TWM619779U - Image capture device - Google Patents

Abstract

An image capture device has a transparent substrate, a light source disposed under the transparent substrate, a light absorbing layer disposed on the surface of the transparent substrate, a bonding layer disposed under the transparent substrate, a light sensing unit disposed under the transparent substrate and a panel module disposed under the bonding layer, wherein the light source emits light beams passing through the light absorbing layer then projecting to the transparent substrate.

Description

Imaging device

This creation is related to an imaging device for acquiring biometric images, and in particular, an optical imaging device that can be installed in a display panel.

Fingerprint recognition devices are divided into capacitive and optical types. Capacitive fingerprint recognition devices mainly record fingerprint characteristics through changes in the capacitance of multiple touch points, while optical fingerprint recognition devices directly obtain fingerprint images to record fingerprint characteristics. . Capacitive fingerprint recognition devices are susceptible to moisture or other electronic noises, and have misjudgment problems. Furthermore, if electronic devices (such as smartphones or tablets) using capacitive fingerprint recognition devices have items such as protective stickers or tempered glass attached, the capacitive fingerprint recognition devices may not be able to recognize fingerprints.

Although the optical fingerprint recognition device can solve the technical problem that the fingerprint cannot be recognized due to the protective sticker or tempered glass, the imaging device in the existing optical fingerprint recognition device still has a large area and is used in handheld devices Time affects the screen's beauty and vision. In addition, for the miniaturization requirements and trends of electronic devices, the imaging device must also be miniaturized (that is, the volume needs to be smaller and the thickness needs to be thinner). However, even if the imaging device becomes thinner, the imaging device After being attached to the display device, it still causes a technical problem of increased thickness.

Based on at least one of the foregoing objectives, this creation provides an image capturing device that includes a light-transmitting substrate, a light-absorbing layer on the surface of the light-transmitting substrate, a light source arranged under the light-transmitting substrate, and The photosensitive unit under the light-transmitting substrate, the bonding layer provided under the light-transmitting substrate, and the panel module provided under the bonding layer, wherein the light source is used to emit a light beam, and the The light beam is projected to the light-transmitting substrate through the bonding layer. The finger to be identified is placed on the light-transmitting substrate, and the light beam is received by the photosensitive unit after being reflected.

In one of the embodiments, the light-transmitting substrate is divided into a display area, an inner frame area, and an outer frame area. The bonding layer has a first surface and a second surface opposite to the first surface; the first surface of the bonding layer is bonded to the display area and the inner frame area of the light-transmitting substrate. The two surfaces are bonded to the panel module; the inner frame area of the light-transmitting substrate covers the edge of the bonding layer, and the light source is arranged under the outer frame area and outside the bonding layer.

In one of the embodiments, the refractive index of the bonding layer is less than the refractive index of the transparent substrate. The incident angle of the light beam entering the light-transmitting substrate can be adjusted by changing the refractive index of the laminating layer, and total reflection can be generated to realize full-screen fingerprint recognition.

In one of the embodiments, the thickness of the light-transmitting substrate is greater than the thickness of the bonding layer, which has better mechanical strength to protect the panel module.

In order to make the above and other purposes, features and advantages of this creation more obvious and understandable, with the attached illustrations, the detailed description is as follows.

In order to fully understand the purpose, features and effects of this creation, the following specific embodiments are used to give a detailed description of this creation in conjunction with the accompanying drawings. The description is as follows.

First, please refer to FIG. 1, which is a schematic top view of an image capturing device 10, which can be divided into a display area 110 and a frame area 120. In this embodiment, the image capturing device 10 may be a mobile phone. The larger the area ratio of the display area 110 to the front of the mobile phone, the larger the screen field of view of the mobile phone. Therefore, driven by full-screen mobile phones, high screen ratio has become a screen display technology that many manufacturers are committed to making breakthroughs. The screen-to-body ratio is the ratio of the displayable area of the mobile phone screen to the area of the overall front of the mobile phone, that is, the screen-to-body ratio=display area 110/(display area 110+frame area 120). In the fingerprint recognition technology (FID, fingerprint in display) of the screen, some technologies require optical components to be placed under the frame area 120, and the width of the frame area is enlarged, resulting in a smaller screen-to-body ratio, which does not conform to the narrow frame trend. . In order to solve this problem, the author provides a technical solution to realize a full-screen mobile phone with extremely narrow bezel, close to no bezel.

Please refer to FIG. 2A and FIG. 2B, which are respectively a schematic plan view and a cross-sectional view of an image capturing device 20. In this embodiment, the image capturing device 20 includes: a light-transmitting substrate 200, which is divided into a display area 210, an inner frame area 221, and an outer frame area 222; a first light-absorbing layer 230 is located in the inner frame area of the light-transmitting substrate 200 221 and the outer frame area 222; the first light source 250 is arranged under the light-transmitting substrate 200; the photosensitive unit 270 is arranged under the light-transmitting substrate 200; the bonding layer 240 is arranged on the light-transmitting substrate 200, it has a first surface 241 and a second surface 242 opposite to the first surface; the panel module 260 is disposed under the bonding layer 240; wherein, the second surface of the bonding layer 240 A surface 241 is bonded to the inner frame area 221 and the display area 210 of the light-transmitting substrate 200, and the second surface 242 is bonded to the panel module 260; wherein, the inner frame area of the light-transmitting substrate 200 221 covers the edge of the bonding layer 240; and wherein, the first light source 250 is used to emit a light beam, and the light beam is projected to the light-transmitting substrate 200 through the bonding layer 240 to allow the imaging device 20 The light beam reflected by the object (for example, a finger, but not limited by this) is absorbed by the photosensitive unit 270 to complete the biometric identification (Biometric Identification).

Basically, the display area 210 of the light-transmitting substrate 200 can be used as a sensing area. The outer frame area 222 of the transparent substrate 200 is located at the outermost edge, and the inner frame area 221 connects the outer frame area 222 and the display area 210.

In this embodiment, the width of the inner frame area 221 and the outer frame area 222 can be changed to adjust the angle of the incident light beam and shield the stray light. And the inner frame area 221 covers the edge of the bonding layer 240 to avoid affecting the display.

In an embodiment, the first light absorbing layer 230 may be a light absorbing material such as a black matrix (Black Matrix). Therefore, by using the light path design of the first light source 250 with the transparent substrate 200, the first light absorption layer 230 and the bonding layer 240, a light channel as shown in FIG. 2B can be formed, so that the light beam can be concentrated in this specific light channel, The bonding layer 240 is projected to the light-transmitting substrate 200, so that the light is efficiently irradiated on the object to be sensed, and then transmitted to the photosensitive unit 270 by reflection to achieve biological feature imaging.

In this embodiment, there is no need for additional optical elements to adjust the light path, which saves the space of the mechanism and conforms to the trend of narrow frame. The photosensitive unit 270 is disposed in the panel module 260, and there is no need to add a multi-layer collimator (Collimator) design, and the cost is low, and the aperture ratio of the display panel is not reduced and the display quality is not affected.

In one embodiment, the refractive index of the transparent substrate 200 is greater than the refractive index of the bonding layer 240. When the ratio (n1/n2) of the refractive index n1 of the bonding layer 240 to the refractive index n2 of the transparent substrate 200 is between 0.886 and 0.995, the detection rate data can reach the identification level. The preferable range of n1/n2 ratio is 0.900~0.995.

In one embodiment, the thickness of the light-transmitting substrate 200 is greater than the thickness of the bonding layer 240, which can protect the panel module with better mechanical strength. In an embodiment, the light-transmitting substrate 200 may be a light-transmitting surface cover such as a cover glass (Cover Glass). In a preferred embodiment, the thickness of the transparent substrate 200 is between 100 um and 10 mm, which has a better protection effect. In one embodiment, the bonding layer 240 may be a light-transmitting material such as Optically Clear Adhesive. In another embodiment, the thickness of the bonding layer 240 is between 10 um and 1 mm, which has less light loss.

In addition, the photosensitive unit 270 of this example is provided in the panel module 260, but this creation is not limited by this. In addition to being arranged in the panel module, the photosensitive unit can also be arranged outside of the panel module.

Please refer to FIG. 3, in the image capturing device 30 of this embodiment, the photosensitive unit 370 is disposed outside the panel module 360. In one embodiment, the photosensitive unit 370 may be a collimator (Collimator) photosensitive module, an optical lens photosensitive module (Lens Module), a complementary metal oxide semiconductor (CMOS) photosensitive module, or a photodiode. Wait for any module that can be photosensitive and imaged. In one embodiment, the panel module 360 may be a display panel such as a liquid crystal panel (LCD), an active matrix organic light emitting panel (AMOLED), a passive matrix organic light emitting panel (PMOLED), a mini light emitting diode panel (Mini LED), Display panels such as Micro LED panels. In an embodiment, the wavelength of the first light source 250 is different from the wavelength of the light emitted by the panel module 360.

Please refer to FIG. 4, in the image capturing device 40 of this embodiment, the second light-absorbing layer 231 is further included on the side of the panel module 260 on the same side as the first light source 250. A second light-absorbing layer 231 is plated on the side of the panel module 260, such as a light-absorbing material such as a black matrix (Black Matrix), to absorb stray light, so as to prevent the stray light from entering the photosensitive unit 270 to affect image recognition.

5, in the image capturing device 50 of this embodiment, the panel module 560 includes: a first light-transmitting part 561, a second light-transmitting part 562, and a backlight module 563 (BLU, Back Light Unit). In one embodiment, the first light-transmitting component 561 includes a polarizer (POL, Polarizer) and a color filter (CF, Color Filter). In one embodiment, the second light-transmitting component 562 includes: Thin Film Transistor liquid crystal (TFT) and Polarizer (POL).

Please refer to FIG. 6, in the image capturing device 60 of this embodiment, a flexible printed circuit board 680 is further included. When the flexible printed circuit board (FPC, Flexible Printed Circuit) has covered the second light-transmitting part 562 of the panel module 560 and the backlight module 563, only the side of the first light-transmitting part 561 can be plated with the second The light-absorbing layer 231, such as a light-absorbing material such as a black matrix (Black Matrix) to absorb stray light, can prevent the stray light from entering the photosensitive unit 270 to affect image recognition.

7A and 7B, in the image capturing device 70 of this embodiment, the first light source 750 is located on one outer side of the bonding layer 240, and the photosensitive unit 770 is located on the other relatively outer side of the bonding layer 240; The first light absorbing layer 230 is located on the inner frame area 221 and the outer frame area 222 on the same side of the first light source 750; and the third light absorbing layer 232 is located on the inner frame area 221 and the outer frame area on the same side of the photosensitive unit 770. The surface of the frame area 222; wherein the inner frame area 221 covers the edge of the bonding layer 240; wherein, the first light source 750 is used to emit a light beam, and the light beam is projected to the bonding layer 240 through the bonding layer 240 The light-transmitting substrate 200 allows the light beam reflected by an object (for example, a finger, but not limited to this) on the image capturing device 70 to be absorbed by the photosensitive unit 770 to complete biometric identification.

In this embodiment in which the photosensitive unit 770 is located on the side, the thickness of the image capturing device 70 can be made thinner to meet the trend of lighter, thinner, shorter handheld device. The third light-absorbing layer 232 can only absorb light with a wavelength different from that of the first light source 750, and let light with the same wavelength as the first light source 750 pass. For example, if the first light source 750 is infrared (IR), the third light-absorbing layer 232 is a light-absorbing material that can pass infrared (IR pass). Therefore, the third light-absorbing layer 232 can be designed correspondingly according to the wavelength of the first light source 750 of visible light or non-component light.

Incidentally, although the light-absorbing layer shown in the embodiment of this creation is attached to the lower surface of the light-transmitting substrate, this creation is not limited to this. In other embodiments, the light-absorbing layer may be located on the upper surface of the light-transmitting substrate.

Please refer to FIG. 8, which is a schematic top view of an image capturing device 80. In this embodiment, there are a first light source 850, a second light source 851, and a third light source 852 below the outer frame area 222. Multiple light sources can increase the image width, enabling multi-finger recognition. Since mobile phones are now loaded with more and more personal personal information, in one embodiment, three fingers can be used to perform fingerprint recognition on the display area of the mobile phone at the same time, which greatly increases security.

In other embodiments, a filter layer may be placed on the photosensitive unit; the filter layer has the function of filtering specific wavelengths, and the light reflected by the transparent substrate passes through the filter layer and is absorbed by the photosensitive unit.

In general, this creation provides a number of imaging devices of different embodiments, the structure of the imaging device is not high, and easy to implement, in line with the advantages of light, thin, short, and small in existing electronic devices.

This creation has been disclosed in preferred embodiments above, but those familiar with this technology should understand that the above-mentioned embodiments are only used to describe the creation, and should not be interpreted as limiting the scope of this creation. It should be noted that all changes and replacements equivalent to the foregoing embodiments should be included in the scope of this creation.

10, 20, 30, 40, 50, 60, 70, 80: imaging device 110, 210: display area 120: Border area 200: Transparent substrate 221: inner border area 222: Outer border area 230: the first light-absorbing layer 231: second light-absorbing layer 232: third light-absorbing layer 240: Laminated layer 241: First Surface 242: second surface 250, 750, 850: the first light source 260, 360, 560: Panel module 270, 370, 770: photosensitive unit 561: The first light-transmitting part 562: second light-transmitting part 563: Backlight module 680: Flexible printed circuit board 851: second light source 852: Third Light Source F: Finger

Fig. 1 is a schematic top view of an image capturing device.

2A and 2B are schematic top and cross-sectional views of the image capturing device according to an embodiment of the invention.

Fig. 3 is a schematic diagram of an image capturing device according to an embodiment of the present creation.

Fig. 4 is a schematic diagram of an image capturing device according to an embodiment of the present creation.

Fig. 5 is a schematic diagram of an image capturing device according to an embodiment of the present creation.

Fig. 6 is a schematic diagram of an image capturing device according to an embodiment of the present creation.

7A and 7B are schematic top and cross-sectional views of an image capturing device according to an embodiment of the invention.

Fig. 8 is a schematic top view of the image capturing device according to an embodiment of the present creation.

20: Capture device

200: Transparent substrate

230: the first light-absorbing layer

240: Laminated layer

241: First Surface

242: second surface

250: light source

260: Panel Module

270: photosensitive unit

Claims (16)

An image capturing device includes: a light-transmitting substrate divided into a display area, an inner frame area, and an outer frame area; a first light-absorbing layer located in the inner frame area and the outer frame area of the light-transmitting substrate; and a first light source , Arranged under the light-transmitting substrate; a photosensitive unit arranged under the light-transmitting substrate; a bonding layer arranged under the light-transmitting substrate, which has a first surface and the A second surface opposite to the surface; and a panel module set under the bonding layer; wherein the outer frame area is the outermost edge of the light-transmitting substrate, and the inner frame area is connected to the The display area and the outer frame area; wherein the first surface of the bonding layer is bonded to the display area and the inner frame area of the light-transmitting substrate, and the second surface is bonded to the panel module Wherein, the inner frame area of the light-transmitting substrate covers the edge of the bonding layer; and wherein, the first light source is used to emit a light beam, and the light beam is projected to the light-transmitting substrate through the bonding layer . The imaging device according to claim 1, wherein the first light source is located on the outer side of the bonding layer and below the outer frame area. The imaging device according to claim 2, further comprising a second light-absorbing layer located on the side of the panel module on the same side as the first light source. In the imaging device according to claim 2, the photosensitive unit is located on the other side opposite to the position of the first light source, and located on the outer side of the laminating layer and below the outer frame area. In the imaging device according to claim 1, the refractive index of the light-transmitting substrate is greater than the refractive index of the bonding layer. According to the imaging device according to claim 5, the ratio of the refractive index of the bonding layer to the refractive index of the light-transmitting substrate is between 0.886 and 0.995. According to the imaging device according to claim 1, the thickness of the light-transmitting substrate is greater than the thickness of the bonding layer. According to the imaging device according to claim 7, the thickness of the transparent substrate is between 100um and 10mm. According to the imaging device described in claim 7, the thickness of the bonding layer is between 10um and 1mm. According to the imaging device of claim 1, the panel module includes: a first light-transmitting component; and a second light-absorbing layer; wherein the first light source is located on one of the outer sides of the bonding layer, And the second light-absorbing layer covers the side of the first light-transmitting component on the same side as the first light source. According to the imaging device of claim 1, the panel module includes: a first light-transmitting component; a second light-transmitting component; a second light-absorbing layer; and A flexible printed circuit board; wherein the first light source is located on one of the outer sides of the bonding layer, and the second light-absorbing layer covers the side of the first light-transmitting component and the first light source on the same side And the flexible printed circuit board covers the side of the second light-transmitting component on the same side as the first light source. In the imaging device according to claim 1, the wavelength of the first light source is different from the wavelength of the light emitted by the panel module. The imaging device according to claim 12, further comprising a filter layer disposed on the photosensitive unit, and the light beam emitted by the first light source is projected to the photosensitive unit after passing through the filter layer . The imaging device according to claim 1, further comprising a second light source disposed under the transparent substrate and located on the same outer side of the bonding layer as the first light source. An image capturing device, comprising: a light-transmitting substrate divided into a display area, an inner frame area, and an outer frame area; a first light-absorbing layer; a third light-absorbing layer; a first light source arranged on the light-transmitting substrate Under; a photosensitive unit arranged under the light-transmitting substrate; a bonding layer arranged under the light-transmitting substrate, which has a first surface and a second surface opposite to the first surface; and A panel module set under the bonding layer; Wherein, the outer frame area is the outermost edge of the transparent substrate, and the inner frame area is connected to the display area and the outer frame area; wherein, the first surface of the laminating layer is connected to the The display area and the inner frame area of the light-transmitting substrate are bonded, and the second surface is bonded to the panel module; wherein, the inner frame area of the light-transmitting substrate covers the edge of the bonding layer; wherein, The first light source is located on one of the outer sides of the bonding layer, and the first light-absorbing layer is located on the surface of the inner frame area and the outer frame area on this side; wherein, the photosensitive unit is located opposite to the first light source On the other outer side of the laminating layer, the third light-absorbing layer is located on the surface of the inner frame area and the outer frame area on this side; and wherein, the first light source is used to emit a light beam, and the light beam passes through the The bonding layer is projected onto the light-transmitting substrate. The imaging device according to claim 15, wherein the third light-absorbing layer can pass light of the same wavelength as the first light source.

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