TWM620524U - Shifting position compensation system using nonlinear model to predict circuit board deformation error - Google Patents

Abstract

This creation provides an offset position compensation system that uses a nonlinear model to predict the deformation error of the circuit board. It includes an image measurement unit, an arithmetic processing unit and a processing unit; the circuit board uses the image measurement unit to measure four samples of local areas The original position of the point is stored, and then a number of power values are set by a non-linear model by the arithmetic processing unit, and the complex prediction positions corresponding to the power values of each sample point are calculated respectively, and the predictions of each sample point are calculated The absolute value average error between the respective positions and the corresponding original positions, the power value corresponding to the smallest absolute value average error is taken as an optimized power value for the processing unit to predict the offset position for comparison The deformed circuit board is processed in an accurate position.

Description

The offset position compensation system for predicting the deformation error of the circuit board using the nonlinear model Unify

This creation is about a circuit board manufacturing process, especially an offset position compensation system that uses a nonlinear model to predict the deformation error of the circuit board.

Under the market demand for light, thin, short and small electronic products, the circuit line width and line spacing of circuit boards have also become smaller. Therefore, the accuracy requirements in the circuit board processing process have also increased, such as high density High Density Interconnector (HDI) printed circuit boards, after the circuit is miniaturized, if the processing accuracy cannot be within the allowable error range, the defect rate of the circuit board will increase. The main reason that the processing accuracy of the circuit board cannot be within the allowable error range is that the circuit board will have uneven stress distribution after the conventional heat pressing process, and then the stress will be gradually released during the cooling process, resulting in the circuit board Produce uneven expansion and contraction deformation, causing non-linear deformation of the image of the circuit board and its internal circuits. At this time, the original center point of the circuit board can no longer be measured and the reference position of the circuit board is shifted, resulting in the confirmation of the target position No benchmarks are available.

In order to solve the above-mentioned problems, the conventional method is to translate the original center of the circuit board before deformation and the geometric center of the circuit board after deformation to coincide with the "center repetition method", and to minimize the error between the targets through rotation to make the circuit The expansion and contraction deformation of the whole board is averaged, thereby predicting the processing position of the internal circuit of the circuit board for offset compensation. However, the deformation of the circuit board after thermal compression is obviously non-linear. The conventional center reconstruction method only averages the overall expansion and contraction deformation of the circuit board, and cannot provide compensation for the deformation error of the local area of the circuit board, resulting in the circuit board In the case of severely uneven expansion and contraction, especially on circuit boards The closer to the local area at the corners, the easier it is to process position errors due to errors caused by deformation in the subsequent manufacturing process, which in turn reduces the process yield. This is the main problem that this creation intends to solve.

The creator of the new type then exhausted his mind to study carefully, and then developed an offset position compensation system that uses a nonlinear model to predict the deformation error of the circuit board, in order to achieve the purpose of accurate processing of the circuit board.

This creation provides an offset position compensation system that uses a nonlinear model to predict the deformation error of a circuit board. The circuit board has an internal circuit, and the circuit board has at least four targets located in the four corners. Suppose a local area has four sample points in at least four corners of the local area. The system includes an image measurement unit, an arithmetic processing unit, and a processing unit. The image measurement unit and the processing unit are respectively It is electrically connected to the arithmetic processing unit, wherein: the image measuring unit measures and stores the original positions of the sample points, each of the sample points is represented by the position of the XY coordinate value; the arithmetic processing unit uses a non-linear model Set a number of power values, calculate the complex predicted positions of each sample point corresponding to these power values, and calculate the average absolute error between the predicted positions of each sample point and the corresponding original position, and calculate The power value corresponding to the smallest of the absolute value average error is taken as an optimized power value; before the circuit board is deformed, it corresponds to a predetermined processing position of the internal circuit in the local area, and is based on the nonlinear model. The optimized power value is calculated to compensate for the corresponding error, so as to predict an offset position of the circuit board after deformation, for the processing unit to process the deformed circuit board at the offset position.

In a preferred embodiment, the image measurement unit includes an X-ray generator, an image sensor, and a memory. The X-ray generator emits rays to penetrate the circuit board, and the image sensor The detector receives the rays penetrating the circuit board to measure the original positions of the plurality of sample points of the circuit board and stores them in the memory.

In a preferred embodiment, the image sensor is a CCD sensor.

In a preferred embodiment, the processing unit is a drill.

In a preferred embodiment, the circuit board is a multi-layer printed circuit board synthesized by two-step hot pressing, and the internal circuit is buried in the circuit board.

In a preferred embodiment, the average error of the absolute value in the corresponding power values is obtained by curve fitting to find the one with the smallest average error of the absolute value.

In a preferred embodiment, the target drilling machine is used to translate the center of the circuit board to coincide with the preset center of the target drilling machine through a centering method, and the four targets are rotated to coincide with the target drilling machine The error between the preset targets is minimized, and the target drilling machine converts the positions of the four targets with the minimized error into a reference for subsequent measurement of the sample points.

In a preferred embodiment, the nonlinear model sets the power values according to a nonlinear position weight equation to calculate the four weight values corresponding to the four sample points, and use the four weights A set of position prediction functions is calculated based on the value, and then the predicted position or the offset position is obtained through a position calculation equation based on the set of position prediction functions.

In a preferred embodiment, the nonlinear position weight equation is:

Among them, N ₁ to N ₄ are the weight values corresponding to the four sample points; a and b are the half lengths of the two adjacent sides of the circuit board; x _i , y _{i are} the values of any points in the local area including the sample points XY coordinate value; k is the set power value.

In a preferred embodiment, the set of position prediction functions is expressed as:

Among them, Δ X _k ( x _i , y _i ) and Δ Y _k ( x _i , y _i ) are the offset of the XY coordinate value when any point of (x _i , y _i ) is k-th power.

In a preferred embodiment, the position calculation equation is expressed as:

Among them, x _i ' and y _i ' are the XY coordinate values corresponding to the predicted position of the arbitrary point.

In a preferred embodiment, the local area is rectangular.

In this way, this creation uses a non-linear model and the setting of several power values to calculate the complex predicted position of each sample point corresponding to these power values, and then calculate the average error of the absolute value between the corresponding original position and the corresponding original position. And the power value corresponding to the smallest of the absolute value average error is taken as the optimized power value. When the processing unit processes the deformed circuit board in a local area corresponding to a predetermined processing position of the internal circuit before deformation, the non-linear model can be used to predict the offset position according to the optimized power value. The processing unit can process the deformed circuit board at the offset position, so as to achieve accurate processing and reduce the defect rate of the circuit board.

100: Compensation system

200: compensation method

201: Acquire the original position of the sample point

202: Calculate the optimal power value

203: Machining according to the predicted offset position

204: Benchmark Conversion

10: Image measurement unit

11: X-ray generator

12: Image sensor

13: Memory

20: Operation processing unit

30: Processing unit

b: circuit board

A~D: target

S1~S4: sample points

T1~T16: test points

Z1~Z4: local area

X, Y: coordinates

x, y: direction

Figure 1 is a block diagram of the compensation system of this creative embodiment.

Figure 2 is a flow chart of the steps of the compensation method of this creative embodiment.

Fig. 3 is a detailed flow chart of the steps of calculating the optimal power value of Fig. 2.

Fig. 4 is a schematic diagram of the distribution of four targets and four local areas on the circuit board of the creative embodiment.

Fig. 5 is a schematic diagram of the distribution of four targets and four sample points in four local areas of the creative embodiment.

Fig. 6 is a schematic diagram of the distribution of four sample points and sixteen test points in the local area in the upper left of Fig. 5. In the figure, the sample points S1~S4 are located in the four corners of the local area, and the test points are marked with numbers T1~T16.

Fig. 7 is a schematic diagram of the distribution of sample points and test points in the upper left partial area of the creative embodiment before and after deformation.

Fig. 8 is an enlarged schematic diagram of the place marked as 1 in Fig. 7.

FIG. 9 is an enlarged schematic diagram of the locations marked as 2 in FIG. 7.

Fig. 10 is a curve fitting diagram of the average error of the absolute value of each power obtained in the partial area on the upper left of the creative embodiment.

Fig. 11 is a curve fitting diagram of the average error of the absolute value of each power obtained in the partial area on the upper right of the creative embodiment.

Fig. 12 is a curve fitting diagram of the average error of the absolute value of each power obtained in the partial area at the lower left of the creative embodiment.

Fig. 13 is a curve fitting diagram of the average error of the absolute value of each power obtained in the partial area at the lower right of the creative embodiment.

In order to fully understand the purpose, features and effects of this creation, we will use the following specific examples and accompanying drawings to give a detailed description of this creation. The description is as follows: please refer to Figures 1 to 13 , This creation provides an offset position compensation system 100 that uses a nonlinear model to predict the deformation error of a circuit board. The compensation system 100, as shown in FIG. 1, includes an image measurement unit 10, an arithmetic processing unit 20, and A processing unit 30, the image measuring unit 10 and the processing unit 30 are respectively electrically connected to the arithmetic processing unit 20. The system 100 is included in a target drilling machine (not shown in the figure) in this embodiment.

The circuit board b has an internal circuit (not shown in the figure). As shown in Figures 4 and 5, the circuit board b of this embodiment has four targets located in the four corners, namely target A, target B, Target C and target D; for ease of description, the circuit board b of this embodiment is preset with four local areas, which are the local area Z1 located on the upper left of the circuit board b, the upper right local area Z2, and the lower left local area Z3 And the partial area Z4 at the lower right, these partial areas Z1 to Z4 are all rectangular (96mm×96mm) in this embodiment.

Continuing, it can be seen in Figure 4 that the selected local areas Z1~Z4 are located at the four corners of the circuit board b and are close to the targets A~D, respectively. However, based on the practical experience of the industry, the circuit board b is heated at the four corners. The expansion and contraction of the corner is the most serious, so in this embodiment, the local area Z1~Z4 is selected for illustration, and the rest of the circuit board b is ignored and not displayed. However, the size and position of the local area described in this creation are not Limited to the above content. In addition, as shown in Figure 5, the circuit board b of this embodiment has four sample points S1~S4 in the four corners of each local area Z1~Z4. The internal circuit (not shown in the figure) of the hot-pressed composite multi-layer printed circuit board is buried in the circuit board b.

The image measurement unit 10, as shown in FIG. 1, includes an X-ray generator 11, an image sensor 12, and a memory 13. In a preferred embodiment, the image sensor 12 is a CCD sensor, and the processing unit 30 is a drill, such as a drill or a laser.

The compensation system 100 of the present creation implements an offset position compensation method 200 that uses a non-linear model to predict the deformation error of the circuit board. As shown in FIG. 2, it mainly includes the original position 201 of the sample point and the calculation optimization step. Steps such as square value 202 and processing 203 based on the predicted offset position, and this embodiment further includes a step of reference conversion 204 before the step of acquiring the original position 201 of the sample point, which is described as follows: the reference conversion 204 The step is that the target drilling machine translates the center of the circuit board b through a centering method, so that the center of the circuit board b coincides with the preset center of the target drilling machine, and then rotates the four targets A~D to The error between the preset targets of the target A~D corresponding to the target drilling machine is minimized, and the target drilling machine converts the positions of the four targets A~D with this minimum error into subsequent measurements The reference of sample points S1~S4 in the local area Z1~Z4. The step of reference conversion 204 is executed, mainly when each circuit board b to be processed is measured by the target drilling machine, if the placement position has a slight deviation of the direction (x direction and/or y direction) and the angle , It will cause errors in the position data provided by the circuit board b after being measured by the target drilling machine, and the original center point of the circuit board b after thermal compression bonding and deformation cannot be determined by measurement, use The step of reference conversion 204 is performed to provide a fixed reference for the circuit board b so that the image position of the internal circuit of the circuit board b can be defined. In this embodiment, after the step of reference conversion 204 is executed, the step of acquiring the original position 201 of the sample point is then executed.

In the step of capturing the original position 201 of the sample point, the image measuring unit 10 captures and stores the original position of the sample point S1~S4. The sample points S1~S4 are represented by the XY coordinate values respectively, so the original The position is represented as ( x _i ,y _i ). In this embodiment, the image measuring unit 10 uses the X-ray generator 11 to emit radiation to penetrate the circuit board b, and uses the image sensor 12 to receive the radiation that penetrates the circuit board b to measure the radiation of the circuit board b. The original positions of the sample points S1~S4 are stored in the memory 13. In this embodiment, after the step of acquiring the original position 201 of the sample point is executed, the step of calculating the optimal power value 202 is then executed.

,

)，並計算各樣本點S1~S4之該預測位置(

,

)和對應的原始位置(x _i ,y _i )間的絕對值平均誤差(誤差值取絕對值後再平均)，以所述絕對值平均誤差中最小者對應之所述次方值取為一最佳化次方值。於一較佳實施例中，所述對應該些次方值中之絕對值平均誤差，係利用曲線擬合找出所述絕對值平均誤差最小者。 In the step of calculating the optimized power value 202, please refer to FIG. 3 again, the calculation processing unit 20 sets a number of power values through a nonlinear model, and respectively calculates the corresponding values of each sample point S1~S4 The predicted position of the complex number of these power values (

,

), and calculate the predicted position of each sample point S1~S4 (

,

) And the corresponding original position ( x _i , y _i ) of the absolute value average error (the error value is taken as the absolute value and then averaged), and the power value corresponding to the smallest of the absolute value average error is taken as one Optimized power value. In a preferred embodiment, the average error of the absolute value in the corresponding power values is obtained by curve fitting to find the one with the smallest average error of the absolute value.

In the step of processing 203 according to the predicted offset position, the circuit board b corresponds to a predetermined processing position of the internal circuit in the local zone Z1~Z4, and the corresponding error is calculated according to the optimized power through the nonlinear model Compensation is performed to predict an offset position of the circuit board after deformation, and the processing unit 30 uses the offset position to process the deformed circuit board b.

In a preferred embodiment, the nonlinear model sets the power values according to a nonlinear position weight equation to calculate the four weight values corresponding to the four sample points S1~S4, and use the A set of position prediction functions is calculated from the four weight values, and the predicted position or the offset position is obtained through a position calculation equation based on the set of position prediction functions.

In a preferred embodiment, the nonlinear position weight equation is:

與

，為樣本點S1~S4的位置與半邊長的比例，利用不同的次方值k，針對所述位置與半邊長的比例部分更改為指數型，故而稱之為非線性位置權重方程式，嘗試在電路板b因壓熱合成型所造成的非線性變形下，來描述局部區域Z1~Z4之樣本點S1~S4的非線性變化，進一步進行電路板b上之任意點在漲縮變形後的位置預測。所述非線性位置權重方程式中，當(x _i ,y _i )=(-a,-b)，且次方值k為偶數次方時，代入

與

兩者作為正負的判斷。 In the non-linear position weight equation, N1 to N4 are the weight values corresponding to the four sample points S1~S4; a and b are the half lengths of the two adjacent sides of the circuit board b; xi and yi are the local area including the The XY coordinate value of any point of the sample points S1~S4; k is the set power value. It must be noted that in the non-linear position weight equation

and

, Is the ratio of the position of the sample points S1 to S4 to the half length, using different power values k, the ratio of the position to the half length is changed to the exponential type, so it is called the nonlinear position weight equation. Try to Under the non-linear deformation of circuit board b caused by the autoclave synthesis type, describe the non-linear change of sample points S1~S4 in the local area Z1~Z4, and further proceed to the position of any point on the circuit board b after expansion and contraction deformation predict. In the non-linear position weight equation, when ( x _i , y _i )=(- a, -b ), and the power value k is an even power, substitute

and

Both are used as positive and negative judgments.

In a preferred embodiment, the set of position prediction functions is expressed as:

In this group of position prediction functions, Δ X _k ( x _i , y _i ) and Δ Y _k ( x _i , y _i ) are the deviation of the XY coordinate value when any point of (x _i , y _i ) is k-th power Shift amount.

In a preferred embodiment, the position calculation equation is expressed as:

Among them, x _i ' and y _i ' are the XY coordinate values corresponding to the predicted position of the arbitrary point.

The following describes the offset position compensation method 200 for predicting the deformation error of the circuit board by using a nonlinear model in this creative embodiment, which is described in a preferred embodiment as follows: As mentioned above, this embodiment is implemented in four local areas of the circuit board b. Z1~Z4 take 4 sample points S1~S4 respectively, and take sixteen test points T1~T16 in the local area Z1~Z4 respectively to perform the calculation and verification of the compensation method 200, as shown in Figure 5. Based on the X and Y axes, the upper left local area Z1 is in the second quadrant, the upper right local area Z2 is in the first quadrant, the lower left local area Z3 is in the third quadrant, and the lower right local area Z4 is in the third quadrant. It is located in the fourth quadrant; take the local area Z1 as an example, as shown in Figure 6, the y direction is positive, the x direction is negative, the local areas Z2~Z4 and so on, the following is the local area located on the upper left of the circuit board b The area Z1 is taken as an example, and the other partial areas Z2 to Z4 are the same as the description of the lower left partial area Z1.

Perform the step of reference conversion 204, the target drilling machine uses a center repositioning method to place the circuit board b so that the center of the circuit board b coincides with the preset center of the target drilling machine, and then rotates four targets A ~D to minimize the error between the preset targets of the target A~D corresponding to the target drilling machine, and then convert the positions of the four targets A~D with this minimum error into the subsequent measurement part The benchmarks of the sample points S1~S4 in the regions Z1~Z4, and the variation of the errors of the targets A~D are shown in Table 1.

In addition, the sample point S1 in Fig. 7 is marked by 1 in the enlarged area of Fig. 8, and the test point T1 in Fig. 7 is marked by 2 in the enlarged area of Fig. 9, respectively. The position distribution of the sample point S1 and the test point T1 before and after the deformation of the circuit board b. The position difference at this time is the error caused by the conventional centering method used when the step of the reference conversion 204 is performed. It can be seen from FIG. 8 that the change value of the sample point S1 in the x direction before and after the deformation of the circuit board b is 0.292 mm, and the change value in the y direction is 0.120 mm. It can also be seen from FIG. 9 that the change value of the test point T1 in the x direction before and after the deformation of the circuit board b is 0.284 mm, and the change value in the y direction is 0.130 mm. In other words, if the processing position of the circuit board b is compensated according to the conventional centering method, it will actually exceed the allowable error range of the industry and be classified as a scrap board.

In the step of calculating the optimal power value 202, the above nonlinear model is used as the basis and a set of power values are set. There are 9 values k, which are {0.1,0.3,0.5,0.7,1.0,2.0, 3.0,5.0,10.0}, here the hypothesis of the secondary defense value of the 9 values k is to observe whether the average error of the sample points S1~S4 has the lowest value within the range of the assumed value k, if there is no lowest value within this range If it appears, it can be adjusted again, so the setting of the number of powers and the value k is not limited to the above example. In addition, the theoretical positions of the four sample points S1 to S4 of the local area Z1 before the circuit board b is deformed are shown in Table 2.

According to the aforementioned set of power values, 9 values k are substituted into the aforementioned nonlinear position weight equation to obtain 9 groups of weight values such as N ₁ , N ₂ , N ₃ and N _{4. The} results are shown in Table 3 to Table 11 shown.

,

)，結果如表12所示。 The sample points S1~S4 of the local zone Z1 on the upper left are substituted into the aforementioned nonlinear position weight equation according to the 9 values k of the set of power values set above, and the set of position prediction functions of the nonlinear model and the position calculation The predicted position after the equation is calculated (

,

), the results are shown in Table 12.

,

)與對應的原始位置(x _i ,y _i )計算出絕對值平均誤差，四個樣本點S1~S4對應的原始位置(x _i ,y _i )如表13所示，各樣本點S1~S4與對應的原始位置的誤差如表14所示，局部區域Z1對應各次方值的絕對值平均誤差如表15所示。所述絕對值平 均誤差，係如表14中四個樣本點的預測位置(

,

)與對應的原始位置(x _i ,y _i )於不同次方值之誤差，先取絕對值，再將各次方值之誤差取平均值。 Next, calculate the predicted positions (

,

) And the corresponding original positions ( x _i , y _i ) to calculate the average absolute value error. The original positions ( x _i , y _i ) corresponding to the four sample points S1~S4 are shown in Table 13. Each sample point S1~S4 The error from the corresponding original position is shown in Table 14, and the average error of the absolute value corresponding to each power value of the local zone Z1 is shown in Table 15. The average error of the absolute value is the predicted position of the four sample points in Table 14 (

,

) And the corresponding original position ( x _i , y _i ) in different powers of error, first take the absolute value, and then take the average of the error of each power.

,

)與原始位置(x _i ,y _i )的誤差，橫軸為假設的次方值，其中之長條部分為分別表示各次方值下所計算的預測位置(

,

)在x方向之誤差，以及各次方值下所計算的預測位置(

,

)在y方向之誤差，圖10至圖13中以黑點所在之處表示為曲線擬合的最低點。將各局部區域Z1~Z4的曲線擬合結果進行一次微分後求得絕對值平均誤差的最小值，如表16所示。從圖10至圖13四個局部區域Z1~Z4在x方向與y方向所求得之數值k皆不相同，表示本創作之非線性模型可針對電路板b任意設定之局部區域的內部電路圖象進行x方向與y方向各自的位置預測，也進一步顯示電路板b確實呈現非線性的漲縮變形。 Then, curve fitting is performed on the average error distribution of the absolute value corresponding to the k value of each power number of the four sample points S1~S4 in each local area to find the optimal power value, as shown in Figure 10 to Figure 13 , Respectively represent the upper left local area Z1, the upper right local area Z2, the lower left local area Z3, and the lower right local area Z4. The vertical axis in Figure 10 to Figure 13 is the predicted position (

,

) And the original position ( x _i , y _i ), the horizontal axis is the hypothetical power value, and the long bars represent the predicted position calculated under each power value (

,

) The error in the x direction and the predicted position calculated under each power value (

,

) The error in the y direction is shown as the lowest point of the curve fitting in Figure 10 to Figure 13 where the black dot is located. The curve fitting results of each local area Z1~Z4 are differentiated once to obtain the minimum value of the absolute value average error, as shown in Table 16. From Fig. 10 to Fig. 13 the four local areas Z1~Z4 have different values k obtained in the x direction and y direction, indicating that the non-linear model of this creation can be arbitrarily set for the internal circuit image of the local area of the circuit board b Predicting the respective positions in the x-direction and the y-direction also further shows that the circuit board b does exhibit nonlinear expansion and contraction deformation.

Calculate the optimal power values (x, y direction) of the four sample points S1~S4 of the above-mentioned local regions Z1~Z4 after curve fitting, and then further define the tenth value in each local region Z1~Z4. The six test points T1~T16 are verified with the obtained optimal power values to verify the effectiveness of the compensation method 200 of this creation through the nonlinear model. Here is an explanation: The optimized power value (x, y direction) of the sample points S1~S4 after curve fitting, and the original position ( x _i ,y _i ) corresponding to each test point T1~T16 before the deformation, respectively Among the parameters of the numerical values k and xi and yi in the nonlinear position weight equation, the weight values N ₁ , N ₂ , N ₃ corresponding to each test point T1 to T16 can be obtained through the nonlinear position weight equation. With N ₄ . Taking the local area Z1 on the upper left as an example, the original position ( x _i ,y _i ) corresponding to each test point T1~T16 before deformation is shown in Table 17. The weight of each test point T1~T16 in the x and y directions The values N ₁ , N ₂ , N ₃ and N _{4 are} shown in Table 18 and Table 19, and the calculation of the results of the remaining local areas Z2~Z4 is based on the lower left local area Z1.

,

)，如表20所示。 Next, calculate the weight values N ₁ , N ₂ , N ₃ and N ₄ corresponding to each test point T1~T16, and the errors of the four targets in the x and y directions after the reference conversion as shown in Table 1. The change value is substituted into the set of position prediction functions to obtain Δ X _k ( x _i , y _i ), Δ Y _k ( x _i , y _i ), and then the obtained Δ X _k ( x _i , y _i ) , Δ Y _k ( x _i , y _i ) is substituted into the position calculation equation to obtain the predicted position (

,

), as shown in Table 20.

,

)與對應的原始位置(x _i ,y _i )計算出絕對值平均誤差，局部區域Z1中十六個測試點T1~T16與對應的原始位置的誤差如表21所示，本創作利用非線性模型之補償方法與中心重合法之誤差補償結果比較如表22所示。 Next, calculate the predicted positions of the sixteen test points T1~T16 in the upper left local area Z1 (

,

) And the corresponding original position ( x _i , y _i ) to calculate the average absolute value error. The error between the sixteen test points T1~T16 in the local zone Z1 and the corresponding original position is shown in Table 21. This creation uses nonlinearity The comparison between the compensation method of the model and the error compensation result of the center weighting method is shown in Table 22.

,

)之絕對值平均誤差皆相對降低，且表22中也可見左上之局部區域Z1之x方向的誤差有最大改善，其誤差從中心重合法的0.2519mm降低至0.0084mm，改善程度高達96.67%。 As shown in Table 22, the test points T1~T16 of each local area S1~S4 of the circuit board b. After this creation, the compensation method 200 using the nonlinear model is compared with the error compensation result of the conventional center reconstruction method. The test points T1~T16 in areas S1~S4 are in the predicted position (

,

The average error of the absolute value of) is relatively reduced, and it can be seen in Table 22 that the error in the x-direction of the upper left local zone Z1 has the greatest improvement. The error is reduced from 0.2519mm in the center offset to 0.0084mm, which is an improvement of 96.67%.

,

)，再經計算和對應的原始位置(x _i ,y _i )間的絕對值平均誤差，而以絕對值平均誤差中最小者對應之次方值取為最佳化次方值，而由上述測試點之驗證，本創作透過非線性模型及若干次方值之設定的補償，確實能大幅改善習知中心重點法之誤差補償不準確的問題，亦可證明當加工單元30對變形後的電路板b於局部區域Z1~Z4內對應於內部電路預定之一加工位置進行加工時，可透過該非線性模型依該最佳化次方值預測偏移位置，加工單元30能夠以該偏移位置對變形後之該電路板b進行加工，以達到加工準確而降低電路板之不良率的功效。 From the above description, it is not difficult to find that the characteristic of this creation is that this creation is based on the nonlinear model and the setting of certain power values to calculate the complex prediction positions of each sample point S1~S4 corresponding to these power values (

,

), and then calculate the absolute average error between the corresponding original position (x _i , y _i ), and take the power value corresponding to the smallest of the absolute average error as the optimized power value, and from the above The verification of the test points, this creation through the compensation of the nonlinear model and the setting of several power values, can indeed greatly improve the inaccuracy of the error compensation of the conventional center-point method, and it can also prove that the processing unit 30 affects the deformed circuit When the board b is processed in the local zone Z1~Z4 corresponding to a predetermined processing position of the internal circuit, the offset position can be predicted according to the optimized power value through the nonlinear model, and the processing unit 30 can use the offset position to The deformed circuit board b is processed to achieve accurate processing and reduce the defect rate of the circuit board.

This creation has been disclosed in a preferred embodiment above, but those familiar with this technology should understand that this embodiment is only used to describe the creation, and should not be construed as limiting the scope of this creation. It should be noted that all changes and replacements equivalent to this embodiment should be included in the scope of this creation. Therefore, the scope of protection of this creation shall be subject to the scope of the patent application.

100: Compensation system

10: Image measurement unit

11: X-ray generator

12: Image sensor

13: Memory

20: Operation processing unit

30: Processing unit

Claims (12)

An offset position compensation system that uses a nonlinear model to predict the deformation error of a circuit board. The circuit board has an internal circuit, and the circuit board has at least four targets located in four corners, and a part of the circuit board is preset Area, and at least four sample points in the four corners of the local area. The system includes an image measurement unit, an arithmetic processing unit, and a processing unit. The image measurement unit and the processing unit are respectively associated with the arithmetic The processing unit is electrically connected, wherein: the image measuring unit measures and stores the original positions of the sample points, each of the sample points is represented by the position of the XY coordinate value; the calculation processing unit is set several times through a nonlinear model Calculate the complex predicted position of each sample point corresponding to the power value, and calculate the average error of the absolute value between the predicted position of each sample point and the corresponding original position, and use the absolute value The power value corresponding to the smallest of the average error is taken as an optimized power value; before the circuit board is deformed, it corresponds to a predetermined processing position of the internal circuit in the local area, and the nonlinear model is used according to the optimum The squared value is calculated to compensate for the corresponding error, so as to predict an offset position of the circuit board after deformation, and the processing unit can process the deformed circuit board at the offset position. The offset position compensation system using a nonlinear model to predict the deformation error of a circuit board as described in claim 1, wherein the image measurement unit includes an X-ray generator, an image sensor, and a memory, and the X The light generator emits rays and penetrates the electricity The circuit board receives the rays penetrating the circuit board with the image sensor to measure the original positions of the plurality of sample points of the circuit board and store them in the memory. The offset position compensation system using a nonlinear model to predict the deformation error of the circuit board as described in claim 2, wherein the image sensor is a CCD sensor. The offset position compensation system for predicting the deformation error of the circuit board by using a nonlinear model as described in claim 1, wherein the processing unit is a drill. The offset position compensation system for predicting the deformation error of the circuit board using a nonlinear model as described in claim 1, wherein the circuit board is a multilayer printed circuit board synthesized by secondary heat pressing, and the internal circuit is buried in the circuit board middle. The offset position compensation system that uses a nonlinear model to predict the deformation error of a circuit board as described in claim 1, wherein the average error of the absolute value in the corresponding power values is found by curve fitting The value with the smallest average error. The offset position compensation system for predicting the deformation error of the circuit board using a nonlinear model as described in claim 1, wherein the target drilling machine is used to translate the center of the circuit board to the preset value of the target drilling machine through a center repositioning method. The centers of the four targets coincide, and the four targets are rotated to minimize the error with the target preset by the target drilling machine. The target drilling machine converts the positions of the four targets with the minimum error to the subsequent The benchmark for measuring these sample points. The offset position compensation system using a nonlinear model to predict a circuit board deformation error according to any one of claims 1 to 7, wherein the nonlinear model is set to the power value according to a nonlinear position weight equation , To calculate the four weight values corresponding to the four sample points, and use the four weight values to calculate a set of position prediction functions According to the set of position prediction functions, the predicted position or the offset position is obtained through a position calculation equation. The offset position compensation system using a nonlinear model to predict the deformation error of a circuit board as described in claim 8, wherein the nonlinear position weight equation is:

Among them, N ₁ to N ₄ are the weight values corresponding to the four sample points; a and b are the half lengths of the two adjacent sides of the circuit board; x _i , y _{i are} the values of any points in the local area including the sample points XY coordinate value; k is the set power value. The offset position compensation system using a nonlinear model to predict the deformation error of a circuit board as described in claim 9, wherein the set of position prediction functions are expressed as:

Among them, Δ X _k ( x _i , y _i ) and Δ Y _k ( x _i , y _i ) are the offset of the XY coordinate value when any point of (x _i , y _i ) is k-th power. The offset position compensation system using a nonlinear model to predict the deformation error of a circuit board as described in claim 10, wherein the position calculation equation is expressed as:

Among them, x _i ' and y _i ' are the XY coordinate values corresponding to the predicted position of the arbitrary point. The offset position compensation system using a non-linear model to predict the deformation error of the circuit board as described in claim 1, wherein the local area is rectangular.

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