TWM618020U - Carrier and expansion card - Google Patents
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- TWM618020U TWM618020U TW110201648U TW110201648U TWM618020U TW M618020 U TWM618020 U TW M618020U TW 110201648 U TW110201648 U TW 110201648U TW 110201648 U TW110201648 U TW 110201648U TW M618020 U TWM618020 U TW M618020U
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Description
本揭露大致關於一種高容量電子組件的承載裝置,用於可被插入伺服器滑動件中的模組化槽的擴充卡。更特定地,本揭露的特點有關於一種具有高導熱效率、不需要工具的承載裝置,用以插入擴充卡。 The present disclosure generally relates to a high-capacity electronic component carrying device for an expansion card that can be inserted into a modular slot in a server slider. More specifically, the feature of the present disclosure relates to a carrying device with high heat conduction efficiency and no tools required for inserting expansion cards.
例如伺服器的電子裝置,包括由一般的供電器驅動的眾多電子組件。大致上,伺服器係針對特定功能,例如儲存大量的資料或處理。伺服器的設計從機箱開始,機箱包括驅動組件和一般控制器,例如基板管理控制器。目前的大型伺服器設計包括槽,用於具有處理器、記憶體、驅動器以及網路介面的伺服器滑動件。這樣的滑動件又包括擴充槽,擴充槽接收擴充裝置卡,擴充裝置卡可被插入以執行額外的伺服器功能,例如儲存或處理。例如,儲存伺服器滑動件可包括槽,用以容納額外的固態硬碟(solid state drive,SSD)裝置卡,而處理伺服器可包括槽,用於具有處理單元的更多裝置卡。 For example, an electronic device such as a server includes numerous electronic components driven by a general power supply. Generally speaking, servers are geared towards specific functions, such as storing large amounts of data or processing. The design of the server starts from the chassis, which includes drive components and general controllers, such as baseboard management controllers. Current large server designs include slots for server sliders with processors, memory, drives, and network interfaces. Such a sliding member further includes an expansion slot, which receives an expansion device card, and the expansion device card can be inserted to perform additional server functions, such as storage or processing. For example, the storage server slider may include slots for accommodating additional solid state drive (SSD) device cards, and the processing server may include slots for more device cards with processing units.
由於內部電子裝置的運作,例如控制器、處理器以及記憶體,以及在這樣的裝置卡上的組件,使伺服器產生大量的熱。因此,伺服器被設計以依賴通過裝置的內部的氣流,以帶走從電子組件產生的熱。當組件的大小增加,例如記憶體裝置,使產生的熱也增加。電子組件用的擴充卡承載裝置通常具有散熱器,以將熱從電子組件散出。散熱器一般係由導熱性材料組成。散熱器從電子組件吸收熱,因此從組件將熱傳導出。隨著裝置卡的每一代變得更強大,從而產生更多的熱,除熱的挑戰也隨之增加。Due to the operation of internal electronic devices, such as controllers, processors, and memory, as well as components on such device cards, the server generates a lot of heat. Therefore, the server is designed to rely on the airflow through the inside of the device to take away the heat generated from the electronic components. When the size of components increases, such as memory devices, the heat generated also increases. Expansion card carrying devices for electronic components usually have a heat sink to dissipate heat from the electronic components. The radiator is generally composed of thermally conductive materials. The heat sink absorbs heat from the electronic components, and therefore conducts heat away from the components. As each generation of device cards becomes more powerful, thereby generating more heat, the challenge of removing heat also increases.
如前所述,儲存伺服器滑動件可包括固態硬碟型的擴充卡(solid state drive based expansion cards),以增加儲存能力。固態硬碟卡的目前一代係基於遵循M.2規格標準的記憶體芯片用的承載裝置,例如M.2 22110。因此,承載裝置被特定地設計,以保持基於M.2規格所設計的組件。例如,M.2 22110機械規格具有頂側組件區域,大約為22毫米乘110毫米、具有金手指型連接器在一端。承載裝置被插入擴充卡。這種擴充卡經常被裝設在豎支架上,豎支架又平行於伺服器滑動件的主機板而被裝設。在這種方式之下,可以將多個擴充卡以節省空間的方式裝設在伺服器滑動件上。As mentioned above, the storage server slider may include solid state drive based expansion cards to increase storage capacity. The current generation of SSD cards is based on a carrier device for memory chips that conforms to the M.2 specification, such as M.2 22110. Therefore, the carrying device is specifically designed to maintain the components designed based on the M.2 specification. For example, the M.2 22110 mechanical specification has a top-side component area, which is approximately 22 mm by 110 mm, and has a golden finger connector at one end. The carrier device is inserted into the expansion card. This kind of expansion card is often installed on a vertical bracket, which is installed parallel to the main board of the server slider. In this way, multiple expansion cards can be installed on the server slider in a space-saving manner.
下一代的儲存卡大致上傾向於較大的M.2承載裝置尺寸,以容納固態硬碟裝置中更大的儲存能力。目前,在M.2裝置上具有更高的容量,用以擴充儲存能力,例如1TB、2TB、4TB、8TB或16TB,需要從6.8 瓦特到18瓦特的更高散熱設計功率。由於期望增加儲存的容量,目前的承載裝置可能無法容納未來的固態硬碟裝置,因為由目前設計的承載裝置散熱器無法解決散熱問題。The next generation of memory cards generally tends to be larger M.2 carrier device size to accommodate the larger storage capacity of the solid state drive device. Currently, M.2 devices have higher capacity to expand storage capacity, such as 1TB, 2TB, 4TB, 8TB or 16TB, which requires a higher heat dissipation design power from 6.8 watts to 18 watts. Due to the desire to increase the storage capacity, the current carrying device may not be able to accommodate future solid state hard disk devices, because the current designed carrying device heat sink cannot solve the heat dissipation problem.
因此,需要一種容納例如固態硬碟的高熱輸出組件的承載裝置。還需要一種不需要工具的機構,以組裝和固定承載裝置的電子組件。還需要一種對於擴充卡從較高存儲量和熱功率固態硬碟組件具有更有效散熱的承載裝置,例如快速周邊組件互連(PCIe)擴充卡。Therefore, there is a need for a carrying device for accommodating high heat output components such as solid state disks. There is also a need for a mechanism that does not require tools to assemble and fix the electronic components of the carrier device. There is also a need for a carrier device that can efficiently dissipate heat from a higher storage capacity and thermal power solid state drive assembly for an expansion card, such as a PCIe expansion card.
所揭露的一個示例係一種承載裝置,用於可安裝於擴充卡中的電子裝置。承載裝置包括頂散熱器以及底散熱器。包括電子裝置的電路板被設置在頂散熱器和底散熱器之間。側扣件包括頂面板和底面板。側扣件具有開啟位置和關閉位置。當側扣件在關閉位置時,側扣件的頂面板與頂散熱器接觸,且側扣件的底面板與底散熱器接觸。側扣件將頂散熱器保持到底散熱器。An example disclosed is a carrying device for an electronic device that can be installed in an expansion card. The carrying device includes a top radiator and a bottom radiator. The circuit board including the electronic device is arranged between the top radiator and the bottom radiator. The side fasteners include a top panel and a bottom panel. The side fastener has an open position and a closed position. When the side fastener is in the closed position, the top panel of the side fastener is in contact with the top radiator, and the bottom panel of the side fastener is in contact with the bottom radiator. The side fasteners hold the top radiator to the bottom radiator.
在所揭露的示例承載裝置的另一實施方式中,頂散熱器包括具有複數個鰭片的外表面。在另一實施方式中,頂散熱器包括具有可與擴充卡上的閂鎖搭接(mateable)的缺口的第一邊緣。頂散熱器包括第二邊緣,第二邊緣包括可與擴充卡上的連接器插座搭接的電路連接器。在另一實施方式中,頂散熱器和底散熱器係由鋁合金所製成。在另一實施方式中,電路板符合M.2規格。在另一實施方式中,電子裝置係固態硬碟(SSD)。在另一實施方式中,承載裝置包括第二側扣件,位在第一側扣件的相反側。第二側扣件具有開啟位置和關閉位置。當第二側扣件在關閉位置時,第二側扣件的頂面板與頂散熱器接觸,且第二側扣件的底面板與底散熱器接觸。第二側扣件將頂散熱器保持到底散熱器。在另一實施方式中,第一側扣件包括耦接到底散熱器的鉸鏈。第一側扣件繞鉸鏈在開啟位置和關閉位置之間旋轉。在另一實施方式中,承載裝置包括在電路板和頂散熱器之間的頂導熱墊。承載裝置包括在電路板和底散熱器之間的底導熱墊。在另一實施方式中,底散熱器包括兩個側壁。側壁被配置以使電路板保持橫向的定向。In another embodiment of the disclosed example carrier device, the top heat sink includes an outer surface with a plurality of fins. In another embodiment, the top heat sink includes a first edge with a notch that can be mateable with a latch on the expansion card. The top heat sink includes a second edge, and the second edge includes a circuit connector that can be overlapped with the connector socket on the expansion card. In another embodiment, the top radiator and the bottom radiator are made of aluminum alloy. In another embodiment, the circuit board complies with the M.2 specification. In another embodiment, the electronic device is a solid state drive (SSD). In another embodiment, the carrying device includes a second side fastener located on the opposite side of the first side fastener. The second side fastener has an open position and a closed position. When the second side fastener is in the closed position, the top panel of the second side fastener is in contact with the top heat sink, and the bottom panel of the second side fastener is in contact with the bottom heat sink. The second side fastener holds the top radiator to the bottom radiator. In another embodiment, the first side fastener includes a hinge coupled to the bottom heat sink. The first side fastener rotates around the hinge between an open position and a closed position. In another embodiment, the carrier device includes a top thermal pad between the circuit board and the top heat sink. The carrying device includes a bottom thermal pad between the circuit board and the bottom heat sink. In another embodiment, the bottom heat sink includes two side walls. The side walls are configured to maintain the circuit board in a lateral orientation.
所揭露的另一示例係一種擴充卡,用以插入伺服器滑動件的擴充槽。擴充卡包括支撐板和在支撐板的一側上的連接器插座。閂鎖構件在支撐板的相反側上。連接器插座和閂鎖構件容納電子裝置的符合M.2的承載裝置。承載裝置包括頂散熱器和底散熱器。承載裝置具有電路板,包括設置在頂散熱器和底散熱器之間的電子裝置。承載裝置具有第一側扣件和第二側扣件。側扣件的每一個包括頂面板和底面板。側扣件具有開啟位置和關閉位置。當側扣件在關閉位置時,側扣件的頂面板與頂散熱器接觸,且側扣件的底面板與底散熱器接觸。側扣件將頂散熱器保持到底散熱器。Another example disclosed is an expansion card for inserting into an expansion slot of a server slider. The expansion card includes a support board and a connector socket on one side of the support board. The latch member is on the opposite side of the support plate. The connector socket and the latch member accommodate the M.2 compliant carrying device of the electronic device. The carrying device includes a top radiator and a bottom radiator. The carrying device has a circuit board and includes an electronic device arranged between the top radiator and the bottom radiator. The carrying device has a first side fastener and a second side fastener. Each of the side fasteners includes a top panel and a bottom panel. The side fastener has an open position and a closed position. When the side fastener is in the closed position, the top panel of the side fastener is in contact with the top radiator, and the bottom panel of the side fastener is in contact with the bottom radiator. The side fasteners hold the top radiator to the bottom radiator.
在所揭露的示例擴充卡中的另一實施方式,支撐板包括邊緣連接器,用以連接到伺服器滑動件上的擴充槽。在另一實施方式中,擴充槽係快速周邊組件互連(PCIe)槽。在另一實施方式中,頂散熱器包括具有缺口的第一邊緣、以及包括可與插座連接器搭接的電路連接器的第二邊緣。在另一實施方式中,閂鎖構件包括與頂散熱器的缺口卡合的可滑動閂鎖。在另一實施方式中,頂散熱器和底散熱器係由鋁合金所製成。在另一實施方式中,電子裝置係固態硬碟(SSD)。在另一實施方式中,每一個側扣件包括耦接到底散熱器的一側的鉸鏈。側扣件繞鉸鏈在開啟位置和關閉位置之間旋轉。在另一實施方式中,承載裝置更包括在電路板和頂散熱器之間的頂導熱墊、以及在電路板和底散熱器之間的底導熱墊。在另一實施方式中,底散熱器包括兩個側壁。側壁被配置以使電路板保持橫向的定向。In another embodiment of the disclosed example expansion card, the support plate includes an edge connector for connecting to the expansion slot on the server slider. In another embodiment, the expansion slot is a Peripheral Component Interconnect (PCIe) slot. In another embodiment, the top heat sink includes a first edge with a notch, and a second edge including a circuit connector that can overlap with the socket connector. In another embodiment, the latch member includes a slidable latch that engages with the notch of the top heat sink. In another embodiment, the top radiator and the bottom radiator are made of aluminum alloy. In another embodiment, the electronic device is a solid state drive (SSD). In another embodiment, each side fastener includes a hinge coupled to one side of the bottom heat sink. The side fastener rotates around the hinge between an open position and a closed position. In another embodiment, the carrying device further includes a top thermal pad between the circuit board and the top heat sink, and a bottom thermal pad between the circuit board and the bottom heat sink. In another embodiment, the bottom heat sink includes two side walls. The side walls are configured to maintain the circuit board in a lateral orientation.
以上新型內容並非旨在代表本揭露的每一實施例或每一特點。而是,前述新型內容僅提供在此闡述的一些新穎特點和特徵的示例。當接合附圖和所附申請專利範圍時,從代表性實施例和模式的以下詳述,本揭露的以上特徵和優點以及其他特徵和優點,將為顯而易見的。The above new content is not intended to represent every embodiment or every feature of this disclosure. Rather, the aforementioned new content only provides examples of some of the novel features and features set forth herein. The above features and advantages and other features and advantages of the present disclosure will be apparent from the following detailed description of representative embodiments and modes when the accompanying drawings and the scope of the appended patent application are combined.
本新型可以許多不同形式實施。代表性實施例在附圖中被顯示,且將在此以細節描述。本揭露是所揭露的原理的示例或說明,且無意於將本揭露的廣泛特點限於所示出的實施例。在此限度上,所揭露的元件和限制,例如,在摘要、新型內容、實施方式段落,但未明確地闡述在申請專利範圍中,不應藉由暗示、推斷或其他方式單獨地或集體地併入申請專利範圍。為了本實施方式的目的,除非明確地說明並非如此,單數包括複數且反之亦然。名詞「包括」意為「包括而不限於」。此外,近似詞如「大約(about, almost, substantially, approximately)」以及其相似詞,可在此意為例如「在(at)」、「近於(near , nearly at)」、「在3%到5%之內(within 3-5% of)」、「在可接受的製造公差內(within acceptable manufacturing tolerances)」或任何其邏輯組合。The invention can be implemented in many different forms. Representative embodiments are shown in the drawings and will be described in detail here. The present disclosure is an example or description of the disclosed principles, and is not intended to limit the broad features of the present disclosure to the illustrated embodiments. To this limit, the disclosed elements and limitations, for example, in the abstract, new content, implementation paragraphs, but not explicitly stated in the scope of the patent application, should not be implied, inferred or otherwise individually or collectively Incorporated into the scope of patent application. For the purpose of this embodiment, unless explicitly stated otherwise, the singular includes the plural and vice versa. The noun "including" means "including but not limited to." In addition, similar words such as "about (about, almost, substantially, approximately)" and similar words can mean "在(at)", "近于(near, nearly at)", "在3% Within 5% (within 3-5% of)", "within acceptable manufacturing tolerances" or any logical combination thereof.
本揭露針對具有兩個散熱器和可旋轉扣件的示例M2承載裝置,可旋轉扣件確保兩個散熱器與導熱墊具有良好的接觸,以允許電子組件具有高熱能。在此描述的M.2承載裝置可被裝設在容納四個承載裝置的擴充卡中。The present disclosure is directed to an example M2 carrying device with two heat sinks and a rotatable fastener. The rotatable fastener ensures that the two heat sinks have good contact with the thermal pad to allow electronic components to have high thermal energy. The M.2 carrier device described here can be installed in an expansion card that accommodates four carrier devices.
第1A圖係示例承載裝置100的組件的爆炸圖,示例承載裝置100符合M.2 22110規格標準。因此,承載裝置容納具有22毫米乘110毫米覆蓋區域(footprint)的M.2型組件卡。第1B圖係已組裝的示例承載裝置100的頂部立體圖。第1C圖係已組裝的示例承載裝置100的底部立體圖。第2A圖係已組裝的承載裝置100的視圖,顯示側扣件旋轉到開啟位置,以允許第1圖中的組件的組裝。Fig. 1A is an exploded view of the components of the
如第1A圖所示,承載裝置100包括底散熱器110、底導熱墊112、電路板114、頂散熱器116以及頂導熱墊118。在此示例中,電路板114符合M.2 22110承載裝置用的大小。在此示例中的電路板114包括電子組件,例如非揮發性記憶體固態硬碟(non-volatile memory solid state drive, NVME SSD)。其他卡的種類,例如,Samsung PM983型固態硬碟或Intel P45113D NAND 硬碟,也可使用承載裝置100。當承載裝置100被組裝時,電路板114被設置在底散熱器110和頂散熱器116之間。在此示例中,底散熱器110和頂散熱器116皆係由高K因數的鋁合金所製成,但其他合適的導熱材料也可被使用。As shown in FIG. 1A, the
如第1B圖到第1C圖所示,三個側扣件120、122以及124,與頂散熱器116、頂導熱墊118(第1A圖)、底散熱器110、電路板114以及底導熱墊112彼此附接,以形成已組裝的承載裝置100。扣件120、扣件122以及扣件124的每一個具有大致的「U」形狀,且提供壓縮力到頂散熱器116和底散熱器110。如將要解釋的,側扣件120、122以及124可旋轉遠離底散熱器110,以允許承載裝置100的其他組件被移除。當側扣件120、122以及124旋轉到關閉位置,側扣件120、122以及124與頂散熱器116、頂導熱墊118、底散熱器110、電路板114以及底導熱墊112接合(join)。電路板114靜置在底導熱墊112上,且藉由側扣件120、122以及124和底散熱器110而相似地被定位,且被限制向橫向的移動。電路板114可包括電子組件,例如固態記憶晶片和支撐電路。邊緣連接器130從電路板114的一端延伸。邊緣連接器130可包括金手指型連接器。相反的邊緣132(第1A圖)包括由導電材料做為界線(bordered)的半圓形缺口134,以作為機械上的接地墊。As shown in Figures 1B to 1C, the three
頂散熱器116包括底部表面,底部表面與頂導熱墊118接觸的被放置,以傳導由電路板114的電子組件所產生的熱。頂散熱器116具有外表面140,外表面140包括從外表面140延伸的鰭片142的樣式(pattern)。鰭片142藉由增加外表面140的表面積來幫助散熱,而允許更多的散熱。除了三個平坦邊緣區域144、146以及148之外,鰭片142大致上被製造於整個外表面140。每一個平坦邊緣區域144、146以及148具有與分別的扣件120、122以及124搭接的形狀。外表面140具有相反邊緣端150和152。半圓形缺口154形成在邊緣端150之一。頂散熱器116包括重合部件(registration feature),當頂散熱器116附接到底散熱器110時,以允許對準。在此示例中,頂散熱器116包括兩個母重合部件156(接近邊緣末端150的兩側各一個)以及兩個公重合部件158(接近邊緣末端152的兩側各一個)。The
如第1A圖、第1C圖以及第2A圖所示,底散熱器110包括大致上係平坦的底部表面160。三個凹部162、164以及166形成在底部表面160的邊緣上。底散熱器110包括中間側邊緣170以及彼此偏置的兩個相反側邊緣172以及174。扣件120和124位在界定凹部162和166的一端的中間側邊緣170的兩側。扣件122位在界定凹部164的另一側上的側邊緣172和174之間。As shown in FIG. 1A, FIG. 1C, and FIG. 2A, the
底散熱器110的相反的頂部表面180(第1A圖)包括兩個側壁182和184(第1A圖),側壁182和184在靠近頂部表面180的邊緣配置平行於彼此。兩個側壁182和184允許底導熱墊112和電路板114(第1B圖)的對準。側壁182和側壁184限制電路板和底導熱墊112的在橫向的運動。在此示例中,側壁182和側壁184包括兩個公重合部件186(第1A圖)和兩個母重合部件188(第1A圖)。當底散熱器110附接到頂散熱器116時,公重合部件186與頂散熱器116的母重合部件156(第1A圖)搭接(mated with),而母重合部件188與頂散熱器116的公重合部件158(第1A圖)搭接。The opposite top surface 180 (FIG. 1A) of the
在此示例的扣件120、122以及124係由不銹鋼所製成,但任何具有足夠的拉伸強度的可撓性材料可被使用。第2B圖係在第1B圖到第1C圖中側扣件122關於底散熱器110的底部立體圖。扣件122相同於扣件120和扣件124。為了說明性目的,扣件122的元件被顯示在第2B圖,但應當理解以下的描述有關於相同的扣件120和124。扣件122包括頂面板210,頂面板210具有相同於平坦邊緣區域146的形狀,平坦邊緣區域146形成在第2A圖中的頂散熱器116的外表面140上。底面板214藉由接合件212接合到頂面板210,以形成「U」形狀。底面板214的形狀係符合在底散熱器110上的凹部164的形狀。底面板214的寬度裝配在邊緣172(第2A圖)和邊緣174之間。底面板214包括具有孔222的延伸片220。孔222與銷224搭接,銷224形成在底散熱器110的底部表面160的凹部164。延伸片220的孔222被插入銷224,銷224作為鉸鏈。因此,扣件122可在第2A圖所顯示的開啟位置和第1B圖到第1C圖所顯示的關閉位置之間旋轉。在關閉位置,頂面板210接觸頂散熱器116,而底面板214接觸底散熱器110。側扣件122因此將頂散熱器116接合到底散熱器110。側扣件122在關閉位置提供壓縮力到散熱器110和116。頂面板210包括外邊緣232,外邊緣232形成允許使用者操控扣件122的半圓柱構件234。在此示例中具有三個側扣件,但其他扣件的數量可被使用。例如,在每一側上一個扣件可被使用,或在每一側上兩個扣件可被使用。三個扣件的配置提供頂散熱器116和底散熱器110上一致的力,以卡合電路板114上的組件,且因此促進導熱率。The
第3A圖係第1A圖中的M.2型承載裝置100安裝到擴充卡300的立體圖。在此示例中的擴充卡300可容納最多四個M.2 22110承載裝置,例如承載裝置100。M.2 22110承載裝置保持電子組件,例如固態硬碟(SSDs)。在此示例中,擴充卡300係OCP AVA-4 M.2承載裝置卡,OCP AVA-4 M.2承載裝置卡係快速周邊組件互連全高半長(Full Height Half Length, FHHL)規格的卡、可從廣達電腦(Quanta Computer Inc.)取得。擴充卡300包括支撐電路板310,對於四個M.2承載裝置的每一個,支撐電路板310具有一組連接器插座312。FIG. 3A is a perspective view of the M.2
支撐電路板310具有邊緣連接器314,邊緣連接器314允許擴充卡300附接到豎板上的連接器。邊緣連接器314可具有金手指連接器。擴充卡300包括兩個側壁320和322。前壁324接合側壁320和側壁322。前壁324包括格子板326,格子板326允許氣流流經承載裝置。前壁324保持延伸片328,延伸片328可被用來在計算裝置中定位擴充卡300。閂鎖機構330藉由側壁320被支撐,以允許擴充卡300附接到豎板。支撐電路板310包括四個閂鎖構件340、342、344以及346,每一閂鎖構件340、342、344以及346位於連接器插座312之一的相對之處。The
第3B圖係由支撐電路板310支撐的閂鎖構件340的放大立體圖。相同的元件被以相同的符號標記,如其在第3A圖中的對應件。閂鎖構件340包括為承載裝置100的高度的支撐350。支撐350的一端附接到支撐電路板310。支撐350的另一端保持可滑動的金屬閂鎖352。金屬閂鎖352具有從承載裝置100縮回的開啟位置,以及朝向承載裝置100的關閉位置。在此示例中的金屬閂鎖352藉由在支撐350中的彈簧而被彈簧偏置到關閉位置。金屬閂鎖352的一端具有半圓形端片354。FIG. 3B is an enlarged perspective view of the
承載裝置100的邊緣連接器130附接到在第3A圖中的支撐電路板310的一端上的連接器插座312之一。承載裝置100的另一端包括在頂散熱器116中的半圓型缺口154。缺口154容納金屬閂鎖352的端片354的形狀。閂鎖352被拉出以壓縮內部的彈簧。當閂鎖352被拉出到開啟位置,承載裝置100可被插入在連接器插座312(第3A圖中)和支撐350之間。一旦承載裝置100被插入,閂鎖352藉由彈簧被迫使向前,使端片354搭接缺口154。在關閉位置,閂鎖352的端片354的底部與電路板114中圍繞半圓型缺口134(第1A圖中)的導電材料接觸,以使電路板114接地。因此,機械上的接地係藉由在端片354和電路板114上的導電材料之間的接觸所提供。閂鎖352透過端片354對缺口154的接觸將承載裝置100保持在定位。The
第4A圖係示例機箱滑動件400的立體圖,用於計算系統,例如伺服器。第4B圖顯示具有豎板和擴充卡的示例機箱滑動件400,擴充卡相似於第3A圖中的擴充卡300。可理解的是例如滑動件400的多個滑動件可被插入機箱中。滑動件400包括擴充槽,擴充槽保持直立的豎板,以定位擴充卡,例如第3A圖中的擴充卡300。Figure 4A is a perspective view of an
在此示例中,滑動件400包括主機板410,主機板410將兩個處理器裝設在散熱器412和散熱器414下。雙線記憶體模組(DIMM) 卡416的一系列被裝設在處理器的側邊。在此示例中,機箱包括四個快速周邊組件互連槽420、422、424以及426。前架430包括位在前架430的之側上的主機板410上的快速周邊組件互連槽420和422。後架432包括位在後架432之側上的主機板410上的快速周邊組件互連槽424和426。In this example, the
在此示例中,豎板440被插入快速周邊組件互連槽420。豎板440具有插入槽420的邊緣連接器。豎板440包括卡連接器,卡連接器靠近豎板440的頂部,以保持擴充卡,例如第3A圖中的擴充卡300。相似地,豎板442被插入快速周邊組件互連槽422。豎板442具有插入槽422的邊緣連接器。豎板442包括卡連接器,卡連接器靠近豎板442的中間,以維持擴充卡。因此,在前架430中的兩個擴充卡堆疊在彼此上,且因此可為延伸橫越滑動件400的寬度的全長卡。In this example, the
相似地,豎板444被插入快速周邊組件互連槽424。豎板444具有插入快速周邊組件互連槽424的邊緣連接器。豎板444包括靠近豎板444的頂部的卡連接器,以保持擴充卡,例如第3A圖中的擴充卡300。相似地,豎板446被插入快速周邊組件互連槽426。豎板446具有插入槽426的邊緣連接器。豎板446包括靠近豎板446的中間的卡連接器,以保持擴充卡。因此,在後架432中的兩個擴充卡堆疊在彼此上,且因此可為延伸橫越滑動件400的寬度的全長卡。Similarly, the
第4B圖顯示具有四個擴充卡450、452、454以及456的滑動件400,四個擴充卡450、452、454以及456附接到在前架430中的不同的豎板440和442,以及在後架432中的豎板444和446。放大圖中所顯示的示例擴充卡450相同於第3A圖中的擴充卡300,且保持四個M.2儲存承載裝置,例如第1A圖的承載裝置100。在此示例中,四個擴充卡450、452、454以及456全部包括四個固態硬碟儲存承載裝置,例如第1A圖的承載裝置100。Figure 4B shows a
第5A圖顯示在伺服器滑動件400的後架432中安裝兩個擴充卡454和456用的過程。第一視圖500顯示具有快速周邊組件互連槽424和426的後架432。支架466附接到豎板446。擴充卡456被插入豎板446的插座。擴充卡456係由支架466和豎板446支撐。然後如第二視圖510所顯示的組合的豎板446、支架466以及擴充卡456,可被插入後架432。更特定地,這允許豎板446的邊緣連接器插入快速周邊組件互連槽426。如第二視圖510所顯示,豎板446和支架466將擴充卡456定位於約為滑動件400的高度的一半的位準(level)。在此示例中,例如指旋螺絲512的附接裝置可被採用,以將支架466固定到滑動件400。Figure 5A shows the process of installing two
第三視圖520顯示連接到豎板444的另一支架464的附接。豎板444的邊緣連接器被插入快速周邊組件互連槽424。豎板444在滑動件400的頂部支撐擴充卡454。例如指旋螺絲522的附接裝置被採用,以將支架464固定到滑動件400。在此示例中,每一支架464和466具有橫跨(spans)後架432的寬度的水平的面板。支架464和466皆具有直立的側邊緣,可藉由分別的指旋螺絲512和522附接到後架432的側邊上的重合部件。The
第5B圖顯示第4A圖中的滑動件400的前架430中的安裝擴充卡452的過程。第一視圖530顯示具有快速周邊組件互連槽420和422的前架430。支架462附接到豎板442。擴充卡452插入豎板442的插座。擴充卡452係由支架462和豎板442支撐。然後如第二視圖540所顯示的組合的豎板442、支架462以及擴充卡452,可被插入前架430。更特定地,這允許豎板442的邊緣連接器插入快速周邊組件互連槽422。如第二視圖540所顯示,豎板442和支架462將擴充卡452定位於約為滑動件400的高度的一半的位準(level)。如內插視圖542所顯示,支架462陷入(slotted into)滑動件400的側邊上的重合部件。然後柱塞(plunger)機構被推動,以將支架462鎖定到滑動件400的側邊,柱塞機構因此將支架462固定到滑動件400的側邊。FIG. 5B shows the process of installing the
第三視圖550係滑動件400的前架430的前視圖,顯示在定位的支架462和擴充卡452。在此示例中,例如指旋螺絲552的附接裝置可被採用,以更將支架462固定到滑動件400。The
第5C圖顯示在如第5B圖所顯示的擴充卡452的安裝後,滑動件400的前架430中安裝擴充卡450的過程。第一視圖560顯示具有已安裝在前架430中的擴充卡452的前架430。如以上所解釋,支架462附接到擴充卡452和豎板442。這些組件全部被固定到前架430的壁。FIG. 5C shows the process of installing the
支架460附接到豎板440。擴充卡450插入豎板440的插座。擴充卡450係由支架460和豎板440支撐。然後如第二視圖570所顯示的組合的豎板440、支架460以及擴充卡450,可被插入前架430。更特定地,這允許豎板440的邊緣連接器插入快速周邊組件互連槽420。如第二視圖570所顯示,豎板440和支架460將擴充卡450定位於滑動件400的頂部的位準。如內插視圖572所顯示,支架460陷入(slotted into)滑動件400的側邊上的重合部件。然後柱塞機構被推動,以將支架460鎖定到滑動件400的側邊。藉由支架460和插入的豎板440兩者,附接的擴充卡450因此被固定到滑動件400。The
第三視圖580係滑動件400的前架430的前視圖,顯示支架460和擴充卡450在先前安裝的支架462和擴充卡452之上定位。在此示例中,例如指旋螺絲582的附接裝置可被採用,以更將支架460固定到滑動件400。因此,兩個擴充卡450和452以堆疊的配置被固定在前架430中。The
示例承載裝置100利用散熱器設計允許導熱問題的解決方法。示例承載裝置100的設計可在沒有任何工具的情況下、輕鬆地被安裝到擴充卡,例如第3A圖中的擴充卡300。因此,對於2U伺服器在結點(node)滑動件中的這種擴充卡、在承載裝置100中具有散熱器的可移除的M.2裝置的可用性(usability)、以及導熱上的優化(thermal optimization ) 、以及更好的利用,符合於1U或2U系統。示例M.2裝置承載裝置100與AVA或可大致上保持四個這樣的M.2型裝置卡的全高半長(FHHL)擴充卡相容。理想地,擴充卡保持具有額外的高熱設計功耗(Thermal Design Power, TDP)的四個M.2 22110型承載裝置。The
在此所使用的名詞僅出於描述特定實施例為目的,且不旨在限制本新型。如在此所使用的,單數形式「一(a, an, the)」也旨在包括複數形式,除非上下文另外明確指出。此外,名詞「包括(including, includes)」、「具有(having, has, with)」或其變化形,為使用在實施方式及/或申請專利範圍,這樣的名詞旨在以相似名詞「包括」的方式包括在內。The terms used here are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used herein, the singular form "一 (a, an, the)" is also intended to include the plural form, unless the context clearly dictates otherwise. In addition, the nouns "including (including, includes)", "having, has, with" or their variations are intended to be used in the implementation and/or the scope of the patent application. Such nouns are intended to be similar nouns "including" The way is included.
除非其他的界定,在此使用的所有名詞(包括技術和科學名詞),具有本技術領域通常知識者普遍理解的相同意義。此外,例如那些定義在常用字典的名詞,應被解讀為具有與其在該相關技術領域的語境中意義一致的意義,除非在此明確定義,不會被解讀為理想化或過度正式的意義。Unless otherwise defined, all terms used here (including technical and scientific terms) have the same meaning commonly understood by those skilled in the art. In addition, for example, nouns defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technical field. Unless clearly defined here, they will not be interpreted as idealized or excessively formal meanings.
雖然本新型的多種實施例已由以上所描述,應當理解其僅以示例且非限制的方式呈現。在不脫離本新型的精神或範圍下,可根據本揭露在此所揭露的實施例進行多種改變。因此,本新型的廣度和範圍不應受到任何上述實施例的限制。相反的,本新型的範圍應根據以下申請專利範圍及其均等物所界定。Although various embodiments of the present invention have been described above, it should be understood that they are presented in an exemplary and non-limiting manner. Various changes can be made according to the embodiments disclosed herein without departing from the spirit or scope of the present invention. Therefore, the breadth and scope of the present invention should not be limited by any of the above-mentioned embodiments. On the contrary, the scope of the present model should be defined according to the scope of the following patent applications and their equivalents.
儘管已關於一個或多個實施方式示出和描述本新型,本領域具有通常知識者經閱讀和理解本說明書和附圖後,將想到均等物和修改。另外,雖然可能已經關於幾種實施方式的僅一種實施方式揭露本新型的特定特徵,對於任何給予或特定的應用,這種特徵如可能有需求和有利的可與其他實施方式的一個或多個其他特徵組合。Although the present invention has been shown and described with respect to one or more embodiments, a person with ordinary knowledge in the art will think of equivalents and modifications after reading and understanding the specification and the drawings. In addition, although the specific features of the present invention may have been disclosed with respect to only one of the several embodiments, for any given or specific application, this feature may be combined with one or more of the other embodiments if required and advantageous. Other feature combinations.
100:承載裝置100: Carrying device
110:底散熱器110: bottom radiator
112:底導熱墊112: bottom thermal pad
114:電路板114: circuit board
116:頂散熱器116: top radiator
118:頂導熱墊118: Top thermal pad
120,122,124:扣件120, 122, 124: fasteners
130,314:邊緣連接器130,314: Edge connectors
132,172,174:邊緣132, 172, 174: Edge
134,154:半圓形缺口/缺口134,154: Semi-circular gap/notch
140:外表面140: outer surface
142:鰭片142: Fins
144,146,148:平坦邊緣區域144, 146, 148: Flat edge area
150,152:邊緣端150, 152: edge end
156,188:母重合部件156,188: Female coincident parts
158,186:公重合部件158,186: Commonly overlapped parts
160:底部表面160: bottom surface
162,164,166:凹部162, 164, 166: recess
170:中間側邊緣170: Middle side edge
172,174:側邊緣172,174: side edges
180:頂部表面180: top surface
182,184,320,322:側壁182,184,320,322: sidewall
210:頂面板210: top panel
212:接合件212: Joint
214:底面板214: bottom panel
220,328:延伸片220,328: Extension piece
222:孔222: hole
224:銷224: pin
232:外邊緣232: Outer Edge
234:半圓柱構件234: Semi-cylindrical member
300:擴充卡300: Expansion card
310:支撐電路板310: Support circuit board
312:連接器插座312: Connector socket
324:前壁324: front wall
326:格子板326: Grid Board
330:閂鎖機構330: Latch mechanism
340,342,344,346:閂鎖構件340, 342, 344, 346: latch member
350:支撐350: support
352:閂鎖352: Latch
354:半圓形端片/端片354: semicircular end piece/end piece
400:滑動件400: Sliding parts
410:主機板410: Motherboard
412,414:散熱器412,414: radiator
416:雙線記憶體模組卡416: Dual-line memory module card
420,422,424,426:快速周邊組件互連槽/槽420,422,424,426: Fast peripheral component interconnection slot/slot
430:前架430: front frame
432:後架432: back frame
440,442,444,446:豎板440,442,444,446: riser
450,452,454,456:擴充卡450,452,454,456: Expansion card
460,462,464,466:支架460,462,464,466: bracket
500,530,560:第一視圖500,530,560: first view
510,540,570:第二視圖510,540,570: second view
512,522,552,582:指旋螺絲512,522,552,582: thumbscrew
520,550,580:第三視圖520,550,580: third view
542,572:內插視圖542,572: Interpolated view
從以下示例性實施例的描述一起參照附圖,將更好理解本揭露,其中: 第1A圖顯示示例M2規格承載裝置的組件的爆炸立體圖; 第1B圖係第1A圖中的已組裝的示例承載裝置的頂部立體圖; 第1C圖係第1B圖中的已組裝的示例承載裝置的底部立體圖; 第2A圖係已組裝的承載裝置的視圖,顯示連結(binding)的扣件旋轉到開啟位置,以允許第1A圖中的組件的組裝; 第2B圖係第1B圖到第1C圖中的扣件之一的立體圖; 第3A圖係第1A圖中的承載裝置在示例的擴充卡的安裝的立體圖; 第3B圖係第3A圖中固定承載裝置之一的擴充卡的閂鎖的放大立體圖; 第4A圖係包括不同的擴充卡槽的示例伺服器滑動件,擴充卡槽保持擴充卡,例如第3A圖中的卡; 第4B圖係第4A圖中的示例伺服器滑動件具有安裝的擴充卡; 第5A圖顯示在第4A圖中的滑動件的後架(bay)中附接擴充卡的過程;以及 第5B圖到第5C圖顯示在第4A圖中的滑動件的前架中附接擴充卡的過程。 本揭露易於進行多種修改和替代形式。在附圖中已經藉由示例的方式示出一些代表性實施例,且將在此詳細描述。然而,應當理解本新型非旨在受限於所揭露的特定形式。而是,本揭露將涵蓋落入如申請專利範圍所界定的本新型的精神和範圍內的所有修改、均等物和替代形式。 The present disclosure will be better understood from the description of the following exemplary embodiments with reference to the accompanying drawings, in which: Figure 1A shows an exploded perspective view of the components of an example M2 size carrying device; Figure 1B is a top perspective view of the assembled example carrying device in Figure 1A; Figure 1C is a bottom perspective view of the assembled example carrying device in Figure 1B; Figure 2A is a view of the assembled carrying device, showing that the fastener of the binding is rotated to the open position to allow the assembly of the components in Figure 1A; Figure 2B is a perspective view of one of the fasteners in Figures 1B to 1C; Figure 3A is a perspective view of the installation of the carrier device in Figure 1A on the exemplary expansion card; FIG. 3B is an enlarged perspective view of the latch of the expansion card of one of the fixed bearing devices in FIG. 3A; Figure 4A is an example server slider that includes different expansion card slots. The expansion card slots hold expansion cards, such as the card in Figure 3A; Figure 4B is the example server slider in Figure 4A with expansion cards installed; Figure 5A shows the process of attaching an expansion card in the bay of the sliding member in Figure 4A; and Figures 5B to 5C show the process of attaching expansion cards to the front frame of the slider in Figure 4A. This disclosure is easy to make various modifications and alternative forms. Some representative embodiments have been shown by way of example in the drawings, and will be described in detail here. However, it should be understood that the present invention is not intended to be limited to the specific forms disclosed. Rather, this disclosure will cover all modifications, equivalents, and alternative forms that fall within the spirit and scope of the new model as defined by the scope of the patent application.
100:承載裝置 100: Carrying device
110:底散熱器 110: bottom radiator
112:底導熱墊 112: bottom thermal pad
114:電路板 114: circuit board
116:頂散熱器 116: top radiator
118:頂導熱墊 118: Top thermal pad
130:邊緣連接器 130: Edge connector
132:邊緣 132: Edge
134,154:半圓形缺口/缺口 134,154: Semi-circular gap/notch
140:外表面 140: outer surface
142:鰭片 142: Fins
144,146,148:平坦邊緣區域 144, 146, 148: Flat edge area
150,152:邊緣端 150, 152: edge end
156,188:母重合部件 156,188: Female coincident parts
158,186:公重合部件 158,186: Commonly overlapped parts
164:凹部 164: Concave
172,174:側邊緣 172,174: side edges
180:頂部表面 180: top surface
182,184:側壁 182,184: sidewall
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110201648U TWM618020U (en) | 2021-02-09 | 2021-02-09 | Carrier and expansion card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110201648U TWM618020U (en) | 2021-02-09 | 2021-02-09 | Carrier and expansion card |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM618020U true TWM618020U (en) | 2021-10-11 |
Family
ID=79603127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110201648U TWM618020U (en) | 2021-02-09 | 2021-02-09 | Carrier and expansion card |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM618020U (en) |
-
2021
- 2021-02-09 TW TW110201648U patent/TWM618020U/en unknown
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