TWM623361U - packaging mold - Google Patents

Abstract

An encapsulation mold includes a first mold closing and a second mold closing that is covered with each other; the first mold closing includes a first mold base, and a first module combined with the first mold base, and the first mold base The mold base is provided with a first mold core, and the first mold core is inserted into it through the first module; the second clamping mold comprises a second mold base, and a second module combined with the second mold base, and The second mold base is provided with a second mold core, and the second mold core is inserted into it through the second module; wherein, the first clamping mold and the second clamping mold are made of thermally conductive materials, and the first clamping mold is on the It is provided with at least a first heater and a first temperature sensor, and the second clamping mold is also provided with at least a second heater and a second temperature sensor for heating and heating a package. pressure.

Description

packaging mold

This creation is related to a mold for packaging, especially a packaging mold that can provide procedures such as increasing its colloidal properties for a preliminarily formed package.

According to the conventional packaging molds, the required colloid is mainly formed on the metal parts by means of gluing, etc., to complete the packaging product. Depending on the actual needs of the packaged products or the standards to be met, etc., there are also cases where colloids are initially formed on the metal parts of the packaged products, and then go through one or more processing processes to meet the above requirements; for example, the metal parts still need to be The colloid is subjected to multi-stage processes such as heating and pressure to improve its material properties and so on.

However, in order to meet the above-mentioned requirements, the existing method has not been able to carry out a consistent processing process through the packaging mold, so that it is relatively cumbersome and inconvenient.

In view of this, in order to improve and solve the above-mentioned deficiencies, the author of this book has devoted himself to research and the application of academic principles, and finally proposed a book with a reasonable design and effective improvement of the above deficiencies.

The main purpose of this creation is to provide a packaging mold, which is used to provide a package with colloid through the mold to provide a controllable heating temperature, pressure channel, and time required for maintaining the above parameters. Encapsulation mold.

In order to achieve the above-mentioned purpose, the present invention provides a packaging mold, which includes a first clamping mold and a second clamping mold that is covered with each other; the first clamping mold includes a first mold base, and a combination of the first mold The first module on the seat, and the first mold seat is provided with a first mold core, and the first mold core is inserted into it through the first module; The second module on the second mold base, and the second mold base is provided with a second mold core, and the second mold core is inserted into it through the second module; wherein, the first clamping mold and the second clamping mold are connected by heat conduction material, and at least a first heater and a first temperature sensor are arranged on the first clamping mold, and at least a second heater and a second temperature sensor are also arranged on the second clamping mold , between the first mold core and the second mold core for a package to set and apply pressure, and to be heated by the first heater and the second heater, and controlled by the first temperature sensor and the second temperature sensor heating temperature.

In order to enable your reviewers to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation, however, the attached drawings are only for reference and illustration, and are not intended to limit this creation. .

Please refer to FIG. 1 and FIG. 2 , which are a flow chart of the steps of the present creation and the implementation of the processing method, and a schematic diagram of the assembly between the packaging mold and the package, respectively. The present creation system provides a packaging mold, which includes a first clamping mold 1 and a second clamping mold 2, and the first clamping mold 1 and the second clamping mold 2 are upper and lower mold clamping so that a package 3 can be placed in each other in order to facilitate the desired processing; wherein:

The first clamping mold 1 can be a lower mold, and includes a first mold base 10 and a first module 11 coupled to the first mold base 10 , and the first mold base 10 is provided with a first mold The core 100, the first mold core 100 is inserted into it through the first module 11, and an elastic element can be arranged between the first mold base 10 and the first module 11, so that the first module 11 is subjected to the above-mentioned second engagement. When the die 2 is pressed together, it provides a buffering effect on a certain stroke.

The second clamping mold 2 can be an upper mold, and includes a second mold base 20 and a second module 21 coupled to the second mold base 20 , and the second mold base 20 is provided with a second mold base 20 . The mold core 200, the second mold core 200 is inserted into it through the second module 21, and an elastic element can also be arranged between the second mold base 20 and the second module 21 for the second module 21 and the above-mentioned first module 21. When the mold 1 is pressed together, the aforementioned buffering effect can also be produced.

As mentioned above, after the first clamping 1 and the second clamping 2 are combined up and down, the package 3 can be placed between the first mold core 100 and the second mold core 200. Generally speaking, the surfaces of the first mold core 100 and the second mold core 200 are provided with grooves and other structures as the required space for the package 3 to be placed, and in order to enable the mold to be applicable to more packages of different specifications or sizes Parts 3, can be matched to different specifications or sizes of packaging parts 3 through different fittings (not shown in the figure), so that the same set of molds can be applied. For example, the fittings have the same external dimensions and can be applied to the same set of molds, but each fitting has different groove sizes to correspond to packages 3 of different specifications or sizes, which can improve the applicability of the molds to the packages 3 There is no need to repeatedly develop multiple sets of molds for production.

In the embodiment of the present invention, the package 3 includes a metal part 30, a first colloid 31 encapsulated on one surface of the metal part 30 and a second colloid 32 encapsulated on the other surface. 30 can be a lead frame on which the first colloid 31 and the second colloid 32 are preliminarily formed, and then meet the actual product requirements or standards through the processing method described in this case, such as improving the properties of the colloid material.

Please also refer to FIG. 1 , the processing method implemented in conjunction with the present creation. Step S1 is to first prepare the above-mentioned packaging mold and the packaging component 3 used in the processing procedure of the present creation. The packaging mold includes a lower mold. and an upper mold, the lower mold is the first clamping mold 1, the upper mold is the second clamping mold 2, and the package 3 is used to be placed between the lower mold and the upper mold for the aforementioned processing. program. In step S2 again, the processing program is executed, and the processing program at least includes the following steps:

1) Pressing the package 3 through the lower mold and the upper mold;

2) maintaining the pressure exerted by the above step 1) on the package 3 according to a first set time;

3) heating the package 3 and reaching a temperature value according to a second set time;

4) Maintain the above-mentioned temperature value for the package 3 in step 3) for a third set time.

For example, as shown in FIG. 3, the first clamping mold 1 and the second clamping mold 2 can be pressed together through a machine such as a compression molding machine (not shown in the figure), so that the first mold core 100 and the second clamping mold 2 can pass through the first mold core 100. The second mold core 2 exerts pressure on the package 3 , thereby providing the effect of compressing the first colloid 31 and the second colloid 32 , so as to perform the above step 1). Further, in conjunction with the pressure exerted by the computer numerical control system (not shown in the figure) on the pressing machine and other equipment, and adding the first set time as the parameter value of the length of time for maintaining the pressure, the above step 2) can be executed. .

Furthermore, as shown in FIG. 4 , at least one first heater 110 and a first temperature sensor 111 are provided on the first clamping mold 1 , and at least one second heating element 111 is also provided on the second clamping mold 2 . The heater 210 and a second temperature sensor 211, and the first clamping mold 1 and the second clamping mold 2 are made of thermally conductive material. Specifically, in the preferred embodiment, the first heater 110 is arranged on the first module 11, the second heater 210 is arranged on the second module 21, and the first temperature sensor 111 is arranged on the first mold core On the top 100 , the second temperature sensor 211 is arranged on the second mold core 200 . In conjunction with step S3 in FIG. 1 , the first heater 110 and the second heater 210 are used to provide heating in step 3) and maintain the temperature value in step 4). That is, in conjunction with the aforementioned computer numerical control system, the second set time is added as a parameter value for heating to the desired temperature, for example, it must be heated to 300 degrees (ie the temperature value) within 180 seconds (ie the second set time), To perform the above step 3); Similarly, with the computer numerical control system, add the third set time as the parameter value of the required time to maintain the temperature, such as maintaining at 300 degrees (ie the temperature value) under the state After 60 seconds (ie the third set time), perform the above step 4). Further, the first colloid 31 and the second colloid 32 of the package 3 can be provided in the mold with controllable heating temperature, pressure channel, and time required to maintain the above parameters.

Therefore, the packaging mold of the present creation can be obtained by the above-mentioned structure.

In addition, as shown in FIG. 2 , a pair of first handles 12 can be added to the first module 11 and a pair of second handles 22 can be added to the second module 21 in the inventive packaging mold. The first handle 12 and the second handle 22 can be made of insulating material, so as to facilitate manual access.

To sum up, this creation can indeed achieve the intended purpose of use, and solve the lack of conventional knowledge, and because it is very novel and progressive, it fully meets the requirements for a new type of patent application, and the application is filed in accordance with the Patent Law. The patent in this case is granted to protect the rights of the creator.

However, the above descriptions are only the preferred feasible embodiments of this creation, and therefore the patent scope of this creation is limited. Therefore, any changes in equivalent technologies and means made by using the description and drawings of this creation shall be treated in the same way. Included in the scope of this creation, it is hereby stated.

＜This creation＞ 1: The first clamping 10: The first mold base 100: The first mold 11: The first module 110: First heater 111: The first temperature sensor 12: The first handle 2: The second clamping 20: The second die base 200: The second mold 21: Second module 210: Second heater 211: Second temperature sensor 22: Second handle 3: Package 30: Metal parts 31: First colloid 32: Second colloid

Figure 1 is a flow chart of the steps of the processing method implemented in conjunction with the creation.

FIG. 2 is a schematic diagram of the assembly between the packaging mold and the packaging component of the present invention.

FIG. 3 is a schematic diagram of the state of pressurization of the packaging mold of the present invention.

FIG. 4 is a schematic diagram of the state of maintaining the constant temperature of the packaging mold of the present invention.

1: The first clamping

10: The first mold base

100: The first mold

11: The first module

110: First heater

111: The first temperature sensor

12: The first handle

2: The second clamping

20: The second die base

200: The second mold

21: Second module

210: Second heater

211: Second temperature sensor

22: Second handle

3: Package

30: Metal parts

31: First colloid

32: Second colloid

Claims (9)

A packaging mold for heating and pressurizing a package, comprising: A first clamping mold includes a first mold base and a first module combined with the first mold base, and the first mold base is provided with a first mold core, and the first mold core passes through the first mold base. a module into which it is built; and A second clamping mold is closed with the first clamping mold, and includes a second mold base, and a second module combined with the second mold base, and the second mold base is provided with a second mold a kernel into which the second mold kernel is inserted through the second module; Wherein, the first clamping mold and the second clamping mold are made of thermally conductive material, and at least a first heater and a first temperature sensor are arranged on the first clamping mold, and the second clamping mold is There is also at least a second heater and a second temperature sensor on it, and the package is placed between the first mold core and the second mold core so that pressure can be applied, and the first heater It is heated with the second heater, and the heating temperature is controlled by the first temperature sensor and the second temperature sensor. The packaging mold of claim 1, wherein the first clamping mold is a lower mold, and the second clamping mold is an upper mold. The packaging mold according to claim 1 or 2, wherein an elastic element is arranged between the first mold base and the first module. The packaging mold according to claim 3, wherein an elastic element is also provided between the second mold base and the second module. The packaging mold according to claim 1, wherein grooves are formed on the surfaces of the first mold core and the second mold core for placing the package. The packaging mold of claim 5, wherein the packaging member is further assembled on a matching member and disposed in the groove. The packaging mold of claim 1, wherein the first module is provided with a pair of first handles, and the second module is provided with a pair of second handles. The packaging mold according to claim 7, wherein the first handle and the second handle are made of insulating material. The packaging mold of claim 1, wherein the first heater is provided on the first module, the second heater is provided on the second module, and the first temperature sensor is provided on the first On the mold core, the second temperature sensor is arranged on the second mold core.

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