TWM618020U - Carrier and expansion card - Google Patents

Abstract

A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.

Description

Carrying device and expansion card

The present disclosure generally relates to a high-capacity electronic component carrying device for an expansion card that can be inserted into a modular slot in a server slider. More specifically, the feature of the present disclosure relates to a carrying device with high heat conduction efficiency and no tools required for inserting expansion cards.

For example, an electronic device such as a server includes numerous electronic components driven by a general power supply. Generally speaking, servers are geared towards specific functions, such as storing large amounts of data or processing. The design of the server starts from the chassis, which includes drive components and general controllers, such as baseboard management controllers. Current large server designs include slots for server sliders with processors, memory, drives, and network interfaces. Such a sliding member further includes an expansion slot, which receives an expansion device card, and the expansion device card can be inserted to perform additional server functions, such as storage or processing. For example, the storage server slider may include slots for accommodating additional solid state drive (SSD) device cards, and the processing server may include slots for more device cards with processing units.

Due to the operation of internal electronic devices, such as controllers, processors, and memory, as well as components on such device cards, the server generates a lot of heat. Therefore, the server is designed to rely on the airflow through the inside of the device to take away the heat generated from the electronic components. When the size of components increases, such as memory devices, the heat generated also increases. Expansion card carrying devices for electronic components usually have a heat sink to dissipate heat from the electronic components. The radiator is generally composed of thermally conductive materials. The heat sink absorbs heat from the electronic components, and therefore conducts heat away from the components. As each generation of device cards becomes more powerful, thereby generating more heat, the challenge of removing heat also increases.

As mentioned above, the storage server slider may include solid state drive based expansion cards to increase storage capacity. The current generation of SSD cards is based on a carrier device for memory chips that conforms to the M.2 specification, such as M.2 22110. Therefore, the carrying device is specifically designed to maintain the components designed based on the M.2 specification. For example, the M.2 22110 mechanical specification has a top-side component area, which is approximately 22 mm by 110 mm, and has a golden finger connector at one end. The carrier device is inserted into the expansion card. This kind of expansion card is often installed on a vertical bracket, which is installed parallel to the main board of the server slider. In this way, multiple expansion cards can be installed on the server slider in a space-saving manner.

The next generation of memory cards generally tends to be larger M.2 carrier device size to accommodate the larger storage capacity of the solid state drive device. Currently, M.2 devices have higher capacity to expand storage capacity, such as 1TB, 2TB, 4TB, 8TB or 16TB, which requires a higher heat dissipation design power from 6.8 watts to 18 watts. Due to the desire to increase the storage capacity, the current carrying device may not be able to accommodate future solid state hard disk devices, because the current designed carrying device heat sink cannot solve the heat dissipation problem.

Therefore, there is a need for a carrying device for accommodating high heat output components such as solid state disks. There is also a need for a mechanism that does not require tools to assemble and fix the electronic components of the carrier device. There is also a need for a carrier device that can efficiently dissipate heat from a higher storage capacity and thermal power solid state drive assembly for an expansion card, such as a PCIe expansion card.

An example disclosed is a carrying device for an electronic device that can be installed in an expansion card. The carrying device includes a top radiator and a bottom radiator. The circuit board including the electronic device is arranged between the top radiator and the bottom radiator. The side fasteners include a top panel and a bottom panel. The side fastener has an open position and a closed position. When the side fastener is in the closed position, the top panel of the side fastener is in contact with the top radiator, and the bottom panel of the side fastener is in contact with the bottom radiator. The side fasteners hold the top radiator to the bottom radiator.

In another embodiment of the disclosed example carrier device, the top heat sink includes an outer surface with a plurality of fins. In another embodiment, the top heat sink includes a first edge with a notch that can be mateable with a latch on the expansion card. The top heat sink includes a second edge, and the second edge includes a circuit connector that can be overlapped with the connector socket on the expansion card. In another embodiment, the top radiator and the bottom radiator are made of aluminum alloy. In another embodiment, the circuit board complies with the M.2 specification. In another embodiment, the electronic device is a solid state drive (SSD). In another embodiment, the carrying device includes a second side fastener located on the opposite side of the first side fastener. The second side fastener has an open position and a closed position. When the second side fastener is in the closed position, the top panel of the second side fastener is in contact with the top heat sink, and the bottom panel of the second side fastener is in contact with the bottom heat sink. The second side fastener holds the top radiator to the bottom radiator. In another embodiment, the first side fastener includes a hinge coupled to the bottom heat sink. The first side fastener rotates around the hinge between an open position and a closed position. In another embodiment, the carrier device includes a top thermal pad between the circuit board and the top heat sink. The carrying device includes a bottom thermal pad between the circuit board and the bottom heat sink. In another embodiment, the bottom heat sink includes two side walls. The side walls are configured to maintain the circuit board in a lateral orientation.

Another example disclosed is an expansion card for inserting into an expansion slot of a server slider. The expansion card includes a support board and a connector socket on one side of the support board. The latch member is on the opposite side of the support plate. The connector socket and the latch member accommodate the M.2 compliant carrying device of the electronic device. The carrying device includes a top radiator and a bottom radiator. The carrying device has a circuit board and includes an electronic device arranged between the top radiator and the bottom radiator. The carrying device has a first side fastener and a second side fastener. Each of the side fasteners includes a top panel and a bottom panel. The side fastener has an open position and a closed position. When the side fastener is in the closed position, the top panel of the side fastener is in contact with the top radiator, and the bottom panel of the side fastener is in contact with the bottom radiator. The side fasteners hold the top radiator to the bottom radiator.

In another embodiment of the disclosed example expansion card, the support plate includes an edge connector for connecting to the expansion slot on the server slider. In another embodiment, the expansion slot is a Peripheral Component Interconnect (PCIe) slot. In another embodiment, the top heat sink includes a first edge with a notch, and a second edge including a circuit connector that can overlap with the socket connector. In another embodiment, the latch member includes a slidable latch that engages with the notch of the top heat sink. In another embodiment, the top radiator and the bottom radiator are made of aluminum alloy. In another embodiment, the electronic device is a solid state drive (SSD). In another embodiment, each side fastener includes a hinge coupled to one side of the bottom heat sink. The side fastener rotates around the hinge between an open position and a closed position. In another embodiment, the carrying device further includes a top thermal pad between the circuit board and the top heat sink, and a bottom thermal pad between the circuit board and the bottom heat sink. In another embodiment, the bottom heat sink includes two side walls. The side walls are configured to maintain the circuit board in a lateral orientation.

The above new content is not intended to represent every embodiment or every feature of this disclosure. Rather, the aforementioned new content only provides examples of some of the novel features and features set forth herein. The above features and advantages and other features and advantages of the present disclosure will be apparent from the following detailed description of representative embodiments and modes when the accompanying drawings and the scope of the appended patent application are combined.

The invention can be implemented in many different forms. Representative embodiments are shown in the drawings and will be described in detail here. The present disclosure is an example or description of the disclosed principles, and is not intended to limit the broad features of the present disclosure to the illustrated embodiments. To this limit, the disclosed elements and limitations, for example, in the abstract, new content, implementation paragraphs, but not explicitly stated in the scope of the patent application, should not be implied, inferred or otherwise individually or collectively Incorporated into the scope of patent application. For the purpose of this embodiment, unless explicitly stated otherwise, the singular includes the plural and vice versa. The noun "including" means "including but not limited to." In addition, similar words such as "about (about, almost, substantially, approximately)" and similar words can mean "在(at)", "近于(near, nearly at)", "在3% Within 5% (within 3-5% of)", "within acceptable manufacturing tolerances" or any logical combination thereof.

The present disclosure is directed to an example M2 carrying device with two heat sinks and a rotatable fastener. The rotatable fastener ensures that the two heat sinks have good contact with the thermal pad to allow electronic components to have high thermal energy. The M.2 carrier device described here can be installed in an expansion card that accommodates four carrier devices.

Fig. 1A is an exploded view of the components of the example carrying device 100, and the example carrying device 100 complies with the M.2 22110 specification standard. Therefore, the carrier device accommodates an M.2 type component card with a footprint of 22 mm by 110 mm. Figure 1B is a top perspective view of the assembled example carrying device 100. Figure 1C is a bottom perspective view of the assembled example carrying device 100. Figure 2A is a view of the assembled carrier device 100, showing the side fasteners rotated to the open position to allow assembly of the components in Figure 1.

As shown in FIG. 1A, the carrier device 100 includes a bottom heat sink 110, a bottom thermal pad 112, a circuit board 114, a top heat sink 116, and a top thermal pad 118. In this example, the circuit board 114 fits the size of the M.2 22110 carrying device. The circuit board 114 in this example includes electronic components, such as a non-volatile memory solid state drive (NVME SSD). Other types of cards, such as Samsung PM983 solid state hard disk or Intel P45113D NAND hard disk, can also use the carrier device 100. When the carrier device 100 is assembled, the circuit board 114 is disposed between the bottom heat sink 110 and the top heat sink 116. In this example, both the bottom heat sink 110 and the top heat sink 116 are made of aluminum alloy with a high K factor, but other suitable thermally conductive materials can also be used.

As shown in Figures 1B to 1C, the three side fasteners 120, 122, and 124 are connected to the top heat sink 116, the top thermal pad 118 (Figure 1A), the bottom heat sink 110, the circuit board 114, and the bottom thermal pad 112 are attached to each other to form an assembled carrier device 100. Each of the fastener 120, the fastener 122, and the fastener 124 has a general “U” shape and provides compressive force to the top heat sink 116 and the bottom heat sink 110. As will be explained, the side fasteners 120, 122, and 124 can be rotated away from the bottom heat sink 110 to allow other components of the carrying device 100 to be removed. When the side fasteners 120, 122, and 124 rotate to the closed position, the side fasteners 120, 122, and 124 are joined with the top heat sink 116, the top thermal pad 118, the bottom heat sink 110, the circuit board 114, and the bottom thermal pad 112. . The circuit board 114 rests on the bottom thermal pad 112 and is similarly positioned by the side fasteners 120, 122, and 124 and the bottom heat sink 110, and is restricted from moving laterally. The circuit board 114 may include electronic components, such as solid-state memory chips and supporting circuits. The edge connector 130 extends from one end of the circuit board 114. The edge connector 130 may include a gold finger type connector. The opposite edge 132 (Figure 1A) includes a semi-circular notch 134 bordered by a conductive material to serve as a mechanical ground pad.

The top heat sink 116 includes a bottom surface, and the bottom surface is placed in contact with the top thermal pad 118 to conduct heat generated by the electronic components of the circuit board 114. The top heat sink 116 has an outer surface 140 that includes a pattern of fins 142 extending from the outer surface 140. The fins 142 help heat dissipation by increasing the surface area of the outer surface 140, allowing more heat dissipation. Except for the three flat edge regions 144, 146, and 148, the fin 142 is manufactured substantially on the entire outer surface 140. Each of the flat edge regions 144, 146, and 148 has a shape that overlaps the respective fasteners 120, 122, and 124. The outer surface 140 has opposite edge ends 150 and 152. The semicircular notch 154 is formed at one of the edge ends 150. The top radiator 116 includes a registration feature that allows alignment when the top radiator 116 is attached to the bottom radiator 110. In this example, the top heat sink 116 includes two female coincident parts 156 (one on each side near the edge end 150) and two male coincident parts 158 (one on each side near the edge end 152).

As shown in FIG. 1A, FIG. 1C, and FIG. 2A, the bottom heat sink 110 includes a bottom surface 160 that is substantially flat. Three recesses 162, 164, and 166 are formed on the edge of the bottom surface 160. The bottom heat sink 110 includes a middle side edge 170 and two opposite side edges 172 and 174 that are offset from each other. The fasteners 120 and 124 are located on both sides of the middle side edge 170 defining one end of the recesses 162 and 166. The fastener 122 is located between the side edges 172 and 174 on the other side defining the recess 164.

The opposite top surface 180 (FIG. 1A) of the bottom heat sink 110 includes two side walls 182 and 184 (FIG. 1A), and the side walls 182 and 184 are arranged parallel to each other at the edges close to the top surface 180. The two side walls 182 and 184 allow alignment of the bottom thermal pad 112 and the circuit board 114 (Figure 1B). The side wall 182 and the side wall 184 limit the lateral movement of the circuit board and the bottom thermal pad 112. In this example, the side wall 182 and the side wall 184 include two male coincident parts 186 (Figure 1A) and two female coincident parts 188 (Figure 1A). When the bottom radiator 110 is attached to the top radiator 116, the male coincident part 186 and the female coincident part 156 (Figure 1A) of the top radiator 116 are mated with (mated with), and the female coincident part 188 and the top radiator 116 are mated with The male and coincident parts 158 (Figure 1A) overlap.

The fasteners 120, 122, and 124 in this example are made of stainless steel, but any flexible material with sufficient tensile strength can be used. FIG. 2B is a bottom perspective view of the side fastener 122 with respect to the bottom heat sink 110 in FIGS. 1B to 1C. The fastener 122 is the same as the fastener 120 and the fastener 124. For illustrative purposes, the elements of the fastener 122 are shown in Figure 2B, but it should be understood that the following description refers to the same fasteners 120 and 124. The fastener 122 includes a top panel 210 having the same shape as the flat edge area 146 formed on the outer surface 140 of the top heat sink 116 in FIG. 2A. The bottom panel 214 is joined to the top panel 210 by the joining member 212 to form a "U" shape. The shape of the bottom panel 214 conforms to the shape of the recess 164 on the bottom heat sink 110. The width of the bottom panel 214 fits between the edge 172 (Figure 2A) and the edge 174. The bottom panel 214 includes an extension piece 220 having a hole 222. The hole 222 overlaps the pin 224, and the pin 224 is formed in the recess 164 of the bottom surface 160 of the bottom heat sink 110. A pin 224 is inserted into the hole 222 of the extension piece 220, and the pin 224 serves as a hinge. Therefore, the fastener 122 can be rotated between the open position shown in Fig. 2A and the closed position shown in Figs. 1B to 1C. In the closed position, the top panel 210 contacts the top heat sink 116 and the bottom panel 214 contacts the bottom heat sink 110. The side fastener 122 thus joins the top heat sink 116 to the bottom heat sink 110. The side fastener 122 provides compressive force to the radiators 110 and 116 in the closed position. The top panel 210 includes an outer edge 232 that forms a semi-cylindrical member 234 that allows a user to manipulate the fastener 122. There are three side fasteners in this example, but other numbers of fasteners can be used. For example, one fastener on each side can be used, or two fasteners on each side can be used. The configuration of the three fasteners provides consistent force on the top heat sink 116 and the bottom heat sink 110 to engage the components on the circuit board 114 and thus promote thermal conductivity.

FIG. 3A is a perspective view of the M.2 type carrying device 100 in FIG. 1A mounted to the expansion card 300. As shown in FIG. The expansion card 300 in this example can accommodate up to four M.2 22110 carrier devices, such as the carrier device 100. The M.2 22110 carrier device holds electronic components, such as solid state drives (SSDs). In this example, the expansion card 300 is an OCP AVA-4 M.2 carrier device card, and the OCP AVA-4 M.2 carrier device card is a Fast Peripheral Component Interconnect Full Height Half Length (FHHL) specification card , Available from Quanta Computer Inc.. The expansion card 300 includes a supporting circuit board 310, and for each of the four M.2 carrying devices, the supporting circuit board 310 has a set of connector sockets 312.

The support circuit board 310 has an edge connector 314 that allows the expansion card 300 to be attached to the connector on the riser. The edge connector 314 may have a gold finger connector. The expansion card 300 includes two side walls 320 and 322. The front wall 324 joins the side wall 320 and the side wall 322. The front wall 324 includes a grid plate 326 that allows airflow to flow through the carrying device. The front wall 324 holds an extension piece 328 that can be used to locate the expansion card 300 in the computing device. The latch mechanism 330 is supported by the side wall 320 to allow the expansion card 300 to be attached to the riser. The supporting circuit board 310 includes four latch members 340, 342, 344, and 346, and each latch member 340, 342, 344, and 346 is located opposite one of the connector sockets 312.

FIG. 3B is an enlarged perspective view of the latch member 340 supported by the supporting circuit board 310. The same elements are marked with the same symbols as their counterparts in Figure 3A. The latch member 340 includes a support 350 that is the height of the carrying device 100. One end of the support 350 is attached to the support circuit board 310. The other end of the support 350 holds a slidable metal latch 352. The metal latch 352 has an open position retracted from the carrier device 100 and a closed position toward the carrier device 100. The metal latch 352 in this example is spring-biased to the closed position by the spring in the support 350. The metal latch 352 has a semicircular end piece 354 at one end.

The edge connector 130 of the carrier device 100 is attached to one of the connector sockets 312 on one end of the supporting circuit board 310 in Figure 3A. The other end of the carrying device 100 includes a semicircular notch 154 in the top radiator 116. The notch 154 accommodates the shape of the end piece 354 of the metal latch 352. The latch 352 is pulled out to compress the spring inside. When the latch 352 is pulled out to the open position, the carrier device 100 can be inserted between the connector socket 312 (Figure 3A) and the support 350. Once the carrier device 100 is inserted, the latch 352 is forced forward by the spring, so that the end piece 354 overlaps the notch 154. In the closed position, the bottom of the end piece 354 of the latch 352 is in contact with the conductive material surrounding the semicircular notch 134 (Figure 1A) in the circuit board 114 to ground the circuit board 114. Therefore, the mechanical grounding is provided by the contact between the terminal piece 354 and the conductive material on the circuit board 114. The latch 352 keeps the carrier device 100 in position through the contact of the end piece 354 to the notch 154.

Figure 4A is a perspective view of an example case slider 400 for use in a computing system, such as a server. Figure 4B shows an example chassis slider 400 with risers and expansion cards. The expansion card is similar to the expansion card 300 in Figure 3A. It is understood that a plurality of sliding members such as the sliding member 400 may be inserted into the case. The sliding member 400 includes an expansion slot, and the expansion slot holds an upright riser for positioning an expansion card, such as the expansion card 300 in FIG. 3A.

In this example, the slider 400 includes a motherboard 410, and the motherboard 410 installs two processors under the heat sink 412 and the heat sink 414. A series of dual-line memory module (DIMM) cards 416 are installed on the side of the processor. In this example, the chassis includes four rapid peripheral component interconnection slots 420, 422, 424, and 426. The front frame 430 includes rapid peripheral component interconnection grooves 420 and 422 on the main board 410 on the side of the front frame 430. The rear frame 432 includes rapid peripheral component interconnection grooves 424 and 426 on the main board 410 on the side of the rear frame 432.

In this example, the riser 440 is inserted into the rapid peripheral component interconnection slot 420. The riser 440 has an edge connector inserted into the slot 420. The riser 440 includes a card connector that is close to the top of the riser 440 to hold an expansion card, such as the expansion card 300 in Figure 3A. Similarly, the riser 442 is inserted into the rapid peripheral component interconnection slot 422. The riser 442 has an edge connector inserted into the slot 422. The riser 442 includes a card connector, and the card connector is close to the middle of the riser 442 to maintain the expansion card. Therefore, the two expansion cards in the front frame 430 are stacked on each other, and thus can be full-length cards that extend across the width of the slider 400.

Similarly, the riser 444 is inserted into the rapid peripheral component interconnection slot 424. The riser 444 has an edge connector inserted into the rapid peripheral component interconnection slot 424. The riser 444 includes a card connector near the top of the riser 444 to hold an expansion card, such as the expansion card 300 in Figure 3A. Similarly, the riser 446 is inserted into the rapid peripheral component interconnection slot 426. The riser 446 has an edge connector inserted into the slot 426. The riser 446 includes a card connector near the middle of the riser 446 to hold the expansion card. Therefore, the two expansion cards in the rear frame 432 are stacked on each other, and thus can be full-length cards that extend across the width of the slider 400.

Figure 4B shows a slider 400 with four expansion cards 450, 452, 454, and 456. The four expansion cards 450, 452, 454, and 456 are attached to different risers 440 and 442 in the front frame 430, and The risers 444 and 446 in the rear frame 432. The exemplary expansion card 450 shown in the enlarged view is the same as the expansion card 300 in FIG. 3A, and holds four M.2 storage and carrying devices, such as the carrying device 100 in FIG. 1A. In this example, the four expansion cards 450, 452, 454, and 456 all include four solid-state disk storage and carrying devices, such as the carrying device 100 in FIG. 1A.

Figure 5A shows the process of installing two expansion cards 454 and 456 in the rear frame 432 of the server slider 400. The first view 500 shows the rear frame 432 with rapid peripheral component interconnection grooves 424 and 426. The bracket 466 is attached to the riser 446. The expansion card 456 is inserted into the socket of the riser 446. The expansion card 456 is supported by the bracket 466 and the riser 446. Then, the combined riser 446, bracket 466, and expansion card 456 as shown in the second view 510 can be inserted into the rear frame 432. More specifically, this allows the edge connector of the riser 446 to be inserted into the rapid peripheral component interconnect slot 426. As shown in the second view 510, the riser 446 and the bracket 466 position the expansion card 456 at a level that is approximately half the height of the slider 400. In this example, an attachment device such as a thumb screw 512 may be adopted to fix the bracket 466 to the slider 400.

The third view 520 shows the attachment of another bracket 464 connected to the riser 444. The edge connector of the riser 444 is inserted into the rapid peripheral component interconnection slot 424. The riser 444 supports the expansion card 454 on the top of the sliding member 400. An attachment device such as a thumb screw 522 is adopted to fix the bracket 464 to the slider 400. In this example, each bracket 464 and 466 has a horizontal panel that spans the width of the rear frame 432. Both brackets 464 and 466 have upright side edges, which can be attached to overlapping parts on the side of the rear frame 432 by means of thumb screws 512 and 522, respectively.

FIG. 5B shows the process of installing the expansion card 452 in the front frame 430 of the slider 400 in FIG. 4A. The first view 530 shows the front frame 430 with the rapid peripheral component interconnection grooves 420 and 422. The bracket 462 is attached to the riser 442. The expansion card 452 is inserted into the socket of the riser 442. The expansion card 452 is supported by the bracket 462 and the riser 442. Then, the combined riser 442, bracket 462, and expansion card 452 as shown in the second view 540 can be inserted into the front frame 430. More specifically, this allows the edge connector of the riser 442 to be inserted into the rapid peripheral component interconnection slot 422. As shown in the second view 540, the riser 442 and the bracket 462 position the expansion card 452 at a level that is approximately half the height of the slider 400. As shown in the inset view 542, the bracket 462 is slotted into the coincident parts on the side of the slider 400. The plunger mechanism is then pushed to lock the bracket 462 to the side of the slider 400, and the plunger mechanism therefore fixes the bracket 462 to the side of the slider 400.

The third view 550 is a front view of the front frame 430 of the sliding member 400, showing the bracket 462 and the expansion card 452 in position. In this example, an attachment device such as a thumb screw 552 may be used to further fix the bracket 462 to the slider 400.

FIG. 5C shows the process of installing the expansion card 450 in the front frame 430 of the slider 400 after the expansion card 452 is installed as shown in FIG. 5B. The first view 560 shows the front frame 430 with the expansion card 452 installed in the front frame 430. As explained above, the bracket 462 is attached to the expansion card 452 and the riser 442. These components are all fixed to the wall of the front frame 430.

The bracket 460 is attached to the riser 440. The expansion card 450 is inserted into the socket of the riser 440. The expansion card 450 is supported by the bracket 460 and the riser 440. Then, the combined riser 440, bracket 460, and expansion card 450 as shown in the second view 570 can be inserted into the front frame 430. More specifically, this allows the edge connector of the riser 440 to be inserted into the rapid peripheral component interconnection slot 420. As shown in the second view 570, the riser 440 and the bracket 460 position the expansion card 450 at the top level of the slider 400. As shown in the inset view 572, the bracket 460 is slotted into coincident parts on the side of the slider 400. The plunger mechanism is then pushed to lock the bracket 460 to the side of the slider 400. With both the bracket 460 and the inserted riser 440, the attached expansion card 450 is thus fixed to the slider 400.

The third view 580 is a front view of the front frame 430 of the slider 400, showing that the bracket 460 and the expansion card 450 are positioned on the bracket 462 and the expansion card 452 previously installed. In this example, an attachment device such as a thumb screw 582 may be used to further fix the bracket 460 to the slider 400. Therefore, the two expansion cards 450 and 452 are fixed in the front frame 430 in a stacked configuration.

The example carrier device 100 utilizes a heat sink design to allow a solution to the heat conduction problem. The design of the example carrier device 100 can be easily installed on an expansion card, such as the expansion card 300 in Figure 3A, without any tools. Therefore, for the 2U server, the expansion card in the node slider, the usability of the removable M.2 device with a heat sink in the carrier device 100, and the optimization of heat conduction ( thermal optimization ), and better utilization, in line with 1U or 2U systems. The example M.2 device carrying device 100 is compatible with AVA or a full-height half-length (FHHL) expansion card that can hold approximately four such M.2 type device cards. Ideally, the expansion card maintains four M.2 22110 type bearing devices with additional high thermal design power (TDP).

The terms used here are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used herein, the singular form "一 (a, an, the)" is also intended to include the plural form, unless the context clearly dictates otherwise. In addition, the nouns "including (including, includes)", "having, has, with" or their variations are intended to be used in the implementation and/or the scope of the patent application. Such nouns are intended to be similar nouns "including" The way is included.

Unless otherwise defined, all terms used here (including technical and scientific terms) have the same meaning commonly understood by those skilled in the art. In addition, for example, nouns defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technical field. Unless clearly defined here, they will not be interpreted as idealized or excessively formal meanings.

Although various embodiments of the present invention have been described above, it should be understood that they are presented in an exemplary and non-limiting manner. Various changes can be made according to the embodiments disclosed herein without departing from the spirit or scope of the present invention. Therefore, the breadth and scope of the present invention should not be limited by any of the above-mentioned embodiments. On the contrary, the scope of the present model should be defined according to the scope of the following patent applications and their equivalents.

Although the present invention has been shown and described with respect to one or more embodiments, a person with ordinary knowledge in the art will think of equivalents and modifications after reading and understanding the specification and the drawings. In addition, although the specific features of the present invention may have been disclosed with respect to only one of the several embodiments, for any given or specific application, this feature may be combined with one or more of the other embodiments if required and advantageous. Other feature combinations.

100: Carrying device

110: bottom radiator

112: bottom thermal pad

114: circuit board

116: top radiator

118: Top thermal pad

120, 122, 124: fasteners

130,314: Edge connectors

132, 172, 174: Edge

134,154: Semi-circular gap/notch

140: outer surface

142: Fins

144, 146, 148: Flat edge area

150, 152: edge end

156,188: Female coincident parts

158,186: Commonly overlapped parts

160: bottom surface

162, 164, 166: recess

170: Middle side edge

172,174: side edges

180: top surface

182,184,320,322: sidewall

210: top panel

212: Joint

214: bottom panel

220,328: Extension piece

222: hole

224: pin

232: Outer Edge

234: Semi-cylindrical member

300: Expansion card

310: Support circuit board

312: Connector socket

324: front wall

326: Grid Board

330: Latch mechanism

340, 342, 344, 346: latch member

350: support

352: Latch

354: semicircular end piece/end piece

400: Sliding parts

410: Motherboard

412,414: radiator

416: Dual-line memory module card

420,422,424,426: Fast peripheral component interconnection slot/slot

430: front frame

432: back frame

440,442,444,446: riser

450,452,454,456: Expansion card

460,462,464,466: bracket

500,530,560: first view

510,540,570: second view

512,522,552,582: thumbscrew

520,550,580: third view

542,572: Interpolated view

The present disclosure will be better understood from the description of the following exemplary embodiments with reference to the accompanying drawings, in which: Figure 1A shows an exploded perspective view of the components of an example M2 size carrying device; Figure 1B is a top perspective view of the assembled example carrying device in Figure 1A; Figure 1C is a bottom perspective view of the assembled example carrying device in Figure 1B; Figure 2A is a view of the assembled carrying device, showing that the fastener of the binding is rotated to the open position to allow the assembly of the components in Figure 1A; Figure 2B is a perspective view of one of the fasteners in Figures 1B to 1C; Figure 3A is a perspective view of the installation of the carrier device in Figure 1A on the exemplary expansion card; FIG. 3B is an enlarged perspective view of the latch of the expansion card of one of the fixed bearing devices in FIG. 3A; Figure 4A is an example server slider that includes different expansion card slots. The expansion card slots hold expansion cards, such as the card in Figure 3A; Figure 4B is the example server slider in Figure 4A with expansion cards installed; Figure 5A shows the process of attaching an expansion card in the bay of the sliding member in Figure 4A; and Figures 5B to 5C show the process of attaching expansion cards to the front frame of the slider in Figure 4A. This disclosure is easy to make various modifications and alternative forms. Some representative embodiments have been shown by way of example in the drawings, and will be described in detail here. However, it should be understood that the present invention is not intended to be limited to the specific forms disclosed. Rather, this disclosure will cover all modifications, equivalents, and alternative forms that fall within the spirit and scope of the new model as defined by the scope of the patent application.

100: Carrying device

110: bottom radiator

112: bottom thermal pad

114: circuit board

116: top radiator

118: Top thermal pad

130: Edge connector

132: Edge

134,154: Semi-circular gap/notch

140: outer surface

142: Fins

144, 146, 148: Flat edge area

150, 152: edge end

156,188: Female coincident parts

158,186: Commonly overlapped parts

164: Concave

172,174: side edges

180: top surface

182,184: sidewall

Claims (10)

A bearing device for an electronic device that can be installed in an expansion card, the bearing device comprising: A radiator A bottom radiator; A circuit board including the electronic device arranged between the top radiator and the bottom radiator; and A first side fastener includes a top panel and a bottom panel. The first side fastener has an open position and a closed position. When the first side fastener is in the closed position, the first side fastener The top panel of the component is in contact with the top radiator, and the bottom panel of the first side fastener is in contact with the bottom radiator, wherein the first side fastener holds the top radiator to the bottom radiator. Such as the carrying device of claim 1, wherein the top radiator includes an outer surface with a plurality of fins. Such as the carrying device of claim 1, wherein the top heat sink includes a first edge and a second edge, the first edge has a notch that can overlap with a latch on the expansion card, and the second edge includes A circuit connector can be overlapped with a connector socket on the expansion card. Such as claim 1, wherein the top radiator and the bottom radiator are made of aluminum alloy. Such as the carrying device of claim 1, wherein the circuit board complies with an M.2 specification. For example, the carrying device of claim 1, further comprising a second side fastener located on the opposite side of the first side fastener, wherein the second side fastener has an open position and a closed position, and when the first side fastener When the two-side fastener is in the closed position, the top panel of the second side fastener is in contact with the top radiator, and the bottom panel of the second side fastener is in contact with the bottom radiator, wherein the second side The fastener holds the top radiator to the bottom radiator. The carrier device of claim 1, wherein the first side fastener includes a hinge coupled to the bottom radiator, and the first side fastener rotates around the hinge between the open position and the closed position. For example, the bearing device of claim 1, further including: A top thermal pad between the circuit board and the top heat sink; and A bottom thermal pad between the circuit board and the bottom heat sink. Such as the carrying device of claim 1, wherein the bottom heat sink includes two side walls, wherein the side walls are configured to keep the circuit board in a lateral orientation. An expansion card for inserting into an expansion slot of a server slider, the expansion card comprising: A support plate; A connector socket on one side of the support plate; and A latch member, on the opposite side of the support plate, in which the connector socket and the latch member accommodate a carrier device conforming to M.2 of an electronic device, the carrier device comprising: A radiator A bottom radiator; A circuit board including the electronic device arranged between the top radiator and the bottom radiator; and A first side fastener and a second side fastener, each of the first side fastener and the second side fastener includes a top panel and a bottom panel, the first side fastener and the second side The fastener has an open position and a closed position. When the first side fastener and the second side fastener are in the closed position, the top panel and the second side fastener of the first side fastener and the second side fastener are in the closed position. The top radiator is in contact, and the bottom panel of the first side fastener and the second side fastener is in contact with the bottom radiator, wherein the first side fastener and the second side fastener hold the top radiator To the bottom radiator.

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