TWM612962U - Dry type laser cleaning equipment - Google Patents
Dry type laser cleaning equipment Download PDFInfo
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- TWM612962U TWM612962U TW109213046U TW109213046U TWM612962U TW M612962 U TWM612962 U TW M612962U TW 109213046 U TW109213046 U TW 109213046U TW 109213046 U TW109213046 U TW 109213046U TW M612962 U TWM612962 U TW M612962U
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Abstract
一種乾式雷射清洗設備,其包括有一機台座、一雷射清洗模組與一遮蔽殼體,其主要是將基底材料放置於機台座之置物平台上,以藉由控制模組驅動第一平行軸向軌道組、第二平行軸向軌道組與垂直軸向軌道組來帶動雷射清洗模組之光纖雷射光刀裝置,並透過光纖雷射光刀裝置照射基底材料之表面,以達到進行清洗基底材料之目的,而同時藉由雷射清洗模組之高度感測裝置與遮蔽殼體之方位感測裝置來感測待清洗物之位置與高度,使光纖雷射光刀裝置可自動對焦於基底材料,以達到最佳清洗效果之目的。 A dry laser cleaning equipment, which includes a machine base, a laser cleaning module and a shielding shell. It mainly places the base material on the platform of the machine base to drive the first parallel through the control module. The axial rail group, the second parallel axial rail group and the vertical axial rail group drive the fiber laser light knife device of the laser cleaning module, and irradiate the surface of the substrate material through the fiber laser light knife device to clean the substrate The purpose of the material is to sense the position and height of the object to be cleaned by the height sensing device of the laser cleaning module and the orientation sensing device of the shielding shell, so that the fiber laser knife device can automatically focus on the base material , In order to achieve the best cleaning effect.
Description
本創作係有關於一種乾式雷射清洗設備,尤指一種藉由雷射光來進行清洗基底材料之清洗設備結構。 This creation is about a dry laser cleaning equipment, especially a cleaning equipment structure that uses laser light to clean the substrate material.
透過雷射來清除特殊基底材料(或金屬材料)表面所累積或沾染之汙染物,乃為一種被相當廣泛使用之技術,目前所最常應用之方式乃是透過機械手臂來夾持住雷射光源,以透過機械手臂之位移來帶動雷射光源以對基底材料進行清洗,然,機械手臂所能位移之高度與速度有所限制,對於高度較高之基底材料則無法達到最佳清洗效果甚至無法進行清洗,並且目前所廣泛使用之雷射光源乃為半導體泵浦固體雷射,除了無法自動對焦之外,在使用一段時間之後乃必需更換雷射共振腔等零件後進行校正,更換過程繁瑣且複雜,再者,由於雷射在進行清洗中乃會產生有毒物質與重金屬之粉塵,目前所應用之雷射清洗設備均無法有效且集中的收集所產生之粉塵,導致於操作人員長期暴露在危險之工作環境中,故,如何將上述缺失問題加以改進,乃為本案創作人所欲解決之技術困難點之所在。 The use of lasers to remove contaminants accumulated or contaminated on the surface of special substrate materials (or metal materials) is a widely used technology. The most commonly used method at present is to hold the laser through a robotic arm. The light source drives the laser light source through the displacement of the robotic arm to clean the substrate material. However, the height and speed that the robotic arm can move is limited, and the best cleaning effect cannot be achieved for the substrate material with higher height. It cannot be cleaned, and the currently widely used laser light source is a semiconductor-pumped solid laser. In addition to being unable to autofocus, after a period of use, it is necessary to replace the laser cavity and other parts for calibration. The replacement process is cumbersome And it’s complicated. Furthermore, because lasers produce dusts of toxic substances and heavy metals during cleaning, none of the laser cleaning equipment currently used can effectively and intensively collect the generated dusts, resulting in long-term exposure to the operators. In a dangerous working environment, how to improve the above-mentioned shortcomings is the technical difficulty that the creators of this case want to solve.
本創作之主要目的在於:由一機台座、一雷射清洗模組與一遮蔽殼體所組成,其主要是將基底材料放置於機台座之置物平台上,以藉 由控制模組驅動第一平行軸向軌道組、第二平行軸向軌道組與垂直軸向軌道組來帶動雷射清洗模組之光纖雷射光刀裝置,並透過光纖雷射光刀裝置照射基底材料之表面,以達到進行清洗基底材料之目的,而同時藉由雷射清洗模組之高度感測裝置與遮蔽殼體之方位感測裝置來感測待清洗物之位置與高度,使光纖雷射光刀裝置可自動對焦於基底材料,以達到最佳清洗效果之目的。 The main purpose of this creation is: it is composed of a machine base, a laser cleaning module and a shielding shell. It is mainly to place the base material on the storage platform of the machine base to borrow The control module drives the first parallel axis track group, the second parallel axis track group and the vertical axis track group to drive the fiber laser light knife device of the laser cleaning module, and irradiate the substrate material through the fiber laser light knife device In order to achieve the purpose of cleaning the substrate material, at the same time, the position and height of the object to be cleaned are sensed by the height sensing device of the laser cleaning module and the orientation sensing device of the shielding shell, so that the optical fiber laser light The knife device can automatically focus on the base material to achieve the best cleaning effect.
1:乾式雷射清洗設備 1: Dry laser cleaning equipment
2:機台座 2: Machine base
21:置物平台 21: storage platform
211:平板 211: Tablet
212:轉軸裝置 212: Shaft device
22:光纖雷射光刀模組 22: Fiber laser light knife module
23:供電模組 23: Power supply module
24:空氣過濾裝置 24: Air filter device
3:雷射清洗模組 3: Laser cleaning module
31:第一平行軸向軌道組 31: The first parallel axial track group
32:第二平行軸向軌道組 32: The second parallel axial track group
33:垂直軸向軌道組 33: Vertical axial track group
34:光纖雷射光刀裝置 34: Optical fiber laser knife device
35:高度感測裝置 35: height sensing device
36:影像擷取裝置 36: Image capture device
37:微調機構 37: Fine-tuning mechanism
4:遮蔽殼體 4: shelter the shell
41:防護拉門 41: Protective sliding door
411:觀測窗 411: Observation Window
42:控制模組 42: control module
421:影像顯示裝置 421: Image display device
43:方位感測裝置 43: Orientation sensing device
44:警報裝置 44: Alarm device
5:空氣過濾裝置 5: Air filter device
6:基底材料 6: Base material
第1圖係本創作之立體外觀圖。 Figure 1 is the three-dimensional appearance of this creation.
第2圖係本創作之立體分解圖。 Figure 2 is a three-dimensional exploded view of this creation.
第3圖係本創作之局部示意圖一。 Figure 3 is a partial schematic diagram of this creation.
第4圖係本創作之局部示意圖二。 Figure 4 is a partial schematic diagram of this creation.
第5圖係本創作之局部示意圖三。 Figure 5 is the third partial schematic diagram of this creation.
第6圖係本創作之較佳實施例示意圖一。 Figure 6 is the first schematic diagram of the preferred embodiment of this creation.
第7圖係本創作之較佳實施例示意圖二。 Figure 7 is the second schematic diagram of the preferred embodiment of this creation.
第8圖係本創作之另一實施例示意圖。 Figure 8 is a schematic diagram of another embodiment of this creation.
請參閱第1圖、第2圖、第3圖、第4圖、第5圖、第6圖、第7圖與第8圖所示,係為本創作之立體外觀圖、立體分解圖、局部示意圖、較佳實施例示意圖與另一實施例示意圖,由圖中可清楚看出,本創作之乾式雷射清洗設備1主要包括有;
Please refer to Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7 and Fig. 8, which are the three-dimensional appearance, three-dimensional exploded view, and partial of this creation A schematic diagram, a schematic diagram of a preferred embodiment, and a schematic diagram of another embodiment. It can be clearly seen from the diagram that the dry
一機台座2,其上乃設置有一置物平台21,其中並另設置有一光纖
雷射光刀模組22以及一供電模組23;
A
一雷射清洗模組3,設置於機台座2之置物平台21上,該雷射清洗模組3並由二第一平行軸向軌道組31、一第二平行軸向軌道組32、一垂直軸向軌道組33、一光纖雷射光刀裝置34、一高度感測裝置35與一影像擷取裝置36所組成;
A
一遮蔽殼體4,用以覆蓋機台座2之置物平台21,該遮蔽殼體4外側並設置有二防護拉門41與一控制模組42,而遮蔽殼體4之內側上方則設置有一方位感測裝置43;
A
一空氣過濾裝置5,設置於機台座2之一側,並與遮蔽殼體4相連接,用以過濾遮蔽殼體4內之空氣;
An
其中,機台座2之置物平台21乃包含有一平板211與一轉軸裝置212;
Wherein, the
其中,垂直軸向軌道組33乃是設置於第二平行軸向軌道組32上,而第二平行軸向軌道組32乃跨設於二第一平行軸向軌道組31之間;
Among them, the vertical
其中,光纖雷射光刀裝置34、高度感測裝置35與影像擷取裝置36乃是另透過一微調機構37設置於垂直軸向軌道組33上;
Among them, the optical fiber
其中,第一平行軸向軌道組31乃可進行Y軸軸向之前後往復移動;
Among them, the first parallel
其中,第二平行軸向軌道組32乃可進行X軸軸向之左右往復移動;
Among them, the second parallel
其中,垂直軸向軌道組33乃可進行Z軸軸向之上下往復移動;
Among them, the vertical
其中,防護拉門41上乃設置有至少一觀測窗411;
Among them, at least one
其中,控制模組42更包含有一影像顯示裝置421;
Wherein, the
其中,遮蔽殼體4上另設置有一警報裝置44;
Wherein, an
本創作之乾式雷射清洗設備1在使用時,主要是先開啟遮蔽殼體4之防護拉門41,以將基底材料6放置於機台座2之置物平台21之平板211上,再關閉防護拉門41並透過控制模組42來驅動遮蔽殼體4內之雷射清洗模組3,以透過雷射清洗模組3之光纖雷射光刀裝置34來對基底材料5進行清洗之程序;
When the dry
承上述,在基底材料6放置於機台座2之平板211上後,乃會先透過方位感測裝置43來感測該基底材料5之位置,再透過高度感測裝置35感測該該基底材料6之高度,而所感測蒐集到位置與高度之數值資訊則會傳送至控制模組42,在經過控制模組42之計算後即驅動第一平行軸向軌道組31、第二平行軸向軌道組32與垂直軸向軌道組33以帶動光纖雷射光刀裝置34來對基底材料6之表面進行清洗之動作;
In view of the above, after the
其中,第一平行軸向軌道組31乃是用以帶動第二平行軸向軌道組32,第二平行軸向軌道組32則是用以帶動垂直軸向軌道組33,而垂直軸向軌道組33則是用以帶動其上之光纖雷射光刀裝置34,且由於第一平行軸向軌道組31可進行Y軸軸向之移動、第二平行軸向軌道組32可進行X軸軸向之移動以及垂直軸向軌道組33可進行Z軸軸向之移動,因此即可帶動光纖雷射光刀裝置34進行前、後、左、右、上與下之往復移動動作;
Among them, the first parallel
另外,光纖雷射光刀裝置34、高度感測裝置35與影像擷取裝置36之所以透過微調機構37設置於垂直軸向軌道組33上,主要是可透過該微調機構37來對光纖雷射光刀裝置34、高度感測裝置35與影像擷取裝置36來進行角度之微調;
In addition, the reason why the optical fiber
另外,方位感測裝置43與高度感測裝置35所感測蒐集底材料6之位置與高度等數值資訊,在經過控制模組42之計算下,更可同時計算出該基底材料6之尺寸大小與形狀,因此可準確的控制光纖雷射光刀裝置34對基底材料6照射之距離與路徑,以達到最佳之清洗效率;
In addition, the
另外,控制模組42乃可控制光纖雷射光刀模組22來驅動光纖雷射光刀裝置34進行照射,透過光纖雷射光刀模組22乃可調整光纖雷射光刀裝置34照射之頻率與廣度;
In addition, the
另外,在垂直軸向軌道組33上另所設置之影像擷取裝置36主要是用以持續的拍攝清洗過程,並且可透過控制模組42之影像顯示裝置421來顯示該清洗過程,以讓操作人員可隨時監控清洗情況;
In addition, the
另外,控制模組42除了是用以控制雷射清洗模組3來進行清潔之動作之外,更可用以監控與偵測在進行清洗動作時之溫度與煙霧之狀況,並可同時透過控制模組42之影像顯示裝置421來顯示;
In addition, the
另外,由於在清洗之過程當中會產生有毒物質與重金屬之粉塵,因此透過機台座2一側所設置之空氣過濾裝置5,乃可對遮蔽殼體4內之空氣進行過濾並收集所產生之粉塵,以避免操作人員在開啟防護拉門41後接觸到粉塵,藉此以達到有效防護之目的;
In addition, since toxic substances and heavy metal dust are generated during the cleaning process, the
另外,本創作之所以採用光纖雷射光刀模組22,主要是由於光纖雷射光刀模組22不具備有雷射共振腔之部件,因此除了免除了需更換與校正雷射共振腔之繁瑣程序外,光纖雷射光刀模組22更有耐震動、省電、使用壽命長、光轉換率高、傳輸低耗損與低維護成本等優點;
In addition, the reason why the fiber laser
另外,遮蔽殼體4上所另設置之警報裝置44,主要是當乾式雷射清
洗設備1發生異常狀況,可透過該警報裝置44以燈光或聲響之警告以通知操作人員;
In addition, the
另外,如第8圖所示,當基底材料6柱狀或棒狀物時,乃是將置物平台21之平板211取下,將柱狀或棒狀物之基底材料6裝設於置物平台21之轉軸裝置212,在由第一平行軸向軌道組31、第二平行軸向軌道組32與垂直軸向軌道組33帶動光纖雷射光刀裝置34進行照射基底材料6之同時,乃透過轉軸裝置212來旋轉該等柱狀或棒狀物之基底材料6,使光纖雷射光刀裝置34能夠平均的照射到基底材料6所有表面;
In addition, as shown in Figure 8, when the
綜上所述,相較於習用雷射清洗設備所存在之種種缺失與無法解決之問題,本創作之乾式雷射清洗設備1乃透過第一平行軸向軌道組31、第二平行軸向軌道組32與垂直軸向軌道組33之設計,以及藉由高度感測裝置35與方位感測裝置43之感測並準確的計算出基底材料6之尺寸與規格,藉此以達到最佳之清洗效果,再者,透過光纖雷射光刀模組22之監控與空氣過濾裝置24之過濾,更可提供最佳之清洗環境,以及提供操作人員最安全之工作環境。
In summary, compared with the various deficiencies and unsolvable problems of conventional laser cleaning equipment, the dry
上述所列舉的實施例係用以闡明本創作之一較佳可行實施例,並非用以限定本創作之範圍,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可做些許更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。 The above-listed embodiments are used to illustrate one of the preferred and feasible embodiments of this creation, and are not used to limit the scope of this creation. Anyone who is familiar with this technique can do a little bit without departing from the spirit and scope of this creation. Changes and modifications, therefore, the scope of protection of this creation shall be subject to the scope of the attached patent application.
1:乾式雷射清洗設備 1: Dry laser cleaning equipment
2:機台座 2: Machine base
21:置物平台 21: storage platform
22:光纖雷射光刀模組 22: Fiber laser light knife module
23:供電模組 23: Power supply module
3:雷射清洗模組 3: Laser cleaning module
31:第一平行軸向軌道組 31: The first parallel axial track group
32:第二平行軸向軌道組 32: The second parallel axial track group
33:垂直軸向軌道組 33: Vertical axial track group
34:光纖雷射光刀裝置 34: Optical fiber laser knife device
35:高度感測裝置 35: height sensing device
36:影像擷取裝置 36: Image capture device
4:遮蔽殼體 4: shelter the shell
41:防護拉門 41: Protective sliding door
42:控制模組 42: control module
5:空氣過濾裝置 5: Air filter device
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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TW109213046U TWM612962U (en) | 2020-10-07 | 2020-10-07 | Dry type laser cleaning equipment |
CN202121954232.2U CN216297386U (en) | 2020-10-07 | 2021-08-19 | Dry-type laser cleaning equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109213046U TWM612962U (en) | 2020-10-07 | 2020-10-07 | Dry type laser cleaning equipment |
Publications (1)
Publication Number | Publication Date |
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TWM612962U true TWM612962U (en) | 2021-06-11 |
Family
ID=77518762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW109213046U TWM612962U (en) | 2020-10-07 | 2020-10-07 | Dry type laser cleaning equipment |
Country Status (2)
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CN (1) | CN216297386U (en) |
TW (1) | TWM612962U (en) |
-
2020
- 2020-10-07 TW TW109213046U patent/TWM612962U/en unknown
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2021
- 2021-08-19 CN CN202121954232.2U patent/CN216297386U/en not_active Expired - Fee Related
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CN216297386U (en) | 2022-04-15 |
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