TWM607188U - Electromagnetic wave absorption structure and electronic device - Google Patents

Abstract

The present invention discloses an electromagnetic wave absorption structure and an electronic device. The electromagnetic wave absorption structure includes at least one electromagnetic wave composite absorbing layers. Wherein, the electromagnetic wave composite absorption layer includes a conductive composite layer and an insulating layer which is disposed overlapping the conductive composite layer. In addition to the good electromagnetic wave absorption effect, the present invention also has the characteristics of lightness and thinness, and is particularly suitable for the electromagnetic wave absorption or shielding requirements of thin electronic products.

Description

Electromagnetic wave absorption structure and electronic device

The present invention relates to an absorption structure, in particular to an electromagnetic wave absorption structure and an electronic device with the electromagnetic wave absorption structure.

Generally speaking, electromagnetic wave radiation energy is low, it will not cause substances to dissociate, nor will it directly damage environmental substances. However, in the modern life full of electronic equipment, supplies, and equipment, electromagnetic interference cannot be taken lightly, because it is in addition to In addition to interfering with the normal operation of electronic equipment, it may also expose people to harm at any time. For example, after using a mobile phone or computer for a long time, people may feel physical fatigue, eye fatigue, shoulder pain, headache, sleepiness, and restlessness, all of which are affected by electromagnetic waves. Electromagnetic waves can also reduce human immune function, or reduce calcium in the human body, and may cause miscarriage, visual disturbance, and hinder cell division such as cancer, leukemia, brain tumors, etc.

The purpose of the present invention is to provide an electromagnetic wave absorbing structure and an electronic device with the electromagnetic wave absorbing structure. In addition to having a good electromagnetic wave absorbing effect, it also has the characteristics of lightness and thinness, which is especially suitable for the electromagnetic wave absorption or shielding requirements of thin electronic products.

To achieve the above objective, an electromagnetic wave absorbing structure according to the present invention includes at least one electromagnetic wave composite absorbing layer. Wherein, the electromagnetic wave composite absorption layer includes a conductive composite layer and an insulating layer arranged overlapping the conductive composite layer.

To achieve the above objective, an electromagnetic wave absorbing structure according to the present invention includes at least two electromagnetic wave composite absorbing layers arranged overlappingly. Wherein, each electromagnetic wave composite absorption layer includes a conductive composite layer and an insulating layer overlapped with the conductive composite layer.

In one embodiment, the thickness of the electromagnetic wave absorption structure is between 5 microns and 5000 microns.

In one embodiment, the thickness of the conductive composite layer is between 1 μm and 100 μm.

In one embodiment, the thickness of the insulating layer is between 0.1 μm and 200 μm.

In one embodiment, the conductive composite layer includes a plurality of conductive layers and a plurality of interlayer insulating layers, and the conductive layers and the interlayer insulating layers are alternately stacked.

In an embodiment, the number of conductive layers and the interlayer insulating layers in the conductive composite layer are different.

In one embodiment, the conductive layer is a graphene layer, a graphite layer, a graphite nanoplatelet layer, a carbon fiber layer, or a carbon nanotube layer.

In one embodiment, the thickness of the conductive layer is between 5 nanometers and 200 nanometers.

In one embodiment, the thickness of the interlayer insulating layer is between 5 nanometers and 10,000 nanometers.

In one embodiment, the insulating layer or the interlayer insulating layer is a polymer resin layer, a resin/ceramic hybrid layer, or a resin/metal hybrid layer.

In one embodiment, the sheet resistance per unit area of the conductive layer is between 10 ohms/square and 1000 ohms/square.

To achieve the above objective, an electronic device according to the present invention includes the above electromagnetic wave absorption structure.

As mentioned above, in the present invention, at least one electromagnetic wave composite absorbing layer is transmitted, and the electromagnetic wave composite absorbing layer includes a conductive composite layer and an insulating layer overlapping the conductive composite layer; or, at least two overlapping electromagnetic wave composite absorbing layers And the structure design of each electromagnetic wave composite absorption layer including a conductive composite layer and an insulating layer overlapped with the conductive composite layer can make the electromagnetic wave absorption structure of the present invention and the electronic device using the electromagnetic wave absorption structure have good electromagnetic wave absorption effect. It also has the characteristics of lightness and thinness, which is especially suitable for the electromagnetic wave absorption or shielding requirements of thin electronic products.

Hereinafter, the electromagnetic wave absorbing structure and the electronic device having the electromagnetic wave absorbing structure according to the preferred embodiment of the present invention will be described with reference to related drawings, and the same components will be described with the same reference symbols.

1 is a schematic diagram of an electromagnetic wave absorption structure according to an embodiment of the new type, FIG. 2 is an enlarged schematic diagram of the electromagnetic wave composite absorption layer of the electromagnetic wave absorption structure shown in FIG. 1, and FIGS. 3 and 4 are electromagnetic waves of different embodiments of the new type. Schematic diagram of the absorbent structure.

Please refer to FIG. 1 first, the electromagnetic wave absorbing structure 1 includes at least one electromagnetic wave composite absorbing layer 2. The electromagnetic wave absorbing structure 1 of this embodiment is an example of an electromagnetic wave composite absorbing layer 2. In different embodiments, the number of electromagnetic wave composite absorption layers 2 may be greater than one, for example, two, three, four..., and they are arranged to overlap each other. The present invention does not particularly limit the number of overlaps, and it depends on the electromagnetic wave absorption effect and thickness required by the design. Generally speaking, the more layers, the better the absorption effect. In some embodiments, the thickness of the electromagnetic wave absorption structure 1 can be between 5 microns (μm) and 5000 microns (including 5 microns and 5000 microns), so it has the characteristics of lightness and thinness, and is particularly suitable for thinning electronic products. Electromagnetic wave absorption or shielding needs.

The electromagnetic wave composite absorption layer 2 may include a conductive composite layer 21 and an insulating layer 22 overlapped with the conductive composite layer 21. In some embodiments, the thickness of the conductive composite layer 21 can be between 1 and 100 microns (including 1 and 100 microns), and the thickness of the insulating layer 22 can be between 0.1 and 200 microns (0.1 microns). ≤The thickness of the insulating layer ≤200 microns), such as 0.1 microns or 30 microns.

Please refer to FIG. 2, the conductive composite layer 21 of this embodiment includes a plurality of conductive layers 211 and a plurality of interlayer insulating layers 212. In this embodiment, the number of conductive layers 211 is 6, the number of interlayer insulating layers 212 is 5, and an interlayer insulating layer 212 is sandwiched between two conductive layers 211, so that the conductive layers 211 are insulated from the interlayers. The layers 212 are alternately stacked (that is, a conductive layer 211, an interlayer insulating layer 212, a conductive layer 211, an interlayer insulating layer 212, a conductive layer 211, etc. are alternately stacked). The number of layers of the conductive layer 211 and the interlayer insulating layer 212 in this embodiment are different. In different embodiments, the number of layers of the two may be the same, but they are still stacked in a staggered manner. In addition, the same film layer in the conductive composite layer 21, for example, the thickness or material of the conductive layers 211 (or the interlayer insulating layers 212) may be completely the same or partially different, and the present invention is not limited.

In some embodiments, the sheet resistance per unit area of the conductive layer 211 can be between 10 ohms/square and 1000 ohms/square (Ohm/sq), and the thickness can be between 5 nanometers (nm) and 200 nanometers. (5nm≤thickness of conductive layer≤200nm), and the thickness of the interlayer insulating layer 212 can be between 5nm and 10,000nm.

The aforementioned conductive layer 211 includes a conductive material, which can be graphene, graphite, nanographite microplates, carbon fibers, or carbon nanotubes, or a combination thereof, so that the conductive layer 211 can be a graphene layer, a graphite layer, or a nanometer Graphite microsheet layer, carbon fiber layer, or carbon nanotube layer, or a film layer made of a combination of materials such as graphene, graphite, nanographite microsheet, carbon fiber, or carbon nanotube. Among them, graphene, graphite, nanographite micro-sheets, carbon fibers, or carbon nanotubes have good electromagnetic wave absorption capabilities, which can make the conductive layer 211 have good electromagnetic wave absorption effects, so that the conductive composite layer 21 also has good electromagnetic waves. Absorption effect.

In addition, the insulating layer 22 or the interlayer insulating layer 212 may be a polymer resin layer, and its material may be, for example, but not limited to, epoxy resin, acrylic resin, polyurethane resin, or wax, or a combination thereof, or other polymer resin materials . In some embodiments, the insulating layer 22 or the interlayer insulating layer 212 may also be a resin/ceramic mixed layer. Specifically, the material of the resin/ceramic mixed layer may include polymer resin and ceramic powder, that is, the ceramic powder is mixed with the polymer resin to form the resin/ceramic mixed layer. The ceramic powder can be, for example, but not limited to, alumina (Al ₂ O ₃ ) ceramic powder, iron oxide (Fe ₂ O ₃ ) ceramic powder, boron nitride (BN) ceramic powder, aluminum nitride (AlN) ceramic powder, or nitrogen Silicon (Si ₃ N ₄ ) ceramic powder, or a combination thereof. In some embodiments, the insulating layer 22 or the interlayer insulating layer 212 may also be a resin/metal hybrid layer. Specifically, metal powder or metal powder that has undergone insulation treatment (ie, the metal powder is coated with an insulating layer) can be mixed in the polymer resin to form a resin/metal mixed layer. Wherein, the material of the metal powder is, for example, but not limited to, alloy materials such as gold, aluminum, copper, nickel, palladium, platinum, zinc, silver, iron silicon alloy, iron silicon aluminum alloy, or iron silicon chromium alloy, or a combination thereof. By adding ceramic powder, metal powder or insulating metal powder to the polymer resin, the insulating layer 22 or the interlayer insulating layer 212 can also have an electromagnetic wave absorption effect.

In addition, referring to FIG. 3, the electromagnetic wave absorbing structure 1a of this embodiment and the electromagnetic wave absorbing structure 1 of the foregoing embodiment have substantially the same element composition and connection relationship of the elements. The difference lies in that the electromagnetic wave absorbing structure 1a of this embodiment includes at least two electromagnetic wave composite absorbing layers 2 arranged overlappingly. The electromagnetic wave absorbing structure 1a of this embodiment is an example of having two electromagnetic wave composite absorbing layers 2 overlapping each other. In different embodiments, the number of overlapping electromagnetic wave composite absorption layers 2 may be greater than two, but less than or equal to ten. For example, the electromagnetic wave absorbing structure can also have three or more electromagnetic wave composite absorbing layers 2 overlapped. The present invention does not specifically limit the number of overlaps, depending on the electromagnetic wave absorption effect required by the design.

Each electromagnetic wave composite absorption layer 2 may include a conductive composite layer 21 and an insulating layer 22 overlapped with the conductive composite layer 21. The thickness or material of the same layer in the two electromagnetic wave composite absorption layers 2 may be the same or different. For example, although the names of the two conductive composite layers 21 in the two electromagnetic wave composite absorption layers 2 in FIG. 3 are the same, the materials of the two can be the same or different, and the thickness of the two can be the same or different. Similarly, although the two insulating layers 22 in the two electromagnetic wave composite absorption layers 2 are both insulating layers, the materials of the two can be the same or different, and the thickness of the two can be the same or different. Limitation depends on the actual design.

Referring to FIG. 4, the electromagnetic wave absorbing structure 1b of this embodiment and the electromagnetic wave absorbing structure of the previous embodiment have substantially the same component composition and connection relationship of the components. The difference lies in that the electromagnetic wave absorbing structure 1b of this embodiment is an example of having four electromagnetic wave composite absorbing layers 2 overlapped.

In addition, the technical content of the conductive composite layer 21 and the insulating layer 22 of the electromagnetic wave composite absorbing layer 2 in the electromagnetic wave absorbing structure 1a, 1b, and the conductive layer 211 and the interlayer insulating layer 212 of the conductive composite layer 21 have been described in detail above. This will not be repeated here.

The electromagnetic wave absorbing structure of different embodiments of the present invention will be introduced below.

Embodiment 1: The material of the conductive layer 211 may include graphene (that is, the conductive layer 211 is a graphene layer), the thickness may be 100 nm, the thickness of the interlayer insulating layer 212 may be 500 nm, and the material may include acrylic resin (interlayer The insulating layer 212 is an acrylic resin layer, and 50 layers of conductive layers 211 and 50 layers of interlayer insulating layers 212 are alternately stacked to form a conductive composite layer 21 with a thickness of 30 μm. In addition, the thickness of the insulating layer 22 may be 10 μm, and the material may include acrylic resin (that is, the insulating layer 22 is an acrylic resin layer), and then a 30 μm thick conductive composite layer 21 and a 10 μm thick insulating layer 22 are stacked An electromagnetic wave composite absorption layer 2 is formed, and three electromagnetic wave composite absorption layers 2 are overlapped to obtain an electromagnetic wave absorption structure with a total thickness of 120 μm.

Embodiment 2: The material of the conductive layer 211 may include graphene (graphene layer), the thickness may be 10 nm, the thickness of the interlayer insulating layer 212 may be 50 nm, and the material may include 90% epoxy resin mixed with 10% nitrogen Boron (resin/ceramic mixed layer), 100 layers of conductive layer 211 and 100 layers of inter-insulating layer 212 are alternately stacked to form a conductive composite layer 21 with a thickness of 6 μm. In addition, the thickness of the insulating layer 22 can be 50μm, and its material can include 70% epoxy resin mixed with 30% iron oxide (resin/ceramic mixed layer), and then a 6μm thick conductive composite layer 21 and a 50μm thick insulating layer 22 is stacked to form an electromagnetic wave composite absorbing layer 2, and five electromagnetic wave composite absorbing layers 2 are stacked to obtain an electromagnetic wave absorbing structure with a total thickness of 280 μm.

In addition, the present invention also provides an electronic device, which may include the aforementioned electromagnetic wave absorbing structure 1, 1a, or 1b, or a variation thereof. Among them, the specific technical content of the electromagnetic wave absorbing structure 1, 1a, or 1b, or its variations, can be referred to the above, and no further description will be given here.

The electromagnetic wave absorbing structure can be used to absorb the electromagnetic waves emitted by the components of the electronic device to prevent excessive electromagnetic noise from interfering with other devices; or the electromagnetic wave absorbing structure can absorb the electromagnetic waves incident on the electronic device from the outside to avoid affecting the normal function of the electronic device; and Or, reduce the intensity of the electromagnetic wave emitted from the outside so that the electronic device can pass the safety standard test for the electromagnetic wave emitted from the outside. The above-mentioned electronic device can be a mobile electronic device such as a mobile phone, a tablet, a notebook computer, or a wearable or a fixed device, or an internal component, unit, or module of the aforementioned mobile electronic device or a fixed device. limited.

To sum up, in the present invention, at least one electromagnetic wave composite absorbing layer is passed through, and the electromagnetic wave composite absorbing layer includes a conductive composite layer and an insulating layer overlapping the conductive composite layer; or, at least two overlapping electromagnetic wave composite absorbing layers And the structure design of each electromagnetic wave composite absorption layer including a conductive composite layer and an insulating layer overlapped with the conductive composite layer can make the electromagnetic wave absorption structure of the present invention and the electronic device using the electromagnetic wave absorption structure have good electromagnetic wave absorption effect. It also has the characteristics of lightness and thinness, which is especially suitable for the electromagnetic wave absorption or shielding requirements of thin electronic products.

The above description is only illustrative, and not restrictive. Any equivalent modifications or changes that do not depart from the spirit and scope of this new model shall be included in the scope of the attached patent application.

1,1a,1b: electromagnetic wave absorption structure 2: Electromagnetic wave composite absorption layer 21: Conductive composite layer 211: conductive layer 212: Interlayer insulation layer 22: Insulation layer

Fig. 1 is a schematic diagram of an electromagnetic wave absorbing structure according to an embodiment of the new type. FIG. 2 is an enlarged schematic diagram of the electromagnetic wave composite absorption layer of the electromagnetic wave absorption structure shown in FIG. 1. 3 and 4 are schematic diagrams of electromagnetic wave absorbing structures in different embodiments of the new type.

1: Electromagnetic wave absorption structure

2: Electromagnetic wave composite absorption layer

21: Conductive composite layer

22: Insulation layer

Claims (13)

An electromagnetic wave absorbing structure includes: at least one electromagnetic wave composite absorbing layer; wherein the electromagnetic wave composite absorbing layer includes a conductive composite layer and an insulating layer arranged overlapping the conductive composite layer. An electromagnetic wave absorbing structure includes: at least two electromagnetic wave composite absorbing layers arranged overlapping; wherein each of the electromagnetic wave composite absorbing layers includes a conductive composite layer and an insulating layer overlapping the conductive composite layer. The electromagnetic wave absorbing structure according to claim 1 or 2, wherein the thickness of the electromagnetic wave absorbing structure is between 5 microns and 5000 microns. The electromagnetic wave absorbing structure according to claim 1 or 2, wherein the thickness of the conductive composite layer is between 1 μm and 100 μm. The electromagnetic wave absorption structure according to claim 1 or 2, wherein the thickness of the insulating layer is between 0.1 μm and 200 μm. The electromagnetic wave absorbing structure according to claim 1 or 2, wherein the conductive composite layer includes a plurality of conductive layers and a plurality of interlayer insulating layers, and the conductive layers and the interlayer insulating layers are alternately stacked. The electromagnetic wave absorbing structure according to claim 6, wherein the conductive layers in the conductive composite layer and the interlayer insulating layers have different layers. The electromagnetic wave absorption structure according to claim 6, wherein the conductive layer is a graphene layer, a graphite layer, a graphite nanoplatelet layer, a carbon fiber layer, or a carbon nanotube layer. The electromagnetic wave absorbing structure according to claim 6, wherein the thickness of the conductive layer is between 5 nm and 200 nm. The electromagnetic wave absorbing structure according to claim 6, wherein the thickness of the interlayer insulating layer is between 5 nanometers and 10,000 nanometers. The electromagnetic wave absorbing structure according to claim 6, wherein the insulating layer or the interlayer insulating layer is a polymer resin layer, a resin/ceramic hybrid layer, or a resin/metal hybrid layer. The electromagnetic wave absorbing structure according to claim 6, wherein the sheet resistance per unit area of the conductive layer is between 10 ohm/square and 1000 ohm/square. An electronic device comprising the electromagnetic wave absorbing structure according to any one of claims 1 to 12.

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