TWM599030U - Thin film piezoelectric assembly - Google Patents

Abstract

This creation discloses a thin film piezoelectric component, which includes: a piezoelectric film, the piezoelectric film has opposite upper and lower sides, and the upper and lower sides of the piezoelectric film can respectively define at least one work Area; at least two conductive layers are respectively provided on the upper and lower sides of the piezoelectric film within the working area; at least one adhesive layer is provided on at least one side of the piezoelectric film, at least one of the The adhesive layer covers the surface of the piezoelectric film and the conductive layer; wherein the adhesive layer can be divided into at least one conductive block and an insulating block, the conductive block has conductivity and is electrically connected to The conductive layer; the conductive block and the insulating block are coplanar with respect to a side surface of the piezoelectric film.

Description

Thin film piezoelectric components

This creation relates to a thin-film piezoelectric component and its electronic device, especially to a thin-film piezoelectric component and its electronic device used in mobile phones, handheld computers, notebook computers and other types of electronic devices.

As touch display panel technology matures, electronic products such as mobile phones, tablet computers, and notebook computers widely use touch panels as display panels.

In addition, in order to reduce the size and increase the viewable area of the screen at the same time, the existing electronic products usually adopt a narrow bezel design to minimize the size of the bezel of the electronic product to maximize the area of the screen display panel. However, existing electronic products usually have more than one speaker to output sound signals. Therefore, speaker holes must be provided on the frame of the electronic product, or even a notch or opening on the display panel to accommodate the speaker. Therefore, the size of the frame of the electronic product cannot be reduced, and the display panel is provided with a gap or opening, which affects the visible area of the display panel and affects the integrity of the display screen.

Therefore, in order to reduce the frame size and improve the area and completeness of the display area of the display panel, some of the existing electronic products use screen sound technology. The existing screen sound technology is roughly on one side of the display panel. A piezoelectric vibrating element is arranged on the side. The piezoelectric vibrating element is attached to one side of the display panel and is electrically connected to the audio signal. Therefore, the piezoelectric vibrating element can drive the display panel to vibrate, so that the display panel becomes a voice unit. To output sound.

However, there are still technical difficulties in how the existing piezoelectric element is integrated into the display panel of the electronic device, and the combination of the piezoelectric element and the display panel of the electronic device has disadvantages.

The main purpose of this creation is to provide a thin film piezoelectric component that can be easily installed on an electronic device as a speaker, a vibration generator, a sound energy conversion element, or a piezoelectric sensor.

In order to solve the above technical problem, an embodiment of the present invention provides a thin film piezoelectric component, which includes: a piezoelectric film, the piezoelectric film has opposite upper and lower sides, and the upper side of the piezoelectric film And the lower side can respectively define at least one working area; at least two conductive layers are respectively provided on the upper side and the lower side of the piezoelectric film within the working area; at least one adhesive layer is provided on the piezoelectric film At least one side of the film, at least one adhesive layer covers the piezoelectric film and the surface of the conductive layer; wherein the adhesive layer can be divided into at least one conductive block and an insulating block, and the conductive area The block has conductivity and is electrically connected to the conductive layer; the conductive block and the insulating block are coplanar with respect to a side surface of the piezoelectric film.

In a preferred embodiment of the present invention, the position of the conductive block is within the range of the working area, so that the conductive block only contacts the conductive layer and does not contact the piezoelectric film.

In a preferred embodiment of the present invention, the conductive block has a ring shape and is in contact with the outer surface of the conductive layer.

A preferred embodiment of the invention, wherein the piezoelectric film is selected from polyvinylidene fluoride (PVDF), nylon (Nylon), polyvinyl chloride (PVC), polymethyl methacrylate (PMMA), polypropylene (PP) Wherein the conductive layer is selected from one of a conductive nano material layer, a nano metal material layer, a metal oxide conductive layer, a conductive polymer material layer, or a conductive adhesive material layer.

In a preferred embodiment of the present invention, the conductive block of the adhesive layer is a conductive adhesive or a conductive polymer material layer with conductivity, and the insulating block is a double-sided adhesive or adhesive layer with insulation.

In a preferred embodiment of the present invention, both the insulating block and the conductive block of the adhesive layer are transparent.

In a preferred embodiment of the invention, the upper side and the lower side of the piezoelectric film are respectively provided with the adhesive layer, and the shapes and positions of the conductive blocks of the two adhesive layers correspond to each other, so that the two adhesive layers The conductive blocks are opposite to each other in contact with the two conductive layers on the two sides of the piezoelectric film and form an electrical connection.

A preferred embodiment of the present invention further includes two substrates. The two substrates are arranged on the upper side and the lower side of the thin film piezoelectric component, and the two substrates are respectively provided with a conductive film facing one side of the thin film piezoelectric component. The circuit layer, the glue layer is attached to one side of the two substrates facing the piezoelectric film, and the conductive block of the glue layer and the conductive circuit layer are electrically connected.

In a preferred embodiment of the present invention, the conductive circuit layer includes at least one contact electrode portion corresponding to the conductive block, and a conductive circuit connected to the contact electrode portion.

In a preferred embodiment of the present invention, the adhesive layer is disposed on a side surface of the piezoelectric film, and a conductive adhesive layer is disposed on a side surface of the piezoelectric film opposite to the adhesive layer The shape and position of the conductive adhesive layer correspond to the conductive blocks of the adhesive layer, and the conductive adhesive layer is in contact with the conductive layer on a side opposite to the adhesive layer.

The beneficial effect of the present invention is that the film piezoelectric component can be combined with the mounting surface of the electronic device or the display panel, which helps simplify the structure of the electronic device and reduce the volume.

In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation. However, the provided drawings are only for reference and explanation, not to limit this creation.

The following is a specific embodiment to illustrate the implementation of the "thin film piezoelectric component" disclosed in this creation, and those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings of this creation are merely schematic illustrations, and are not depicted in actual size, and are stated in advance. The following implementations will further describe the related technical content of this creation in detail, but the disclosed content is not intended to limit the protection scope of this creation.

It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

As shown in FIGS. 1 to 2, it is an embodiment of the electronic device 1 provided with the thin film piezoelectric component 30 of the present invention. The electronic device 1 may be a mobile phone, a tablet computer, a display, a laptop or other types of electronic devices. In this embodiment, the electronic device is a mobile phone, the electronic device 1 has a body portion 10, the body portion 10 may be a casing of the electronic device 1, and a panel module 20 is provided on a front of the body portion 10 The module 20 includes a display panel 21 and a cover 23 covering the outside of the display panel 21. As shown in Figures 2 and 3, in this embodiment, the thin film assembly 30 of the present creation is arranged between the display panel 21 and the cover 23, and the surface of the display panel 21 forms a mounting surface 22 for the installation of the thin film assembly 30.

In this embodiment, the display panel 21 of the electronic device 1 is a curved display panel, and both sides of the display panel 21 have curved side curved surfaces for the user to hold. Therefore, the mounting surface 22 outside the display panel 21 is formed with a plurality of curved surface portions 221, and the curved surface portion 221 and the rest of the mounting surface 22 are not on the same plane. Therefore, as shown in FIG. 2 and FIG. 3, when the film piezoelectric component 30 is attached to the mounting surface 22 of the electronic device 1, it will also form a curved shape corresponding to the mounting surface 22 and the curved portion 221.

The thin film piezoelectric component 30 of the present invention can be used as a speaker, an ultrasonic generator, a vibration generator of an electronic device, or a piezoelectric sensor of the electronic device 1 of various types of electronic components. As shown in Figures 3 to 6, the first embodiment of the thin film piezoelectric component 30 used in this creation includes: a piezoelectric film 31, conductive layers 33 disposed on opposite sides of the piezoelectric film 31, and The adhesive layer 34 on at least one side of the piezoelectric film 31.

Among them, the piezoelectric film 31 is made of a polymer material with piezoelectric properties, such as: polyvinylidene fluoride (PVDF), nylon (Nylon), polyvinyl chloride (PVC), polymethyl methacrylate ( PMMA), polypropylene (PP), so that the piezoelectric film 321 has flexibility. The piezoelectric film 31 has opposite upper and lower sides, and the upper and lower sides of the piezoelectric film 31 can respectively define a plurality of working areas 32, and the upper and lower sides within the working area 32 of the piezoelectric film 31 The conductive layers 33 are respectively provided on the side surfaces, so that the piezoelectric film 31 forms a sandwich structure formed by the piezoelectric film 31 and the two conductive layers 33 in the range of the working area 32.

The conductive layer 33 is provided on both sides of the piezoelectric film 31 through methods such as evaporation, sputtering, deposition, coating, and printing. The conductive layer 33 is made of a conductive material. The materials that can be selected for the conductive layer 33 include a conductive nanomaterial layer, a nanometal material layer, a metal oxide conductive layer, a conductive polymer material layer, or a conductive adhesive material layer. In more detail, when the conductive layer 33 is a nano-conductive material or nano-metal, the types of materials that can be used include: carbon nanotubes, graphene, carbon nanospheres, nanogold, nanosilver, and nanometers. Metal wire and other types of materials. When the conductive layer 33 is a metal oxide conductive layer, it may be an indium tin oxide layer (ITO). In addition, the conductive layer 33 can also be selected from a polymer conductive material or a conductive adhesive, where the transparent conductive polymer material can be an intrinsically conductive polymer, such as polyacetylene and PEDOT.

As shown in Figures 4 to 6, in this embodiment, the upper and lower sides of the thin film piezoelectric component 30 are both provided with a glue layer 34, and the two sides of the thin film piezoelectric component 30 can pass through the glue layer 34 to be attached to the electronics. The mounting surface of the device 1 or the surface of any substrate. The glue layer 34 can be divided into a conductive block 341 and an insulating block 342. The glue layer 34 in the conductive block 341 has conductivity, and the glue layer 34 in the insulating block 342 has no conductivity.

As shown in FIGS. 4 and 5, the conductive area 341 of the adhesive layer 34 is located within the working area of the piezoelectric film 31, so that the conductive area 341 of the adhesive layer 34 can contact the conductive layer 33 relative to One side of the piezoelectric film 31. Moreover, as shown in FIG. 5, the conductive blocks 341 of the two adhesive layers 34 can be further electrically connected to a processing unit 40, so that the processing unit 40 can pass through the conductive blocks 341 of the adhesive layer 34 and the two conductive layers 33 electrically. connection.

Wherein, the processing unit 40 can be an audio signal device or a sensor signal processing device. When the processing unit 40 is an audio signal device, the processing unit 40 can output the audio signal voltage to the two conductive layers 33, so that the There are electric fields on both sides of the piezoelectric film 31 in the area, so that the piezoelectric film 31 in the work area vibrates due to the reverse piezoelectric effect, and can emit sound. When the processing unit 40 is a signal processing device, the processing unit 40 can receive the voltage signals output from the two conductive layers 33. Therefore, when the piezoelectric film 31 is bent or deformed, a voltage signal will be generated due to piezoelectric action. The signal can be transmitted to the conductive block 341 of the adhesive layer 34 through the two conductive layers 33, and then to the processing unit 40 via the conductive block 341, so that the processing unit receives the voltage signal.

The conductive area 341 and the insulating area 342 of the adhesive layer 34 are in a coplanar state relative to the side of the piezoelectric film 31, that is, the adhesive layer 34 is a complete plane with respect to the side of the piezoelectric film 31. The adhesive layer 34 can be attached to the mounting plane of the electronic device or the substrate.

In particular, the conductive block 341 and the insulating block 342 of the adhesive layer 34 can be made of different materials. For example, the conductive block 341 is made of conductive glue or conductive polymer material, and the insulating block 342 is made of The non-conductive double-sided adhesive or adhesive layer material is made, so that the conductive block 341 and the insulating block 342 of the adhesive layer 34 are essentially composed of a combination of different adhesive layers. In addition, the glue layer 34 can also be made of the same glue layer material, and within the range of the conductive block 341, the material of the glue layer 34 is made conductive (for example, doped conductive particles, ionized). The local area of the glue layer 34 is made conductive, and the conductive block 341 is formed.

In addition, in order to make the glue layer 34 transparent, the conductive block 341 of the glue layer 34 can be made of transparent conductive glue or conductive polymer material, and the insulating block 342 can be made of transparent glue layer material, for example: OCA optical glue, epoxy glue and other types of glue layer or adhesive glue.

In particular, in this embodiment, the conductive block 341 of the adhesive layer 34 is formed in a ring shape and is attached to the periphery of the two conductive layers 33. Therefore, when the voltage signal is transmitted to the two conductive layers 33 through the conductive block 341, The voltage signal can be evenly transmitted from the peripheral area of the conductive layer 33 to the conductive layer 33, so that the electric field strength of the piezoelectric film 31 within the working area 32 becomes uniform, and can generate a uniform amplitude, thereby improving The sound quality performance of the output sound.

As shown in FIG. 6, it is a schematic diagram of an application example of the first embodiment of the thin film piezoelectric component 30 created between two substrates of an electronic device 1. As shown in the figure, the thin film piezoelectric component 30 of the present invention can be arranged between two substrates 50. The two substrates 50 are respectively provided with a conductive circuit layer 51 facing one side of the thin film piezoelectric component 30. The adhesive layer 34 can be attached to the conductive circuit layers 51 of the two substrates 50, and the conductive blocks 341 of the adhesive layer 34 can be attached to the conductive circuit layer 51 to form an electrical connection. In addition, a plurality of different working areas 32 can be planned on the thin film piezoelectric component 30 of the present creation, and different types or different uses of piezoelectric functional elements (such as speakers, receivers, etc.) can be formed in each of the different working areas 32. Generators, sound wave generators, sound energy converters, vibration generators, pressure sensors, etc.).

As shown in FIG. 7, in this creative embodiment, the conductive circuit layer 51 on the surface of the substrate 50 includes a contact electrode portion 511 corresponding to the conductive block 341 of the glue layer 34, and a conductive circuit 512 connected to the contact electrode portion 511 . Wherein, the position of the contact electrode portion 511 corresponds to the conductive block 341 of the glue layer 34, and the area of the contact electrode portion 511 is larger than the area of the conductive block 341, so that the contact electrode portion 511 can cover the conductive block of the glue layer 34 341, so that the conductive block 341 and the conductive circuit layer 51 are electrically connected. The conductive circuit 512 of the conductive circuit layer 51 is connected to the contact electrode portion 511 and is connected to a circuit contact 52 provided on the substrate 50. The circuit contact 52 is used for electrically connecting with the control circuit of the electronic device, so that the circuit device of the electronic device 1 can be electrically connected with the control circuit of the electronic device through the conductive circuit layer 51.

In more detail, in this embodiment, the two substrates 50 may be the display panel and the protective cover of an electronic device, respectively, and the thin-film piezoelectric component 30, the adhesive layer 34, and the conductive circuit layer 51 are also transparent to The image or light displayed by the display panel can penetrate through the thin film piezoelectric component 30 and the two adhesive layers 34 and the conductive circuit layer 51 of the two substrates 50. In order to make the conductive circuit layer 51 of the two substrates 50 translucent, the conductive circuit layer 51 can be a transparent conductive nano material layer, a nano metal material layer, a metal oxide conductive layer, a conductive polymer material layer, or a conductive adhesive. The material layer, and the conductive circuit layer 51 is disposed on the surface of the substrate 50 by over-evaporation, sputtering, deposition, coating, printing, etc.

As shown in FIG. 8, the second embodiment of the thin film piezoelectric component 30 is created. The basic structure of the thin film piezoelectric component 30 disclosed in this embodiment is similar to the first embodiment, so similar technical features will not be repeated. The difference of this embodiment is that among the adhesive layer 34 used in the thin film piezoelectric element 30, the conductive block 341 is elongated, and the conductive block 341 is located on one side of the conductive layer 33, so that the adhesive layer The conductive block 341 of 34 can be attached to one side of the conductive layer 33.

From the structure disclosed in this embodiment, it can be seen that the conductive block 341 of the adhesive layer 34 of the present creation is not limited to the annular structure disclosed in the first embodiment, and can be changed into various shapes according to actual needs. However, it should be noted that the position and area of the conductive block 341 of the adhesive layer 34 must be limited to the working area 32 of the piezoelectric film 31, so that the conductive block 341 will only conduct electricity with the two sides of the piezoelectric film 31. The layer 33 is in contact with the piezoelectric film 31 outside the working area 32.

As shown in FIG. 9, this is the third embodiment of the creation of the thin-film piezoelectric component 30. The thin-film piezoelectric component 30 disclosed in this embodiment is provided with the adhesive layer 34 on one side of the piezoelectric film 31, and Another conductive adhesive layer 35 is provided on the other side of the adhesive layer 34. Wherein, the structure of the adhesive layer 34 is the same as the foregoing embodiments, and has a conductive block 341 and an insulating block 342. The conductive block 341 has conductivity and is in contact with the conductive layer 33 on the surface of the piezoelectric film 31. The conductive adhesive layer 35 is provided on the other side of the piezoelectric film 31 opposite to the adhesive layer 34. The shape of the conductive adhesive layer 35 is the same as the shape of the conductive block 341 of the adhesive layer 34 and is similar to that of the adhesive layer 34. The conductive blocks 341 are disposed on the conductive layer 33 on the side of the piezoelectric film 31 opposite to the adhesive layer 34 opposite to each other.

One side of the thin film piezoelectric component 30 provided with the adhesive layer 34 can be attached to the mounting surface or the substrate surface of the electronic device through the adhesive layer 34, and the other side opposite to the adhesive layer 34 penetrates the conductive adhesive layer. 35 is attached to the substrate of the electronic device 1 or the surface of the circuit board.

As shown in Figures 10 and 11, this is the fourth embodiment of the creation of the thin film piezoelectric device 30. The difference between the thin film piezoelectric device 30 disclosed in this embodiment and the previous embodiments is that the piezoelectric film 31 is working The conductive layer 33 is not provided on the upper side surface and the lower side surface within the area 32. The two adhesive layers 34 cover the upper and lower sides of the piezoelectric film 31. The two adhesive layers 34 can be divided into a conductive block 341 and an insulating block 342 respectively, and the conductive block 341 and the insulating block 342 are coplanar with respect to a side surface of the piezoelectric film 31.

The conductive block 341 has conductivity, and the position, shape, and area of the conductive block 341 correspond to the position, shape, and area of the working area 32 of the piezoelectric film 31, so that the conductive block 341 of the adhesive layer 34 can cover The piezoelectric film 31 is on the upper side and the lower side within the working area, and is electrically connected to both sides of the piezoelectric film 31 within the working area 32.

The feature of this embodiment is that the conductive area 341 of the adhesive layer 34 is in direct contact with the piezoelectric film 31, thus replacing the original function of the conductive layer 33, and the conductive area 341 of the adhesive layer 34 forms two piezoelectric films 31. Electrodes on the side.

[Possible effects of the embodiment]

In summary, the beneficial effect of the present creation is that the thin film piezoelectric component 30 can be installed on the mounting surface or the substrate surface of the electronic device in a fully bonded manner through the adhesive layer 34, making the installation of the thin film piezoelectric component 30 easier. In addition, there is no gap between the film piezoelectric component 30 and the mounting surface or substrate of the electronic device.

The above descriptions are only the preferred and feasible embodiments of this creation, which do not limit the scope of patents of this creation. Therefore, all equivalent technical changes made by using this creation specification and schematic content are included in the protection scope of this creation. .

1: Electronic device 10: Body part 20: Panel module 21: display panel 22: Mounting surface 221: Curved part 23: cover 30: Thin film piezoelectric components 31: Piezo film 32: work area 33: conductive layer 34: Glue layer 341: Conductive block 342: Insulation block 35: conductive adhesive layer 40: processing unit 50: substrate 51: Conductive circuit layer 511: Contact electrode part 512: Conductive circuit 52: Circuit contact

FIG. 1 is a three-dimensional assembly diagram of an embodiment of an electronic device equipped with a thin-film piezoelectric component of the invention.

FIG. 2 is a three-dimensional exploded schematic diagram of the electronic device shown in FIG. 1.

Figure 3 is a schematic top view of the first embodiment of the creative thin film piezoelectric component.

Fig. 4 is a schematic cross-sectional view of the first embodiment of the creative thin-film piezoelectric component.

Fig. 5 is a three-dimensional exploded schematic diagram of the first embodiment of the creative thin-film piezoelectric component.

Fig. 6 is a schematic cross-sectional view of a specific embodiment of the creation of a thin film piezoelectric component and a combination of two substrates.

Figure 7 is a schematic top view of the substrate used in conjunction with the creation of thin film piezoelectric components.

FIG. 8 is a three-dimensional exploded schematic diagram of the second embodiment of the creative thin-film piezoelectric component.

FIG. 9 is a three-dimensional exploded schematic diagram of the third embodiment of the creative thin-film piezoelectric component.

FIG. 10 is a three-dimensional exploded schematic diagram of the fourth embodiment of the creative thin-film piezoelectric component.

FIG. 11 is a schematic cross-sectional view of a fourth embodiment of the creative thin-film piezoelectric component.

30: Thin film piezoelectric components

31: Piezo film

32: work area

33: conductive layer

34: Glue layer

341: Conductive block

342: Insulation block

Claims (14)

A thin film piezoelectric component, including: A piezoelectric film, the piezoelectric film has opposite upper and lower sides, and the upper and lower sides of the piezoelectric film can respectively define at least one working area; At least two conductive layers are respectively arranged on the upper side and the lower side of the piezoelectric film within the working area; At least one adhesive layer disposed on at least one side surface of the piezoelectric film, and at least one adhesive layer covers the surfaces of the piezoelectric film and the conductive layer; Wherein, the adhesive layer can be divided into at least one conductive block and an insulating block, the conductive block has conductivity and is electrically connected to the conductive layer; the conductive block and the insulating block are opposite to One side of the piezoelectric film is coplanar. The thin film piezoelectric component according to claim 1, wherein the position of the conductive block is within the range of the working area, so that the conductive block only contacts the conductive layer and does not contact the piezoelectric film . The thin-film piezoelectric component according to claim 2, wherein the conductive block is in a ring shape and is in contact with the outer surface of the conductive layer. The film piezoelectric component according to claim 1, wherein the piezoelectric film is selected from polyvinylidene fluoride (PVDF), nylon (Nylon), polyvinyl chloride (PVC), polymethyl methacrylate (PMMA), One of polypropylene (PP); wherein the conductive layer is selected from one of a conductive nano material layer, a nano metal material layer, a metal oxide conductive layer, a conductive polymer material layer, or a conductive adhesive material layer . The thin film piezoelectric component according to claim 1, wherein the conductive section of the adhesive layer is a conductive adhesive or a conductive polymer material layer with conductivity, and the insulating section is a double-sided adhesive with insulation Or adhesive layer. The thin film piezoelectric component according to claim 5, wherein the insulating section and the conductive section of the adhesive layer are both transparent. According to the thin film piezoelectric component according to any one of claims 1 to 6, the upper side and the lower side of the piezoelectric film are respectively provided with the adhesive layer, and the shape and position of the conductive block of the two adhesive layers Corresponding to each other, so that the conductive blocks of the two adhesive layers are opposite to each other in contact with the two conductive layers on the two sides of the piezoelectric film and form an electrical connection. The thin film piezoelectric component according to claim 7, which further includes two substrates, the two substrates are arranged on the upper and lower sides of the thin film piezoelectric component, and the two substrates face one of the thin film piezoelectric components. A conductive circuit layer is respectively arranged on the side surface, and the adhesive layer is attached to one side of the two substrates facing the piezoelectric film, and the conductive block of the adhesive layer and the conductive circuit layer are electrically connected. The thin film piezoelectric component according to claim 8, wherein the conductive circuit layer includes at least one contact electrode portion corresponding to the conductive block, and a conductive circuit connected to the contact electrode portion. The thin film piezoelectric component according to any one of claims 1 to 6, wherein the adhesive layer is provided on one side of the piezoelectric film, and a conductive adhesive layer is provided on the pressure One side of the electrical film relative to the adhesive layer, the shape and position of the conductive adhesive layer correspond to the conductive blocks of the adhesive layer, and the conductive adhesive layer is in contact with the adhesive layer opposite The conductive layer on one side. A thin film piezoelectric component, including: A piezoelectric film, the piezoelectric film has opposite upper and lower sides, and the upper and lower sides of the piezoelectric film can respectively define at least one working area; Two adhesive layers are arranged on the upper and lower sides of the piezoelectric film, the two adhesive layers cover the surfaces of the piezoelectric film and the conductive layer; Wherein, each of the adhesive layers can be divided into at least one conductive block and insulating block, and the conductive block and the insulating block are coplanar with respect to a side surface of the piezoelectric film; The two conductive blocks have conductivity, and the shape and area of the two conductive blocks correspond to the shape and area of the working area of the piezoelectric film, and the conductive blocks cover the piezoelectric film The upper and lower sides within the working area. The thin film piezoelectric component according to claim 11, wherein the conductive block of the adhesive layer is a conductive adhesive or a conductive polymer material layer with conductivity, and the insulating block is a double-sided tape with insulation Or adhesive layer. The thin film piezoelectric component according to claim 12, wherein the insulating section and the conductive section of the adhesive layer are both transparent. The thin film piezoelectric component according to claim 13, which further includes two substrates, the two substrates are arranged on the upper side and the lower side of the thin film piezoelectric component, and the two substrates face one of the thin film piezoelectric components. A conductive circuit layer is respectively arranged on the side surface, and the adhesive layer is attached to one side of the two substrates facing the piezoelectric film, and the conductive block of the adhesive layer and the conductive circuit layer are electrically connected.

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