TWM601904U - Light-emitting module - Google Patents
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- 239000000758 substrate Substances 0.000 claims abstract description 47
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
Description
本創作涉及一種發光的技術領域,特別是涉及一種發光模組。This creation relates to the technical field of luminescence, in particular to a luminous module.
目前現有的發光裝置都設有多個發光單元,然而,多個發光單元都集中設置於發光裝置的電路板的中心處,使得光束較為集中,進而導致發光效率有限。At present, the existing light-emitting devices are provided with multiple light-emitting units. However, the multiple light-emitting units are concentratedly arranged at the center of the circuit board of the light-emitting device, which makes the light beams more concentrated, which in turn leads to limited luminous efficiency.
本創作所要解決的技術問題在於,針對現有技術的不足提供一種發光模組。The technical problem to be solved by this creation is to provide a light-emitting module for the shortcomings of the prior art.
為了解決上述的技術問題,本創作所採用的其中一技術方案是,提供一種發光模組,其包括一基板、多個發光組件以及一訊號控制器。所述基板包括一本體以及內建在所述本體內的多個接地電路,多個控制電路內建在所述本體內或者設置在所述本體上,每一所述控制電路具有裸露在所述本體外的一導電接點,每一所述接地電路具有裸露在所述本體外的一接地接點。每一所述發光組件包括設置在所述基板上的多個發光二極體結構,每一所述發光二極體結構具有電性連接於所述導電接點的一第一電極端以及電性連接於所述接地接點的一第二電極端。所述訊號控制器設置在所述本體上。其中,多個所述發光組件彼此相鄰設置而使得多個所述發光組件的多個所述發光二極體結構排列成一畫素陣列。其中,所述基板包括分別電性連接於多個所述發光組件的多個訊號接點,多個所述訊號接點電性連接於所述訊號控制器。其中,所述基板的上表面具有相對設置的兩個第一側區域以及相對設置的兩個第二側區域,多個所述訊號接點設置在所述第一側區域而不設置在所述第二側區域,或者多個所述訊號接點設置在所述第二側區域而不設置在所述第一側區域。In order to solve the above technical problems, one of the technical solutions adopted in this creation is to provide a light-emitting module, which includes a substrate, a plurality of light-emitting components, and a signal controller. The substrate includes a main body and a plurality of ground circuits built in the main body, a plurality of control circuits are built in the main body or arranged on the main body, and each of the control circuits is exposed to the A conductive contact outside the body, and each of the ground circuits has a ground contact exposed outside the body. Each of the light-emitting components includes a plurality of light-emitting diode structures disposed on the substrate, and each of the light-emitting diode structures has a first electrode terminal electrically connected to the conductive contact and electrical A second electrode terminal connected to the ground contact. The signal controller is arranged on the body. Wherein, the plurality of light-emitting components are arranged adjacent to each other so that the plurality of light-emitting diode structures of the plurality of light-emitting components are arranged in a pixel array. Wherein, the substrate includes a plurality of signal contacts electrically connected to a plurality of the light-emitting components, and the plurality of signal contacts are electrically connected to the signal controller. Wherein, the upper surface of the substrate has two opposite first side regions and two opposite second side regions, and a plurality of the signal contacts are arranged on the first side region but not on the The second side area, or a plurality of the signal contacts are arranged in the second side area but not in the first side area.
為了解決上述的技術問題,本創作所採用的另外一技術方案是,提供一種發光模組,其包括一基板、多個發光組件以及一訊號控制器。所述基板包括多個控制電路。每一所述發光組件包括設置在所述基板上的多個發光二極體結構,多個所述發光二極體結構分別電性連接於多個所述控制電路。所述訊號控制器設置在所述本體上。其中,多個所述發光組件彼此相鄰設置而使得多個所述發光組件的多個所述發光二極體結構排列成一畫素陣列。其中,所述基板包括分別電性連接於多個所述發光組件的多個訊號接點,多個所述訊號接點電性連接於所述訊號控制器。其中,所述基板的上表面具有相對設置的兩個第一側區域以及相對設置的兩個第二側區域,多個所述訊號接點設置在所述第一側區域而不設置在所述第二側區域,或者多個所述訊號接點設置在所述第二側區域而不設置在所述第一側區域。In order to solve the above technical problems, another technical solution adopted in this creation is to provide a light-emitting module, which includes a substrate, a plurality of light-emitting components, and a signal controller. The substrate includes a plurality of control circuits. Each of the light-emitting components includes a plurality of light-emitting diode structures arranged on the substrate, and the plurality of light-emitting diode structures are electrically connected to a plurality of the control circuits, respectively. The signal controller is arranged on the body. Wherein, the plurality of light-emitting components are arranged adjacent to each other so that the plurality of light-emitting diode structures of the plurality of light-emitting components are arranged in a pixel array. Wherein, the substrate includes a plurality of signal contacts electrically connected to a plurality of the light-emitting components, and the plurality of signal contacts are electrically connected to the signal controller. Wherein, the upper surface of the substrate has two opposite first side regions and two opposite second side regions, and a plurality of the signal contacts are arranged on the first side region but not on the The second side area, or a plurality of the signal contacts are arranged in the second side area but not in the first side area.
本創作的其中一有益效果在於,本創作所提供的發光模組,其能通過“所述基板包括多個控制電路”、“每一所述發光組件包括設置在所述基板上的多個發光二極體結構,多個所述發光二極體結構分別電性連接於多個所述控制電路”、“所述訊號控制器設置在所述本體上”、“多個所述發光組件彼此相鄰設置而使得多個所述發光組件的多個所述發光二極體結構排列成一畫素陣列”、“所述基板包括分別電性連接於多個所述發光組件的多個訊號接點,多個所述訊號接點電性連接於所述訊號控制器”以及“所述基板的上表面具有相對設置的兩個第一側區域以及相對設置的兩個第二側區域,多個所述訊號接點設置在所述第一側區域而不設置在所述第二側區域,或者多個所述訊號接點設置在所述第二側區域而不設置在所述第一側區域”的技術方案,以提升發光的效率。One of the beneficial effects of this creation is that the light-emitting module provided by this creation can pass through "the substrate includes a plurality of control circuits", "each of the light-emitting components includes a plurality of light-emitting components arranged on the substrate. A diode structure, a plurality of the light-emitting diode structures are electrically connected to a plurality of the control circuits", "the signal controller is arranged on the body", "a plurality of the light-emitting components are mutually connected Adjacently arranged so that the plurality of light-emitting diode structures of the plurality of light-emitting components are arranged in a pixel array", "the substrate includes a plurality of signal contacts electrically connected to the plurality of light-emitting components, A plurality of the signal contacts are electrically connected to the signal controller" and "the upper surface of the substrate has two opposite first side regions and two opposite second side regions. The signal contacts are arranged in the first side area but not in the second side area, or a plurality of the signal contacts are arranged in the second side area but not in the first side area" Technical solutions to improve the efficiency of light emission.
為使能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本創作加以限制。In order to have a better understanding of the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation. However, the provided drawings are only for reference and explanation, not to limit this creation.
以下是通過特定的具體實施例來說明本創作所公開有關“發光模組”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本創作的構思下進行各種修改與變更。另外,本創作的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本創作的相關技術內容,但所公開的內容並非用以限制本創作的保護範圍。The following is a specific specific embodiment to illustrate the implementation of the "light emitting module" disclosed in this creation, and those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings in this creation are merely schematic illustrations, and are not depicted in actual size, and are stated in advance. The following embodiments will further describe the related technical content of this creation in detail, but the disclosed content is not intended to limit the protection scope of this creation.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件,但這些元件不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.
[第一實施例][First Embodiment]
參閱圖1至圖3所示,本創作第一實施例提供一種發光模組Z,其包括一基板1、多個發光組件2以及一訊號控制器3。Referring to FIGS. 1 to 3, the first embodiment of the present invention provides a light emitting module Z, which includes a
首先,配合圖1所示,本創作的基板1包括了本體10以及多個接地電路12,多個控制電路11與多個接地電路12內建在本體10內,特別是多個控制電路11也可以設置在本體10上(也就是說,控制電路11可以預先製作完成後,再另外設置在本體10上,以與發光組件2相鄰並置,例如本創作可以省略一些發光組件2,而以控制電路11取代之,當然發光組件2也可以預先製作完成後,再另外設置在本體10上)。並且,每一個控制電路11還具有裸露在本體10外的導電接點110,每一個接地電路12也具有裸露在本體10外的接地接點120。舉例來說,基板可為晶圓級基板,例如拋光矽晶圓(Polished Silicon Wafer)、磊晶矽晶圓(Epitaxial Silicon Wafer)、氬氣回火矽晶圓(Argon Anneal Silicon Wafer)、氦氣回火矽晶圓(Hai Silicon Wafer)以及絕緣矽晶圓(Silicon on Insulator Silicon Wafer)之中的其中一種,並且控制電路11可為一種CMOS(Complementary Metal-Oxide-Semiconductor)控制電路,CMOS控制電路具有源極、汲極以及閘極。然而,本創作不以上述所舉的例子為限。First of all, as shown in FIG. 1, the
接著,配合圖1所示,每一個發光組件2包括了多個發光二極體結構20,並且,每一個發光二極體結構20具有一第一電極端200以及第二電極端201,第一電極端200電性連接於導電接點110,第二電極端201電性連接於接地接點120。舉例來說,發光二極體結構20可以是紅色發光二極體、綠色發光二極體或者藍色發光二極體,然而,本創作不以此舉例為限。並且,本創作的多個發光組件2可彼此相鄰設置而使得多個發光組件2的多個發光二極體結構20排列成一畫素陣列。Next, as shown in FIG. 1, each light-
再者,配合圖1所示,基板1可包括多個訊號接點13,每一個訊號接點13可電性連接多個發光組件2的發光二極體結構20與設置在本體10上的訊號控制器3。其中,訊號控制器3可以是微控制器(Microcontroller Unit, MCU),然而,本創作不以此舉例為限。Furthermore, as shown in FIG. 1, the
進一步來說,配合圖1及圖2所示,基板1的上表面的邊緣具有相對設置的兩個第一側區域14、14’以及相對設置的兩個第二側區域15、15’。並且,多個訊號接點13可設置在第一側區域14’而不設置在第二側區域15、15’,或者設置在第二側區域15’而不設置在第一側區域14、14’。Furthermore, as shown in Figs. 1 and 2, the edge of the upper surface of the
舉例來說,配合圖1及圖2所示,多個訊號接點13可設置在其中一個第一側區域14,並且,其中一個第一側區域14’的間距大小大於訊號接點13的大小。另一個第一側區域14與兩個第二側區域15、15’的間距大小則小於訊號接點13的大小,而無法設置多個訊號接點13。For example, as shown in FIGS. 1 and 2, a plurality of
又或者,配合圖1及圖3所示,多個訊號接點13可設置在其中一個第二側區域15’,並且,其中一個第二側區域15’的間距大小大於訊號接點13的大小。另一個第二側區域15與兩個第一側區域14、14’的間距大小則小於訊號接點13的大小,而無法設置多個訊號接點13。Or, as shown in FIGS. 1 and 3, a plurality of
然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit this creation.
[第二實施例][Second Embodiment]
參閱圖4所示,本創作第二實施例提供一種發光模組Z,其包括一基板1、多個發光組件2以及一訊號控制器3。由圖2與圖4的比較可知,本創作第二實施例與第一實施例最大的不同在於:多個訊號接點13設置在其中一第一側區域14’上,而另外一第一側區域14與兩個第二側區域15、15’為沒有設置訊號接點13的一接點淨空區16,其中一部分的發光二極體結構20設置在接點淨空區16上。Referring to FIG. 4, the second embodiment of the present invention provides a light emitting module Z, which includes a
舉例來說,配合圖4所示,本創作的基板1的其中一個第一側區域14’上設置了多個訊號接點13,而另外一個第一側區域14與兩個第二側區域15、15’形成了接點淨空區16。並且,兩個第一側區域14、14’與兩個第二側區域15、15’的間距大小彼此相同,但不以此為限。進一步來說,基板1上的其中一部分的發光二極體結構20設置在接點淨空區16上,即其中一部分的發光二極體結構20設置在另外一個第一側區域14與兩個第二側區域15、15’上。For example, as shown in FIG. 4, a plurality of
更進一步來說,多個訊號接點13可設置在沒有發光二極體結構20的其中一第一側區域14’上,並且,其中一部分的發光二極體結構20設置在沒有訊號接點13的另外一第一側區域14上,另外一部分的發光二極體結構20設置在沒有訊號接點13的兩個第二側區域15、15’上。Furthermore, a plurality of
然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit this creation.
[第三實施例][Third Embodiment]
參閱圖5所示,本創作第三實施例提供一種發光模組Z,其包括一基板1、多個發光組件2以及一訊號控制器3。由圖3與圖5的比較可知,本創作第三實施例與第一實施例最大的不同在於:其中,多個訊號接點13設置在其中一第二側區域15’上,而另外一第二側區域15與兩個第一側區域14、14’為沒有設置訊號接點13的一接點淨空區16,其中一部分的發光二極體結構20設置在接點淨空區16上。Referring to FIG. 5, the third embodiment of the present invention provides a light-emitting module Z, which includes a
舉例來說,配合圖5及圖5所示,本創作的基板1的其中一個第二側區域15’上設置了多個訊號接點13,而另外一個第二側區域15與兩個第一側區域14、14’形成了接點淨空區16。並且,兩個第一側區域14、14’與兩個第二側區域15的間距大小彼此相同,但不以此為限。進一步來說,基板1上的其中一部分的發光二極體結構20設置在接點淨空區16上,即其中一部分的發光二極體結構20設置在另外一個第二側區域15與兩個第一側區域14、14’上。For example, as shown in FIGS. 5 and 5, a plurality of
更進一步來說,多個訊號接點13設置在沒有發光二極體結構20的其中一第二側區域15’上,並且,其中一部分的發光二極體結構20設置在沒有訊號接點13的另外一第二側區域15上,另外一部分的發光二極體結構20設置在沒有訊號接點13的兩個第一側區域14、14’上。Furthermore, a plurality of
然而,上述所舉的例子只是其中一可行的實施例而並非用以限定本創作。However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit this creation.
[實施例的有益效果][Beneficial effects of the embodiment]
本創作的其中一有益效果在於,本創作所提供的發光模組Z,其能通過“基板1包括多個控制電路11”、“每一發光組件2包括設置在基板1上的多個發光二極體結構20,多個發光二極體結構20分別電性連接於多個控制電路11”、“訊號控制器3設置在本體10上”、“多個發光組件2彼此相鄰設置而使得多個發光組件2的多個發光二極體結構20排列成一畫素陣列”、“基板1包括分別電性連接於多個發光組件2的多個訊號接點13,多個訊號接點13電性連接於訊號控制器3”以及“基板1的上表面具有相對設置的兩個第一側區域14、14’以及相對設置的兩個第二側區域15、15’,多個訊號接點13設置在第一側區域14’而不設置在第二側區域15、15’,或者多個訊號接點13設置在第二側區域15’而不設置在第一側區域14、14’”的技術方案,以提升發光的效率。One of the beneficial effects of this creation is that the light-emitting module Z provided by this creation can pass through "the
更進一步來說,本創作所提供的發光模組Z通過上述的技術方案,可使得發光二極體結構20所產生的光束能更為擴散,進而可提升發光二極體結構20的發光效率。Furthermore, the light-emitting module Z provided by the present creation can make the light beam generated by the light-emitting
以上所公開的內容僅為本創作的優選可行實施例,並非因此侷限本創作的申請專利範圍,所以凡是運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的申請專利範圍內。The content disclosed above is only a preferred and feasible embodiment of the creation, and does not limit the scope of the patent application for this creation. Therefore, all equivalent technical changes made using the creation specification and schematic content are included in the application for this creation. Within the scope of the patent.
Z:發光模組
1:基板
10:本體
11:控制電路
110:導電接點
12:接地電路
120:接地接點
13:訊號接點
14, 14’:第一側區域
15, 15’:第二側區域
16:接點淨空區
2:發光組件
20:發光二極體結構
200:第一電極端
201:第二電極端
3:訊號控制器
Z: Light-emitting module
1: substrate
10: body
11: Control circuit
110: Conductive contact
12: Grounding circuit
120: Ground contact
13:
圖1為本創作第一實施例的發光模組的側視示意圖。Fig. 1 is a schematic side view of the light emitting module of the first embodiment of the creation.
圖2為本創作第一實施例的發光模組的第一俯視示意圖。Fig. 2 is a first schematic top view of the light emitting module of the first embodiment of the creation.
圖3為本創作第一實施例的發光模組的第二俯視示意圖。FIG. 3 is a second schematic top view of the light-emitting module of the first embodiment of the creation.
圖4為本創作第二實施例的發光模組的俯視示意圖。4 is a schematic top view of the light emitting module of the second embodiment of the creation.
圖5為本創作第三實施例的發光模組的俯視示意圖。FIG. 5 is a schematic top view of the light-emitting module according to the third embodiment of the creation.
Z:發光模組 Z: Light-emitting module
1:基板 1: substrate
13:訊號接點 13: Signal contact
14,14’:第一側區域 14,14’: First side area
15,15’:第二側區域 15,15’: second side area
2:發光組件 2: Light-emitting components
20:發光二極體結構 20: Light-emitting diode structure
Claims (10)
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TW109209703U TWM601904U (en) | 2019-10-21 | 2019-10-21 | Light-emitting module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW109209703U TWM601904U (en) | 2019-10-21 | 2019-10-21 | Light-emitting module |
Publications (1)
Publication Number | Publication Date |
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TWM601904U true TWM601904U (en) | 2020-09-21 |
Family
ID=74094671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW109209703U TWM601904U (en) | 2019-10-21 | 2019-10-21 | Light-emitting module |
Country Status (1)
Country | Link |
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TW (1) | TWM601904U (en) |
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2019
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