TWM619150U - Tray turning module of chip inspection device - Google Patents

Abstract

A material tray turning module of a wafer inspection device, comprising: a bearing platform; a lifting platform; a positive material tray temporary platform for placing the material tray in an upward direction; and a reverse tray temporary platform , For a material tray to be placed in a direction with the carrying surface facing down; a flipping fixture, having a flipping drive device and two clamping arms, the flipping drive device drives the two clamping arms to relatively open or clamp, and the The turning drive device drives the two clamping arms to turn together. When the turning jig approaches the lifting platform, one of the clamping arms is located on one side of the lifting platform and below the material tray; and a transfer jig having At least two clamping jaws clamp or release a material tray, and can move between the positive material tray temporary holding table, the inverted material tray temporary holding table and the bearing platform.

Description

Tray turning module of chip inspection device

This creation is related to the wafer inspection device, in particular to the tray turning module of a wafer inspection device.

Most of the currently known wafer inspection technologies are to take an image of the surface of the wafer and compare it with the sample through image processing to determine whether the wafer is normal. This technology is well known. However, some wafers need to be inspected on both the upper and lower sides. This kind of wafer requires flipping technology to process the wafer so that the wafer after the top surface inspection is turned over, and then the backside of the wafer can be inspected.

my country's I718594 patent discloses a wafer inspection machine and a wafer inspection method. In this case, the technology of flipping the wafer is mainly to use a wafer extraction mechanism to extract one of the multiple wafers in the wafer tray, and it can also Use this wafer picking mechanism to flip the wafer, and then move the wafer scanning mechanism to the top of the wafer tray and above the wafer extracted by the wafer picking mechanism, and the wafers in the wafer tray and the wafer picking mechanism The extracted wafer is scanned.

The aforementioned conventional technology has its inconveniences in actual use, that is, when all the wafers on the wafer tray need to be turned over for scanning, with this technology, the wafer extraction mechanism must be used one by one. It is a very time-consuming and cost-consuming method to flip and scan, which cannot meet the fast and accurate needs of the industry.

The main purpose of this creation is to propose a tray turning module of a wafer inspection device, which can turn all the wafers in the entire tray at a time, so that the wafers that need to be inspected on both sides can be inspected quickly.

In order to achieve the above purpose, this creation proposes a tray turning module of a wafer inspection device, which is installed in a wafer inspection device for turning over two trays of the same size that are stacked opposite each other. The tray turning mold of the wafer inspection device The set includes: a bearing platform for receiving a material tray; a lifting platform, driven by a lifting drive device to lift, so as to lift or lower the material tray from the bottom surface of the material tray, the lifting platform is lowered The lower position is adjacent to the bearing platform and its top surface is not higher than the surface of the bearing platform, where the lifting platform does not completely cover the bottom surface of the tray; a positive tray temporary platform has at least one bearing area, For placing the tray with the supporting surface facing upwards; for placing the tray with at least one supporting area, and for placing the tray with the supporting surface facing downwards; for placing the tray with the supporting surface facing downwards; and for placing the tray with a turning over A driving device and two clamping arms. The turning drive device drives the two clamping arms to relatively open or clamp relatively, and the turning drive device drives the two clamping arms to turn together, and the turning jig is driven by a moving platform When moving closer to or away from the lifting platform, when the turning jig moves closer to the lifting platform, a clamping arm is located on one side of the lifting platform and under the tray; and a transfer jig having at least two The clamping jaw clamps or releases a material tray, and can move between the positive material tray temporary setting table, the inverted material tray temporary setting table and the bearing platform.

With the above technical features, this creation can achieve the effect of turning the multiple chips carried by the tray all at once, so that the chips that need to be inspected on both sides can be inspected quickly, which improves the need for each wafer in the prior art. The time-consuming and cost-intensive problem of flipping inspection.

In order to explain in detail the technical features of this creation, the following preferred embodiments are described in conjunction with the drawings, in which:

As shown in Figures 1 and 2, the tray turning module 10 of a wafer inspection device proposed in a preferred embodiment of the present creation is installed in a wafer inspection device 90 for turning over oppositely stacked and the same size Two trays 81. The tray turning module 10 of the wafer inspection device is mainly composed of a supporting platform 11, a lifting platform 21, a positive tray temporary platform 31, an inverting tray temporary platform 41, a turning fixture 51, and a Composed of transfer fixture 61, of which:

The bearing platform 11 can be configured to have a hollow portion 12 in actual implementation. In this embodiment, the hollow portion 12 is rectangular. In this embodiment, the platform 11 is a part of the inspection platform (not shown in the figure) of the wafer inspection device 90 itself.料盘81。 Material tray 81. In addition, the bearing platform 11 has a plurality of retaining walls 14, and when the bearing platform 11 places a tray 81 on the bearing platform 11, the tray 81 abuts against the edge of the retaining wall 14.

The lifting platform 21 is driven by a lifting driving device 22 to lift up and down, thereby lifting or lowering the material tray 81 from the bottom surface of the material tray 81. The lifting platform 21 is located in the hollow portion 12 when it is lowered to the lower position. And the top surface is not higher than the top surface of the bearing platform 11, so as to be adjacent to the bearing platform. The width of the lifting platform 21 is smaller than the width of the tray 81. As a result, the lifting platform 21 That is, the bottom surface of the tray 81 will not be completely covered. In this embodiment, the lifting platform 21 is rectangular, and when a tray 81 is placed on the supporting platform 11, a part of the tray 81 is located above the lifting platform 21, and the tray 81 is wider than Part of the lifting platform 21 is carried by the bearing platform 11. The aforementioned hollow portion 12 and the lifting platform 21 are rectangular in shape only for example, and are not used to limit their shapes. Other shapes that are available for manufacturing can also be used.

The positive tray temporary placing table 31 has three bearing areas 32 for placing a tray 81 with the bearing surface facing upward. The tray 81 placed on the positive tray temporary placing table 31 usually has a plurality of grooves (not shown in the figure) on its carrying surface to carry and position the plurality of wafers 82. In this embodiment, the three load-bearing areas 32 are all rectangular, and the smaller the depth is, the deeper the load-bearing area 32 is, and the center points of the three load-bearing areas 32 overlap. The rectangular shape of the three load-bearing areas 32 is only an example, and is not used to limit the shape of the three load-bearing areas 32 to be rectangular, and other shapes may also be used. In addition, the positive tray temporary placement table 31 can be located at any position on the wafer inspection device 90, depending on the convenience of actual implementation. The groove on the tray 81 is a well-known technology, and its boundary is not easy to mark in the figure after the chip 82 is housed, so it is not allowed to mark it with a figure number.

The inverting tray temporary placing table 41 has three bearing areas 42 for placing a tray 81 with the bearing surface facing downward. The tray 81 placed on the temporary tray 41 has the same number and position of grooves (not shown) as the tray 81 placed on the temporary tray 31. When the two trays 81 are stacked facing each other, the grooves of the two trays 81 will face up and down, so that each of the wafers 82 can be partially accommodated in the grooves of the trays 81. In this embodiment, the three load-bearing areas 42 are all rectangular, and the smaller the depth is, the deeper the load-bearing area 42 is, and the center points of the three load-bearing areas 42 overlap. In addition, the pour tray temporary placement table 41 can be located at any position on the wafer inspection device 90, depending on the convenience of actual implementation.

The turning jig 51 has a turning driving device 52, a turning table 54, an opening and closing driving device 56 and two clamping arms 58, the turning table 54 is connected to the turning driving device 52 to be driven to rotate, and the rotation An opening and closing driving device 56 is also provided on the table 54. The two clamping arms 58 are connected to the opening and closing driving device 56 and are driven by the opening and closing driving device 56 to be relatively opened or relatively clamped, and the turning driving device 52 drives the rotating table 54 drives the two clamping arms 58 to flip together. Each of the clamping arms 58 has a retreat space 581 extending from the end to the root. The width of the retreat space 581 is greater than the width of the lifting platform 21 and can be used for the lifting platform 21 Enter or exit, in this way, a clamping arm 58 can be located on both sides of the lifting platform 21 after the lifting platform 21 enters the retreat space 581, and the turning fixture 51 is moved by a moving platform 59 Driven to move closer to or away from the lifting platform 21, when the turning jig 51 moves closer to the lifting platform 21, a clamping arm 58 is located on both sides of the lifting platform 21 and below the material tray 81, and does not Interfere with the lifting platform 21. The mobile platform 59 is an example of a conventional single-axis mobile platform.

The transfer jig 61 has two clamping jaws 62, which can be controlled to clamp or release the material tray 81. The transfer jig 61 is driven by a conventional three-axis moving platform 69 to move, and thus can be moved. The clamped tray 81 is moved between the positive tray temporary placement table 31, the inverted tray temporary placement table 41 and the platform 11. In this embodiment, the number of the two clamping jaws 62 can also be more, and the number is not limited to two.

Wherein, when the lifting platform 21 is raised to the top position, when there are two material trays 81 stacked on the lifting platform 21 facing each other, the two clamping arms 58 are respectively located above and below the two material trays 81 The tray 81 is clamped in a spatial relationship, and the lifting platform 21 is located in the retreat space 581 of a clamping arm 58 located below.

The architecture of this embodiment has been explained above, and the operation state of this embodiment will be explained next.

As shown in FIG. 2, before the inspection, a tray 81 full of multiple wafers 82 is first placed in a loading area 32 of the positive tray temporary placement table 31, and an empty tray 81 faces It is placed upside down in a carrying area 42 of the inverting tray temporary placing table 41, and the lifting platform 21 is lowered to a lower position.

As shown in Figures 3 to 5, when testing is to be carried out, the transfer jig 61 is used to transfer the tray 81 full of wafers 82 on the positive tray temporary placement table 31 to the platform 11, and if necessary, the The tray 81 abuts against the blocking wall 14, and the blocking wall 14 can provide the effect of positioning or calibrating the position. After that, the wafer inspection device 90 can pick up the tray 81 to inspect the plurality of wafers 82 it carries. It can be seen from FIG. It has been moved into the wafer inspection device 90, and after the inspection is completed, the tray 81 is returned to the position of the platform 11, and the position of the tray 81 is shown in FIG. 4. At this time, only the top surface of the plurality of wafers 82 on the tray 81 has been tested, and the bottom surface has not yet been tested. Therefore, there is a need for turning over.

As shown in Figures 6 and 7, before turning over, first use the transfer clamp 61 to clamp the tray 81 facing down on the inverting tray temporary table 41, and move it to the platform 11 And the cover is placed on the tray 81 loaded with a plurality of wafers 82 (shown in FIG. 2). At this time, the plurality of wafers 82 are also embedded in the plurality of grooves of the tray 81 facing down, and the The tray 81 facing downward and the tray 81 carrying the plurality of wafers 82 are also stacked opposite to each other.

As shown in FIG. 8, when turning over, the lifting driving device 22 drives the lifting platform 21 to the top position. As shown in FIG. 9 again, the turning jig 51 is driven to move so that the two clamping arms 58 are respectively located above and below the two material trays 81 that are stacked opposite each other, and the retreat space 581 of the clamping arm 58 located below can accommodate The lifting platform 21 is set so that the clamping arm 58 located below does not interfere with the lifting platform 21, and then the opening and closing driving device 56 drives the two clamping arms 58 to clamp the two material trays 81 . As shown in FIG. 10, the lifting platform 21 is then lowered, and the rotating platform 54 is driven to rotate 180 degrees by the turning drive device 52. The two trays 81 are turned over, and the plurality of wafers 82 follow Turn it over. As shown in FIG. 9, the lifting platform 21 is raised to the top position to receive the two material trays 81, and the two clamping arms 58 of the turning jig 51 can be driven to open and move away. After that, the lifting platform 21 is lowered, and the upper tray 81 of the two trays 81 is moved back to the dump tray temporary placement platform 41 by the transfer jig 61, and the state shown in FIG. 6 is shown. At this time, the plurality of wafers 82 have been turned over, and the original bottom surface is up, ready for inspection. The subsequent inspection is performed by the wafer inspection device 90 as described above.

It can be seen from the above description that the tray turning module 10 of the present creation can achieve the effect of turning the multiple chips 82 carried by the tray 81 all at once, so that the chips 82 that need to be inspected on both sides can be quickly processed. The detection improves the time-consuming and cost-consuming problem of turning over one by one in the prior art. In addition, with the cooperation of the lifting platform 21 and the turning jig 51, this creation can complete the turning movement of all the wafers on a tray at one time with extremely simple and few steps in the turning movement.

10: Tray turning module of chip inspection device 11: platform 12: Hollow part 14: retaining wall 21: Lifting table 22: Lifting drive device 31: Temporary table for positive material tray 32: Carrying area 41: Temporary table for pouring tray 42: Carrying area 51: Flip the fixture 52: Flip drive 54: Rotating table 56: Opening and closing drive device 58: Clamp arm 581: Concession Space 59: mobile platform 61: Transfer fixture 62: Gripper 69: Three-axis mobile platform 81: Reel 82: chip 90: Wafer inspection device

FIG. 1 is a perspective view of the first preferred embodiment of the present invention installed in a chip inspection device. Fig. 2 is a diagram of the first operation action of the first preferred embodiment of the authoring. Fig. 3 is a diagram of the second operation action of the first preferred embodiment of the authoring. Fig. 4 is a diagram of the third operation action of the first preferred embodiment of the creation. Fig. 5 is a diagram of the fourth operation action of the first preferred embodiment of the creation. Fig. 6 is a diagram of the fifth operation action of the first preferred embodiment of the creation. Fig. 7 is a diagram of the sixth operation action of the first preferred embodiment of the authoring. Fig. 8 is a diagram of the seventh operation action of the first preferred embodiment of the present creation. Fig. 9 is a diagram of the eighth operation action of the first preferred embodiment of the authoring. Fig. 10 is a diagram of the ninth operation action of the first preferred embodiment of the present creation.

10: Tray turning module of chip inspection device

11: platform

12: Hollow part

14: retaining wall

21: Lifting table

22: Lifting drive device

31: Temporary table for positive material tray

32: Carrying area

41: Temporary table for pouring tray

42: Carrying area

51: Flip the fixture

52: Flip drive

54: Rotating table

56: Opening and closing drive device

58: Clamp arm

581: Concession Space

59: mobile platform

61: Transfer fixture

62: Gripper

69: Three-axis mobile platform

90: Wafer inspection device

Claims (8)

A material tray turning module of a wafer inspection device is installed in a wafer inspection device for turning over two material trays of the same size that are stacked opposite each other. The material tray turning module of the wafer inspection device includes: A supporting platform for receiving a tray; An elevating platform is driven by an elevating drive device to lift up and down, so as to lift or lower the tray from the bottom surface of the tray. When the elevating platform is lowered to the lower position, it is adjacent to the bearing platform and its top surface is not high On the surface of the bearing platform, where the lifting platform does not completely cover the bottom surface of the tray; A positive tray temporary placement table with at least one carrying area for placing the tray with the carrying surface facing upwards; A temporary placement table for a dumping tray with at least one carrying area for placing the tray with the carrying surface facing downwards; A flipping jig has a flipping drive device and two clamping arms. The flipping drive device drives the two clamping arms to open or clamp relatively, and the flipping drive device drives the two clamping arms to flip together. The flipping fixture is Driven by a moving platform to move closer to or away from the lifting platform, when the turning jig moves closer to the lifting platform, a clamping arm is positioned at one side of the lifting platform and below the tray; and A transfer fixture has at least two clamping jaws, clamps or releases a material tray, and can move between the positive tray temporary holding table, the inverted tray temporary holding table and the bearing platform. The tray turning module of the wafer inspection device according to claim 1, wherein the lifting platform is rectangular, and when a tray is placed on the supporting platform, a part of the tray is located above the lifting platform. The tray turning module of the wafer inspection device according to claim 1, wherein: the positive tray temporary placing table and the inverting tray temporary placing table have a plurality of carrying areas, each of the carrying areas is rectangular, in terms of depth The smaller the load-bearing area is, the deeper it is, and the center points of the load-bearing areas overlap. The tray turning module of the wafer inspection device according to claim 1, wherein: the turning jig has a rotating table which is driven to rotate by the turning driving device; the two clamping arms are arranged on the rotating table, and The rotating table moves simultaneously and flips. The tray turning module of a wafer inspection device according to claim 4, wherein: an opening and closing driving device is provided on the rotating table, and the two clamping arms are relatively opened or opposed to each other by being driven by the opening and closing driving device Clamp. The tray turning module of the wafer inspection device according to claim 1, wherein: the transfer fixture is moved by a three-axis moving platform. The tray turning module of the wafer inspection device according to claim 1, wherein: when the lifting platform is raised to the top position, when two trays are stacked on the lifting platform, the two clamps The arms clamp the two material trays in a spatial relationship respectively located above and below the two material trays, and the clamping arm located below does not interfere with the lifting platform. The tray turning module of the wafer inspection device according to claim 1, wherein: the bearing platform has a plurality of retaining walls, and when a tray is placed on the bearing platform, the tray abuts against the edge of the retaining wall .

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