TWM613270U - Etching device with pre-etching process - Google Patents

Abstract

The model is an etching device with a pre-etching process. It has a measuring mechanism, a leveling mechanism, an etching mechanism, and a transfer mechanism penetrating inside each mechanism. The measuring mechanism and the leveling mechanism are arranged side by side. The mechanism measures the circuit board to be processed and uses the pre-etching process to make the copper foil thickness of the circuit board the same. The etching mechanism uses the first etching part to roughly etch the circuit board, and the second etching part sprays a specific proportion of etching The liquid is subjected to a more detailed etching treatment, and the etching liquid of the circuit board is removed by the suction part provided, so as to achieve the effect of increasing the etching factor.

Description

Etching device with pre-etching process

The new type is a manufacturing equipment for printed circuit boards, especially an etching device that uses etching technology to remove conductive materials to form lines or patterns.

The circuit board of the prior art is constructed with a conductive copper foil on the substrate, and the copper foil of the substrate is coated with a resist film as a mask layer at the place where the circuit or pattern is to be formed, without being blocked by the resist film The conductive layer of the copper foil will be removed by the etching solution, and finally on the substrate is a circuit or pattern with conductive function.

In order to provide the use of various existing high-tech products, the volume of the circuit board is gradually reduced and more lines are provided, so that the width of the line or the interval between the lines is greatly reduced. Therefore, the etching process is used for line or pattern processing. When the etching device sprays the etching liquid on the copper foil of the substrate, the etching liquid and the copper foil that are not shielded and protected by the resist film are etched. Due to the large particle size of the etching liquid, it is impossible to divide the lines or the lines with extremely small distances between the lines. The pattern is processed, resulting in the disadvantage that it is difficult to increase the etch factor (E/F etch factor).

In order to solve this shortcoming, the prior art discloses Invention No. TWI539876 "Etching Method and Etching Apparatus" patent. Its technical means is to spray an etching solution from a single fluid nozzle and blow it onto the etching target surface of the etching target. The first etching process in which the surface is etched, and the etching liquid and gas are mixed and sprayed from a 2-fluid nozzle, and the etching liquid is blown onto the etching target surface etched in the first etching process to further etch the etching target surface In the second etching process, the second etching process has an etching solution with a smaller droplet, which is blown on the etching pair by a stronger impact than the first etching process. The image surface, therefore, after effectively combining the etching liquid sprayed by the 1-fluid nozzle and the mixture of the etching liquid and the gas sprayed by the 2-fluid nozzle, the etching factor can be appropriately increased.

Although the technical means of the aforementioned existing disclosed inventions can increase the etching factor, the existing circuit boards respond to the needs of high-tech products, and the etched lines or patterns tend to be miniaturized. Therefore, there are further improvements for the increase in the etching factor. need.

In order to solve the problems and shortcomings of the aforementioned prior art, the present invention uses a pre-etching process for the copper foil on the circuit board to be processed to make the copper foil have the same thickness, and then the first etching part is applied to the circuit board. A rough etching process is carried out, and then the ratio of the amount of the second etching liquid sprayed by the second etching part to the total amount sprayed by the first nozzle and the second nozzle accounts for more than 55%, and the copper foil of the circuit board is more detailed The etching treatment can obtain a higher etching factor.

In order to achieve the foregoing creative purpose, the technical means used in the present invention is to provide an etching device with a pre-etching process, which includes a transfer mechanism, a measurement mechanism, a leveling mechanism and an etching mechanism, and the transfer mechanism penetrates It is located inside the measuring mechanism, the leveling mechanism and the etching mechanism arranged in sequence; the transfer mechanism can be used to transfer a circuit board to be processed, it has a frame, and the frame is arranged parallel to each other A plurality of lower conveying rods, each of the lower conveying rods is formed as a first lateral transfer position, the frame is additionally provided with a plurality of upper conveying rods arranged parallel to each other, each of the upper conveying rods is formed as a second lateral transfer position and Oppositely located at the etching mechanism, a space for circuit board transfer is formed between the first lateral transfer position and the second lateral transfer position; the measurement mechanism includes at least one sensor and is mounted on a frame , The sensor can measure the thickness of the copper foil of the circuit board at the first lateral transfer position, and send the measured information to an arithmetic processing unit; The leveling mechanism has a pre-etcher and a plurality of nozzles, the pre-etcher and each of the nozzles are corresponding to the conveying path of the transfer mechanism, the pre-etcher is connected to the arithmetic processing unit, and the arithmetic processing unit can control each of the nozzles The etching liquid is sprayed out to pre-etch the surface of the copper foil of the circuit board; the etching mechanism has an etching processing chamber, the etching processing chamber has a hollow body and a groove at the bottom, and the groove is filled with the etching liquid. A first etching part, a second etching part and a suction part are installed inside the chamber. The first etching part and the second etching part are arranged side by side according to the transfer direction of the circuit board. The suction part has a plurality of suction nozzles, and each suction nozzle Is arranged adjacent to the first etching part and the second etching part, the suction nozzle has at least one suction port and corresponds to the upper surface of the circuit board to be transferred to remove the etching liquid on the circuit board; the first The etching part has a first nozzle, the first nozzle sprays a first etching solution, the second etching part has a second nozzle, the second nozzle sprays a second etching solution, and the second etching solution is pumped and pressurized And the air is introduced at high pressure and delivered to the second nozzle through the pipeline, and the ratio of the amount of the second etching liquid sprayed by the second nozzle to the total amount sprayed by the first nozzle and the second nozzle is 55 %the above.

The etching device with a pre-etching process, wherein the first nozzle has a plurality of first upper nozzles and a plurality of first lower nozzles, and the first etching liquid is pumped and pressurized and then delivered to each of the first upper nozzles through a pipeline And each of the first lower nozzles ejects, the droplets of the first etching solution can roughly etch the copper foil of the circuit board, the second nozzle has a plurality of second upper nozzles and a plurality of second lower nozzles, and the second etching solution After being pumped and pressurized and air is introduced at a high pressure, it is delivered to each of the second upper nozzles and each of the second lower nozzles and sprayed out through a pipeline. The second etching liquid is a finer droplet for detailed etching treatment.

Through the use of the aforementioned technical means, the circuit board to be processed after the pre-etching process of the measuring mechanism and the pre-etching mechanism can make the thickness of the copper foil on the circuit board uniform and the same, and then it is transferred to the etching mechanism for the first etching The first etching solution sprayed from the first nozzle of the second etching portion undergoes a rough etching process, and then enters the second etching portion. The amount of the second etching solution sprayed from the second nozzle of the second etching portion is relative to the first etching solution. The proportion of the total ejected by one nozzle and the second nozzle accounts for more than 55%. The second etching liquid has tiny droplets and can be formed with stronger impact force, so as to achieve a substantial increase in the etching factor (E/F).

10: Transfer mechanism

11: Lower transmission rod

12: Upper transmission rod

20: Measuring mechanism

21: Sensor

30: Leveling mechanism

31: Pre-etcher

32: Nozzle

40: Etching mechanism

400: tank

401: Etching Solution

41: The first etching part

410: The first nozzle

411: The first upper nozzle

412: The first nozzle

42: The second etching part

420: second nozzle

421: The second upper nozzle

422: The second nozzle

43: Absorption Department

431: Nozzle

50: circuit board

51: copper foil

510: Line

511: protruding part

52: substrate

53: Resist film

Figure 1 is a schematic diagram of the new configuration.

Figure 2 is an enlarged schematic diagram of the new measuring mechanism and leveling mechanism.

Figure 3 is a schematic diagram of a new type of circuit board to be processed.

Figure 4 is a schematic diagram of the new type of circuit board to be processed in the transfer mechanism and the measurement mechanism.

Figure 5 is an enlarged schematic diagram of the new etching mechanism.

Figure 6 is a schematic diagram of the circuit board processed by the new leveling mechanism.

Fig. 7 is a schematic diagram of a circuit board with a film resist applied to a circuit or pattern position.

FIG. 8 is a schematic diagram of the circuit board after being etched by the etching mechanism of the present invention.

Referring to Figure 1, the present invention is an etching device with a pre-etching process, which includes a transfer mechanism 10, a measurement mechanism 20, a leveling mechanism 30, and an etching mechanism 40. The transfer mechanism 10 is installed in Yi The measuring mechanism 20, the leveling mechanism 30, and the etching mechanism 40 are arranged in sequence, and the circuit board 50 to be processed is positioned on the transfer mechanism 10 and facing the measuring mechanism 20, the leveling mechanism 30, and the etching mechanism. The mechanism 40 moves and performs processing.

As shown in FIGS. 2, 3 and 4, the transfer mechanism 10 is arranged on a frame, which is a frame of the prior art, which is not shown in the figure. The circuit board 50 to be processed can be transferred through the transfer mechanism 10. The transfer mechanism 10 shown in the figure is one of the embodiments that can be used to transfer the circuit board 50 to be processed in the prior art, and its structure is roughly arranged on the frame Multiple lower transmission rods 11, each The lower conveying rods 11 are arranged in parallel to each other, so that the circuit board 50 to be processed is transferred in a plane, and each of the lower conveying rods 11 is formed as a first lateral transfer position. Referring to FIG. 5, a plurality of upper conveying rods 12 are provided on the frame relative to the etching mechanism 40, and each of the upper conveying rods 12 is arranged in parallel with each other on another conveying plane, and each of the upper conveying rods The body 12 is formed as a second lateral transfer position, a gap is formed between each of the lower transfer rod bodies 11 and each of the upper transfer rod bodies 12, and the circuit board 50 can be located in each of the lower transfer rod bodies in the first lateral transfer position. 11 moves upward, or moves in the space formed between each of the upper conveying rods 12 and each of the lower conveying rods 11.

The measuring mechanism 20 includes at least one sensor 21, which can be set on a frame of the prior art, and the detection direction of each sensor 21 is toward the transfer mechanism 10. The specific embodiment shown in the figure is Downward detection of the circuit board 50 passed. When the circuit board 50 passes the measuring mechanism 20, the sensor 21 can measure the thickness of the copper foil 51 of the circuit board 50 at various positions. The message is sent to an arithmetic processing unit, which is a prior art, so it is not shown in the figure.

One of the specific embodiments of the measuring mechanism 20 may be a radio frequency copper measuring instrument used in the prior art. Each of the sensors 21 can project and receive radio frequencies, and the projected radio frequency ranges overlap each other. , And can completely cover the surface of the circuit board 50 to measure the thickness of the copper foil 51. The thickness of the copper foil 51 provided on the circuit board 50 on the substrate is not exactly the same in different areas. As shown in FIG. 3, the copper foil 51 has a plurality of protrusions 511, and the area of each protrusion 511 is The thickness is thicker than the thickness in other areas. When the circuit board 50 is placed on the transfer mechanism 10 and transported to the measuring mechanism 20, each sensor 21 measures each area of the copper foil 51 of the circuit board 50. The detecting mechanism 20 can detect and obtain the position information corresponding to each of the protrusions 511.

The leveling mechanism 30 has a pre-etcher 31 and a plurality of nozzles 32, the pre-etcher 31 corresponds to the conveying path of the transfer mechanism 10, and each of the nozzles 32 is arranged on the pre-etcher 31 and faces the transfer mechanism 10 The number of nozzles 32 installed in the pre-etcher 31 can be adjusted and installed according to needs. The pre-etcher 31 of the leveling mechanism 30 can be connected to the arithmetic processing unit, and the quantity The information of the position of the protrusion 511 of the circuit board 50 detected by the measuring mechanism 20 is sent to the pre-etcher 31 of the leveling mechanism 30, and the pre-etcher 31 activates the nozzle 32 corresponding to the protrusion 511 of the circuit board 50. The nozzle 32 The sprayed etching solution can etch each of the protrusions 511 on the copper foil 51, thereby trimming the thickness of the copper foil 51. After completion, the thickness of the copper foil 51 on the circuit board 50 can be approximately uniform in each position. .

As shown in FIG. 6, after the circuit board 50 completes the foregoing processing operations, the thickness of the copper foil 51 on the surface of the substrate 52 of the circuit board 50 is the same. After the completion, the circuit or pattern is made, as shown in FIG. 7, on the circuit board 50 The surface of the copper foil 51 is covered with a resist film 53 on the surface where the circuit or pattern is to be formed, and the semi-finished circuit board 50 is transferred by the transfer mechanism 10 toward the next processing station.

As shown in FIG. 5, the etching mechanism 40 has an etching processing chamber, which is a hollow body. The inside of the etching processing chamber is installed with a first etching portion 41, a second etching portion 42 and a suction portion 43. The bottom of the box body of the mechanism 40 has a tank 400 in which the etching solution 401 is contained. The first etching part 41 and the second etching part 42 are arranged side by side in the conveying direction of the transfer mechanism 10 according to the position of the circuit board 50. The suction The portion 43 has a plurality of suction nozzles 431, the suction portion 43 is disposed adjacent to the first etching portion 41 and the second etching portion 42, the suction nozzle 431 has at least one suction port, and the suction port of each suction nozzle 431 In order to correspond to the upper surface of the circuit board 50 being transferred, during implementation, the etching solution 401 in the tank 400 is transported to the first etching part 41 and the second etching part 42 to etch the circuit board 50. The etching solution 401 flows into the tank 400, and the etching solution remaining on the circuit board 50 passes through the suction portion 43, and the suction nozzle 431 of the suction portion 43 sucks the remaining etching solution, so that the etching solution is separated from the surface of the circuit board 50 to avoid Unexpected over-etching is caused during the transfer process of the transfer mechanism 10.

The first etching part 41 has a first nozzle 410, and the first nozzle 410 sprays a first etching solution. The first nozzle 410 has a plurality of first upper nozzles 411 and a plurality of first lower nozzles 412. The droplets of the first etching solution are relatively large. The first etching solution is pumped and pressurized and then delivered to each of the first upper nozzles 411 and each of the first lower nozzles 412 to be sprayed out. Each of the first upper nozzles 411 is arranged at an upper position of the transfer mechanism 10 and The sprayed first etching liquid is sprayed downwards, each of the first The lower nozzle 412 is arranged at the lower position of the transfer mechanism 10 and the sprayed first etching liquid is sprayed upwards. Since the droplets of the first etching liquid sprayed by the first nozzle 410 are relatively large, it can affect the circuit board 50 The copper foil 51 undergoes a rough etching process.

The second etching part 42 has a second nozzle 420 which sprays a second etching liquid. The second nozzle 420 has a plurality of second upper nozzles 421 and a plurality of second lower nozzles 422. The second etching liquid passes through The pump is pressurized and the air is introduced at high pressure and then delivered through a pipeline to each of the second upper nozzles 421 and each of the second lower nozzles 422 to spray out. Each of the second upper nozzles 421 is arranged at an upper position of the transfer mechanism 10 and The second etching liquid mixed with gas is sprayed downward, and each of the second lower nozzles 422 is arranged at a position below the transfer mechanism 10 and the second etching liquid mixed with gas is sprayed upward. The second etching liquid ejected by the second nozzle 420 of the present invention is mixed with high-pressure air and then ejected from the second nozzle 420. Since the second etching liquid of the second etching portion 42 is a finer droplet, the ejected The second etching solution has smaller droplets than the first etching solution and can form a stronger impact force. The copper foil 51 of the circuit board 50 is etched more delicately with the minute etching solution droplets, so that more Small width lines or detailed patterns.

The suction portion 43 includes a plurality of suction nozzles 431, each of the suction nozzles 431 is located above the circuit board 50 conveyed by the transfer mechanism 10, the suction port at one end of the suction nozzle 431 is adjacent to the upper surface of the circuit board 50, and the other end is connected to the upper surface of the circuit board 50. The suction device is connected. The suction device is of the prior art (not shown in the figure). For example, the suction device is a negative pressure generating device that can make the suction port of the suction nozzle 431 have a suction force, and each of the suction nozzles 431 can be positioned on the circuit board The etching solution above 50 is sucked.

The second etching liquid sprayed by the second nozzle 420 of the second etching part 42 is composed of a mixture of etching liquid and high-pressure air. The second etching liquid is pumped and pressurized and then delivered to the second nozzle 420 via a pipeline. The air pipeline transports the pressurized air to the nozzle 420, and the mixed second etching liquid containing high-pressure air is sprayed out through each of the second upper nozzles 421 and each of the second lower nozzles 422, and the circuit board 50 The copper foil 51 that is not covered by the resist film 53 is etched, and after completion, the electric board 50 has the designed circuit 510 or pattern.

In the implementation of the present invention, the circuit board 50 is manufactured. First, the semi-finished circuit board 50 is processed by the measuring mechanism 20 and the leveling mechanism 30, so that the thickness of the copper foil 51 can be the same thickness, and the circuit board 50 is transferred to the etching mechanism At 40 o'clock, the copper foil 51 that is not covered by the resist film 53 is etched with the first etching liquid sprayed from the first nozzle 410 of the first etching part 41. Since the droplets of the first etching liquid are relatively large, the circuit can be The copper foil 51 of the board 50 undergoes a rough etching process, and the semi-finished circuit board 50 is then transferred to the second etching solution sprayed from the second nozzle 420 of the second etching part 42 for etching, which has a smaller amount than the first etching solution. The droplets can be formed with stronger impact force, so that the width or pattern of the etched circuit can be smaller and more detailed.

The etching mechanism 40 of the present invention performs an etching test on the circuit board, and the etching test method is the same as the invention No. TWI539876 proposed by the prior art. The following table is to test the circuit boards with two different lines or patterns, one of which is to form a circuit or pattern with L/S=20/20μm on a circuit board with 18μm copper foil, and the other is to form a 35μm copper foil The circuit board is L/S=50/50μm line or pattern formation, with reference to Figure 8, the aforementioned L represents the width of the line 510 or pattern between the resist film 53 and the substrate 52, and S represents the width of the line 510 or pattern between the resist film 53 and the substrate 52. The distance between two resist films 53 adjacent to each other and between the lines 510 or patterns between the resist film 53 and the substrate 52.

For example, in the test example described in the table as L/S=20/20 μm, the width of the line 510 or pattern and the separation distance between two adjacent lines 510 or patterns are both 20 μm. Furthermore, in the etching conditions of the test example, the pressure of the first etching liquid of the first nozzle 410 was set to 0.2Mpa, and the pressure of the second etching liquid of the second nozzle 420 was set to 0.3Mpa. The ratio of the amount of the second etching liquid sprayed by the changed second nozzle 420 to the total amount of liquid sprayed by the first nozzle 410 and the second nozzle 420 are 0.0%, 2.0%, 6.0%, 12.1%, respectively. 24.1%, 44.1%, 55.0%, 75.1%, and 100.0%, and the tested etching factors (E/F) are 4.7, 5.9, 6.5, 6.9, 7.1, 7.2, 7.5, 7.7, and 7.8, respectively.

According to the test results obtained from the contents of the table after the test, the ratio of the amount of the second etching liquid sprayed by the second nozzle 420 to the total amount of the liquid sprayed by the first nozzle 410 and the second nozzle 420 accounts for 55 % Or more is the best, the etching factor (E/F) is greatly increased, and it has a more appropriate etching factor (E/F).

10: Transfer mechanism

20: Measuring mechanism

21: Sensor

30: Leveling mechanism

31: Pre-etcher

32: Nozzle

40: Etching mechanism

400: tank

401: Etching Solution

41: The first etching part

410: The first nozzle

42: The second etching part

420: second nozzle

431: Nozzle

50: circuit board

Claims (2)

An etching device with a pre-etching process includes a transfer mechanism, a measurement mechanism, a leveling mechanism, and an etching mechanism. The transfer mechanism penetrates the measurement mechanism, the leveling mechanism, and the Inside the etching mechanism; the transfer mechanism can be used to transfer a circuit board to be processed. It has a frame on which a plurality of lower transfer rods arranged parallel to each other are arranged, and each of the lower transfer rods is formed as a first In the horizontal transfer position, the frame is additionally provided with a plurality of upper transfer rods arranged in parallel with each other. Each of the upper transfer rods is formed as a second transverse transfer position and is located opposite to the etching mechanism. The first transverse transfer position is opposite to the first transverse transfer position. A space is formed between the two lateral transfer positions for the circuit board to be transferred; the measuring mechanism includes at least one sensor and is mounted on a frame, and the sensor can be aligned with the circuit board at the first lateral transfer position The thickness of the copper foil is measured, and the measured information is sent to an arithmetic processing unit; the leveling mechanism has a pre-etcher and a plurality of nozzles, and the pre-etcher and each nozzle are corresponding to the conveying mechanism Path, the pre-etcher is connected with the arithmetic processing unit, the arithmetic processing unit can control the etching liquid sprayed by each nozzle, and pre-etch the copper foil surface of the circuit board; the etching mechanism has an etching processing chamber, and the etching processing The chamber is a hollow body and has a tank at the bottom. The tank is filled with etching solution. The etching processing chamber is equipped with a first etching part, a second etching part and a suction part. The first etching part and the second etching part are installed inside the etching processing chamber. The two etching parts are arranged side by side according to the transfer direction of the circuit board, the suction part has a plurality of suction nozzles, each of the suction nozzles is arranged adjacent to the first etching part and the second etching part, and the suction nozzle has at least one suction port and Corresponding to the upper surface of the circuit board being transferred to remove the etching liquid on the circuit board; the first etching part has a first nozzle, the first nozzle sprays the first etching liquid, and the second etching part has a first etching liquid. Two nozzles, the second nozzle sprays the second etching liquid, the second etching liquid is pumped and pressurized and the air is introduced at a high pressure and then transported through the pipeline to the second nozzle to be sprayed. The second nozzle sprays The ratio of the liquid amount of the second etching liquid to the total amount of liquid ejected by the first nozzle and the second nozzle is 55% or more. The etching device having a pre-etching process according to claim 1, wherein the first nozzle has a plurality of first upper nozzles and a plurality of first lower nozzles, and the first etching liquid is pumped and pressurized and then delivered to each of the The first upper nozzle and each of the first lower nozzles are ejected. The droplets of the first etching solution can roughly etch the copper foil of the circuit board. The second nozzle has a plurality of second upper nozzles and a plurality of second lower nozzles. The second etching liquid is pumped and pressurized and air is introduced at a high pressure, and then transported to each of the second upper nozzles and each of the second lower nozzles through the pipeline to be sprayed out. The second etching liquid is a finer droplet for fineness.的etching treatment.

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