 1112 . In other embodiments, a part of the plurality of probes 1112 may also be a part of the plurality of probes 1112, that is, in addition to the plurality of probes 1112 located in the fluid channel 1130, The remaining plurality of probes 1112 are still buried in the aforementioned detection part 1110 , so that the features of the present invention are suitable for implementing various detachable detection part 1110 implementations.

為了加強熱對流進行該複數個探針1112的排熱,請參閱圖5之流體輸送部件1900的立體圖。本創作更配置有流體輸送部件1900,其基本上是由一頂側、一底側及四個側面所定義而成,該流體輸送部件1900具有位於其中一側面的一開口1910,該開口1910的大小以及形狀是對應前述之流體通道1130的兩端開口所設計;該流體輸送部件1900位於頂側具有一扇葉1920,可根據該流體輸送部件1900的運作條件,將流體自頂側導入或導出,以及複數個固接孔1930,用以將流體輸送部件1900固接於該載板3000上。 In order to enhance heat convection for heat removal from the plurality of probes 1112, please refer to the perspective view of the fluid delivery member 1900 in FIG. 5 . The present invention is further configured with a fluid delivery member 1900, which is basically defined by a top side, a bottom side and four sides. The fluid delivery member 1900 has an opening 1910 on one of the side surfaces. The opening 1910 has an opening 1910. The size and shape are designed to correspond to the openings at both ends of the aforementioned fluid channel 1130; the fluid conveying member 1900 has a fan blade 1920 on the top side, which can introduce or export the fluid from the top side according to the operating conditions of the fluid conveying member 1900 , and a plurality of fixing holes 1930 for fixing the fluid delivery component 1900 on the carrier board 3000 .

請參閱圖6之提供有一對流體輸送部件1900的測試插座的立體圖。圖7之具有流體輸送部件的測試插座的另一立體圖。如圖6至7所示,該測試插座1000的兩側設置,也是流體通道1130的兩側,提供有相同於前述圖5之該對流體輸送部件1900。該對流體輸送部件1900具有一流體導入部件1900A用於導入流體,以及一流體導出部件1900B用於導出流體。該流體導入部件1900A平行地且對應於該流體通道1130的位置設置於該測試插座1000的一側面,使流體導入部件1900A的開口對應第二通道1130A。同樣地,該流體導出部件1900B平行地且對應 於該流體通道1130的位置設置於該測試插座1000的另一相對側面,使流體導出部件1900B的開口對應第三通道1130B。 Please refer to FIG. 6 for a perspective view of a test socket provided with a pair of fluid delivery components 1900 . Another perspective view of the test socket with fluid delivery components of FIG. 7 . As shown in FIGS. 6 to 7 , the two sides of the test socket 1000 are also provided on both sides of the fluid channel 1130 , and are provided with the same pair of fluid delivery components 1900 as the aforementioned FIG. 5 . The pair of fluid delivery parts 1900 has a fluid introduction part 1900A for introducing the fluid, and a fluid outflow part 1900B for discharging the fluid. The fluid introduction part 1900A is disposed on one side of the test socket 1000 in parallel and at a position corresponding to the fluid channel 1130 , so that the opening of the fluid introduction part 1900A corresponds to the second channel 1130A. Likewise, the fluid lead-out member 1900B is parallel and corresponding to The position of the fluid channel 1130 is disposed on the other opposite side of the test socket 1000, so that the opening of the fluid lead-out member 1900B corresponds to the third channel 1130B.

接上述,請回到圖3所示,該流體導入部件1900A之第一開口1910A是以對應第二通道1130A且緊貼著該本體部1100的一側面的方式設置在載板3000上,而該流體導出部件1900B之第二開口1910B是以對應第三通道1130B,但隔有一間隙G的距離至該本體部1100的另一相對側面的方式設置在載板3000上。如此設置間隙G可以預防高溫流體經過該流體導出部件1900B之第二開口1910B或第三通道1130B時,會因第二開口1910B與第三通道1130B之連接處的體積膨脹進而導致結構上的破損,也可使一部份高溫流體從該間隙G排出以減少高溫流體在該流體導出部件1900B所產生的積熱。同樣的原理,該流體導入部件1900A之第一開口1910A緊貼著第二通道1130A設置是可以防止低溫流體洩漏,使低溫流體能夠完全的進入橫向通道(即第一通道1113、第二通道1130A、第三通道1130B及)內將探針1112的積熱排出。 3, the first opening 1910A of the fluid introduction member 1900A is disposed on the carrier plate 3000 in a manner corresponding to the second channel 1130A and close to a side surface of the main body 1100, and the The second opening 1910B of the fluid leading member 1900B is disposed on the carrier plate 3000 in a manner corresponding to the third channel 1130B, but separated by a gap G to the other opposite side of the body portion 1100 . Setting the gap G in this way can prevent the high temperature fluid from passing through the second opening 1910B or the third channel 1130B of the fluid outlet member 1900B, which will cause structural damage due to the volume expansion of the connection between the second opening 1910B and the third channel 1130B. A part of the high-temperature fluid can also be discharged from the gap G to reduce the accumulated heat generated by the high-temperature fluid in the fluid outlet part 1900B. In the same principle, the first opening 1910A of the fluid introduction member 1900A is disposed close to the second channel 1130A to prevent leakage of the cryogenic fluid, so that the cryogenic fluid can completely enter the lateral channels (ie the first channel 1113, the second channel 1130A, the The heat accumulated in the probe 1112 is discharged in the third channel 1130B and 1130B.

請參考圖8之顯示具有流體輸送部件的測試插座的剖視圖,其中箭頭標示為流體流動的方向,當測試插座1000開始針對複數個探針1112進行排熱時,首先,低溫流體會藉由流體導入部件1900A導入,該低溫流體經由流體導入部件1900A之第一開口1910A進入本體部1100的第二通道1130A,再由第二通道1130A通向第一通道1113,並在複數個探針1112區域吸收熱量而形成高溫流體,該高溫流體經由第一通道1113流向第三通道1130B,高溫流體之一小部分會在第三通道1130B與第二開口1910B之間的間隙G溢出,而高溫流體之主要部分會進入流體導出部件1900B之第二開口1910B,最終由流體導出部件1900B導出。 Please refer to FIG. 8 showing a cross-sectional view of a test socket with fluid delivery components, wherein the arrows indicate the direction of fluid flow. When the test socket 1000 starts to discharge heat for the plurality of probes 1112, first, the cryogenic fluid is introduced through the fluid. The component 1900A is introduced, the cryogenic fluid enters the second channel 1130A of the main body 1100 through the first opening 1910A of the fluid introduction component 1900A, and then leads to the first channel 1113 from the second channel 1130A, and absorbs heat in the areas of the plurality of probes 1112 A high-temperature fluid is formed, and the high-temperature fluid flows to the third channel 1130B through the first channel 1113, a small part of the high-temperature fluid will overflow in the gap G between the third channel 1130B and the second opening 1910B, and the main part of the high-temperature fluid will The fluid entering the second opening 1910B of the fluid leading member 1900B is finally led out by the fluid leading member 1900B.

以下說明本創作測試插座1000之第二實施例,圖9係顯示測試插座中檢測部之第二實施例的立體圖;圖10係顯示測試插座中檢測部之第二實施例的側視圖。應了解,第二實施例之檢測部可以類似的手段容置在前述本體部中 1100。如圖所示,該檢測部1110配置有複數個探針1112。其中探針1112的頂端用於電性接觸連接檢測物W的一底端,探針1112的底端用於電性連接至前述載板3000的電路。該檢測部1110配置有一殼體1111,該殼體1111基本上由一用於放置檢測物W的一下半部,以及由該下半部向上凸起所形成定位該檢測物W的一上半部所定義,且該殼體1111的上半部以及下半部以一體成型的方式所配置。其中該殼體1111的一對側邊具有對應彼此位置的一對凹口1114,該對凹口1114之間形成如前述第一實施例功能相同的一第一通道1113(燒機測試時,由於檢測物W設置於該殼體1111中,使相對於殼體1111的頂側形成封閉狀態),讓空氣可以流動於該第一通道1113之中。在此實施方式中,該檢測部1110更配置有一用於輔助定位該檢測物W的浮動板(floating plate)1115以可動的方式收容於該殼體1111的上半部之中,使浮動板1115可相對於殼體1111微幅擺動,以緩衝檢測物W的一下壓力。所述第一通道1113界定於浮動板1115的下表面和殼體1111的下半部的上表面之間。具體而言,浮動板1115與殼體1111之間可提供有支撐和間隔元件,使浮動板1115下表面不與殼體1111貼合。如請參考圖10,該浮動板1115之底部配置有彈性部1116,使該浮動板1115能以一間隔而彈性接觸該殼體1111上,如此配置該浮動板1115於該殼體1111時,該第一通道1113是由該浮動板1115的底部與該對凹口1114的底部所定義。此不同於前述圖4第一實施例的一體成形檢測部。在第二實施例中,以側面方向觀看時,該探針1112之頂部部分係暴露於該第一通道1113內。 The second embodiment of the inventive test socket 1000 will be described below. FIG. 9 is a perspective view showing the second embodiment of the detection part in the test socket; FIG. 10 is a side view showing the second embodiment of the detection part in the test socket. It should be understood that the detection portion of the second embodiment can be accommodated in the aforementioned body portion by a similar means 1100. As shown in the figure, the detection unit 1110 is provided with a plurality of probes 1112 . The top end of the probe 1112 is used for electrically contacting and connecting to a bottom end of the detection object W, and the bottom end of the probe 1112 is used for electrically connecting to the circuit of the carrier board 3000 . The detection part 1110 is configured with a casing 1111 , the casing 1111 basically consists of a lower half for placing the detection object W, and an upper half for positioning the detection object W formed by the upward protrusion of the lower half defined, and the upper half and the lower half of the casing 1111 are configured in an integral molding manner. A pair of side edges of the casing 1111 has a pair of notches 1114 corresponding to each other, and a first channel 1113 having the same function as the first embodiment is formed between the pair of notches 1114 (during the burn-in test, due to the The detection object W is arranged in the casing 1111 to form a closed state relative to the top side of the casing 1111 ), so that the air can flow in the first channel 1113 . In this embodiment, the detection part 1110 is further configured with a floating plate 1115 for assisting the positioning of the detection object W and is movably accommodated in the upper half of the housing 1111, so that the floating plate 1115 It can swing slightly relative to the housing 1111 to buffer the pressure of the detection object W. The first channel 1113 is defined between the lower surface of the floating plate 1115 and the upper surface of the lower half of the housing 1111 . Specifically, support and spacer elements may be provided between the floating plate 1115 and the casing 1111 , so that the lower surface of the floating plate 1115 does not fit with the casing 1111 . Referring to FIG. 10 , the bottom of the floating plate 1115 is provided with an elastic portion 1116 , so that the floating plate 1115 can elastically contact the casing 1111 at an interval. The first channel 1113 is defined by the bottom of the floating plate 1115 and the bottom of the pair of notches 1114 . This is different from the integrally formed detection portion of the first embodiment of FIG. 4 . In the second embodiment, the top portion of the probe 1112 is exposed in the first channel 1113 when viewed from the side.

圖11係顯示提供有流體輸送部件的測試插座之第二實施例的立體圖、圖12係顯示具有對流的測試插座之第二實施例的剖視圖。如圖所示,該測試插座1000的兩側設置,也是流體通道1130的兩側,提供有相同於前述圖5之該對流體輸送部件1900。該對流體輸送部件1900具有一流體導入部件1900A用於導入流體,以及一流體導出部件1900B用於導出流體。該流體導入部件1900A平行地且對應於該流體通道1130的位置設置於該測試插座1000的一側面,使流體導入部 件1900A的開口對應第二通道1130A。與第一實施例不同的差異在於,第二實施例的該流體導出部件1900B是對應於該測試插座1000的另一相對側面垂直設置於載板3000上,如此設置方式,可以更方便的安裝於載板3000上,且不用刻意地將第一實施例的該流體導出部件1900B之第二開口1910B對應第三通道1130B來進行設置。 11 is a perspective view showing a second embodiment of a test socket provided with fluid delivery components, and FIG. 12 is a cross-sectional view showing a second embodiment of a test socket with convection. As shown, the two sides of the test socket 1000, which are also the two sides of the fluid channel 1130, are provided with the same pair of fluid delivery components 1900 in FIG. 5 described above. The pair of fluid delivery parts 1900 has a fluid introduction part 1900A for introducing the fluid, and a fluid outflow part 1900B for discharging the fluid. The fluid introduction part 1900A is disposed on one side of the test socket 1000 in parallel with the position corresponding to the fluid channel 1130, so that the fluid introduction part The opening of the piece 1900A corresponds to the second channel 1130A. The difference from the first embodiment is that the fluid lead-out member 1900B of the second embodiment is vertically disposed on the carrier board 3000 corresponding to the other opposite side of the test socket 1000 , and in this way, it can be more conveniently installed on the carrier board 3000 . On the carrier plate 3000, the second opening 1910B of the fluid leading member 1900B of the first embodiment is not intentionally arranged to correspond to the third channel 1130B.

圖13係顯示提供有流體輸送部件的測試插座之第二實施例的剖視圖,其中標示有流體流動的方向。如圖所示,流體導入部件1900A為了將低溫流體能完全導入該測試插座1000內部,較佳的配置方式為相同於第一實施例,使流體導入部件1900A的第一開口1910A緊貼於該測試插座1000的第二通道1130A,該低溫流體經由第二通道1130A導入該第一通道1113,並在暴露於通道1113中的複數個探針1112的頂部區域吸收熱量而形成高溫流體。該高溫流體經由第一通道1113流向第三通道1130B,並由第三通道1130B離開該測試插座1000。在該流體導出部件1900B垂直設置於載板3000的配置下,該流體導出部件1900B除了可以將該高溫流體導出進行散熱,更可以同時將頂部散熱鰭片組1500的積熱進行散熱。最終如圖所示,該流體導出部件1900B將頂部散熱鰭片組1500的積熱及由第三通道1130B離開的高溫流體向上排出。除此之外,由於該流體導出部件1900B與該測試插座1000之間可具有適當間隙G,該流體導出部件1900B可以改變設置的方向,進而調整高溫流體的導出方向,以方便在如圖14上的燒機測試板中調整各測試插座之間的對流,以致使燒機測試下的散熱效率最佳化。請參閱圖14之裝設有複數個測試插座之燒機測試板的示意圖,如圖所示,該複數個測試插座1000(連同流體輸送部件1900)以陣列方式並排設置於該燒機測試板2000(母板)上,其中於載板3000(子板)上配置測試插座1000為一種實施方式,但也可以省略載板3000,直接地將測試插座1000連同流體輸送部件1900安裝該燒機測試板2000。在前述測試插座1000的流體輸送部件1900可以根據設計需求而以其他不同的形式安裝在 測試插座1000的側邊,從而使燒機測試板中各測試插座之間的對流最佳化。同樣地,如圖13以上述第二實施例之複數個具有流體輸送部件的測試插座設置在該燒機測試板上,該測試插座在之流體導出部件1900B將高溫流體向上排出的方式,較不會影響其所緊鄰的測試插座的流體導入部件1900A所導入的低溫流體,從而使燒機測試板中各測試插座之間的對流較佳化。 13 is a cross-sectional view showing a second embodiment of a test socket provided with fluid delivery components, with the direction of fluid flow indicated. As shown in the figure, in order to completely guide the low-temperature fluid into the test socket 1000, the fluid introduction part 1900A is preferably configured in the same manner as in the first embodiment, so that the first opening 1910A of the fluid introduction part 1900A is close to the test socket 1000. In the second channel 1130A of the socket 1000, the low temperature fluid is introduced into the first channel 1113 through the second channel 1130A, and absorbs heat in the top regions of the plurality of probes 1112 exposed in the channel 1113 to form a high temperature fluid. The high temperature fluid flows through the first channel 1113 to the third channel 1130B, and leaves the test socket 1000 through the third channel 1130B. In the configuration in which the fluid guiding member 1900B is vertically disposed on the carrier plate 3000 , the fluid guiding member 1900B can not only discharge the high-temperature fluid for heat dissipation, but also dissipate the accumulated heat of the top heat dissipation fin group 1500 at the same time. Finally, as shown in the figure, the fluid outlet part 1900B discharges the heat accumulated in the top heat dissipation fin group 1500 and the high-temperature fluid exiting from the third channel 1130B upwards. In addition, since there may be an appropriate gap G between the fluid lead-out component 1900B and the test socket 1000, the fluid lead-out component 1900B can change the direction of setting, and then adjust the lead-out direction of the high-temperature fluid, so as to facilitate the operation as shown in FIG. 14 . Adjust the convection between the test sockets in the burn-in test board, so as to optimize the heat dissipation efficiency under the burn-in test. Please refer to the schematic diagram of the burn-in test board equipped with a plurality of test sockets in FIG. 14. As shown in the figure, the plurality of test sockets 1000 (together with the fluid conveying components 1900) are arranged side by side on the burn-in test board 2000 in an array manner. (mother board), in which the test socket 1000 is configured on the carrier board 3000 (daughter board) is an embodiment, but the carrier board 3000 can also be omitted, and the test socket 1000 together with the fluid delivery component 1900 can be directly installed on the burn-in test board 2000. The fluid delivery component 1900 in the aforementioned test socket 1000 can be installed in other different forms according to design requirements. Test the sides of socket 1000 to optimize convection between the test sockets in the burn-in test board. Similarly, as shown in FIG. 13 , a plurality of test sockets with fluid delivery components of the above-mentioned second embodiment are arranged on the burn-in test board, and the way in which the fluid outlet components 1900B of the test sockets discharge the high-temperature fluid upwards is less obvious. The low temperature fluid introduced by the fluid introduction part 1900A of the adjacent test socket will affect the convection between the test sockets in the burn-in test board.

以上本創作實施例之流體是以對流的方式來排熱進行說明,但熟知此技術領域的人也可以利用液體冷卻來替代氣體冷卻,例如本創作之流體輸送部件1900可以是風扇,也可以是液冷散熱器,藉由輸入及輸出冷卻液至測試插座1000之流體通道1130進行排熱,更可以以浸沒式冷卻的方式,將具有流體通道1130之測試插座1000浸沒於冷卻液中進行排熱。 The fluid in the embodiment of the present invention is described by using convection to remove heat, but those skilled in the art can also use liquid cooling instead of gas cooling. For example, the fluid conveying component 1900 of the present invention can be a fan or The liquid cooling radiator can dissipate heat by inputting and outputting coolant to the fluid channel 1130 of the test socket 1000, and can also use the immersion cooling method to immerse the test socket 1000 with the fluid channel 1130 in the coolant to dissipate heat. .

需注意的是,本創作所提之前述實施例係僅用於例示說明本創作,而非用於限制本創作之範圍。熟習本創作所屬技術領域中具通常技藝之人對於本創作所進行之諸般修飾和變化皆不脫離本創作之精神與範疇。不同實施例中相同或相似的構件、或不同實施例中以相同元件符號表示的構件係具有相同的物理或化學特性。此外,在適當的情況下,本創作之上述實施例係可互相組合或替換,而非僅限於上文所描述的特定實施例。在一實施例中所描述的特定構件與其他構件的連接關係亦可應用於其他實施例中,其皆落於本創作如附申請專利範圍之範疇。 It should be noted that the foregoing embodiments mentioned in the present creation are only used to illustrate the present creation, rather than to limit the scope of the present creation. All modifications and changes made to this creation by persons with ordinary skills in the technical field to which this creation belongs will not depart from the spirit and scope of this creation. The same or similar components in different embodiments, or components denoted by the same reference numerals in different embodiments, have the same physical or chemical properties. In addition, the above-described embodiments of the present invention may be combined or replaced with each other under appropriate circumstances, and are not limited to the specific embodiments described above. The connection relationship between a specific component and other components described in one embodiment can also be applied to other embodiments, which all fall within the scope of the present invention and the scope of the appended claims.

1000:測試插座 1000: Test socket

1100:本體部 1100: body part

1111:殼體 1111: Shell

1112:探針 1112: Probe

1113:第一通道 1113: first channel

1130A:第二通道 1130A: Second channel

1130B:第三通道 1130B: Third channel

1200:容置部 1200: accommodating part

1300:上蓋 1300: upper cover

1310:導熱部件 1310: Thermally conductive parts

1500:頂部散熱鰭片組 1500: Top cooling fin set

1600:底部散熱鰭片組 1600: Bottom cooling fin group

1700:固定手柄 1700: Fixed handle

1900A:流體導入部件 1900A: Fluid Induction Components

1900B:流體導出部件 1900B: Fluid Outlet Parts

1910A:第一開口 1910A: First Opening

1910B:第二開口 1910B: Second Opening

1920A:流體導入部件的扇葉 1920A: Fan blades for fluid introduction components

1920B:流體導出部件的扇葉 1920B: Fan blades for fluid outlet parts

3000:載板 3000: carrier board

G:間隙 G: Gap

W:檢測物 W: detected object

Claims (11)

一種提供有對流的測試插座,包括:一本體部,具有:一容置空間,配置為收容一檢測物;一檢測部,配置於該容置空間,該檢測部配置有複數個探針以接觸該檢測物之底側進行檢測;一上蓋,配置於本體部之頂側,該上蓋具有:一導熱部件,配置為可接觸該檢測物之頂側;其中,該本體部的一側面和該側面的另一相對側面之間穿設有一流體通道,且該流體通道通過該檢測部及複數個探針之一部分。 A test socket provided with convection, comprising: a main body part, having: an accommodating space configured to accommodate a detection object; a detection part, arranged in the accommodating space, the detection part is configured with a plurality of probes to contact The detection is performed on the bottom side of the detection object; an upper cover is arranged on the top side of the main body, and the upper cover has: a heat-conducting component configured to contact the top side of the detection object; wherein, a side surface of the main body part and the side surface A fluid channel is pierced between the other opposite side surfaces, and the fluid channel passes through the detection part and a part of a plurality of probes. 如請求項1所述的測試插座,其中該測試插座配置於一載板上,該流體通道貫穿該測試插座,使該複數個探針的該部份暴露於該流體通道,藉此使該複數個探針於一測試程序中產生的熱得以經由該流體通道之對流而自該測試插座排除。 The test socket of claim 1, wherein the test socket is disposed on a carrier board, the fluid channel penetrates the test socket, and the portion of the plurality of probes is exposed to the fluid channel, thereby enabling the plurality of probes Heat generated by a probe during a test procedure is removed from the test socket via convection in the fluid channel. 如請求項2之測試插座,更提供有一或多個流體輸送部件,該一或多個流體輸送部件配置於該測試插座的周圍用於促進該流體通道之對流。 The test socket of claim 2, further providing one or more fluid delivery components disposed around the test socket for promoting convection in the fluid channel. 如請求項3之測試插座,其中該一或多個流體輸送部件包含一流體導入部件及一流體導出部件,分別配置於該流體通道的兩端以建立一單向對流。 The test socket of claim 3, wherein the one or more fluid delivery components include a fluid inlet component and a fluid outlet component, which are respectively disposed at both ends of the fluid channel to establish a unidirectional convection. 一種提供有對流的測試插座,包括:一本體部,具有:一容置空間,配置為收容一檢測物;一檢測部,配置於該容置空間,該檢測部具有: 一殼體,配置有貫穿該殼體的一第一通道;複數個探針,穿設於該殼體,以接觸該檢測物之底側進行檢測,以及該探針之一部分係暴露於該第一通道內;一上蓋,配置於本體部之頂側,該上蓋具有:一導熱部件,配置為可接觸該檢測物之頂側;其中,該本體部的一側面穿設有一第二通道,且該側面的另一相對側面穿設有一第三通道,該第一通道、該第二通道與該第三通道相連形成一流體通道。 A test socket provided with convection, comprising: a main body part, having: an accommodating space configured to accommodate a detection object; a detection part, disposed in the accommodating space, the detection part having: A casing is configured with a first channel passing through the casing; a plurality of probes are penetrated through the casing to contact the bottom side of the test object for detection, and a part of the probes is exposed to the first In a channel; an upper cover, disposed on the top side of the main body, the upper cover has: a heat-conducting component configured to contact the top side of the detection object; wherein, a side surface of the main body is provided with a second channel, and The other opposite side of the side is provided with a third channel, and the first channel, the second channel and the third channel are connected to form a fluid channel. 如請求項5之測試插座,其中暴露於該第一通道的該複數個探針的一部分位於該流體通道的兩端開口之間。 The test socket of claim 5, wherein a portion of the plurality of probes exposed to the first channel is located between the openings at both ends of the fluid channel. 如請求項5之測試插座,其中該本體部的周圍提供有一流體導入部件以及一流體導出部件,其中該流體導入部件流體連通該第二通道,該流體導出部件流體連通該第三通道。 The test socket of claim 5, wherein a fluid introduction member and a fluid discharge member are provided around the body portion, wherein the fluid introduction member is in fluid communication with the second channel, and the fluid outlet member is in fluid communication with the third channel. 如請求項7之測試插座,其中:該流體導入部件更具備一第一開口,流體連通該第二通道;該流體導出部件更具備一第二開口,流體連通該第三通道。 The test socket of claim 7, wherein: the fluid introduction member further has a first opening for fluid communication with the second channel; the fluid outlet member further has a second opening for fluid communication with the third channel. 如請求項7之測試插座,其中該流體導入部件、該流體導出部件、該第二通道與該第三通道都位在一載板的頂側。 The test socket of claim 7, wherein the fluid inlet part, the fluid outlet part, the second channel and the third channel are all located on the top side of a carrier board. 如請求項7之測試插座,其中該流體導出部件與相對於該本體部之具有該第三通道的側面之間具有一間隙。 The test socket of claim 7, wherein there is a gap between the fluid lead-out member and the side with the third channel relative to the body portion. 一種燒機測試板,包括:複數個測試插座,每一個測試插座包括:一本體部,具有:一容置部,配置為收容一檢測物;一檢測部,配置有複數個探針以接觸該檢測物之底側進行檢測; 一上蓋,具有:一導熱部件,配置為接觸該檢測物之頂側;其中,該本體部的一側面開設有一第一通道,且對應該側面的另一側面開設有對應該第一通道的一第二通道,該第一通道與第二通道相通形成一流體通道,該流體通道延伸通過該檢測部的一部分;一流體導入部件,流體連通該第一通道;以及一流體導出部件,流體連通該第二通道。 A burn-in test board includes: a plurality of test sockets, and each test socket includes: a main body part, which has: a accommodating part configured to accommodate a detection object; a detection part equipped with a plurality of probes to contact the The bottom side of the test object is tested; an upper cover, comprising: a heat-conducting component configured to contact the top side of the detection object; wherein a first channel is opened on one side of the main body, and a side corresponding to the first channel is opened on the other side of the side a second channel, the first channel communicates with the second channel to form a fluid channel, the fluid channel extends through a part of the detection part; a fluid introduction part is in fluid communication with the first channel; and a fluid outlet part is in fluid communication with the first channel second channel.
TW110211289U 2021-09-24 2021-09-24 Test socket providing convective flow and burn-in test board including the test socket TWM626707U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI808790B (en) * 2022-06-15 2023-07-11 伊士博國際商業股份有限公司 Burn-in socket with built-in buffering mechanism

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI808790B (en) * 2022-06-15 2023-07-11 伊士博國際商業股份有限公司 Burn-in socket with built-in buffering mechanism

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