M372611 五、新型說明： 【新型所屬之技術領域】 本新型是有關於一種伺服器裝置，特別是有關於一種 具有儲存陣列模組之伺服器裝置。 【先前技術】 按，機架單位是美國電子工業聯盟（EIA)用來標定伺 服器的單位。一個機架單位，一般叫做”1U”，實際上高度 為1.75英寸（約44.5毫米），寬度為19英寸；兩個機架單 位，一般叫做”2U”，實際上高度為1.75英寸*2 (約89毫 米），寬度仍為19英寸，依此類推。因此所稱N個機架單 位下之伺服器内部之零組件無論如何搭配，在一定之規格 限定下，必須相容於此一高度中。按，機架單位是美國電 子工業聯盟（EIA)用來標定伺服器的單位。一個機架單位， 一般叫做"1U”，實際上高度為1.75英寸（約44.5毫米）， 寬度為19英寸；兩個機架單位，一般叫做"21T，實際上高 度為1.75英寸*2 (約89毫米），寬度仍為19英寸，依此 類推。因此，依據上述規則所稱之N個機架單位下的伺服 器中，其内部之零組件無論如何搭配，在一定之規格限定 下，必須相容於此一高度中。 目前市場上業界所提供之"21T規格的伺服器機箱雖已 提升空間利用率，但並無擴充性。通常’'2U”伺服器機箱内 包含有主機、電源供應器及訊號線，電源供應器用以提供 主機所需要之電源，訊號線用以電性連接主機之各元件。 M372611 各該主機板進一步具有一硬碟機承載架，其中該硬碟機承 載架中放置有多個硬碟。然而，由於訊號線之配線限制， 一般2U規格之伺服主機機箱無法有效利用空間，僅能提 供容納主機的數量不多，更別遑論提供擴充其他功能模 組，以及增加功能模組之元件數量。 【新型内容】 有鑒於此，本新型一方面揭露一種具有儲存陣列模組 之伺服器裝置，冀望於儲存陣列模組上放置更多硬碟裝 置，提昇可承載硬碟裝置的數量，增加伺服器裝置之資料 儲存性能。 本新型另一方面揭露一種具有儲存陣列模組之伺服器 裝置，有效地增加伺服器單元之效率。 此種伺服器裝置具雙倍機架單位之規格，至少包括一 機殼及至少一儲存陣列模組。儲存陣列模組包括一第一托 盤、一硬碟背板、多個第一硬碟裝置及多個第二硬碟裝置。 第一托盤可抽取地設於機殼之一端。豎立地設於該第一托 盤上，具有相對應之第一面及第二面。第一硬碟裝置分別 依據一陣列之排列方式，排列在硬碟背板之第一面，並與 硬碟背板電性連接。第二硬碟裝置分別依據此陣列之排列 方式排列在硬碟背板之第二面，並與硬碟背板電性連接。 其中第一硬碟裝置與第二硬碟裝置相互為一百八十度反向 設置。 另外，儲存陣列模組更包括多個第一硬碟接口及多個 第二硬碟接口。第一硬碟接口分別設置於硬碟背板之第一 M372611 面上，且一對一地與第一硬碟裝置電性連接。第二硬碟接 口分別設置於硬碟责板之第一面上’ 一對一地與第二硬碟 裝置電性連接，其中第一硬碟接口與第二硬碟接口分別相 互交錯地排列於硬碟背板上。M372611 V. New Description: [New Technology Field] The present invention relates to a server device, and more particularly to a server device having a storage array module. [Prior Art] Press, the rack unit is the unit used by the Electronic Industries Alliance (EIA) to calibrate the servo. A rack unit, commonly called "1U", actually has a height of 1.75 inches (about 44.5 mm) and a width of 19 inches; two rack units, commonly called "2U", actually have a height of 1.75 inches * 2 (about 89 mm), the width is still 19 inches, and so on. Therefore, the components inside the server under the N rack units must be matched to this height regardless of the specifications. Press, the rack unit is the unit used by the Electronic Industries Alliance (EIA) to calibrate the server. A rack unit, commonly called "1U", actually has a height of 1.75 inches (about 44.5 mm) and a width of 19 inches; two rack units, commonly called "21T, actually have a height of 1.75 inches*2 ( About 89 mm), the width is still 19 inches, and so on. Therefore, according to the above rules, the internal components of the server in N rack units are matched by certain specifications. It must be compatible with this height. Currently, the "21T" server chassis provided by the industry has improved space utilization, but there is no expansion. Usually the ''2U' server chassis contains a host, The power supply and the signal line, the power supply is used to provide the power required by the host, and the signal line is used to electrically connect the components of the host. M372611 Each of the motherboards further has a hard disk carrier, wherein a plurality of hard disks are placed in the hard disk carrier. However, due to the wiring restrictions of the signal lines, the general 2U-size servo host chassis cannot effectively utilize the space, and only a small number of hosts can be provided, not to mention the expansion of other functional modules and the increase in the number of components of the functional modules. [New content] In view of this, the present invention discloses a server device having a storage array module, which is expected to place more hard disk devices on the storage array module, increase the number of hard disk devices that can be carried, and increase the number of servers. Data storage performance of the device. Another aspect of the present invention discloses a server device having a storage array module, which effectively increases the efficiency of the server unit. The server device has a double rack unit size and includes at least one housing and at least one storage array module. The storage array module includes a first tray, a hard disk backplane, a plurality of first hard disk devices, and a plurality of second hard disk devices. The first tray is detachably provided at one end of the casing. It is erected on the first tray and has a corresponding first side and second side. The first hard disk devices are arranged on the first side of the hard disk backplane according to an array arrangement, and are electrically connected to the hard disk backplane. The second hard disk device is arranged on the second side of the hard disk backplane according to the arrangement of the array, and is electrically connected to the hard disk backplane. The first hard disk device and the second hard disk device are mutually opposite one hundred and eighty degrees. In addition, the storage array module further includes a plurality of first hard disk interfaces and a plurality of second hard disk interfaces. The first hard disk interfaces are respectively disposed on the first M372611 surface of the hard disk backplane, and are electrically connected to the first hard disk device one-to-one. The second hard disk interface is respectively disposed on the first side of the hard disk device, and is electrically connected to the second hard disk device one-to-one, wherein the first hard disk interface and the second hard disk interface are respectively arranged alternately with each other. Hard disk backplane.
伺服器裝置更包括至少一可抽取式之主機板模組、電 源模組、輸入輸出界面電路板模組。主機板模組設於機殼 之一端’以及儲存陣列模組之下方’且主機板模組與硬碟 背板電性連接。電源模組設於機殼之另端。輸入輸出界面 電路板模組設於機殼之另端，位於電源模組之—側，且對 應主機板模組。 伺服器裝置更包括一可延展/收折之支撐臂及一導線 組，支撐臂係由多個連桿成串聯方式排列並依序樞設而 成’支撐臂之兩末端分別樞接機殼與第一托盤。導線=配 置於支射上’隨支_延展/收折’其—端電性連接硬= 背板，另端電性連接輸入輸出界面電路板。The server device further comprises at least one removable motherboard module, a power module, and an input/output interface circuit board module. The motherboard module is disposed at one end of the casing and below the storage array module, and the motherboard module is electrically connected to the hard disk backplane. The power module is located at the other end of the casing. Input/Output Interface The circuit board module is located at the other end of the chassis, on the side of the power module, and corresponds to the motherboard module. The server device further comprises an extendable/retractable support arm and a wire set. The support arm is arranged in series by a plurality of connecting rods and is sequentially pivoted. The two ends of the support arm are respectively pivotally connected to the casing and The first tray. The wire = is placed on the branch. 'With the branch _ extension / folding' its end is electrically connected to the hard = back plate, and the other end is electrically connected to the input and output interface circuit board.
第一托盤更包括一可收合/轉出之握把結構 者推入/拉出對應之托盤。 以供使用 ，使其得以 提升伺服器 綜上所述，藉由本新型上述之伺服器麥置 於固定之空間中’提供更多的資料儲存服^， 單元之性能。 【實施方式】 以下將以圖示及詳細說明清楚說明本新型之精神，如 熟悉此技術之人貝在瞭解本新型之實施例後#可由本新 型所教示之技術’加以改變騎飾，麵錢ς本新型之 6 M372611 精神與範圍。 本新型係揭露-種儲存陣列模組，特別是词服器裝置 上之儲存陣列模組。儲存陣列餘可自舰器裝置之一端 抽出’其上具有-豎立之背板，背板之兩對應面分別垂直 地設有許多硬碟裝置，這些硬碟裝置於背板之兩對應面相 互為一百八十度反向設置。 在以下敘述中，伺服器裝置不限於單倍機架單位（lu) 或雙倍機架單位（2U)之規格。以下說明係以雙倍機架單 位（2U)之規格的伺服器裝置為例，以清楚說明本新型之 實施方式。 請參閱第1圖所示’第1圖為本新型具有儲存陣列模 組之祠服器裝置於一實施例中之立體示意圖。此伺服器裝 置10包括·一機殼1 ’機殼1 〇〇之高度（厚度）約2*1 75 英吋，其橫截面呈”u”字型或”口”字型。其中此機殼100用 以至少容置兩個可抽取之主機板模組200、儲存陣列模組 300、電源模組400及輸入輸出（Input/Output)界面電路 板模組5〇0。 此機殼100相背對之兩端分別具有相接通之一第一開 口 101及一第二開口 105，第一開口 101相對機殼1〇〇高 度（厚度）的方向可劃分出一上層區102及一下層區103。 第一開口 1〇1立設一中央區隔豎板110’中央區隔豎板110 與機殼1〇〇之一側内壁分別於上層區102及下層區中 各設有二個相互面對之移動滑軌120,任二相互面對之移 動滑執120玎支撐一托盤，並提供此托盤於移動滑軌I20 上相對地移動。如此，中央區隔豎板分別於上層區102 7 M372611 及下層區103中合計可供放置4個托盤，換言之，中央區 隔豎板110之兩對應面於上層區1〇2及下層區1〇3中同時 共有四個第一容置空間104。 機设100另端於第一開口 105之中央位置處立設一承 載架130,第二開口 105被承載架130區隔成兩個第二容 置空間106。相同地，承載架13〇與機殼1〇〇之一侧内壁 亦各設有上述可支撐托盤之移動滑軌12〇。如此，中央承 載架130分別於機殼1〇〇中合計可供放置2個托盤。、The first tray further includes a collapsible/retractable grip structure for pushing/pulling the corresponding tray. For use, it is possible to improve the server. As described above, the above-mentioned server is placed in a fixed space to provide more data storage services and unit performance. [Embodiment] Hereinafter, the spirit of the present invention will be clearly illustrated by the drawings and the detailed description. If the person familiar with the technology understands the embodiment of the present invention, the technique can be changed by the technique taught by the present invention. The new 6 M372611 spirit and scope. The present invention discloses a storage array module, particularly a storage array module on a vocabulary device. The storage array can be extracted from one end of the device to have an erected back plate, and the two opposite faces of the back plate are respectively vertically provided with a plurality of hard disk devices, and the two hard disk devices are mutually opposite to each other on the opposite side of the back plate One hundred and eighty degrees reverse setting. In the following description, the server device is not limited to the specifications of a single rack unit (lu) or a double rack unit (2U). The following description is made by taking a server device of a double rack unit (2U) as an example to clearly explain the embodiment of the present invention. Referring to Fig. 1, a first perspective view of a device with a storage array module is shown in an embodiment. The server device 10 includes a housing 1 ′ housing 1 高度 height (thickness) of about 2*1 75 inches, and its cross section is in the shape of a "u" or "mouth". The casing 100 is configured to accommodate at least two extractable motherboard modules 200, a storage array module 300, a power module 400, and an input/output interface circuit board module 5〇0. The two sides of the casing 100 are respectively connected to the first opening 101 and the second opening 105. The first opening 101 can be divided into an upper layer area with respect to the height (thickness) of the casing 1 102 and the lower layer area 103. The first opening 1〇1 is provided with a central partitioning vertical plate 110', the central partitioning vertical plate 110 and one side inner wall of the casing 1 are respectively provided with two facing surfaces in the upper layer area 102 and the lower layer area. The moving rail 120, any two moving sliding handles 120 玎 support a tray, and provides the tray to move relatively on the moving rail I20. In this way, the central partition vertical plate can be used to place four trays in the upper layer area 102 7 M372611 and the lower layer area 103 respectively, in other words, the two corresponding surfaces of the central partition vertical plate 110 are in the upper layer area 1〇2 and the lower layer area 1〇 There are four first accommodating spaces 104 in the same time. The carrier 100 is disposed at a central position of the first opening 105 to define a carrier 130. The second opening 105 is partitioned by the carrier 130 into two second housing spaces 106. Similarly, the carrier 13 〇 and the inner wall of one side of the casing 1 are also provided with the above-mentioned movable rail 12 可 which can support the tray. Thus, the central carrier 130 can be used to place two trays in the casing 1 respectively. ,
承載架130的橫截面呈” u，，字型或，，口，，字型，直兩側星 有相流通之開σ(如圖所示）。機殼10G更設有—電源豎板 二^1原暨板140立設於倾100上，介於承载架130與 中央區隔豎板11 〇之間，以供雷卜 及電源模組_。續電隨通上权主機板模組 承載=些上下層疊的方式架設於 130-侧開口之抽取手把、、 之端具有露出承载架 /伸入承载架13〇。 以方便電源模組彻被抽離 請搭配第1圖、第2Α圖及第2β = =:=器裝置對儲= 於上此:r:=，3°〇分別-對-地放置 組包括-第-托盤 碟裝置332 (例如規格為 332 (例如規格為2 5 硬碟裝置 碟裝置332’為相同尺寸 更碟裝置32與第二硬 ^ , Sr_ 1Λ〇门尺寸及種類之產品。第一托盤310 於上層區搬之其中—第—容 & 動滑軌120互動，h 1逯過與移 了活動地抽出或插入第一開口 1〇1。$ 可為—豎板，垂直地立設於第一托盤_硬 其-長邊貼附於第-托盤_上’並具有相對應之第 0a及第一面330b。第一硬碟裝置332分別排列在 板330之第一面330a，與硬碟背板電性連接；第= 碟裝置332’分別排列在硬碟背板33〇之第二面3地，與硬 碟背板330電性連接，而且第-硬碟裝i 332與第二硬碟 裝置332’相互為一百八十度反向設置。 當硬碟背板330立設於第一托盤310上，其第一面330a 設置（如：插設）有多個第一硬碟接口 331 (例如mini-SAS 接口），另外，其相對應面，即第二面330b，設置（如： 插設）有多個第二硬碟接口 331，（例如mini-SAS接口）， 而且第一硬碟接口 331與第二硬碟接口 331，分別具相同 格式，且分別相互地交錯地設置於硬碟背板330上，與硬 碟背板330電性連接。 詳細而言，硬碟背板330之第一面330a上所設置之第 一硬碟接口 331會穿過硬碟背板330,而伸出於硬碟背板 330之第二面330b上之對應位置。同樣地，硬碟背板330 之第二面330b上所設置之第二硬碟接口 331會穿過硬碟背 板330,而伸出於硬碟背板330之第一面330a之對應位置’ 故硬碟背板330之第一面330a之第一硬碟接口 331與其第 9 應ί 3 tsTH0 331 ’無法位於硬碟背板330二對 此造成干涉。故，^=33()b)之同―對應位置’會彼 可採以L 第碟接口331與第二硬碟接口331， =父錯排列之方式設於硬碟背板33。 徽及 第一面330b上。 碟裝晋…，、’硬碟裝置（如第-硬碟裝置332或第二硬 二;)用以與硬碟接口（如第一硬碟接口 331或第 接π 331，）相接之連接界面並不沿著硬碟裝置一侧 之春中心線而配置’而是位於硬碟裝置此侧面之邊緣。 筮备_使用者欲正向地安裝硬碟裝置（如第一硬碟裝置幻2 ^ -硬碟裝置332，）時，使用者將硬碟裝置（如第一硬 中、置332或第二硬碟裝置332’）之連接界面位於上述之 “線下方，並連接對應之硬碟接口（如第一硬碟接口 331 =硬碟接口 331’），反之’當使用者欲反向地安裝硬碟 "(如第一硬碟裝置332或第二硬碟裝置332，）時，使 33^將硬碟裝置（如第一硬碟裝置332或第二硬碟裝置 )之連接界面位於上述之中心線上方，並連接對應 硬碟接口（如第一硬碟接口 331或第二硬碟接口 331，）。 故，當此些第一硬碟裝置332分別一對一地電性連接 對應之第一硬碟接口 331，以及此些第二硬碟裝置332，分 別一對一地電性連接對應之第二硬碟接口 331’時，第一^ 碟裝置332為正向地設置，而第二硬碟裝置332,為反向地 設置。如此，由於此些第一硬碟裝置332與第二硬碟裝置 332’相互為一百八十度之反向設置。 另外，此些第一硬碟裝置332或此些第二硬碟裂置 M372611 332’係至少以上、下二排之陣列（例如2X6或2X4)排列 方式設置於硬碟背板330之第一面330a或第二面33〇b上。 如此，當第一托盤310部份或全部抽離機箱1〇()時， 第一硬碟袭置332或第二硬碟裝置332’便可自機箱1〇〇露 出，故’使用者便可於硬碟背板330上進行插拔第一硬碟 裝置332或第二硬碟裝置332’。 請搭配第1圖及第3圖所示，第3圖緣示本新型具有 儲存陣列模組之伺服器裝置之主機板模組於此實施例中之 φ 俯視示意圖。此實施例中’兩主機板模組200分別一對一 地設置於下層區103之此些第一容置空間1〇4中。主機板 模組200包括一第二托盤21〇、一主機板220、一連接器界 面230、多個半導體晶片240、多個記憶體250以及多個散 熱片260。其中第二托盤210架設於下層區103之其中一 第一容置空間104中，且透過移動滑軌120，可活動地抽 出或插入第一開口 1〇1。主機板220平貼地設於第二托盤 210上可直接藉由一跨接導線（圖中未示）與上方之硬碟 φ 背板330電性連接’或透過輸入輸出界面電路板模組5〇〇 與硬碟背板330電性連接。連接器界面230設於主機板220 之端部，並露出第一開口 1〇1 (如第丨圖所示），以供不同 之外接連接器插設。半導體晶片240、記憶體250及散熱 片260分別設於主機板22〇之一面。 請搭配第1圖及第4圖所示，第4圖繪示本新型具有 儲存陣列模組之伺服器裝置1〇之輸入輸出界面電路板模 組於此實施例中之立體示意圖。此實施例中，輸入輸出界 面電路板模組500為可熱插拔，且分別一對一地設置於承 M372611 載架130兩側之第二容置空間i〇6中，並對應下層區l〇3 之其中一主機板模組200。且兩輸入輸出界面電路板模組 500上之所有元件之配置方式相對該承載架130係成鏡射 對稱狀。 輸入輸出界面電路板模組500包括一第三托盤510、 一輸入輸出界面電路板520、一連接器界面530、一主機板 連接器550。第三托盤510架設於此第二容置空間106中 (參考第1圖所示），且可活動地抽出或插入第二開口 105。輸入輸出界面電路板520平貼地設於第三托盤510 上。連接器界面530設於輸入輸出界面電路板520之端部， 露出第二開口 105’以供許多不同之外接連接器插設。主 機板連接器550設於輸入輸出界面電路板520上，電性連 接其所對應之主機板模組200之一輸入輸出界面電路板連 接器270。 輸入輸出界面電路板520具多個外接卡輸入輪出界面 541，此些外接卡輸入輸出界面541可分別提供插設一外接 卡542 (例如PCI-E、PCI)。各外接卡542係透過一金手指 界面546插入外接卡輸入輸出界面541，與輸入輸出界面 電路板520電性連接。 此外，外接卡542具有一儲存陣列連接器56〇 (例如 mini-SAS接口），用以分別電性連接儲存陣列模組3〇〇與 輸入輸出界面電路板模組500,用以導接主機板模組2〇〇 及此主機板模組200正上方之儲存陣列模組3〇〇 β 另外’本發明上述之實施例中，第二開口 1〇5亦可同 第一開口 101般具有上、下層之空間設計（圖中未示）。如 12 M372611 ΐ之第：開二1〇5可同時提供四個第二容置空間•換 二徐出便可同時提供兩兩層叠擺放之四個輸 入輸出界面電路板模組5〇〇。发 出界面電路板模組500均共同電性; J主機板模組·，以提供主機板模組2〇〇:= 入輸出界面電路板模組5〇。亦可藉 由，'外接卡542電性連接儲存陣列模組3〇〇。 此^例中，機殼100與儲存陣列模址· = 臂刪’使得儲存陣列模組遍被拉 出第-開口 101時，儲存陣列模組 保持電性連接，仍可進行#料存取的工作服15裝置10 詳細之實施方式如τ，此切臂6 板J组5〇ί之:ί樞接至機殼100接近輸入輸出界面電路 板模d 5GG之位置，例如機殼1⑼—側内 =圖所示)，其另端樞接至其他-連桿61〇之:端！ 連桿610之一端係樞接至儲存陣列模 ，且300之第-把盤31()上，其另端樞接至其他另 之一端。 疋什〇川 300 & „ 時藉由各連# 610之依序樞轉而依序 展開，以增長支撐臂600之延展距離（如第5圖），反之， 第-托盤31J)被推入而帶動儲存陣列模址_進入第一開 口 101時’藉由各連桿61〇之依序樞轉而收折支禮臂_， 以縮短支撑臂600之延展距離（如第1圖），連到不佔空間 13 [72611 之目的。 配署支撐臂600上更包括一導線組620，導線組620 入於2支撐臂600上，導線組620係隨各連桿610而自輸 么输^界面電路板模組500延伸至儲存陣列模組3〇〇。詳 =而言’導線組620中包括至少-電源導線624及一信號 線625。導線組620之一端以一第一連接器621 (例如同 時具有電源導線624及信號導線625之mini_SAS接口）電 ，連接此儲存陣列模組3〇〇之硬碟背板32〇、33〇上之連接The cross-section of the carrier 130 is "u," or font, or, mouth, and font, and the straight sides of the star have a phase opening σ (as shown). The casing 10G is further provided with a power riser 2 ^1 The original cum plate 140 is erected on the tilting 100, between the carrier 130 and the central partition between the vertical plates 11 , for the Leib and the power module _. The power is continued with the host board module = some of the upper and lower stacking is mounted on the 130-side open extraction handle, and the end has an exposed carrier/into the carrier 13〇. To facilitate the power module to be completely removed, please match the first picture and the second picture. And the 2β = =:== device device pair = above: r:=, 3° 〇-to-ground placement group includes - the first-tray dish device 332 (for example, the specification is 332 (for example, the specification is 2 5 hard) The disc device disc device 332' is a product of the same size disc device 32 and the second hard, Sr_ 1 door size and type. The first tray 310 is moved in the upper layer area - the first-capacity & , h 1 与 与 移 移 移 移 移 移 移 移 $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ 竖 竖 竖The upper hard disk device 332 is respectively arranged on the first surface 330a of the board 330, and is electrically connected to the hard disk backplane; the first disk device 332' is respectively arranged. On the second side 3 of the hard disk backplane 33, electrically connected to the hard disk backplane 330, and the first hard disk mounted device 332 and the second hard disk device 332' are mutually opposite one hundred and eighty degrees. When the hard disk backplane 330 is erected on the first tray 310, the first surface 330a thereof is disposed (eg, inserted) with a plurality of first hard disk interfaces 331 (eg, a mini-SAS interface), and correspondingly, corresponding thereto The second surface 330b is provided (eg, inserted) with a plurality of second hard disk interfaces 331 (eg, a mini-SAS interface), and the first hard disk interface 331 and the second hard disk interface 331 respectively have The same format is disposed on the hard disk backplane 330 and electrically connected to the hard disk backplane 330. In detail, the first hard disk is disposed on the first surface 330a of the hard disk backplane 330. The interface 331 will pass through the hard disk backplane 330 and protrude from the corresponding position on the second side 330b of the hard disk backplane 330. Similarly, the hard disk backplane 330 The second hard disk interface 331 disposed on the second side 330b passes through the hard disk backplane 330 and protrudes from the corresponding position of the first surface 330a of the hard disk backplane 330. The first hard disk interface 331 of the surface 330a and its ninth ί3 tsTH0 331 ' cannot be located on the hard disk backplane 330. Therefore, the same "corresponding position" of ^=33()b) will be adopted. It is provided on the hard disk backplane 33 in such a manner that the Lth disk interface 331 and the second hard disk interface 331 are in the wrong arrangement. The emblem and the first side of the 330b. The disk is mounted, and the 'hard disk device (such as the first hard disk device 332 or the second hard second) is connected to the hard disk interface (such as the first hard disk interface 331 or the first π331). The interface is not configured along the spring centerline of the hard disk device side but is located on the edge of the side of the hard disk device. When the user wants to install the hard disk device in the forward direction (such as the first hard disk device phantom 2 ^ - hard disk device 332), the user will install the hard disk device (such as the first hard disk, set 332 or the second) The connection interface of the hard disk device 332') is located below the "line" and is connected to the corresponding hard disk interface (such as the first hard disk interface 331 = hard disk interface 331'), otherwise "when the user wants to install the hardware in reverse. a disc" (such as the first hard disk device 332 or the second hard disk device 332), such that the connection interface of the hard disk device (such as the first hard disk device 332 or the second hard disk device) is located above The top of the center line is connected to the corresponding hard disk interface (such as the first hard disk interface 331 or the second hard disk interface 331). Therefore, when the first hard disk devices 332 are respectively electrically connected one to one, the corresponding ones When a hard disk interface 331 and the second hard disk devices 332 are electrically connected to the corresponding second hard disk interface 331' one-to-one, the first disk device 332 is disposed in a forward direction, and the second device The hard disk device 332 is disposed in the reverse direction. Thus, due to the first hard disk device 332 and the second hard disk device The 332's are mutually oppositely arranged at one hundred and eighty degrees. In addition, the first hard disk devices 332 or the second hard disk crackers M372611 332' are arrays of at least the upper and lower rows (for example, 2X6 or 2X4). The arrangement is disposed on the first side 330a or the second side 33〇b of the hard disk backplane 330. Thus, when the first tray 310 is partially or completely pulled away from the chassis, the first hard disk is placed. The 332 or the second hard disk device 332' can be exposed from the chassis 1 so that the user can insert and remove the first hard disk device 332 or the second hard disk device 332' on the hard disk back plate 330. As shown in FIG. 1 and FIG. 3, the third figure shows a top view of the motherboard module of the server device having the storage array module in this embodiment. In this embodiment, two motherboards are provided. The module 200 is disposed one-to-one in the first accommodating spaces 1〇4 of the lower layer area 103. The motherboard module 200 includes a second tray 21〇, a motherboard 220, and a connector interface 230. a plurality of semiconductor wafers 240, a plurality of memory bodies 250, and a plurality of heat sinks 260. The second trays 210 are disposed in the lower layer region 103. The first opening 1〇1 is movably extracted or inserted through one of the first accommodating spaces 104. The main board 220 is disposed on the second tray 210 and can be directly connected by a span. The connecting wire (not shown) is electrically connected to the upper hard disk φ back plate 330 or electrically connected to the hard disk back plate 330 through the input/output interface circuit board module 5. The connector interface 230 is disposed on the host The end of the board 220 is exposed to the first opening 1〇1 (as shown in the figure) for insertion of different external connectors. The semiconductor wafer 240, the memory 250 and the heat sink 260 are respectively disposed on the motherboard 22 One side of it. Please refer to FIG. 1 and FIG. 4, and FIG. 4 is a perspective view showing the input/output interface circuit board module of the server device having the storage array module in this embodiment. In this embodiment, the input/output interface circuit board module 500 is hot-swappable, and is disposed one-to-one in the second accommodating space i 〇 6 on both sides of the carrier M372611, and corresponds to the lower layer area. One of the motherboard modules 200 of the 〇3. The arrangement of all the components on the two input/output interface circuit board modules 500 is mirror-symmetrical with respect to the carrier 130. The input/output interface circuit board module 500 includes a third tray 510, an input/output interface circuit board 520, a connector interface 530, and a motherboard connector 550. The third tray 510 is mounted in the second accommodating space 106 (refer to Fig. 1), and is movably extracted or inserted into the second opening 105. The input/output interface circuit board 520 is disposed on the third tray 510 in a flat manner. A connector interface 530 is provided at the end of the input and output interface circuit board 520 to expose the second opening 105' for insertion of a plurality of different external connectors. The main board connector 550 is disposed on the input/output interface circuit board 520, and is electrically connected to an input/output interface board connector 270 of the corresponding motherboard module 200. The input/output interface circuit board 520 has a plurality of external card input wheel-out interfaces 541. The external card input/output interfaces 541 can respectively provide an external card 542 (for example, PCI-E, PCI). Each external card 542 is inserted into the external card input/output interface 541 through a gold finger interface 546, and is electrically connected to the input/output interface circuit board 520. In addition, the external card 542 has a storage array connector 56 (for example, a mini-SAS interface) for electrically connecting the storage array module 3 and the input/output interface circuit board module 500 for guiding the motherboard. The module 2 and the storage array module 3 〇〇β directly above the motherboard module 200. In the above embodiment of the present invention, the second opening 1〇5 may also have the same as the first opening 101. The space design of the lower layer (not shown). For example, 12 M372611 ΐ第第:open 2〇5 can provide four second accommodating spaces at the same time. The interface board module 500 is collectively electrically; the J motherboard module is provided to provide the motherboard module 2:= into the output interface circuit board module 5〇. Alternatively, the external card 542 can be electrically connected to the storage array module 3〇〇. In this example, when the storage case module and the storage array module are removed, the storage array module is continuously pulled out of the first opening 101, and the storage array module remains electrically connected, and the material access can still be performed. Workwear 15 device 10 Detailed implementation method such as τ, the cutting arm 6 plate J group 5〇ί: 枢 pivot to the chassis 100 close to the input and output interface circuit board module d 5GG position, such as the chassis 1 (9) - side = As shown in the figure), the other end is pivotally connected to the other - link 61: end! One end of the link 610 is pivotally connected to the storage array module, and the other end of the tray 31 is pivotally connected to the other end.疋 〇 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各When the storage array module is moved into the first opening 101, the arm _ is folded by the respective links 61 枢 to shorten the extension distance of the support arm 600 (as shown in FIG. 1). The purpose of the space is not to occupy the space 13 [72611. The support support arm 600 further includes a wire set 620, the wire set 620 is inserted into the 2 support arm 600, and the wire set 620 is self-transferred with each link 610. The circuit board module 500 extends to the storage array module 3. In the following, the 'wire group 620 includes at least a power supply wire 624 and a signal line 625. One end of the wire group 620 has a first connector 621 (for example) At the same time, the power supply wire 624 and the signal wire 625 of the mini_SAS interface are electrically connected to the connection of the hard disk backplane 32 〇 and 33 此 of the storage array module 3
器340 ’另端包括一具信號導線625之第二連接器622及 一具電源導線624之第三連接器623。第二連接器622電 性連接至輸入輪出界面電路板模組500之儲存陣列連接器 560 (見第4圖）。第三連接器623電性連接電源豎板14〇 之連接器。 另外’如第6圖所示，第6圖繪示本新型具有儲存陣 列模組之伺服器裝置之握把結構於此實施例中之示意圖。 上述之第一托盤310、第二托盤210或/及第三托盤510上 φ 均可具一可收合/轉出之握把結構700。此可收合握把結構 700包括一握把桿體710、一彈片72〇及一柱體730。握把 桿體710藉由一樞設部712，將握把桿體710之一端樞設 至第二托盤210、第一托盤310或第三托盤510之一收納 區160上，其遠離樞設部712之一端部具有一卡固凹槽 714。彈片720之一端固設於收納區160中，另端為一自由 端，並傾斜地朝該收納區160外延伸。柱體730之一端固 設於第二托盤210、第一托盤310或第三托盤510上，另 端為一自由端，且另端面對握把桿體710之一側設有一卡 M372611 固凸塊732。如此，當握把桿體71 〇轉入收納區16〇並推 壓彈片720後，卡固凹槽714被卡固至卡固凸塊732上， 以限制握把桿體710之運動，反之，當柱體73〇之另端被 板動’進而使卡固凸塊732遠離卡固凹槽714後，被推壓 之彈片720反將握把桿體71〇推出收納區ι6〇β 對於散熱方面，外接卡542之一端部延伸至機箱1〇〇 之上層區102、其中一儲存陣列模組3〇〇上時，外接卡542 之端部具有一第一散熱風扇544 (例如渦輪風扇），用以流 通儲存陣列模組3〇〇及外接卡542間之空氣，對儲存陣列 模組300及外接卡542進行散熱。機殼1〇〇底面於上述各 主機板220與各輸入輸出界面電路板52〇之間分別設有一 第-散熱風扇142 ’以供對上述主機板22()及上述外接卡 542進行散熱。另外，第三托盤·上鄰近連接器界面別 之位置亦設有一第三散熱風扇545,用以對輸入輸出界面 電路板模組500進行散熱。 本新型所揭露如上之各實施例中，並非用以限定本新 型，任何熟習此技藝者，在不脫離太新刑 洛可作各種之f錢新精神和範圍内， 田叮作各種之更動與_，因此本新型 親 附之申請專利關所界定者 ㈣圍田視後 【圖式簡單說明】 為讓本新型之上述和其他目的、特徵 能更明顯易懂’所附圖式之詳細說明如下：‘〜、實施例 第1圖繚示本新型具有 -實施例之-立體示意圖。㈣模組之问服器裝置於 第2A圖繪示本新型具有儲存陣列模組之伺服裔裝置 對館存陣列模組之立體示意圖。 第2B圖繪示第2A圖之A-A剖面圖。 第3圖繪示本新型具有儲存陣列模組之伺服器裝置之 主機板模組於此實施例中之俯視示意圖。 第4圖繪示本新型具有儲存陣列模組之伺服器裝置之 輪入輪出界面電路板模組於此實施例中之立體示意圖。 第5圖緣示本新型具有儲存陣列模組之伺服器裝置 支撐臂於此實施例中之伸展狀態示意圖。 第6圖繪示本新型具有儲存陣列模組之祠服器裝4& 握把結構於此實施例中之示意圖。The other end of the device 340' includes a second connector 622 having a signal conductor 625 and a third connector 623 having a power supply conductor 624. The second connector 622 is electrically coupled to the storage array connector 560 of the input wheel-out interface circuit board module 500 (see Figure 4). The third connector 623 is electrically connected to the connector of the power riser 14 。. Further, as shown in Fig. 6, FIG. 6 is a schematic view showing the structure of the grip of the present invention having a server device for storing array modules in this embodiment. The first tray 310, the second tray 210 or/and the third tray 510 may each have a grip structure 700 that can be folded/retracted. The collapsible grip structure 700 includes a grip body 710, a spring 72 〇 and a cylinder 730. The grip lever body 710 pivots one end of the grip lever body 710 to the storage area 160 of the second tray 210, the first tray 310 or the third tray 510 by a pivoting portion 712, which is away from the pivoting portion. One end of the 712 has a snap recess 714. One end of the elastic piece 720 is fixed in the receiving area 160, and the other end is a free end, and extends obliquely outward of the receiving area 160. One end of the cylinder 730 is fixed on the second tray 210, the first tray 310 or the third tray 510, and the other end is a free end, and the other end is provided with a card M372611 on one side of the grip rod 710. Block 732. Thus, when the grip body 71 is turned into the receiving area 16 〇 and the elastic piece 720 is pushed, the locking groove 714 is fastened to the locking protrusion 732 to restrict the movement of the grip rod 710. When the other end of the cylinder 73 is plated 'and the fixing protrusion 732 is away from the fixing groove 714, the pressed elastic piece 720 pushes the grip body 71〇 out of the storage area ι6〇β for heat dissipation. When one end of the external card 542 extends to the upper layer 102 of the chassis 1 and one of the storage array modules 3, the end of the external card 542 has a first cooling fan 544 (for example, a turbo fan). The storage array module 300 and the external card 542 are dissipated by air flowing between the storage array module 3 and the external card 542. A first cooling fan 142' is disposed between the main board 220 and each of the input/output interface boards 52A on the bottom surface of the casing 1 for dissipating heat from the main board 22 and the external card 542. In addition, a third cooling fan 545 is disposed at a position other than the third tray upper adjacent connector interface for dissipating heat from the input/output interface circuit board module 500. The various embodiments disclosed above are not intended to limit the present invention, and anyone skilled in the art can make various changes and modifications without departing from the new spirit and scope of the new crimes. _, therefore, the definition of the patent application for this new type of attachment (4) After the field, [Simplified description of the drawings] In order to make the above and other objects and features of the present invention more obvious and easy to understand, the detailed description of the drawings is as follows : '~, Embodiment 1 FIG. 1 is a perspective view showing the present invention. (4) Module Applicator Device FIG. 2A is a perspective view showing the storage device array module of the present invention having a storage array module. Fig. 2B is a cross-sectional view taken along line A-A of Fig. 2A. FIG. 3 is a top plan view of the motherboard module of the server device with the storage array module in this embodiment. FIG. 4 is a perspective view showing the wheel-in and out-out interface circuit board module of the server device with the storage array module in this embodiment. Fig. 5 is a schematic view showing the extended state of the support arm of the server device having the storage array module in this embodiment. FIG. 6 is a schematic view showing the structure of the present invention having a storage array module and a grip structure in this embodiment.
【主要元件符號說明】 10 ： 伺服器裝置 332 :第一硬碟裝置 100 機殼 332, :第二硬碟裝置 101 第一開口 340 硬碟背板之連接器 102 上層區 400 電源模組 103 下層區 410 抽取手把 104 第一容置空間 500 輸入輸出界面電路板 105 第二開口 510 第三托盤 106 第二容置空間 520 輸入輸ib料電_ 110 區隔豎板 530 連接器界面 120 移動滑執 541 外接卡輸入輸出界面 130 承载架 542 外接卡 16 M372611 140 ： 電源豎板 142 ： 第二散熱風扇 150 ： 凸架 160 ： 收納區 200 ： 主機板模組 210 ： 第二托盤 220 ： 主機板 230 ： 連接器界面 240 ： 半導體晶片 250 ： 記憶體 260 ： 散熱片 270 ： 輸入輸出界面電 路板連接器 300 :儲存陣列模組 310 :第一托盤 330 :硬碟背板 330a :硬碟背板第一面 330b :硬碟背板第二面 331 :第一硬碟接口 331’ ：第二硬碟接口 :第一散熱風扇 :第三散熱風扇 :金手指界面 :主機板連接器 :儲存陣列連接器 :支撐臂 :連桿 :導線組 :導線組之第一連接器 :導線組另端之第二連接器 :導線組之第三連接器 .電源導線 :信號導線 :握把結構 :握把桿體 :樞設部 :卡固凹槽 :彈片 :柱體 :卡固凸塊 17[Main component symbol description] 10: Server device 332: First hard disk device 100 housing 332, : Second hard disk device 101 First opening 340 Hard disk backplane connector 102 Upper layer 400 Power module 103 Lower layer Zone 410 extraction handle 104 first accommodating space 500 input and output interface circuit board 105 second opening 510 third tray 106 second accommodating space 520 input and output _ _ 110 compartment vertical plate 530 connector interface 120 moving slip 541 External card input and output interface 130 Carrier 542 External card 16 M372611 140 : Power riser 142 : Second cooling fan 150 : Projector 160 : Storage area 200 : Motherboard module 210 : Second tray 220 : Motherboard 230 : Connector interface 240 : Semiconductor wafer 250 : Memory 260 : Heat sink 270 : Input / output interface Board connector 300 : Storage array module 310 : First tray 330 : Hard disk back plate 330a : Hard disk back plate first Face 330b: second side of hard disk backplane 331: first hard disk interface 331': second hard disk interface: first cooling fan: third cooling fan: golden finger Face: Motherboard connector: Storage array connector: Support arm: Connecting rod: Wire group: First connector of wire group: Second connector at the other end of wire group: Third connector of wire group. Power wire: Signal wire: grip structure: grip body: pivoting part: clamping groove: spring piece: cylinder: clamping bump 17