TWM611398U - Probe system - Google Patents

Abstract

This case provides a needle testing system, which includes a probe module, a pressure sensing module, and a testing machine. The probe module includes a probe base and a probe, and the probe is arranged on the probe base. The pressure sensing module is arranged on the probe module. The tester includes a case, a circuit module, and a pin pressure display. The circuit module is arranged in the casing and includes a first signal processing unit and a second signal processing unit. The first signal processing unit is electrically connected to the probe, and the second signal processing unit is electrically connected to the pressure sensing module. The acupuncture pressure indicator is arranged on the surface of the casing and is electrically connected to the second signal processing unit to display the pressure value of the probe.

Description

Probe system

This case is related to the testing system of semiconductor products.

The main purpose of semiconductor device testing is to use the testing machine to perform the required test work and to ensure that the measured parameter values can meet the design specifications.

Generally, semiconductor testing can be divided into bare die probing (CP) and final testing (FT) from the test object. Bare die pin testing is an operation to test the electrical characteristics of semiconductor components through a probe tester (Prober) before packaging. Unqualified dies will be marked with a mark, so that after the wafer is cut into dies , Die marked with a mark can be classified or eliminated, and no subsequent packaging or classification for use in different purposes.

The needle tester, also known as the spot tester, mainly uses the probe to contact the pad on the die to form electrical conduction to detect the semiconductor die. During the needle test operation, the proper needle pressure between the probe and the die is closely related to the accuracy of the point measurement. If the needle pressure is too small, the contact between the probe and the die is not reliable enough, which may reduce the accuracy of spot measurement; and if the needle pressure is too large, the probe may damage the surface of the die.

Please refer to FIG. 1 for a schematic diagram of a general probe module P. According to the probe module P in Fig. 1 including the probe holder P1, the probe P2 and the spring P3, in the needle test operation, the way to adjust the needle pressure is mostly achieved by manually adjusting the tightness of the spring P3, and the adjustment is After the tightness of the spring P3, observe the needle marks produced by the probe P2 on the die to determine whether the needle pressure is appropriate. As semiconductor products are becoming more and more sophisticated, the requirements for point measurement needle pressure are becoming more and more accurate, and the permissible value of needle marks is becoming more and more stringent. Therefore, manual adjustment of needle pressure and visual observation of needle marks are no longer possible. Needs to be improved to meet the demand.

This case provides a needle testing system, which includes a probe module, a pressure sensing module, and a testing machine. The probe module includes a probe base and a probe, and the probe is arranged on the probe base. The pressure sensing module is arranged on the probe module. The tester includes a case, a circuit module, and a pin pressure display. The circuit module is arranged in the casing and includes a first signal processing unit and a second signal processing unit. The first signal processing unit is electrically connected to the probe, and the second signal processing unit is electrically connected to the pressure sensing module. The acupuncture pressure indicator is arranged on the surface of the casing and is electrically connected to the second signal processing unit to display the pressure value of the probe.

In this way, the needle measuring system can directly measure and display the needle pressure between the probe and the object to be measured, and the operator can instantly adjust the needle pressure to the correct value, which improves the convenience of use.

Please refer to FIG. 2 for a three-dimensional schematic diagram of an embodiment of the needle measuring system of this case. The needle measuring system of this case can digitally display the needle pressure of the probe, thereby providing precise needle pressure measuring work.

2 and 5, the needle testing system of this case includes a probe module 10, a pressure sensing module 20, and a testing machine 30. The probe module 10 includes a probe holder 11 and a probe 12, and the probe 12 is disposed on the probe holder 11. The pressure sensing module 20 is disposed in the probe module 10. The testing machine 30 includes a casing 31, a circuit module 32 and a pin pressure display 33. The circuit module 32 is disposed in the casing 31 and includes a first signal processing unit 321 and a second signal processing unit 322. The first signal processing unit 321 is electrically connected to the probe 12 of the probe module 10, and the second signal processing unit 322 is electrically connected to the pressure sensing module 20. The needle pressure display 33 is electrically connected to the second signal processing unit 322 to display the pressure value received by the probe 12.

Referring to FIG. 2, in an embodiment, the probe 12 has a needle tip 121, and the needle testing system performs a needle test on the DUT (Device Under Test) on the test base 40 through the needle tip 121 of the probe 12. Here, the test base 40 is disposed on one side of the needle tip 121 of the probe module 10, and the needle tip 121 of the probe 12 and the test base 40 have a distance in the first direction D1. The distance between the test socket 40 and the probe module 10 in the first direction D1 can be changed to contact or disengage.

Referring to FIG. 2, in an embodiment, the probe module 10 is set on the test bench P, and the DUT is set on the test stand 40. The needle tip 121 of the probe 12 of the probe module 10 can contact the DUT of the object to be tested to perform the probing work or move away from the DUT of the object to be tested when the probing work is completed.

In this embodiment, the implementation aspect in which the needle tip 121 of the probe 12 of the probe module 10 is close to or far from the DUT of the DUT can be that the test platform P can be displaced along the first direction D1, and the test seat 40 is fixed. The probe 12 of the station P equipped with the probe module 10 contacts the DUT of the object under test with the tip 121 or is far away from the DUT of the object under test, but the present case is not limited to this.

Referring to FIG. 2, in another embodiment in which the needle tip 121 of the probe 12 of the probe module 10 is close to or far from the DUT of the DUT, it may also be that the test bench P carrying the probe module 10 is fixed, and the test seat The driving device 40 is connected to the driving device 50 to drive the test base 40 carrying the DUT to be displaced in the first direction D1 to contact the needle tip 121 of the probe 12 or to move away from the needle tip 121.

Referring to FIG. 2, in one embodiment, the probe module 10 is a cantilever probe module 10 as a whole. Here, the probe 12 is disposed at one end of the probe base 11 and faces the DUT with the needle tip 121, and the probe base 11 is fixed on the test bench P or other fixed platform. When the needle tip 121 of the probe 12 of the probe module 10 contacts the DUT, the probe 12 and the probe holder 11 are simultaneously affected by stress and the probe holder 11 is strained.

Referring to FIGS. 2 to 5, in one embodiment, the pressure sensing module 20 is disposed on the probe base 11 of the probe module 10 to sense the stress of the probe base 11. In this embodiment, the pressure sensing module 20 includes a bridge circuit 21, and the bridge circuit 21 includes a strain gauge 211. Here, the bridge circuit 21 is disposed on the probe holder 11, so that in this embodiment, the strain gauge 211 (Strain Gauge) can sense the strain of the probe holder 11 to reflect the pressure value of the needle pressure.

The strain gauge 211 senses the strain (Strain) of the substance which is defined as the ratio of the change in the length of the substance affected by the stress to the original unaffected length. Here, the strain gauge 211 includes a metal wire 2111. According to Ohm's law, the resistance value of the wire 2111 is proportional to its length and inversely proportional to the cross-sectional area. Therefore, when the length or cross-sectional area of the wire 2111 changes, its resistance value will also change accordingly. Specifically, when the wire 2111 is pressed to shorten its length and increase its cross-sectional area, the resistance value of the wire 2111 decreases. When the wire 2111 receives a tensile force to increase its length and reduce its cross-sectional area, the resistance value of the wire 2111 increases.

Referring to FIG. 2, in an embodiment, the pressure sensing module 20 may further include a flexible base 22. The flexible base 22 is made of a flexible material to directly reflect the strain of the probe base 11. Here, the material of the flexible base 22 can be, but is not limited to, metal, such as aluminum or stainless steel. In this embodiment, the flexible base 22 is attached to the surface of the probe base 11.

In an embodiment, since the probe holder 11 is the main body that directly generates strain, the pressure sensing module 20 may not be provided with the flexible substrate 22, and the bridge circuit 21 may be directly disposed on the probe holder 11 to The strain change of the probe base 11 is directly reflected.

2 and 4, in one embodiment, the bridge circuit 21 is a Wheatstone Bridge circuit including a strain gauge 211. Here, the bridge circuit 21 can be disposed on the surface of the flexible substrate 22 to directly react to the strain of the flexible substrate 22. The strain will cause the resistance of the bridge circuit 21 to change, which can then be converted into a measurable voltage change.

Referring to FIG. 3, in one embodiment, the strain gauge 211 includes a flexible insulating film 2112 and a metal wire 2111. The metal wire 2111 is meandering and forms a plurality of parallel and parallel strain segments L. The flexible insulating film 2112 covers the metal wire 2111. Only two ends of the metal wire 2111 extend out of the flexible insulating film 2112 for circuit connection. Here, when the length or cross-sectional area of the strain section L of the metal wire 2111 of the strain gauge 211 changes, the resistance value of the metal wire 2111 changes accordingly.

In one embodiment, in order to ensure the sensing sensitivity of the strain gauge 211, the strain gauge 211 has a better directionality when installed on the surface of the flexible substrate 22 or the probe base 11. Here, the setting direction of the strain gauge 211 depends on the strain direction of the flexible substrate 22 and the probe holder 11. In this embodiment, the probe holder 11 moves along the first direction D1 based on the probe 12 contacting the DUT of the object under test. Displacement, the setting direction of the strain gauge 211 is preferably such that the length extension direction of the strain section L extends along the first direction D1, so that the strain gauge 211 can directly generate strain for the force in the first direction D1, thereby improving the strain gauge. Sensitivity of 211.

In an embodiment, the bridge circuit 21 may be a full bridge configuration (Full Bridge), a half bridge configuration (Half Bridge), or a quarter bridge configuration (Quarter Bridge).

Referring to FIG. 4, in the embodiment where the bridge circuit 21 is a full-bridge configuration, the bridge circuit 21 uses four strain gauges 211 to form the bridge circuit 21. In this embodiment, no matter whether the bridge circuit 21 is arranged on the flexible base 22 or directly on the probe base 11, the four strain gauges 211 are symmetrically arranged on the flexible base 22 or the probe base 11 in pairs. Two sides. Here, when the probe holder 11 is strained, the resistance changes generated by the four strain gauges 211 of this embodiment are equal, but the changes of the strain gauges 211 on the upper and lower sides are opposite. Therefore, this embodiment can achieve maximum sensitivity. degree. The influence of noise is minimal, and because the resistance values of the four strain gauges 211 have the same changing trend, the error caused by temperature can be ignored.

In the embodiment where the bridge circuit 21 is a half-bridge configuration, the bridge circuit 21 uses two strain gauges 211 and two fixed resistors to form the bridge circuit 21. In this embodiment, the output voltage of the bridge circuit 21 is one-half of the output voltage of the full-bridge configuration, and since the four resistances of the bridge circuit 21 are not the same, the resistance changes are not proportionally changed, and further Considering the temperature error, if the distance between the fixed resistor and the DUT of the DUT is too far, the environmental difference will increase the error. Therefore, in this embodiment, the fixed resistor of the bridge circuit 21 must be positioned so that the fixed resistor is as close as possible to the strain-generating device. Probe holder 11.

In the embodiment where the bridge circuit 21 is a quarter bridge configuration, the bridge circuit 21 is composed of a strain gauge 211 and three fixed resistors. In this embodiment, the output voltage of the bridge circuit 21 is one-fourth of the output voltage of the full-bridge configuration. Due to the smaller output voltage, the influence of noise is greater, and attention must be paid to the environment and error factors.

In one embodiment, the testing machine 30 is a semiconductor testing machine, such as a wafer prober (Prober) or a light-emitting diode testing machine, and the present case is not limited to this. In this embodiment, the testing machine 30 is electrically connected to the probe 12 of the probe module 10 and the pressure sensing module 20. In this way, the first signal processing unit 321 of the testing machine 30 can send and receive specific test signals to the probe 12 for electrical testing, and can also use the second signal processing unit 322 to cooperate with the pressure sensing module 20 to calculate the probe The acupuncture pressure of 12 is displayed on the acupuncture pressure display 33.

In an embodiment, the items for which the testing machine 30 can perform the electrical test on the probe 12 may be, but are not limited to, a DC test (DC Test), a function test (Function Test), or an AC test (AC Test). The DC test is to verify the voltage and current value of the DUT. The functional test is to verify whether the logic function of the DUT is operating correctly. The AC test is to verify whether the DUT is functioning at the correct time.

In one embodiment, the testing machine 30 can provide input voltage to the bridge circuit 21 of the pressure sensing module 20. When the probe holder 11 is strained, the resistance value and output voltage of the bridge circuit 21 change, and the testing machine 30 The second signal processing unit 322 collects the output voltage of the bridge circuit 21 as a basis for the needle pressure calculation.

Referring to FIG. 6, in an embodiment, the second signal processing unit 322 of the circuit module 32 may include a signal amplification circuit 323, a signal conversion circuit 324 and a calculation circuit 325. The signal amplifying circuit 323 is coupled to the bridge circuit 21 to amplify the output voltage of the bridge circuit 21, the signal conversion circuit 324 is coupled to the signal amplifying circuit 323 to convert the analog electrical signal into a digital signal, and the calculation circuit 325 calculates the strain value It becomes the stress value to be displayed.

Referring to FIG. 6 and in conjunction with FIG. 2, in one embodiment, the probe test system can also be used with an electronic device E (such as a desktop computer, a tablet computer, or a controller) equipped with a test program 60. The test program 60 can be used to control the hardware of the probe test system (such as the movable test bench P or the driving device 50 that drives the displacement of the test seat 40), collect each test result performed by the test machine 30, and make a correct (Pass) or Fail judgment, and the test results can be made into test reports by statistical methods or other methods.

Referring to FIG. 6, in one embodiment, the testing machine 30 may further include a connection port 34, which is provided on the surface of the casing 31 for convenient signal connection with the probe module 10 and the pressure sensing module 20 through wiring. . Here, the connection port 34 is coupled to the first signal processing unit 321 and the second signal processing unit 322. As a result, the probe 12 of the probe module 10 is connected to the connection port 34 to connect to the first signal processing unit 321 The connection is completed, and the pressure sensing module 20 is connected to the connection port 34 to complete the connection with the second signal processing unit 322.

Based on the foregoing, when the probe 12 of the probe testing system contacts the DUT of the object to be tested for probe testing, the testing machine 30 cooperates with the pressure sensing module 20 to directly sense the acupuncture pressure between the probe 12 and the DUT of the object to be tested and directly display it The operator can quickly obtain the precise acupuncture pressure value from the acupuncture pressure display 33 of the testing machine 30, and can quickly adjust the acupuncture pressure when the acupuncture pressure does not meet the requirements, and does not need to remove the probe module 10 for additional measurement, and improve the needle pressure. Convenience of the test operation.

Although this disclosure has been disclosed in some embodiments as above, it is not intended to limit the disclosure. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of this disclosure. Therefore, the scope of patent protection in this case shall be determined by the scope of patent application attached to this specification.

P: Probe module P1: Probe holder P2: Probe P3: Spring 10: Probe module 11: Probe holder 12: Probe 121: Needle Point 20: Pressure sensing module 21: Bridge circuit 211: Strain Gauge 2111: Wire 2112: Flexible insulating film 22: Flexible substrate 30: test machine 31: Chassis 32: circuit module 321: The first signal processing unit 322: second signal processing unit 323: signal amplifier circuit 324: signal conversion circuit 325: calculation circuit 33: Needle pressure display 34: Port 40: Test Block 50: drive device 60: Test program DUT: DUT P: Test bench D1: First direction L: Strain section E: Electronic device

[Figure 1] is a schematic diagram of a general probe module. [Figure 2] A schematic diagram of the three-dimensional structure of an embodiment of the needle testing system in this case. [Figure 3] A schematic diagram of the strain gauge in an embodiment of the needle measuring system in this case. [Fig. 4] A schematic diagram of the bridge circuit in one embodiment of the probing system in this case. [Figure 5] A schematic diagram of the modules of an embodiment of the needle testing system in this case. [Figure 6] A schematic diagram of modules of another embodiment of the needle testing system in this case.

10: Probe module

20: Pressure sensing module

30: test machine

31: Chassis

32: circuit module

321: The first signal processing unit

322: second signal processing unit

33: Needle pressure display

Claims (11)

A needle testing system, including: A probe module, including a probe holder and a probe, the probe is disposed on the probe holder; A pressure sensing module set on the probe module; and A test machine, including: A housing A circuit module is arranged in the casing and includes a first signal processing unit and a second signal processing unit. The first signal processing unit is electrically connected to the probe, and the second signal processing unit is electrically connected to the probe. Pressure sensing module; and A needle pressure display is arranged on the surface of the casing and is electrically connected to the second signal processing unit to display the pressure value of the probe. The needle measurement system according to claim 1, wherein the pressure sensing module is disposed on the probe base. The needle test system according to claim 1, wherein the pressure sensing module includes a flexible substrate and a bridge circuit, and the bridge circuit is disposed on the surface of the flexible substrate. The probe system according to claim 3, wherein the bridge circuit includes a strain gauge. The probe system according to claim 3, wherein the bridge circuit is a full bridge circuit and includes four strain gauges. The needle test system according to claim 3, wherein the bridge circuit is a half-bridge circuit and includes two strain gauges and two fixed resistors. The needle test system according to claim 3, wherein the bridge circuit is a quarter bridge circuit and includes a strain gauge and three fixed resistors. The needle test system according to claim 4, further comprising a test base disposed on one side of the probe, the probe has a distance from the test base in a first direction, and the strain gauge includes a The metal wire can change the length along the first direction. The probing system according to claim 3, wherein the second signal processing unit further includes a signal amplifying circuit coupled to the bridge circuit. The probing system according to claim 9, wherein the second signal processing unit further includes a signal conversion circuit coupled to the signal amplifying circuit. The probing system according to claim 10, wherein the second signal processing unit further includes a calculation circuit coupled to the signal conversion circuit.

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