TWM609818U - Substrate module integrated with piezoelectric component - Google Patents

Abstract

A substrate module integrating piezoelectric components, which includes: a substrate with at least one functional block, each functional block having at least one spacer layer attached to the back of the substrate, and at least one planar piezoelectric component, At least one planar piezoelectric element is attached to a side surface of the spacer layer opposite to the substrate; wherein, at least one planar piezoelectric element can receive a voltage signal output by a signal source and then vibrate due to the inverse piezoelectric effect, thereby driving the substrate to vibrate , Or can be driven by the vibration or strain of the substrate, so that the planar piezoelectric component generates a response signal due to the piezoelectric effect.

Description

Substrate module integrating piezoelectric components

The present creation relates to a substrate module integrating piezoelectric components, in particular to a substrate module integrating piezoelectric components used on the substrates of mobile device display panels, notebook panels, displays or other types of electronic devices.

In order to reduce the volume of existing electronic products, piezoelectric components are usually integrated on a circuit substrate or a panel module. For example, a piezoelectric speaker is integrated on the panel of a mobile phone, so that the mobile phone screen also has a speaker function.

The principle of the piezoelectric component is to have the characteristics of the piezoelectric effect through the piezoelectric material, and the piezoelectric material is used as a speaker, a vibration generator, or a sensor. However, the existing technology of integrating piezoelectric components on a circuit substrate or a panel has problems that the integration of piezoelectric components is not easy, and the functions of the integrated piezoelectric components are limited.

The main purpose of this creation is to solve the problem of difficult integration when the existing piezoelectric components are integrated on a panel or a circuit substrate.

In order to solve the above-mentioned problems, an embodiment of the present invention provides a substrate module integrating piezoelectric components, which includes: a substrate having opposite front and back surfaces, the substrate being able to plan at least one functional block, each One of the functional blocks has: at least one spacer layer, at least one of the spacer layers is attached to the back of the substrate; and at least one planar piezoelectric element, at least one of the planar piezoelectric element faces the One side of the substrate is attached to a side surface of the spacer layer opposite to the substrate; wherein, at least one of the planar piezoelectric components can receive a voltage signal output by a signal source and then vibrate due to the inverse piezoelectric effect to drive The substrate is vibrated, or can be driven by the vibration or strain of the substrate, so that the planar piezoelectric component generates a response signal due to the piezoelectric effect.

In a preferred embodiment of the present invention, at least one of the planar piezoelectric components has at least one piezoelectric vibrating body, and at least one of the piezoelectric vibrating bodies includes a piezoelectric material layer and two electrode layers, and the two electrode layers They are respectively in contact with two opposite sides of the piezoelectric material layer.

In a preferred embodiment of the invention, the piezoelectric material layer of the piezoelectric vibrating body is a piezoelectric resin film or a piezoelectric ceramic film.

In a preferred embodiment of the present invention, each of the planar piezoelectric components has one piezoelectric vibrating body, or has a plurality of piezoelectric vibrating bodies superimposed on each other.

In a preferred embodiment of the present invention, the two side surfaces of the spacer layer are respectively attached to the back surface of the substrate and the surface of the planar piezoelectric component through a bonding layer.

In a preferred embodiment of the present invention, the substrate is a flexible substrate or a rigid substrate. When the substrate is a flexible substrate, the Young's coefficient of the spacer layer is greater than the Young's coefficient of the substrate. When the substrate is a rigid substrate, the Young's coefficient of the spacer layer is smaller than the Young's coefficient of the substrate.

In a preferred embodiment of the present invention, at least one of the spacer layers can be a foamed rubber layer, or a resin material layer, or a polymer piezoelectric film.

In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation. However, the drawings provided are only for reference and explanation, and are not used to limit this creation.

The following is a specific embodiment to illustrate the implementation of the "substrate module integrated with piezoelectric components" disclosed in this creation. Those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of this creation. In addition, the drawings of this creation are merely schematic illustrations, and are not depicted in actual size, and are stated in advance. The following implementations will further describe the related technical content of this creation in detail, but the disclosed content is not intended to limit the protection scope of this creation.

It should be understood that although terms such as “first”, “second”, and “third” may be used in this document to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

As shown in Figures 1 to 2, this is the first embodiment of creating a substrate module 1 integrating piezoelectric components. The substrate module 1 creating integrated piezoelectric components mainly includes: a substrate 10 and at least one spacer layer 20 , And at least one planar piezoelectric component 30.

Wherein, the substrate 10 may be a display panel, or a display panel back cover, a display protection cover, a circuit carrier, or other types of substrates. The substrate 10 may be a flexible plate or a rigid substrate. Specifically, in one embodiment of the invention, the substrate 10 may be a flexible OLED or MICRO LED display panel, and in another embodiment of the invention, the substrate 10 may be a rigid liquid crystal display panel or a display panel. The protective back cover or protective cover of the panel. Of course, the type of the creative substrate 10 is not limited to those listed in the above-mentioned embodiment.

The substrate 10 has opposite front and back surfaces. In this creation, the spacer layer 20 is arranged on the back surface of the substrate 10 and the planar piezoelectric component 30 is arranged on the side of the spacer layer 20 opposite to the substrate 10.

In this embodiment, the spacer layer 20 includes a base material layer 21. The base material layer 21 is attached to the back of the substrate 10 through a bonding layer 22 toward the side of the substrate 10, and is disposed toward one side of the planar piezoelectric component 30. Another bonding layer 22 is used to bond the planar piezoelectric element 30 to a side surface of the spacer layer 20 opposite to the substrate 10 through the bonding layer 22.

Among them, the base material layer 21 can be made of an elastic foam material, a resin layer, or a composite material mixed with a polymer material and ceramic or metal particles. When a foamed material is selected for the base layer 21, the materials that can be enumerated include: ethylene propylene rubber foam, butyl rubber foam, nitrile rubber foam, natural rubber foam, styrene butadiene rubber foam Foam, silicone resin foam, etc. When the base material layer 21 is made of a resin material, the materials that can be enumerated include: ethylene propylene rubber layer, butyl rubber layer, nitrile rubber layer, natural rubber, silicone resin, acrylic resin layer, and the like. When the base material layer 21 is a composite material of a resin material or a foamed material and metal particles or ceramic particles, it may be the resin material or foamed material and ceramic particles listed above, such as alumina, zirconia, silicon carbide, etc. Particulate materials, or metal particles: such as: one or more of metal particles such as copper, aluminum, iron, tungsten, etc., are mixed.

The bonding layer 22 on both sides of the substrate layer 21 is composed of a glue layer or an adhesive layer coated on both sides of the substrate layer 21. Therefore, the spacer layer 20 can be essentially regarded as a double-sided tape and can be conveniently used The planar piezoelectric component 30 is attached to the back surface of the substrate 10.

The planar piezoelectric component 30 has at least one piezoelectric vibrating body 31. The piezoelectric vibrating body 31 includes a piezoelectric material layer 311, and two electrode layers 312 arranged on both sides of the piezoelectric material layer 311. The two electrode layers 312 are in contact with each other. The piezoelectric material layer 311 enables the two electrode layers 312 to form electrical conduction with the two sides of the piezoelectric material layer 311.

The piezoelectric material layer 311 of the piezoelectric vibrating body 31 can be made of a polymer piezoelectric film or a piezoelectric ceramic film. When a polymer piezoelectric film is selected, the materials that can be selected for the piezoelectric material layer 311 can be listed : Polyvinylidene fluoride, nylon, polyvinyl chloride, polymethyl methacrylate, polypropylene, etc. When a piezoelectric ceramic film is selected for the piezoelectric material layer 311, the materials may include: lead zirconate, lead zirconate titanate, lead lanthanum zirconate titanate, barium titanate, Bi layered compound, tungsten bronze structural compound, etc.

The two electrode layers 312 are disposed on the two sides of the piezoelectric material layer 311 through methods such as evaporation, sputtering, deposition, coating, and printing. The materials that can be selected for the two electrode layers 312 include a conductive nano material layer, a nano metal material layer, a metal oxide conductive layer, a conductive polymer material layer, or a conductive adhesive material layer.

When the electrode layer 312 is made of nano conductive material or nano metal, the types of materials that can be selected include: carbon nanotubes, graphene, carbon nanospheres, nano gold, nano silver, nano metal wires, etc. . When the electrode layer 312 is a metal oxide conductive layer, it may be an indium tin oxide layer (ITO). In addition, the electrode layer 312 can also be selected from a polymer conductive material or a conductive glue, where the conductive polymer material can be an intrinsically conductive polymer, such as polyacetylene and PEDOT. It can also be a polymer material film doped or mixed with conductive particles.

As shown in FIG. 2, the working principle of the planar piezoelectric component 30 of the present invention is that the electrode layers 312 on both sides of each piezoelectric vibrating body 31 are respectively connected to a signal source 32, and the voltage signal output by the signal source 32 is conducted to When the electrode layer 312 is used, the two sides of the piezoelectric material layer 311 will have electric fields, and the piezoelectric material layer 311 will vibrate due to the inverse piezoelectric principle, so that the planar piezoelectric component 30 will generate sound due to the vibration, or produce Vibration of feedback. When the planar piezoelectric component 30 vibrates, the substrate 10 can be driven to vibrate or deform along the normal direction of the surface of the substrate 10 through the spacer layer 20, so that the substrate 10 can become a part of the vibrating body, and the substrate 10 can be enlarged. Generate sound or shock waves on a large scale.

In addition, in another application example of this creation, each piezoelectric vibrating body 31 in the planar piezoelectric component 30 can be driven by the vibration or deformation of the substrate 10 when the substrate 10 vibrates or deforms, so that the piezoelectric vibrating body Therefore, the piezoelectric material layer 311 of 31 is bent or strained, and the piezoelectric material layer 311 is charged on opposite sides due to the piezoelectric effect, so that the piezoelectric vibrating body 31 generates a response signal. Therefore, the planar piezoelectric component 30 of the present invention can form a speaker, a receiver, an ultrasonic generator, an ultrasonic sensor, a pressure sensor, and a vibration through the piezoelectric effect or the inverse piezoelectric effect of the piezoelectric material layer 311. One of piezoelectric components with various functions such as sensors, deformation sensors, and vibration generators.

The planar piezoelectric component 30 is connected to the back of the substrate 10 through the spacer layer 20, so that when the planar piezoelectric component 30 vibrates, the vibration of the planar piezoelectric component 30 can be transmitted to the substrate 10 through the spacer layer 20, or the substrate 10 can be bent or bent. When deformed, the planar piezoelectric component 30 is driven to vibrate or deform together through the spacer layer 20.

In order to enable the planar piezoelectric component 30 and the substrate 10 to transmit vibration or strain to each other through the spacer layer 20, the spacer layer 20 itself must have appropriate rigidity so that the vibration or strain can not be transmitted through the spacer layer 20. Circumstances that produce energy consumption or delays. Specifically, the rigidity of the spacer layer 20 of the present creation can be expressed by the Young's coefficient of the material of the spacer layer 20 and the material of the substrate 10. When the substrate 10 is a rigid substrate, the Young's coefficient of the spacer layer 20 is arranged to be lower than that of the substrate. When the substrate 10 is a flexible substrate 10, the Young's coefficient of the spacer layer 20 is arranged to be greater than the Young's coefficient of the substrate 10.

In this embodiment, the substrate 10 is planned to have at least one functional block 11, and a single spacer layer 20 is provided in the at least one functional block 11, and the planar piezoelectric component 30 is composed of a single layer of piezoelectric vibrating body 31. constitute. In more detail, in this embodiment, the area of the spacer layer 20 is roughly the same as the area of the functional block 11 of the substrate 10 in the plane viewing angle direction, so that at least one functional block 11 of the substrate 10 is covered by the spacer layer 20. Covered. In addition, the area of the spacer layer 20 is greater than or equal to the area of the planar piezoelectric component 30. In other words, the area of the planar piezoelectric component 30 is not larger than the area of the functional block 11.

As shown in FIG. 3, this is the second embodiment of creating a substrate module 1 integrating piezoelectric components. In this embodiment, the substrate 10 can define a first axis D1 and a second axis that are perpendicular to each other from the plane view direction. To D2, and in this embodiment, the substrate 10 is planned for at least one functional block 11, and a single spacer layer 20 is arranged in the same functional block 11, and a plurality of schematic representations are respectively arranged on each spacer layer 20 A rectangular planar piezoelectric element 30, the area of the plurality of planar piezoelectric elements 30 is smaller than the area of the spacer layer 20, and the plurality of planar piezoelectric elements 30 are arranged at intervals along the first axis D1 It is provided on the side of the spacer layer 20 opposite to the substrate 10.

As shown in Figs. 4 and 5, in this embodiment, since the plurality of planar piezoelectric components 30 are spaced apart from each other, a gap is formed between every two adjacent planar piezoelectric components 30, so that they are located in every two phases. The substrate 10 and the spacer layer 20 between the adjacent planar piezoelectric components 30 have a bendable space, so that when the substrate 10 and the spacer layer 20 are bent, the planar piezoelectric component 30 will not bend along with the substrate 10. Or, the bending amplitude of the planar piezoelectric component 30 is reduced, so this embodiment is particularly suitable for use on the flexible substrate 10.

As shown in FIG. 6, this is the third embodiment of the substrate module 1 with integrated piezoelectric components. The arrangement of the spacer layer 20 and the planar piezoelectric component 30 in this embodiment is similar to that of the second embodiment. A single spacer layer 20 is arranged in each functional block 11, and a plurality of planar piezoelectric components 30 with a small area are arranged on the spacer layer 20. The difference of this embodiment is that the plurality of planar piezoelectric components 30 are arranged along the first axis D1 and the second axis D2 of the substrate 10 respectively, and are arranged in a matrix on the spacer layer 20 opposite to the substrate 10. Therefore, the substrate 10 of the piezoelectric component-integrated substrate module 1 of this embodiment can be bent along the first axis D1 and the second axis D2.

As shown in FIG. 7, this is a fourth embodiment of creating a substrate module 1 integrating piezoelectric components. In this embodiment, a plurality of spacer layers 20 are provided on the same functional block 11 of the substrate 10. 20 has a substantially rectangular shape, and is arranged in the functional block 11 of the substrate 10 at intervals along the first axis D1 of the substrate 10. Moreover, in this embodiment, the area of the planar piezoelectric element 30 is larger than the area of each spacer layer 20, and each planar piezoelectric element 30 covers a plurality of spacer layers 20 at the same time, and the planar piezoelectric element 30 is separated through the plurality of spacer layers 20. Bonded to the back surface of the substrate 10.

Therefore, as shown in FIG. 8, the fourth embodiment of the substrate module 1 that integrates piezoelectric components of the present invention forms a sandwich structure in which a plurality of spacer layers 20 are sandwiched between the planar piezoelectric component 30 and the substrate 10, and There are gaps between each spacer layer 20.

As shown in FIG. 9, this is a fifth embodiment of creating a substrate module 1 integrated with piezoelectric components. This embodiment is similar to the fourth embodiment in that multiple spacer layers 20 are arranged in each functional block 11. In addition, a planar piezoelectric component 30 is attached to a side surface of the plurality of spacer layers 20 opposite to the substrate 10. The difference of this embodiment is that the plurality of spacer layers 20 are arranged along the first axis D1 and the second axis D2 of the substrate 10 in a matrix manner on a side surface of the spacer layer 20 opposite to the substrate 10. .

As shown in Figures 10 and 11, as shown in Figure 12, this is a seventh embodiment of creating a substrate module 1 integrated with piezoelectric components. The difference between this embodiment and the previous embodiments lies in the spacing The arrangement of the layer 20 and the planar piezoelectric component 30 is changed to provide a plurality of spacer layers 20 in each working area, and the plurality of spacer layers 20 are arranged at intervals along the first axis D1 of the substrate 10, or at the same time. The first axis D1 and the second axis D2 are arranged on the back surface of the substrate 10 in a matrix manner. In addition, each spacer layer 20 is provided with a planar piezoelectric component 30 on a side surface of the substrate 10, and the area of each planar piezoelectric component 30 is equal to or smaller than the area of the corresponding spacer layer 20.

This is the sixth embodiment of the creation of the substrate module 1 integrating piezoelectric components. Compared with the previous embodiments, this embodiment is different in that the planar piezoelectric component 30 is composed of a plurality of piezoelectric vibrating bodies 31 overlapping each other. Therefore, the vibration intensity of the planar piezoelectric component 30 can be adjusted or enhanced by stacking the piezoelectric vibrating body 31.

As shown in FIG. 13, this is the eighth embodiment of the substrate module 1 with integrated piezoelectric components. The difference of this embodiment is that the spacer layer 20 used includes a polymer piezoelectric film 23 and is The two sides of the piezoelectric film 23 are respectively provided with a conductive layer 231, so that the spacer layer 20 of this embodiment can form a piezoelectric element that has a similar function to the planar piezoelectric component 30.

In particular, in this embodiment, the two electrode layers 312 of the spacer layer 20 and the electrode layers of the planar piezoelectric component 30 can be connected to the same signal source or signal receiver together, and perform together with the planar piezoelectric component 30 With the same function, for example, the spacer layer 20 and the planar piezoelectric component 30 of this embodiment are used to jointly constitute the sound emitting unit of the speaker. Alternatively, the two conductive layers 231 of the spacer layer 20 and the electrode layer of the planar piezoelectric component 30 of this embodiment can be connected to different signal sources or receivers, so that the spacer layer 20 and the planar piezoelectric component 30 can be connected to different signal sources or receivers. Perform different functions. For example, the planar piezoelectric component 30 is connected to a signal source to form a speaker or an ultrasonic generator, and the two electrode layers 312 of the spacer layer 20 are connected to a signal receiver to form a vibration or sound wave receiver.

Fig. 14 shows a ninth embodiment of creating a substrate module 1 integrating piezoelectric components. In this embodiment, a plurality of different functional blocks 11 are planned on the substrate 10, and each functional block 11 At least one spacer layer 20 and at least one planar piezoelectric element 30 are respectively provided in the, and the planar piezoelectric element 30 in each functional block 11 can be planned as a plurality of groups of independent piezoelectric elements and used to perform different types of functions. Electrical components, for example: multiple different functional blocks 11 can be separately planned as: speaker, receiver, ultrasonic generator, ultrasonic sensor, pressure sensor, vibration sensor, deformation sensor, vibration generator, etc. One or a combination of various piezoelectric components with different functions.

[Possible effects of the embodiment]

To sum up, the beneficial effects of this creation are mainly that the spacer layer 20 can be used as a connecting layer for the planar piezoelectric component 30 to be placed on the back of the substrate 10. On the one hand, the planar piezoelectric component 30 can be quickly placed on the back of the substrate 10. , On the other hand, it can be used as a vibration transmission medium and produce a buffering effect, or the purpose of adjusting the vibration amplitude or sound quality can be achieved by changing the material density and elastic coefficient of the spacer layer 20.

In addition, through the creative technical means, the substrate module 1 can integrate piezoelectric components with different functions, thereby reducing the number of components and the thickness of the electronic device.

The above descriptions are only the preferred and feasible embodiments of this creation, which do not limit the scope of the creation of this creation. Therefore, all equivalent technical changes made using this creation specification and schematic content are included in the scope of protection of this creation. .

1: substrate module 10: substrate 11: Function block 20: Interval layer 21: Substrate layer 22: Bonding layer 23: Polymer piezoelectric film 231: Conductive layer 30: Planar piezoelectric components 31: Piezoelectric vibrating body 311: Piezoelectric material layer 312: Electrode layer 32: signal source

FIG. 1 is a three-dimensional exploded schematic diagram of a first embodiment of creating a substrate module integrating piezoelectric components.

FIG. 2 is a schematic diagram of the working principle of the first embodiment of creating a substrate module integrating piezoelectric components.

FIG. 3 is a three-dimensional exploded schematic diagram of the second embodiment of the substrate module with integrated piezoelectric components according to the present invention.

4 is a schematic cross-sectional view of a second embodiment of the creation of a substrate module integrating piezoelectric components.

FIG. 5 is a schematic cross-sectional view of a second embodiment of a substrate module with integrated piezoelectric components created when the substrate is bent.

FIG. 6 is a three-dimensional exploded schematic diagram of a third embodiment of creating a substrate module integrating piezoelectric components.

FIG. 7 is a three-dimensional exploded schematic diagram of a fourth embodiment of creating a substrate module integrating piezoelectric components.

FIG. 8 is a schematic cross-sectional view of a fourth embodiment of the creation of a substrate module integrating piezoelectric components.

FIG. 9 is a three-dimensional exploded schematic diagram of a fifth embodiment of creating a substrate module integrating piezoelectric components.

FIG. 10 is a three-dimensional exploded schematic diagram of a sixth embodiment of creating a substrate module integrating piezoelectric components.

FIG. 11 is a schematic cross-sectional view of a sixth embodiment of creating a substrate module integrating piezoelectric components.

FIG. 12 is a schematic cross-sectional view of a seventh embodiment of a substrate module with integrated piezoelectric components.

FIG. 13 is a schematic cross-sectional view of an eighth embodiment of creating a substrate module integrating piezoelectric components.

14 is a schematic cross-sectional view of a ninth embodiment of a substrate module with integrated piezoelectric components.

1: substrate module

10: substrate

11: Function block

20: Interval layer

30: Planar piezoelectric components

Claims (17)

A substrate module integrating piezoelectric components, which includes: A substrate, the substrate has opposite front and back surfaces, the substrate can plan at least one functional block, and each functional block has: At least one spacer layer, and at least one spacer layer is attached to the back surface of the substrate; and At least one planar piezoelectric component, at least one side of the planar piezoelectric component facing the substrate is attached to a side surface of the spacer layer opposite to the substrate; Wherein, at least one of the planar piezoelectric components can receive a voltage signal output by a signal source and then vibrate due to the inverse piezoelectric effect to drive the substrate to vibrate, or can be driven by the vibration or strain of the substrate, As a result, the planar piezoelectric component generates a response signal due to the piezoelectric effect. The substrate module integrated with piezoelectric components according to claim 1, wherein at least one of the planar piezoelectric components has at least one piezoelectric vibrating body, and at least one of the piezoelectric vibrating bodies includes a piezoelectric material layer and two An electrode layer, the two electrode layers are respectively in contact with two opposite sides of the piezoelectric material layer. The substrate module integrating piezoelectric components according to claim 2, wherein the piezoelectric material layer of the piezoelectric vibrating body is a piezoelectric resin film or a piezoelectric ceramic film. The substrate module integrated with piezoelectric components according to claim 3, wherein each of the planar piezoelectric components has one piezoelectric vibrating body, or has a plurality of piezoelectric vibrating bodies superimposed on each other. The substrate module integrated with piezoelectric components according to claim 4, wherein the two side surfaces of the spacer layer are respectively attached to the back surface of the substrate and the surface of the planar piezoelectric component through a bonding layer. The substrate module integrated with piezoelectric components according to claim 5, wherein the substrate is a flexible substrate or a rigid substrate, and when the substrate is a flexible substrate, the Young's coefficient of the spacer layer is greater than that of the spacer layer. For the Young's coefficient of the substrate, when the substrate is a rigid substrate, the Young's coefficient of the spacer layer is smaller than the Young's coefficient of the substrate. According to claim 6 of the substrate module integrated with piezoelectric components, at least one of the spacer layers may be a foamed rubber layer, or a resin material layer, or a polymer piezoelectric film. The substrate module integrated with piezoelectric components according to claim 7, wherein, when the spacer layer is a polymer piezoelectric film, both sides of the polymer piezoelectric film have a conductive layer, and the two The conductive layers can respectively introduce voltages to cause the piezoelectric polymer film to vibrate, or the voltage generated when the piezoelectric polymer film is driven by the substrate to generate strain is introduced into the two conductive layers. The substrate module integrated with piezoelectric components according to any one of claim 7 or 8, wherein each of the functional blocks has one of the spacer layers, and the spacer layer is respectively provided with the plane type The piezoelectric component, the area of the planar piezoelectric component is equal to or smaller than the area of the spacer layer. The substrate module integrating piezoelectric components according to any one of claim 7 or 8, wherein each of the functional blocks has one of the spacer layers, and each of the spacer layers is provided with a plurality of spacers. In the planar piezoelectric component, the area of the plurality of planar piezoelectric components is smaller than the area of the spacer layer. According to claim 10, the substrate module integrating piezoelectric components, wherein the substrate can define a first axis and a second axis that are perpendicular to each other, and a plurality of the planar piezoelectric components are along the first axis. The axial arrangement is arranged on the spacer member, and a gap is formed between every two adjacent planar piezoelectric components. The substrate module integrated with piezoelectric components according to claim 11, wherein a plurality of the planar piezoelectric components are arranged on at least one of the spacer members in a matrix manner along the first axis and the second axis . The substrate module integrating piezoelectric components according to any one of claim 7 or 8, wherein the substrate can define a first axis and a second axis that are perpendicular to each other, and each of the functions of the substrate A plurality of the spacer members are respectively arranged in the block, and a plurality of the spacer members are arranged on the back of the substrate along the first axial direction, or a plurality of the spacer members are arranged along the first axial direction. And the second axis are arranged in a matrix on the back of the substrate. The substrate module integrated with piezoelectric components according to claim 13, wherein at least one of the planar piezoelectric components is provided in each of the functional blocks, and the area of at least one of the planar piezoelectric components is larger than the interval The area of the component, and at least one of the planar piezoelectric components simultaneously covers a plurality of the spacer components. The substrate module integrated with piezoelectric components according to claim 13, wherein each of the spacer members is provided with one planar piezoelectric component relative to a side surface of the substrate. The substrate module integrating piezoelectric components according to any one of claim 7 or 8, wherein the substrate can plan a plurality of functional blocks, and at least one of the functional blocks is provided in the range of each of the functional blocks. A spacer member and at least one of the planar piezoelectric components. The substrate module integrating piezoelectric components according to claim 16, wherein the planar piezoelectric components in the plurality of functional blocks of the substrate respectively form a speaker, a receiver, an ultrasonic generator, an ultrasonic sensor, Pressure sensor, vibration sensor, deformation sensor, vibration generator and other piezoelectric components with different functions.

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