TWM621534U - LED package, display device, lamp and lighting system - Google Patents

LED package, display device, lamp and lighting system Download PDF

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TWM621534U
TWM621534U TW110210476U TW110210476U TWM621534U TW M621534 U TWM621534 U TW M621534U TW 110210476 U TW110210476 U TW 110210476U TW 110210476 U TW110210476 U TW 110210476U TW M621534 U TWM621534 U TW M621534U
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terminal
led
led package
test
electrically connected
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TW110210476U
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甘洋
何俊杰
廖本瑜
黃建中
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大陸商弘凱光電(江蘇)有限公司
弘凱光電股份有限公司
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Abstract

本創作揭露了一種LED封裝體、顯示裝置、燈具以及燈光系統,包含基板、控制單元及LED發光單元,基板包含電源端子、接地端子、訊號輸入端子、訊號輸出端子及測試端子;控制單元的輸入端與訊號輸入端子電性連接,控制單元的驅動端、LED發光單元的負極以及測試端子電性共接,控制單元的輸出端與訊號輸出端子電性連接,控制單元的接地端與接地端子電性連接,LED發光單元的正極與電源端子電性連接。透過於LED封裝體的基板設置測試端子和電源端子,以使在控制單元和LED發光單元封裝在基板上之後,能夠透過對測試端子施加正向電壓以及將電源端子連接電源接地,從而對LED發光單元的反向擊穿電壓和漏電流等參數進行測試。This creation discloses an LED package, a display device, a lamp, and a lighting system, including a substrate, a control unit, and an LED light-emitting unit. The substrate includes a power terminal, a ground terminal, a signal input terminal, a signal output terminal, and a test terminal; the input of the control unit The terminal is electrically connected to the signal input terminal, the driving terminal of the control unit, the negative terminal of the LED light-emitting unit and the test terminal are electrically connected together, the output terminal of the control unit is electrically connected to the signal output terminal, and the ground terminal of the control unit is electrically connected to the ground terminal. The anode of the LED light-emitting unit is electrically connected with the power terminal. The test terminal and the power terminal are provided through the substrate of the LED package, so that after the control unit and the LED light-emitting unit are packaged on the substrate, the LED can emit light by applying a forward voltage to the test terminal and connecting the power terminal to the power supply ground. Parameters such as reverse breakdown voltage and leakage current of the unit are tested.

Description

LED封裝體、顯示裝置、燈具以及燈光系統LED packages, display devices, lamps and lighting systems

本創作屬於光電技術領域,尤其涉及一種LED封裝體、顯示裝置、燈具以及燈光系統。This creation belongs to the field of optoelectronic technology, and in particular relates to an LED package, a display device, a lamp and a lighting system.

發光二極體(light-emitting diode,LED)作為一種常用的發光器件,已被廣泛應用於照明或資訊顯示等技術領域。現有技術透過在LED封裝體的內部嵌入可編程的控制單元來實現對單顆LED封裝體的單點控制或獨立尋址等功能。As a common light-emitting device, light-emitting diode (LED) has been widely used in lighting or information display and other technical fields. In the prior art, functions such as single-point control or independent addressing of a single LED package are implemented by embedding a programmable control unit inside the LED package.

傳統的LED封裝體內部整合了LED發光晶片和用於對LED發光晶片進行驅動控制的控制單元,且傳統的LED封裝體在封裝時僅將電源端子、接地端子、訊號輸入端子以及訊號輸出端子作為其引腳。在LED封裝體內部,LED發光晶片的負極與控制單元的驅動端電性連接,LED發光晶片的正極與電源端子電性連接。這樣,封裝後的LED封裝體僅能實現對LED發光晶片的正向導通和反向截止等特徵的測試,無法實現對LED發光晶片的反向擊穿電壓和漏電流等參數的測試。The traditional LED package integrates the LED light-emitting chip and the control unit for driving and controlling the LED light-emitting chip, and the traditional LED package only uses the power terminal, the ground terminal, the signal input terminal and the signal output terminal as the packaging. its pins. Inside the LED package body, the negative electrode of the LED light-emitting chip is electrically connected to the driving end of the control unit, and the positive electrode of the LED light-emitting chip is electrically connected to the power terminal. In this way, the packaged LED package can only test the forward conduction and reverse cut-off characteristics of the LED light-emitting chip, but cannot test the parameters such as reverse breakdown voltage and leakage current of the LED light-emitting chip.

本創作的目的在於提供一種LED封裝體,旨在解決傳統的LED封裝體在封裝之後無法實現對LED發光晶片的反向擊穿電壓和漏電流等參數的測試的問題。The purpose of this creation is to provide an LED package, which aims to solve the problem that the traditional LED package cannot test the parameters such as reverse breakdown voltage and leakage current of the LED light-emitting chip after packaging.

本創作實施例的第一方面提供了一種LED封裝體,包含:基板、控制單元及LED發光單元,基板包含電源端子、接地端子、訊號輸入端子及訊號輸出端子,基板進一步包含測試端子;控制單元的輸入端與訊號輸入端子電性連接,控制單元的驅動端、LED發光單元的負極以及測試端子電性共接,控制單元的輸出端與訊號輸出端子電性連接,控制單元的接地端與接地端子電性連接,控制單元的電源端、LED發光單元的正極與電源端子電性共接;控制單元和LED發光單元設置在基板上,電源端子、接地端子、訊號輸入端子、訊號輸出端子以及測試端子各自作為LED封裝體用於與外部電性連接的引腳。A first aspect of this creative embodiment provides an LED package, comprising: a substrate, a control unit and an LED light-emitting unit, the substrate includes a power terminal, a ground terminal, a signal input terminal and a signal output terminal, the substrate further includes a test terminal; the control unit The input terminal of the control unit is electrically connected to the signal input terminal, the driving terminal of the control unit, the negative terminal of the LED light-emitting unit and the test terminal are electrically connected together, the output terminal of the control unit is electrically connected to the signal output terminal, and the ground terminal of the control unit is connected to the ground The terminals are electrically connected, and the power supply terminal of the control unit, the positive pole of the LED light-emitting unit and the power supply terminal are electrically connected together; the control unit and the LED light-emitting unit are arranged on the substrate, the power supply terminal, the ground terminal, the signal input terminal, the signal output terminal and the test The terminals are respectively used as pins of the LED package for electrical connection with the outside.

在一實施例中,LED發光單元包含一個或者複數個LED發光晶片,測試端子的數量與LED發光晶片的數量相同,控制單元的驅動端的數量與LED發光晶片的數量相同;LED發光晶片的負極透過基板與對應的測試端子以及對應的控制單元的驅動端電性共接。In one embodiment, the LED light-emitting unit includes one or more LED light-emitting chips, the number of test terminals is the same as that of the LED light-emitting chips, and the number of driving ends of the control unit is the same as the number of the LED light-emitting chips; The substrate is electrically connected to the corresponding test terminal and the corresponding driving terminal of the control unit.

在一實施例中,複數個LED發光晶片包含紅光晶片、綠光晶片以及藍光晶片;對應地,複數個測試端子包含第一測試端子、第二測試端子以及第三測試端子;複數個驅動端包含第一驅動端、第二驅動端以及第三驅動端;紅光晶片的正極、綠光晶片的正極、藍光晶片的正極、電源端子及控制單元的電源端透過基板電性共接,紅光晶片的負極、控制單元的第一驅動端以及第一測試端子透過基板電性共接,綠光晶片的負極、控制單元的第二驅動端以及第二測試端子透過基板電性共接,藍光晶片的負極、控制單元的第三驅動端以及第三測試端子透過基板電性共接。In one embodiment, the plurality of LED light-emitting chips include red light chips, green light chips and blue light chips; correspondingly, the plurality of test terminals include a first test terminal, a second test terminal and a third test terminal; a plurality of driving terminals It includes a first drive end, a second drive end and a third drive end; the positive electrode of the red light chip, the positive electrode of the green light chip, the positive electrode of the blue light chip, the power supply terminal and the power supply end of the control unit are electrically connected together through the substrate, and the red light The negative electrode of the chip, the first drive terminal of the control unit and the first test terminal are electrically connected together through the substrate, the negative electrode of the green chip, the second drive terminal of the control unit and the second test terminal are electrically connected together through the substrate, and the blue chip is electrically connected through the substrate. The negative electrode of the control unit, the third drive terminal of the control unit and the third test terminal are electrically connected together through the substrate.

在一實施例中,第一測試端子、第二測試端子以及第三測試端子設置在基板的第一側,電源端子、接地端子、訊號輸入端子以及訊號輸出端子設置在基板的其餘側,其餘側為除了第一側之外的任意一側。In one embodiment, the first test terminal, the second test terminal and the third test terminal are arranged on the first side of the substrate, the power supply terminal, the ground terminal, the signal input terminal and the signal output terminal are arranged on the remaining side of the substrate, and the remaining side is any side except the first side.

在一實施例中,第一測試端子、第二測試端子、第三測試端子、電源端子、接地端子、訊號輸入端子以及訊號輸出端子設置於基板的同一側。In one embodiment, the first test terminal, the second test terminal, the third test terminal, the power terminal, the ground terminal, the signal input terminal and the signal output terminal are arranged on the same side of the substrate.

在一實施例中,電源端子用於電性連接外部電源的正極,測試端子用於電性連接外部電源接地;或者電源端子用於電性連接外部電源接地,測試端子用於電性連接外部電源的正極。In one embodiment, the power terminal is used to electrically connect to the positive pole of the external power source, and the test terminal is used to electrically connect to the ground of the external power source; or the power terminal is used to electrically connect to the ground of the external power source, and the test terminal is used to electrically connect to the external power source. the positive pole.

在一實施例中,電源端子、接地端子、訊號輸入端子、訊號輸出端子以及測試端子的材質均為銅。In one embodiment, the material of the power terminal, the ground terminal, the signal input terminal, the signal output terminal and the test terminal are all copper.

本創作的實施例的第二方面提供了一種顯示裝置,包含驅動器和顯示陣列,顯示陣列包含X×Y個如第一方面中任一實施例所述之LED封裝體;其中,X為顯示陣列的行數,Y為顯示陣列的列數;驅動器與第1個LED封裝體的訊號輸入端子電性連接,用於輸出驅動訊號至第1個LED封裝體;第2個LED封裝體至第X×Y個LED封裝體中的每一個LED封裝體的訊號輸入端子與其前一個LED封裝體的訊號輸出端子電性連接。A second aspect of the embodiments of the present invention provides a display device, including a driver and a display array, the display array includes X×Y LED packages according to any one of the embodiments in the first aspect; wherein X is the display array The number of rows, Y is the number of columns of the display array; the driver is electrically connected to the signal input terminal of the first LED package for outputting driving signals to the first LED package; the second LED package to the Xth The signal input terminal of each LED package of the ×Y LED packages is electrically connected to the signal output terminal of the preceding LED package.

本創作的實施例的第三方面提供了一種燈具,包含N個如第一方面中任一實施例所述之LED封裝體;其中,N為大於1的整數;N個LED封裝體中的第1個LED封裝體的訊號輸入端子為燈具的輸入端,第N個LED封裝體的訊號輸出端子為燈具的輸出端,第2個LED封裝體至第N個LED封裝體中的每一個LED封裝體的訊號輸入端子與其前一個LED封裝體的訊號輸出端子電性連接。A third aspect of the embodiments of the present invention provides a lamp, including N LED packages according to any embodiment of the first aspect; wherein, N is an integer greater than 1; The signal input terminal of one LED package is the input terminal of the lamp, the signal output terminal of the Nth LED package is the output terminal of the lamp, and each LED package from the second LED package to the Nth LED package The signal input terminal of the body is electrically connected with the signal output terminal of the preceding LED package body.

本創作的實施例的第四方面提供了一種燈光系統,包含驅動器和如第三方面中的實施例所述之燈具;驅動器的輸出端與燈具的輸入端電性連接;驅動器用於向燈具輸出驅動訊號。A fourth aspect of the embodiments of the present invention provides a lighting system, including a driver and the lamp according to the embodiment in the third aspect; the output end of the driver is electrically connected with the input end of the lamp; the driver is used for outputting to the lamp drive signal.

本創作的實施例與現有技術相比存在的有益效果是:透過在LED封裝體的基板設置測試端子,並將LED發光單元的負極與測試端子電性連接,且將測試端子也封裝為LED封裝體的引腳,從而在LED封裝體封裝後,不僅可以透過向電源端子施加正向電壓以及將測試端子連接電源接地,實現對LED發光單元的正向導通和反向截止等特徵的測試;而且可以進一步透過向測試端子施加正向電壓以及將電源端子連接電源接地,以實現對LED發光單元的反向擊穿電壓和漏電流等參數的測試。Compared with the prior art, the embodiment of the present invention has the beneficial effect that: by arranging a test terminal on the substrate of the LED package, the negative electrode of the LED light-emitting unit is electrically connected to the test terminal, and the test terminal is also packaged as an LED package Therefore, after the LED package body is encapsulated, not only can the forward conduction and reverse cut-off characteristics of the LED light-emitting unit be tested by applying a forward voltage to the power supply terminal and connecting the test terminal to the power supply ground; The parameters such as reverse breakdown voltage and leakage current of the LED light-emitting unit can be further tested by applying a forward voltage to the test terminal and connecting the power terminal to the power supply ground.

為了使本創作所要解決的技術問題、技術方案及有益效果更加清楚明白,以下將結合附圖及實施例,對本創作進行進一步詳細說明。應當理解的是,此處所說明的具體實施例僅僅用以解釋本創作,並不用於限定本創作。In order to make the technical problems, technical solutions and beneficial effects to be solved by the present creation more clear, the present creation will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

此外,術語「第一」、「第二」僅用於說明目的,而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此,限定有「第一」、「第二」的特徵可以明示或者隱含地包含一個或者更複數個該特徵。在本創作的說明中,「複數個」的含義是兩個或兩個以上,除非另有明確具體的限定。In addition, the terms "first" and "second" are used for illustration purposes only, and should not be interpreted as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined with "first" and "second" may expressly or implicitly include one or more of the feature. In the description of this creation, "plurality" means two or more, unless otherwise expressly and specifically limited.

傳統情況下,LED發光晶片的測試是在LED發光晶片封裝在LED封裝體的基板之前完成的,而在LED發光晶片被封裝到LED封裝體的基板之後,因為LED發光晶片的負極是與控制單元的驅動端電性連接而無法單獨引出檢測端子,因此無法對LED發光晶片的負極施加正向電壓,所以無法對封裝後的LED封裝體的LED發光晶片的反向擊穿電壓和漏電流進行檢測。而LED封裝體在生產或運輸的過程中,LED發光晶片的PN結構如果遭受到了破壞,例如遭受到靜電或晶片片裂等破壞,將造成LED發光晶片出現反向擊穿或漏電的情況,隨著LED發光晶片的使用時間的延長,會導致LED發光晶片的亮度急劇下降,這導致了LED封裝體的品質變差。由於傳統的LED封裝體無法在其封裝之後對LED發光晶片的反向擊穿電壓和漏電流進行檢測,因此無法將這類品質變差的LED封裝體篩選出來。Traditionally, the test of the LED light-emitting chip is completed before the LED light-emitting chip is packaged on the substrate of the LED package, and after the LED light-emitting chip is packaged to the substrate of the LED package, because the negative electrode of the LED light-emitting chip is connected to the control unit. The driving end of the LED light-emitting chip is electrically connected and the detection terminal cannot be drawn out separately, so the forward voltage cannot be applied to the negative electrode of the LED light-emitting chip, so the reverse breakdown voltage and leakage current of the LED light-emitting chip of the packaged LED package body cannot be detected. . In the process of production or transportation of the LED package, if the PN structure of the LED light-emitting chip is damaged, such as static electricity or chip cracking, it will cause reverse breakdown or leakage of the LED light-emitting chip. With the prolongation of the use time of the LED light-emitting chip, the brightness of the LED light-emitting chip will drop sharply, which leads to the deterioration of the quality of the LED package. Since the conventional LED package cannot detect the reverse breakdown voltage and leakage current of the LED light-emitting chip after it is packaged, it is impossible to screen out such poor quality LED packages.

有鑑於此,本創作實施例的LED封裝體透過設置測試端子,且將測試端子也封裝為LED封裝體的引腳,從而在LED封裝體封裝後,不僅可以透過向電源端子施加正向電壓以及將測試端子連接電源接地,實現對LED發光晶片的正向導通和反向截止等特徵的測試,而且可以進一步透過向測試端子施加正向電壓以及將電源端子連接電源接地,以實現對LED發光晶片的反向擊穿電壓和漏電流的測試,從而將存在反向擊穿電壓異常及/或漏電流異常的LED發光晶片對應的LED封裝體給篩選出來,從而提高LED封裝體的品管品質。In view of this, the LED package of the present invention is provided with test terminals, and the test terminals are also packaged as pins of the LED package, so that after the LED package is packaged, not only can the forward voltage be applied to the power terminals and The test terminal is connected to the power supply ground to test the forward conduction and reverse cut-off characteristics of the LED light-emitting chip, and the LED light-emitting chip can be further tested by applying a forward voltage to the test terminal and connecting the power terminal to the power supply ground. The reverse breakdown voltage and leakage current test of the device can be used to screen out the LED packages corresponding to the LED light-emitting chips with abnormal reverse breakdown voltage and/or leakage current, thereby improving the quality control quality of the LED packages.

本創作的實施例首先提供一種LED封裝體。請參閱圖1,圖1為本創作實施例提供的一種LED封裝體的結構示意圖。如圖1所示,LED封裝體包含基板800、控制單元100及LED發光單元200;基板800包含電源端子300、接地端子400、訊號輸入端子500、訊號輸出端子600以及測試端子700;LED發光單元200在本實施例中為一個LED發光晶片。Embodiments of the present invention first provide an LED package. Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of an LED package according to an embodiment of the present invention. As shown in FIG. 1 , the LED package includes a substrate 800, a control unit 100 and an LED lighting unit 200; the substrate 800 includes a power terminal 300, a ground terminal 400, a signal input terminal 500, a signal output terminal 600 and a test terminal 700; the LED lighting unit 200 is an LED light-emitting chip in this embodiment.

控制單元100的輸入端與訊號輸入端子500電性連接,控制單元100的驅動端、LED發光單元200的負極以及測試端子700電性共接,控制單元100的輸出端與訊號輸出端子600電性連接,控制單元100的接地端與接地端子400電性連接,控制單元100的電源端、LED發光單元200的正極與電源端子300電性連接。The input end of the control unit 100 is electrically connected to the signal input terminal 500 , the driving end of the control unit 100 , the negative electrode of the LED lighting unit 200 and the test terminal 700 are electrically connected together, and the output end of the control unit 100 is electrically connected to the signal output terminal 600 For connection, the ground terminal of the control unit 100 is electrically connected to the ground terminal 400 , and the power terminal of the control unit 100 and the anode of the LED light-emitting unit 200 are electrically connected to the power terminal 300 .

控制單元100和LED發光單元200設置在基板800上,電源端子300、接地端子400、訊號輸入端子500、訊號輸出端子600以及測試端子700均作為LED封裝體用於與外部電性連接的引腳。The control unit 100 and the LED light-emitting unit 200 are disposed on the substrate 800 , and the power terminal 300 , the ground terminal 400 , the signal input terminal 500 , the signal output terminal 600 and the test terminal 700 are used as pins of the LED package for electrical connection with the outside. .

其中,電源端子300作為封裝後的LED封裝體的電源引腳,接地端子400作為封裝後的LED封裝體的接地引腳,訊號輸入端子500作為封裝後的LED封裝體的訊號輸入引腳,訊號輸出端子600作為封裝後的LED封裝體的訊號輸出引腳;測試端子700作為封裝後的LED封裝體的測試引腳。The power terminal 300 is used as the power supply pin of the packaged LED package, the ground terminal 400 is used as the ground pin of the packaged LED package, and the signal input terminal 500 is used as the signal input pin of the packaged LED package. The output terminal 600 is used as the signal output pin of the packaged LED package; the test terminal 700 is used as the test pin of the packaged LED package.

在本實施例中,訊號輸入端子500用於接收外部的驅動訊號,並向控制單元100傳輸驅動訊號。控制單元100接收到驅動訊號後,可以基於驅動訊號產生控制訊號,並透過控制單元100的驅動端將控制訊號輸出至LED發光單元200,以對LED發光單元200進行驅動控制,例如控制LED發光單元200點亮或熄滅。In this embodiment, the signal input terminal 500 is used for receiving an external driving signal and transmitting the driving signal to the control unit 100 . After the control unit 100 receives the driving signal, it can generate a control signal based on the driving signal, and output the control signal to the LED lighting unit 200 through the driving terminal of the control unit 100, so as to drive and control the LED lighting unit 200, such as controlling the LED lighting unit 200 on or off.

此外,當複數個LED封裝體串聯而電性連接時,各LED封裝體中的控制單元100可以進一步將其接收到的驅動訊號進行整理後透過訊號輸出端子600輸出至下一級LED封裝體的訊號輸入端子500。透過為LED封裝體設置測試端子700,並將測試端子700與LED發光單元200的負極電性連接,電源端子300與LED發光單元200的正極電性連接,以使在控制單元100和LED發光單元200封裝在基板800之後,能夠透過對測試端子700施加正向電壓以及將電源端子300連接外部電源接地,從而測試LED發光單元200的反向擊穿電壓和漏電流等參數。同時,也可以透過對電源端子300施加正向電壓以及將測試端子700連接外部電源接地,從而測試LED發光單元200是否能夠正常點亮。In addition, when a plurality of LED packages are electrically connected in series, the control unit 100 in each LED package can further organize the received driving signals and then output the signals to the next-level LED package through the signal output terminal 600 Input terminal 500. The test terminal 700 is provided for the LED package, and the test terminal 700 is electrically connected to the negative electrode of the LED light-emitting unit 200, and the power terminal 300 is electrically connected to the positive electrode of the LED light-emitting unit 200, so that the control unit 100 and the LED light-emitting unit are electrically connected. After the 200 is packaged on the substrate 800 , parameters such as reverse breakdown voltage and leakage current of the LED lighting unit 200 can be tested by applying a forward voltage to the test terminal 700 and connecting the power terminal 300 to an external power source to ground. At the same time, it is also possible to test whether the LED lighting unit 200 can be normally lit by applying a forward voltage to the power terminal 300 and connecting the test terminal 700 to an external power source to ground.

具體地,電源端子300用於電性連接外部電源的正極,測試端子700用於與外部電源接地電性連接;或者電源端子300用於與外部電源接地電性連接,測試端子700用於電性連接外部電源的正極。Specifically, the power terminal 300 is used to electrically connect the positive pole of the external power source, and the test terminal 700 is used to electrically connect to the ground of the external power source; or the power terminal 300 is used to electrically connect to the ground of the external power source, and the test terminal 700 is used for electrical connection Connect to the positive side of the external power supply.

當電源端子300與外部電源的正極電性連接,測試端子700與外部電源接地電性連接,透過對電源端子300施加正向電壓以及將測試端子700連接外部電源接地,從而測試LED發光單元200是否能夠正常點亮;當電源端子300用於與外部電源接地電性連接,測試端子700用於電性連接外部電源的正極,透過對測試端子700施加正向電壓以及將電源端子300連接外部電源接地,從而測試LED發光單元200的反向擊穿電壓和漏電流等參數。When the power terminal 300 is electrically connected to the positive pole of the external power source, and the test terminal 700 is electrically connected to the ground of the external power source, by applying a forward voltage to the power terminal 300 and connecting the test terminal 700 to the ground of the external power source, it is possible to test whether the LED lighting unit 200 is Can be lit normally; when the power terminal 300 is used for electrical connection with the external power supply ground, and the test terminal 700 is used for electrical connection with the positive pole of the external power supply, by applying a forward voltage to the test terminal 700 and connecting the power terminal 300 to the external power supply grounding , so as to test parameters such as reverse breakdown voltage and leakage current of the LED lighting unit 200 .

在另一個實施例中,LED發光單元200包含複數個LED發光晶片,例如分別為紅光LED發光晶片、綠光LED發光晶片和藍光LED發光晶片,以滿足LED封裝體的發光要求,測試端子700的數量與LED發光晶片的數量相同,控制單元100的驅動端的數量與LED發光晶片的數量相同。一個LED發光晶片對應一個測試端子700和控制單元100的一個驅動端。In another embodiment, the LED lighting unit 200 includes a plurality of LED lighting chips, such as a red LED lighting chip, a green LED lighting chip and a blue LED lighting chip, respectively, so as to meet the lighting requirements of the LED package, and the test terminal 700 The number of LEDs is the same as the number of LED light-emitting chips, and the number of the driving ends of the control unit 100 is the same as the number of LED light-emitting chips. One LED light-emitting chip corresponds to one test terminal 700 and one drive terminal of the control unit 100 .

LED發光晶片的負極透過基板800與對應的測試端子700以及對應的控制單元100的驅動端電性共接;基板800設置複數個導電墊並形成有作為各端子的引腳,甚至也可以設置有連接導電墊及引腳的導電電路,以方便電子元件的固接及各測試端子700可以被獨立地接觸外部電源的正極或外部電源接地。The negative electrode of the LED light-emitting chip is electrically connected to the corresponding test terminal 700 and the corresponding driving end of the control unit 100 through the substrate 800; The conductive pads and the conductive circuits of the pins are connected to facilitate the fixing of electronic components and each test terminal 700 can be independently contacted with the positive pole of the external power supply or the external power supply grounding.

請參閱圖2至圖4,在其中一實施例中,LED發光單元200包含紅光晶片210、綠光晶片220以及藍光晶片230。Referring to FIGS. 2 to 4 , in one embodiment, the LED light-emitting unit 200 includes a red light chip 210 , a green light chip 220 and a blue light chip 230 .

對應地,複數個測試端子700包含第一測試端子710、第二測試端子720以及第三測試端子730。控制單元100的複數個驅動端包含第一驅動端、第二驅動端以及第三驅動端。Correspondingly, the plurality of test terminals 700 include a first test terminal 710 , a second test terminal 720 and a third test terminal 730 . The plurality of driving ends of the control unit 100 include a first driving end, a second driving end and a third driving end.

紅光晶片210的正極、綠光晶片220的正極、藍光晶片230的正極、電源端子300及控制單元100的電源端透過基板800電性共接,基板800設有延伸作為電源端子300的引腳的導電墊,以方便地供上述元件透過此導電墊電性共接;紅光晶片210的負極、控制單元100的第一驅動端以及第一測試端子710透過基板800電性共接,綠光晶片220的負極、控制單元100的第二驅動端以及第二測試端子720透過基板800電性共接,藍光晶片230的負極、控制單元100的第三驅動端以及第三測試端子730透過基板800電性共接,基板800設置有複數個導電墊並形成有作為各端子的引腳,甚至也可以設置有連接導電墊及引腳的導電電路,以方便上述晶片的固接及上述元件透過對應的導電墊電性共接,並且作為各測試端子700的引腳的導電墊可被獨立地接觸外部電源正極或外部電源接地,以方便實際操作。The positive electrode of the red light chip 210 , the positive electrode of the green light chip 220 , the positive electrode of the blue light chip 230 , the power terminal 300 and the power terminal of the control unit 100 are electrically connected together through the substrate 800 , and the substrate 800 is provided with pins extending as the power terminals 300 . The conductive pad is used to facilitate the electrical common connection of the above-mentioned components through the conductive pad; the negative electrode of the red light chip 210, the first driving terminal of the control unit 100 and the first test terminal 710 are electrically connected to each other through the substrate 800, and the green light The negative electrode of the chip 220 , the second drive terminal of the control unit 100 and the second test terminal 720 are electrically connected together through the substrate 800 , and the negative electrode of the blue chip 230 , the third drive terminal of the control unit 100 and the third test terminal 730 are connected through the substrate 800 . Electrically connected, the substrate 800 is provided with a plurality of conductive pads and formed with pins as terminals, and even a conductive circuit connecting the conductive pads and the pins can be provided, so as to facilitate the fixing of the above-mentioned chips and the corresponding transmission of the above-mentioned components. The conductive pads are electrically connected together, and the conductive pads serving as the pins of each test terminal 700 can be independently contacted with the positive pole of the external power supply or the grounding of the external power supply, so as to facilitate practical operation.

在本實施例中,可以透過對第一測試端子710施加正向電壓以及將電源端子300連接電源接地,從而測試紅光晶片210的反向擊穿電壓和漏電流等參數;透過對電源端子300施加正向電壓以及將第一測試端子710連接電源接地,從而測試紅光晶片210是否能夠正常點亮。進一步地,可以透過對第二測試端子720施加正向電壓以及將電源端子300連接電源接地,從而測試綠光晶片220的反向擊穿電壓和漏電流等參數;透過對電源端子300施加正向電壓以及將第二測試端子720連接電源接地,從而測試綠光晶片220是否能夠正常點亮。進一步地,可以透過對第三測試端子730施加正向電壓以及將電源端子300連接電源接地,從而測試藍光晶片230的反向擊穿電壓和漏電流等參數;透過對電源端子300施加正向電壓以及將第三測試端子730連接電源接地,從而測試藍光晶片230是否能夠正常點亮。In this embodiment, parameters such as reverse breakdown voltage and leakage current of the red chip 210 can be tested by applying a forward voltage to the first test terminal 710 and connecting the power terminal 300 to the power supply ground; A forward voltage is applied and the first test terminal 710 is connected to the power source to ground, so as to test whether the red light chip 210 can be lit normally. Further, parameters such as reverse breakdown voltage and leakage current of the green chip 220 can be tested by applying a forward voltage to the second test terminal 720 and connecting the power terminal 300 to the power supply ground; by applying a forward voltage to the power terminal 300 voltage and connect the second test terminal 720 to the power supply ground, so as to test whether the green light chip 220 can be normally lit. Further, parameters such as reverse breakdown voltage and leakage current of the blue light chip 230 can be tested by applying a forward voltage to the third test terminal 730 and connecting the power terminal 300 to the power supply ground; by applying a forward voltage to the power terminal 300 And the third test terminal 730 is connected to the power source to ground, so as to test whether the blue light chip 230 can be lit normally.

在本創作的一個實施例中,電源端子300、接地端子400、訊號輸入端子500、訊號輸出端子600、第一測試端子710、第二測試端子720以及第三測試端子730的材質均為銅,其降低了傳輸訊號或者電時的損耗。In an embodiment of the present invention, the power supply terminal 300 , the ground terminal 400 , the signal input terminal 500 , the signal output terminal 600 , the first test terminal 710 , the second test terminal 720 and the third test terminal 730 are made of copper, It reduces the loss when transmitting signals or electricity.

請參閱圖3,其中一實施例中,分別作為第一測試端子710、第二測試端子720以及第三測試端子730的複數個引腳均設置於基板800的同一側,分別作為電源端子300、接地端子400、訊號輸入端子500以及訊號輸出端子600的複數個引腳則設置於基板800的其餘側,此較佳的配置將方便後續的測試操作。其中,當基板800的形狀為方形時,分別作為第一測試端子710、第二測試端子720以及第三測試端子730的複數個引腳可以設置在基板800的第一側,分別作為電源端子300、接地端子400、訊號輸入端子500以及訊號輸出端子600的複數個引腳可以設置在基板800的第二側、第三側和第四側。Referring to FIG. 3 , in one embodiment, a plurality of pins, which are respectively used as the first test terminal 710 , the second test terminal 720 and the third test terminal 730 , are disposed on the same side of the substrate 800 , and are respectively used as the power terminals 300 , 720 and 730 . The plurality of pins of the ground terminal 400 , the signal input terminal 500 and the signal output terminal 600 are disposed on the remaining side of the substrate 800 , and this preferred configuration will facilitate subsequent testing operations. Wherein, when the shape of the substrate 800 is a square, a plurality of pins, which are respectively the first test terminal 710 , the second test terminal 720 and the third test terminal 730 , can be arranged on the first side of the substrate 800 and are respectively used as the power terminal 300 . The plurality of pins of the ground terminal 400 , the signal input terminal 500 and the signal output terminal 600 may be disposed on the second side, the third side and the fourth side of the substrate 800 .

請參閱圖4,當基板800的形狀為長條狀時,分別作為第一測試端子710、第二測試端子720、第三測試端子730、電源端子300、接地端子400、訊號輸入端子500以及訊號輸出端子600的複數個引腳均設置於基板800的同一側(長邊側),此較佳的配置將方便後續的測試操作。Referring to FIG. 4 , when the shape of the substrate 800 is a long strip, it is respectively used as the first test terminal 710 , the second test terminal 720 , the third test terminal 730 , the power terminal 300 , the ground terminal 400 , the signal input terminal 500 and the signal The plurality of pins of the output terminal 600 are disposed on the same side (long side) of the substrate 800 , and this preferred configuration will facilitate subsequent testing operations.

請參閱圖5,本創作實施例進一步提供了一種顯示裝置,包含驅動器1000和顯示陣列2000,顯示陣列2000包含X×Y個如上述任一實施例所述之LED封裝體(在圖中使用911、912…91y;921、922…92y…9x1、9x2…9xy表示)。其中,X為顯示陣列2000的行數,Y為顯示陣列2000的列數。因為本實施例的顯示裝置包含上述任一實施例所述之LED封裝體,因此本實施例的顯示裝置至少包含上述任一實施例所述之LED封裝體所對應的有益效果。Referring to FIG. 5 , the present inventive embodiment further provides a display device including a driver 1000 and a display array 2000 , and the display array 2000 includes X×Y LED packages (using 911 in the figure) as described in any of the above embodiments , 912...91y; 921, 922...92y...9x1, 9x2...9xy). Wherein, X is the number of rows of the display array 2000 , and Y is the number of columns of the display array 2000 . Because the display device of this embodiment includes the LED package described in any one of the above embodiments, the display device of this embodiment at least includes the beneficial effects corresponding to the LED package described in any one of the above embodiments.

驅動器1000與第1個LED封裝體911的訊號輸入端子電性連接,用於輸出驅動訊號至第1個LED封裝體911;第2個LED封裝體912至第X×Y個LED封裝體9xy中的各LED封裝體的訊號輸入端子與其前一個LED封裝體的訊號輸出端子電性連接。The driver 1000 is electrically connected to the signal input terminal of the first LED package 911 for outputting driving signals to the first LED package 911 ; the second LED package 912 is placed in the X×Y-th LED package 9xy The signal input terminal of each LED package body is electrically connected with the signal output terminal of the preceding LED package body.

在本實施例中,複數個LED封裝體之間為串接,其減少了接線耗材。In this embodiment, a plurality of LED packages are connected in series, which reduces wiring consumables.

請參閱圖6,本創作實施例進一步提供了另外一種燈具,包含N個如上述任一實施例所述之LED封裝體(在圖中標示為901…90M…90M+1…90N),因為本實施例的燈具包含上述任一實施例所述之LED封裝體,因此本實施例的燈具至少包含上述任一實施例的LED封裝體所對應的有益效果。其中,N為大於1的整數。N個LED封裝體中的第1個LED封裝體901的訊號輸入端子為燈具的輸入端,第N個LED封裝體90N的訊號輸出端子為燈具的輸出端,第2個LED封裝體至第N個LED封裝體中的各LED封裝體的訊號輸入端子與其前一個LED封裝體的訊號輸出端子電性連接,以實現複數個LED封裝體之間為串接,進而減少了接線耗材。Referring to FIG. 6 , the present inventive embodiment further provides another lighting fixture, including N LED packages (marked as 901...90M...90M+1...90N in the figure) as described in any of the above-mentioned embodiments, because this The lamp of the embodiment includes the LED package described in any of the above-mentioned embodiments, so the lamp of this embodiment at least includes the beneficial effects corresponding to the LED package of any of the above-mentioned embodiments. Wherein, N is an integer greater than 1. In the N LED packages, the signal input terminal of the first LED package 901 is the input terminal of the lamp, the signal output terminal of the Nth LED package 90N is the output terminal of the lamp, and the second LED package to the Nth LED The signal input terminal of each LED package in each LED package is electrically connected to the signal output terminal of the preceding LED package, so as to realize serial connection between the plurality of LED packages, thereby reducing wiring consumables.

在本實施例中,燈具的任一個LED封裝體的LED發光晶片的反向擊穿電壓和漏電流均可進行檢測,因此能夠篩選出燈具中存在反向擊穿電壓異常及/或漏電流異常情況的LED封裝體。In this embodiment, the reverse breakdown voltage and leakage current of the LED light-emitting chip of any LED package body of the lamp can be detected, so it is possible to screen out the abnormal reverse breakdown voltage and/or leakage current in the lamp case of the LED package.

請參閱圖7,本創作實施例進一步提供了一種燈光系統,包含驅動器1000和如上述實施例的燈具3000,因為本實施例的燈光系統包含上述任一實施例的燈具3000,因此本實施例的燈光系統至少包含上述任一實施例的燈具3000所對應的有益效果。驅動器1000的輸出端與燈具3000的輸入端電性連接,驅動器1000用於向燈具3000輸出驅動訊號。Referring to FIG. 7 , this creative embodiment further provides a lighting system including a driver 1000 and the lamp 3000 of the above-mentioned embodiment. Because the lighting system of this embodiment includes the lamp 3000 of any of the above-mentioned embodiments, the The lighting system includes at least the beneficial effects corresponding to the lamps 3000 of any of the above embodiments. The output end of the driver 1000 is electrically connected to the input end of the lamp 3000 , and the driver 1000 is used for outputting a driving signal to the lamp 3000 .

在本實施例中,驅動器1000輸出第一級外部的驅動訊號至第1個LED封裝體901,第1個LED封裝體901根據第一級外部的驅動訊號運作,並且輸出下一級外部的驅動訊號至第2個LED封裝體。第2個LED封裝體根據第1個LED封裝體901輸出的驅動訊號運作,並且輸出下一級外部的驅動訊號至第3個LED封裝體,以此類推,直至第N個LED封裝體90N根據第N-1個LED封裝體輸出的驅動訊號運作,以實現複數個LED封裝體之間的串接,進而減少了接線耗材。In this embodiment, the driver 1000 outputs a first-level external driving signal to the first LED package 901, and the first LED package 901 operates according to the first-level external driving signal and outputs the next-level external driving signal to the second LED package. The second LED package operates according to the driving signal output by the first LED package 901, and outputs the next-level external driving signal to the third LED package, and so on, until the Nth LED package 90N operates according to the first LED package 90N. The driving signals output by the N-1 LED packages operate to realize serial connection between a plurality of LED packages, thereby reducing wiring consumables.

以上實施例僅用以說明本創作的技術方案,而非對其限制;儘管參照前述實施例對本創作進行了詳細的說明,本領域具有通常知識者應當理解的是:其依然可以對前述各實施例所記載的技術方案進行修改,或者對其中部分技術特徵進行等同替換;而這些修改或者替換,並不使相應技術方案的本質脫離本創作各實施例技術方案的精神和範圍,其均應包含在本創作的保護範圍之內。The above embodiments are only used to illustrate the technical solutions of the present creation, but not to limit it; although the present creation has been described in detail with reference to the foregoing embodiments, those with ordinary knowledge in the art should understand that: it can still be used for the foregoing implementations. Modify the technical solutions described in the examples, or perform equivalent replacements to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of this creation, and all of them should include within the scope of protection of this creation.

100:控制單元 200:LED發光單元 210:紅光晶片 220:綠光晶片 230:藍光晶片 300:電源端子 400:接地端子 500:訊號輸入端子 600:訊號輸出端子 700:測試端子 710:第一測試端子 720:第二測試端子 730:第三測試端子 800:基板 1000:驅動器 901,90M,90M+1,90N,911,912,91y,921,922,92y,9x1,9x2,9xy:LED封裝體 2000:顯示陣列 3000:燈具 100: Control unit 200: LED lighting unit 210: red light chip 220: Green chip 230: Blu-ray chip 300: Power terminal 400: Ground terminal 500: Signal input terminal 600: Signal output terminal 700: Test terminal 710: The first test terminal 720: Second test terminal 730: The third test terminal 800: Substrate 1000: drive 901,90M,90M+1,90N,911,912,91y,921,922,92y,9x1,9x2,9xy:LED package 2000: Display array 3000: Lamps

圖1為本創作一實施例提供的一種LED封裝體的結構示意圖; 圖2為本創作另一實施例提供的一種LED封裝體的結構示意圖; 圖3為本創作一實施例提供的一種LED封裝體的端子分佈示意圖; 圖4為本創作另一實施例提供的一種LED封裝體的端子分佈示意圖; 圖5為本創作一實施例提供的一種顯示裝置的結構示意圖; 圖6為本創作一實施例提供的一種燈具的結構示意圖;以及 圖7為本創作一實施例提供的一種燈光系統的結構示意圖。 FIG. 1 is a schematic structural diagram of an LED package provided by an embodiment of the invention; FIG. 2 is a schematic structural diagram of an LED package provided by another embodiment of the present invention; 3 is a schematic diagram of terminal distribution of an LED package provided by an embodiment of the present invention; 4 is a schematic diagram of terminal distribution of an LED package provided by another embodiment of the present invention; FIG. 5 is a schematic structural diagram of a display device according to an embodiment of the present invention; FIG. 6 is a schematic structural diagram of a lamp according to an embodiment of the present invention; and FIG. 7 is a schematic structural diagram of a lighting system according to an embodiment of the present invention.

100:控制單元 100: Control unit

200:LED發光單元 200: LED lighting unit

300:電源端子 300: Power terminal

400:接地端子 400: Ground terminal

500:訊號輸入端子 500: Signal input terminal

600:訊號輸出端子 600: Signal output terminal

700:測試端子 700: Test terminal

800:基板 800: Substrate

Claims (10)

一種LED封裝體,包含:一基板、一控制單元及一LED發光單元,該基板包含一電源端子、一接地端子、一訊號輸入端子、一訊號輸出端子及一測試端子; 該控制單元的一輸入端與該訊號輸入端子電性連接,該控制單元的一驅動端、該LED發光單元的一負極以及該測試端子電性共接,該控制單元的一輸出端與該訊號輸出端子電性連接,該控制單元的一接地端與該接地端子電性連接,該控制單元的一電源端、該LED發光單元的正極與該電源端子電性共接; 該控制單元和該LED發光單元設置在該基板上,該電源端子、該接地端子、該訊號輸入端子、該訊號輸出端子以及該測試端子各自作為該LED封裝體用於與外部電性連接的一引腳。 An LED package includes: a substrate, a control unit and an LED light-emitting unit, the substrate includes a power terminal, a ground terminal, a signal input terminal, a signal output terminal and a test terminal; An input end of the control unit is electrically connected to the signal input terminal, a drive end of the control unit, a negative electrode of the LED light-emitting unit and the test terminal are electrically connected together, and an output end of the control unit is electrically connected to the signal The output terminal is electrically connected, a ground terminal of the control unit is electrically connected to the ground terminal, a power terminal of the control unit and the positive electrode of the LED light-emitting unit are electrically connected to the power terminal; The control unit and the LED light-emitting unit are disposed on the substrate, and the power terminal, the ground terminal, the signal input terminal, the signal output terminal and the test terminal are respectively used as a part of the LED package for electrical connection with the outside. pin. 如請求項1所述之LED封裝體,其中該LED發光單元包含一或複數個LED發光晶片,該測試端子的數量與該LED發光晶片的數量相同,該控制單元的該驅動端的數量與該LED發光晶片的數量相同; 該LED發光晶片的該負極透過該基板與對應的該測試端子以及對應的該控制單元的該驅動端電性共接。 The LED package of claim 1, wherein the LED light-emitting unit comprises one or more LED light-emitting chips, the number of the test terminals is the same as the number of the LED light-emitting chips, and the number of the driving ends of the control unit is the same as the number of the LED light-emitting chips The number of light-emitting chips is the same; The negative electrode of the LED light-emitting chip is electrically connected to the corresponding test terminal and the corresponding driving terminal of the control unit through the substrate. 如請求項2所述之LED封裝體,其中該複數個LED發光晶片包含一紅光晶片、一綠光晶片以及一藍光晶片;對應地,該複數個測試端子包含一第一測試端子、一第二測試端子以及一第三測試端子;該複數個驅動端包含一第一驅動端、一第二驅動端以及一第三驅動端; 該紅光晶片的正極、該綠光晶片的正極、該藍光晶片的正極、該電源端子及該控制單元的該電源端透過該基板電性共接,該紅光晶片的負極、該控制單元的該第一驅動端以及該第一測試端子透過該基板電性共接,該綠光晶片的負極、該控制單元的該第二驅動端以及該第二測試端子透過該基板電性共接,該藍光晶片的負極、該控制單元的該第三驅動端以及該第三測試端子透過該基板電性共接。 The LED package of claim 2, wherein the plurality of LED light-emitting chips comprise a red light chip, a green light chip and a blue light chip; correspondingly, the plurality of test terminals comprise a first test terminal, a first two test terminals and a third test terminal; the plurality of driving terminals include a first driving terminal, a second driving terminal and a third driving terminal; The positive electrode of the red light chip, the positive electrode of the green light chip, the positive electrode of the blue light chip, the power supply terminal and the power supply terminal of the control unit are electrically connected together through the substrate, the negative electrode of the red light chip, the positive electrode of the control unit The first drive terminal and the first test terminal are electrically connected through the substrate, the negative electrode of the green chip, the second drive terminal of the control unit and the second test terminal are electrically connected through the substrate. The negative electrode of the blue light chip, the third driving end of the control unit and the third test terminal are electrically connected together through the substrate. 如請求項3所述之LED封裝體,其中該第一測試端子、該第二測試端子以及該第三測試端子設置在該基板的一第一側,該電源端子、該接地端子、該訊號輸入端子以及該訊號輸出端子設置在該基板的其餘側,其餘側為除了該第一側之外的任意一側。The LED package of claim 3, wherein the first test terminal, the second test terminal and the third test terminal are disposed on a first side of the substrate, the power terminal, the ground terminal, the signal input The terminal and the signal output terminal are arranged on the remaining side of the substrate, and the remaining side is any side except the first side. 如請求項3所述之LED封裝體,其中該第一測試端子、該第二測試端子、該第三測試端子、該電源端子、該接地端子、該訊號輸入端子以及該訊號輸出端子設置於該基板的同一側。The LED package of claim 3, wherein the first test terminal, the second test terminal, the third test terminal, the power terminal, the ground terminal, the signal input terminal and the signal output terminal are disposed on the the same side of the substrate. 如請求項1至請求項5中的任意一項所述之LED封裝體,其中該電源端子用於電性連接一外部電源的一正極,該測試端子用於電性連接一外部電源接地;或者該電源端子用於電性連接該外部電源接地,該測試端子用於電性連接該外部電源的該正極。The LED package according to any one of claim 1 to claim 5, wherein the power terminal is used for electrically connecting a positive pole of an external power source, and the test terminal is used for electrically connecting an external power source to ground; or The power terminal is used for electrically connecting to the ground of the external power supply, and the test terminal is used for electrically connecting the positive pole of the external power supply. 如請求項1至請求項5中的任意一項所述之LED封裝體,其中該電源端子、該接地端子、該訊號輸入端子、該訊號輸出端子以及該測試端子的材質均為銅。The LED package according to any one of claim 1 to claim 5, wherein the power terminal, the ground terminal, the signal input terminal, the signal output terminal and the test terminal are made of copper. 一種顯示裝置,其包含一驅動器和一顯示陣列,該顯示陣列包含X×Y個如請求項1至請求項7中的任意一項所述之LED封裝體;其中,X為該顯示陣列的行數,Y為該顯示陣列的列數; 該驅動器與第1個該LED封裝體的該訊號輸入端子電性連接,用於輸出一驅動訊號至第1個該LED封裝體;第2個該LED封裝體至第X×Y個該LED封裝體中的每一個該LED封裝體的該訊號輸入端子與其前一個該LED封裝體的該訊號輸出端子電性連接。 A display device comprising a driver and a display array, the display array comprising X×Y LED packages as described in any one of claim 1 to claim 7; wherein X is the row of the display array number, Y is the number of columns of the display array; The driver is electrically connected to the signal input terminal of the first LED package for outputting a driving signal to the first LED package; the second LED package to the X×Y-th LED package The signal input terminal of each LED package in the body is electrically connected to the signal output terminal of the preceding LED package. 一種燈具,其包含N個如請求項1至請求項7中的任意一項所述之LED封裝體;其中,N為大於1的整數; N個該LED封裝體中的第1個該LED封裝體的該訊號輸入端子為該燈具的一輸入端,第N個該LED封裝體的該訊號輸出端子為該燈具的一輸出端,第2個該LED封裝體至第N個該LED封裝體中的每一個該LED封裝體的該訊號輸入端子與其前一個該LED封裝體的該訊號輸出端子電性連接。 A lamp, comprising N LED packages according to any one of claim 1 to claim 7; wherein, N is an integer greater than 1; The signal input terminal of the first LED package in the N LED packages is an input terminal of the lamp, the signal output terminal of the Nth LED package is an output terminal of the lamp, and the second LED package is an output terminal of the lamp. The signal input terminal of each of the LED packages from the LED packages to the Nth LED package is electrically connected to the signal output terminal of the preceding LED package. 一種燈光系統,其包含一驅動器和如請求項9所述之燈具; 該驅動器的一輸出端與該燈具的該輸入端電性連接;該驅動器用於向該燈具輸出一驅動訊號。 A lighting system comprising a driver and the lamp as claimed in claim 9; An output end of the driver is electrically connected with the input end of the lamp; the driver is used for outputting a driving signal to the lamp.
TW110210476U 2021-07-23 2021-09-03 LED package, display device, lamp and lighting system TWM621534U (en)

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Publication number Priority date Publication date Assignee Title
TWI871061B (en) * 2023-09-08 2025-01-21 大陸商弘凱光電(江蘇)有限公司 Light-emitting unit and light-emitting panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI871061B (en) * 2023-09-08 2025-01-21 大陸商弘凱光電(江蘇)有限公司 Light-emitting unit and light-emitting panel

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