TWM622367U - Electronic component carrier - Google Patents

Abstract

An electronic component carrier board, comprising a plurality of laminates arranged at intervals along the up-down direction, a plurality of insulating layers arranged alternately with the laminates in the up-down direction, a plurality of conductive pins passing through the laminates and the insulating layers, and a plurality of wires connected to the outer peripheral surfaces of the conductive pins and having the same length and diameter. Since the outer diameters of the conductive pins and the lengths and diameters of the wires are the same, the impedances are equal without additional adjustment, thereby overcoming the problem of uneven impedance in the prior art. When the electronic component carrier is used as a detection carrier can ensure the detection accuracy.

Description

Electronic component carrier board

The present invention relates to a carrier board, in particular to an electronic component carrier board.

The printed circuit board is an indispensable carrier component in modern technology products. It is mainly used to carry electronic components and conduct specific circuits. The current wiring process of printed circuit boards is based on one or both sides of the plastic board as required. If the printed circuit board is a double-layer board, it is necessary to print conductive copper foil on both sides of the plastic board, and open vias on the plastic board to make the conductive copper foil on both sides. can be connected. As long as various electronic components are mounted on the finished printed circuit board, the conductive copper foil will connect these electronic components to form a complete circuit.

In view of the continuous development of science and technology, the increasingly complex functions of electronic products, and the increasing circuit complexity of printed circuit boards, the form of single-layer board or double-layer board can no longer meet the demand, so printed circuit boards in the form of multi-layer boards have emerged. The multilayer printed circuit board is to prepare a multilayer board with copper foil circuit printed on the surface, and make holes on the board according to the requirements, and then stack these layers with the insulating film up and down, and pass through the high temperature and high pressure. The presses will be tightly combined with each other, and the aforementioned openings will be connected to each other to form a through-hole. There are plate through hoes that pass through all the layers, blind via holes that open unidirectionally to the outer layers, and buried vias that only communicate between some inner layers. These vias, blind vias and buried vias are connected to the copper foil circuits on each layer board through internal electroplating of copper to complete the wiring. These copper foil circuits will then be connected to electronic components or connectors. However, the wire lengths and even the wire diameters of these copper foil lines are often not equal, resulting in the problem of uneven impedance during signal transmission. It is necessary to adjust the impedance matching through other methods, and the adjustment effect is limited. This problem occurs when high-frequency signals are transmitted. especially serious. When such a problem occurs on a load board that requires high-precision testing, such as a load board, the reliability of the testing result will be greatly affected.

Therefore, the purpose of the present invention is to provide an electronic component carrier board which can avoid uneven impedance and improve the accuracy of signal transmission.

Therefore, the new electronic component carrier board includes a plurality of layers arranged at intervals along the up-down direction, a plurality of insulating layers arranged alternately with the layers in the up-down direction, and a plurality of layers passing through the layers and the insulating layers. Conductive pins, and a plurality of wires connecting the conductive pins and having the same length and diameter. Each layer plate forms a plurality of through holes extending from the top surface to the bottom surface, each through hole of the layer plate is aligned with one of the through holes of the adjacent layer plate, and the through holes aligned with each other in the up-down direction communicate with each other to form a slot . Each insulating layer is disposed between two adjacent layers. The conductive pins are inserted into the slots. Each wire is connected The conductive pins are connected to the outer peripheral surface of one of the conductive pins, and are covered in one of the insulating layers, so as to be located between the two corresponding layers, and the wires extend and route along the horizontal direction of the layers.

The effect of the present invention is that the wires are connected to the outer peripheral surfaces of the conductive pins. Since the outer diameters of the conductive pins and the lengths and diameters of the wires are the same, the impedances are equal and do not need to be adjusted separately. Knowing the problem of uneven impedance, when the electronic component carrier is used as a detection carrier, the detection accuracy can be ensured.

11: Preliminary steps

12: Threading steps

13: Trace steps

14: layer filling step

15: Lamination step

2: Laminate

21: Through hole

3: Conductive pins

4: Wire

5: Insulation layer

6: Electronic component carrier board

7: Connector

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein: FIG. 1 is a flowchart illustrating the wiring method of the electronic component carrier of the present invention; FIG. 2 is a perspective view illustrating the One of the pre-steps of the wiring method; FIG. 3 is a perspective view illustrating a threading step of the wiring method; FIG. 4 is a perspective view illustrating a wiring step of the wiring method; FIG. 5 is a perspective view illustrating the wiring method. and FIG. 6 is a perspective view illustrating an electronic component carrier board made by the wiring method, which is an embodiment of the new electronic component carrier board.

Referring to FIG. 1 and FIG. 2, the wiring method of the electronic component carrier board of the present invention includes: A pre-processing step 11 , a threading step 12 , a wiring step 13 , a layer filling step 14 , and a stacking step 15 . In the pre-step 11, a plurality of layers 2 are prepared, and each layer 2 is formed with a plurality of through holes 21 arranged in a matrix and each extending from the top surface to the bottom surface. In this embodiment, the layer board 2 can be a plastic board or a dense board. The through holes 21 can also be arranged in different shapes according to requirements, and should not be limited by the arrangement of the matrix.

Referring to FIG. 1 and FIG. 3 , in the insertion step 12 , a laminate 2 to be placed on the bottommost layer is selected, and the conductive pins 3 are respectively inserted through the through holes 21 of the laminate 2 . It should be noted that, in this embodiment, the number of the conductive pins 3 is the same as the number of the through holes 21 as an example, after the actual requirements such as wiring are considered, the number of the conductive pins 3 can be smaller than the through holes 21. the quantity.

Referring to FIG. 1 and FIG. 4 , in the routing step 13, several copper wires 4 with equal lengths and wire diameters are welded to the outer peripheral surfaces of the conductive pins 3, and each wire 4 is on the layer The top and bottom surfaces of the board 2 are routed in the horizontal direction (the route of the route in FIG. 4 is only a schematic diagram, and the actual route can be rounded or bent, and is not limited to a straight line). The number of the wires 4 may be determined by the line requirements of the wiring, that is, it may not necessarily be equal to the number of the conductive pins 3 . Referring to FIGS. 1 and 5 , in the layer filling step 14 , an insulating layer 5 is covered on the top surface of the laminate 2 , and the insulating layer 5 covers the wires 4 .

Referring to FIG. 1 and FIG. 6, in the lamination step 15, select the next layer 2, and repeat the threading step 12, the wiring step 13, and the filling step 14, that is, the conductive The pins 3 pass through the through holes 21 so that the laminate 2 is stacked on the insulating layer 5 Then, solder a plurality of wires 4 to the corresponding conductive pins 3 according to the requirements, and the wires 4 are routed in the horizontal direction on the top surface and the bottom surface (or only the top surface or the bottom surface) of the layer board 2, Then, an insulating layer 5 is covered on the top surface of the laminate 2 to cover the wires 4 . In this way, the aforementioned process is continuously performed until all the laminates 2 are stacked on top of each other, and finally the laminates 2 and the insulating layers 5 are pressed together to form an electronic component carrier 6, which is a new type of electronic component. One embodiment of the carrier board 6, the electronic component carrier board 6 includes a plurality of layers 2 arranged at intervals along the up-down direction, a plurality of insulating layers 5 arranged alternately with the layers 2 in the up-down direction, and a plurality of layers through the The conductive pins 3 of the laminate 2 and the insulating layers 5, and a plurality of wires 4 connected to the conductive pins 3 and having the same length and diameter. Each through hole 21 of each layer 2 of the electronic component carrier board 6 is aligned with and communicated with a through hole 21 of two adjacent layers 2, and all the through holes 21 aligned with each other in the up-down direction communicate with each other A slot is formed, and the conductive pins 3 are respectively located in the slot.

The wires 4 are connected to the outer peripheral surfaces of the conductive pins 3. Since the outer diameters of the conductive pins 3 are the same, the lengths and diameters of the wires 4 are also the same, so that the same impedance can be ensured to overcome the conventional problem. When the wires 4 are to be joined with the connector 7, the wires 4 will pass out of the layers 2 and the insulating layers 5 in the horizontal direction. are located in the same planar position to engage with connector 7 . In addition, the conductive pins 3 are of solid structure, so they have better structural strength, which can improve the durability of the electronic component carrier board 6 .

To sum up, the present invention can connect the wires 4 with the same wire length and wire diameter. The conductive pins 3 with the same outer diameter are connected, so that the impedance value is the same, the signal transmission can be stable, and the conductive pins 3 can be well applied to transmit high-frequency signals, so the purpose of the present invention can be achieved.

However, the above are only examples of the present invention, which should not limit the scope of the present invention. Any simple equivalent changes and modifications made according to the scope of the patent application for this new model and the contents of the patent specification are still within the scope of the present invention. within the scope of this new patent.

2: Laminate

21: Through hole

3: Conductive pins

4: Wire

5: Insulation layer

6: Electronic component carrier board

7: Connector

Claims (2)

An electronic component carrier board comprising: A plurality of laminates are arranged at intervals along the up-down direction, each laminate forms a plurality of through holes extending from the top surface to the bottom surface, each through-hole of the laminate is aligned with one of the through-holes of the adjacent laminates, and aligned with each other along the up-down direction The through-holes are connected to each other to form a slot; A plurality of insulating layers are alternately arranged with the layers in the up-down direction, and each insulating layer is arranged between two adjacent layers; a plurality of conductive pins, which pass through the layers and the insulating layers, and are inserted into the slots; and A plurality of wires, with the same length and diameter as each other, each wire is connected to the outer peripheral surface of one of the conductive pins, and is covered in one of the insulating layers, so as to be located between the corresponding two layers. Horizontally extending traces of the equal-layer board. The electronic component carrier board of claim 1, wherein each wire is connected to the corresponding conductive pin by soldering.

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